Wafer jacking mechanism and semiconductor equipment

Abstract

The invention provides a wafer jacking mechanism and semiconductor equipment. The wafer jacking mechanism comprises an ejector pin body, an ejector pin heavy hammer and a locking pendulum bob, a connecting column is arranged at the top of the thimble heavy hammer; the locking pendulum bob is rotatably mounted in the connecting column; wherein the ejector pin body is provided with a first position and a second position, one end of the ejector pin body is inserted into the connecting column from the top of the connecting column to the bottom of the connecting column, and the locking pendulum bob sequentially corresponds to the first position and the second position; when the locking pendulum bob corresponds to the first position of the ejector pin body, the locking pendulum bob can rotate in the direction away from the ejector pin body so that the ejector pin body can continue to move into the connecting column. When the locking pendulum bob corresponds to the second position of the ejector pin body, the locking pendulum bob can rotate in the direction close to the ejector pin body under the action of gravity and can be connected with the ejector pin body in a clamped mode. A novel part which is more stable, more durable and free of maintenance is introduced, and risks and maintenance cost caused by performance reduction of the part are reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor equipment, and more specifically, relates to a wafer lifting mechanism and semiconductor equipment. Background Art

[0002] In the semiconductor industry, high-density plasma chemical vapor deposition (HDP-CVD) equipment is widely used in thin film processes (Thin Film) for high-quality dielectric film deposition with undoped and doped processes and void-free gap filling process deposition, including shallow trench isolation (STI), pre-metal dielectric layer (PMD), interlayer dielectric layer (ILD), intermetal dielectric layer (IMD) and passivation protection layer and other process dielectric layer deposition. The basic composition of HDP-CVD equipment is as follows: Figure 1 As shown, the wafer is sent into the cavity and placed on the electrostatic chuck (ESC). Reactive gas is introduced into the cavity, and plasma is formed under the excitation of radio frequency (RF) energy, which then reacts on the surface of the wafer to form the desired thin film. The gas by-products are pumped out of the cavity by the vacuum pumping system. After the reaction is completed, the wafer is freed from static adsorption, then lifted up by a ceramic pin and taken out of the cavity by a robotic arm, completing the entire process.

[0003] like Figure 2 As shown, currently, the existing ejector lifting / lifting mechanism usually uses resistant materials (polymer materials with excellent resistance to chemical gas corrosion, plasma erosion and high temperature environment) to make clamping connectors, such as Figure 3 As shown, the connector is used to connect the upper ceramic lift pin and the lower lift pin weight. The upper ceramic lift pin and the lower lift pin weight are connected to the connector by a clamping installation. This clamping installation relies on the elastic deformation of the polymer material of the connector itself for clamping. Its elastic clamping force will weaken or even disappear with the duration of the use environment and the changes in process conditions, resulting in the inability to stably clamp and drag the lift pin up and down. In severe cases, the lift pin will be disconnected, i.e., the pin will fall off, causing the ceramic lift pin to fail to fall back in time and accurately, and then a process accident will occur. In addition, since the connector made of polymer materials needs to be inspected and replaced regularly and irregularly to ensure safe and stable production and avoid process accidents, this brings inconvenience to equipment maintenance and stable process production. Summary of the invention

[0004] The purpose of the embodiments of the present invention is to provide a wafer lifting mechanism and a semiconductor device, aiming to solve the technical problem that in the existing ejector pin lifting / lifting mechanism, connecting parts made of polymer materials are used to clamp and fix the ceramic thin ejector pins and the ejector pin weights, which has the risk of consumption and disability, and the connecting parts made of polymer materials need to be inspected and replaced regularly and irregularly, which brings inconvenience to equipment maintenance and stable process production.

