Hsa pin resistance value selection method, device and computer readable storage medium

Abstract

The embodiment of the application provides a HSA pin resistance value selection method, device and computer readable storage medium, and relates to the chip technical field.The method internally arranges a nonvolatile memory in a serial presence detect hub, and utilizes the nonvolatile memory to persistently save a HID (HID is an abbreviation of High Definition) which can normally work at low temperature, normal temperature and high temperature, that is, an optimal HID.In use of the serial presence detect hub, a user can directly acquire the optimal HID in the nonvolatile memory of the serial presence detect hub, and access preset resistance values corresponding to the optimal HID to the HSA pin of the serial presence detect hub, so that the test time of the user is saved, and the use experience of the user is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chips, in particular to an HSA pin resistance value selection method, device and computer readable storage medium. BACKGROUND

[0002] A DDR5 serial presence detection hub (DDR5 Serial Presence Detect EEPROM with Hub function, abbreviated as: SPD5 Hub) generates a host identifier (Host Identifier, abbreviated as HID) by connecting different resistance values to the host status array (Host Status Array, abbreviated as HSA) pin, which is a serial presence detection mechanism. Users will spend a lot of valuable time testing to find the HID of the SPD5 Hub that can work normally at different temperatures, which will affect the user's experience. SUMMARY

[0003] Therefore, the present application aims to provide an HSA pin resistance value selection method, device and computer readable storage medium, which can save testing time and improve user experience.

[0004] To achieve the above purpose, the technical scheme adopted by the embodiments of the present application is as follows:

[0005] In a first aspect, the present application provides an HSA pin resistance value selection method applied to a chip tester, wherein the chip tester is installed with a serial presence detection hub, and the serial presence detection hub comprises a non-volatile memory and an HSA pin; the method comprises:

[0006] Different preset resistance values are connected to the HSA pin in sequence; each preset resistance value corresponds to an HID;

[0007] Based on the preset resistance value, the test results of the serial presence detection hub at low temperature, normal temperature and high temperature are obtained;

[0008] When the test results of the serial presence detection hub at low temperature, normal temperature and high temperature corresponding to the preset resistance value are all passed, the HID corresponding to the preset resistance value is determined as the best HID, and the best HID is saved in the non-volatile memory, so that the user can connect the corresponding preset resistance value based on the best HID; the test results of the serial presence detection hub at low temperature, normal temperature and high temperature are all passed, indicating that the serial presence detection hub works normally at low temperature, normal temperature and high temperature.

[0009] In an optional embodiment, the non-volatile memory stores test records of each HID, the test records including the HID, low-temperature test results, normal-temperature test results, and high-temperature test results; and the obtaining of the test results of the serial presence detect hub under low temperature, normal temperature, and high temperature based on the preset resistance value includes:

[0010] determining the corresponding test record according to the HID corresponding to the preset resistance value;

[0011] testing the serial presence detect hub under a low-temperature environment to obtain the low-temperature test results in the test record corresponding to the HID;

[0012] testing the serial presence detect hub under a normal-temperature environment to obtain the normal-temperature test results in the test record corresponding to the HID;

[0013] testing the serial presence detect hub under a high-temperature environment to obtain the high-temperature test results in the test record corresponding to the HID.

[0014] In an optional embodiment, the serial presence detect hub further includes an HSDA pin; and the testing of the serial presence detect hub under a low-temperature environment to obtain the low-temperature test results in the test record corresponding to the HID includes:

[0015] setting the low-temperature test results in the test record corresponding to the HID as passed when the HSDA pin receives an ACK signal under a low-temperature environment;

[0016] setting the low-temperature test results in the test record corresponding to the HID as failed when the HSDA pin does not receive an ACK signal under a low-temperature environment.

[0017] In an optional embodiment, the serial presence detect hub further includes an HSDA pin; and the testing of the serial presence detect hub under a normal-temperature environment to obtain the normal-temperature test results in the test record corresponding to the HID includes:

[0018] setting the normal-temperature test results in the test record corresponding to the HID as passed when the HSDA pin receives an ACK signal under a normal-temperature environment;

[0019] setting the normal-temperature test results in the test record corresponding to the HID as failed when the HSDA pin does not receive an ACK signal under a normal-temperature environment.

[0020] In an optional embodiment, the serial presence detection hub further comprises an HSDA pin; the testing of the serial presence detection hub in a high-temperature environment obtains a high-temperature test result in a test record corresponding to the HID, including:

[0021] When the HSDA pin receives an ACK signal in a high-temperature environment, the high-temperature test result in the test record corresponding to the HID is set as passed;

[0022] When the HSDA pin does not receive an ACK signal in a high-temperature environment, the high-temperature test result in the test record corresponding to the HID is set as failed.

[0023] In an optional embodiment, the method further comprises:

[0024] When the low temperature and / or the high temperature changes, the low-temperature test result and / or the high-temperature test result in each test record is erased, and the best HID in the non-volatile memory is erased;

[0025] The HSA pin is sequentially connected to different preset resistance values, and based on the preset resistance values, the test results of the serial presence detection hub in the updated low temperature and / or the updated high temperature are obtained;

[0026] The low-temperature test result and / or the high-temperature test result in the test record is updated by using the new test result;

[0027] A new best HID is determined according to the low-temperature test result, the normal-temperature test result, and the high-temperature test result in the updated test record.

