Thermocouple sensor assembly, decontamination system and vehicle

Abstract

A thermocouple sensor assembly (10) is disclosed, comprising: a housing (100); the circuit board (200) is arranged in the shell, and the circuit board comprises a chip (210); at least one terminal (300), each terminal comprising a connecting end (320) and a terminating end (310), the terminating end (310) being used for connecting with the circuit board; at least one wire (400a, 400b), each wire comprising a first end (410a, 410b) and a second end (420a, 420b) opposite to each other, the first end being intended to be placed in an environment to be measured, each wire being connected at the second end with a connection end of a corresponding terminal to form a connection portion; wherein the terminal is arranged opposite to the inner side of the circuit board; wherein the terminal is at least partially integrated with the shell. Also disclosed is a decontamination system mounted on an exhaust gas discharge line of a vehicle and including such a thermocouple sensor assembly. The invention further discloses a vehicle which comprises the decontamination system.

Description

Technical Field

[0001] The present disclosure relates to the field of sensors, and more specifically to a thermocouple sensor assembly. The present disclosure also relates to a decontamination system installed on an exhaust gas exhaust pipe of a vehicle and comprising the thermocouple sensor assembly. The present disclosure relates to a vehicle comprising the decontamination system. Background Art

[0002] It is known that the thermocouple sensor assembly is used to sense the temperature in a thermal environment. For example, it can be used in a decontamination system installed on an exhaust gas exhaust pipe of a vehicle to sense the temperature in the vehicle, thereby ensuring that high temperature does not affect the good operation of the various components of the decontamination system, and thus limiting the emission of pollutants. Usually, the sensing end of the thermocouple sensor assembly is placed in the environment to be tested, and the connecting end opposite to the sensing end is connected to a circuit board, such as an ASIC (application-specific integrated circuit), so that the sensing result is processed by the chip of the circuit board to obtain a temperature value. In the prior art, the connecting end of the thermocouple sensor assembly is often far away from the chip of the circuit board, and the long distance will cause a relatively large thermal gradient between the connecting end and the chip of the circuit board, thereby reducing the accuracy of the final temperature sensing value. In addition, there are also problems in the prior art that the number of components of the thermocouple sensor assembly is large, the assembly is complex, and the overall volume is large, which reduces its cost-effectiveness and is disadvantageous for a space-limited use environment such as a vehicle decontamination system.

[0003] There is still a need for a new thermocouple sensor assembly that can at least partially overcome the problems existing in the prior art and can bring other advantages. Summary of the invention

[0004] To this end, the present disclosure proposes a thermocouple sensor assembly, comprising: a shell; a circuit board, arranged in the shell, the circuit board including a chip; at least one terminal, each terminal including a connecting end and a terminating end, the terminating end being used to connect to the circuit board; at least one wire, each wire including a first end and a second end opposite to each other, the first end being used to be placed in a test environment, and each wire being connected to the connecting end of the corresponding terminal at the second end to form a connecting portion; wherein the terminal is arranged opposite to the inner side of the circuit board; wherein the terminal is at least partially formed integrally with the shell.

[0005] Thus, in the present disclosure, arranging the terminal relative to the inner side of the circuit board allows reducing the distance between the connection portion formed by the connection between the connection end of the terminal and the second end of the wire and the chip of the circuit board, thereby reducing the temperature gradient from the connection portion to the chip, thereby improving the accuracy of the measured temperature value. In addition, forming the terminal at least partially integrally with the housing allows simplifying assembly and facilitating the formation of a more stable assembly, which is conducive to achieving a more compact overall construction and improving cost-effectiveness.

[0006] According to various embodiments, the thermocouple sensor assembly proposed by the present disclosure may further include one or more of the following further developments.

[0007] In some embodiments, the wire is located at the connection portion on a side of the terminal facing the circuit board. This allows the connection between the second end of the wire and the connection end of the terminal to be achieved in a simple structure and manner.

[0008] In some embodiments, the wire is located beside the terminal at the connection portion, which allows the connection between the second end of the wire and the connection end of the terminal to be achieved in a simple structure and manner.