[0005] To achieve the above-mentioned purpose, according to one aspect of the present invention, there is provided a wafer lifting mechanism, comprising: an ejector body, an ejector weight and a locking pendulum; a connecting column is arranged on the top of the ejector weight; the locking pendulum is rotatably installed in the connecting column; wherein the ejector body has a first position and a second position, one end of the ejector body is inserted into the connecting column along the top to the bottom of the connecting column, and the locking pendulum corresponds to the first position and the second position in sequence; when the locking pendulum corresponds to the first position of the ejector body, the locking pendulum can rotate in a direction away from the ejector body so that the ejector body can continue to move into the connecting column; when the locking pendulum corresponds to the second position of the ejector body, the locking pendulum can rotate in a direction close to the ejector body under the action of gravity, and can be engaged with the ejector body.

[0006] Optionally, the connecting column and the locking pendulum are integrally formed by ceramic 3D printing.

[0007] Optionally, a driving structure is provided at the first position of the ejector body, and a first locking structure is provided on the locking pendulum. The driving structure can drive the first locking structure to drive the locking pendulum to rotate in a direction away from the ejector body.

[0008] Optionally, a second locking structure is provided at the second position of the ejector body, and the first locking structure is engaged with the second locking structure to lock the ejector body on the coupling column.

[0009] Optionally, the driving structure is a first protrusion, the first locking structure is a second protrusion, and the second locking structure is a first groove; when the locking pendulum corresponds to the first position of the ejector body, the first protrusion abuts against the second protrusion and pushes the locking pendulum to rotate away from the ejector body; when the locking pendulum corresponds to the second position of the ejector body, the second protrusion extends into and is clamped in the first groove.

[0010] Optionally, a third protrusion is further provided on the ejector body, the first protrusion and the third protrusion respectively extend along the circumference of the ejector body to form an annular flange, the third protrusion is located on the side of the first protrusion away from the bottom end of the ejector body, and the third protrusion and the first protrusion are spaced apart to form an annular first groove.

[0011] Optionally, the locking pendulum includes a rotating shaft and a swing arm, the rotating shaft is connected to the swing arm, and the second protrusion is arranged on a side of the swing arm close to the ejector body, wherein the swing arm is inclined downward from an end close to the rotating shaft to an end away from the rotating shaft, and the swing arm is in an arc shape bent toward one side of the ejector body.

[0012] Optionally, the rotation axis is a rotating ball axis.

[0013] Optionally, the connecting column is axially provided with a mounting groove for inserting the ejector body, and the opening of the mounting groove is formed on the top surface of the connecting column; a second groove and a third groove are provided inside the connecting column, the second groove and the third groove are connected, the rotating shaft is provided in the second groove, the swing arm is provided in the third groove, the rotating shaft can rotate and drive the swing arm to rotate; wherein the third groove is connected to the mounting groove, and the second protrusion can extend into the mounting groove through the third groove.

[0014] According to another aspect of the present invention, a semiconductor device is provided, comprising the above-mentioned wafer lifting mechanism.

[0015] The beneficial effect of the wafer lifting mechanism provided by the present invention is that: compared with the prior art, the wafer lifting mechanism provided by the present invention sets a rotatable locking pendulum in the connecting column at the top of the ejector weight, and when the ejector body is inserted into the connecting column, the locking pendulum corresponds to the first position and the second position of the ejector body in sequence, so that the locking pendulum can rotate under the action of gravity after being away from the ejector body and engage with the ejector body, so that the ejector body is locked on the connecting column. Through the above arrangement, the locking pendulum can rotate and hold the ejector body tightly by gravity, introducing a more stable, durable and maintenance-free new component into the process, reducing the risks and related maintenance costs caused by the decline of component performance, thereby getting rid of the risks and inconveniences brought by the use of consumable polymer materials to production and equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 It is a structural schematic diagram of a high-density plasma chemical vapor deposition device; Figure 2 It is a structural schematic diagram of an existing ejector lifting / lifting mechanism; Figure 3 It is a structural schematic diagram of an existing connecting piece; Figure 4A three-dimensional diagram of a wafer lifting mechanism provided by an embodiment of the present invention; Figure 5 A front view of a wafer lifting mechanism provided by an embodiment of the present invention; Figure 6 for Figure 5 The cross-section at aa in the middle; Figure 7 for Figure 6 The enlarged view of point A in the middle; Figure 8 A three-dimensional diagram of an ejector body provided in an embodiment of the present invention; Fig. 9 A three-dimensional diagram of an ejector weight provided in an embodiment of the present invention; Fig.10 A front view of an ejector weight provided in an embodiment of the present invention; Fig.11 for Fig.10 Sectional view at bb in the middle; Fig.12 A three-dimensional diagram of a locking pendulum provided in accordance with an embodiment of the present invention.

