Fault monitoring and early warning method and system for semiconductor cleaning equipment

Abstract

The invention discloses a fault monitoring and early warning method and system for semiconductor cleaning equipment, and relates to the technical field of monitoring analysis, and the system comprises an information collection module which is used for collecting equipment information and video information corresponding to the semiconductor cleaning equipment; the analysis module is used for analyzing and processing the equipment information and the video information corresponding to the semiconductor cleaning equipment, analyzing the safety of the semiconductor cleaning equipment based on an analysis and processing result, and further formulating an early warning strategy according to a safety analysis result; the early warning module is used for executing an early warning strategy and outputting an alarm signal to the semiconductor cleaning equipment; and the risk estimation module is used for estimating the risk value of the semiconductor cleaning equipment in a future period of time. The semiconductor cleaning equipment has the effect of improving the cleaning efficiency of the semiconductor cleaning equipment.

Description

Technical Field

[0001] The present application relates to the field of monitoring and analysis technology, and in particular to a fault monitoring and early warning method and system for semiconductor cleaning equipment. Background Art

[0002] Semiconductor cleaning equipment is one of the key equipment to ensure the cleanliness of the wafer surface. Cleaning equipment removes impurities such as particles, metal pollutants and organic matter remaining on the wafer surface through chemical solutions, ultrasound, spraying and other methods to ensure the smooth progress of subsequent processes. With the continuous improvement of semiconductor process technology, the size of devices is getting smaller and smaller, and the manufacturing precision requirements are getting higher and higher. The role of cleaning equipment is becoming more and more important. However, the operating state of the cleaning equipment is complex, involving the precise control of multiple parameters such as the temperature, pressure, flow rate, and concentration of the cleaning liquid. Abnormal fluctuations in any parameter may lead to poor cleaning results, which in turn affects the yield of the wafer and the performance of the device.

[0003] In the related technology, the existing fault monitoring and early warning technology for semiconductor cleaning equipment does not monitor and analyze the faults of semiconductor cleaning equipment from multiple angles (cleaning equipment type, operating data, etc.), which increases the occurrence of faults in semiconductor cleaning equipment during use and reduces the working efficiency of semiconductor cleaning equipment. There is room for improvement. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present application provides a fault monitoring and early warning method and system for semiconductor cleaning equipment.

[0005] In a first aspect, the present application provides a fault monitoring and early warning system for semiconductor cleaning equipment, comprising: An information collection module, used to collect equipment information and video information corresponding to semiconductor cleaning equipment; An analysis module, used to analyze and process the equipment information and video information corresponding to the semiconductor cleaning equipment, and analyze the safety of the semiconductor cleaning equipment based on the results of the analysis and processing, and then formulate an early warning strategy according to the safety analysis results; An early warning module, used to execute the early warning strategy and output an alarm signal to the semiconductor cleaning equipment; The risk estimation module is used to estimate the risk value of the semiconductor cleaning equipment in the future.

[0006] Preferably, the analysis module includes an information identification unit, an information analysis unit and an abnormality marking unit; The information identification unit is used to obtain type information, operation information and abnormal mark information corresponding to the semiconductor cleaning equipment according to the equipment information corresponding to the semiconductor cleaning equipment, wherein the operation information corresponding to the semiconductor cleaning equipment includes vibration frequency information, cleaning liquid concentration information and pressure value information corresponding to the semiconductor cleaning equipment when it is working; The information analysis unit is used to comprehensively analyze the type information, operation information, fault mark information and video information corresponding to the semiconductor cleaning equipment; The abnormal marking unit is used to mark abnormal semiconductor cleaning equipment and confirm the marking number information.

[0007] Preferably, the process of analyzing and processing the video information specifically includes: Based on a preset camera device, video information corresponding to the semiconductor cleaning equipment when it is in working state is obtained, and view information corresponding to each semiconductor device after cleaning is obtained from the video information; Compare and identify the corresponding view information of each semiconductor device after cleaning with the standard view, obtain the corresponding key area of ​​each semiconductor device, and then confirm the cleaning evaluation coefficient corresponding to each key area in each semiconductor device ,in, Indicates the number corresponding to each semiconductor device, , Indicates the number corresponding to each key area, ; By formula , confirm the comprehensive cleaning evaluation coefficient corresponding to the semiconductor cleaning equipment ,in, Expressed as Among semiconductor devices The regional weight coefficient corresponding to each key area is: Expressed as The cleanliness assessment coefficient corresponding to other areas of a semiconductor device.

