Temperature control method and constant temperature system

Abstract

The present invention provides a temperature control method and a constant temperature system, which relate to the technical field of laser temperature control. The method includes the steps of: obtaining the temperature n1 of the heat exchange liquid for heat exchange of the device to be processed; adjusting the temperature and flow rate of the heat exchange liquid according to n1 and n2, so that n1 tends to n2, where n2 is the set temperature. In this solution, starting from both the temperature and flow rate of the heat exchange liquid, adjusting the temperature and flow rate of the heat exchange liquid according to n1 and n2 can improve the accuracy and adjustment range of temperature adjustment, making n1 closer to n2. Integrating the temperature and flow rate control logics in a control system can more effectively coordinate the relationship between the two, thereby improving the accuracy and range of temperature adjustment.

Description

Technical Field

[0001] The present invention relates to the field of laser temperature control, and more particularly, to a temperature control method and a constant temperature system. Background Art

[0002] High-power and high-heat lasers have problems of large heat generation and fast heat generation rate. A fast and wide-adjustment-range temperature control system is required to keep the laser working at a constant temperature.

[0003] Currently, for high-power laser devices, water cooling is generally used for temperature reduction. The heat of the laser is taken out through contact heat dissipation and conducted to the water cooling box. The water cooling box cools the water temperature through air cooling and then circulates it back to the laser. However, this system has the characteristics of low adjustment rate and poor adjustment accuracy, which seriously restricts the wavelength stability of the laser. Although the TEC, as the mainstream fast adjustment device, solves the above problems, it has a low adjustment range, extremely poor adjustment ability for high temperature differences, and there are long-term reliability risks. Summary of the Invention

[0004] The purpose of the present invention is to provide a temperature control method and a constant temperature system, which can adjust the temperature and flow rate of the heat exchange liquid and improve the accuracy and adjustment range of temperature adjustment.

[0005] In a first aspect, the present invention provides a temperature control method applied to a constant temperature system. The constant temperature system includes a first circulation pipeline, and the first circulation pipeline is filled with a heat exchange liquid for heat exchange treatment of the device to be processed. The method includes the steps of:

[0006] Obtaining the temperature n1 of the heat exchange liquid for heat exchange treatment of the device to be processed;

[0007] Adjusting the temperature and flow rate of the heat exchange liquid according to n1 and n2 to make n1 tend to n2, where n2 is the set temperature.

[0008] Further, when k≥a2 or k≤a1, adjusting the flow rate of the heat exchange liquid to make n1 tend to n2;

[0009] When a1<k<0 or 0<k<a2, adjusting the temperature of the heat exchange liquid to make n1 tend to n2;

[0010] Wherein, both a1 and a2 are set values, and k = .

[0011] Further, the step of adjusting the flow rate of the heat exchange liquid to make n1 tend to n2 when k≥a2 or k≤a1 is specifically:

[0012] When k≥a2 or k≤a1 and the current flow rate is within the set range of flow rate adjustment, adjusting the flow rate of the heat exchange liquid to make n1 tend to n2;

[0013] When k ≥ a2 or k ≤ a1, and when the current flow rate reaches the critical value of the set range of flow rate adjustment, adjust the temperature of the heat exchange liquid so that n1 tends to n2.

[0014] Further, in the step of adjusting the flow rate of the heat exchange liquid, the flow rate is changed in stages according to the adjustment interval time t in an increasing or decreasing manner.

[0015] Further, when a2 ≤ k < b2, or b1 < k ≤ a1, adjust t to t1;

[0016] When k ≥ b2 or k ≤ b1, adjust t to t2;

[0017] Wherein, b1 < a1 < 0 < a2 < b2; t1 > t2.

