Substrate processing apparatus

Abstract

The invention relates to a substrate processing apparatus. The present invention suppresses an increase in size of a substrate processing apparatus due to increase in productivity. The substrate processing apparatus includes: a feed-in / feed-out module including a container placement portion on which a plurality of containers configured to be capable of accommodating substrates are placed; and a processing module which is provided adjacent to the feed / discharge module in the width direction and has a plurality of processing units for processing the substrate, and a handover module in which handover units for handover of the substrate are stacked is provided on the processing module side of the feed / discharge module for handover with the processing module. The feeding and discharging module further comprises a first conveying mechanism for conveying the substrate between the container carrying part and the transfer module, the processing module further comprises a second conveying mechanism for conveying the substrate between the transfer module and the processing unit, and the first conveying mechanism comprises a supporting part for supporting the substrate. The substrate supported by the support portion can pass through the transfer module in a depth direction intersecting with the width direction in a plan view.

Description

Technical Field

[0001] The present disclosure relates to a substrate processing apparatus. Background Art

[0002] The coating and developing device disclosed in Patent Document 1 forms a coating film including an anti-etching film on a substrate that is fed into a carrier module using a carrier, then develops the exposed substrate that is fed to an exposure device via an interface module and returned via the interface module and hands it over to a carrier module. The coating and developing device includes a processing module. The processing module includes a unit module for forming a coating film and a unit module for developing treatment that is stacked on the unit module for forming a coating film. Each unit module includes a liquid processing unit, a heating unit, a cooling unit, and a conveying component for conveying substrates between units. In addition, a conveying area for substrates that connect the carrier module and the interface module is formed in the unit module. The area adjacent to the carrier module in the conveying area is a handover area for the substrate. A rack unit with one or more handover stations is provided in the handover area.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2006-203075 Summary of the invention

[0006] Problem that the invention aims to solve

[0007] The technology disclosed in the present invention suppresses the increase in size of a substrate processing apparatus due to the improvement in productivity.

[0008] Solutions for solving problems

[0009] A technical solution disclosed herein is a substrate processing device, characterized in that the substrate processing device comprises: a feed-in and feed-out module, which has a container loading portion for loading a plurality of containers configured to accommodate substrates; and a processing module, which is arranged adjacent to the feed-in and feed-out module in a width direction and has a plurality of processing units for processing the substrates, a handover module is provided at a position close to the processing module side in the feed-in and feed-out module for handover with the processing module, the handover module is formed by stacking handover units for handover of the substrates, the feed-in and feed-out module further has a first conveying mechanism for conveying the substrate between the container loading portion and the handover module, the processing module further has a second conveying mechanism for conveying the substrate between the handover module and the processing unit, the first conveying mechanism has a supporting portion for supporting the substrate, and the first conveying mechanism is configured to enable the substrate supported by the supporting portion to pass through the handover module along a depth direction intersecting the width direction when viewed from above.

[0010] Effects of the Invention

[0011] According to the present disclosure, it is possible to suppress the increase in size of a substrate processing apparatus due to increased productivity. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is an explanatory diagram showing a schematic configuration of a coating and developing device as a substrate processing device according to the present embodiment.

[0013] Figure 2 Yes means Figure 1 An explanatory diagram of the schematic structure of the front side of the coating and developing device.

[0014] Figure 3 It is an explanatory diagram schematically showing the general structure of a processing module.

[0015] Figure 4 This is an explanatory diagram of the structure of the processing module side in the box module.

[0016] Figure 5 This is a diagram illustrating the dimensions of a box module.

[0017] Figure 6 This is a diagram illustrating the structure of an interface module.

[0018] Figure 7 It is an explanatory diagram of a modified example of the delivery module included in the cassette module.

[0019] Figure 8 This is an explanatory diagram of a specific example of the upper layer of the upper submodule of the processing module.

[0020] Fig. 9 This is an explanatory diagram of a specific example of the upper layer of the upper submodule of the processing module.

[0021] Fig.10 This is an explanatory diagram of a specific example of the upper layer of the upper submodule of the processing module.

[0022] Fig.11 This is an explanatory diagram of a specific example of the upper layer of the upper submodule of the processing module.

[0023] Fig.12 It is an explanatory diagram showing a schematic structure of a modified example 1 of the processing module.

[0024] Fig.13 Yes means Fig.12 An illustration of the schematic structure of the front side of the processing module.

[0025] Fig.14 It is an explanatory diagram schematically showing the general structure of the split module.

[0026] Fig.15 This is a diagram illustrating the structure of the intermediate module.

[0027] Fig.16 It is an explanatory diagram showing a schematic structure of a second variation of the processing module.

[0028] Fig.17 yes Fig.16 An illustration of the structure of an intermediate module of a processing module.

[0029] Fig.18 It is an explanatory diagram showing the schematic structure of a third variation of the processing module.

[0030] Fig.19 yes Fig.18 An illustration of the structure of a split module included in a processing module.

[0031] Description of Reference Numerals

[0032] 1, 1A, 1B, 1C, coating and developing device; 10, box module; 11, 11A, 11B, 11C, processing module; 20, box mounting table; 30, handover module; 31, handover unit; 40, first conveying mechanism; 41, fork; 70, second conveying mechanism; C, box; COT, resist film forming unit; DEV, developing unit; HT, heat treatment unit; W, wafer. DETAILED DESCRIPTION

[0033] In the photolithography process of the manufacturing process of semiconductor devices, etc., a predetermined process is performed to form a resist pattern on a substrate such as a semiconductor wafer (hereinafter referred to as a "wafer"). The predetermined process includes, for example, a resist coating process of coating a resist liquid on the substrate to form a resist film, an exposure process of exposing to a predetermined pattern, and a development process of developing the exposed resist film. The resist coating process and the development process of these processes are performed by a coating and developing device, which is a substrate processing device equipped with various processing units that perform various processes on the substrate, a conveying unit that conveys the substrate, and the like.

[0034] For substrate processing devices, high productivity is sought. In order to achieve high productivity, it is necessary to increase the number of processing units mounted on the substrate processing device. However, if the number of mountings is increased in this way, the device will become larger. Specifically, the footprint of the device will become larger.

[0035] Therefore, the technology disclosed in the present invention suppresses the increase in size of the substrate processing apparatus due to the improvement in productivity.

[0036] Hereinafter, the substrate processing apparatus of the present embodiment will be described with reference to the drawings. In addition, in this specification and the drawings, elements having substantially the same functional configuration are denoted by the same reference numerals, and repeated descriptions are omitted.

[0037] <Coating and developing device>

[0038] Figure 1 It is an explanatory diagram showing a schematic configuration of a coating and developing device as a substrate processing device according to the present embodiment. Figure 2 Yes means Figure 1 An explanatory diagram of the schematic structure of the front side of the coating and developing device. Figure 3 Schematically shows the schematic structure of the processing module described later. Figure 2 In the figure, the storage section 50 described later is omitted.

[0039] like Figure 1 and Figure 2 As shown, the coating and developing device 1 includes a box module 10 as a feeding and unloading module, a processing module 11, and an interface module 12 as other modules, and the coating and developing device is connected to an exposure device (not shown). The box module 10, the processing module 11, and the interface module 12 are arranged in this order along the width direction (Y direction in the figure) as one direction in the horizontal direction, and are connected as a whole. In addition, an exposure device is connected to the side of the interface module 12 opposite to the processing module 11. In addition, the exposure device performs exposure processing on the wafer W.

[0040] A cassette C, which is a container capable of accommodating wafers W, is carried in and out of the cassette module 10 .

[0041] The cartridge module 10 has a cartridge mounting table 20 as a container mounting portion for mounting a plurality of cartridges C. In the cartridge module 10, the cartridge mounting table 20 is provided, for example, at an end portion on one side in the width direction (the negative side in the Y direction in the figure), that is, at an end portion on the side opposite to the processing module 11 side in the width direction.

[0042] The cartridge C is placed in a plurality in a row in the depth direction (X direction in the figure) on the cartridge placement table 20. Specifically, a plurality (e.g., four) placement plates 21 are arranged in a row in the depth direction on the cartridge placement table 20, and the cartridge C can be placed on each placement plate 21 when the cartridge C is carried in and out of the coating and developing device 1. The depth direction is a direction intersecting the width direction (Y direction in the figure) when viewed from above, and specifically, a direction orthogonal to the width direction when viewed from above.

[0043] The loading plate 21 includes a lifting plate (not shown). The lifting plate lifts and lowers a plurality of wafers W in the box C loaded on the loading plate 21 together, and moves in the box loading table 20, so that the wafers W can be transferred to and from the first conveying mechanism 40 described later. The lifting plate is lifted and lowered between a first position on the upper side and a second position on the lower side, for example, by a lifting mechanism (not shown). The first position is a position where the wafer W on the lifting plate is located in the box C, and the second position is a position where the wafer W is transferred between the lifting plate and the first conveying mechanism 40.

[0044] In addition, depending on the diameter of the wafer W, the wafer W may be transferred between the cassette C and the first transport mechanism 40 by means of the above-mentioned lifting plate. This is determined by the specifications.

[0045] In addition, the box module 10 has a handover module 30. The handover module 30 is formed by stacking handover units 31 for handing over wafers W. In the box module 10, the handover module 30 is provided on the side of the processing module 11 in the width direction (the positive side in the Y direction in the figure) and is used for handover with the processing module 11. Specifically, the handover module 30 is provided in a portion of the box module 10 adjacent to the second conveying space K2 of the processing module 11 described later in the width direction (the Y direction in the figure).

[0046] Furthermore, the cassette module 10 includes a first conveying mechanism 40 for conveying the wafer W between the cassette stage 20 and the delivery module 30. The first conveying mechanism 40 includes a fork 41 as a support portion for supporting the wafer W. The fork 41 is configured to be movable in a vertical direction (Z direction in the figure), a direction around a vertical axis, a depth direction (X direction in the figure), and a width direction (Y direction in the figure).

[0047] And, in Figure 1 As shown by the thick black arrow in FIG. 8 , the first transport mechanism 40 is configured to allow the wafer W supported by the fork 41 to pass through the delivery module 30 in the depth direction (X direction in the figure) in a plan view.

