A polishing device and method

Abstract

The present application relates to the field of wafer processing, and in particular, to a polishing device and method. The polishing device includes: a polishing platen, on which a polishing pad is adhered; a first mechanism for detecting whether there are air bubbles between the polishing pad and the polishing platen; and a second mechanism corresponding to the first mechanism for eliminating the air bubbles between the polishing pad and the polishing platen, achieving the technical effect of reducing the influence of air bubbles on the polishing quality.

Description

Technical Field

[0001] This application relates to the field of wafer processing, and particularly to a polishing device and method. Background Art

[0002] In the current semiconductor manufacturing field, chemical mechanical polishing (CMP) technology has become an indispensable part of wafer processing and manufacturing due to its excellent global and local planarization capabilities. The successful implementation of the CMP process highly depends on multiple key factors. Among them, as the core component, the microstructure, physical properties, and surface conditions of the polishing pad play a decisive role in achieving ultra-precise polishing effects. However, the effective bonding between the polishing pad and the polishing platen is a prerequisite for ensuring the stability and efficiency of the polishing process.

[0003] In the prior art, the bonding process of the polishing pad often faces challenges. Especially when the surface of the polishing platen is not thoroughly cleaned or improper bonding techniques are used, it is easy to form bubbles at the interface between the polishing pad and the polishing platen. The presence of bubbles not only exacerbates the abnormal wear of the polishing pad in the bubble area, shortening its service life, but also may cause the rupture of the polished wafer due to uneven local pressure during the polishing process, resulting in production accidents; not only direct economic losses, but also valuable time is required to repair the CMP system, seriously interfering with the continuity and efficiency of the production line.

[0004] Therefore, the technical problem of the prior art is that the bubbles caused by the polishing pad need to be urgently solved. Summary of the Invention

[0005] This application provides a polishing device and method, achieving the technical effect of reducing the influence of bubbles on the polishing quality.

[0006] On the one hand, a polishing device provided by this application adopts the following technical solution:

[0007] A polishing device includes: a polishing platen, on which a polishing pad is bonded; a first mechanism for detecting whether there are bubbles between the polishing pad and the polishing platen; and a second mechanism corresponding to the first mechanism for eliminating the bubbles between the polishing pad and the polishing platen.

[0008] Preferably, the first mechanism includes: a first bracket that is movable; a plurality of distance sensors connected to the first bracket, and the distance sensors can measure the distance to the polishing pad along a preset direction.

[0009] Preferably, the second mechanism includes: a second bracket which is movable; a carrier having at least a partially arc-shaped peripheral side surface, the carrier being rotatably connected to the second bracket such that the carrier can roll on the polishing pad to compress and eliminate the air bubbles located between the polishing pad and the polishing disc.

[0010] Preferably, the second mechanism further includes: a plurality of fine needles uniformly connected to the peripheral side surface of the carrier; defining one end of the fine needle away from the carrier as the first end, the first end being sharpened so that the fine needle rolls with the carrier and pierces into the air bubbles to eliminate the air bubbles.

[0011] Preferably, the interior of the carrier has a cavity which is in negative pressure; a flow channel is provided inside the fine needle, and the flow channel is communicated with the cavity so that when the fine needle pierces into the air bubbles, the air bubbles can be sucked by the negative pressure.

[0012] Preferably, defining the end of the fine needle located inside the carrier as the second end; the fine needle is movably connected to the peripheral side surface of the carrier, and the second end is located inside the carrier; such that the fine needle can extend and retract relative to the peripheral side surface of the carrier; the carrier includes: a limiting member connected to the inside of the carrier, the limiting member being used for limiting the fine needle, and a limiting space is formed between the limiting member and the inner wall of the carrier so that the fine needle can lift in the limiting space; a blocking member located inside the carrier, the blocking member being used for cooperating with the second end of the fine needle to block or open the flow channel; and a reset member located inside the carrier, the reset member being connected between the fine needle and the carrier, the reset member being used for resetting the extension of the fine needle; the fine needle forms a first state and a second state as it rolls with the carrier: in the first state, the fine needle extends and does not contact the air bubbles, and the second end of the fine needle is blocked by the blocking member; in the second state, the fine needle pierces into the air bubbles and at least partially retracts, and the second end of the fine needle disengages from the blocking member to open the flow channel, so that the negative pressure in the cavity sucks the air bubbles through the flow channel.