[0018] Further, the temperature control method further includes the steps of:

[0019] Cooling the heat exchange liquid by using a cooling mechanism, the cooling mechanism includes a second circulation pipeline, and a coolant is provided in the second circulation pipeline, and the coolant is used for heat exchange with the heat exchange liquid after heat exchange with the device to be processed;

[0020] The step of cooling the heat exchange liquid by using the cooling mechanism includes:

[0021] When d1 ≤ k ≤ d2, control the flow rate of the coolant in the second circulation pipeline to be unchanged;

[0022] When k > d2, increase the flow rate of the coolant in the second circulation pipeline;

[0023] When k < d1, decrease the flow rate of the coolant in the second circulation pipeline;

[0024] Wherein, d1 < 0 < d2;

[0025] And / or, the step of cooling the heat exchange liquid by using the cooling mechanism includes:

[0026] Step 1. After receiving the adjustment instruction, according to the current flow rate value of the coolant, increase or decrease the flow rate value in the direction of tending to the set range;

[0027] Step 2. At an interval time T, detect the flow rate value of the coolant in the second circulation pipeline;

[0028] Step 3. When the detected flow rate value is within the set range, stop the flow rate adjustment of the second heat exchange liquid;

[0029] When the detected flow rate value is not within the set range, increase or decrease the flow rate value of the coolant in the direction of tending to the set range and then execute Step 2.

[0030] Further, when k ≥ c2 or k ≤ c1, the flow rate and temperature of the heat exchange liquid are adjusted simultaneously, where c1 < b1 < a1 < 0 < a2 < b2 < c2.

[0031] Further, when k ≥ c2, the flow rate of the heat exchange liquid is adjusted to the maximum, and the heating temperature of the heat exchange liquid is adjusted to the minimum;

[0032] When k ≤ c1, the flow rate of the heat exchange liquid is adjusted to the minimum, and the heating temperature of the heat exchange liquid is adjusted to the maximum.

[0033] Further, the heat exchange liquid is heated by a heating mechanism; the flow rate of the heat exchange liquid is adjusted by a pump body;

[0034] The temperature control method includes steps performed before obtaining the temperature n1 of the heat exchange liquid at the heat exchange location for the device to be processed:

[0035] Reset the output range and initial value of the heating mechanism;

[0036] Reset the output frequency range, initial frequency, and initial flow rate of the frequency converter of the pump body.

[0037] In a second aspect, the present invention provides a constant temperature system for implementing the above temperature control method, including: a liquid storage tank, a controller, and a heat exchange structure. The liquid storage tank and the heat exchange structure are connected through a first circulation pipeline to enable the heat exchange liquid to circulate between the liquid storage tank and the heat exchange structure;

[0038] In the first circulation pipeline, a pump body, a heating mechanism, and a flow sensor are arranged in a section of the pipeline where the heat exchange liquid flows from the liquid storage tank to the heat exchange structure. The pump body is used to make the heat exchange liquid in the liquid storage tank flow into the heat exchange structure, and the flow sensor is used to detect the flow rate of the heat exchange liquid; the heating mechanism is used to heat the heat exchange liquid;

[0039] In the first circulation pipeline, a first temperature sensor is arranged in a section of the pipeline where the heat exchange liquid flows from the heat exchange structure to the liquid storage tank, for obtaining the temperature n1 of the heat exchange liquid at the heat exchange location for the device to be processed;

[0040] The controller is electrically connected to the pump body, the heating mechanism, the flow sensor, and the first temperature sensor respectively. The controller adjusts the flow rate of the heat exchange liquid according to n1 and n2, and adjusts the temperature of the heat exchange liquid through the heating mechanism to make n1 tend to n2.

[0041] The beneficial effects of the embodiments of the present invention are:

[0042] In this solution, starting from the temperature and flow rate of the heat exchange liquid, adjusting the temperature and flow rate of the heat exchange liquid according to n1 and n2 can improve the accuracy and adjustment range of temperature adjustment, making n1 closer to n2. Integrating the temperature and flow control logics in a control system can more effectively coordinate the relationship between the two, thereby improving the accuracy and range of temperature adjustment. Brief Description of the Drawings

[0043] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0044] Figure 1 It is a flowchart of the temperature control method provided by an embodiment of the present invention;

[0045] Figure 2 It is a schematic diagram of the constant temperature system provided by an embodiment of the present invention.

