High-precision coupling equipment and coupling method for photon integrated sensing module

Abstract

The invention relates to a high-precision coupling device and method for a photon integrated sensing module, the device comprises a rack, a PIC positioning unit, an FA coupling unit, an SLD coupling unit, a PD coupling unit, a dispensing illumination unit, a side vision assembly and a backlight source assembly, the top of the rack is provided with a developing plate, the middle part of the rack is provided with an upward shooting camera, and the middle part of the rack is provided with an upward shooting camera; the dispensing illumination unit comprises an automatic XYZ moving assembly, a dispensing support, an illumination support, a high-angle shooting camera, a laser, an optical adhesive dispensing assembly and a high-angle shooting UV lamp holder, the automatic XYZ moving assembly independently drives the dispensing support and the illumination support to move, the laser is arranged on the illumination support, the laser obliquely irradiates the upper surface of the photon integrated sensing module, and the optical adhesive dispensing assembly is arranged on the lower surface of the photon integrated sensing module. And reflected light of the laser irradiates the developing plate. The method comprises the steps of feeding, pre-positioning, FA pasting and SLD pasting. The parallelism of the adjacent coupling parts is detected by using an oblique laser specular reflection imaging method, so that the optical precision is improved, the method is simple, and the effect is remarkable.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor devices, and in particular to a high-precision coupling device and a coupling method for a photon integrated sensing module. Background Art

[0002] like Figure 1 As shown, the photon integrated sensing module 100 is assembled by SLD 11 (Super-Luminescent Diodes), FA 12 (Fiber Array), PIC 13 (Photonic Integrated Circuit) and PD 14 (Photo-Diode). SLD 11, PIC 13 and FA 12 are connected in sequence, and PD 14 is connected to one side of PIC 13. PIC 13 includes an optical waveguide. Part of the light emitted by SLD 11 passes through PIC 13 to reach FA 12, and is then guided to other locations that require illumination. The other part is reflected by PIC 13 and reaches PD 14. PD 14 is a light detector that can convert light signals into electrical signals. The photon integrated sensing module 100 has a small volume and a size at the millimeter level. At the same time, because the accuracy of the light direction is extremely high, the parts must also have very strict coupling accuracy, so special equipment is required for assembly.

[0003] Chinese patent CN113156596A discloses a three-piece coupling device, including a substrate, a first motion module connected to the substrate, a second motion module, a third motion module, and a coupling fixture table, which can mount the laser emission module (equivalent to SLD 11) and the optical isolation module on the PCB board. Here, the PCB board is only the installation base of the laser emission module and the optical isolation module. There are optical precision requirements between the laser emission module and the optical isolation module, and the positional accuracy of the surface of the PCB board and the other two does not need to be very high. Here, it is only necessary to rely on the visual shooting component to shoot the bottom of the laser emission module and the optical isolation module and the top of the PCB board respectively, and then the coupling can be started. The optical receiver (equivalent to PD 14) and the optical fiber (equivalent to FA 12) are located on the PCB board carrier, not on the product, so the positional accuracy of the optical receiver and the optical fiber and the product is not strict. However, the optical path in the photon integrated sensor module 100 must pass through adjacent parts without any deviation angle, and the above equipment cannot meet the accuracy requirements.

[0004] Chinese patent CN116859526A discloses an optical device mounting coupling device, including a workpiece platform, a transfer mechanism and a visual positioning mechanism. The visual positioning mechanism here can only shoot the workpiece from top to bottom, so it can only provide horizontal position positioning, and cannot further improve the coupling accuracy of adjacent parts.

[0005] Therefore, it is necessary to improve the equipment to enhance the coupling accuracy of the photonic integrated sensing module. Summary of the invention

[0006] A main purpose of the present invention is to provide a high-precision coupling device for a photonic integrated sensing module, which uses an oblique laser mirror reflection imaging method to detect the parallelism of adjacent coupling parts, thereby improving optical accuracy.

[0007] The present invention achieves the above-mentioned purpose through the following technical solution: A high-precision coupling device for a photon integrated sensing module, comprising: A frame, comprising a base, a developing plate facing downwards is provided on the top of the frame, and a camera for shooting an upward shot of the lower surface of the developing plate is provided in the middle of the frame; A PIC positioning unit, disposed in the middle of the base, comprising a PIC fixing frame; The FA coupling unit is located on the X-axis side of the PIC positioning unit, and includes a FA fixture and a first multi-axis adjustment component, wherein the first six-dimensional adjustment component is located on the base and controls the movement of the FA fixture, and a FA pressure sensor is connected between the FA fixture and the first six-dimensional adjustment component; An SLD coupling unit is located at the other side of the PIC positioning unit in the X direction, and the SLD coupling unit includes an SLD fixture, a second six-dimensional adjustment component and a first probe component. The second six-dimensional adjustment component is located on a base and controls the movement of the SLD fixture and the first probe component. An SLD pressure sensor is connected between the SLD fixture and the second six-dimensional adjustment component. The glue dispensing illumination unit is located above the PIC positioning unit, and includes an automatic XYZ moving component, a glue dispensing bracket, an illumination bracket, a bird's-eye view camera, a laser, an optical glue dispensing component, and a bird's-eye view UV lamp head. The automatic XYZ moving component independently drives the glue dispensing bracket and the illumination bracket to move. The optical glue dispensing component is arranged on the glue dispensing bracket. The bird's-eye view camera, the laser, and the bird's-eye view UV lamp head are arranged on the illumination bracket. The bird's-eye view camera shoots the PIC from top to bottom. The laser obliquely illuminates the upper surface of the photon integrated sensor module, and the reflection of the laser by the photon integrated sensor module is illuminated onto the developing plate. A side vision component, located on one side of the PIC positioning unit in the Y direction, comprising a side camera, wherein the lens of the side camera faces the PIC positioning unit in the Y direction; The backlight source assembly is located at the other side of the PIC positioning unit in the Y direction.

[0008] Specifically, four air-floating shock-absorbing mechanisms are provided at the four lower corners of the base.

[0009] Specifically, the PIC positioning unit also includes a PIC clamping cylinder and a movable clamping claw. A fixed clamping claw is provided on the top of the PIC fixing frame. The PIC clamping cylinder is arranged on the upper part of the PIC fixing frame and drives the movable clamping claw to move along the Y direction. The movable clamping claw cooperates with the fixed clamping claw to clamp the PIC above the PIC fixing frame. The PIC positioning unit also includes an automatic RZ turntable, a manual RX axis and a manual RY axis. The automatic RZ turntable is located in the middle of the base, and the manual RX axis and the manual RY axis are stacked on each other between the automatic RZ turntable and the PIC fixing frame.

[0010] Specifically, the FA fixture includes a FA support block and a FA electric clamp, the FA support block has a suction nozzle for sucking FA from bottom to top, and the FA electric clamp clamps FA from both sides of the Y direction of the FA support block; the first six-dimensional adjustment component is composed of a first automatic Y-axis, a first automatic X-axis, a first automatic Z-axis, a first automatic RX-axis, a first automatic RY-axis and a first automatic RZ-axis.

[0011] Specifically, the SLD fixture includes an SLD support block, an SLD electric clamp and a thermoelectric cooler, the SLD support block has a suction nozzle for adsorbing the SLD from bottom to top, the thermoelectric cooler is arranged close to the lower surface of the SLD support block, and the SLD electric clamp clamps the SLD from both sides of the SLD support block in the Y direction; the second six-dimensional adjustment component is composed of a second automatic Y-axis, a second automatic X-axis and a second automatic Z-axis, a second automatic RX axis, a second automatic RY axis and a second automatic RZ axis; the first probe assembly includes an SLD probe, a probe extension cylinder, a probe manual Y-axis and a first probe automatic Z-axis, the probe extension cylinder drives the SLD probe to enter or leave the upper projection range of the SLD, the probe manual Y-axis adjusts the Y-position of the SLD probe, and the first probe automatic Z-axis adjusts the Z-height of the SLD probe.