[0028] In an optional embodiment, the method further comprises:

[0029] The HSA pin of a plurality of sample hubs is sequentially connected to different preset resistance values; the plurality of sample hubs are selected from a plurality of serial presence detection hubs in the same wafer;

[0030] Based on the preset resistance values, the test results of each sample hub in the low temperature, the normal temperature, and the high temperature are obtained;

[0031] When the test results of all sample hubs corresponding to the preset resistance values in the low temperature, the normal temperature, and the high temperature are all passed, the HID corresponding to the preset resistance value is determined as the best HID.

[0032] In an optional embodiment, the non-volatile memory is further provided with a trimming bit area; and when the test results of the serial presence detect hub at low temperature, normal temperature and high temperature corresponding to the preset resistance value are all passed, the HID corresponding to the preset resistance value is determined as the optimal HID, and the optimal HID is saved in the non-volatile memory, comprising:

[0033] traversing each test record in the non-volatile memory, if the low-temperature test result, the normal-temperature test result and the high-temperature test result in the test record are all passed, the HID in the test record is determined as the optimal HID;

[0034] the optimal HID is saved in the trimming bit area.

[0035] In a second aspect, the application provides an HSA pin resistance value selection device, applied to a chip testing machine, wherein the chip testing machine is provided with a serial presence detect hub, and the serial presence detect hub comprises a non-volatile memory and an HSA pin; the device comprises:

[0036] an access module, configured to sequentially access different preset resistance values for the HSA pin; each preset resistance value corresponds to an HID;

[0037] a test module, configured to obtain test results of the serial presence detect hub at low temperature, normal temperature and high temperature based on the preset resistance values;

[0038] a selection module, configured to, when the test results of the serial presence detect hub at low temperature, normal temperature and high temperature corresponding to the preset resistance value are all passed, determine the HID corresponding to the preset resistance value as the optimal HID, and save the optimal HID in the non-volatile memory, so that a user accesses the corresponding preset resistance value based on the optimal HID; the test results of the serial presence detect hub at low temperature, normal temperature and high temperature being all passed indicates that the serial presence detect hub works normally at low temperature, normal temperature and high temperature.

[0039] In a third aspect, the application provides a computer readable storage medium, which stores a computer program, and the computer program is executed by a chip testing machine to realize the HSA pin resistance value selection method according to any one of the preceding embodiments.

[0040] Compared with the prior art, the HSA pin resistance value selection method, device and computer readable storage medium provided by the embodiment of the application have the nonvolatile memory built in the serial presence detect hub, and the nonvolatile memory is used to persistently store the HID, that is, the optimal HID, which can normally work at low temperature, normal temperature and high temperature. When the serial presence detect hub is used, the user can directly obtain the optimal HID in the nonvolatile memory of the serial presence detect hub, and access the preset resistance value corresponding to the optimal HID to the HSA pin of the serial presence detect hub, thereby saving the test time of the user and improving the use experience of the user.

[0041] In order to make the above objectives, characteristics and advantages of the present application more apparent, the following preferred embodiments are specifically described below, and the accompanying drawings are referred to for detailed description. BRIEF DESCRIPTION OF DRAWINGS

[0042] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be considered as a limitation to the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0043] Figure 1 Fig. 1 shows a flow diagram of the HSA pin resistance value selection method provided by the embodiment of the present application.

[0044] Figure 2 Fig. 2 shows another flow diagram of the HSA pin resistance value selection method provided by the embodiment of the present application.

[0045] Figure 3 Fig. 3 shows another flow diagram of the HSA pin resistance value selection method provided by the embodiment of the present application.

[0046] Figure 4 Fig. 4 shows another flow diagram of the HSA pin resistance value selection method provided by the embodiment of the present application.

[0047] Figure 5 Fig. 5 shows another flow diagram of the HSA pin resistance value selection method provided by the embodiment of the present application.

[0048] Figure 6 Fig. 6 shows a block diagram of the HSA pin resistance value selection device provided by the embodiment of the present application.

[0049] Figure 7 Fig. 7 shows a block diagram of the chip tester provided by the embodiment of the present application.

[0050] Icon: 100-chip tester; 110-serial presence detect hub; 300-HSA pin resistance value selection device; 301-access module; 302-test module; 303-selection module. DETAILED DESCRIPTION

[0051] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. The components of the embodiments of the present application described and shown in the accompanying drawings can be arranged and designed in various different configurations.

[0052] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0053] It should be noted that the relational terms such as "first" and "second" and the like are used only to distinguish one entity or operation from another, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus including a series of elements includes not only those elements, but also other elements not explicitly listed or inherent to such a process, method, article or apparatus. Without more limitations, the element defined by the statement "comprising a" does not exclude the presence of additional identical elements in the process, method, article or apparatus including the element.

[0054] Different resistance values are connected on the HSA pins of the SPD5 Hub, corresponding to different 3-bit HIDs, which are used to identify the characteristics and status of the devices connected to the SPD5 Hub. Specifically, the change of each resistance value will affect the time delay in signal transmission, thereby forming a unique identification sequence. For example, Table 1 shows the correspondence between different preset resistance values and HIDs, which is crucial for ensuring the compatibility and configuration of the storage system.

[0055] Table 1

[0056]

[0057]

[0058] The inventor has found that, before using the SPD5 Hub each time, a suitable HID needs to be found through chip probing (CP testing) and the HSA pin needs to be connected to the resistance value corresponding to the suitable HID. Limited by cost and efficiency, the CP testing is usually performed by using a chip tester to simulate the resistance. The SPD5 Hub is affected by temperature, and the HID that can work at low temperature, normal temperature and high temperature is verified by continuous adjustment, which undoubtedly increases the time cost and affects the user experience.