[0018] The reference numerals in the above drawings are as follows: 10. Ejector body; 11. Ejector weight; 12. Locking pendulum; 121. Rotating shaft; 122. Swing arm; 13, connecting column; 131, mounting groove; 132, second groove; 133, third groove; 14. First protrusion; 15. Second protrusion; 16. First groove; 17. Third protrusion. DETAILED DESCRIPTION

[0019] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0020] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0021] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0022] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0023] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0024] Please refer to Figures 4 to 7As shown, according to one aspect of the present invention, the present invention provides a wafer lifting mechanism, comprising: an ejector body 10, an ejector weight 11 and a locking pendulum 12; a connecting column 13 is arranged on the top of the ejector weight 11; the locking pendulum 12 is rotatably installed in the connecting column 13; wherein the ejector body 10 has a first position and a second position, one end of the ejector body 10 is inserted into the connecting column 13 along the top to the bottom of the connecting column 13, and the locking pendulum 12 corresponds to the first position and the second position in sequence; when the locking pendulum 12 corresponds to the first position of the ejector body 10, the locking pendulum 12 can rotate in a direction away from the ejector body 10, so that the ejector body 10 can continue to move into the connecting column 13; when the locking pendulum 12 corresponds to the second position of the ejector body 10, the locking pendulum 12 can rotate in a direction close to the ejector body 10 under the action of gravity, and can be engaged with the ejector body 10. Specifically, one end of the ejector pin body 10 is used to support the wafer, and the other end thereof is mounted on the connecting column 13. The end of the ejector pin body 10 mounted on the connecting column 13 is provided with a first position and a second position, and the first position and the second position are arranged along the direction from the ejector pin body 10 close to the connecting column 13 to away from the connecting column 13. When installing the ejector body 10, the ejector body 10 is inserted from the top of the connecting column 13 to the bottom thereof, wherein the top of the connecting column 13 is an end away from the ejector weight 11, and the bottom of the connecting column 13 is an end close to the ejector weight 11. In this embodiment, the ejector body 10 is inserted along the axis of the connecting column 13; the first position of the ejector body 10 first corresponds to the locking pendulum 12, and at this time the locking pendulum 12 can rotate in the direction away from the ejector body 10, so that the ejector body 10 can continue to move into the connecting column 13; when the locking pendulum 12 corresponds to the second position of the ejector body 10, the locking pendulum 12 can rotate in the direction close to the ejector body 10 under the action of gravity, and can be engaged with the ejector body 10.

[0025] The wafer lifting mechanism provided in this embodiment is provided with a rotatable locking pendulum 12 in the connecting column 13 at the top of the ejector weight 11. When the ejector body 10 is inserted into the connecting column 13, the locking pendulum 12 is sequentially corresponding to the first position and the second position of the ejector body 10, so that the locking pendulum 12 can rotate under the action of gravity after being away from the ejector body 10 and engage with the ejector body 10, so that the ejector body 10 is locked on the connecting column 13. Through the above arrangement, the locking pendulum 12 can rotate and hold the ejector body 10 tightly under the action of gravity, introducing a new type of component that is more stable, durable and maintenance-free for the process, reducing the risks and related maintenance costs caused by the degradation of component performance, thereby getting rid of the risks and inconveniences brought by the use of consumable polymer materials to production and equipment.