[0012] Specifically, the dispensing and lighting unit also includes a gantry, which is located on the base and straddles the PIC positioning unit, the FA coupling unit and the SLD coupling unit. The automatic XYZ moving component includes an X-axis module, a Y-axis module, an automatic dispensing Z-axis and an automatic lighting Z-axis. The X-axis module is directly connected to the gantry, and the X-axis module drives the Y-axis module to move along the X-axis. The Y-axis module independently drives the automatic dispensing Z-axis and the automatic lighting Z-axis to move along the Y-axis respectively. The automatic dispensing Z-axis drives the dispensing bracket to rise and fall in the Z direction, and the automatic lighting Z-axis drives the lighting bracket to rise and fall in the Z direction.

[0013] Specifically, the optical glue dispensing assembly includes an optical glue dispensing head, a dispensing lifting cylinder and a first pressure sensor. The dispensing direction of the optical glue dispensing head is downward. The dispensing lifting cylinder is fixed on the movable bracket and drives the optical glue dispensing head to rise and fall. The first pressure sensor is connected between the driving head of the dispensing lifting cylinder and the optical glue dispensing head.

[0014] Specifically, the dispensing bracket is also provided with a fixed glue dispensing component, and the fixed glue dispensing component includes a fixed glue dispensing head, an XY adjustment axis and an automatic glue dispensing RZ axis. The dispensing direction of the fixed glue dispensing head is downward, and the XY adjustment axis adjusts the XY position of the fixed glue dispensing head. The axis of the fixed glue dispensing head is parallel to the axis of the automatic glue dispensing RZ axis, and the automatic glue dispensing RZ axis controls the fixed glue dispensing head to rotate around the Z axis; a second pressure sensor is connected between the fixed glue dispensing head and the XY adjustment axis.

[0015] Furthermore, there are two optical glue dispensing components and they are arranged on both sides of the fixed glue dispensing component.

[0016] Specifically, a PD coupling unit is further provided on the base, and the PD coupling unit is located on the Y-direction side of the PIC positioning unit. The PD coupling unit includes a PD electric clamp, a third six-dimensional adjustment component and a second probe component. The third six-dimensional adjustment component is located on the base and drives the PD electric clamp and the second probe component to move; a bottom dispensing component is provided on the X-direction side of the PD coupling unit, and the bottom dispensing component includes a bottom dispensing head, a Y-direction cylinder and a bottom X-direction module. The dispensing direction of the bottom dispensing head is upward, and the Y-direction cylinder controls the Y-direction position of the bottom dispensing head relative to the bottom X-direction module. The bottom X-direction module is connected to the base and drives the bottom dispensing head to move along the X-direction; The lighting bracket is also provided with a side-lighting UV lamp head, and the side-lighting UV lamp head is connected to the lighting bracket through a side-lighting lifting cylinder; the third six-dimensional adjustment component is composed of a third automatic Y-axis, a third automatic X-axis, a third automatic Z-axis, a third automatic RX-axis, a third automatic RY-axis and a third automatic RZ-axis; the second probe assembly includes a PD probe, a probe manual XY axis and a second probe automatic Z axis, the PD electric clamp clamps the PD along the X direction, and the end of the PD probe extends between the two tips of the PD electric clamp; the probe manual XY axis and the second probe automatic Z axis adjust the XYZ position of the PD probe; a PD pressure sensor is connected between the PD electric clamp and the third six-dimensional adjustment component.

[0017] Furthermore, the backlight source assembly includes a backlight source, a backlight source lifting cylinder and a backlight source bracket. The backlight source bracket is located on the base, and the backlight source lifting cylinder drives the backlight source to rise and fall relative to the backlight source bracket.

[0018] Furthermore, a tray support is provided on the Y-direction side of the PIC fixing frame, and the tray support is located below the PD electric clamp; the tray support is used to position and place the PD tray, and the upper surface of the PD tray is provided with a plurality of holes for placing the PD.

[0019] Specifically, the side vision component also includes a side shooting Z-direction module that drives the side shooting camera to move along the Z direction, a side shooting X-direction module that drives the side shooting Z-direction module to move along the X direction, and a side shooting Y-direction module that drives the side shooting X-direction module to move along the Y direction relative to the base.

[0020] Another main purpose of the present invention is to provide a coupling method, which can automatically complete the coupling of SLD, FA and PIC by using the above high-precision coupling device.

[0021] The coupling method using the high-precision coupling device comprises the following steps: S1. Loading: placing the PIC on the PIC fixing frame, the FA is clamped by the FA clamp, and the SLD is clamped by the SLD clamp; S2, leveling: under the monitoring of the side camera and the overhead camera, the SLD and the FA are respectively placed on both sides of the PIC in the X direction, the light entrance of the FA is aligned with the rear light exit of the PIC, and the light exit of the SLD is aligned with the light entrance of the PIC, the laser is translated, the laser is first irradiated on the boundary line between the SLD and the PIC, the reflected light is irradiated on the developing board to form two light spots, under the monitoring of the overhead camera, the posture of the SLD is adjusted until the two light spots are in close contact; the laser is translated again, the laser is irradiated on the boundary line between the FA and the PIC, the reflected light is irradiated on the developing board to form another two light spots, under the monitoring of the overhead camera, the posture of the FA is adjusted until the other two light spots are in close contact; S3, preliminary optical coupling: FA is connected to the optical power meter through the tail optical fiber, the SLD probe supplies power to the SLD, the optical power meter measures the received optical power in real time, and the FA coupling unit and the SLD coupling unit start to micro-move through the software algorithm until the optical power received by the optical power meter is the maximum, at which time the optical path is the optimal optical path; S4, FA sticking: under the monitoring of the side camera and the overhead camera, FA is glued and stuck to the X side of PIC, and FA 12 is fixed by UV after secondary optical coupling; S5, attaching SLD: under the monitoring of the side camera and the overhead camera, the SLD is glued and attached to the other side of the PIC in the X direction, and the SLD is fixed by UV after secondary optical coupling.

[0022] Specifically, the steps also include: S6, attaching PD: Under the monitoring of the side camera and the overhead camera, attach PD to the upper part of PIC 13, the specific steps are as follows: S61, PD optical coupling: The PD electric gripper takes out the PD from the hole, and uses the third automatic RX axis, the third automatic RY axis and the third automatic RZ axis to adjust the posture of the PD so that its lower surface is parallel to the upward surface of the PIC. Then the second probe automatic Z axis drives the PD probe to descend, thereby connecting the circuit on the PD, and then moves the PD so that its light inlet is aligned with the side light outlet of the PIC. After the SLD is lit, a part of the light will shine on the PD, and the PD will induce a small current, which will be transmitted to the internal measuring instrument of the equipment through the PD probe. The third automatic Y axis, the third automatic X axis and the third automatic Z axis are slightly moved through the algorithm until the current measured in real time is the largest, at which time the PD is in the optimal position; S62, bottom glue application: The PD electric gripper moves the PD to the Y-direction side of the PIC, the backlight source descends, and the bottom glue dispensing head applies the bottom glue on the lower surface of the PD from bottom to top, and then the PD returns to its optical coupling position; S63, PD secondary optical coupling: perform optical coupling on the adhesive-attached PD again according to step S61; S64, bottom glue light curing: Move the side UV lamp head to one side of the PD, and light it up to cure the bottom glue UV.

[0023] The beneficial effects of the technical solution of the present invention are: 1. The present invention uses the method of oblique laser mirror reflection imaging to detect the parallelism of adjacent coupled parts, thereby improving optical accuracy. The method is simple and the effect is significant.

[0024] 2. FA coupling unit, SLD coupling unit and PD coupling unit can complete six-axis positioning of the relative position of parts under the monitoring of overhead camera and side camera, with comprehensive adjustment dimensions and flexible operation.