[0009] In some embodiments, each of the terminals includes a vertical extension portion relative to the circuit board, a lateral extension portion, and a transition portion connecting the vertical extension portion and the lateral extension portion, the vertical extension portion includes the termination end, the lateral extension portion includes the connection end, and the transition portion is configured to avoid the path from the second end of the wire to the connection end. This allows the connection end of the terminal to be set closer to the chip on the circuit board to improve measurement accuracy, while allowing the second end of the wire to reach the connection end of the terminal without hindrance.

[0010] In some embodiments, the transition portion includes a C-shaped segment connected to the vertically extending portion, and the second end of the wire passes through the corresponding C-shaped segment. This allows the above effect to be achieved with a compact structure.

[0011] In some embodiments, the transition portion further includes a curved section disposed between the C-shaped section and the lateral extension portion and curved away from the inner side of the circuit board. This further allows the connection end of the terminal to be disposed closer to the chip on the circuit board to improve measurement accuracy, while allowing the second end of the wire to reach the connection end of the terminal without hindrance.

[0012] In some embodiments, the vertically extending portion and the transversely extending portion of the terminal are in the same plane. This allows, in particular, a reduction in the width dimension of the housing.

[0013] In some embodiments, the connection portion is arranged to align with the chip, which allows minimizing the distance between the connection portion and the chip, thereby ensuring the measurement accuracy to the greatest extent.

[0014] In some embodiments, the second end of the wire is laser welded to the connecting end of the terminal, which allows for a simple, easy, and reliable connection between the second end of the wire and the connecting end of the terminal.

[0015] In some embodiments, the at least one terminal is integrally molded with the housing. This allows the elimination of a retaining member that holds the terminal in place in the housing, reduces the number of components, saves material, simplifies manufacturing and assembly, improves cost-effectiveness, and allows a more compact construction of the housing, especially in terms of length.

[0016] According to another aspect of the present disclosure, a decontamination system is provided, which is installed on an exhaust gas exhaust pipe of a vehicle and includes the thermocouple sensor assembly according to any one of the above embodiments.

[0017] According to yet another aspect of the present disclosure, a vehicle is provided, which includes the above-mentioned decontamination system. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present disclosure and should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work. In the drawings:

[0019] Figure 1 A schematic diagram of a thermocouple sensor assembly is shown;

[0020] Figure 2 schematically illustrates a perspective view of a thermocouple sensor assembly according to one embodiment;

[0021] Figure 3 yes Figure 2 A three-dimensional view of the thermocouple sensor assembly after removing the housing;

[0022] Figure 4 is a cross-sectional view of a thermocouple sensor assembly according to one embodiment.

[0023] Reference numerals list

[0024] 10 Thermocouple Sensor Assembly

[0025] 100 Shell

[0026] 110 Main Body

[0027] 111 Open end

[0028] 120 Cover

[0029] 130 First side

[0030] 140 bottom side

[0031] 150 Length direction side

[0032] 200 Circuit Board

[0033] 210 Chip

[0034] 220 jack

[0035] 230 Inside

[0036] 240 outside

[0037] 300 terminal

[0038] 310 Termination end

[0039] 320 Connector

[0040] 330 Vertical extension

[0041] 340 Horizontal extension

[0042] 350 Transition Section

[0043] 351 C-segment

[0044] 352 Bend

[0045] 400a, 400b wire

[0046] 410a, 410b first end

[0047] 420a, 420b Second end

[0048] CP connection, cold spot

[0049] P Lateral plane

[0050] HP Hotspot

[0051] Width

[0052] Length Specific embodiments

[0053] Below, the thermocouple sensor assembly, decontamination system and vehicle according to the embodiments of the present disclosure are described in detail with reference to the accompanying drawings. In order to make the purpose, technical solution and advantages of the present utility model more clear, the technical solution in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments.

[0054] Therefore, the following detailed description of the embodiments of the present disclosure provided in conjunction with the accompanying drawings is not intended to limit the scope of the present disclosure claimed for protection, but merely represents selected embodiments of the present disclosure. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present disclosure.

[0055] Unless otherwise defined in the context, the singular includes the plural. Throughout the specification, the terms "comprising", "having", etc. are used herein to specify the presence of the features, numbers, steps, operations, elements, parts or combinations thereof, but do not exclude the presence or addition of one or more other features, numbers, steps, operations, elements, parts or combinations thereof.