[0046] Reference Signs: 100 - liquid storage tank; 110 - automatic liquid filling port; 120 - manual liquid filling port; 130 - liquid level sensor; 140 - exhaust port; 150 - liquid discharge port;

[0047] 200 - pump body; 300 - heating mechanism; 400 - filter; 500 - flow sensor; 610 - first temperature sensor; 620 - second temperature sensor; 710 - first pressure sensor; 720 - second pressure sensor; 810 - first valve body; 820 - second valve body; 900 - cooling mechanism; 910 - heat exchanger; 920 - second circulation pipeline. Specific Embodiments

[0048] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. Usually, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0049] Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed present invention, but merely represents the selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the scope of protection of the present invention.

[0050] It should be noted that like reference numerals and letters refer to like items in the following figures. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0051] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the inventive product is customarily placed during use. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and should not be construed as indicating or implying relative importance.

[0052] In addition, terms such as "horizontal" and "vertical" do not mean that the components are required to be absolutely horizontal or hanging, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0053] In the description of the present invention, it should also be noted that unless otherwise clearly specified and limited, the terms "set", "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0054] As Figure 1 and Figure 2 shown, the temperature control method provided by the present invention is applied to a constant temperature system, and the constant temperature system can perform constant temperature treatment on a device to be processed, such as a laser. The working characteristics of the laser are extremely sensitive to temperature. Changes in temperature will cause drift in the output power and wavelength of the laser, thereby affecting its performance and reliability.

[0055] The constant temperature system includes a first circulation pipeline, and there is a heat exchange liquid in the first circulation pipeline. The heat exchange liquid can be a fluorinated liquid, and the heat exchange liquid is used to perform heat exchange treatment on the device to be processed, thereby changing the temperature around the device to be processed.

[0056] The method includes the steps of:

[0057] Obtain the temperature n1 of the heat exchange liquid for performing heat exchange treatment on the device to be processed.

[0058] In this embodiment, the first circulation pipeline includes a liquid inlet pipeline and a liquid return pipeline. One end of the liquid inlet pipeline is connected to the liquid storage tank 100, and the other end is used to connect to the inlet of the heat exchange pipeline of the heat exchange structure; one end of the liquid return pipeline is connected to the liquid storage tank 100, and the other end is used to connect to the outlet of the heat exchange pipeline. The liquid storage tank 100 stores heat exchange liquid. A first temperature sensor 610 is provided on the liquid return pipeline, and the first temperature sensor 610 is used to detect the temperature of the heat exchange liquid flowing out of the heat exchange pipeline of the heat exchange structure. The temperature directly reflects the temperature of the surrounding environment of the device to be processed, that is, the temperature n1 of the heat exchange liquid at the place where the device to be processed is subjected to heat exchange.

[0059] According to n1 and n2, the temperature and flow rate of the heat exchange fluid are adjusted so that n1 approaches n2, where n2 is the set temperature.

[0060] Starting from the liquid storage tank 100 , a pump body 200 , a heating mechanism 300 and a flow sensor 500 are sequentially arranged on the liquid inlet pipeline.

[0061] After the heating mechanism 300 is working, the temperature of the heat exchange fluid may change. Specifically, when other parameters remain unchanged, the heating power of the heating mechanism 300 increases, and n1 increases; conversely, when the heating power of the heating mechanism 300 decreases, n1 decreases. After the flow rate changes, the contact time between the heat exchange fluid and the heat exchange structure changes, and n1 changes. Specifically, when other parameters remain unchanged, when the power of the pump body 200 increases, the flow rate increases, and n1 decreases; conversely, when the power of the pump body 200 decreases, the flow rate decreases, and n1 increases.

[0062] According to the regulation performance of flow rate and temperature, the pump body 200 can be used to roughly adjust n1 so that n1 tends to n2, and then the heating mechanism 300 can be used to finely adjust n1 so that the difference between n1 and n2 tends to zero. When k≥a2 or k≤a1, the heat exchange liquid flow rate is adjusted to make n1 tend to n2; when a1<k<0, or 0<k<a2, the heat exchange liquid temperature is adjusted to make n1 tend to n2; wherein,

[0063] k=

[0064] a1 and a2 are both set values, which are set before the system is started according to the performance requirements of the device to be thermostatically treated.