[0025] 3. The optical glue dispensing component gives the equipment a dispensing function, and the UV lamp head gives the equipment a light curing function. The combination of the two can automatically complete the rapid curing of the light curing glue at the bonding position, with a high degree of automation. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a top view of the photon integrated sensing module; Figure 2 A three-dimensional diagram of a high-precision coupling device of an embodiment with a partial housing removed; Figure 3 It is a three-dimensional diagram of the base and its upper unit in working state; Figure 4 for Figure 3 A partial enlarged view of position A in the middle; Figure 5 This is the principle diagram of laser alignment; Figure 6 It is a stereogram of the PIC positioning unit; Figure 7 is a stereogram of the FA coupling unit; Figure 8 is a stereogram of the SLD coupling unit; Fig. 9 for Figure 8 A partial enlarged view of position B in the middle; Fig.10 is a stereogram of a PD coupling unit; Fig.11 for Fig.10 A partial enlarged view of the C position in the middle; Fig.12 A three-dimensional diagram of a dispensing lighting unit; Fig.13 for Fig.12 A partial enlarged view of the D position in the middle; Fig.14A perspective view of the side vision component; Fig.15 is a three-dimensional diagram of a backlight source assembly; Fig.16 A perspective view of the bottom dispensing assembly.

[0027] The numbers in the figure represent: 100-photon integrated sensing module, 11-SLD, 12-FA, 13-PIC, 14-PD; 200-High precision coupling equipment, 21-frame, 211-base, 212-air-floating shock-absorbing mechanism, 213-developing board, 214-upward-shooting camera; 22-PIC positioning unit, 221-automatic RZ turntable, 222-manual RX axis, 223-manual RY axis, 224-PIC fixing frame, 2241-fixed clamping claw, 225-PIC clamping cylinder, 226-movable clamping claw, 227-carrier support table, 23-FA coupling unit, 231-FA fixture, 2311-FA support block, 2312-FA electric clamp, 232-first six-dimensional adjustment component, 2321-first automatic Y axis, 2322-first automatic X axis, 2323-first automatic Z axis, 2324-first automatic RX axis, 2325-first automatic RY axis, 2326-first automatic RZ axis, 233-FA pressure sensor, 24-SLD coupling unit, 241-SLD fixture, 2411-SLD support block, 2412-SLD electric gripper, 2413-thermoelectric cooler, 242-second six-dimensional adjustment component, 2421-second automatic Y axis, 2422-second automatic X axis, 2423-second automatic Z axis, 2424-second automatic RX axis, 2425-second automatic RY axis, 2426-second automatic RZ axis, 243-SLD pressure sensor, 244-first probe assembly, 2441-SLD probe, 2442-probe extension cylinder, 2443-probe manual Y axis, 2444-first probe automatic Z axis, 25-PD coupling unit, 251-PD electric gripper, 252-third six-dimensional adjustment assembly, 2521-third automatic Y axis, 2522-third automatic X axis, 2523-third automatic Z axis, 2524-third automatic RX axis, 2525-third automatic RY axis, 2526-third automatic RZ axis, 253-PD pressure sensor, 254-second probe assembly, 2541-PD probe, 2542-probe manual XY axis, 2543-second probe automatic Z axis, 26- glue dispensing lighting unit, 261- gantry, 262- automatic XYZ moving assembly, 2621- X-axis module, 2622- Y-axis module, 2623- glue dispensing automatic Z axis, 2624- lighting automatic Z axis, 263a- glue dispensing bracket, 263b- lighting bracket, 264- overhead camera, 265- laser, 266- optical glue dispensing assembly, 2661- optical glue dispensing head, 2662- glue dispensing lifting cylinder, 2663- first pressure sensor, 267- fixed glue dispensing assembly, 2671- fixed glue dispensing head, 2672- XY adjustment axis, 2673- glue dispensing automatic RZ axis, 2674- second pressure sensor, 268- overhead UV lamp head, 2681- overhead lifting cylinder, 269- side UV lamp head, 2691- side lifting cylinder, 27-side vision component, 271-side camera, 272-side Z-direction module, 273-side X-direction module, 274-side Y-direction module, 28-backlight assembly, 281-backlight, 282-backlight lifting cylinder, 283-backlight bracket, 29-bottom dispensing assembly, 291-bottom dispensing head, 292-Y-direction cylinder, 293-bottom X-direction module, 300-PD carrier, 31-hole. DETAILED DESCRIPTION

[0028] The present invention is further described in detail below with reference to specific embodiments.

[0029] Embodiment 1: like Figures 1 to 3 As shown, a high-precision coupling device 200 for a photon integrated sensing module 100 of the present invention is used to assemble SLD 11, FA 12, PIC 13 and PD 14 into a photon integrated sensing module 100, including a rack 21, a PIC positioning unit 22, a FA coupling unit 23, an SLD coupling unit 24, a PD coupling unit 25, a dispensing lighting unit 26, a side vision component 27 and a backlight component 28.

[0030] like Figure 2 , Figure 3 and Figure 5 As shown, the frame 21 includes a base 211 and four air-floating shock-absorbing mechanisms 212 arranged at the four corners of the lower part of the base 211. A developing plate 213 facing downward is provided on the top of the frame 21, and an overhead camera 214 for photographing the lower surface of the developing plate 213 is provided in the middle of the frame 21.

[0031] The rack 21 is a fixed frame for each unit in the high-precision coupling device 200, wherein the PIC positioning unit 22, the FA coupling unit 23, the SLD coupling unit 24, the PD coupling unit 25, the dispensing illumination unit 26, the side vision assembly 27 and the backlight assembly 28 are all fixed on the base 211. The air-floating shock-absorbing mechanism 212 can reduce the problem of unstable optical path caused by the working vibration of the equipment. The developing plate 213 is used to project the laser reflected by the photon integrated sensor module 100 to form a light spot, and the overhead camera 214 is used to detect the shape of the light spot, thereby providing a basis for dynamic adjustment for the assembly of the photon integrated sensor module 100. The overhead camera 214 can not only shoot the developing plate 213 from bottom to top along the Z direction, but also the shooting direction can have an inclination angle within 45° to avoid the movement of each coupling unit, which does not affect the accuracy of the monitoring light spot alignment. The FA coupling unit 23, the SLD coupling unit 24 and the PD coupling unit 25 can all complete the six-axis positioning of the relative positions of the parts under the monitoring of the overhead camera 264 and the side camera 271, with comprehensive adjustment dimensions and flexible operation.

[0032] like Figure 2 and Figure 3 As shown, the PIC positioning unit 22 is arranged in the middle of the base 211, the FA coupling unit 23 and the SLD coupling unit 24 are respectively located on the opposite sides of the PIC positioning unit 22 in the X direction, the PD coupling unit 25 is located on the Y direction side of the PIC positioning unit 22, the dispensing illumination unit 26 is located above the PIC positioning unit 22, and the side vision component 27 and the backlight component 28 are respectively located on the opposite sides of the PIC positioning unit 22 in the Y direction. The X direction and the Y direction are both located in the horizontal plane and are perpendicular to each other, and the Z direction is the vertical direction.

[0033] The PIC positioning unit 22 is used to locate and fine-tune the position of PIC 13. The FA coupling unit 23 is used to locate and fine-tune the position of FA12. The SLD coupling unit 24 is used to locate and fine-tune the position of SLD 11, and the PD coupling unit 25 is used to locate and fine-tune the position of PD14. The glue dispensing illumination unit 26 is used to perform XY plane bidirectional detection and gluing on the pasting surface of all two adjacent components in the photon integrated sensing module 100, and the side vision component 27 performs XZ plane bidirectional detection on SLD 11, FA 12, and PIC 13. The backlight source component 28 is used to provide backlight for the side vision component 27. Under the joint guidance of the glue dispensing illumination unit 26 and the side vision component 27, the FA coupling unit 23, the SLD coupling unit 24, and the PD coupling unit 25 can jointly complete the precise positioning and coupling of the four parts.