[0048] In addition, as described later, the box module 10 has a storage portion 50. Also, as described later, a first air supply unit 60 (see Figure 4 ).

[0049] The detailed structure of the box module 10 will be described later.

[0050] The process module 11 includes a plurality of various process units that perform predetermined processes such as development processing, and is provided adjacent to the cartridge module 10 in the width direction (Y direction in the figure).

[0051] Furthermore, the processing module 11 further includes a second transport mechanism 70 .

[0052] The second conveying mechanism 70 conveys the wafer W between the delivery module 30 and the processing unit in the processing module 11. The second conveying mechanism 70 may also convey the wafer W between the processing units in the processing module 11. In addition, in this example, the second conveying mechanism 70 also conveys the wafer W between the processing unit in the processing module 11 and the delivery module 110 of the interface module 12 described later.

[0053] The second transport mechanism 70 transfers the wafer W to and from the transfer module 30 in the width direction (the Y direction in the figure).

[0054] For example, in processing module 11, Figure 3 As shown, the submodules BL each provided with the second conveying mechanism 70 are stacked in the vertical direction. In the example of the figure, two submodules BL are stacked in the vertical direction. Hereinafter, the upper submodule BL is sometimes referred to as the upper submodule BL1, and the lower submodule BL is sometimes referred to as the lower submodule BL2.

[0055] A second conveying space K2 in which the second conveying mechanism 70 is provided is formed at the center of each submodule BL in the depth direction (X direction in the figure) so as to extend in the width direction (Y direction in the figure) in a plan view.

[0056] In addition, in each sub-module BL, multiple processing units are provided in the space near the front side (negative side of the X direction in the figure) and the space on the inner side (positive side of the X direction in the figure) of the second conveying space K2, respectively along the vertical direction (Z direction in the figure) and the width direction (Y direction in the figure).

[0057] The front side (the negative side in the X direction in the figure) of the second conveying space K2 in the upper submodule BL1 is divided into an upper layer BL11 and a lower layer BL12. Figure 2 As shown, a plurality of (two in the example of the drawing) developing units DEV are provided in the layers BL11 and BL12 along the width direction (the Y direction in the drawing).

[0058] The developing unit DEV performs a developing process on the exposed wafer W to develop the resist film on the wafer W and form a resist pattern. Each developing unit DEV includes: a rotating holding disk 81 that holds the wafer W and rotates it; and a cup 82 that surrounds the wafer W on the rotating holding disk 81 and recovers the processing liquid that is scattered from the wafer W. Figure 1 As shown, there is provided a nozzle 83 for ejecting a developer as a processing liquid toward the wafer W held on the rotating holding plate 81. The nozzle 83 is provided, for example, one each in the layers BL11 and BL12, and is shared between the developing units DEV in the same layer.

[0059] like Figure 2As shown in the figure, the front side of the second conveying space K2 in the lower submodule BL2 is also divided into an upper layer BL21 and a lower layer BL22, similar to the upper submodule BL1. However, in the lower submodule BL2, a plurality of (two in the example of the figure) anti-etching film forming units COT are provided in the layers BL21 and BL22 respectively along the width direction (Y direction in the figure).

[0060] The resist film forming unit COT performs resist film forming processing on the wafer W to form a resist film on the wafer W. Each resist film forming unit COT has a rotating holding disk 81 and a cup 82, similar to the developing unit DEV. In addition, a nozzle 83 is provided that is shared between the resist film forming units COT of the same layer. In addition, a resist liquid for resist film formation is ejected from the nozzle 83 for the resist film forming unit COT as a processing liquid.

[0061] like Figure 1 and Figure 3 As shown, in the upper part of the inner side (positive side in the X direction in the figure) of the second conveying space K2 in each submodule BL, the heat treatment unit HT is provided with a plurality of (in the upper part) along the vertical direction (the Z direction in the figure) Figure 3 In the example, there are four (four), and there are also multiple (in the width direction (Y direction in the figure) Figure 1 Each heat treatment unit HT performs, for example, a heating process on the wafer W. Each heat treatment unit HT may perform both a heating process and a cooling process on the wafer W.

[0062] In addition, a storage section 90 is provided at the back lower portion of the second conveying space K2 in each submodule BL. The storage section 90 stores electrical appliances for the heat treatment unit HT (for example, a driver for controlling the heat treatment unit HT).

[0063] Furthermore, in the process module 11, a utility unit U is provided below the lower submodule BL2. The utility unit U functions as, for example, a storage unit that stores components (resist liquid storage bottle, etc.) related to supply of resist liquid to the resist film forming unit COT.

[0064] Furthermore, in the processing module 11, the filter 102 of the second air supply unit 100 is provided for each submodule BL.

[0065] The second air supply unit 100 supplies clean air to the second transport space K2 from above. The second air supply unit 100 includes a fan unit 101 (see FIG. 1 ) in addition to a filter 102. Figure 6 ).

[0066] The fan unit 101 delivers gas to the filter 102. Specifically, for example, the fan unit 101 sucks gas into the fan unit 101 and delivers the sucked gas to the filter 102 via a pipe (not shown). The fan unit 101 is shared between the submodules BL. The configuration position of the fan unit 101 may also be on the interface module 12. That is, the fan unit 101 may also be overlapped on the interface module 12.

[0067] The filter 102 purifies the gas sent from the fan unit 101 , that is, filters out particles in the gas, and blows out the purified gas (clean gas) toward the second transfer space K2 below.

[0068] The filter 102 is provided above the corresponding second conveying space K2.

[0069] In this manner, a portion of the second air supply unit 100 (specifically, the fan unit 101 ) overlaps the interface module 12 .

[0070] The interface module 12 is provided between the processing module 11 and an exposure device (not shown) and transfers the wafer W therebetween.

[0071] like Figure 1 and Figure 2 As shown, the interface module 12 has a handover module 110. The handover module 110 is stacked by handover units 111 for handing over wafers W. In the interface module 12, the handover module 110 is arranged on the side of the processing module 11 in the width direction (the negative side of the Y direction in the figure) and is used for handing over the wafer W between the processing module 11. Specifically, the handover module 110 is arranged at a position in the interface module 12 adjacent to the second conveying space K2 of the processing module 11 in the width direction (the Y direction in the figure).

[0072] In addition, the interface module 12 has a third conveying mechanism 120 for conveying the wafer W between the delivery module 110 and the exposure device. The third conveying mechanism 120 has a fork 121 for supporting the wafer W. The fork 121 is configured to be movable in the vertical direction (Z direction in the figure), the direction around the vertical axis, the depth direction (X direction in the figure), and the width direction (Y direction in the figure).

[0073] Furthermore, as will be described later, a third air supply unit 130 is provided with respect to the interface module 12 .

[0074] The detailed structure of the interface module 12 will be described later.

[0075] In addition, the coating and developing device 1 has a control unit 200, which controls the parts constituting the coating and developing device 1 including the control of the first to third conveying mechanisms 40, 70, and 120. The control unit 200 is, for example, a computer having a processor such as a CPU and a memory, and has a program storage unit (not shown). The program storage unit stores a program including instructions for controlling the processing of the coating and developing device 1. In addition, the above-mentioned program can also be recorded in a storage medium H that can be read by a computer, and loaded into the control unit 200 from the storage medium H. The storage medium H can also be temporary or non-temporary.

[0076] The control section 200 may be accommodated in a storage section 51 or a storage section 52 of the cartridge module 10 , which will be described later.

[0077] <Box module 10>

[0078] Next, refer to Figure 1 and Figure 2 and use Figure 4 and Figure 5 A more detailed structure of the cartridge module 10 will be described. Figure 4 It is an explanatory diagram of the structure of the process module 11 side in the cartridge module 10. Figure 5 It is an explanatory diagram of the dimensions of the box module 10 .

[0079] As described above, the cartridge module 10 includes the first transport mechanism 40 .

[0080] like Figure 4 As shown, the first transport mechanism 40 includes a first guide portion 42 and a second guide portion 43 in addition to the fork 41 .

[0081] The first guide 42 guides the fork 41 to move in the vertical direction (Z direction in the figure). Specifically, the first guide 42 moves the lifting body 44 along the first guide 42, for example. The fork 41 is supported on the lifting body 44 by a rotating body 45. The rotating body 45 rotates on the lifting body 44. The fork 41 moves forward and backward horizontally relative to the rotating body 45.

[0082] The second guide portion 43 guides the movement of the first guide portion 42 in the depth direction (the X direction in the figure). Specifically, the second guide portion 43 guides the movement of the first guide portion 42 as follows. Figure 1 and Figure 2 As shown, the second guide portion 43 guides the first guide portion 42 to move in the depth direction in a region adjacent to the cassette mounting table 20 in the width direction (Y direction in the figure) in a plan view in the first transport space K1 where the first transport mechanism 40 is provided.

[0083] In the cassette module 10 , the following condition (A) is satisfied with respect to the width direction (Y direction in the drawing).

[0084] (A) Figure 5 As shown, the size (width) W1 of the gap h1 between the cassette mounting table 20 and the delivery module 30 is larger than the length (width) W2 of the first guide portion 42 and smaller than the length (width) of the fork 41 .

[0085] In addition, the "length of the fork 41" in the condition (A) refers to the size of the fork 41 in the width direction (Y direction in the figure) when moving in the depth direction (X direction in the figure).

[0086] As described above, in the cassette module 10, the first conveying mechanism 40 is configured to allow the wafer W supported by the fork 41 to pass through the delivery module 30 in the depth direction (X direction in the figure) when viewed from above. When passing through in this way, since the cassette module 10 satisfies the above condition (A), the first guide portion 42 can pass through the above gap h1.

[0087] When the condition (A) is satisfied, when the fork 41 moves in the depth direction (X direction in the figure), the first guide 42 can pass through the gap h1 , but the wafer W supported by the fork 41 cannot pass through the gap h1 .

[0088] Furthermore, the first transport mechanism 40 transfers the wafer W to and from the cassette mounting table 20 from the processing module 11 side in the width direction (Y direction in the figure).