[0065] Specifically, when k≤a1, the flow rate of the heat exchange fluid is reduced to increase n1;

[0066] When a1<k<0, the heating mechanism 300 enables PID negative feedback to increase the power of the heating mechanism 300 to increase n1;

[0067] When 0 < k < a2, the heating mechanism 300 enables PID negative feedback to reduce the power of the heating mechanism 300 in order to reduce n1.

[0068] When k ≥ a2, increase the flow rate of the heat exchange liquid to reduce n1.

[0069] However, when k ≥ a2 or k ≤ a1, and the current flow rate reaches the critical value of the set range of flow rate adjustment, adjust the temperature of the heat exchange liquid to make n1 tend to n2.

[0070] That is to say, after the flow rate adjustment, the maximum or minimum value of the flow rate has been reached and the flow rate cannot be adjusted anymore, and the value of k is still in the range of k ≥ a2 or k ≤ a1. Then, introduce the heating mechanism 300 to cooperate with the flow rate to further change n1. Specifically, when k ≥ a2 and the flow rate of the heat exchange liquid is the maximum, reduce the power of the heating mechanism 300 to reduce n1. When k ≤ a1 and the flow rate of the heat exchange liquid is the minimum, increase the power of the heating mechanism 300 to increase n1. When the current flow rate is within the set range of flow rate adjustment, only rely on the flow rate adjustment to make n1 tend to n2.

[0071] In the step of adjusting the flow rate of the heat exchange liquid, the flow rate is changed in stages according to the adjustment interval time t in an increasing or decreasing manner.

[0072] In this embodiment, the pump body 200 is a magnetic pump, and its power adjustment is a stepped stage adjustment with an adjustment interval time of t, and t can be changed. When the power of the magnetic pump completes a change, the system requires a certain reaction time. That is, when the power of the magnetic pump changes, the temperature detected by the first temperature sensor 610 will not change immediately. Leave the time t for reaction, and then the temperature detected by the first temperature sensor 610 is closer to the actual n1. If within the time t, k ≥ a2 or k ≤ a1 and the range where k is located does not change, it means that the current power of the pump body 200 is insufficient and needs to be changed continuously; while within the time t, the range of k changes, that is, a1 < k < 0 or 0 < k < a2, it means that there is no need to adjust through the flow rate, and then the heating mechanism 300 can be used for adjustment. If the above adjustment method is not adopted and the power of the pump body is continuously changed, the temperature detected by the first temperature sensor 610 will deviate significantly from the actual n1, and there will be a situation of over-adjustment of the flow rate.

[0073] When a2 ≤ k < b2, or b1 < k ≤ a1, adjust t to t1; when k ≥ b2 or k ≤ b1, adjust t to t2; where b1 < a1 < 0 < a2 < b2; t1 > t2.

[0074] Assume that the current adjustment interval time t = 3s. When the temperature difference between n1 and n2 is detected to be small, adjust the time setting of the timer of the magnetic pump, that is, the adjustment interval time t = 4s, so as to increase the reaction time and improve the accuracy; when the temperature difference between n1 and n2 is detected to be large, adjust the time setting of the timer of the magnetic pump, that is, the adjustment interval time t = 2s, shorten the reaction time, speed up the temperature adjustment speed, and make n1 tend to n2 faster.

[0075] The steps of adjusting the temperature of the heat exchange liquid include:

[0076] Use the heating mechanism 300 to heat the heat exchange liquid.

[0077] The initial temperature of the heat exchange liquid in the liquid storage tank 100 is lower than n2, and n1 can tend to n2 through the heating mechanism 300.

[0078] The constant temperature system may further include a cooling mechanism 900. The cooling mechanism 900 includes a second circulation pipeline 920, and the second circulation pipeline 920 is filled with a coolant, and the coolant can be water. The coolant is used to exchange heat with the heat exchange liquid after heat exchange with the device to be processed. The cooling mechanism 900 cools the heat exchange liquid flowing out of the heat exchange structure, and after cooling, it returns to the liquid storage tank 100 to prevent the temperature of the heat exchange liquid in the liquid storage tank 100 from being too high.