[0008] Preferably, a comprehensive analysis is performed on the type information, operation information, fault mark information and video information corresponding to the semiconductor cleaning equipment, specifically including: The risk value of failure of semiconductor cleaning equipment is estimated, and the estimation process is as follows: By formula , confirm the risk assessment factor of semiconductor cleaning equipment failure ; in, Expressed as the type coefficient corresponding to the semiconductor cleaning equipment, It is expressed as the number of marks corresponding to the semiconductor cleaning equipment, and e is a natural constant; Risk assessment factor for failure of semiconductor cleaning equipment Compared with the preset risk assessment threshold Make a comparison; Risk assessment factor if semiconductor cleaning equipment fails When the semiconductor cleaning equipment is used, there is no need to analyze the safety of the semiconductor cleaning equipment; Risk assessment factor if semiconductor cleaning equipment fails When the semiconductor cleaning equipment is used for cleaning, the safety of the semiconductor cleaning equipment needs to be analyzed.

[0009] Preferably, the process of analyzing the safety of the semiconductor cleaning equipment specifically includes: In the selected time window, the cleaning stages corresponding to the semiconductor cleaning equipment are confirmed, and then the curves of the vibration frequency information of the semiconductor cleaning equipment in each cleaning stage changing with time are obtained based on the vibration frequency information, cleaning liquid concentration information and pressure value information corresponding to the operation of the semiconductor cleaning equipment. , Curve of cleaning fluid concentration changing with time The curve of pressure value information changing with time ,in, It represents the number corresponding to each cleaning stage. ; By formula , confirm the fault assessment coefficients corresponding to each cleaning stage of semiconductor cleaning equipment ; in, Respectively represent the semiconductor cleaning equipment working Each cleaning stage corresponds to the preset standard vibration frequency and standard pressure value. Indicates the semiconductor cleaning equipment is working The curve of standard cleaning solution concentration changing with time corresponding to each cleaning stage, are respectively represented as preset weight coefficients, They are respectively represented as the time interval corresponding to each cleaning stage; The fault assessment coefficients corresponding to each cleaning stage of semiconductor cleaning equipment With the preset fault assessment threshold Make a comparison; If the fault assessment coefficients corresponding to each cleaning stage of semiconductor cleaning equipment Both lower than There is no need to formulate early warning strategies; If there is a fault assessment coefficient corresponding to the cleaning stage , a braking warning strategy is required for the cleaning phase.

[0010] Preferably, the process of the cleaning phase braking warning strategy specifically includes: By formula , confirm the comprehensive evaluation coefficient corresponding to the cleaning stage ,in, Respectively represented as preset weight coefficients; The comprehensive evaluation coefficient corresponding to the cleaning stage Compared with the preset comprehensive evaluation threshold Make a comparison; If the comprehensive evaluation coefficient corresponding to the cleaning stage When the cleaning phase is completed, a warning signal is output based on the cleaning phase; If the comprehensive evaluation coefficient corresponding to the cleaning stage When the cleaning phase fails, the cleaning phase is maintained while outputting an early warning signal based on the cleaning phase.

[0011] Preferably, abnormal semiconductor cleaning equipment is marked and the number of markings is confirmed, specifically including: Confirm that the semiconductor cleaning equipment is in working condition, and then obtain the fluctuation data corresponding to the electrical information of the semiconductor cleaning equipment when it is in working condition through a preset monitoring device, the electrical information includes voltage value, current value and temperature value, and when the fluctuation data corresponding to the electrical information exceeds the preset fluctuation threshold, the semiconductor cleaning equipment is marked once and a fluctuation warning signal is output.

[0012] Preferably, estimating the risk value of the semiconductor cleaning equipment in the future period of time specifically includes: In the preset time period, the fault assessment coefficients corresponding to each cleaning stage of the semiconductor cleaning equipment are collected in real time, and the real-time change curve of the fault assessment coefficients corresponding to each cleaning stage over time is established. ; By formula , confirm the change coefficient of the fault assessment coefficient corresponding to each cleaning stage of the semiconductor cleaning equipment ; The coefficient of change of the fault assessment coefficient corresponding to each cleaning stage of the semiconductor cleaning equipment Preset change thresholds corresponding to each cleaning stage Make a comparison; If there is a corresponding cleaning phase , it is determined that the risk value of the cleaning stage in the future period will increase, and it is necessary to warn the management personnel.