[0089] On the other hand, the first conveying mechanism 40 only delivers the wafer W to the delivery module 30 in the depth direction (the X direction in the figure) (i.e., conveys the wafer W relative to the delivery module 30), but not in the width direction (the Y direction in the figure). Figure 1 As shown by the hollow dashed arrow, the first conveying mechanism 40 only transfers the wafer W to the transfer module 30 from the inner side (positive side in the X direction in the figure), but not from the width direction (Y direction in the figure) and the front side (negative side in the X direction in the figure).

[0090] Furthermore, in the cassette module 10 , a delivery module 30 is provided in the first conveyance space K1 .

[0091] In the first conveying space K1, the delivery module 30 is configured to be able to deliver the wafer W between the second conveying mechanisms 70 of all the sub-modules BL included in the processing module 11. Specifically, for example, Figure 2 As shown, the delivery module 30 is provided to be continuous in the vertical direction (X direction in the figure), and overlaps with both the upper submodule BL1 and the lower submodule BL2 when viewed in the width direction (Y direction in the figure).

[0092] The height of the upper end of the delivery module 30 is substantially equal to the height of the top surface of the housing 10a of the cassette module 10 that defines the first transport space K1. That is, the delivery module 30 is provided with almost no gap between it and the top surface of the housing 10a.

[0093] The height of the lower end of the delivery module 30 is such that the wafer W can be delivered between the second transport mechanism 70 of the lower submodule BL2 and the delivery module 30 , and is, for example, substantially the same as the height of the lower end of the layer BL21 .

[0094] like Figure 4 As shown, the portion of the first conveying space K1 divided by the housing 10a that is closer to the front side (the negative side in the X direction in the figure) than the delivery module 30 is filled with a storage section 50 for storing various electrical appliances. Figure 1 and Figure 4 As shown, the portion of the first conveying space K1 that is closer to the front side than the delivery module 30 and is on the processing module 11 side (positive side in the Y direction in the figure) and the upper side is filled with the storage section 50. The storage section 50 exists in the substantially same range as the delivery module 30 in the vertical direction (Z direction in the figure). That is, the height of the upper end and the lower end of the storage section 50 is substantially consistent with that of the delivery module 30.

[0095] Furthermore, a first air supply unit 60 is provided with respect to the box module 10 .

[0096] The first air supply unit 60 supplies clean gas from above to the first transfer space K1 . The first air supply unit 60 includes a fan unit 61 and a filter 62 .

[0097] The fan unit 61 sends the gas toward the filter 62. Specifically, for example, the fan unit 61 sucks the gas into the fan unit 61 and sends the sucked gas toward the filter 62.

[0098] The filter 62 purifies the gas sent from the fan unit 61 , that is, filters out particles in the gas, and blows out the purified gas (clean gas) toward the first transfer space K1 below.

[0099] For example, the first air supply unit 60 supplies clean air only to a portion of the first transfer space K1 that is not filled with the storage section 50 and is located further back than the delivery module 30 (positive side in the X direction in the drawing).

[0100] Specifically, the filter 62 is provided only above a portion of the first conveying space K1 that is further back than the delivery module 30 .

[0101] In addition, the exhaust from the bottom side of the box module 10 may be performed from both sides, the front side and the back side (the positive side and the negative side in the X direction in the figure), so that the clean gas supplied from the first air supply unit 60 to the first conveying space K1 also flows below the storage section 50 through which the wafer W passes. That is, exhaust ports (not shown) for exhausting air from the first conveying space K1 may be provided on the front side and the back side of the bottom of the box module 10.

[0102] In addition, storage sections 51 and 52 for storing various electrical appliances may also be provided on the upper part of the box module 10. However, the height of the upper ends of the storage sections 51 and 52 is set to be lower than the height of the upper end of the processing module 11. For example, the storage section 51 is provided above the filter 62, and the storage section 52 is provided so as to straddle the upper part of the delivery module 30 and the upper part of the storage section 50.

[0103] In addition, the fan unit 61 of the first air supply unit 60 may also be provided at a position higher than the first conveying space K1 and at a position closer to the inside (positive side in the X direction in the figure) than the first conveying space K1. In this case, the lower part of the fan unit 61 may also serve as a storage section 53 for storing various electrical appliances. The storage section 53 may also extend to a region overlapping with the box mounting table 20 when viewed from above.

[0104] <Interface module 12>

[0105] Next, refer to Figure 2 and use Figure 6 A more detailed structure of the interface module 12 will be described. Figure 6 It is an explanatory diagram of the structure of the interface module 12.

[0106] As described above, the interface module 12 includes the third transport mechanism 120 .

[0107] The third conveying mechanism 120 is configured, for example, so that the fork 121 is only on the front side ( Figure 6 The fork 121 moves in a space (on the negative side of the X direction, etc.), and the wafer W is transferred to and from the transfer module 110 only from the near front side.

[0108] Furthermore, in the interface module 12 , the delivery module 110 is provided in the third transport space K3 where the third transport mechanism 120 is provided.

[0109] In the third conveying space K3, the delivery module 110 is configured to be able to deliver the wafer W between the second conveying mechanisms 70 of all the sub-modules BL included in the processing module 11. Specifically, for example, Figure 2 As shown, the interface module 110 is continuous in the vertical direction (Z direction in the figure), and overlaps with both the upper submodule BL1 and the lower submodule BL2 when viewed in the width direction (Y direction in the figure).

[0110] For example, Figure 6 As shown, the delivery module 110 is provided with a gap between it and the top surface of the housing 12 a of the interface module 12 that partitions the third transport space K3 .

[0111] A storage section 140 for storing various electrical appliances is provided at the back side (positive side in the X direction in the figure) and the upper end of the third conveying space K3 . The storage section 140 is provided at a distance from the delivery module 110 .

[0112] In addition, the depth (length in the X direction in the figure) of the housing 12a that divides the third conveying space K3 is smaller than the depth of the processing module 11. Therefore, the front side (negative side in the X direction in the figure) end of the housing 12a and the processing module 11 are roughly consistent, but the back side (positive side in the X direction in the figure) end is inconsistent, and the back side end of the processing module 11 is located on the back side.

[0113] Furthermore, a third air supply unit 130 is provided with respect to the interface module 12 .

[0114] The third air supply unit 130 supplies clean air to the third transport space K3 from above. The third air supply unit 130 includes a fan unit 131 and a filter 132 .

[0115] The fan unit 131 delivers the gas toward the filter 132. Specifically, for example, the fan unit 131 sucks the gas into the fan unit 131, and delivers the sucked gas to the filter 132 via the duct 133.

[0116] The filter 132 purifies the gas sent from the fan unit 131 , that is, filters out particles in the gas, and blows out the purified gas (clean gas) toward the third transfer space K3 below.

[0117] The third air supply unit 130 supplies the clean gas to the following portion in the third transfer space K3 , for example.

[0118] The space where the wafer W passes through is closer to the front side (negative side in the X direction in the figure) than the delivery module 110

[0119] The space overlapping with the handover module 110 when viewed from above

[0120] The space between the transfer module 110 and the storage unit 140

[0121] Specifically, the filter 132 is provided from the front side (the negative side in the X direction in the figure) end of the housing 12 a to a portion between the interface module 110 and the storage portion 140 .

[0122] In addition, the fan unit 131 of the third air supply unit 130 may also be arranged at a position further back than the housing 12a (positive side in the X direction in the figure). However, in this case, the fan unit 131 is arranged such that its back end is not further back than the back end of the processing module 11.

[0123] As described above, the fan unit 101 of the second air supply unit 100 used in the processing module 11 may also be overlapped on the interface module 12. Specifically, the fan unit 101 may also be overlapped on the filter 132. However, the height of the upper end of the fan unit 101 is set to be lower than the height of the upper end of the processing module 11. By providing the fan unit 101 in this way, the overall height of the coating and developing device 1 can be suppressed.

[0124] In addition, the storage parts 141 and 142 may be respectively provided above the part closer to the front side (negative side in the X direction in the figure) and the part closer to the inner side (positive side in the X direction in the figure) than the fan unit 101 in the interface module 12. However, the height of the upper end of the storage parts 141 and 142 is set to be lower than the height of the upper end of the processing module 11. For example, the storage parts 141 and 142 store items that were previously mounted on the upper side of the processing module 11 (for example, electrical appliances for the resist film forming unit COT and electrical appliances for the second conveying mechanism 70). By providing the storage parts 141 and 142 in this way, the overall height of the coating and developing device 1 can also be suppressed.

[0125] <Example of Processing by Coating and Developing Device 1>

[0126] Next, an example of the processing of the coating and developing apparatus 1 will be described. In addition, each of the following steps is executed under the control of the control unit 200 based on the program stored in the program storage unit (not shown).

[0127] (Step S1)

[0128] First, the wafer W is loaded into the delivery module 30 of the coating and developing apparatus 1 .

[0129] Specifically, for example, first, on the front side ( Figure 4 When the lifting plate (not shown) of the mounting plate 21 (on the negative side in the X direction, etc.) is moved to the second position, the wafer W on the lifting plate is delivered to the fork 41 of the first transport mechanism 40.

[0130] Next, the wafer W supported by the fork 41 is oriented toward the back side ( Figure 4 The transfer module 30 moves on the positive side of the X direction (eg, the positive side of the X direction).

[0131] Specifically, the first guide 42 moves toward the back side along the depth direction, and the wafer W supported by the fork 41 passes under the delivery module 30 and moves to a position further back than the delivery module 30 .

[0132] In one embodiment, the height of the wafer W when it is delivered from the lifting plate of the mounting plate 21 to the fork 41 is substantially equal to the height of the wafer W when it passes through the delivery module 30 in a plan view.

[0133] Then, the wafer W supported by the fork 41 is transferred from the back side ( Figure 4 The positive side in the X direction (such as the positive side in the X direction) is connected to the connection module 30.

[0134] Specifically, the fork 41 enters the delivery unit 31 corresponding to the lower submodule BL2 in the delivery module 30 from the inner side, and delivers the wafer W from the fork 41 to the delivery unit 31 .

[0135] (Step S2)

[0136] Next, a resist coating process is performed on the wafer W, and a resist film is formed on the wafer W.

[0137] Specifically, for example, the second conveying mechanism 70 is used to convey the wafer W from the transfer unit 31 corresponding to the lower sub-module BL2 in the transfer module 30 to the anti-etching film forming unit COT of the lower sub-module BL2, and then the anti-etching liquid is rotationally coated on the surface of the wafer W to form an anti-etching film in a manner that covers the surface of the wafer W.