[0079] Among them, the flow rate of the coolant can be adjusted automatically or manually.

[0080] In an implementable way (automatic), the steps of using the cooling mechanism 900 to cool the heat exchange liquid include:

[0081] When d1 ≤ k ≤ d2, d1 < 0 < d2, for the cooling mechanism, k is within the preset temperature range, and there is no need to adjust the coolant flow rate.

[0082] When k > d2, increase the flow rate of the coolant in the second circulation pipeline 920. Among them, the adjustment method can be adjusted in stages, that is, every certain time T (set value), detect whether d1 ≤ k ≤ d2 is satisfied. If not, continue to increase a certain amount of cooling water flow. If satisfied, stop adjusting.

[0083] When k < d1, reduce the flow rate of the coolant in the second circulation pipeline 920. Among them, the adjustment method can be adjusted in stages, that is, every certain time T (set value), detect whether d1 ≤ k ≤ d2 is satisfied. If not, continue to reduce a certain amount of cooling water flow. If satisfied, stop adjusting. The operation of the cooling mechanism is related to the temperature of the first coolant, so that the cooling mechanism can work with the most suitable flow rate.

[0084] In another implementable way (manual), the step of using the cooling mechanism 900 to cool down the heat exchange liquid includes:

[0085] Step 1. After receiving the adjustment instruction, according to the current flow rate value of the coolant, increase or decrease the flow rate value of the coolant in the direction towards the set flow rate range;

[0086] The set range is the range manually given before the constant temperature system starts. If the current flow rate value is within the set range, there is no need to adjust; if the current flow rate value is greater than the maximum value of the set range, decrease the flow rate. Conversely, if the current flow rate value is less than the minimum value of the set range, increase the flow rate.

[0087] Step 2. At an interval of time T, detect the flow rate value of the coolant in the second circulation pipeline 920;

[0088] After each flow rate adjustment, a certain time needs to be waited before making subsequent actions because time needs to be left for the system to respond and wait for the system flow rate to stabilize. Detecting the current flow rate value will be more accurate.

[0089] Step 3. When the detected flow rate value is within the set range, stop adjusting the flow rate of the coolant. When the detected flow rate value is not within the set range, increase or decrease the flow rate value of the coolant in the direction towards the set range and then execute Step 2 until the detected flow rate value is within the set range, completing the adjustment of the flow rate of the coolant.

[0090] When k≥c2 or k≤c1, simultaneously adjust the flow rate and temperature of the heat exchange liquid, where c1<b1<a1<0<a2<b2<c2.

[0091] When k≥c2 or k≤c1, it indicates that the temperature difference between the current n1 and n2 is very large, and the gap between the two needs to be quickly narrowed. The power of the pump body 200 and the heating mechanism 300 can be immediately adjusted simultaneously to make n1 quickly approach n2.

[0092] Specifically, when k≥c2, adjust the flow rate of the heat exchange liquid to the maximum and adjust the heating temperature of the heat exchange liquid to the minimum.

[0093] For example, set n2 = 25°C, c2 = 40%, and the detected n1 = 45°C, and the calculated k = 80%. At this time, the temperature controller enables negative feedback, reduces the power of the heating mechanism to the minimum, and increases the output power of the pump body frequency converter, so that the flow rate of the heat exchange liquid in the pipeline increases to the maximum, and rapid cooling is carried out.

[0094] When k≤c1, adjust the flow rate of the heat exchange liquid to the minimum and adjust the heating temperature of the heat exchange liquid to the maximum.

[0095] For example, set n2 = 25°C, c1 = -40%, and the detected n1 = 5°C. The calculated k = -80%. At this time, the thermostat enables negative feedback, increases the power of the heating mechanism to the maximum, and reduces the output power of the pump body frequency converter, so that the flow rate of the heat exchange liquid in the pipeline is reduced to the minimum, and the temperature is increased rapidly.

[0096] The temperature control method includes the steps performed before obtaining the temperature n1 of the heat exchange liquid for heat exchange of the device to be processed: resetting the output range and initial value of the heating mechanism 300; resetting the output frequency range, initial frequency, and initial flow rate of the frequency converter of the pump body 200.