[0059] Therefore, the HSA pin resistance value selection method, device, chip tester and storage medium provided by the embodiments of the present application are provided. The method internally builds a non-volatile memory in the serial presence detect hub, and uses the non-volatile memory to persistently save the HID that can normally work at low temperature, normal temperature and high temperature, i.e. the optimal HID. When the serial presence detect hub is used, the user can directly obtain the optimal HID in the non-volatile memory of the serial presence detect hub, connect the HSA pin of the serial presence detect hub to the preset resistance value corresponding to the optimal HID, save the test time for the user, and improve the user experience.

[0060] The embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0061] Please refer to Figure 1 , Figure 1 Fig. 1 shows a flowchart of the HSA pin resistance value selection method provided by the embodiments of the present application. The method is applied to a chip tester, the chip tester is installed with a serial presence detect hub, the serial presence detect hub includes a non-volatile memory and an HSA pin. The method includes the following steps:

[0062] Step S10, sequentially connecting different preset resistance values to the HSA pin; each preset resistance value corresponds to an HID.

[0063] In the embodiments of the present application, the non-volatile memory internally built in the serial presence detect hub (i.e. the SPD5 Hub) can be an electrically erasable programmable read-only memory (EEPROM), and the EEPROM is used to record the optimal HID.

[0064] The chip tester sequentially connects different preset resistance values to the HSA pin, for example, first connecting the preset resistance value 10.0KΩ to GND to the HSA pin in the order of resistance value from small to large, and finally connecting the preset resistance value 196KΩ to GND to the HSA pin. Alternatively, first connecting the preset resistance value 196KΩ to GND to the HSA pin in the order of resistance value from large to small, and finally connecting the preset resistance value 10.0KΩ to GND to the HSA pin. Alternatively, randomly selecting the preset resistance value to connect to the HSA pin until the chip tester sequentially connects all the preset resistance values to the HSA pin. The order of connecting the preset resistance value to the HSA pin is not limited in the application.

[0065] In step S20, based on the preset resistance value, the test results of the serial presence detect hub at low temperature, normal temperature and high temperature are obtained.

[0066] In the embodiment of the application, when the HSA pin is connected to the preset resistance value, the serial presence detect hub is tested at low temperature, normal temperature and high temperature to obtain the test results.

[0067] The low temperature represents the lower limit of the temperature range in which the SPD5 Hub can work normally, which is the low temperature part of the industrial temperature range, for example, between-40℃ and-30℃. The normal temperature usually refers to the room temperature, which is the ideal temperature range in which the chip normally works, for example, between 15℃ and 25℃. The high temperature represents the upper limit of the temperature range in which the SPD5 Hub can work normally, which is the high temperature part of the industrial temperature range, for example, between 110℃ and 125℃.

[0068] In step S30, when the test results of the serial presence detect hub corresponding to the preset resistance value at low temperature, normal temperature and high temperature are all passed, the HID corresponding to the preset resistance value is determined as the best HID, and the best HID is saved in the non-volatile memory, so that the user can connect the corresponding preset resistance value based on the best HID; the test results of the serial presence detect hub at low temperature, normal temperature and high temperature are all passed, which indicates that the serial presence detect hub works normally at low temperature, normal temperature and high temperature.

[0069] In the embodiment of the application, it is judged whether the test results of the SPD5 Hub corresponding to the preset resistance value at low temperature, normal temperature and high temperature are all passed. If there is a test result that is not passed, the preset resistance value cannot support the SPD5 Hub to work normally at low temperature, normal temperature and high temperature. If the test results corresponding to the preset resistance value are all passed, the preset resistance value can support the SPD5 Hub to work normally at low temperature, normal temperature and high temperature, and the HID corresponding to the preset resistance value is determined as the best HID and saved in the EEPROM.

[0070] When the user uses the SPD5 Hub, the optimal HID is obtained from the non-volatile memory (i.e., EEPROM), the HSA pin is accessed to the preset resistance value corresponding to any optimal HID, and the SPD5 Hub can quickly enter the working state, thereby saving the test time of the SPD5 Hub.

[0071] In summary, the HSA pin resistance value selection method provided by the embodiment of the application sequentially accesses different preset resistance values to the HSA pin; based on the preset resistance value, test results of the serial presence detect hub at low temperature, normal temperature and high temperature are obtained; when the test results of the serial presence detect hub at low temperature, normal temperature and high temperature corresponding to the preset resistance value are all passed, the HID corresponding to the preset resistance value is determined as the optimal HID, and the optimal HID is saved in the non-volatile memory, so that the user can access the corresponding preset resistance value based on the optimal HID.

[0072] It can be seen that the embodiment of the application creatively embeds the non-volatile memory in the serial presence detect hub, and uses the non-volatile memory to persistently save the HID (i.e., the optimal HID) that can normally work at low temperature, normal temperature and high temperature. When the serial presence detect hub is used, the user can directly obtain the optimal HID in the non-volatile memory of the serial presence detect hub, access the preset resistance value corresponding to the optimal HID to the HSA pin of the serial presence detect hub, save the test time for the user, and improve the user experience.

[0073] Optionally, in actual application, the non-volatile memory stores test records of each HID, and the test record includes the HID, the low-temperature test result, the normal-temperature test result and the high-temperature test result. As to how to generate the low-temperature test result, the normal-temperature test result and the high-temperature test result in the test record, a possible implementation manner is provided as follows. Please refer to the sub-step of step S20 in Figure 2 , Figure 1 may include:

[0074] Step S201: determining the corresponding test record according to the HID corresponding to the preset resistance value.