[0013] Preferably, the blocking member has a contact surface for blocking the flow channel of the fine needle, and both the contact surface and the second end are inclined; to guide the second end to disengage or reset to the contact surface.

[0014] On the other hand, a polishing method provided by the present application adopts the following technical solution:

[0015] A polishing method includes: bonding the polishing pad to the polishing disc; pressing the peripheral side surface of the carrier against the polishing pad and rolling.

[0016] Preferably, it includes: bonding the polishing pad to the polishing disc; pressing the carrier onto the polishing pad and rolling it, and inserting the fine needle into the bubble to eliminate the bubble.

[0017] Preferably, it includes: bonding the polishing pad to the polishing disc; pressing the carrier onto the polishing pad and rolling it; making the cavity in negative pressure; the fine needle forms a first state and a second state as it rolls with the carrier: in the first state, the fine needle extends and does not contact the bubble, and the second end of the fine needle is blocked by the blocking member; in the second state, the fine needle pierces into the bubble causing at least partial retraction of the fine needle, and the second end of the fine needle disengages from the blocking member to open the flow channel, so that the negative pressure in the cavity sucks the bubble through the flow channel.

[0018] In summary, the present application includes at least one of the following beneficial technical effects:

[0019] By detecting the bubbles between the polishing pad and the polishing disc through the first mechanism, the bubble problem can be discovered in a timely manner, providing an accurate basis for subsequent bubble elimination. The technical effect of reducing the influence of bubbles on the polishing quality is achieved. Description of the Drawings

[0020] Figure 1 is a schematic diagram of the polishing equipment described in the present application;

[0021] Figure 2 is a schematic diagram of the first mechanism of the polishing equipment described in the present application;

[0022] Figure 3 is a schematic diagram of the second mechanism of the polishing equipment described in the present application;

[0023] Figure 4 is a schematic diagram of an embodiment of the second mechanism of the polishing equipment described in the present application;

[0024] Figure 5 is a partial cross-sectional view of the second mechanism of the polishing equipment described in the present application;

[0025] Figure 6 is a state schematic diagram of an embodiment of the second mechanism of the polishing equipment described in the present application;

[0026] Figure 7 is a state schematic diagram of another embodiment of the second mechanism of the polishing equipment described in the present application.

[0027] Explanation of the reference numerals: 100, polishing disc; 110, polishing pad; 120, bubble; 200, first mechanism; 210, first bracket; 220, ranging sensor; 300, second mechanism; 310, second bracket; 320, carrier; 321, cavity; 322, limit member; 3221, limit space; 323, reset member; 324, blocking member; 3241, contact surface; 330, fine needle; 331, flow channel; 332, first end; 333, second end; 334, sealing ring; 335, limit portion. DETAILED DESCRIPTION

[0028] The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application, unless otherwise specified, include direct and indirect connections (couplings). In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0029] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0030] The embodiments of the present application provide a polishing device and method, which achieve the technical effect of reducing the influence of bubbles 120 on the polishing quality.

[0031] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific embodiments described here are only used to explain the present application and are not used to limit the present application.

[0032] The present application proposes a polishing device, such as Figure 1As shown in the figure, it includes a polishing platen 100, a first mechanism 200, and a second mechanism 300. A polishing pad 110 is provided on the polishing platen 100. The first mechanism 200 is used to detect the formation of air bubbles 120 between the polishing pad 110 and the polishing platen 100. The second mechanism 300 is used to eliminate the air bubbles 120 formed between the polishing pad 110 and the polishing platen 100.

[0033] As Figure 1 shown in the figure, the polishing platen 100 serves as the basic platform for polishing. The polishing platen 100 is used to carry the wafer. A polishing pad 110 is laid on the polishing platen 100, and the wafer is polished on the polishing pad 110. By rotating the polishing platen 100 and the wafer relative to each other to remove the thickness of the wafer, the polishing of the wafer is completed. It should be noted that the polishing pad 110 is adhered to the polishing platen 100 with glue. Since the areas of the surface of the polishing platen 100 and the polishing pad 110 are large, and the polishing pad 110 is relatively soft in texture, when the polishing pad 110 is laid on the polishing platen 100, it is impossible to ensure full contact between the polishing pad 110 and the polishing platen 100, resulting in the formation of air bubbles 120 between the polishing platen 100 and the polishing pad 110. Once the glue solidifies, the air bubbles 120 are difficult to remove. Therefore, during the laying process, it is necessary to timely detect the laying situation of the polishing pad 110 and eliminate the air bubbles 120 to avoid affecting the polishing of the wafer.