[0097] Before performing constant temperature treatment on the device to be processed, first initialize the system. Among them, set the output frequency range of the frequency converter of the pump body 200, the initial output frequency of the frequency converter of the pump body 200, the output range of the heating mechanism 300, the initial output setting of the heating mechanism 300, and the flow rate setting range. For example, the output frequency range of the frequency converter of the pump body 200 is 0 - 50 HZ, the initial frequency setting of the frequency converter of the pump body 200 (for example, 25 HZ), the output range setting of the heating mechanism 300 is 0% - 100%, the initial output setting of the heating mechanism 300 (for example, 35%), and the flow rate setting range is 2 L / min - 10 L / min.

[0098] As Figure 2 shown, the constant temperature system provided by the present invention includes: a liquid storage tank 100 and a first circulation pipeline.

[0099] Among them, the liquid storage tank 100 stores heat exchange liquid, and the heat exchange liquid can be replenished regularly by an automatic liquid replenishing mechanism. Among them, the automatic liquid replenishing mechanism can include a liquid pumping pump. One end of the liquid pumping pump is connected to a feeding barrel, and the controller can regularly suck the heat exchange liquid in the feeding barrel into the liquid storage tank 100. An electromagnetic valve is provided at the automatic liquid replenishing port 110 of the liquid storage tank 100, that is, at the port connected to the automatic liquid replenishing mechanism, to control the opening and closing of this port. At the same time, a manual liquid replenishing port 120 can also be set to manually replenish the heat exchange liquid into the liquid storage tank 100.

[0100] A liquid level sensor 130 is provided in the liquid storage tank 100 to avoid overfilling. The liquid storage tank 100 includes an exhaust port 140, and an electromagnetic valve is provided at the exhaust port 140 to exhaust the liquid storage tank 100 during liquid replenishment to avoid excessive internal pressure. The liquid storage tank 100 includes a liquid discharge port 150 and an electromagnetic valve for controlling the opening and closing of the liquid discharge port 150, so as to achieve automatic control of opening and closing. And a manually opened and closed ball valve is also provided at the liquid discharge port 150. The on-off of the liquid discharge port 150 is uniformly controlled by the electromagnetic valve and the ball valve, that is, the liquid discharge port 150 only opens when both of them are in the conducting state, to avoid accidental opening of the liquid discharge port 150.

[0101] The number of the first circulation pipelines can be one or two. In this embodiment, the number of the first circulation pipelines is two, and the environmental temperature of the device A to be processed and the device B to be processed can be adjusted simultaneously.

[0102] The first circulation pipeline includes a liquid inlet pipeline and a liquid return pipeline. One end of the liquid inlet pipeline is connected to the liquid storage tank 100, and the other end is used to be connected to the inlet of the heat exchange pipeline of the heat exchange structure; one end of the liquid return pipeline is communicated with the liquid storage tank 100, and the other end is used to be connected to the outlet of the heat exchange pipeline.

[0103] Taking the side of the device A to be processed as an example for illustration, starting from the liquid storage tank 100, a pump body 200, a heating mechanism 300, a filter 400, a flow sensor 500, a second temperature sensor 620, a first pressure sensor 710, and a first valve body 810 are sequentially arranged on the liquid inlet pipeline.

[0104] The pump body 200 is used to make the heat exchange liquid in the liquid storage tank 100 flow into the heat exchange pipeline of the heat exchange structure, and the pump body 200 can be a magnetic pump.

[0105] The heating mechanism 300 is used to heat the heat exchange liquid. The filter 400 can be a heat exchange liquid type filter 400 to filter impurities in the heat exchange liquid. The flow sensor 500 detects the flow rate of the heat exchange liquid, and the flow sensor 500 can display the flow rate value, that is, intuitively reflect the change of the power of the pump body 200.

[0106] The second temperature sensor 620 can detect and display the temperature of the heat exchange liquid before entering the heat exchange structure, and provide data for detection and data analysis.