[0075] In the embodiment of the application, the EEPROM stores test records of each HID, and each test record includes the HID, the low-temperature test result, the normal-temperature test result and the high-temperature test result. The chip tester can find the corresponding HID from Table 1 according to the preset resistance value accessed to the HSA pin, and find the corresponding test record through the corresponding HID.

[0076] Before the HSA pin resistance value selection method is executed, the low-temperature test result, the normal-temperature test result and the high-temperature test result in each test record of the EEPROM are all invalid values (for example, 0xFF), as shown in Table 2.

[0077] Table 2

[0078] HID Low temperature test results Normal temperature test results High temperature test results 000 0xFF 0xFF 0xFF 001 0xFF 0xFF 0xFF 010 0xFF 0xFF 0xFF 011 0xFF 0xFF 0xFF 100 0xFF 0xFF 0xFF 101 0xFF 0xFF 0xFF 110 0xFF 0xFF 0xFF 111 0xFF 0xFF 0xFF

[0079] In step S202, the serial presence detect hub is tested in a low-temperature environment to obtain a low-temperature test result in the test record corresponding to the HID.

[0080] In step S203, the serial presence detect hub is tested in a normal-temperature environment to obtain a normal-temperature test result in the test record corresponding to the HID.

[0081] In step S204, the serial presence detect hub is tested in a high-temperature environment to obtain a high-temperature test result in the test record corresponding to the HID.

[0082] In the embodiment of the application, the chip tester is placed in a low-temperature environment, and the SPD5 Hub is tested in the low-temperature environment, i.e., the SPD5 Hub communicates with the host to obtain a low-temperature test result corresponding to the HID, and the low-temperature test result is updated to the test record corresponding to the HID. Similarly, the chip tester is placed in a normal-temperature environment and a high-temperature environment respectively, and the SPD5 Hub is tested to obtain a normal-temperature test result and a high-temperature test result corresponding to the HID, which are updated to the test record corresponding to the HID.

[0083] It should be noted that, in order to reduce the time for changing the temperature of the test environment, the serial presence detect hub connected to different preset resistance values can be tested in the same temperature environment. For example, different preset resistance values are connected to the HSA pin in the low-temperature environment, and test results of the serial presence detect hub connected to different preset resistance values in the low-temperature environment are obtained.

[0084] In the normal-temperature environment, different preset resistance values are connected to the HSA pin in sequence, and test results of the serial presence detect hub connected to different preset resistance values in the normal-temperature environment are obtained. In the high-temperature environment, different preset resistance values are connected to the HSA pin in sequence, and test results of the serial presence detect hub connected to different preset resistance values in the high-temperature environment are obtained, and finally the best HID is obtained based on the test results of the preset resistance values in the low-temperature, normal-temperature and high-temperature environments.

[0085] It can be seen that, in the embodiment of the application, the nonvolatile memory records the test results of the serial presence detect hub based on the preset resistance values in the low-temperature, normal-temperature and high-temperature environments, so that the test results after power-off are also not lost. The best HID is quickly determined based on the low-temperature test result, the normal-temperature test result and the high-temperature test result recorded in the test record in the nonvolatile memory.

[0086] Optionally, in actual application, the serial presence detect hub further comprises an HSDA pin, and the following provides a possible implementation for how to determine the low-temperature test result by using the HSDA pin. Figure 2 The sub-steps in step S202 can include:

[0087] When the HSDA pin receives the ACK signal in the low-temperature environment, the low-temperature test result in the test record corresponding to the HID is set as passed; and when the HSDA pin does not receive the ACK signal in the low-temperature environment, the low-temperature test result in the test record corresponding to the HID is set as failed.

[0088] In the embodiment of the present application, after the host successfully receives the data sent by the serial presence detect hub, the host sends an ACK signal to the serial presence detect hub, and the serial presence detect hub receives the ACK signal through the HSDA pin.

[0089] When the chip tester is in the low-temperature environment, if the HSDA pin receives the ACK signal, it indicates that the serial presence detect hub can work normally in the low-temperature environment and can successfully send data to the host, and the low-temperature test result in the test record corresponding to the HID is set as passed, for example, set as 1. If the HSDA pin does not receive the ACK signal, it indicates that the serial presence detect hub cannot work normally in the low-temperature environment, and the low-temperature test result in the test record corresponding to the HID is set as failed, for example, set as 0.

[0090] Optionally, in actual application, the serial presence detect hub further comprises an HSDA pin, and the following provides a possible implementation for how to determine the normal-temperature test result by using the HSDA pin. Figure 2 The sub-steps in step S203 can include:

[0091] When the HSDA pin receives the ACK signal in the normal-temperature environment, the normal-temperature test result in the test record corresponding to the HID is set as passed; and when the HSDA pin does not receive the ACK signal in the normal-temperature environment, the normal-temperature test result in the test record corresponding to the HID is set as failed.

[0092] In the embodiment of the present application, when the chip tester is in the normal-temperature environment, if the HSDA pin receives the ACK signal, it indicates that the serial presence detect hub can work normally in the normal-temperature environment and can successfully send data to the host, and the normal-temperature test result in the test record corresponding to the HID is set as passed, for example, set as 1. If the HSDA pin does not receive the ACK signal, it indicates that the serial presence detect hub cannot work normally in the normal-temperature environment, and the normal-temperature test result in the test record corresponding to the HID is set as failed, for example, set as 0.