[0138] (Step S3)

[0139] Next, the wafer W is subjected to a pre-exposure bake (PAB: Pre-Applied Bake) process.

[0140] Specifically, the second transport mechanism 70 transports the wafer W to the heat treatment unit HT for PAB treatment, and performs PAB treatment on the wafer W. Thereafter, the wafer W is transported to the delivery unit 111 corresponding to the lower submodule BL2 in the delivery module 110 of the interface module 12 .

[0141] (Step S4)

[0142] Next, the wafer W is subjected to an exposure process.

[0143] Specifically, for example, the wafer W is transported from the delivery unit 111 corresponding to the lower submodule BL2 in the delivery module 110 to the exposure device by the third delivery mechanism 120, so that the resist film on the wafer W is exposed to a predetermined pattern. After that, the wafer W is transported to the delivery unit 111 corresponding to the upper submodule BL1 in the delivery module 110 by the third delivery mechanism 120.

[0144] (Step S5)

[0145] Next, the wafer W is subjected to a PEB (Post Exposure Bake) process.

[0146] Specifically, for example, the wafer W is transported from the delivery unit 111 corresponding to the upper submodule BL1 in the delivery module 110 to the thermal treatment unit HT for PEB treatment of the upper submodule BL1 by the second transport mechanism 70 , and the wafer W is subjected to PEB treatment.

[0147] (Step S6)

[0148] Next, the wafer W is subjected to a development process.

[0149] Specifically, for example, the wafer W is transported to the developing unit DEV by the second transport mechanism 70 , and the wafer W is subjected to a developing process using a developing solution.

[0150] (Step S7)

[0151] Next, the wafer W is subjected to a post-bake process.

[0152] Specifically, for example, the second conveying mechanism 70 conveys the wafer W to the heat treatment unit HT for post-bake treatment, and performs post-bake treatment on the wafer W. Thereafter, the second conveying mechanism 70 conveys the wafer W to the delivery unit 31 corresponding to the upper submodule BL1 in the delivery module 30 of the cassette module 10 .

[0153] (Step S8)

[0154] Then, the wafer W is carried out from the coating and developing device 1 .

[0155] Specifically, the wafer W is returned to the front side (ie, the side facing the left side) of the cassette mounting table 20 located at the second position in the reverse order of step S1. Figure 4 On a lifting plate (not shown) of the mounting plate 21 (on the negative side in the X direction, etc.).

[0156] At this point, the process of the coating and developing device 1 is completed.

[0157] <Main Effects of the Present Embodiment>

[0158] As described above, in the coating and developing apparatus 1, the box module 10 includes the delivery module 30 formed by stacking the delivery units 31 for delivering the wafer W between the box module 10 and the processing module 11. Therefore, compared with the case where the processing module 11 includes the delivery module 30, the number of processing units mounted on the processing module 11 can be increased without changing the floor space of the processing module 11, thereby improving productivity.

[0159] In the coating and developing device 1, the cassette module 10 includes a first conveying mechanism 40 for conveying the wafer W between the cassette mounting table 20 and the delivery module 30. The first conveying mechanism 40 includes a fork 41 and is configured to allow the wafer W supported by the fork 41 to be conveyed in the depth direction ( Figure 4 Therefore, compared with a case where the wafer W supported by the fork 41 passes through the region that does not overlap with the delivery module 30 when viewed from above when moving in the depth direction, the following effects are achieved. That is, it is possible to suppress an increase in the footprint of the cassette module 10 caused by providing the delivery module 30 in the cassette module 10.

[0160] Therefore, according to the present embodiment, it is possible to suppress the increase in size of the device due to the increase in productivity. That is, according to the present embodiment, it is possible to increase the number of processing units mounted without significantly increasing the size of the device, thereby achieving an increase in productivity.

[0161] In addition, in the present embodiment, the first conveying mechanism 40 only conveys Figure 4 The wafer W is transferred to and from the transfer module 30 in the X direction, rather than in the width direction ( Figure 4 Therefore, in the width direction, the size of the portion that does not overlap with the box mounting table 20 when viewed from above can be reduced as much as possible. Specifically, in the width direction, the gap h1 between the box mounting table 20 and the delivery module 30 can be reduced as much as possible. Therefore, according to this embodiment, the enlargement of the device can be suppressed.

[0162] Furthermore, in this embodiment, the first conveying mechanism 40 only conveys Figure 4 The wafer W is transferred to and from the transfer module 30 (on the positive side in the X direction, etc.), but not from the width direction ( Figure 4 Y direction) and near front side ( Figure 4 On this basis, the first air supply unit 60 supplies clean gas only to the portion of the first conveying space K1 that is not filled by the storage unit 50 and is closer to the inner side than the delivery module 30. Therefore, the size of the first air supply unit 60 can be suppressed, and the gas can be suppressed from stagnating in the first conveying space K1.

[0163] In this embodiment, the fan unit 101 of the second air supply unit 100 for the process module 11 is provided on the interface module 12 whose upper end is lower than the upper end of the process module 11. Therefore, compared with the case where the fan unit 101 is provided on the process module 11, the height of the coating and developing device 1 can be suppressed.

[0164] <Specific example and modification of the height of the delivery module>

[0165] Figure 7 It is an explanatory diagram of a modified example of the delivery module included in the cassette module 10 .

[0166] In the above example, the delivery modules 30 of the box module 10 are continuous in the vertical direction and are connected in the width direction ( Figure 2 That is, the delivery module 30 includes a module 32 for the upper submodule BL1 and a module 33 for the lower submodule BL2, and these modules 32 and 33 are continuous in the vertical direction.

[0167] Instead, it is also possible to Figure 7 In this case, the wafer W supported by the fork 41 of the first conveying mechanism 40 passes through the above gap h2 when passing through the delivery module 30 in the depth direction in a plan view.

[0168] <Specific example of liquid treatment layer in treatment module>

[0169] Figure 8 This is an explanatory diagram of a specific example of the upper layer BL11 of the upper submodule BL1 of the processing module 11. In addition, the structures of the lower layer BL12 of the upper submodule BL1, the upper layer BL21 and the lower layer BL22 of the lower submodule BL2 are the same as the structure of the upper layer BL11 of the upper submodule BL1.

[0170] like Figure 8 As shown, the upper layer BL11 has an air flow creation unit 300. The air flow creation unit 300 generates an air flow from above to below the cup 82 in the processing space K11 where the rotating holding disk 81 and the cup 82 are provided.

[0171] The air flow forming unit 300 includes a fan filter unit (FFU) 301 as a fourth air supply unit for supplying clean gas from the upper side to the processing space K11.

[0172] The air flow forming unit 300 includes a straightening plate 302 in addition to the FFU 301 .

[0173] The rectifying plate 302 is provided between the cup 82 and the FFU 301 , and forms a downward airflow by the gas blown out from the FFU 301 .

[0174] The rectifying plate 302 has an opening 303 for each rotating holding disk 81, that is, for each cup 82. Each opening 303 is provided at a position facing the corresponding rotating holding disk 81, and forms an airflow toward the wafer W held on the corresponding rotating holding disk 81.

[0175] In addition, the rectifying plate 302 forms a stronger airflow in the region R1 surrounding the outer periphery of the corresponding opening 303 in a plan view than in the outer region R2 for each opening 303. Hereinafter, the regions R1 and R2 may be referred to as the strong airflow forming region R1 and the weak airflow forming region R2, respectively.

[0176] The rectifying plate 302 includes an ejection hole (not shown) through which the gas from the FFU 301 passes and is ejected downward. A plurality of ejection holes are formed in both the region opposite to the strong airflow forming region R1 and the region opposite to the weak airflow forming region R2 in the rectifying plate 302. The proportion of the ejection holes in the region opposite to the strong airflow forming region R1 of the rectifying plate 302, i.e., the first opening ratio, is lower than the proportion of the ejection holes in the region opposite to the weak airflow forming region R2, i.e., the second opening ratio. As a result, the flow rate of the airflow formed by the gas ejected from the ejection holes in the region opposite to the strong airflow forming region R1 is faster than the flow rate of the airflow formed by the gas ejected from the ejection holes in the region opposite to the weak airflow forming region R2. That is, a stronger airflow can be formed in the strong airflow forming region R1 than in the weak airflow forming region R2.

[0177] The strong airflow formed in the strong airflow forming region R1 functions as an air curtain. Therefore, it is possible to suppress the influence of the disturbance factors existing in the weak airflow forming region R2 from spreading to the area above the cup 82 which is inside the strong airflow forming region R1. Specifically, it is possible to suppress the particles in the weak airflow forming region R2 from being included in the airflow from the opening 303 to the bottom, that is, the airflow toward the wafer W.

[0178] like Fig. 9 As shown, an opening 311 may also be provided on the side wall 310 of the upper layer BL11 covering the side of the processing space K11. The opening 311 connects the space adjacent to the processing space K11 (e.g., the first conveying space K1 or the third conveying space K3) and the processing space K11. By providing such an opening 311, the gas in the processing space K11 can be discharged to the adjacent space.

[0179] The opening 311 is provided, for example, at the lower portion of the side wall 310, specifically, at a position of the side wall 310 below the upper end of the cup 82. Thus, when the gas in the adjacent space returns to the processing space K11 through the opening 311, particles contained in the gas can be prevented from reaching the cup 82.

[0180] In addition, the opening 311 may also be provided at the upper portion of the side wall 310. Specifically, it may also be provided at a position of the side wall 310 that is higher than the upper end of the cup 82. Thus, when the pressure in the processing space K11 suddenly rises or the airflow in the processing space K11 suddenly becomes stronger, the gas in the processing space K11 can be discharged to the adjacent space through the opening 311.

[0181] like Fig.10 As shown, a partition wall 320 may be provided in the width direction (Y direction in the figure) to separate the cups 82. Thus, the following mutual influence can be suppressed between a portion of the processing space K11 where one cup 82 is provided and a portion of the processing space K11 where another cup 82 is provided.

[0182] The airflow formed by the airflow forming unit 300 is a downflow.

