MOS chip etching apparatus

Abstract

The application discloses a MOS chip etching equipment and relates to the technical field of MOS chip etching.The MOS chip etching equipment comprises an etching machine body, an inlet and an outlet are formed in the two ends of the etching machine body, an electrostatic adsorption table is fixedly connected to the bottom end of the etching machine body, a control assembly is slidably connected to the top end of the inner wall of the etching machine body, a plurality of spray heads are arranged on the control assembly and are equidistantly distributed along the length direction of the control assembly, the spray heads are fixedly connected to the control assembly, a drive is arranged at the side end of the etching machine body, a guide rod is slidably connected to the drive, and a clamping assembly is fixedly connected to the side end of the guide rod.The control assembly controls the plurality of spray heads to spray etching liquid on MOS chips, so that the MOS chips can be etched in a targeted manner, and each MOS chip can be fully etched by the etching liquid.The clamping assembly can position and place the MOS chips by the drive and the guide rod, so that the MOS chips can be kept at intervals.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of MOS chip etching, in particular to a MOS chip etching device. BACKGROUND

[0002] MOS chip, full name metal oxide semiconductor chip, is a kind of semiconductor device widely used in digital and analog circuits, and MOS technology is one of the most common technologies in modern electronic equipment, which includes metal oxide semiconductor field effect transistor and other devices.

[0003] In the prior art, MOS chips are often etched by etching machines, a large number of MOS chips are placed on the etching machine, the electrostatic chuck on the etching machine directly adsorbs the MOS chips, and then the spray head on the etching machine sprays etching liquid on the MOS chips, so as to realize etching treatment of the MOS chips.

[0004] However, when a large number of MOS chips are etched, the spray head sprays etching liquid on multiple chips, and the etching liquid is not uniformly sprayed when sprayed on multiple chips concentrated together, thereby affecting the etching precision of the MOS chips. SUMMARY

[0005] The purpose of the present application is to provide a MOS chip etching device to solve the technical problem that in the prior art, when a large number of MOS chips are etched, the spray head sprays etching liquid on multiple chips, and the etching liquid is not uniformly sprayed when sprayed on multiple chips concentrated together, thereby affecting the etching precision of the MOS chips.

[0006] The technical problem solved by the present application can be realized by the following technical scheme:

[0007] A MOS chip etching device, comprising:

[0008] An etching machine body, the etching machine body is provided with an inlet and an outlet at both ends, the etching machine body is fixedly connected with an electrostatic adsorption table at the bottom end, and the inner wall top of the etching machine body is slidably connected with a control assembly;

[0009] A spray head, the spray head is provided with a plurality of groups and is equidistantly distributed along the length direction of the control assembly, and the spray head is fixedly connected with the control assembly;

[0010] A driver, the driver is arranged at the side end of the etching machine body, the driver is slidably connected with a guide rod, and the side end of the guide rod is fixedly connected with a clamping assembly.

[0011] As a further scheme of the present application, the control assembly comprises a controller and a control panel, the top end of the controller is slidably connected with the etching machine body, the bottom end of the controller is fixedly connected with the control panel, and the control panel is fixedly connected with the plurality of spray heads.

[0012] As a further scheme of the present application, the etching machine body is provided with a sliding groove in the inner part of each end, and a block door is slidably connected with the inner wall of the sliding groove.

[0013] As a further scheme of the present application, the block door is connected with the inner wall of the sliding groove in a clamping manner.

[0014] As a further scheme of the present application, the bottom part of the guide rod is provided with a conveyor, the conveyor is provided with two groups and is fixedly connected with the two sides of the etching machine body, the side end of the conveyor is fixedly connected with a driver, the clamping assembly is located on the top part of the conveyor, and the driver is fixedly connected with a support plate at the bottom part of the end far away from the clamping assembly.

[0015] As a further scheme of the present application, the clamping assembly comprises a clamp and a clamping plate, the side end of the clamp is fixedly connected with the guide rod, and the clamping plate is provided with two groups and is slidably connected with the bottom part of the clamp.

[0016] As a further scheme of the present application, the side end of the clamp is fixedly connected with a positioner.

[0017] As a further scheme of the present application, the top part of the electrostatic adsorption table is slidably connected with a removal plate, the side end of the electrostatic adsorption table is provided with a recycling groove, the side end of the electrostatic adsorption table is provided with a impurity absorber, and the impurity absorber is fixedly connected with the end of the etching machine body far away from the clamping assembly.