[0093] Optionally, in practical application, the serial presence detect hub further comprises an HSDA pin. As to how to determine the high-temperature test result by using the HSDA pin, a possible implementation is provided as follows. Figure 2 The sub-step of step S204 can comprise:

[0094] When the HSDA pin receives the ACK signal in the high-temperature environment, the high-temperature test result in the test record corresponding to the HID is set as passed; when the HSDA pin does not receive the ACK signal in the high-temperature environment, the high-temperature test result in the test record corresponding to the HID is set as failed.

[0095] In the embodiment of the application, when the chip tester is in the high-temperature environment, if the HSDA pin receives the ACK signal, it indicates that the serial presence detect hub can work normally in the high-temperature environment and can successfully send data to the host computer, and the high-temperature test result in the test record corresponding to the HID is set as passed, for example, set as 1. If the HSDA pin does not receive the ACK signal, it indicates that the serial presence detect hub cannot work normally in the high-temperature environment, and the high-temperature test result in the test record corresponding to the HID is set as failed, for example, set as 0.

[0096] As a possible implementation, it is assumed that the HIDs whose test results of the serial presence detect hub are passed in the low-temperature environment are 011, 100, 101, 110 and 111. The HIDs whose test results of the serial presence detect hub are passed in the normal-temperature environment are 010, 011, 100 and 101. The HIDs whose test results of the serial presence detect hub are passed in the high-temperature environment are 001, 010, 011 and 100, and the test records of the HIDs of the EEPROM are shown in Table 3.

[0097] Table 3

[0098] HID Low temperature test results Normal temperature test results High temperature test results 000 0 0 0 001 0 0 1 010 0 1 1 011 1 1 1 100 1 1 1 101 1 1 0 110 1 0 0 111 1 0 0

[0099] Optionally, in practical application, the nonvolatile memory is further provided with a trimming bit area. As to how to store the optimal HID by using the trimming bit area, a possible implementation is provided as follows. Figure 1 The sub-step of step S30 can comprise:

[0100] The test records in the nonvolatile memory are traversed, if the low-temperature test result, the normal-temperature test result and the high-temperature test result in the test record are all passed, the HID in the test record is determined as the optimal HID, and the optimal HID is saved into the trimming bit area.

[0101] In the product calibration stage, the test results of each HID at three temperatures (i.e. low temperature, normal temperature and high temperature) are read from the non-volatile memory EEPROM, and the HID whose test results at low temperature, normal temperature and high temperature (i.e. low-temperature test result, normal-temperature test result and high-temperature test result) are all passed is determined as the optimal HID, such as 011 and 100 in Table 3 are determined as the optimal HID.

[0102] A trimming bit area is set in the non-volatile memory EEPROM, which is used to record the optimal HID of the serial presence detect hub, and the optimal HID (such as 011 and 100) is written into the trimming bit area as the final adjustment setting of the product.

[0103] Optionally, in actual application, the optimal HID of the serial presence detect hub needs to be retested when the low temperature or high temperature is redefined. A possible implementation is provided below, please refer to Figure 3 The HSA pin resistance value selection method further includes the following steps:

[0104] In step S40, when the low temperature and / or high temperature changes, the low-temperature test result and / or high-temperature test result in each test record is erased, and the optimal HID in the non-volatile memory is also erased.

[0105] In the embodiment of the present application, when the ambient temperature of the serial presence detect hub changes greatly, the low temperature and / or high temperature need to be redefined according to the actual application scene. When the low temperature or high temperature is redefined, the HSA pin resistance value needs to be re-recommended. In order to prevent important information in the non-volatile memory (such as EEPROM) from being overwritten, the old data needs to be erased before each write, and the non-volatile memory needs to be maintained regularly to prolong the service life, so as to ensure the persistence and safety of the optimal HID storage.

[0106] In step S50, different preset resistance values are sequentially connected to the HSA pin, and based on the preset resistance values, the test results of the serial presence detect hub at the updated low temperature and / or updated high temperature are obtained.

[0107] In step S60, the low-temperature test result and / or high-temperature test result in the test record is updated by using the new test result.

[0108] In step S70, the new optimal HID is determined according to the low-temperature test result, normal-temperature test result and high-temperature test result in the updated test record.

[0109] In the embodiment of the present application, the chip tester is placed in the updated low-temperature environment and / or high-temperature environment, the test results of the serial presence detect hub after accessing different preset resistance values are tested, and the low-temperature test result and / or the high-temperature test result in the corresponding test record is updated by using the new test result. When the low-temperature test result, the normal-temperature test result and the high-temperature test result in the updated test record are all passed, the HID in the test record is determined as the best HID, and the new best HID is saved into the nonvolatile memory.

[0110] Optionally, in actual application, there are tens of thousands of serial presence detect hubs on the same wafer, in order to improve the test efficiency, hundreds of sample hubs can be extracted from the tens of thousands of serial presence detect hubs in the same wafer. A possible implementation manner is provided below, please refer to Figure 4 , the HSA pin resistance value selection method further includes the following steps:

[0111] In step S80, different preset resistance values are sequentially accessed for the HSA pins of the plurality of sample hubs; the plurality of sample hubs are selected from the plurality of serial presence detect hubs in the same wafer.

[0112] In step S90, based on the preset resistance value, the test results of each sample hub under low temperature, normal temperature and high temperature are obtained.

[0113] In step S100, when the test results of all the sample hubs corresponding to the preset resistance value under low temperature, normal temperature and high temperature are all passed, the HID corresponding to the preset resistance value is determined as the best HID.

[0114] In the embodiment of the present application, in order to further improve the test efficiency, test samples are extracted from the tens of thousands of serial presence detect hubs in the same wafer to obtain a plurality of sample hubs. Based on the different preset resistance values accessed, the serial presence detect hubs are tested under low temperature, normal temperature and high temperature to obtain the test record of each HID corresponding to each sample hub.