[0026] See also Figure 7 and Fig.12As shown, in this embodiment, the connecting column 13 and the locking pendulum 12 are integrally formed by ceramic 3D printing. The locking pendulum 12 and the connecting column 13 can be made into an integral structure by ceramic 3D printing processing technology, so that the connecting column 13 becomes a semi-permanent structure, and the connecting column 13 and the locking pendulum 12 do not need to use consumable polymer materials, and do not need to replace consumables, thereby improving process production and reducing equipment maintenance costs.

[0027] See also Figure 8 and Fig.12 As shown, in this embodiment, a driving structure is provided at the first position of the ejector body 10, and a first locking structure is provided on the locking pendulum 12. The driving structure can drive the first locking structure to drive the locking pendulum 12 to rotate in a direction away from the ejector body 10. By providing a driving structure at the first position of the ejector body 10 provided in this embodiment, and providing a first locking structure on the locking pendulum 12, when the first position of the ejector body 10 provided in this embodiment corresponds to the locking pendulum 12, the first locking structure is driven by the driving structure to drive the locking pendulum 12 to rotate in a direction away from the ejector body 10, so that the locking pendulum 12 cannot block the ejector body 10 from continuing to move into the coupling column 13, and the second position of the ejector body 10 corresponds to the locking pendulum 12.

[0028] See also Figure 8 and Fig.12 As shown, in this embodiment, the second position of the ejector body 10 is provided with a second locking structure, and the first locking structure is engaged with the second locking structure, so that the ejector body 10 is locked on the connecting column 13. By providing the second locking structure at the second position of the ejector body 10 provided in this embodiment, when the second position of the ejector body 10 provided in this embodiment corresponds to the locking pendulum 12, the first locking structure is engaged with the second locking structure, so that the ejector body 10 is locked on the connecting column 13.

[0029] See also Figures 8 to 12As shown, in this embodiment, the driving structure is the first protrusion 14, the first locking structure is the second protrusion 15, and the second locking structure is the first groove 16; when the locking pendulum 12 corresponds to the first position of the ejector body 10, the first protrusion 14 abuts against the second protrusion 15 and pushes the locking pendulum 12 to rotate in the direction away from the ejector body 10; when the locking pendulum 12 corresponds to the second position of the ejector body 10, the second protrusion 15 extends into and is clamped in the first groove 16. By setting the driving structure provided in the present embodiment as the first protrusion 14 and the second locking structure as the second protrusion 15, when the first position of the ejector body 10 provided in the present embodiment corresponds to the locking pendulum 12, the first protrusion 14 abuts against the second protrusion 15, so that the first protrusion 14 can push the second protrusion 15 to drive the locking pendulum 12 to rotate in the direction away from the ejector body 10, so that the locking pendulum 12 cannot prevent the ejector body 10 from continuing to move into the connecting column 13, and the second position of the ejector body 10 corresponds to the locking pendulum 12; by setting the first groove 16 at the second position of the ejector body 10 provided in the present embodiment, when the second position of the ejector body 10 provided in the present embodiment corresponds to the locking pendulum 12, the second protrusion 15 is engaged with the first groove 16, so that the ejector body 10 is locked on the connecting column 13.

[0030] See also Figure 8 As shown, in this embodiment, the ejector body 10 is further provided with a third protrusion 17, the first protrusion 14 and the third protrusion 17 respectively extend along the circumference of the ejector body 10 to form an annular flange, the third protrusion 17 is located on the side of the first protrusion 14 away from the bottom end of the ejector body 10, and the third protrusion 17 and the first protrusion 14 are arranged at intervals to form an annular first groove 16. Among them, the bottom end of the ejector body 10 is installed on one end of the connecting column 13, and the first protrusion 14 and the third protrusion 17 are arranged at intervals along the direction from the bottom end to the top end of the ejector body 10, so as to form a first groove 16 adapted to the second protrusion 15 between the first protrusion 14 and the third protrusion 17.