[0183] · Exhaust from the outside of cup 82

[0184] In addition, the height range of the partition wall 320 is, for example, equal to the height range of the processing space K11 (the height range from the bottom wall 330 of the layer BL11 to the rectifying plate 302 when the rectifying plate 302 is provided). In this case, the partition wall 320 is formed with an opening 321 through which the nozzle 83 and the like pass when the nozzle 83 moves in the width direction (the Y direction in the figure).

[0185] like Fig.11 As shown, a rectifying member 340 may be provided between the cup 82 and the side wall 310A. The rectifying member 340 guides the gas from the FFU 301 toward the exhaust port 331 provided at the lower part of the processing space K11 and outside the cup 82 .

[0186] The exhaust port 331 is provided for each cup 82, for example, between the corresponding cup 82 and the side wall 310. Alternatively, at least the lower end of the rectifying member 340 may be located between the cup 82 and the exhaust port 331, and the rest of the rectifying member 340 may be located between the exhaust port 331 and the side wall 310.

[0187] Furthermore, the height of the upper end of the partition wall 320A separating the cups 82 may be lower than the height of the upper end of the cup 82. In this case, an exhaust port 332 for exhausting the processing space K11 from the outside of the cup 82 may be provided between the partition wall 320A and the cup 82 for each cup 82. Thus, it is easy to control the pressure and airflow separately between the portion of the processing space K11 where one cup 82 is provided and the portion of the processing space K11 where another cup 82 is provided.

[0188] In the example shown in the drawings, the exhaust ports 331 and 332 are provided in the bottom wall 330. However, the exhaust ports 331 and 332 may be provided outside the cup 82 and at a portion other than the bottom wall 330 that is lower than the upper end of the cup 82.

[0189] <Variation 1 of Processing Module>

[0190] Fig.12It is an explanatory diagram showing a schematic structure of a modified example 1 of the processing module. Fig.13 Yes means Fig.12 An illustration of the schematic structure of the front side of the processing module. Fig.14 It is an explanatory diagram schematically showing the general structure of a split module described later. Fig.15 This is an explanatory diagram of the structure of an intermediate module to be described later.

[0191] Fig.12 and Fig.13 The coating and developing device 1A and Figure 1 The coating and developing apparatus 1 shown in FIG. 1A and FIG. 2A is different in the structure of the process module. Specifically, the process module 11A of the coating and developing apparatus 1A is divided into a plurality of divided modules DBL along the width direction (the Y direction in the figure). Fig.12 In the example of FIG. 1 , the processing module 11A is divided into two divided modules DBL, and an intermediate module CBL is provided between the two adjacent divided modules DBL. Hereinafter, the divided module DBL on the negative side in the width direction (the left side in the figure) is sometimes referred to as the left divided module DBL1, and the divided module DBL on the positive side in the width direction (the right side in the figure) is sometimes referred to as the right divided module DBL2.

[0192] The segmentation module DBL is used separately Figure 1 The processing module 11 described above is configured similarly.

[0193] Hereinafter, the division module DBL and the intermediate module CBL will be described. Regarding the division module DBL, the description will focus on the differences from the processing module 11 .

[0194] like Fig.14 As shown, in the left dividing module DBL1 among the dividing modules DBL, an upper submodule BL1A and a lower submodule BL2 are stacked in this order from the top, and a reciprocating layer BL3 is provided between the upper submodule BL1A and the lower submodule BL2.

[0195] Similar to the upper submodule BL1 of the processing module 11, the upper submodule BL1A and the lower submodule BL2 of the left partition module DBL1 are respectively provided with a second conveying mechanism 70. However, the second conveying mechanism 70 provided in the left partition module DBL1 not only conveys the wafer W between the handover module 30 and the processing unit in the left partition module DBL1 and between the processing units in the left partition module DBL1, but also conveys the wafer W between the processing unit in the left partition module DBL1 and the handover module 170 described later of the intermediate module CBL.

[0196] In addition, in the left-side division module DBL1, the front side (the negative side in the X direction in the figure) of the second conveying space K2 in the upper submodule BL1A is different from the above-mentioned processing module 11, and is divided into an upper layer BL21 and a lower layer BL22 provided with the anti-etching film forming unit COT, similarly to the lower submodule BL2. That is, in the left-side division module DBL1, four layers provided with the anti-etching film forming unit COT are stacked.

[0197] The other structures of the upper submodule BL1A and the lower submodule BL2 of the left division module DBL1 are respectively the same as those of the upper submodule BL1 and the lower submodule BL2 of the processing module 11 described above.

[0198] A reciprocating conveying mechanism 150 is provided in the reciprocating layer BL3. The reciprocating conveying mechanism 150 conveys the wafer W linearly only in the width direction (the Y direction in the figure). In this example, the reciprocating conveying mechanism 150 conveys the wafer W linearly in the width direction (the Y direction in the figure) between the delivery module 30 of the box module 10 and the delivery module 170 of the intermediate module BLC. That is, the reciprocating conveying mechanism 150 conveys the wafer W linearly in the width direction between the delivery modules. Therefore, the reciprocating conveying mechanism 150 does not convey the wafer W to the processing unit in the processing module 11.

[0199] The linear wafer W transport path of the reciprocating transport mechanism 150 does not overlap with the processing units in the left dividing module DBL1 in a plan view, but overlaps with the second transport space K2 where the second transport mechanism 70 is provided.

[0200] On the other hand, Fig.13 As shown, in the right split module DBL2, the upper submodule BL1 and the lower submodule BL2A ​​are stacked in this order from the top. In addition, although not shown in the figure, in the right split module DBL2, similarly to the left split module DBL1, a reciprocating layer BL3 is provided between the upper submodule BL1 and the lower submodule BL2A.

[0201] The upper submodule BL1 and the lower submodule BL2A ​​of the right dividing module DBL2 are provided with a conveying mechanism 160 (see Fig.12 ). Like the second conveying mechanism 70 provided in the left segmentation module DBL1, the conveying mechanism 160 conveys the wafer W to the processing unit in the right segmentation module DBL2. Specifically, the conveying mechanism 160 conveys the wafer W between the handover module 170 of the intermediate module CBL and the processing unit in the right segmentation module DBL2, between the processing units in the right segmentation module DBL2, and between the processing unit in the right segmentation module DBL2 and the handover module 110 of the interface module 12A described later.

[0202] In addition, in the right dividing module DBL2, the front side (the negative side in the X direction in the figure) of the second conveying space K2 in the lower submodule BL2A ​​is different from the above-mentioned processing module 11, and is divided into an upper layer BL11 and a lower layer BL12 provided with a developing unit DEV, similarly to the upper submodule BL1. That is, in the right dividing module DBL2, four layers provided with a developing unit DEV are stacked.

[0203] The other structures of the upper submodule BL1 and the lower submodule BL2A ​​of the right division module DBL2 are respectively the same as the upper submodule BL1 and the lower submodule BL2 of the above-mentioned processing module 11 .

[0204] The reciprocating layer BL3 of the right dividing module DBL2 is also provided with a reciprocating conveying mechanism 150. However, the reciprocating conveying mechanism 150 of the right dividing module DBL2 linearly conveys the wafer W in the width direction (Y direction in the figure) between the delivery module 170 of the intermediate module BLC and the delivery module 110 of the interface module 12A.

[0205] In the reciprocating layer BL3 of the right dividing module DBL2 , the reciprocating transport mechanism 150 transports the wafer W linearly so that the wafer W does not pass through the area overlapping with the processing units in the right dividing module DBL2 in a plan view but passes through the transport space K4 provided with the transport mechanism 160 .

[0206] like Fig.12 As shown, the intermediate module CBL is disposed between two dividing modules DBL arranged along the width direction, and the wafer W is relayed between them.

[0207] like Fig.15 As shown, the intermediate module CBL has a delivery module 170. The delivery module 170 is composed of stacked delivery units 171 for delivering wafers W. In the intermediate module CBL, the delivery module 170 is provided at a position sandwiched between the second conveying space K2 of the left dividing module DBL1 and the conveying space K4 of the right dividing module DBL2.

[0208] The handover units 171 included in the handover module 170 and the handover units 171 to which the reciprocating conveying mechanism 150 approaches can also be independently provided for the reciprocating conveying mechanism 150 of the left segmentation module DBL1 and the reciprocating conveying mechanism 150 of the right segmentation module DBL2. Thus, the conveyance of one reciprocating conveying mechanism 150 will not be hindered by the conveyance of another reciprocating conveying mechanism 150.

[0209] like Fig.12As shown, in the case of independent arrangement like this, the interface unit 171a for the reciprocating conveying mechanism 150 of the left segmentation module DBL1 and the interface unit 171b for the reciprocating conveying mechanism 150 of the right segmentation module DBL2 can also be arranged in the same layer along the width direction (Y direction in the figure). Thus, the reciprocating layer BL3 can be set to the same height in the left segmentation module DBL1 and the right segmentation module DBL2, so the device height when the reciprocating layer BL3 is set can be suppressed.

[0210] In addition, similarly, in the handover module 170, for layers other than the layer where the handover unit 171 for the reciprocating conveying mechanism 150 is provided, the handover unit 171 can also be independently provided for the left dividing module DBL1 and the right dividing module DBL2 and arranged along the width direction (Y direction in the figure).

[0211] Furthermore, the intermediate module CBL has a conveying mechanism 180 for conveying the wafer W between the delivery unit 171 for the reciprocating conveying mechanism 150 of the delivery module 170 and other delivery units 171. The conveying mechanism 180 has a fork 181 for supporting the wafer W. The fork 181 is configured to be movable in the vertical direction (Z direction in the figure), the direction around the vertical axis, the depth direction (X direction in the figure), and the width direction (Y direction in the figure).

[0212] In the intermediate module CBL, the above-mentioned delivery module 170 is provided in the conveying space K5 provided with the conveying mechanism 180. The delivery module 170 is provided with a gap between, for example, the top surface of the housing CBLa of the intermediate module CBL1 that partitions the conveying space K5.

[0213] A chemical unit CHE is provided on the front side (negative side in the X direction in the figure) of the conveying space K5. The chemical unit CHE houses a bottle storing a coating liquid (specifically, resist liquid) used in the resist film forming unit COT, a pump for pressurizing and conveying the coating liquid to the resist film forming unit COT, and the like.