[0034] Therefore, during the laying process of the polishing pad 110, pores, that is, air bubbles 120, are often formed between the polishing pad 110 and the polishing platen 100, resulting in partial bulging of the polishing pad 110. Generally, the surface of the polishing platen 100 is flat, and the polishing pad 110 laid and adhered to the polishing platen 100 is also flat. Based on process requirements, the formation of the surface of the polishing platen 100 can also be adjusted. For example, the polishing platen 100 is concave or convex. In this way, when the polishing pad 110 is laid and adhered to the polishing platen 100, the polishing pad 110 also has the shape of the polishing platen 100, that is, concave or convex.

[0035] As Figure 1 、 2As shown, the first mechanism 200 is used to detect the bonding condition between the polishing disc 100 and the polishing pad 110, that is, to detect whether there are air bubbles 120 between the polishing disc 100 and the polishing pad 110. The first mechanism 200 is arranged above the polishing disc 100 and is used to detect the polishing disc 100 after the polishing pad 110 is laid and bonded downward. In other words, the first mechanism 200 judges whether there are air bubbles 120 between the polishing pad 110 and the polishing disc 100 by detecting the polishing pad 110. Specifically, the first mechanism 200 includes a first bracket 210 and a distance measuring sensor 220. The first bracket 210 is set to be movable so as to be able to flexibly adjust the position during the detection process or to be able to detect the polishing pad 110 at different positions. A plurality of distance measuring sensors 220 are provided. The plurality of distance measuring sensors 220 are fixedly connected to the first bracket 210. The plurality of distance measuring sensors 220 can perform distance measurement detection on the polishing pad 110 along a preset direction, for example, perform distance detection on the polishing pad 110 in a direction perpendicular to the surface of the polishing disc 100.

[0036] During the detection process, the first bracket 210 drives the distance measuring sensor 220 to move directly above the polishing pad 110 so that the distance measuring sensor 220 is at a preset height, and the distance measuring sensor 220 starts to work: the distance measuring sensor 220 detects the distance of the polishing pad 110 and compares the measured value with a preset value. Herein, the preset value refers to the height of the distance measuring sensor 220 to the idealized topography after the polishing pad 110 is laid (in the case where there are no air bubbles 120). Thus, if the measured value is equal to or basically equal to the preset value, it is judged that there are no air bubbles 120 between the polishing pad 110 and the polishing disc 100; if the measured value is less than the preset value, it is judged that there are air bubbles 120 causing the polishing pad 110 to bulge. In order to improve the comprehensiveness of the detection of the polishing pad 110, the polishing disc 100 can be rotated to perform the above detection on the polishing pad 110 at different positions.

[0037] As Figure 3 As shown, the second mechanism 300 is used to eliminate the air bubbles 120 between the polishing pad 110 and the polishing disc 100. The second mechanism 300 corresponds to the first mechanism 200. In other words, when the first mechanism 200 detects that there are air bubbles 120 between the polishing pad 110 and the polishing disc 100, the second mechanism 300 correspondingly performs the elimination of the air bubbles 120. The second mechanism 300 includes a second bracket 310 and a carrier 320. The second bracket 310 is set to be movable so as to eliminate the air bubbles 120 at different positions on the polishing pad 110. The carrier 320 has at least a circumferential side surface with a partial arc. The carrier 320 is rotatably connected to the second bracket 310. When the second bracket 310 moves, the carrier 320 can roll on the polishing pad 110. Thus, when the carrier 320 rolls, the circumferential side surface of the arc presses on the polishing pad 110, and the air bubbles 120 located between the polishing pad 110 and the polishing disc 100 will be eliminated by the rolling pressure.

[0038] In one embodiment, as Figure 3 shown, the carrier 320 is set as a pressure roller, and the pressure roller is horizontally arranged; after the polishing pad 110 is laid on the polishing disc 100, the pressure roller is placed on the polishing pad 110, and the second bracket 310 drives the pressure roller to rotate, so that the pressure roller rolls on the polishing pad 110 to roll over the polishing pad 110 to eliminate the bubbles 120.