[0056] In addition, even though terms including ordinal numbers such as "first," "second," etc. may be used to describe various components, these components are not limited by these terms, and these terms are only used to distinguish one element from other elements. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component without departing from the scope of the present disclosure.

[0057] In the description of the present invention, it should be understood that the terms "upper", "lower", "left", "right", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the disclosed product is conventionally placed when in use, or are the orientations or positional relationships conventionally understood by those skilled in the art. They are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.

[0058] like Figure 1-3 As shown, the present disclosure provides a thermocouple sensor assembly 10. The thermocouple sensor assembly 10 can be optionally used in a decontamination system installed on an exhaust gas exhaust pipe of a vehicle to measure the temperature inside the vehicle, thereby avoiding improper operation of the decontamination system or one or more of its components due to excessively high temperature inside the vehicle, which may increase the amount of pollutants discharged.

[0059] According to some embodiments, Figure 1-3As shown, the thermocouple sensor assembly 10 may include a housing 100 , a circuit board 200 , at least one terminal 300 , and at least one wire 400 a , 400 b .

[0060] like Figure 2 As shown, in some embodiments, the housing 100 is made of, for example, a plastic material. In a specific embodiment, the housing 100 may include a main body 110 and a cover 120. The main body 110 may include, for example, an open end 111 ( Figure 4 ), the cover 120 is, for example, removably covered on the open end 111 of the main body 110 to close the cover open end 111. More specifically, as shown in the figure, the housing 100 can be in the shape of a substantially parallelepiped. Of course, this shape is only schematic and not restrictive, and the shape of the housing 100 can be designed according to the installation space to allow the thermocouple sensor assembly 10 to be well adapted in the installation space.

[0061] like Figure 2-4 As shown, in some embodiments, the circuit board 200 is arranged inside the housing 100, and the circuit board 200 includes a chip 210, more specifically an ASIC. Each terminal 300 includes two ends, namely a connection end 320 and a termination end 310, the termination end 310 is used to connect with the circuit board 200, more specifically inserted into a corresponding jack 220 formed in the circuit board 200, and optionally welded in the corresponding jack 220. The terminal 300 more specifically does not include a portion located outside the housing 100. Each wire 400a, 400b also includes two ends opposite to each other, respectively referred to as a first end 410a, 410b and a second end, the first end 410a, 410b can be used to be placed in the environment to be tested, that is, the environment in which the temperature is to be detected, and therefore outside the housing 100. Each wire 400a, 400b is connected to the connection end 320 of the corresponding terminal 300 at the second end 420a, 420b to form a connection portion CP, which is, for example, located inside the housing 100. More specifically, the number of wires is the same as the number of terminals. Figure 2-4 As shown, in a specific embodiment, the thermocouple sensor assembly 10 is constructed such that each terminal 300 is disposed opposite to the inner side 230 of the circuit board 200. Figure 2-3 As shown, each terminal 300 is arranged so that, except for the portion extending to the outer side 240 of the circuit board 200 through the corresponding insertion hole 210 of the circuit board 200, the rest of the terminal 300 is arranged opposite to the inner side 230 of the circuit board 200. More specifically, the thermocouple sensor assembly 10 is also configured so that each terminal 300 thereof is at least partially integrally formed with the housing 100. In one embodiment, the at least one terminal 300 is integrally molded with the housing 100.

[0062] It should be noted that in the sense of the present disclosure, the circuit board 200 can be disposed between a side surface of the housing 100, such as the side surface formed by the cover 120, and the above-mentioned remaining portion of the terminal 300, and the side of the circuit board 200 facing the side surface of the housing 100 is referred to as the "outer side 240", and the side facing the above-mentioned remaining portion of the terminal 300 and opposite to the outer side 240 is referred to as the "inner side 230". In a specific embodiment, as Figure 4 As shown, the circuit board 200 is arranged with its outer side 240 facing the opening end 111 of the housing 100 mentioned above.