[0034] like Figure 4 and Figure 7As shown, the FA coupling unit 23 includes a FA fixture 231, a first six-dimensional adjustment component 232 and a FA pressure sensor 233. The FA fixture 231 includes a FA support block 2311 and a FA electric clamp 2312. The FA support block 2311 has a suction nozzle for sucking FA 12 from bottom to top, and the FA electric clamp 2312 clamps FA 12 from both sides of the Y direction of the FA support block 2311. The first six-dimensional adjustment component 232 is composed of a first automatic Y axis 2321, a first automatic X axis 2322, a first automatic Z axis 2323, a first automatic RX axis 2324, a first automatic RY axis 2325 and a first automatic RZ axis 2326. The first six-dimensional adjustment component 232 is located on the base 211 and controls the movement of the FA fixture 231. The FA pressure sensor 233 connects the FA fixture 231 and the first six-dimensional adjustment component 232.

[0035] FA 12 needs to be placed on FA support block 2311 from top to bottom and mounted to the first side of PIC 13 along X direction, so FA fixture 231 must clamp FA 12 from Y direction. The side of FA 12 is the mounting surface, so during its assembly, the lower part is preferably sucked by a suction nozzle to prevent it from falling due to force during mounting. The first six-dimensional adjustment component 232 can flexibly adjust the position and posture of FA 12 to adapt to the position of PIC 13. FA pressure sensor 233 is used to prevent the first six-dimensional adjustment component 232 from causing excessive adhesion force of FA 12 on PIC 13 and causing damage to parts.

[0036] like Figure 4 , Figure 8 and Fig. 9As shown, the SLD coupling unit 24 includes an SLD fixture 241, a second six-dimensional adjustment component 242, an SLD pressure sensor 243 and a first probe component 244. The SLD fixture 241 includes an SLD support block 2411, an SLD electric clamp 2412 and a thermoelectric cooler 2413. The SLD support block 2411 has a suction nozzle for adsorbing the SLD 11 from bottom to top. The thermoelectric cooler 2413 is arranged close to the lower surface of the SLD support block 2411. The SLD electric clamp 2412 clamps the SLD 11 from both sides of the Y direction of the SLD support block 2411. The second six-dimensional adjustment component 242 is composed of a second automatic Y axis 2421, a second automatic X axis 2422, a second automatic Z axis 2423, a second automatic RX axis 2424, a second automatic RY axis 2425, and a second automatic RZ axis 2426. The second six-dimensional adjustment component 242 is located on the base 211 and controls the movement of the SLD fixture 241 and the first probe component 244. The first probe component 244 includes an SLD probe 2441, a probe extension cylinder 2442, a probe manual Y axis 2443, and a first probe automatic Z axis 2444. The probe extension cylinder 2442 drives the SLD probe 2441 to enter or leave the upper projection range of the SLD 11, the probe manual Y axis 2443 adjusts the Y position of the SLD probe 2441, and the first probe automatic Z axis 2444 adjusts the Z height of the SLD probe 2441. The SLD pressure sensor 243 connects the SLD fixture 241 and the second six-dimensional adjustment component 242.

[0037] SLD 11 needs to be placed on the SLD support block 2411 from top to bottom and mounted on the second side of PIC 13 along the X direction, so the SLD probe 2441 needs to avoid the upper projection range of SLD 11 at first. When SLD 11 has been sucked by the suction nozzle on the SLD support block 2411, the probe extension cylinder 2442 drives the SLD probe 2441 to extend, and then the first probe automatic Z axis 2444 drives the SLD probe 2441 to descend to contact the circuit on the upper surface of SLD 11, thereby powering SLD 11 and making it emit light. The driving direction of the probe extension cylinder 2442 is not limited to the X direction, but can also be an oblique direction other than the three-dimensional coordinate direction. The second six-dimensional adjustment component 242 can flexibly adjust the position and posture of SLD 11 to adapt to the position of PIC 13. The manual Y axis 2443 of the probe is used to adjust the Y position of the SLD probe 2441 before working. After the SLD 11 is in place, the probe extends the cylinder 2442 to move the SLD probe 2441 to the top of the SLD 11 first, and then the first probe automatic Z axis 2444 makes the SLD probe 2441 descend, so that the end of the SLD probe 2441 is connected to the circuit on the SLD 11. Because the SLD 11 is a very small light source, it is inevitable to generate heat during its operation. If the SLD 11 is overheated, it will affect the accuracy of the measurement. Therefore, compared with the FA coupling unit 23 (FA 12 hardly generates heat), it is necessary to add a thermoelectric cooler 2413 for cooling. The heat emitted by the SLD 11 will be conducted to the thermoelectric cooler 2413 through the SLD support block 2411, and then quickly absorbed. In order to improve the heat dissipation effect, the SLD support block 2411 is preferably made of a material with a high thermal conductivity. The SLD pressure sensor 243 is used to prevent the second six-dimensional adjustment component 242 from causing the SLD 11 to have an excessively large adhesion force on the PIC 13, thereby causing damage to the components.

[0038] like Figure 4 and Figure 6 As shown, the PIC positioning unit 22 includes an automatic RZ turntable 221, a manual RX axis 222, a manual RY axis 223, a PIC fixing frame 224, a PIC clamping cylinder 225 and a movable clamping claw 226. The automatic RZ turntable 221 is located in the middle of the base 211, the manual RX axis 222 and the manual RY axis 223 are stacked on each other between the automatic RZ turntable 221 and the PIC fixing frame 224, a fixed clamping claw 2241 is provided on the top of the PIC fixing frame 224, the PIC clamping cylinder 225 is provided on the upper part of the PIC fixing frame 224 and drives the movable clamping claw 226 to move along the Y direction, and the movable clamping claw 226 cooperates with the fixed clamping claw 2241 to clamp the PIC 13 above the PIC fixing frame 224.

[0039] The PIC fixing frame 224 is used to support the PIC 13 so that the SLD 11, FA 12, and PD 14 are all assembled with the PIC 13 as the center. Because the SLD 11 and FA 12 are to be assembled on both sides of the X direction of the PIC 13 respectively, and there must be no obstruction, the movable jaws 226 and the fixed jaws 2241 should clamp the PIC 13 along the Y direction so that it will not move at will. The fixed jaws 2241 provide a Y-direction reference for the PIC 13. The automatic RZ turntable 221, the manual RX axis 222, and the manual RY axis 223 together constitute the angle fine-tuning device of the PIC fixing frame 224. The manual RX axis 222 and the manual RY axis 223 are used to adjust the upper surface level of the PIC fixing frame 224 before work, so that the upper surface of the PIC 13 is along the XY plane when it is in place. The automatic RZ turntable 221 is used to adjust the angle of the PIC 13 during work so that its sides are directly opposite to other parts.

[0040] like Figure 4 and Fig.14 As shown, the side vision component 27 includes a side camera 271, a side camera Z-direction module 272 for driving the side camera 271 to move along the Z direction, a side camera X-direction module 273 for driving the side camera Z-direction module 272 to move along the X direction, and a side camera Y-direction module 274 for driving the side camera X-direction module 273 to move along the Y direction relative to the base 211. The lens of the side camera 271 faces the PIC positioning unit 22 along the Y direction.

[0041] The side-shooting Z-direction module 272, the side-shooting X-direction module 273 and the side-shooting Y-direction module 274 form an XYZ three-coordinate moving assembly, which is used to drive the side-shooting camera 271 to move. The field of view of the side-shooting camera 271 includes the photon integrated sensor module 100, so it can monitor the relative positioning of the PIC 13, SLD 11 and FA 12 in the X direction.