[0039] Furthermore, as Figure 4 shown, fine needles 330 are arranged on the circumferential side surface of the carrier 320. The fine needles 330 have a first end 332 and a second end 333. The second end 333 is fixedly connected to the circumferential side surface of the carrier 320, and the first end 332 faces the outside of the carrier 320 and is set to be sharp; a plurality of fine needles 330 are arranged and are evenly connected to the circumferential side surface of the carrier 320; the second bracket 310 drives the carrier 320 to roll. During the rolling process, the fine needles 330 on the carrier 320 roll synchronously. At the position where there are bubbles 120 on the polishing pad 110, the first part of the fine needle 330 contacts the raised polishing pad 110 and makes the fine needle 330 pierce into the bubble 120. Due to the sharpness of the fine needle 330 and the pressure of the carrier 320 on the fine needle 330, the pressure inside the bubble 120 is released, thereby realizing the elimination of the bubble 120; after eliminating one bubble 120, the fine needle 330 moves to the next position as the carrier 320 continues to roll until all the bubbles 120 on the entire polishing pad 110 are eliminated.

[0040] The fine needle 330 needs to pierce into the bubble 120 to make the bubble 120 automatically release. However, in some cases, due to insufficient pressure inside the bubble 120, it is very likely that the bubble 120 cannot be completely eliminated, still causing partial bulging of the polishing pad 110. Based on this, the present application proposes a further technical solution: as Figure 5 shown, a cavity 321 is arranged inside the carrier 320. The carrier 320 is connected to an external negative pressure source through the end shaft position, so that the cavity 321 maintains a negative pressure state; and a flow channel 331 is arranged inside the fine needle 330, and each flow channel 331 communicates with the cavity 321; thus, when the fine needle 330 pierces into the bubble 120, the negative pressure in the cavity 321 can actively suck the bubble 120 through the flow channel 331, further improving the elimination effect of the bubble 120.

[0041] On the basis of sucking the bubble 120 by negative pressure, a further cooperation between the expansion and contraction of the fine needle 330 and the blockage of the flow channel 331 is proposed. As Figure 6 、 7As shown, one end of the fine needle 330 located inside the carrier 320 is defined as the second end 333; the fine needle 330 is movably connected to the circumferential side surface of the carrier 320, and the second end 333 is located inside the carrier 320; so that the fine needle 330 can stretch relative to the circumferential side surface of the carrier 320; the carrier 320 includes: a limiting member 322, the limiting member 322 is connected to the inside of the carrier 320, the limiting member 322 is used to limit the fine needle 330, and a limiting space 3221 is formed between the limiting member 322 and the inner wall of the carrier 320, so that the fine needle 330 can move up and down in the limiting space 3221; a blocking member 324, the blocking member 324 is located inside the carrier 320, the blocking member 324 is used to cooperate with the second end 333 of the fine needle 330 to block or open the flow channel 331; and a reset member 323, the reset member 323 is located inside the carrier 320, the reset member 323 is connected between the fine needle 330 and the carrier 320, and the reset member 323 is used to perform an extension reset on the fine needle 330; the fine needle 330 forms a first state and a second state as the carrier 320 rolls: in the first state, the fine needle 330 extends, and the fine needle 330 does not contact the air bubble 120, and the second end 333 of the fine needle 330 is blocked by the blocking member 324; in the second state, the fine needle 330 pierces the air bubble 120 so that at least part of the fine needle 330 retracts, and the second end 333 of the fine needle 330 is separated from the blocking member 324 to open the flow channel 331, so that the negative pressure in the cavity 321 sucks the air bubble 120 through the flow channel 331.

[0042] Specifically, as Figure 6 , 7 shown, the fine needle 330 is movably connected to the circumferential side surface of the carrier 320. In other words, the fine needle 330 can stretch relative to the circumferential side surface of the carrier 320. The first end 332 of the fine needle 330 is located outside the carrier 320, and the second end 333 of the fine needle 330 is located inside the carrier 320; and the fine needle 330 and the carrier 320 are hermetically sealed by an elastic sealing ring 334. Due to the existence of the sealing ring 334, the fine needle 330 can swing obliquely by a certain angle while stretching.