[0063] Thus, in the present disclosure, arranging the terminal 300 relative to the inner side 230 of the circuit board 200 allows reducing the distance between the connection portion CP formed by the connection between the connection end 320 of the terminal 300 and the second end 420 of the wire 400 and the chip 210 of the circuit board 200, thereby reducing the temperature gradient from the connection portion CP to the chip 210, thereby improving the accuracy of the processing result of the chip 210, that is, the measured temperature value. In addition, forming the terminal 300 at least partially integrally with the housing 100 allows for simplified assembly and facilitates the formation of a more stable assembly, which is conducive to achieving a more compact overall structure and improving cost-effectiveness. Further, molding the terminal 300 integrally with the housing 100 allows the elimination of a retaining component that holds the terminal 300 in place in the housing 100, which on the one hand reduces the number of components of the thermocouple sensor assembly 10, saves material and further simplifies manufacturing and assembly, and on the other hand is conducive to saving space, especially allowing the reduction of, for example, Figure 2 The housing 100 is shown with a length Length.

[0064] In a specific embodiment, Figure 1As shown, the at least one wire 400a, 400b includes at least one pair of wires 400a, 400b arranged in pairs, and each pair of wires 400a, 400b may include a first wire 400a and a second wire 400b made of different materials, respectively. The first wire 400a is made of nickel-chromium silicon, for example, and the second wire 400b is made of nickel silicon, for example. More specifically, the connection portion CP formed by connecting the first wire 400a and the second wire 400b in each pair of wires with the connection end 320 of the corresponding terminal 300 forms a cold spot of the thermocouple sensor assembly 10, and the first ends 410a, 410b of the first wire 400a and the second wire 400b in each pair of wires are connected to each other to form a hot spot HP placed in the environment to be measured. When the thermocouple sensor assembly 10 is placed in an environment to be detected and is in working condition, there may be a temperature gradient (T2-T1) between the hot spot HP and the cold spot CP. The temperature gradient causes an electromotive force V to be generated between the first conductor 400a and the corresponding second conductor 400b in the cold spot CP region. The chip 210 of the circuit board 200 can obtain a measured temperature value by processing the electromotive force V.

[0065] In some embodiments, Figure 2 and 3 As shown, the wires 400a, 400b are arranged at the connection portion CP on the side of the corresponding terminal 300 facing the circuit board 200, that is, the upper side in the figure, that is, the second ends 420a, 420b ( Figure 1) is located between the circuit board 200 and the connection end 320 of the terminal 300 at the connection portion CP. Alternatively, in an embodiment not shown, the wires 400a, 400b may be located beside the corresponding terminal 300 at the connection portion CP, and more specifically, the second ends 420a, 420b of the wires 400a, 400b and the connection end 320 of the corresponding terminal 300 may be arranged side by side in a plane parallel to the main extension surface of the circuit board 200. More specifically, in an embodiment in which the wire includes a wire pair consisting of a first wire 400a and a second wire 400b, one or both of the first wire 400a and the second wire 400b may be located on a side of the corresponding terminal 300 facing the circuit board 200 or beside the corresponding terminal 300 at the connection portion CP. In one embodiment, the second ends 420a, 420b of the wires 400a, 400b may be laser welded to the connection end 320 of the corresponding terminal 300. More specifically, in the case where the housing 100 includes an open end 111 and a cover 120 and the outer side 240 of the circuit board 200 is arranged toward the open end 111, the connection end 320 of the terminal 300 and the second end 420a, 420b of the corresponding wire 400a, 400b can be laser welded at the connection portion CP in a state where the cover 120 of the housing 100 is removed or opened and the circuit board 200 has not yet been installed. The wires 400a, 400b are arranged on the side of the corresponding terminal 300 facing the circuit board 200 or on the side of the corresponding terminal 300 at the connection portion CP. It is possible to perform laser welding via the open end 111 of the housing 100 without providing a passage that allows the laser to reach the connection portion CP on the bottom side 140 opposite to the open end 111 or the adjacent side 150 in the length direction of the housing 100.