[0115] When the low-temperature test result, the normal-temperature test result and the high-temperature test result in all the test records of the same HID are all passed, the HID is determined as the best HID corresponding to each serial presence detect hub in the same wafer. That is to say, the best HID corresponding to each serial presence detect hub in the same wafer is the same. By selecting the test sample, the test time is reduced, and thus the efficiency of the HSA pin resistance recommendation test is improved.

[0116] In order to more clearly illustrate the HSA pin resistance value selection method provided in the embodiment of the present application, please refer to Figure 5 , which is exemplarily described by taking the serial presence detect hub tested under the low-temperature environment as an example.

[0117] Step 1, start the serial presence detect hub.

[0118] Step 2, take one preset resistance value from a plurality of preset resistance values as a resistance value to be connected.

[0119] Step 3, set the analog resistance to the resistance to be connected, and connect the resistance to be connected to the HSA pin.

[0120] Step 4, write the HID corresponding to the resistance value to be connected into the trimming area in the serial presence detect hub.

[0121] Since the trimming area can only write a three-bit HID, the old HID in the trimming area needs to be erased before recording the following HID, and the HID corresponding to the resistance to be connected in this round of processing is written into the trimming area.

[0122] Step 5, judge whether the HSDA pin of the serial presence detect hub receives an ACK signal.

[0123] If the HSDA pin does not receive an ACK signal, step 6 is executed; if the HSDA pin receives an ACK signal, step 7 is executed.

[0124] Step 6, set the test result of the HID corresponding to the resistance value to be connected as failed.

[0125] Step 7, set the test result of the HID corresponding to the resistance value to be connected as passed.

[0126] Step 8, save the test result of the HID corresponding to the resistance value to be connected to the non-volatile memory.

[0127] Step 9, judge whether all preset resistance values have been tested.

[0128] If not, step 10 is executed; if yes, step 11 is executed.

[0129] Step 10, take the next preset resistance value as the resistance value to be connected, and jump back to step 3 for execution.

[0130] Step 11, the low-temperature test is completed.

[0131] Continue to place the chip tester in normal temperature and high temperature in turn to complete the normal temperature test and high temperature test by executing steps 2-11. Finally, the HID corresponding to the preset resistance value whose test results in low temperature, normal temperature and high temperature are all passed in the serial presence detect hub is determined as the best HID, and the best HID is saved in the non-volatile memory.

[0132] It should be noted that, assuming that the test result of the serial presence detect hub in a low temperature environment is saved into the nonvolatile memory, when the low temperature check is performed, if the value of the trimming area is 0 (representing failure), the corresponding low temperature test result in the nonvolatile memory can be written into the trimming area again, and then the value in the trimming area is checked whether it is 1 (representing pass), so as to improve the HSA pin yield.

[0133] Based on the same inventive concept, the basic principle and the generated technical effects of the HSA pin resistance value selection device provided by the embodiments of the present application are the same as those of the above-mentioned embodiments. For brevity of description, some parts of the present embodiment are not mentioned, and the corresponding contents of the above-mentioned embodiments can be referred to.

[0134] Please refer to Figure 6 , Figure 6 A block schematic diagram of the HSA pin resistance value selection device 300 provided by the embodiments of the present application is shown in FIG. 3. The HSA pin resistance value selection device 300 comprises an access module 301, a test module 302 and a selection module 303.

[0135] The access module 301 is configured to sequentially access different preset resistance values for the HSA pin; each preset resistance value corresponds to an HID.

[0136] The test module 302 is configured to obtain the test results of the serial presence detect hub in low temperature, normal temperature and high temperature based on the preset resistance values.

[0137] The selection module 303 is configured to determine the HID corresponding to the preset resistance value as the best HID when the test results of the serial presence detect hub in low temperature, normal temperature and high temperature corresponding to the preset resistance value are all pass, and save the best HID in the nonvolatile memory, so that the user can access the corresponding preset resistance value based on the best HID. The test results of the serial presence detect hub in low temperature, normal temperature and high temperature are all pass, which indicates that the serial presence detect hub works normally in low temperature, normal temperature and high temperature.

[0138] In summary, the HSA pin resistance value selection device provided by the embodiments of the present application sequentially accesses different preset resistance values for the HSA pin; obtains the test results of the serial presence detect hub in low temperature, normal temperature and high temperature based on the preset resistance values; and determines the HID corresponding to the preset resistance value as the best HID when the test results of the serial presence detect hub in low temperature, normal temperature and high temperature corresponding to the preset resistance value are all pass, and saves the best HID in the nonvolatile memory, so that the user can access the corresponding preset resistance value based on the best HID.

[0139] It can be seen that the embodiment of the application creatively embeds a nonvolatile memory in the serial presence detect hub, and uses the nonvolatile memory to persistently save the HID, i.e. the optimal HID, of the serial presence detect hub which can normally work at low temperature, normal temperature and high temperature. When the serial presence detect hub is used, the user can directly obtain the optimal HID in the nonvolatile memory of the serial presence detect hub, and access the preset resistance value corresponding to the optimal HID for the HSA pin of the serial presence detect hub, thereby saving the test time of the user and improving the use experience of the user.