[0043] As Figure 6 , 7As shown, the limiting member 322 is used to limit the fine needle 330, so that the fine needle 330 can only be extended and retracted inside the limiting space 3221, so that when the fine needle 330 encounters the bubble 120, the fine needle 330 can overcome the elastic potential energy of the resetting member 323 and retract a certain length to the inside of the cavity 321, and due to the limitation of the limiting member 322, the fine needle 330 cannot be completely retracted, and then the bubble 120 can be successfully penetrated by the reaction force of the limiting member 322; before the bubble 120 penetrates the bubble 120, the fine needle 330 has not yet retracted, and the second end 333 of the fine needle 330 is blocked by the blocking member 324, so that the flow channel 331 is blocked, and the negative pressure cannot absorb the bubble 120 through the flow channel 331; when the fine needle 330 retracts and rises to a certain length, the fine needle 330 deflects a certain angle to make the second end 333 disengage from the blocking member 324, so that the flow channel 331 is exposed, and the flow channel 331 and the cavity 331 are connected. 21 is connected, at this time, the negative pressure can absorb the bubble 120 through the flow channel 331; as the carrier 320 rotates, the downward pressure of the fine needle 330 on the bubble 120 disappears, and the fine needle 330 is reset by the reset member 323, and extends from the original retracted state. At this time, the second end 333 is blocked by the blocking member 324 again; due to the blocking of the flow channel 331 of the fine needle 330 by the blocking member 324 in the carrier 320, the fine needle 330 originally has no absorption ability. Only when encountering the bubble 120, the bubble 120 makes the fine needle 330 push up, thereby triggering the blocking member 324 to cancel the blocking of the flow channel 331 in the fine needle 330, and the fine needle 330 has an absorption effect on the bubble 120, instead of making multiple fine needles 330 always connected to the negative pressure; if each fine needle 330 is always connected to the negative pressure, multiple fine needles 330 share the negative pressure, and the absorption effect on the bubble 120 is not good.

[0044] Based on the above, if Figure 7 As shown, when the fine needle 330 rolls with the carrier 320 and encounters the bubble 120, the pressure of the bubble 120 causes the fine needle 330 to overcome the elastic potential energy of the reset member 323 and retract a certain length to the inside of the cavity 321. In one embodiment, the reset member 323 is a spring, and a limiting portion 335 is provided on the fine needle 330. The spring is in a stretched state and is connected between the limiting portion 335 of the fine needle 330 and the inner wall of the carrier 320 to reset the fine needle 330. At this time, the second end 333 of the fine needle 330 is separated from the blocking member 324, so that the flow channel 331 is opened, and the negative pressure is sucked through the flow channel 331 to absorb the bubble 120. As the carrier 320 continues to roll, the downward pressure of the fine needle 330 on the bubble 120 disappears, and the fine needle 330 is extended and reset by the reset member 323, and the second end 333 is blocked by the blocking member 324 again.

[0045] Among them, Figure 6 , 7As shown, the blocking member 324 has a contact surface 3241 which is used to block the flow channel 331 of the fine needle 330. Both the contact surface 3241 and the second end 333 are inclined; to guide the second end 333 to disengage from or reset to the contact surface 3241; the contact surface 3241 is in an inclined state, so that the contact surface 3241 can more smoothly guide the second end 333 of the fine needle 330 to disengage from the contact surface 3241 when needed, and the flow channel 331 is opened; when the fine needle 330 pierces the air bubble 120 and retracts under the pressure of the air bubble 120, the inclined contact surface 3241 can provide a gradually decreasing resistance, so that the second end 333 can more smoothly disengage from the contact surface 3241, ensuring that the negative pressure can quickly pass through the flow channel 331 to suck the air bubble 120; the inclined contact surface 3241 can also more stably guide the second end 333 of the fine needle 330 to reset to the contact surface 3241 when not needed, so as to re-block the flow channel 331; when the fine needle 330 completes the task of sucking the air bubble 120 and extends and resets under the action of the reset member 323, the inclined contact surface 3241 can provide a gradually increasing guiding force to help the second end 333 more accurately reset to the contact surface 3241, ensuring that the flow channel 331 is in a blocked state again and preparing for the next air bubble 120 elimination task. The stability and reliability of the telescopic movement of the fine needle 330 are improved, and the whole air bubble 120 elimination process is made smoother and more efficient; through the design of the inclined contact surface 3241, the polishing device can more accurately control the telescopic movement of the fine needle 330 and the opening and blocking of the flow channel 331, so as to effectively eliminate the air bubble 120 and improve the polishing quality and efficiency.