[0042] like Fig.12 and Fig.13As shown, the dispensing and lighting unit 26 includes a gantry 261, an automatic XYZ moving assembly 262, a dispensing bracket 263a, an lighting bracket 263b, a bird's-eye view camera 264, a laser 265, an optical dispensing assembly 266, and a bird's-eye view UV lamp head 268. The automatic XYZ moving assembly 262 independently drives the dispensing bracket 263a and the lighting bracket 263b to move, and the automatic XYZ moving assembly 262 includes an X-axis module 2621, a Y-axis module 2622, a dispensing automatic Z-axis 2623, and an lighting automatic Z-axis 2624. The gantry 261 is located on the base 211 and straddles the PIC positioning unit 22, the FA coupling unit 23, the SLD coupling unit 24 and the PD coupling unit 25. The X-axis module 2621 is directly connected to the gantry 261. The X-axis module 2621 drives the Y-axis module 2622 to move along the X-axis. The Y-axis module 2622 independently drives the automatic Z-axis 2623 for dispensing glue and the automatic Z-axis 2624 for illumination to move along the Y-axis. The automatic Z-axis 2623 for dispensing glue drives the dispensing bracket 263a to rise and fall in the Z-axis. The automatic Z-axis 2624 for illumination drives the illumination bracket 263b to rise and fall in the Z-axis. The optical glue dispensing assembly 266 is arranged on the dispensing bracket 263a. The overhead camera 264, the laser 265 and the overhead UV lamp head 268 are arranged on the illumination bracket 263b. The overhead camera 264 shoots the PIC 13 from top to bottom. The laser 265 obliquely irradiates the upper surface of the photon integrated sensor module 100 , and the reflection of the laser by the photon integrated sensor module 100 irradiates the developing plate 213 .

[0043] SLD 11, FA 12 and PIC 13 are all parts with smooth upper surfaces. When the three are mounted, the upper surfaces should be in a horizontal direction and the height difference should be less than 1mm. SLD 11 and PIC 13 will be pre-positioned to the distance when they are mounted, thereby generating a boundary line. When the oblique laser emitted by the laser 265 irradiates the boundary line between SLD 11 and PIC 13, two approximately semicircular light spots will be left on the developing plate 213 due to the mirror reflection of the two adjacent upper surfaces. Theoretically, if the parallelism of SLD 11 and PIC 13 is good, then the two light spots projected on the developing plate 213 at the same time should be co-centered and close together. Otherwise, the posture of SLD 11 should be adjusted by the second automatic RX axis 2424 and the second automatic RY axis 2425 under the monitoring of the overhead camera 214 until the two light spots are close together. Similarly, when the laser is irradiated onto the boundary line between FA12 and PIC13 during the pre-positioning between FA12 and PIC13, two other light spots are generated on the developing plate 213. Under the monitoring of the overhead camera 214, the posture of FA12 is adjusted by the first automatic RX axis 2324, the first automatic RY axis 2325 and the first automatic RZ axis 2326 until the other two light spots are close together. In order to magnify the horizontal error of the parts to be recognized by the overhead camera 214, the height difference between the developing plate 213 and the upper surface of the photon integrated sensor module 100 should be appropriately greater than the height difference between the laser 265 and the upper surface of the photon integrated sensor module 100. Assuming that the former height difference is k times the latter height difference, the magnification of the X angle deviation and the Y angle deviation is k+1. The higher the magnification, the higher the accuracy when the light spots are adjusted to overlap. Therefore, the present invention uses the method of oblique laser mirror reflection imaging to detect the parallelism of adjacent coupled parts, thereby improving the optical accuracy. The method is simple and the effect is significant. The optical glue dispensing component 266 gives the device a dispensing function, and the UV lamp head gives the device a light-curing function. The two work together to automatically complete the rapid curing of the light-curing glue at the bonding position, with a high degree of automation.

[0044] like Fig.13 As shown, the optical glue dispensing assembly 266 includes an optical glue dispensing head 2661, a dispensing lifting cylinder 2662 and a first pressure sensor 2663. The dispensing direction of the optical glue dispensing head 2661 is downward, the dispensing lifting cylinder 2662 is fixed on the movable bracket 263 and drives the optical glue dispensing head 2661 to move up and down, and the first pressure sensor 2663 is connected between the driving head of the dispensing lifting cylinder 2662 and the optical glue dispensing head 2661. The overhead UV lamp head 268 is connected to the illumination bracket 263b through the overhead lifting cylinder 2681.

[0045] Optical glue can not only play the role of bonding two parts, but also make the light transmittance higher, which is used to prevent dust from entering the gap between the two parts and causing light blocking. The optical glue dispensing head 2661 is used to apply optical glue on the bonding surface of SLD 11 or the bonding surface of FA 12 (the two bonding surfaces face the positive or reverse direction of the X direction). The automatic XYZ moving component 262 and the dispensing lifting cylinder 2662 will jointly control the position of the optical glue dispensing head 2661 to complete the optical glue dispensing. When dispensing, the end of the optical glue dispensing head 2661 cannot be too close to the bonding surface, otherwise it may knock or damage the parts, so the reaction force needs to be sensed by the first pressure sensor 2663. In order to improve the bonding efficiency, optical glue generally uses UV curing glue, so the overhead lifting cylinder 2681 is required to make the overhead UV lamp head 268 descend to a position close to PIC 13 to complete light curing.

[0046] Embodiment 2: like Fig.12 and Fig.13 As shown, the difference from Example 1 is that a fixed glue dispensing component 267 is also provided on the dispensing bracket 263a, and the fixed glue dispensing component 267 includes a fixed glue dispensing head 2671, an XY adjustment axis 2672, an automatic dispensing RZ axis 2673 and a second pressure sensor 2674. The dispensing direction of the fixed glue dispensing head 2671 is downward, the XY adjustment axis 2672 adjusts the XY position of the fixed glue dispensing head 2671, the axis of the fixed glue dispensing head 2671 is parallel to the axis of the automatic dispensing RZ axis 2673, and the automatic dispensing RZ axis 2673 controls the fixed glue dispensing head 2671 to rotate around the Z axis, and the second pressure sensor 2674 is connected between the fixed glue dispensing head 2671 and the XY adjustment axis 2672.

[0047] Because optical glue is more prominent in light transmittance and fixed glue is more prominent in adhesion, in order to ensure the adhesion strength between parts, it is generally necessary to add fixed glue on both sides of the optical glue in the Y direction. The dispensing method is that the fixed glue dispensing head 2671 first moves to the Y side of the axis of the automatic dispensing RZ axis 2673 to complete the first dispensing of fixed glue, and then the automatic dispensing RZ axis 2673 rotates the fixed glue dispensing head 2671 to the Y side of the axis of the automatic dispensing RZ axis 2673, thereby completing the second dispensing of fixed glue. When dispensing, the end of the fixed glue dispensing head 2671 cannot be too close to the adhesive surface, otherwise it may knock or damage the parts, so the reaction force needs to be sensed by the second pressure sensor 2674.

[0048] like Fig.12 and Fig.13 As shown, there are two optical glue dispensing components 266 and they are arranged on both sides of the fixed glue dispensing component 267.

[0049] Sometimes, the user requires that the optical glue on the SLD 11 and the optical glue on the FA 12 be different in type, so the two optical glue dispensing components 266 need to prepare different types of optical glue, and therefore two sets of optical glue dispensing components 266 are required. Another advantage of this arrangement is that the overhead camera 264 is above the PIC 13, so the two optical glue dispensing components 266 can complete the optical glue dispensing action of the SLD 11 and the optical glue dispensing action of the FA 12 on both sides, reducing the moving time.

[0050] Embodiment 3: like Fig.10 and Fig.11 As shown, the difference from Example 1 is that: the PD coupling unit 25 includes a PD electric gripper 251, a third six-dimensional adjustment component 252, a PD pressure sensor 253 and a second probe component 254. The third six-dimensional adjustment component 252 is located on the base 211 and drives the PD electric gripper 251 and the second probe component 254 to move. The third six-dimensional adjustment component 252 is composed of a third automatic Y axis 2521, a third automatic X axis 2522, a third automatic Z axis 2523, a third automatic RX axis 2524, a third automatic RY axis 2525 and a third automatic RZ axis 2526. The second probe component 254 includes a PD probe 2541, a probe manual XY axis 2542 and a second probe automatic Z axis 2543. The PD electric gripper 251 clamps the PD 14 along the X direction, and the end of the PD probe 2541 extends between the two tips of the PD electric gripper 251; the probe manual XY axis 2542 and the second probe automatic Z axis 2543 adjust the XYZ position of the PD probe 2541. The PD pressure sensor 253 is connected between the PD electric clamp 251 and the third six-dimensional adjustment component 252 .