[0140] Optionally, the nonvolatile memory stores test records of the respective HID, and the test records include the HID, a low-temperature test result, a normal-temperature test result and a high-temperature test result. The test module is specifically configured to determine the corresponding test record according to the HID corresponding to the preset resistance value, test the serial presence detect hub in a low-temperature environment to obtain the low-temperature test result in the test record corresponding to the HID, test the serial presence detect hub in a normal-temperature environment to obtain the normal-temperature test result in the test record corresponding to the HID, and test the serial presence detect hub in a high-temperature environment to obtain the high-temperature test result in the test record corresponding to the HID.

[0141] Optionally, the serial presence detect hub further includes an HSDA pin. The test module is specifically configured to set the low-temperature test result in the test record corresponding to the HID as passed when the HSDA pin receives an ACK signal in the low-temperature environment, and set the low-temperature test result in the test record corresponding to the HID as failed when the HSDA pin does not receive the ACK signal in the low-temperature environment.

[0142] Optionally, the serial presence detect hub further includes an HSDA pin. The test module is specifically configured to set the normal-temperature test result in the test record corresponding to the HID as passed when the HSDA pin receives an ACK signal in the normal-temperature environment, and set the normal-temperature test result in the test record corresponding to the HID as failed when the HSDA pin does not receive the ACK signal in the normal-temperature environment.

[0143] Optionally, the serial presence detect hub further includes an HSDA pin. The test module is specifically configured to set the high-temperature test result in the test record corresponding to the HID as passed when the HSDA pin receives an ACK signal in the high-temperature environment, and set the high-temperature test result in the test record corresponding to the HID as failed when the HSDA pin does not receive the ACK signal in the high-temperature environment.

[0144] Optionally, the selection module 303 is further configured to erase the low-temperature test result and / or the high-temperature test result in the respective test record and erase the optimal HID in the nonvolatile memory when the low temperature and / or the high temperature changes.

[0145] The access module 301 is configured to sequentially access different preset resistance values to the HSA pin.

[0146] The test module 302 is further configured to obtain test results of the serial presence detect hub at the updated low temperature and / or the updated high temperature based on the preset resistance value, and update the low-temperature test result and / or the high-temperature test result in the test record by using the new test result.

[0147] The selection module 303 is further configured to determine a new optimal HID according to the low-temperature test result, the normal-temperature test result and the high-temperature test result in the updated test record.

[0148] Optionally, the access module 301 is further configured to sequentially access different preset resistance values to the HSA pin of a plurality of sample hubs, and the plurality of sample hubs are selected from a plurality of serial presence detect hubs in the same wafer.

[0149] The test module 302 is further configured to obtain test results of each sample hub at the low temperature, the normal temperature and the high temperature based on the preset resistance value.

[0150] The selection module 303 is further configured to determine the HID corresponding to the preset resistance value as the optimal HID when the test results of all sample hubs corresponding to the preset resistance value at the low temperature, the normal temperature and the high temperature are all passed.

[0151] Please refer to Figure 7 , Figure 7 A block schematic diagram of a chip testing machine 100 provided by the embodiments of the present application is shown. The chip testing machine 100 is installed with a serial presence detect hub 110, and the chip testing machine 100 can implement the HSA pin resistance value selection method disclosed in the above embodiments.

[0152] The embodiments of the present application further provide a computer readable storage medium, which stores a computer program, and the computer program is executed by the chip testing machine 100 to implement the HSA pin resistance value selection method disclosed in the above embodiments.

[0153] The embodiments of the present application further provide a program product, and the program product is executed by the chip testing machine 100 to implement the HSA pin resistance value selection method disclosed in the above embodiments.

[0154] In several embodiments provided in the present application, it should be understood that the disclosed apparatus and method can also be implemented by other manners. The apparatus embodiments described above are merely illustrative, for example, the flowcharts and block diagrams in the drawings show the possible implementation architecture, function and operation of the apparatus, method and computer program product according to the embodiments of the present application. In this regard, each block in the flowcharts or block diagrams can represent a module, a program segment or a part of code, which contains one or more executable instructions for implementing the specified logic function. It should also be noted that in some alternative implementations, the functions noted in the blocks can occur in different orders from those noted in the drawings. For example, two consecutive blocks can actually be executed substantially in parallel, and they can also be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and the combination of blocks in the block diagrams and / or flowcharts, can be implemented by a dedicated hardware-based system for executing the specified functions or actions, or can be implemented by a combination of dedicated hardware and computer instructions.

[0155] In addition, the function modules in the embodiments of the present application can be integrated together to form an independent part, or each module can exist independently, or two or more modules can be integrated to form an independent part.

[0156] If the functions are implemented in the form of software function modules and sold or used as independent products, they can be stored in a computer readable storage medium. Based on this understanding, the technical solutions of the present application or the part of the present application that essentially contributes to the prior art or the part of the technical solutions can be embodied in the form of a software product, which is stored in a storage medium and includes a number of instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the method described in the embodiments of the present application. The aforementioned storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM, Read-Only Memory), a random access memory (RAM, Random Access Memory), a magnetic disk or an optical disk, and various media that can store program codes.

[0157] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A method for selecting the resistance value of an HSA pin, characterized in that, The application is applied to a chip testing machine, wherein a serial presence detect hub is installed on the chip testing machine, and the serial presence detect hub comprises a non-volatile memory and an HSA pin; the method comprises the following steps: sequentially connecting different preset resistance values to the HSA pin; each preset resistance value corresponds to an HID; based on the preset resistance value, obtaining test results of the serial presence detect hub under low temperature, normal temperature and high temperature; when the test results of the serial presence detect hub under low temperature, normal temperature and high temperature corresponding to the preset resistance value are all passed, determining the HID corresponding to the preset resistance value as the optimal HID, and saving the optimal HID in the non-volatile memory, so that the user can connect the corresponding preset resistance value based on the optimal HID; the test results of the serial presence detect hub under low temperature, normal temperature and high temperature are all passed, which indicates that the serial presence detect hub works normally under low temperature, normal temperature and high temperature.