[0066] In some embodiments, as particularly referred to Figure 3As shown, the terminal 300 may be constructed to include a vertical extension portion 330 relative to the circuit board 200, more specifically relative to the main extension surface of the circuit board 200, a lateral extension portion 340, and a transition portion 350 connecting the vertical extension portion 330 and the lateral extension portion 340. More specifically, the vertical extension portion 330 of the terminal 300 may extend substantially perpendicular to the main extension surface of the circuit board 200, and the lateral extension portion 340 may extend substantially parallel to the main extension surface of the circuit board 200. The vertical extension portion 330 may include a termination end 310, that is, the vertical extension portion 330 may be inserted into a corresponding insertion hole 220 of the circuit board 200 and, for example, welded therein, and the lateral extension portion 340 may include a connection end 320 for connecting to the second ends 420a, 420b of the wires 400a, 400b, for example, laser welding. The transition portion 350 may be arranged to avoid the path from the second ends 420a, 420b of the wires 400a, 400b to the connection end 320 of the corresponding terminal 300. Thus, the terminal 300 is constructed in such a way that the second ends 420a, 420b of the corresponding wires 400a, 400b can reach their connection ends 320 without hindrance to form the above-mentioned connection portion CP, which allows the connection portion CP to be kept at a shorter distance from the chip 210 of the circuit board 200, thereby ensuring improved measurement accuracy.

[0067] In some embodiments, Figure 2-4 As shown, the transition portion 350 of the terminal 300 may also include a C-shaped segment 351 connected to the vertical extension portion 330, and the C-shaped segment 351 is more specifically configured to allow the second ends 420a, 420b of the corresponding wires 400a, 400b to pass through to reach the connection end 320 of the lateral extension portion 340 of the terminal 300. More specifically, as shown in the figure, the terminal 300 is a terminal 300 arranged in a row, for example, the vertical extension portions 330 of all the terminals 300 are in the same lateral plane P, and the lateral plane P, for example, can be roughly parallel to one side of the housing 100, referred to as the first side 130, which is more specifically the side in the width Width direction; more specifically, the lateral extension portions 340 of all the terminals 300 are in the same lateral plane, and the lateral plane is, for example, roughly parallel to the bottom side of the housing 100. In a specific embodiment, the C-shaped segments 351 of all the terminals are bent in the same direction relative to the vertical extension portion 330 of the terminal 300, and for example, are bent in the same direction in the above-mentioned lateral plane P. This allows the width Width ( Figure 2 A very compact structure is achieved.

[0068] In some embodiments, Figure 2-3As shown, the transition portion 350 of the terminal 300 further includes a bent section 352 disposed between the C-shaped section 351 and the transverse extension portion 340 and bent away from the inner side 230 of the circuit board 200. More specifically, one end of the C-shaped section 351 is connected to the vertical extension portion 330, and the other end of the C-shaped section 351 is connected to the bent section 352, that is, the bent section 352 starts from the other end of the C-shaped section 351. The bent section 352 is arranged to bend away from the inner side 230 of the circuit board 200, more specifically, in a direction toward the bottom side 140 of the housing 100, which allows the lateral extension 340 with the connection end 320 of the terminal 300 to be arranged at a more inner portion of the housing 100, and allows the second ends 420a, 420b of the corresponding wires 400a, 400b to reach the connection end 320 without hindrance, thereby allowing the connection portion CP formed by the second ends 420a, 420b of the wires 400a, 400b and the connection end 320 of the terminal 300 to be closer to the chip 210 of the circuit board 200. More specifically, the connection portion CP is arranged to be aligned with the chip 210 on the circuit board 200, more specifically, aligned in a direction perpendicular to the main extension surface of the circuit board 200, which allows minimizing the distance between the connection portion CP, i.e., the cold spot, and the chip 210, thereby maximizing the measurement accuracy.

[0069] In some embodiments, Figure 2 and 3 As shown, the vertically extending portion 330 and the transversely extending portion 340 of the terminal 300 are in the same plane, more specifically in the same plane substantially perpendicular to the above-mentioned lateral plane P. This further allows minimizing the width Width dimension of the housing 100 .

[0070] In some embodiments, at least the transition portion of the terminal 300, more specifically the C-shaped segment 351 and / or the bent segment 352, is molded in the material of the housing 100. In one embodiment, the C-shaped segment 351 of the terminal 300 is integrally molded with the first side 130 of the housing 100. Additionally or alternatively, the bent segment 352 of the terminal 300 is integrally molded with the bottom side 140 of the housing 300. This further helps to reduce the volume of the housing 100, especially in the length direction and the height direction orthogonal to the width and length, to achieve a more compact structure. Further, the vertical extension portion 330 and / or the lateral extension portion 340 of the terminal 300 can be at least partially integrally molded with the housing 100. For example, the rest of the lateral extension portion 340 of the terminal 330 except the side facing the circuit board 200 can be molded in the bottom side 140 of the housing 200. For example, a portion of the vertically extending portion 330 of the terminal 300 adjacent to the C-shaped section 351 may be molded in the first side surface 130 of the housing 100 .