[0013] In a second aspect, the present application provides a fault monitoring and early warning method for semiconductor cleaning equipment, comprising the following steps: Collect equipment information and video information corresponding to semiconductor cleaning equipment; Analyze and process the equipment information and video information corresponding to the semiconductor cleaning equipment, and analyze the safety of the semiconductor cleaning equipment based on the results of the analysis and processing, and then formulate an early warning strategy according to the safety analysis results; Executing the early warning strategy and outputting an alarm signal to the semiconductor cleaning equipment; Estimate the risk value of the semiconductor cleaning equipment in the future.

[0014] In a third aspect, the present application provides a computer-readable storage medium storing instructions, which, when executed on a computer, enables the computer to execute any one of the above-described fault monitoring and early warning systems for semiconductor cleaning equipment.

[0015] In summary, the present application includes at least one of the following beneficial technical effects: 1. The present invention provides a fault monitoring and early warning system for semiconductor cleaning equipment, which collects and analyzes equipment information and video information corresponding to the semiconductor cleaning equipment, thereby confirming a risk assessment coefficient of a fault in the semiconductor cleaning equipment, and comparing the risk assessment coefficient of a fault in the semiconductor cleaning equipment with a preset risk assessment threshold, thereby analyzing the safety of the semiconductor cleaning equipment based on the comparison result, further confirming the fault assessment coefficient corresponding to each cleaning stage of the semiconductor cleaning equipment, and formulating an early warning strategy based on the fault assessment coefficient corresponding to each cleaning stage of the semiconductor cleaning equipment, thereby effectively reducing the occurrence of a fault in the semiconductor cleaning equipment during use and reducing the working efficiency of the semiconductor cleaning equipment; 2. By collecting the fault assessment coefficients corresponding to each cleaning stage of the semiconductor cleaning equipment in real time, and then establishing a real-time change curve of the fault assessment coefficient corresponding to each cleaning stage over time, and then confirming the change coefficient of the fault assessment coefficient corresponding to each cleaning stage of the semiconductor cleaning equipment, the change coefficient of the fault assessment coefficient corresponding to each cleaning stage of the semiconductor cleaning equipment is compared with the preset change threshold value corresponding to each cleaning stage, and then estimating the risk value of the semiconductor cleaning equipment in the future period, so as to effectively make early warnings, further reduce the occurrence of semiconductor cleaning equipment failures, thereby effectively reducing the occurrence of semiconductor cleaning equipment failures during use and reducing the working efficiency of the semiconductor cleaning equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0017] Figure 1 It is a system schematic diagram of fault monitoring and early warning of semiconductor cleaning equipment in an embodiment of the present application.

[0018] Figure 2 It is a flow chart of the method for fault monitoring and early warning of semiconductor cleaning equipment in an embodiment of the present application. DETAILED DESCRIPTION

[0019] The following is combined with Figure 1-2 This application is described in further detail.

[0020] Example 1 The embodiment of the present application discloses a fault monitoring and early warning system for semiconductor cleaning equipment.

[0021] Reference Figure 1 , a fault monitoring and early warning system for semiconductor cleaning equipment, comprising: An information collection module, used to collect equipment information and video information corresponding to semiconductor cleaning equipment; An analysis module, used to analyze and process the equipment information and video information corresponding to the semiconductor cleaning equipment, and analyze the safety of the semiconductor cleaning equipment based on the results of the analysis and processing, and then formulate an early warning strategy according to the safety analysis results; An early warning module, used to execute the early warning strategy and output an alarm signal to the semiconductor cleaning equipment; The risk estimation module is used to estimate the risk value of the semiconductor cleaning equipment in the future.

[0022] Further, the analysis module includes an information identification unit, an information analysis unit and an abnormality marking unit; The information identification unit is used to obtain type information, operation information and abnormal mark information corresponding to the semiconductor cleaning equipment according to the equipment information corresponding to the semiconductor cleaning equipment, wherein the operation information corresponding to the semiconductor cleaning equipment includes vibration frequency information, cleaning liquid concentration information and pressure value information corresponding to the semiconductor cleaning equipment when it is working; The information analysis unit is used to comprehensively analyze the type information, operation information, fault mark information and video information corresponding to the semiconductor cleaning equipment; The abnormal marking unit is used to mark abnormal semiconductor cleaning equipment and confirm the marking number information.