[0031] See also Fig.12As shown, in this embodiment, the locking pendulum 12 includes a rotating shaft 121 and a swing arm 122, the rotating shaft 121 is connected to the swing arm 122, and the second protrusion 15 is provided on the side of the swing arm 122 close to the ejector body 10, wherein the swing arm 122 is tilted downward from one end close to the rotating shaft 121 to one end away from the rotating shaft 121, and the swing arm 122 is in an arc shape that bends toward one side of the ejector body 10. By setting the end of the arc-shaped swing arm 122 provided in this embodiment connected to the rotating shaft 121 to be higher than the end away from the rotating shaft 121, the swing arm 122 can rotate under the action of gravity after being away from the ejector body 10. When the ejector body 10 is installed, the ejector body 10 is axially inserted into the connecting column 13. When the first protrusion 14 of the ejector body 10 abuts against the second protrusion 15, the first protrusion 14 pushes the second protrusion 15 to drive the swing arm 122 to rotate around the rotating shaft 121 in a direction away from the ejector body 10, and the first protrusion 14 continues to move into the connecting column 13, so that the first groove 16 corresponds to the second protrusion 15. At this time, the locking pendulum 12 rotates under the action of gravity so that the second protrusion 15 extends into the first groove 16 and is clamped, so that the swing arm 122 embraces the bottom end of the ejector body 10, thereby limiting and fixing the ejector body 10.

[0032] See also Fig.12 As shown, in this embodiment, the rotating shaft 121 is a rotating ball shaft. The rotating ball shaft provided in this embodiment is a rotatable sphere, which is connected to one end of the swing arm 122 and can drive the swing arm 122 to rotate.

[0033] See also Figures 9 to 11 As shown, in this embodiment, the connecting column 13 is axially provided with a mounting groove 131 for inserting the ejector body 10, and the opening of the mounting groove 131 is formed on the top surface of the connecting column 13; a second groove 132 and a third groove 133 are provided inside the connecting column 13, the second groove 132 and the third groove 133 are connected, the rotating shaft 121 is arranged in the second groove 132, the swing arm 122 is arranged in the third groove 133, the rotating shaft 121 can rotate and drive the swing arm 122 to rotate; wherein, the third groove 133 is connected with the mounting groove 131, and the second protrusion 15 can extend into the mounting groove 131 through the third groove 133. The inner diameter of the mounting groove 131 provided in this embodiment is larger than the maximum outer diameter of the ejector body 10, so that the ejector body 10 can be inserted into the mounting groove 131; the rotating shaft 121 is a rotating ball shaft, which is arranged in the second groove 132 and can rotate in the second groove 132; the space of the third groove 133 is larger than the entire swing arm 122, and is a rotation space reserved for the swing arm 122, so that the swing arm 122 can rotate in the third groove 133.

[0034] According to another aspect of the present invention, a semiconductor device is provided, comprising the above-mentioned wafer lifting mechanism. It is understandable that the beneficial effects of the above-mentioned other aspect can be found in the relevant description of the above-mentioned wafer lifting mechanism, which will not be repeated here.

[0035] In summary, the wafer lifting mechanism and semiconductor device provided by this embodiment have at least the following beneficial technical effects: By arranging a rotatable locking pendulum 12 in the connecting column 13 at the top of the ejector weight 11, the locking pendulum 12 can rotate and hold the ejector body 10 by gravity, and the locking pendulum 12 and the connecting column 13 are made into an integral structure by ceramic 3D printing processing technology, so that the connecting column 13 becomes a semi-permanent structure. The present invention introduces a new type of component that is more stable, durable and maintenance-free into the process, reduces the risk of damage to the wafer and the electrostatic chuck due to the degradation of the component performance and the related maintenance costs, thereby getting rid of the risks and inconveniences brought to production and equipment by using consumable polymer materials, thereby improving process production and reducing equipment maintenance costs.