[0071] According to another aspect of the present disclosure, a decontamination system is provided, which is installed on an exhaust pipe of a vehicle and may include the thermocouple sensor assembly 10 according to any one of the above embodiments or implementations.

[0072] According to yet another aspect of the present disclosure, a vehicle is provided, which includes the above-mentioned decontamination system.

[0073] The exemplary implementations of the thermocouple sensor assembly, decontamination system and vehicle proposed in the present invention are described in detail above with reference to the preferred embodiments. However, it can be understood by those skilled in the art that, without departing from the concept of the present invention, various modifications and variations can be made to the above-mentioned specific embodiments, and various technical features and structures proposed in the present invention can be combined in various ways without exceeding the scope of protection of the present invention.

[0074] The scope of the present disclosure is not limited by the above-described embodiments but by the appended claims and their equivalents.

Claims

1. A thermocouple sensor assembly (10), comprising: Housing (100); A circuit board (200) is arranged in the housing (100), and the circuit board (200) includes a chip (210); at least one terminal (300), each terminal (300) comprising a connecting end (320) and a terminating end (310), the terminating end (310) being used to be connected to the circuit board (200); At least one wire (400a, 400b), each wire (400a, 400b) comprising a first end (410a, 410b) and a second end (420a, 420b) opposite to each other, the first end being used for being placed in a test environment, and each wire being connected to a connection end (320) of a corresponding terminal (300) at the second end (420a, 420b) to form a connection portion; Wherein, the terminal (300) is arranged opposite to the inner side of the circuit board (200); Wherein, the terminal (300) is at least partially formed integrally with the housing (100).

2. The thermocouple sensor assembly (10) according to claim 1, wherein: The conductive wires (400a, 400b) are located at the connection portion on a side of the terminal (300) facing the circuit board (200).

3. The thermocouple sensor assembly (10) according to claim 1, wherein: The wires (400a, 400b) are located beside the terminal (300) at the connection portion.

4. The thermocouple sensor assembly (10) according to claim 2 or 3, wherein: Each of the terminals (300) comprises a vertically extending portion (330) relative to the circuit board (200), a transversely extending portion (340), and a transition portion (350) connecting the vertically extending portion (330) and the transversely extending portion (340). The vertically extending portion (330) includes the terminating end (310), The transversely extending portion (340) includes the connecting end (320), The transition portion (350) is configured to avoid a path from the second end (420a, 420b) of the conductive wire (400a, 400b) to the connection end (320).

5. The thermocouple sensor assembly (10) according to claim 4, wherein: The transition portion (350) includes a C-shaped segment (351) connected to the vertically extending portion (330), and the second ends (420a, 420b) of the conductive wires (400a, 400b) pass through the corresponding C-shaped segments (351).

6. The thermocouple sensor assembly (10) according to claim 5, wherein: The transition portion (350) further comprises a bent section (352) disposed between the C-shaped section (351) and the transversely extending section (340) and bent away from the inner side of the circuit board (200).

7. The thermocouple sensor assembly (10) according to claim 6, wherein: The vertically extending portion (330) and the horizontally extending portion (340) of the terminal (300) are on the same plane.

8. The thermocouple sensor assembly (10) according to any one of claims 1 to 3, wherein: The connection portion is arranged to align with the chip (210).

9. The thermocouple sensor assembly (10) according to any one of claims 1 to 3, wherein: The second ends (420a, 420b) of the wires (400a, 400b) are laser welded to the connection ends (320) of the terminal (300).

10. Thermocouple sensor assembly (10) according to any one of claims 1 to 3, in, The at least one terminal (300) is molded integrally with the housing (100).

11. A decontamination system installed on an exhaust gas discharge line of a vehicle and comprising a thermocouple sensor assembly (10) according to any one of claims 1 to 10.

12. A vehicle comprising a decontamination system according to claim 11.

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