[0023] It should be noted that the process of analyzing and processing video information specifically includes: Based on a preset camera device, video information corresponding to the semiconductor cleaning equipment when it is in working state is obtained, and view information corresponding to each semiconductor device after cleaning is obtained from the video information; Compare and identify the corresponding view information of each semiconductor device after cleaning with the standard view, obtain the corresponding key area of ​​each semiconductor device, and then confirm the cleaning evaluation coefficient corresponding to each key area in each semiconductor device ,in, Indicates the number corresponding to each semiconductor device, , Indicates the number corresponding to each key area, ; In an embodiment of the present application, an online detection system (such as optical detection, surface analysis, particle counting, etc.) is used to evaluate the surface cleanliness of key areas and other areas after cleaning, and the cleaning effect is quantified by combining indicators such as particle residue and metal ion concentration. Through historical data and machine learning algorithms, a cleaning model for each area can be established, and then the cleaning evaluation coefficient can be calculated.

[0024] By formula , confirm the comprehensive cleaning evaluation coefficient corresponding to the semiconductor cleaning equipment ,in, Expressed as Among semiconductor devices The regional weight coefficient corresponding to each key area is: Expressed as The cleanliness assessment coefficients corresponding to other areas of a semiconductor device are: Expressed as Among semiconductor devices The regional weight coefficients corresponding to the key areas can be obtained by fitting the historical data.

[0025] Specifically, by using the cleaning evaluation coefficients of each key area and other areas during the cleaning process of semiconductor cleaning equipment, it is confirmed that the comprehensive cleaning evaluation coefficient can significantly improve the overall evaluation accuracy of the cleaning effect and the equipment control efficiency. Different areas of semiconductor devices have different requirements for cleanliness. Key areas (such as wafer surfaces, contact points, etc.) are highly sensitive to particulate contamination, while the requirements for other areas are relatively loose. By calculating the cleaning evaluation coefficients of key areas and non-key areas separately and comprehensively deriving the overall cleaning evaluation coefficient, it can ensure that the equipment meets the cleaning requirements of all areas while focusing on optimizing the cleaning quality of key areas. The comprehensive cleaning evaluation coefficient can enhance the equipment's fault diagnosis capabilities, promptly detect uneven cleaning or equipment abnormalities, and ultimately improve production yields and equipment operation stability.

[0026] Furthermore, a comprehensive analysis is performed on the type information, operation information, fault mark information and video information corresponding to the semiconductor cleaning equipment, including: The risk value of failure of semiconductor cleaning equipment is estimated, and the estimation process is as follows: By formula , confirm the risk assessment factor of semiconductor cleaning equipment failure ; in, Expressed as the type coefficient corresponding to the semiconductor cleaning equipment, It is expressed as the number of marks corresponding to the semiconductor cleaning equipment, and e is a natural constant; Risk assessment factor for failure of semiconductor cleaning equipment Compared with the preset risk assessment threshold Make a comparison; Risk assessment factor if semiconductor cleaning equipment fails When the semiconductor cleaning equipment is used, there is no need to analyze the safety of the semiconductor cleaning equipment; Risk assessment factor if semiconductor cleaning equipment fails When the semiconductor cleaning equipment is used for cleaning, the safety of the semiconductor cleaning equipment needs to be analyzed.