[0051] The PD electric gripper 251 needs to mount the PD 14 onto the PIC 13 from top to bottom, and the PD 14 does not need to rely on the auxiliary positioning of the laser. The position of the PD probe 2541 will not affect the movement of the PD electric gripper 251, but it is necessary to control its position relative to the circuit on the PD 14. Therefore, during the equipment debugging stage, the probe manual XY axis 2542 needs to be used to manually adjust the position of the PD probe 2541 relative to the PD electric gripper 251. When the PD electric gripper 251 clamps the PD 14, the second probe automatic Z axis 2543 can lower the PD probe 2541, thereby connecting the circuit on the PD 14, and then confirming whether the PD 14 can convert the optical signal into an electrical signal normally. The third six-dimensional adjustment component 252 can flexibly adjust the position and posture of the PD 14 to adapt to the position of the PIC 13. The lower surface of PD14 is the mounting surface, and the upper surface is the circuit surface. Both surfaces cannot be blocked during the movement of PD 14, so a suction nozzle is not needed, and only the PD electric clamp 251 is needed for clamping.

[0052] like Figure 3 and Fig.16 As shown, the X-direction side of the PD coupling unit 25 is provided with a bottom dispensing assembly 29, which includes a bottom dispensing head 291, a Y-direction cylinder 292 and a bottom X-direction module 293. The dispensing direction of the bottom dispensing head 291 is upward, and the Y-direction cylinder 292 controls the Y-direction position of the bottom dispensing head 291 relative to the bottom X-direction module 293. The bottom X-direction module 293 is connected to the base 211 and drives the bottom dispensing head 291 to move along the X-direction. A side-illumination UV lamp head 269 is also provided on the illumination bracket 263b, and the side-illumination UV lamp head 269 is connected to the illumination bracket 263b through the side-illumination lifting cylinder 2691.

[0053] PD 14 is pasted on the upward surface of PIC 13 through the bottom surface, so the bottom glue dispensing head 291 is required to apply another light-curing glue on the bottom surface of PD 14, and then PD 14 is attached to PIC 13. Because the overhead UV lamp head 268 cannot irradiate the light-curing glue here, a side-lighting UV lamp head 269 is added to complete the light curing. Under the monitoring of the overhead camera 264 and the side camera 271, the Y-axis cylinder 292 and the bottom X-axis module 293 will adjust the position of the bottom glue dispensing head 291 to complete the dispensing of the light-curing glue. After the bottom glue dispensing is completed, the bottom glue dispensing head 291 retreats, and the side-lighting lifting cylinder 2691 controls the side-lighting UV lamp head 269 to descend to the side where the glue is dispensed, and then the light curing is completed.

[0054] like Fig.15 As shown, the backlight assembly 28 includes a backlight 281 , a backlight lifting cylinder 282 and a backlight bracket 283 . The backlight bracket 283 is located on the base 211 , and the backlight lifting cylinder 282 drives the backlight 281 to rise and fall relative to the backlight bracket 283 .

[0055] When PIC 13 is assembled with other components, the backlight source 281 needs to be moved to the back of PIC 13 (close to the Y-direction side of PIC 13) to facilitate the side camera 271 to take pictures. When PD 14 needs to be glued, the backlight source 281 needs to be lowered to the outside of the range of movement of the PD coupling unit 25 and the bottom glue dispensing component 29 to avoid interfering with the glue on the lower surface of PD 14.

[0056] Embodiment 4: like Figure 4 and Figure 6 As shown, the difference from Example 4 is that a tray support 227 is provided on the Y-direction side of the PIC fixing frame 224, and the tray support 227 is located below the PD electric clamp 251. The tray support 227 is used to position and place the PD tray 300, and the upper surface of the PD tray 300 is provided with a plurality of cavities 31 for placing the PD 14.

[0057] PD 14 is placed in the cavity 31 of PD carrier 300 in advance, and PD carrier 300 is positioned and placed on carrier support 227 for picking up by PD electric gripper 251. PD carrier 300 is located very close to PIC fixing frame 224, so PD electric gripper 251 can quickly transfer PD 14 to PIC 13, saving the material picking time of PD 14. After all cavities 31 are emptied, another fully loaded PD carrier 300 can be replaced.

[0058] The working process of the high-precision coupling device 200 is: S1. Loading: PIC 13 is placed on the PIC fixing frame 224 and then clamped by the fixed clamp 2241 and the movable clamp 226; PD 14 is placed on the PD carrier 300; PD carrier 300 is placed on the carrier support 227; FA 12 is adsorbed by the FA support block 2311 and clamped by the FA electric clamp 2312; SLD 11 is adsorbed by the SLD support block 2411 and clamped by the SLD electric clamp 2412.

[0059] S2, leveling: under the monitoring of the side camera 271 and the overhead camera 264, SLD 11 and FA 12 are respectively placed on both sides of the PIC 13 in the X direction, so that the light entrance of FA 12 is aligned with the rear light exit of PIC 13, and the light exit of SLD 11 is aligned with the light entrance of PIC 13, and then the laser 265 is translated to first irradiate the laser on the boundary line between SLD 11 and PIC 13, and the reflected light is irradiated on the developing plate 213 to form two light spots, and under the monitoring of the overhead camera 214, the posture of SLD 11 is adjusted by the second automatic RX axis 2424, the second automatic RY axis 2425 and the second automatic RZ axis 2426 until the two light spots are close to each other; the laser 265 is translated again to irradiate the laser on the boundary line between FA 12 and PIC 13, the reflected light shines on the developing plate 213 to form another two light spots. Under the monitoring of the overhead camera 214, the posture of FA 12 is adjusted by the first automatic RX axis 2324, the first automatic RY axis 2325 and the first automatic RZ axis 2326 until the other two light spots are in close contact.

[0060] S3. Preliminary optical coupling: FA 12 is connected to the optical power meter through the tail optical fiber, the SLD probe 2441 supplies power to SLD 11, the optical power meter measures the received optical power in real time, and the first automatic Y-axis 2321, the first automatic X-axis 2322, the first automatic Z-axis 2323 in the FA coupling unit 23 and the second automatic Y-axis 2421, the second automatic X-axis 2422, and the second automatic Z-axis 2423 in the SLD coupling unit 24 start to micro-move through the software algorithm until the optical power received by the optical power meter is the maximum. At this time, the optical path is the optimal optical path.

[0061] S4, attaching FA: Under the monitoring of the side camera 271 and the overhead camera 264, attach FA 12 to the X-axis side of PIC 13, and fix FA by glue after secondary optical coupling. The specific steps are as follows: S41, FA applies optical glue: keep the SLD coupling unit 24 still, FA 12 moves away from PIC 13 by tens of microns in the X direction, so that a first gap is formed between its end face and the side surface of PIC 13, the optical glue dispensing head 2661 on the optical glue dispensing assembly close to FA 12 descends, applies the first optical glue to the first gap and then retracts, and the capillary phenomenon is used to make the first optical glue penetrate into the first gap, and the actual width of the first gap only needs to allow the first optical glue to penetrate, and then FA 12 returns to its optical coupling position; S42, FA secondary optical coupling: perform optical coupling on FA 12 again according to step S3, but keep the SLD coupling unit 24 unchanged, and only use the first automatic Y axis 2321, the first automatic X axis 2322, and the first automatic Z axis 2323 to adjust the position of FA 12; S43, curing the first optical adhesive: shining the UV lamp head 268 from top to bottom close to the first gap, and lighting it to UV cure the first optical adhesive; S44, FA fixed glue: keep the SLD coupling unit 24 and the FA coupling unit 23 immobile, move the fixed glue dispensing assembly 267 along the X direction to the top of FA 12, use the fixed glue dispensing head 2671 to dispense fixed glue on both sides of the first optical glue in the Y direction and then retract; S45, primary fixing glue curing: the UV lamp head 268 is directed downward from top to bottom close to the first gap, and the fixing glue is UV cured after being lit.