2. The HSA pin resistance value selection method of claim 1, wherein, the non-volatile memory stores test records of each HID, and the test records comprise an HID, a low-temperature test result, a normal-temperature test result and a high-temperature test result; the method for obtaining the test results of the serial presence detect hub under low temperature, normal temperature and high temperature based on the preset resistance value comprises the following steps: determining the corresponding test record according to the HID corresponding to the preset resistance value; testing the serial presence detect hub under a low-temperature environment to obtain the low-temperature test result in the test record corresponding to the HID; testing the serial presence detect hub under a normal-temperature environment to obtain the normal-temperature test result in the test record corresponding to the HID; testing the serial presence detect hub under a high-temperature environment to obtain the high-temperature test result in the test record corresponding to the HID.

3. The HSA pin resistance value selection method of claim 2, wherein, the serial presence detect hub further comprises an HSDA pin; the method for testing the serial presence detect hub under a low-temperature environment to obtain the low-temperature test result in the test record corresponding to the HID comprises the following steps: when the HSDA pin receives an ACK signal under a low-temperature environment, setting the low-temperature test result in the test record corresponding to the HID as passed; when the HSDA pin does not receive an ACK signal under a low-temperature environment, setting the low-temperature test result in the test record corresponding to the HID as failed.

4. The HSA pin resistance value selection method of claim 2, wherein, the serial presence detect hub further comprises an HSDA pin; the method for testing the serial presence detect hub under a normal-temperature environment to obtain the normal-temperature test result in the test record corresponding to the HID comprises the following steps: when the HSDA pin receives an ACK signal under a normal-temperature environment, setting the normal-temperature test result in the test record corresponding to the HID as passed; when the HSDA pin does not receive an ACK signal under a normal-temperature environment, setting the normal-temperature test result in the test record corresponding to the HID as failed.

5. The HSA pin resistance value selection method of claim 2, wherein, the serial presence detect hub further comprises an HSDA pin; the method for testing the serial presence detect hub under a high-temperature environment to obtain the high-temperature test result in the test record corresponding to the HID comprises the following steps: When the HSDA pin receives an ACK signal in a high-temperature environment, set the high-temperature test result in the test record corresponding to the HID as passed; When the HSDA pin does not receive an ACK signal in a high-temperature environment, set the high-temperature test result in the test record corresponding to the HID as failed.

6. The HSA pin resistance value selection method of claim 2, wherein, The method further comprises: When the low temperature and / or the high temperature changes, erase the low-temperature test result and / or the high-temperature test result in each test record, and erase the best HID in the non-volatile memory; sequentially connect different preset resistance values to the HSA pin, and based on the preset resistance values, obtain the test results of the serial presence detect hub in the updated low temperature and / or the updated high temperature; update the low-temperature test result and / or the high-temperature test result in the test record with the new test result; determine a new best HID according to the low-temperature test result, the normal-temperature test result and the high-temperature test result in the updated test record.

7. The HSA pin resistance value selection method of claim 1, wherein, The method further comprises: sequentially connect different preset resistance values to the HSA pin of a plurality of sample hubs; the plurality of sample hubs are selected from a plurality of serial presence detect hubs in the same wafer; based on the preset resistance values, obtain the test results of each sample hub in the low temperature, the normal temperature and the high temperature; when the test results of all sample hubs corresponding to the preset resistance values in the low temperature, the normal temperature and the high temperature are all passed, determine the HID corresponding to the preset resistance value as the best HID.

8. The HSA pin resistance value selection method of claim 2, wherein, The non-volatile memory is further provided with a trimming bit area; when the test results of the serial presence detect hub corresponding to the preset resistance value in the low temperature, the normal temperature and the high temperature are all passed, determine the HID corresponding to the preset resistance value as the best HID, and save the best HID in the non-volatile memory, which comprises: traverse each test record in the non-volatile memory, if the low-temperature test result, the normal-temperature test result and the high-temperature test result in the test record are all passed, determine the HID in the test record as the best HID; save the best HID into the trimming bit area.

9. An HSA pin resistance value selection apparatus, comprising: The device is applied to a chip testing machine, the chip testing machine is installed with a serial presence detect hub, the serial presence detect hub comprises a non-volatile memory and an HSA pin; the device comprises: a connection module, configured to sequentially connect different preset resistance values to the HSA pin; each preset resistance value corresponds to an HID; a test module, configured to obtain the test results of the serial presence detect hub in the low temperature, the normal temperature and the high temperature based on the preset resistance values; a determination module, configured to determine the HID corresponding to the preset resistance value as the best HID when the test results of all sample hubs corresponding to the preset resistance values in the low temperature, the normal temperature and the high temperature are all passed. The selection module is configured to determine the preset resistance value corresponding to the HID as an optimal HID when the test results of the serial presence detect hub corresponding to the preset resistance value at low temperature, normal temperature and high temperature are all passed, and save the optimal HID in the non-volatile memory, so that a user accesses the corresponding preset resistance value based on the optimal HID. The test results of the serial presence detect hub at low temperature, normal temperature and high temperature are all passed, indicating that the serial presence detect hub works normally at low temperature, normal temperature and high temperature.

10. A computer-readable storage medium having stored thereon a computer program, characterized in that, The computer program is executed by a chip tester to implement the HSA pin resistance value selection method according to any one of claims 1-8.

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