[0027] Specifically, It is expressed as the type coefficient corresponding to the semiconductor cleaning equipment, that is, the probability of failure of this type of semiconductor cleaning equipment. The higher the probability of failure, the larger the type coefficient corresponding to the semiconductor cleaning equipment. It is represented by the number of marks corresponding to the semiconductor cleaning equipment, that is, the more the number of marks, the greater the probability of failure of the semiconductor cleaning equipment. The type coefficient corresponding to the semiconductor cleaning equipment can be obtained by fitting historical data; It should be noted that the process of analyzing the safety of the semiconductor cleaning equipment specifically includes: In the selected time window, the cleaning stages corresponding to the semiconductor cleaning equipment are confirmed, and then the curves of the vibration frequency information of the semiconductor cleaning equipment in each cleaning stage changing with time are obtained based on the vibration frequency information, cleaning liquid concentration information and pressure value information corresponding to the operation of the semiconductor cleaning equipment. , Curve of cleaning fluid concentration changing with time The curve of pressure value information changing with time ,in, It is represented by the number corresponding to each cleaning stage. ; By formula , confirm the fault assessment coefficients corresponding to each cleaning stage of semiconductor cleaning equipment ; in, Respectively represent the semiconductor cleaning equipment working Each cleaning stage corresponds to the preset standard vibration frequency and standard pressure value. Indicates the semiconductor cleaning equipment is working The curve of standard cleaning solution concentration changing with time corresponding to each cleaning stage, are respectively represented as preset weight coefficients, They are respectively represented as the time interval corresponding to each cleaning stage; The fault assessment coefficients corresponding to each cleaning stage of semiconductor cleaning equipment With the preset fault assessment threshold Make a comparison; If the fault assessment coefficients corresponding to each cleaning stage of semiconductor cleaning equipment Both lower than There is no need to formulate early warning strategies; If there is a fault assessment coefficient corresponding to the cleaning stage , a braking warning strategy is required for the cleaning phase.

[0028] Specifically, based on the vibration frequency, cleaning fluid concentration and pressure value information of the semiconductor cleaning equipment during operation, confirming the fault assessment coefficient of each cleaning stage can significantly improve the accuracy of equipment fault detection and prevention. Abnormal vibration frequency is usually an early sign of mechanical failure, fluctuations in cleaning fluid concentration directly affect the cleaning effect, and abnormal pressure values ​​may lead to insufficient cleaning or equipment damage. By real-time monitoring of the above key parameters and combining the process requirements of each cleaning stage, the corresponding fault assessment coefficient is calculated, which can help identify potential fault trends. For example, abnormal vibration frequency may mean pump or pipeline problems, while deviations in cleaning fluid concentration may indicate a fault in the proportioning system. Abnormal pressure values ​​may reflect equipment overload or leakage. The fault assessment coefficient based on the above information can provide early warning of semiconductor cleaning equipment problems, reduce downtime, improve equipment operation stability, and optimize maintenance plans.

[0029] Furthermore, the process of the braking warning strategy in the cleaning phase specifically includes: By formula , confirm the comprehensive evaluation coefficient corresponding to the cleaning stage ,in, Respectively represented as preset weight coefficients; The comprehensive evaluation coefficient corresponding to the cleaning stage Compared with the preset comprehensive evaluation threshold Make a comparison; If the comprehensive evaluation coefficient corresponding to the cleaning stage When the cleaning phase is completed, a warning signal is output based on the cleaning phase; If the comprehensive evaluation coefficient corresponding to the cleaning stage When the cleaning phase fails, the cleaning phase is maintained while outputting an early warning signal based on the cleaning phase.

[0030] Furthermore, abnormal semiconductor cleaning equipment is marked and the number of markings is confirmed, including: Confirm that the semiconductor cleaning equipment is in working condition, and then obtain the fluctuation data corresponding to the electrical information of the semiconductor cleaning equipment when it is in working condition through a preset monitoring device, the electrical information includes voltage value, current value and temperature value, and when the fluctuation data corresponding to the electrical information exceeds the preset fluctuation threshold, the semiconductor cleaning equipment is marked once and a fluctuation warning signal is output.

[0031] It should be noted that the estimated risk value of the semiconductor cleaning equipment in the future includes: In the preset time period, the fault assessment coefficients corresponding to each cleaning stage of the semiconductor cleaning equipment are collected in real time, and the real-time change curve of the fault assessment coefficients corresponding to each cleaning stage over time is established. ; By formula , confirm the change coefficient of the fault assessment coefficient corresponding to each cleaning stage of the semiconductor cleaning equipment ; The coefficient of change of the fault assessment coefficient corresponding to each cleaning stage of the semiconductor cleaning equipment Preset change thresholds corresponding to each cleaning stage Make a comparison; If there is a corresponding cleaning phase , it is determined that the risk value of the cleaning stage in the future period will increase, and it is necessary to warn the management personnel.

[0032] Example 2 The embodiment of the present application also discloses a fault monitoring and early warning method for semiconductor cleaning equipment.