[0214] In addition, the depth (length in the X direction in the figure) of the housing CBLa that divides the conveying space K5 is smaller than the depth of the dividing module DBL. Therefore, the front side (negative side in the X direction in the figure) ends of the housing CBLa and the dividing module DBL are roughly consistent, but the inner side (positive side in the X direction in the figure) ends are inconsistent, and the inner side end of the dividing module DBL is located on the inner side.

[0215] Furthermore, an air supply unit 190 is provided with respect to the intermediate module CBL.

[0216] The air supply unit 190 supplies clean air to the conveying space K5 from above. The air supply unit 190 includes a fan unit 191 and a filter 192 .

[0217] The fan unit 191 delivers the gas to the filter 192. Specifically, for example, the fan unit 191 sucks the gas into the fan unit 191 and delivers the sucked gas to the filter 192 via the pipe 193.

[0218] The filter 192 purifies the gas sent from the fan unit 191 , that is, filters out particles in the gas, and blows out the purified gas (clean gas) toward the downward transfer space K5 .

[0219] The air supply unit 190 supplies the clean gas to the following parts in the transport space K5, for example.

[0220] The space that the wafer W passes through is located on the inner side (positive side in the X direction in the figure) of the transfer module 170

[0221] · Space overlapping with the handover module 170 when viewed from above

[0222] The fan unit 191 of the air supply unit 190 may also be disposed at a position further back (positive side in the X direction in the figure) than the housing CBLa. However, in this case, the fan unit 191 is configured such that its back end is not located further back than the back end of the division module DBL.

[0223] The fan unit 101 of the second air supply unit 100 used by the left partition module DBL1 may also be overlapped on the middle module CBL. Specifically, the fan unit 101 may also be overlapped on the filter 192. However, the height of the upper end of the fan unit 101 is set to be lower than the height of the upper end of the partition module DBL. By arranging the fan unit 101 in this way, the overall height of the coating and developing device 1A can be suppressed.

[0224] In addition, the above-mentioned storage parts 141 and 142 may be provided above the portion of the intermediate module CBL closer to the front side (negative side in the X direction in the figure) and the portion closer to the back side (positive side in the X direction in the figure) than the fan unit 101. However, the height of the upper end of the storage parts 141 and 142 is set to be lower than the height of the upper end of the processing module 11A.

[0225] and, Fig.12 The coating and developing device 1A and Figure 1 The coating and developing apparatus 1 shown in the drawings is different in the structure of the interface module. Specifically, the interface module 12A of the coating and developing apparatus 1A is provided with a conveying mechanism 125, and the conveying mechanism 125 conveys the wafer W between the handover unit 171 approached by the reciprocating conveying mechanism 150 in the handover module 110 and other handover units 171. The conveying mechanism 125 is provided, for example, at the inner side (positive side in the X direction in the figure) of the handover module 110.

[0226] The rest of the structure of the interface module 12A is the same as that of the interface module 12 .

[0227] In the coating and developing device 1A, the wafer W is supported, for example, in the following order, and a resist coating process, an exposure process, etc. are performed on the wafer W. In addition, hereinafter, among the delivery units, the delivery unit that is close to any of the reciprocating conveying mechanisms is referred to as a reciprocating delivery unit, and the delivery unit that is not close to any of the reciprocating conveying mechanisms is referred to as a non-reciprocating delivery unit.

[0228] The first conveying mechanism 40 → the non-reciprocating transfer unit 31 of the transfer module 30 → the second conveying mechanism 70 → the anti-etching film forming unit COT of the left dividing module DBL1 → the second conveying mechanism 70 → the heat treatment unit HT for PAB treatment of the left dividing module DBL1 → the second conveying mechanism 70 → the non-reciprocating transfer unit 171 of the middle module CBL → the conveying mechanism 180 → the transfer unit 171b of the middle module CBL → the reciprocating conveying mechanism 150 of the right dividing module DBL2 → the reciprocating transfer unit 111 of the interface module 12A → the conveying mechanism 125 → the non-reciprocating transfer unit 111 of the transfer module 110 → the third conveying mechanism 120 → the exposure device.

[0229] Then, the wafer W is supported, for example, in the following procedure, and the wafer W is subjected to a PEB process, a development process, and the like.

[0230] Exposure device → 3rd conveying mechanism 120 → non-reciprocating transfer unit 111 of interface module 12A → conveying mechanism 160 → heat treatment unit HT for PEB treatment of right dividing module DBL2 → conveying mechanism 160 → developing unit DEV of right dividing module DBL2 → conveying mechanism 160 → heat treatment unit HT for post-bake treatment of right dividing module DBL2 → conveying mechanism 160 → non-reciprocating transfer unit 171 of middle module CBL → conveying mechanism 180 → transfer unit 171a of middle module CBL → reciprocating conveying mechanism 150 of left dividing module DBL1 → reciprocating transfer unit 31 of transfer module 30 → 1st conveying mechanism 40.

[0231] By using the above-described processing module 11A, the number of processing units mounted in the processing module 11A can be increased.

[0232] <Variation 2 of Processing Module>

[0233] Fig.16 It is an explanatory diagram showing a schematic structure of a second variation of the processing module. Fig.17 This is an explanatory diagram of the structure of the intermediate module CBLB.

[0234] Fig.16 The coating and developing device 1B and Fig.12 Similarly to the coating and developing device 1A shown in FIG. 1 , the processing module 11B is divided in the width direction (the Y direction in the figure). However, in the coating and developing device 1B, unlike the coating and developing device 1A, the storage section 141 is provided above the left divided module DBL1 and the right divided module DBL2. Fig.17 As shown, the storage parts 141 and 142 are not provided above the middle module CBLB.

[0235] Therefore, the height of the upper end of the intermediate module CBLB can be raised to the height of the upper end of the split module DBL. By raising the intermediate module CBLB in this way, the operator can easily approach the uppermost layer of the split module DBL with the help of the intermediate module CBLB to perform maintenance on the processing unit at the uppermost layer of the split module DBL. In other words, maintenance is easier.

[0236] In addition, even if the height of the upper end of the intermediate module CBLB is increased as described above, since the upper end of the storage portion 141 from the upper end of the intermediate module CBLB to the dividing module DBL is separated, both the fan unit 191 and the filter 192 of the air supply unit 190 can be set above the intermediate module CBL.

[0237] Moreover, if the fan unit 191 is disposed above the intermediate module CBLB, rather than being disposed at a position further inside than the intermediate module CBLB (the shell CBLBa thereof), the inner end portion of the shell CBLBa (the positive end portion in the X direction in the figure) can be expanded to the inner end portion of the split module DBL. As a result, a processing unit can be disposed further inside than the conveying mechanism 180 in the intermediate module CBLB. In addition, a processing unit smaller than, for example, the heat treatment unit HT disposed in the split module DBL is disposed further inside than the conveying mechanism 180 in the intermediate module CBLB. More specifically, for example, in a case where the heat treatment unit HT has both a hot plate and a cooling plate, a heat treatment unit HTB having only a hot plate is disposed further inside than the conveying mechanism 180 in the intermediate module CBLB.

[0238] In addition, by increasing the height of the upper end of the intermediate module CBLB as described above, it is possible to set a unit (for example, an inspection camera unit) having a size equal to that of the chemical unit CHE in the depth direction (the X direction in the figure) in an area where the chemical unit CHE does not exist on the near front side of the intermediate module CBLB (the negative side of the X direction in the figure).

[0239] In addition, for the interface module 12A, when the storage parts 141 and 142 are not provided above it, the height of the upper end of the interface module 12A can also be increased, and the fan unit 131 and the filter 132 of the third air supply unit 130 can both be provided above the interface module 12A.

[0240] <Variation 3 of Processing Module>

[0241] Fig.18 It is an explanatory diagram showing the schematic structure of a third variation of the processing module. Fig.19 It is an explanatory diagram of the structure of the division module DBLC.

[0242] Fig.18 The coating and developing device 1C and Fig.12 Similar to the coating and developing device 1A shown in the figure, the processing module 11C is divided into a plurality of divided modules DBLC along the width direction (the Y direction in the figure). However, unlike the coating and developing device 1A, no intermediate module is provided between adjacent divided modules DBLC, and the plurality of divided modules DBLC constituting the processing module 11C are connected along the width direction (the Y direction in the figure). Fig.18 In the example of FIG. 1 , the processing module 11C is divided into two divided modules DBLC, and no intermediate module is provided between the two adjacent divided modules DBLC. Hereinafter, the divided module DBLC on the negative side in the width direction (the left side in the figure) is sometimes referred to as the left divided module DBLC1, and the divided module DBLC on the positive side in the width direction (the right side in the figure) is sometimes referred to as the right divided module DBLC2.

[0243] like Fig.19 As shown, in the left dividing module DBLC1 among the dividing modules DBLC, the upper submodule BL1C and the lower submodule BL2C are stacked in this order from the top, and the reciprocating layers BL3C are provided in the upper submodule BL1C and the lower submodule BL2C, respectively.

[0244] Similar to the upper submodule BL1 of the processing module 11, the upper submodule BL1C and the lower submodule BL2C of the left partition module DBLC1 are respectively provided with a second conveying mechanism 70. However, the second conveying mechanism 70 provided in the left partition module DBLC1 not only conveys the wafer W between the handover module 30 and the processing unit in the left partition module DBLC1 and between the processing units in the left partition module DBLC1, but also conveys the wafer W between the processing unit in the left partition module DBLC1 and the handover unit TRS3 described later.

[0245] In addition, in the left-side dividing module DBLC1, the front side (negative side in the X direction in the figure) of the second conveying space K2 of each of the upper sub-module BL1C and the lower sub-module BL2C is divided into an upper layer BL21 and a lower layer BL22 provided with an anti-etching film forming unit COT, similar to the above-mentioned lower sub-module BL2.

[0246] On the other hand, in the right dividing module DBLC2 among the dividing modules DBLC, although not shown in the figure, the upper submodule BL1D and the lower submodule BL2D are stacked in this order from the top, and a reciprocating layer BL3D is provided in each of the upper submodule BL1D and the lower submodule BL2D.