[0107] The first pressure sensor 710 can detect the pressure in the liquid inlet pipeline, and cooperate with the second pressure sensor 720 on the liquid return pipeline to reflect whether there is a leakage in the heat exchange structure. When there is a large difference in the front and rear pressure values, it is necessary to check whether the heat exchange structure is damaged.

[0108] Starting from the heat exchange structure, a second valve body 820, a first temperature sensor 610, a second pressure sensor 720, and a cooling mechanism 900 are arranged on the liquid return pipeline.

[0109] The first valve body 810 and the second valve body 820 are respectively located at the inlet and outlet of the heat exchange pipeline, and can both be ball valves. By manually opening and closing, the on-off of the inlet and outlet of the heat exchange structure is changed. When the heat exchange structure needs to be replaced, the first valve body 810 and the second valve body 820 can both be closed.

[0110] The first temperature sensor 610 is used to detect the temperature of the heat exchange liquid flowing out of the heat exchange pipeline of the heat exchange structure. This temperature directly reflects the temperature of the surrounding environment of the device A to be processed, which is n1. By comparing n1 with the set temperature n2, the power of the pump body 200 and the heating mechanism 300 is adjusted to narrow the gap between n1 and the set temperature n2. Specifically, the controller of the system is electrically connected to the pump body 200, the heating mechanism 300, the flow sensor 500, and the first temperature sensor 610 respectively. The controller adjusts the power of the pump body 200 and the heating mechanism 300 according to n1 and n2 to make n1 tend to n2.

[0111] For the device A to be processed, a cooling mechanism 900 is provided on the return liquid pipeline. The first temperature sensor 610 is located between the cooling mechanism 900 and the heat exchange structure. The cooling mechanism 900 is used to dissipate heat from the heat exchange liquid. The controller of the system is electrically connected to the cooling mechanism 900. The cooling mechanism 900 can be used to cool the heat exchange liquid, and then reduce the power of the heating mechanism 300 or stop heating, so as to reduce the temperature of the heat exchange liquid flowing into the heat exchange structure and avoid the actual temperature of the heat exchange liquid being too high. Among them, the set temperature n2 is the working temperature required when the device A to be processed works. Among them, the cooling mechanism 900 includes a heat exchanger 910 and a second circulation pipeline 920. The heat exchanger 910 is respectively connected to the second circulation pipeline 920 and the return liquid pipeline, so that the second circulation pipeline 920 absorbs the heat of the return liquid pipeline through the heat exchanger 910. The coolant circulating in the cooling pipeline can be water.

[0112] The heat exchange liquid can be a fluorinated liquid.

[0113] For another first circulation pipeline, this first circulation pipeline performs constant temperature treatment on the device B to be processed. The two first circulation pipelines share a liquid storage tank 100. Therefore, only one cooling mechanism 900 needs to be provided.

[0114] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, not to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features. And these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A temperature control method, applied to a constant temperature system, the constant temperature system comprising a first circulation pipeline, the first circulation pipeline having a heat exchange fluid, the heat exchange fluid being used to perform heat exchange treatment on a device to be treated, characterized in that: Includes steps: Obtain the temperature n1 of the heat exchange fluid at the location where the heat exchange with the device to be processed is performed; According to n1 and n2, adjust the temperature and flow rate of the heat exchange fluid so that n1 approaches n2, where n2 is the set temperature; When k≥a2 or k≤a1, adjust the heat exchange fluid flow rate so that n1 approaches n2; When a1<k<0, or 0<k<a2, adjust the temperature of the heat exchange fluid so that n1 approaches n2; Among them, a1 and a2 are set values, k= ; In the step of adjusting the flow rate of the heat exchange fluid, the flow rate is changed in stages according to the adjustment interval time t in an increasing or decreasing manner; When a2≤k<b2, or b1<k≤a1, adjust t to t1; When k≥b2 or k≤b1, adjust t to t2; Among them, b1<a1<0<a2<b2; t1>t2; When k≥c2 or k≤c1, the flow rate and temperature of the heat exchange fluid are adjusted simultaneously, wherein c1<b1<a1<0<a2<b2<c2.