[0046] The present application also proposes a polishing method, including:

[0047] Bond the polishing pad 110 to the polishing disc 100; press the peripheral side surface of the carrier 320 against the polishing pad 110 and roll it to eliminate the air bubble 120 between the polishing pad 110 and the polishing disc 100 through the pressure. Specifically, after the bonding of the polishing pad 110 is completed, use the carrier 320 (such as a pressing roller) to roll over the polishing pad 110; the peripheral side surface of the carrier 320 should be evenly pressed against the polishing pad 110 and roll along the rotation direction of the polishing disc 100; through the pressure and rolling action of the carrier 320, most of the air bubbles 120 between the polishing pad 110 and the polishing disc 100 can be eliminated.

[0048] Further, on the basis above, when the carrier 320 presses on the polishing pad 110 and rolls, the fine needles 330 will roll with the carrier 320 and pierce into the air bubbles 120 to eliminate the air bubbles 120. Specifically, the fine needles 330 are evenly installed on the circumferential side surface of the carrier 320 to ensure that the fine needles 330 are sharp and evenly distributed; the number and length of the fine needles 330 should be adjusted according to the material and thickness of the polishing pad 110; the carrier 320 is used to roll over the polishing pad 110, and at the same time the fine needles 330 roll with the carrier 320; when the fine needles 330 encounter the air bubbles 120, they will pierce into the air bubbles 120, release the pressure inside the air bubbles 120, and thus eliminate the air bubbles 120; the rolling and piercing actions of the fine needles 330 should be uniform and continuous to ensure that the air bubbles 120 are completely eliminated.

[0049] Still further, before the carrier 320 rolls, the cavity 321 is in a negative pressure state. Then, the carrier 320 is pressed on the polishing pad 110 and rolls. During the rolling process, the fine needles 330 form a first state and a second state as they roll with the carrier 320. In the first state, the fine needles 330 extend and do not contact the air bubbles 120, and the second end 333 of the fine needles 330 is blocked by the blocking member 324; in the second state, the fine needles 330 pierce into the air bubbles 120 causing at least partial retraction of the fine needles 330, and the second end 333 of the fine needles 330 is separated from the blocking member 324 to open the flow channel 331, and the negative pressure sucks the air bubbles 120 through the flow channel 331. Specifically,

[0050] A cavity 321 is provided inside the carrier 320, and an external negative pressure source is connected through the position of the end rotating shaft; the fine needles 330 are evenly installed on the circumferential side surface of the carrier 320, and it is ensured that a flow channel 331 is provided inside the fine needles 330 and communicated with the cavity 321; before the carrier 320 rolls, the external negative pressure source is first turned on to make the cavity 321 in a negative pressure state; the carrier 320 is used to roll over the polishing pad 110, and at the same time the fine needles 330 roll with the carrier 320; when the fine needles 330 encounter the air bubbles 120, they will pierce into the air bubbles 120; at this time, due to the cavity 321 being in a negative pressure state, the negative pressure sucks the air bubbles 120 through the flow channel 331; the expansion and contraction of the fine needles 330 cooperate with the blocking of the flow channel 331: in the first state, the fine needles 330 extend and do not contact the air bubbles 120; in the second state, the fine needles 330 pierce into the air bubbles 120 and retract, opening the flow channel 331, and the negative pressure sucks the air bubbles 120 through the flow channel 331; as the carrier 320 continues to roll, the pressing action of the fine needles 330 on the air bubbles 120 disappears, and the fine needles 330 are extended and reset under the action of the reset member 323, and the flow channel 331 is blocked again.

[0051] It should be noted that this application focuses on solving the problem of eliminating large bubbles 120 during the polishing process. Given that tiny bubbles 120 cannot be effectively eliminated by piercing them with a fine needle 330 and their impact on the final polishing effect is minimal, in the method of this application, the focus is on eliminating large bubbles 120.

[0052] Although the preferred embodiments of this application have been described, those skilled in the art can make additional changes and modifications to these embodiments once they learn the basic creative concept. Therefore, the appended claims are intended to be interpreted to include the preferred embodiments as well as all changes and modifications that fall within the scope of this application.

[0053] Obviously, those skilled in the art can make various changes and modifications to this application without departing from the spirit and scope of this application. Thus, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalent technologies, this application also intends to include these changes and modifications.