[0033] Reference Figure 2 , a fault monitoring and early warning method for semiconductor cleaning equipment, comprising the following steps: Collect equipment information and video information corresponding to semiconductor cleaning equipment; Analyze and process the equipment information and video information corresponding to the semiconductor cleaning equipment, and analyze the safety of the semiconductor cleaning equipment based on the results of the analysis and processing, and then formulate an early warning strategy according to the safety analysis results; Executing the early warning strategy and outputting an alarm signal to the semiconductor cleaning equipment; Estimate the risk value of the semiconductor cleaning equipment in the future.

[0034] The above contents are merely examples and explanations of the concept of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the concept of the invention, they should all fall within the protection scope of the present invention.

[0035] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0036] The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to specific implementation methods. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well.

Claims

1. A fault monitoring and early warning system for semiconductor cleaning equipment, characterized in that: include: An information collection module, used to collect equipment information and video information corresponding to semiconductor cleaning equipment; An analysis module, used to analyze and process the equipment information and video information corresponding to the semiconductor cleaning equipment, and analyze the safety of the semiconductor cleaning equipment based on the results of the analysis and processing, and then formulate an early warning strategy according to the safety analysis results; An early warning module, used to execute the early warning strategy and output an alarm signal to the semiconductor cleaning equipment; The risk estimation module is used to estimate the risk value of the semiconductor cleaning equipment in the future.

2. A fault monitoring and early warning system for semiconductor cleaning equipment according to claim 1, characterized in that: The analysis module includes an information identification unit, an information analysis unit and an abnormality marking unit; The information identification unit is used to obtain type information, operation information and abnormal mark information corresponding to the semiconductor cleaning equipment according to the equipment information corresponding to the semiconductor cleaning equipment, wherein the operation information corresponding to the semiconductor cleaning equipment includes vibration frequency information, cleaning liquid concentration information and pressure value information corresponding to the semiconductor cleaning equipment when it is working; The information analysis unit is used to comprehensively analyze the type information, operation information, fault mark information and video information corresponding to the semiconductor cleaning equipment; The abnormal marking unit is used to mark abnormal semiconductor cleaning equipment and confirm the marking number information.

3. A fault monitoring and early warning system for semiconductor cleaning equipment according to claim 2, characterized in that: The process of analyzing and processing video information specifically includes: Based on a preset camera device, video information corresponding to the semiconductor cleaning equipment when it is in working state is obtained, and view information corresponding to each semiconductor device after cleaning is obtained from the video information; Compare and identify the corresponding view information of each semiconductor device after cleaning with the standard view, obtain the corresponding key area of ​​each semiconductor device, and then confirm the cleaning evaluation coefficient corresponding to each key area in each semiconductor device ,in, Indicates the number corresponding to each semiconductor device, , Indicates the number corresponding to each key area, ; By formula , confirm the comprehensive cleaning evaluation coefficient corresponding to the semiconductor cleaning equipment ,in, Expressed as Among semiconductor devices The regional weight coefficient corresponding to each key area is: Expressed as The cleanliness assessment coefficient corresponding to other areas of a semiconductor device.

4. A fault monitoring and early warning system for semiconductor cleaning equipment according to claim 3, characterized in that: Comprehensive analysis of the type information, operation information, fault mark information and video information corresponding to the semiconductor cleaning equipment, including: The risk value of failure of semiconductor cleaning equipment is estimated, and the estimation process is as follows: By formula , confirm the risk assessment factor of semiconductor cleaning equipment failure ; in, Expressed as the type coefficient corresponding to the semiconductor cleaning equipment, It is expressed as the number of marks corresponding to the semiconductor cleaning equipment, and e is a natural constant; Risk assessment factor for failure of semiconductor cleaning equipment Compared with the preset risk assessment threshold Make a comparison; Risk assessment factor if semiconductor cleaning equipment fails When the semiconductor cleaning equipment is used, there is no need to analyze the safety of the semiconductor cleaning equipment; Risk assessment factor if semiconductor cleaning equipment fails When the semiconductor cleaning equipment is used for cleaning, the safety of the semiconductor cleaning equipment needs to be analyzed.