[0062] S5, attaching SLD: Under the monitoring of the side camera 271 and the overhead camera 264, glue the SLD 11 and attach it to the other side of the X direction of the PIC 13, and fix the SLD 11 with UV after secondary optical coupling. The specific steps are as follows: S51, SLD applies optical glue: keep the FA coupling unit 23 still, and the SLD 11 retreats several tens of microns in the X direction to form a second gap between its end face and the side of the PIC 13. The optical glue dispensing head 2661 on the optical glue dispensing assembly close to the SLD 11 descends, applies the second optical glue to the second gap, and then retracts. The capillary phenomenon is used to make the second optical glue penetrate into the second gap. The actual width of the second gap only needs to allow the second optical glue to penetrate. Then the SLD 11 returns to its optical coupling position. S52, SLD secondary optical coupling: perform optical coupling on SLD 11 again according to step S3, but keep FA coupling unit 23 still, and only use the second automatic Y axis 2421, the second automatic X axis 2422 and the second automatic Z axis 2423 to adjust the position of SLD 11; S53, curing the second optical glue: shining the UV lamp head 268 from top to bottom close to the second gap, and lighting it to cure the second optical glue with UV light; S54, SLD fixed glue: keep the SLD coupling unit 24 and the FA coupling unit 23 immobile, move the fixed glue dispensing assembly 267 along the X direction to the top of the SLD 11, and the fixed glue dispensing head 2671 dispenses fixed glue on both sides of the second optical glue in the Y direction and then retracts; S55, secondary fixing glue curing: the UV lamp head 268 is directed downward from top to bottom close to the second gap, and the fixing glue is UV cured after being lit.

[0063] S6, attaching PD: Under the monitoring of the side camera 271 and the overhead camera 264, attach the PD 14 to the upper part of the PIC 13. The specific steps are as follows: S61, PD optical coupling: the PD electric gripper 251 takes out the PD 14 from the cavity 31, and uses the third automatic RX axis 2524, the third automatic RY axis 2525 and the third automatic RZ axis 2526 to adjust the posture of the PD 14 so that its lower surface is parallel to the upward surface of the PIC 13, and then the second probe automatic Z axis 2543 drives the PD probe 2541 to descend, thereby connecting the circuit on the PD 14, and then moves the PD 14 so that its light entrance is aligned with the side light exit of the PIC 13, and after the SLD 11 is lit, a part of the light will be irradiated on the PD 14, and the PD will induce a small current and transmit the current to the internal measuring instrument of the equipment through the PD probe 2541, and the third automatic Y axis 2521, the third automatic X axis 2522 and the third automatic Z axis 2523 will be slightly moved by the algorithm until the current measured in real time is the maximum, at which time the PD 14 is in the optimal position; S62, applying bottom glue: the PD electric gripper 251 moves the PD 14 to the Y-direction side of the PIC 13, the backlight source 281 descends, and the bottom glue dispensing head 291 dispenses the bottom glue on the lower surface of the PD 14 from bottom to top, and then the PD 14 returns to its optical coupling position; S63, PD secondary optical coupling: perform optical coupling on the adhesive-attached PD 14 again according to step S61; S64, bottom glue light curing: the side UV lamp head 269 moves to one side of the PD 14 and lights up to UV cure the bottom glue.

[0064] The above are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the creative concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A high-precision coupling device for photon integrated sensing module, characterized in that include: A frame, comprising a base, a developing plate facing downwards is provided on the top of the frame, and a camera for shooting an upward shot of the lower surface of the developing plate is provided in the middle of the frame; A PIC positioning unit, disposed in the middle of the base, comprising a PIC fixing frame; The FA coupling unit is located on the X-axis side of the PIC positioning unit, and includes a FA fixture and a first multi-axis adjustment component, wherein the first six-dimensional adjustment component is located on the base and controls the movement of the FA fixture, and a FA pressure sensor is connected between the FA fixture and the first six-dimensional adjustment component; An SLD coupling unit is located at the other side of the PIC positioning unit in the X direction, and the SLD coupling unit includes an SLD fixture, a second six-dimensional adjustment component and a first probe component. The second six-dimensional adjustment component is located on a base and controls the movement of the SLD fixture and the first probe component. An SLD pressure sensor is connected between the SLD fixture and the second six-dimensional adjustment component. The glue dispensing illumination unit is located above the PIC positioning unit, and includes an automatic XYZ moving component, a glue dispensing bracket, an illumination bracket, a bird's-eye view camera, a laser, an optical glue dispensing component, and a bird's-eye view UV lamp head. The automatic XYZ moving component independently drives the glue dispensing bracket and the illumination bracket to move. The optical glue dispensing component is arranged on the glue dispensing bracket. The bird's-eye view camera, the laser, and the bird's-eye view UV lamp head are arranged on the illumination bracket. The bird's-eye view camera shoots the PIC from top to bottom. The laser obliquely illuminates the upper surface of the photon integrated sensor module, and the reflection of the laser by the photon integrated sensor module is illuminated onto the developing plate. A side vision component, located on one side of the PIC positioning unit in the Y direction, comprising a side camera, wherein the lens of the side camera faces the PIC positioning unit in the Y direction; The backlight source assembly is located at the other side of the PIC positioning unit in the Y direction.

2. The high-precision coupling device for photon integrated sensing module according to claim 1, characterized in that: Four air-floating shock-absorbing mechanisms are arranged at the four corners of the lower part of the base.

3. The high-precision coupling device for photon integrated sensing module according to claim 1, characterized in that: The PIC positioning unit also includes a PIC clamping cylinder and a movable clamping claw. A fixed clamping claw is provided on the top of the PIC fixing frame. The PIC clamping cylinder is arranged on the upper part of the PIC fixing frame and drives the movable clamping claw to move along the Y direction. The movable clamping claw cooperates with the fixed clamping claw to clamp the PIC above the PIC fixing frame; the PIC positioning unit also includes an automatic RZ turntable, a manual RX axis and a manual RY axis. The automatic RZ turntable is located in the middle of the base, and the manual RX axis and the manual RY axis are stacked on each other between the automatic RZ turntable and the PIC fixing frame.

4. The high-precision coupling device for photon integrated sensing module according to claim 1, characterized in that: The FA fixture includes a FA support block and a FA electric clamp, the FA support block has a suction nozzle for sucking FA from bottom to top, and the FA electric clamp clamps FA from both sides of the Y direction of the FA support block; the first six-dimensional adjustment component consists of a first automatic Y-axis, a first automatic X-axis, a first automatic Z-axis, a first automatic RX-axis, a first automatic RY-axis and a first automatic RZ-axis.

5. The high-precision coupling device for photon integrated sensing module according to claim 1, characterized in that: The SLD fixture includes an SLD support block, an SLD electric clamp and a thermoelectric cooler. The SLD support block has a suction nozzle for adsorbing the SLD from bottom to top. The thermoelectric cooler is arranged close to the lower surface of the SLD support block. The SLD electric clamp clamps the SLD from both sides of the Y direction of the SLD support block; the second six-dimensional adjustment component is composed of a second automatic Y-axis, a second automatic X-axis and a second automatic Z-axis, a second automatic RX axis, a second automatic RY axis and a second automatic RZ axis; the first probe assembly includes an SLD probe, a probe extension cylinder, a probe manual Y-axis and a first probe automatic Z-axis. The probe extension cylinder drives the SLD probe to enter or leave the upper projection range of the SLD, the probe manual Y-axis adjusts the Y-position of the SLD probe, and the first probe automatic Z-axis adjusts the Z-height of the SLD probe.