Claims

1. A polishing device, characterized in that: include: A polishing disc (100), wherein a polishing pad (110) is bonded to the polishing disc (100); A first mechanism (200), the first mechanism (200) being used to detect whether bubbles (120) exist between the polishing pad (110) and the polishing plate (100); as well as a second mechanism (300), the second mechanism (300) corresponding to the first mechanism (200), the second mechanism (300) being used to eliminate bubbles (120) between the polishing pad (110) and the polishing disk (100); Wherein, the second mechanism (300) comprises: A second bracket (310), wherein the second bracket (310) is movable; a carrier (320), the carrier (320) having at least a partially arcuate circumferential side surface, the carrier (320) being rotatably connected to the second bracket (310); A plurality of fine needles (330) are provided and are evenly connected to the peripheral side surface of the carrier (320); an end of the fine needle (330) away from the carrier (320) is defined as a first end (332), and the first end (332) is sharp, so that the fine needle (330) rolls with the carrier (320) and penetrates into the air bubble (120) to eliminate the air bubble (120); The carrier (320) has a cavity (321) inside, and the cavity (321) is at a negative pressure; A flow channel (331) is provided inside the fine needle (330), and the flow channel (331) is in communication with the cavity (321), so that when the fine needle (330) pierces the bubble (120), the bubble (120) can be sucked out by negative pressure; The end of the fine needle (330) located inside the carrier (320) is defined as the second end (333); the fine needle (330) is movably connected to the peripheral side surface of the carrier (320), and the second end (333) is located inside the carrier (320); so that the fine needle (330) can be extended and retracted compared to the peripheral side surface of the carrier (320); The carrier (320) comprises a blocking member (324), the blocking member (324) being located inside the carrier (320), and the blocking member (324) being used to cooperate with the second end (333) of the fine needle (330) to block or open the flow channel (331); The fine needle (330) forms a first state and a second state as the carrier (320) rolls: In a first state, the fine needle (330) is extended, the fine needle (330) is not in contact with the bubble (120), and the second end (333) of the fine needle (330) is blocked by the blocking member (324); In the second state, the fine needle (330) penetrates the bubble (120) so that the fine needle (330) at least partially retracts, and the second end (333) of the fine needle (330) is separated from the blocking member (324) so ​​that the flow channel (331) is opened, so that the negative pressure in the cavity (321) absorbs the bubble (120) through the flow channel (331).

2. A polishing device according to claim 1, characterized in that: The first mechanism (200) comprises: A first bracket (210), wherein the first bracket (210) is movable; A distance measuring sensor (220), wherein the distance measuring sensors (220) are multiple, and the multiple distance measuring sensors (220) are connected to the first bracket (210), and the distance measuring sensors (220) can measure the distance of the polishing pad (110) along a preset direction.

3. A polishing device according to claim 1, characterized in that: The carrier (320) comprises: a limiting member (322), the limiting member (322) being connected to the inside of the carrier (320), the limiting member (322) being used to limit the position of the fine needle (330), a limiting space (3221) being formed between the limiting member (322) and the inner wall of the carrier (320), so that the fine needle (330) can be raised and lowered in the limiting space (3221); as well as A resetting member (323), the resetting member (323) is located inside the carrier (320), the resetting member (323) is connected between the fine needle (330) and the carrier (320), and the resetting member (323) is used to extend and resize the fine needle (330).

4. A polishing device according to claim 3, characterized in that: The blocking member (324) has a contact surface (3241) for blocking the flow channel (331) of the fine needle (330); the contact surface (3241) and the second end (333) are both arranged at an angle to guide the second end (333) to detach from or return to the contact surface (3241).

5. A polishing method of the polishing device according to claim 1, characterized in that: include: The polishing pad (110) is bonded to the polishing plate (100); the carrier (320) is pressed onto the polishing pad (110) and rolled; causing the cavity (321) to have a negative pressure; The fine needle (330) rolls with the carrier (320) to form a first state and a second state: In a first state, the fine needle (330) is extended, the fine needle (330) is not in contact with the bubble (120), and the second end (333) of the fine needle (330) is blocked by the blocking member (324); In the second state, the fine needle (330) penetrates the bubble (120) so that the fine needle (330) at least partially retracts, and the second end (333) of the fine needle (330) is separated from the blocking member (324) so ​​that the flow channel (331) is opened, so that the negative pressure in the cavity (321) absorbs the bubble (120) through the flow channel (331).

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