5. A fault monitoring and early warning system for semiconductor cleaning equipment according to claim 4, characterized in that: The process of analyzing the safety of the semiconductor cleaning equipment specifically includes: In the selected time window, the cleaning stages corresponding to the semiconductor cleaning equipment are confirmed, and then the curves of the vibration frequency information of the semiconductor cleaning equipment in each cleaning stage changing with time are obtained based on the vibration frequency information, cleaning liquid concentration information and pressure value information corresponding to the operation of the semiconductor cleaning equipment. , Curve of cleaning fluid concentration changing with time The curve of pressure value information changing with time ,in, It is represented by the number corresponding to each cleaning stage. ; By formula , confirm the fault assessment coefficients corresponding to each cleaning stage of semiconductor cleaning equipment ; in, Respectively represent the semiconductor cleaning equipment working Each cleaning stage corresponds to the preset standard vibration frequency and standard pressure value. Indicates the semiconductor cleaning equipment is working The curve of standard cleaning solution concentration changing with time corresponding to each cleaning stage, are respectively represented as preset weight coefficients, They are respectively represented as the time interval corresponding to each cleaning stage; The fault assessment coefficients corresponding to each cleaning stage of semiconductor cleaning equipment With the preset fault assessment threshold Make a comparison; If the fault assessment coefficients corresponding to each cleaning stage of semiconductor cleaning equipment Both lower than There is no need to formulate early warning strategies; If there is a fault assessment coefficient corresponding to the cleaning stage , a braking warning strategy is required for the cleaning phase.

6. A fault monitoring and early warning system for semiconductor cleaning equipment according to claim 5, characterized in that: The process of the braking warning strategy in the cleaning stage specifically includes: By formula , confirm the comprehensive evaluation coefficient corresponding to the cleaning stage ,in, Respectively represented as preset weight coefficients; The comprehensive evaluation coefficient corresponding to the cleaning stage Compared with the preset comprehensive evaluation threshold Make a comparison; If the comprehensive evaluation coefficient corresponding to the cleaning stage When the cleaning phase is completed, a warning signal is output based on the cleaning phase; If the comprehensive evaluation coefficient corresponding to the cleaning stage When the cleaning phase fails, the cleaning phase is maintained while outputting an early warning signal based on the cleaning phase.

7. A fault monitoring and early warning system for semiconductor cleaning equipment according to claim 2, characterized in that: Mark abnormal semiconductor cleaning equipment and confirm the number of times it has been marked, including: Confirm that the semiconductor cleaning equipment is in working condition, and then obtain the fluctuation data corresponding to the electrical information of the semiconductor cleaning equipment when it is in working condition through a preset monitoring device, the electrical information includes voltage value, current value and temperature value, and when the fluctuation data corresponding to the electrical information exceeds the preset fluctuation threshold, the semiconductor cleaning equipment is marked once and a fluctuation warning signal is output.

8. A fault monitoring and early warning system for semiconductor cleaning equipment according to claim 5, characterized in that: Estimate the risk value of the semiconductor cleaning equipment in the future, including: In the preset time period, the fault assessment coefficients corresponding to each cleaning stage of the semiconductor cleaning equipment are collected in real time, and the real-time change curve of the fault assessment coefficients corresponding to each cleaning stage over time is established. ; By formula , confirm the change coefficient of the fault assessment coefficient corresponding to each cleaning stage of the semiconductor cleaning equipment ; The coefficient of change of the fault assessment coefficient corresponding to each cleaning stage of the semiconductor cleaning equipment Preset change thresholds corresponding to each cleaning stage Make a comparison; If there is a corresponding cleaning phase , it is determined that the risk value of the cleaning stage in the future period will increase, and it is necessary to warn the management personnel.

9. A fault monitoring and early warning method for semiconductor cleaning equipment, applied to a fault monitoring and early warning system for semiconductor cleaning equipment as claimed in any one of claims 1 to 8, characterized in that: The following steps are involved: Collect equipment information and video information corresponding to semiconductor cleaning equipment; Analyze and process the equipment information and video information corresponding to the semiconductor cleaning equipment, and analyze the safety of the semiconductor cleaning equipment based on the results of the analysis and processing, and then formulate an early warning strategy according to the safety analysis results; Executing the early warning strategy and outputting an alarm signal to the semiconductor cleaning equipment; Estimate the risk value of the semiconductor cleaning equipment in the future.

10. A computer-readable storage medium, characterized in that: Instructions are stored, and when the instructions are run on a computer, the computer executes a fault monitoring and early warning system for semiconductor cleaning equipment as described in any one of claims 1 to 8.

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