[0036] The above are only preferred embodiments of the present invention, and only specifically describe the technical principles of the present invention. These descriptions are only for explaining the principles of the present invention and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanations here, any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention, and other specific implementations of the present invention that can be associated with by technicians in this field without creative labor, should be included in the scope of protection of the present invention.

Claims

1. A wafer lifting mechanism, characterized in that: include: Ejector body; An ejector weight, wherein a connecting column is provided on the top of the ejector weight; A locking pendulum, the locking pendulum being rotatably mounted in the coupling column; The ejector body has a first position and a second position, one end of the ejector body is inserted into the connecting column from the top to the bottom of the connecting column, and the locking pendulum corresponds to the first position and the second position in sequence; When the locking pendulum corresponds to the first position of the ejector body, the locking pendulum can rotate in a direction away from the ejector body, so that the ejector body can continue to move into the coupling column; When the locking pendulum corresponds to the second position of the ejector body, the locking pendulum can rotate toward the ejector body under the action of gravity and can be engaged with the ejector body.

2. The wafer lifting mechanism according to claim 1, characterized in that: The connecting column and the locking pendulum are integrally formed by ceramic 3D printing.

3. The wafer lifting mechanism according to claim 1, characterized in that: A driving structure is disposed at the first position of the ejector body, and a first locking structure is disposed on the locking pendulum. The driving structure can drive the first locking structure to drive the locking pendulum to rotate in a direction away from the ejector body.

4. The wafer lifting mechanism according to claim 3, characterized in that: A second locking structure is disposed at the second position of the ejector body, and the first locking structure is engaged with the second locking structure so that the ejector body is locked on the connecting column.

5. The wafer lifting mechanism according to claim 4, characterized in that: The driving structure is a first protrusion, the first locking structure is a second protrusion, and the second locking structure is a first groove; When the locking pendulum corresponds to the first position of the ejector body, the first protrusion abuts against the second protrusion and pushes the locking pendulum to rotate in a direction away from the ejector body; When the locking pendulum corresponds to the second position of the ejector body, the second protrusion extends into and is clamped in the first groove.

6. The wafer lifting mechanism according to claim 5, characterized in that: The ejector body is also provided with a third protrusion, the first protrusion and the third protrusion respectively extend along the circumference of the ejector body to form an annular flange, the third protrusion is located on a side of the first protrusion away from the bottom end of the ejector body, and the third protrusion and the first protrusion are spaced apart to form the first annular groove.

7. The wafer lifting mechanism according to claim 6, characterized in that: The locking pendulum includes a rotating shaft and a swing arm, the rotating shaft is connected to the swing arm, the second protrusion is arranged on a side of the swing arm close to the ejector body, wherein the swing arm is inclined downward from an end close to the rotating shaft to an end away from the rotating shaft, and the swing arm is in an arc shape bent toward one side of the ejector body.

8. The wafer lifting mechanism according to claim 7, characterized in that: The rotating shaft is a rotating ball shaft.

9. The wafer lifting mechanism according to claim 8, characterized in that: The connecting column is provided with a mounting groove for inserting the ejector body along the axial direction, and the opening of the mounting groove is formed on the top surface of the connecting column; A second groove and a third groove are provided inside the coupling column, the second groove and the third groove are connected, the rotating shaft is provided in the second groove, the swing arm is provided in the third groove, and the rotating shaft can rotate and drive the swing arm to rotate; Wherein, the third groove is communicated with the mounting groove, and the second protrusion can extend into the mounting groove through the third groove.

10. A semiconductor device, characterized in that: It comprises a wafer lifting mechanism as described in any one of claims 1 to 9.

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