[0247] Similar to the upper submodule BL1 of the right dividing module DBL2, the upper submodule BL1D and the lower submodule BL2D of the right dividing module DBLC2 are provided with a conveying mechanism 160 (see Fig.18 However, unlike the conveying mechanism provided in the above-mentioned right dividing module DBL2, the conveying mechanism 160 provided in the right dividing module DBLC2 not only conveys the wafer W between the handover module 110 of the interface module 12A and the processing units in the right dividing module DBLC2 and between the processing units in the right dividing module DBLC2, but also conveys the wafer W between the processing units in the right dividing module DBLC2 and the handover unit TRS2 described later.

[0248] In addition, in the right dividing module DBLC2, the front side (negative side in the X direction in the figure) of the conveying space K4 of each of the upper submodule BL1D and the lower submodule BL2D is divided into an upper layer BL11 and a lower layer BL12 provided with a developing unit DEV, similar to the above-mentioned upper submodule BL1.

[0249] Return to the description of the left split module DBLC1.

[0250] In the left division module DBLC1, a reciprocating layer BL3C is provided on the back side (positive side in the X direction in the figure) of the second conveying space K2 of each of the upper submodule BL1C and the lower submodule BL2C so as to be stacked with the heat treatment unit HT.

[0251] A reciprocating conveying mechanism 150C is provided on the reciprocating layer BL3C. Hereinafter, the reciprocating conveying mechanism 150C provided on the reciprocating layer BL3C of the upper submodule BL1C is sometimes referred to as an upper reciprocating conveying mechanism 150Ca, and the reciprocating conveying mechanism 150C provided on the reciprocating layer BL3C of the lower submodule BL2C is sometimes referred to as a lower reciprocating conveying mechanism 150Cb.

[0252] Similar to the above-mentioned reciprocating conveying mechanism 150, the reciprocating conveying mechanism 150C linearly conveys the wafer W only in the width direction (the Y direction in the figure). In this example, the reciprocating conveying mechanism 150C linearly conveys the wafer W in the width direction (the Y direction in the figure) between the delivery unit TRS1 provided in the left dividing module DBL1 and the delivery unit TRS2 provided in the right dividing module DBL2.

[0253] Specifically, the upper reciprocating conveying mechanism 150Ca conveys the wafer W linearly along the width direction between the delivery unit TRS1 provided in the upper submodule BL1C of the left segmentation module DBLC1 and the delivery unit TRS2 provided in the upper submodule BL1D of the right segmentation module DBLC2. In addition, the lower reciprocating conveying mechanism 150Cb conveys the wafer W linearly along the width direction between the delivery unit TRS1 provided in the lower submodule BL2C of the left segmentation module DBLC1 and the delivery unit TRS2 provided in the lower submodule BL2D of the right segmentation module DBLC2.

[0254] Hereinafter, the transfer unit TRS1 provided in the upper submodule BL1C may be referred to as an upper transfer unit TRS1a, and the transfer unit TRS2 provided in the upper submodule BL1D may be referred to as an upper transfer unit TRS2a.

[0255] The linear wafer W conveying path and the delivery units TRS1 and TRS2 of the reciprocating conveying mechanism 150C are arranged so as to overlap with the processing units in the processing module 11C in a plan view. For example, when the thermal processing unit HT has both a hot plate and a cooling plate, the linear wafer W conveying path and the delivery units TRS1 and TRS2 of the reciprocating conveying mechanism 150C are arranged so as not to overlap with the hot plate of the thermal processing unit HT in a plan view but to overlap only with the cooling plate.

[0256] The transfer unit TRS1 is provided, for example, at an end portion on the cassette module 10 side in a region of the left division module DBLC1 that is further back than the second conveyance space K2 (positive side in the X direction in the drawing).

[0257] Furthermore, the delivery unit TRS2 is provided, for example, at an end portion on the cassette module 10 side in a region of the right division module DBLC2 that is further back than the conveyance space K4 (positive side in the X direction in the figure).

[0258] On the other hand, in the right division module DBLC2, a reciprocating layer BL3D is provided on the inner side (positive side in the X direction in the figure) of the conveying space K4 of each of the upper submodule BL1D and the lower submodule BL2D so as to be stacked with the heat treatment unit HT.

[0259] A reciprocating conveying mechanism 150D is provided on the reciprocating layer BL3D. Hereinafter, the reciprocating conveying mechanism 150D provided on the reciprocating layer BL3D of the upper submodule BL1D is sometimes referred to as an upper reciprocating conveying mechanism 150Da, and the reciprocating conveying mechanism 150D provided on the reciprocating layer BL3D of the lower submodule BL2D is sometimes referred to as a lower reciprocating conveying mechanism 150Db.

[0260] Similar to the above-mentioned reciprocating conveying mechanism 150, the reciprocating conveying mechanism 150D conveys the wafer W linearly only in the width direction (the Y direction in the figure). In this example, the reciprocating conveying mechanism 150D conveys the wafer W linearly in the width direction (the Y direction in the figure) between the delivery unit TRS3 provided in the right dividing module DBLC2 and the delivery unit TRS4 provided in the left dividing module DBLC1.

[0261] Specifically, the upper reciprocating conveying mechanism 150Da conveys the wafer W linearly along the width direction between the delivery unit TRS3 provided in the upper submodule BL1D of the right segmentation module DBLC2 and the delivery unit TRS4 provided in the upper submodule BL1C of the left segmentation module DBLC1. In addition, the lower reciprocating conveying mechanism 150Db conveys the wafer W linearly along the width direction between the delivery unit TRS3 provided in the lower submodule BL2D of the right segmentation module DBLC2 and the delivery unit TRS4 provided in the lower submodule BL2C of the left segmentation module DBLC1.

[0262] Hereinafter, the transfer unit TRS3 provided in the upper submodule BL1D may be referred to as an upper transfer unit TRS3a, and the transfer unit TRS4 provided in the upper submodule BL1C may be referred to as an upper transfer unit TRS4a.

[0263] The linear wafer W conveying path of the reciprocating conveying mechanism 150D and the delivery units TRS3 and TRS4 are arranged so as to overlap with the processing units in the processing module 11C in a plan view. For example, when the thermal processing unit HT has both a hot plate and a cooling plate, the linear wafer W conveying path of the reciprocating conveying mechanism 150D and the delivery units TRS3 and TRS4 are arranged so as not to overlap with the hot plate of the thermal processing unit HT in a plan view but to overlap only with the cooling plate.

[0264] The transfer unit TRS3 is provided, for example, at an end portion on the interface module 12A side in a region of the right division module DBLC2 that is further back than the conveyance space K4 (positive side in the X direction in the figure).

[0265] Furthermore, the delivery unit TRS4 is provided, for example, at an end portion on the interface module 12A side in a region of the left division module DBLC1 that is further back than the second conveyance space K2 (positive side in the X direction in the figure).

[0266] When the processing module 11C is configured as described above, the transport mechanism 125 of the interface module 12A transports the wafer W between the delivery unit TRS3 and the delivery module 110 .

[0267] Furthermore, when the process module 11C is configured as described above, the first transport mechanism 40 of the cassette module 10 is configured to be able to transport the wafer W also to the delivery unit TRS1 .

[0268] When the process module 11C is configured as described above, the wafer W is supported, for example, in the following procedure, and the wafer W is subjected to a resist coating process, an exposure process, and the like.

[0269] The first conveying mechanism 40 → the handover unit 31 of the handover module 30 → the second conveying mechanism 70 → the anti-etching film forming unit COT of the upper sub-module BL1C → the second conveying mechanism 70 → the heat treatment unit HT for PAB treatment of the upper sub-module BL1C → the second conveying mechanism 70 → the upper handover unit TRS4a → the upper reciprocating conveying mechanism 150Da → the upper handover unit TRS3a → the conveying mechanism 125 → the handover unit 111 of the interface module 12A → the third conveying mechanism 120 → the exposure device.

[0270] Then, the wafer W is supported, for example, in the following procedure, and the wafer W is subjected to a PEB process, a developing process, and the like.

[0271] Exposure device → 3rd conveying mechanism 120 → handover unit 111 of interface module 12A → conveying mechanism 160 → heat treatment unit HT for PEB treatment of upper sub-module BL1D → conveying mechanism 160 → heat treatment unit HT for PEB treatment of upper sub-module BL1D → conveying mechanism 160 → developing unit DEV of upper sub-module BL1D → conveying mechanism 160 → heat treatment unit HT for post-bake treatment of upper sub-module BL1D → conveying mechanism 160 → upper handover unit TRS2a → upper reciprocating conveying mechanism 150Ca → upper handover unit TRS1a → 1st conveying mechanism 40.

[0272] By using the above-described processing module 11C, the number of processing units mounted in the processing module 11C can be increased.

[0273] In addition, when the first conveying mechanism 40 conveys wafers not only relative to the handover module 30 but also relative to the handover unit TRS1, it is preferably configured as follows. That is, the first conveying mechanism 40 only performs handover of wafer W with the handover module 30 from one side (specifically, the inner side) in the depth direction (X direction in the figure), and the handover unit TRS1 is preferably located closer to the above-mentioned side (specifically, the inner side) than the handover module 30. As a result, the conveyance of wafer W relative to the handover module 30 by the first conveying mechanism 40 and the conveyance of wafer W relative to the handover unit TRS1 by the first conveying mechanism 40 can be continuously performed in a short time, which can improve productivity.

[0274] The substrate processing apparatus disclosed herein can also be applied to a processing apparatus for processing substrates other than semiconductor wafers, for example, FPD (Flat Panel Display) substrates.

[0275] Furthermore, the processing unit included in the substrate processing apparatus may perform processing on the wafer W by acquiring an image for inspection.

[0276] It should be understood that the embodiments disclosed herein are illustrative and not restrictive in all aspects. The above embodiments may also be omitted, replaced, or changed in various forms without departing from the appended claims and their purport. For example, the constituent elements of the above embodiments may be combined arbitrarily. According to the arbitrary combination, the functions and effects of the combined constituent elements can be obtained, and other functions and effects that can be clearly understood by those skilled in the art from the description of this specification can be obtained.