6. The high-precision coupling device for photon integrated sensing module according to claim 1, characterized in that: The glue dispensing and illumination unit also includes a gantry, which is located on the base and straddles the PIC positioning unit, the FA coupling unit and the SLD coupling unit. The automatic XYZ moving component includes an X-axis module, a Y-axis module, an automatic glue dispensing Z-axis and an automatic illumination Z-axis. The X-axis module is directly connected to the gantry, the X-axis module drives the Y-axis module to move along the X-axis, the Y-axis module independently drives the automatic glue dispensing Z-axis and the automatic illumination Z-axis to move along the Y-axis respectively, the automatic glue dispensing Z-axis drives the glue dispensing bracket to rise and fall in the Z-axis, and the automatic illumination Z-axis drives the illumination bracket to rise and fall in the Z-axis.

7. The high-precision coupling device for photon integrated sensing module according to claim 1, characterized in that: The optical glue dispensing assembly includes an optical glue dispensing head, a dispensing lifting cylinder and a first pressure sensor. The dispensing direction of the optical glue dispensing head is downward. The dispensing lifting cylinder is fixed on the movable bracket and drives the optical glue dispensing head to rise and fall. The first pressure sensor is connected between the driving head of the dispensing lifting cylinder and the optical glue dispensing head.

8. The high-precision coupling device for photon integrated sensing module according to claim 1, characterized in that: The dispensing bracket is also provided with a fixed glue dispensing component, which includes a fixed glue dispensing head, an XY adjustment axis and an automatic glue dispensing RZ axis. The dispensing direction of the fixed glue dispensing head is downward, and the XY adjustment axis adjusts the XY position of the fixed glue dispensing head. The axis of the fixed glue dispensing head is parallel to the axis of the automatic glue dispensing RZ axis, and the automatic glue dispensing RZ axis controls the fixed glue dispensing head to rotate around the Z axis; a second pressure sensor is connected between the fixed glue dispensing head and the XY adjustment axis.

9. The high-precision coupling device for photon integrated sensing module according to claim 8, characterized in that: There are two optical glue dispensing components, which are arranged on both sides of the fixed glue dispensing component.

10. The high-precision coupling device for photon integrated sensing module according to claim 1, characterized in that: The base is also provided with a PD coupling unit, which is located on the Y-direction side of the PIC positioning unit. The PD coupling unit includes a PD electric clamp, a third six-dimensional adjustment component and a second probe component. The third six-dimensional adjustment component is located on the base and drives the PD electric clamp and the second probe component to move; the X-direction side of the PD coupling unit is provided with a bottom dispensing component, which includes a bottom dispensing head, a Y-direction cylinder and a bottom X-direction module. The dispensing direction of the bottom dispensing head is upward, and the Y-direction cylinder controls the Y-direction position of the bottom dispensing head relative to the bottom X-direction module. The bottom X-direction module is connected to the base and drives the bottom dispensing head to move along the X-direction; the optical A side-illumination UV lamp head is also provided on the illumination bracket, and the side-illumination UV lamp head is connected to the illumination bracket through a side-illumination lifting cylinder; the third six-dimensional adjustment component is composed of a third automatic Y-axis, a third automatic X-axis, a third automatic Z-axis, a third automatic RX-axis, a third automatic RY-axis and a third automatic RZ-axis; the second probe assembly includes a PD probe, a probe manual XY-axis and a second probe automatic Z-axis, the PD electric clamp clamps the PD along the X-direction, and the end of the PD probe extends between the two tips of the PD electric clamp; the probe manual XY-axis and the second probe automatic Z-axis adjust the XYZ position of the PD probe; a PD pressure sensor is connected between the PD electric clamp and the third six-dimensional adjustment component.

11. The high-precision coupling device for photon integrated sensing module according to claim 10, characterized in that: The backlight source assembly comprises a backlight source, a backlight source lifting cylinder and a backlight source bracket. The backlight source bracket is located on the base, and the backlight source lifting cylinder drives the backlight source to rise and fall relative to the backlight source bracket.

12. The high-precision coupling device for photon integrated sensing module according to claim 10, characterized in that: A tray support is provided on the Y-direction side of the PIC fixing frame, and the tray support is located below the PD electric clamp; the tray support is used to position and place the PD tray, and a plurality of holes for placing the PD are provided on the upper surface of the PD tray.

13. The high-precision coupling device for photon integrated sensing module according to claim 1, characterized in that: The side vision component also includes a side shooting Z-direction module that drives the side shooting camera to move along the Z direction, a side shooting X-direction module that drives the side shooting Z-direction module to move along the X direction, and a side shooting Y-direction module that drives the side shooting X-direction module to move along the Y direction relative to the base.

14. A coupling method using the high-precision coupling device according to any one of claims 1 to 13, characterized in that the steps include: S1. Loading: placing the PIC on the PIC fixing frame, the FA is clamped by the FA clamp, and the SLD is clamped by the SLD clamp; S2, leveling: under the monitoring of the side camera and the overhead camera, the SLD and the FA are respectively placed on both sides of the PIC in the X direction, the light entrance of the FA is aligned with the rear light exit of the PIC, and the light exit of the SLD is aligned with the light entrance of the PIC, the laser is translated, the laser is first irradiated on the boundary line between the SLD and the PIC, the reflected light is irradiated on the developing board to form two light spots, under the monitoring of the overhead camera, the posture of the SLD is adjusted until the two light spots are in close contact; the laser is translated again, the laser is irradiated on the boundary line between the FA and the PIC, the reflected light is irradiated on the developing board to form another two light spots, under the monitoring of the overhead camera, the posture of the FA is adjusted until the other two light spots are in close contact; S3, preliminary optical coupling: FA is connected to the optical power meter through the tail optical fiber, the SLD probe supplies power to the SLD, the optical power meter measures the received optical power in real time, the FA coupling unit and the SLD coupling unit start to micro-move through the software algorithm until the optical power received by the optical power meter is the maximum, at which time the optical path is the optimal optical path; S4, attaching FA: under the monitoring of the side camera and the overhead camera, glue the FA and attach it to the X side of the PIC, and fix the FA with UV after secondary optical coupling; S5, attaching SLD: under the monitoring of the side camera and the overhead camera, the SLD is glued and attached to the other side of the PIC in the X direction, and the SLD is fixed by UV after secondary optical coupling.

15. The coupling method according to claim 14, characterized in that The steps also include: S6, attaching PD: Under the monitoring of the side camera and the overhead camera, attach the PD to the upper part of the PIC. The specific steps are as follows: S61, PD optical coupling: The PD electric gripper takes out the PD from the hole, and uses the third automatic RX axis, the third automatic RY axis and the third automatic RZ axis to adjust the posture of the PD so that its lower surface is parallel to the upward surface of the PIC. Then the second probe automatic Z axis drives the PD probe to descend, thereby connecting the circuit on the PD, and then moves the PD so that its light inlet is aligned with the side light outlet of the PIC. After the SLD is lit, a part of the light will shine on the PD, and the PD will induce a small current, which will be transmitted to the internal measuring instrument of the equipment through the PD probe. The third automatic Y axis, the third automatic X axis and the third automatic Z axis are slightly moved through the algorithm until the current measured in real time is the largest, at which time the PD is in the optimal position; S62, bottom glue application: The PD electric gripper moves the PD to the Y-direction side of the PIC, the backlight source descends, and the bottom glue dispensing head applies the bottom glue on the lower surface of the PD from bottom to top, and then the PD returns to its optical coupling position; S63, PD secondary optical coupling: perform optical coupling on the adhesive-attached PD again according to step S61; S64, bottom glue light curing: Move the side UV lamp head to one side of the PD, and light it up to cure the bottom glue UV.

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