2. The temperature control method according to claim 1, characterized in that: When k≥a2 or k≤a1, the step of adjusting the heat exchange fluid flow rate so that n1 approaches n2 is specifically as follows: When k≥a2 or k≤a1, and the current flow rate is within the set range of flow regulation, adjust the heat exchange fluid flow rate so that n1 approaches n2; When k≥a2 or k≤a1, and the current flow rate reaches the critical value of the set range of flow rate regulation, the heat exchange liquid temperature is adjusted so that n1 approaches n2.

3. The temperature control method according to claim 1, characterized in that: The temperature control method further comprises the steps of: The heat exchange liquid is cooled using a cooling mechanism (900), wherein the cooling mechanism (900) comprises a second circulation pipeline (920), wherein the second circulation pipeline (920) has a cooling liquid therein, and the cooling liquid is used to exchange heat with the heat exchange liquid after heat exchange with the device to be processed; The step of using the cooling mechanism (900) to cool the heat exchange fluid comprises: When d1≤k≤d2, the flow rate of the coolant in the second circulation pipeline (920) is controlled to remain unchanged; When k>d2, the flow rate of the coolant in the second circulation pipeline (920) is increased; When k<d1, reducing the flow rate of the coolant in the second circulation pipeline (920); Among them, d1<0<d2; And / or, the step of using the cooling mechanism (900) to cool the heat exchange fluid comprises: Step 1. After receiving the adjustment instruction, increase or decrease the flow value of the coolant in the direction of the set range according to the current flow value of the coolant; Step 2. At an interval T, detect the flow value of the coolant in the second circulation pipeline (920); Step 3. When the detected flow value is within the set range, stop adjusting the flow of the second heat exchange fluid; When the detected flow value is not within the set range, the flow value of the coolant is increased or decreased in the direction toward the set range and then step 2 is executed.

4. The temperature control method according to claim 1, characterized in that: When k ≥ c2, adjust the flow rate of the heat exchange fluid to the maximum and adjust the heating temperature of the heat exchange fluid to the minimum; When k≤c1, adjust the flow rate of the heat exchange fluid to the minimum and adjust the heating temperature of the heat exchange fluid to the maximum.

5. The temperature control method according to claim 1, characterized in that: The heat exchange liquid is heated by using a heating mechanism (300); and the flow rate of the heat exchange liquid is adjusted by using a pump body (200); The temperature control method includes the following steps before obtaining the temperature n1 of the heat exchange fluid at the location where the device to be processed is subjected to heat exchange: Resetting the output range and initial value of the heating mechanism (300); The output frequency range, initial frequency and initial flow rate of the frequency converter of the pump body (200) are reset.

6. A constant temperature system for implementing the temperature control method according to any one of claims 1 to 5, characterized in that: include: A liquid storage tank (100), a controller and a heat exchange structure, wherein the liquid storage tank (100) and the heat exchange structure are connected via a first circulation pipeline so that the heat exchange liquid circulates between the liquid storage tank (100) and the heat exchange structure; In the first circulation pipeline, a section of the pipeline where the heat exchange liquid flows from the liquid storage tank (100) to the heat exchange structure is provided with a pump body (200), a heating mechanism (300) and a flow sensor (500); the pump body (200) is used to allow the heat exchange liquid in the liquid storage tank (100) to flow into the heat exchange structure; the flow sensor (500) is used to detect the flow rate of the heat exchange liquid; and the heating mechanism (300) is used to heat the heat exchange liquid. In the first circulation pipeline, a first temperature sensor (610) is provided in a section of the pipeline where the heat exchange liquid flows from the heat exchange structure to the liquid storage tank (100), and is used to obtain the temperature n1 of the heat exchange liquid at the location where heat exchange is performed on the device to be processed; The controller is electrically connected to the pump body (200), the heating mechanism (300), the flow sensor (500) and the first temperature sensor (610) respectively. The controller adjusts the flow rate of the heat exchange fluid through the pump body (200) and the temperature of the heat exchange fluid through the heating mechanism (300) according to n1 and n2, so that n1 approaches n2.

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