[0277] In addition, the effects described in this specification are only illustrative or exemplary, and not restrictive. That is, the technology disclosed in this disclosure can have other effects that can be clearly understood by those skilled in the art from the description of this specification on the basis of or in place of the above effects.

[0278] In addition, the following structural examples also belong to the technical scope of the present disclosure.

[0279] (1) A substrate processing device, characterized in that:

[0280] The substrate processing device comprises:

[0281] a carrying-in and carrying-out module having a container placing portion for placing a plurality of containers configured to accommodate substrates; and

[0282] a processing module, which is arranged adjacent to the carrying-in and carrying-out module in the width direction and has a plurality of processing units for processing the substrate,

[0283] The input and output module also has:

[0284] a handover module, which is formed by stacking handover units for handing over the substrate between the processing module and the processing module, and the handover module is arranged on the processing module side,

[0285] a first conveying mechanism for conveying the substrate between the container mounting portion and the delivery module,

[0286] The processing module further includes a second conveying mechanism for conveying the substrate between the handover module and the processing unit.

[0287] The first conveying mechanism includes a supporting portion for supporting the substrate.

[0288] The first conveying mechanism is configured to allow the substrate supported by the supporting portion to pass through the delivery module along a depth direction intersecting the width direction in a plan view.

[0289] (2) The substrate processing apparatus according to (1), characterized in that:

[0290] The first conveying mechanism delivers the substrate to and from the delivery module only in the depth direction.

[0291] (3) The substrate processing apparatus according to (2), characterized in that:

[0292] The substrate processing apparatus further comprises a first air supply unit for supplying clean gas from above to a first conveying space provided with the first conveying mechanism in the carrying-in / out module.

[0293] The first conveying mechanism delivers the substrate to the delivery module only from one side in the depth direction.

[0294] The first air supply unit is configured to supply the clean gas only to a portion of the first transport space that is closer to the one side in the depth direction than the delivery module.

[0295] A portion of the first conveying space that is closer to the other side in the depth direction than the delivery module is filled with a storage portion for storing electrical appliances.

[0296] (4) The substrate processing apparatus according to any one of (1) to (3), wherein:

[0297] The container placement section is provided on the side of the carrying-in / out module opposite to the processing module side in the width direction.

[0298] (5) The substrate processing apparatus according to (4), characterized in that:

[0299] The first transport mechanism transfers the substrate to and from the container mounting portion from the processing module side in the width direction.

[0300] (6) The substrate processing apparatus according to (4) or (5), characterized in that:

[0301] The first conveying mechanism further comprises: a first guide portion that guides the movement of the support portion in the vertical direction; and a second guide portion that guides the movement of the first guide portion in the depth direction.

[0302] In the width direction, a size of a gap between the container mounting portion and the delivery module is larger than a length of the first guide portion and smaller than a length of the support portion.

[0303] (7) The substrate processing apparatus according to any one of (1) to (6), characterized in that:

[0304] The second conveying mechanism delivers the substrate to and from the delivery module in the width direction.

[0305] (8) The substrate processing apparatus according to any one of (1) to (7), characterized in that:

[0306] The processing module is divided into a plurality of modules along the vertical direction.

[0307] The second conveying mechanism is provided in each of the plurality of modules.

[0308] The delivery module is provided to be capable of delivering the substrate to and from the second transport mechanisms of all the plurality of modules.

[0309] (9) The substrate processing apparatus according to any one of claims (1) to (8), wherein:

[0310] The substrate processing device also includes:

[0311] Another module is provided on the side of the processing module opposite to the feeding and unfeeding module in the width direction; and

[0312] a second air supply unit for supplying clean gas from above to a second conveying space, which is a space in the processing module where the second conveying mechanism is provided,

[0313] The second air supply unit partially overlaps the other modules.

[0314] (10) The substrate processing apparatus according to any one of claims (1) to (8), wherein:

[0315] The processing module is divided into a plurality of division modules along the width direction.

[0316] For each of the segmentation modules, there is:

[0317] a plurality of said processing units; and

[0318] A reciprocating conveying mechanism conveys the substrate linearly only in the width direction.

[0319] (11) The substrate processing apparatus according to (10), characterized in that:

[0320] The processing module further comprises an intermediate module between the adjacent segmentation modules.

[0321] The intermediate module has the handover module.

[0322] The reciprocating conveying mechanism conveys the substrate linearly along the width direction between the delivery modules.

[0323] (12) The substrate processing apparatus according to (10), characterized in that:

[0324] The plurality of segmentation modules are connected along the width direction,

[0325] The reciprocating conveying mechanism conveys the substrate linearly along the width direction between the delivery unit in the dividing module in which the reciprocating conveying mechanism is provided and the delivery unit in another dividing module adjacent to the dividing module.

[0326] (13) The substrate processing apparatus according to (12), characterized in that:

[0327] The linear wafer W conveying path of the reciprocating conveying mechanism and the delivery unit through which the wafer W is conveyed by the reciprocating conveying mechanism overlap with the processing unit in a plan view.

[0328] (14) The substrate processing apparatus according to (12) or (13), characterized in that:

[0329] The first conveying mechanism also conveys the substrate to the delivery unit in the dividing module on the side of the carry-in / out module in the width direction, to which the reciprocating conveying mechanism conveys the substrate.

[0330] (15) The substrate processing apparatus according to (14), characterized in that:

[0331] The first conveying mechanism delivers the substrate to the delivery module only from one side in the depth direction.

[0332] The delivery unit in the dividing module on the carrying-in / out module side in the width direction, for conveying the substrate by the reciprocating conveying mechanism, is provided on the one side in the depth direction relative to the delivery module of the carrying-in / out module.

Claims

1. A substrate processing device, characterized in that: The substrate processing device comprises: a carrying-in and carrying-out module having a container placing portion for placing a plurality of containers configured to accommodate substrates; and a processing module, which is arranged adjacent to the carrying-in and carrying-out module in the width direction and has a plurality of processing units for processing the substrate, A handover module is provided at a position close to the processing module in the input / output module for handover with the processing module. The handover module is formed by stacking handover units for handover of the substrate. The carrying-in and carrying-out module further comprises a first conveying mechanism for conveying the substrate between the container loading section and the delivery module. The processing module further includes a second conveying mechanism for conveying the substrate between the handover module and the processing unit. The first conveying mechanism includes a supporting portion for supporting the substrate. The first conveying mechanism is configured to allow the substrate supported by the supporting portion to pass through the delivery module along a depth direction intersecting the width direction in a plan view.

2. The substrate processing device according to claim 1, characterized in that: The first conveying mechanism delivers the substrate to and from the delivery module only in the depth direction.

3. The substrate processing device according to claim 2, characterized in that: The substrate processing apparatus further comprises a first air supply unit for supplying clean gas from above to a first conveying space provided with the first conveying mechanism in the carrying-in / out module. The first conveying mechanism delivers the substrate to the delivery module only from one side in the depth direction. The first air supply unit is configured to supply the clean gas only to a portion of the first transport space that is closer to the one side in the depth direction than the delivery module. A portion of the first conveying space that is closer to the other side in the depth direction than the delivery module is filled with a storage portion for storing electrical appliances.

4. The substrate processing apparatus according to any one of claims 1 to 3, characterized in that: The container placement section is provided on the side of the carrying-in / carrying-out module opposite to the processing module side in the width direction.

5. The substrate processing device according to claim 4, characterized in that: The first transport mechanism transfers the substrate to and from the container mounting portion from the processing module side in the width direction.

6. The substrate processing device according to claim 4, characterized in that: The first conveying mechanism further comprises: a first guide portion that guides the movement of the support portion in the vertical direction; and a second guide portion that guides the movement of the first guide portion in the depth direction. In the width direction, a size of a gap between the container placement portion and the delivery module is larger than a length of the first guide portion and smaller than a length of the support portion.

7. The substrate processing apparatus according to any one of claims 1 to 3, characterized in that: The second conveying mechanism delivers the substrate to and from the delivery module in the width direction.

8. The substrate processing apparatus according to any one of claims 1 to 3, characterized in that: The processing module is divided into a plurality of modules along the vertical direction. The second conveying mechanism is provided in each of the plurality of modules. The delivery module is provided to be capable of delivering the substrate to and from the second transport mechanisms of all the plurality of modules.

9. The substrate processing apparatus according to any one of claims 1 to 3, characterized in that: The substrate processing device also includes: Another module is provided on the side of the processing module opposite to the feeding and unfeeding module in the width direction; and a second air supply unit for supplying clean gas from above to a second conveying space, which is a space in the processing module where the second conveying mechanism is provided, The second air supply unit partially overlaps the other modules.

10. The substrate processing apparatus according to any one of claims 1 to 3, characterized in that: The processing module is divided into a plurality of division modules along the width direction. For each of the segmentation modules, there is: a plurality of said processing units; and A reciprocating conveying mechanism conveys the substrate linearly only in the width direction.

11. The substrate processing apparatus according to claim 10, wherein: The processing module further comprises an intermediate module between the adjacent segmentation modules. The intermediate module has the handover module. The reciprocating conveying mechanism conveys the substrate linearly along the width direction between the delivery modules.

12. The substrate processing apparatus according to claim 10, wherein: The plurality of segmentation modules are connected along the width direction, The reciprocating conveying mechanism conveys the substrate linearly along the width direction between the delivery unit in the dividing module in which the reciprocating conveying mechanism is provided and the delivery unit in another dividing module adjacent to the dividing module.

13. The substrate processing apparatus according to claim 12, wherein: The linear wafer W conveying path of the reciprocating conveying mechanism and the delivery unit through which the wafer W is conveyed by the reciprocating conveying mechanism overlap with the processing unit in a plan view.

14. The substrate processing apparatus according to claim 12, wherein: The first conveying mechanism also conveys the substrate to the delivery unit in the dividing module on the side of the carry-in / out module in the width direction, to which the reciprocating conveying mechanism conveys the substrate.

15. The substrate processing apparatus according to claim 14, wherein: The first conveying mechanism delivers the substrate to the delivery module only from one side in the depth direction. The delivery unit in the dividing module on the carrying-in / out module side in the width direction, for conveying the substrate by the reciprocating conveying mechanism, is provided on the one side in the depth direction relative to the delivery module of the carrying-in / out module.

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