[0018] As a further scheme of the present application, the side end of the removal plate is fixedly connected with a telescopic rod, the etching machine body is provided with a positioning hole, the telescopic rod is slidably connected with the inner wall of the etching machine body, the side end of the telescopic rod is fixedly connected with a telescopic device, and the telescopic device is fixedly connected with the side end of the etching machine body.

[0019] As a further scheme of the present application, the side end of the recycling groove is provided with a discharge pipe, the side end of the electrostatic adsorption table is provided with a connecting hole, the discharge pipe is fixedly connected with the side end of the electrostatic adsorption table, and the connecting hole is in communication with the recycling groove and the discharge pipe at two ends.

[0020] The present application has the following beneficial effects:

[0021] 1、When a large number of MOS chips need to be etched, the driver controls the guide rod to move in and out, the guide rod moves with the clamping assembly, the clamping assembly clamps the MOS chip to pass through the inlet and outlet, the clamping assembly places the MOS chip on the electrostatic adsorption table one by one, and the MOS chips are kept equidistant, at this time, the electrostatic adsorption table runs, the electrostatic adsorption table adsorbs the MOS chip, and then the control assembly controls a plurality of spray heads to spray etching liquid on the MOS chip, so that the etching of a plurality of MOS chips is realized, and each MOS chip can be fully etched by the etching liquid, so that the MOS chip is fully etched.

[0022] 2、Each MOS chip is equidistantly distributed on the electrostatic adsorption table, thereby avoiding the phenomenon that the MOS chips are concentrated together, wherein the clamping assembly can clamp the MOS chip for feeding, and the clamping assembly can position and place the MOS chip through the driver and the guide rod, thereby realizing the effect that the MOS chips are kept apart. BRIEF DESCRIPTION OF DRAWINGS

[0023] The application will be further described below in combination with the drawings.

[0024] Figure 1 It is a schematic view of the overall structure of the application;

[0025] Figure 2 It is a schematic view of the overall structure of the application Figure 1 It is an enlarged schematic view of the structure at A of the application;

[0026] Figure 3 It is a top view of the overall structure of the application;

[0027] Figure 4 It is an A-A sectional view of the overall structure of the application;

[0028] Figure 5 It is a B-B sectional view of the overall structure of the application;

[0029] Figure 6 It is a schematic view of the control assembly structure of the application;

[0030] Figure 7 It is a schematic view of the removal plate structure of the application.

[0031] In the drawings: 1, etching machine main body; 2, conveyor; 3, driver; 4, support plate; 5, guide rod; 6, extender; 7, blocking door; 8, chute; 9, positioner; 10, clamp; 11, clamping plate; 12, inlet and outlet; 13, discharge pipe; 14, electrostatic adsorption table; 15, telescopic rod; 16, removal plate; 17, positioning hole; 18, recovery groove; 19, connecting hole; 20, controller; 21, control panel; 22, spray head; 23, impurity absorber. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative effort belong to the scope of protection of the present application.

[0033] As shown in the drawings, Figures 1-7 A MOS chip etching device, comprising: an etching machine body 1, a shower head 22 and a driver 3,

[0034] The etching machine body 1 is provided with an inlet and an outlet 12 at both ends, respectively, and the bottom end of the etching machine body 1 is fixedly connected with an electrostatic chucking table 14. A control assembly is slidably connected to the inner wall top end of the etching machine body 1. The shower head 22 is provided with a plurality of groups and is equidistantly distributed along the length direction of the control assembly. The shower head 22 is fixedly connected with the control assembly. The driver 3 is arranged at the side end of the etching machine body 1. The driver 3 is slidably connected with a guide rod 5. The side end of the guide rod 5 is fixedly connected with a clamping assembly. When a large number of MOS chips need to be etched, the driver 3 controls the guide rod 5 to move in and out, and the guide rod 5 moves with the clamping assembly. The clamping assembly clamps the MOS chips to pass through the inlet and outlet 12. The clamping assembly places the MOS chips on the electrostatic chucking table 14 one by one. The MOS chips are equidistantly distributed. At this time, the electrostatic chucking table 14 operates and adsorbs the MOS chips. Then the control assembly controls the plurality of shower heads 22 to spray etching liquid on the MOS chips, so as to realize targeted etching of the plurality of MOS chips and ensure that each MOS chip can be fully etched by the etching liquid, thereby realizing the effect of fully etching the MOS chips.

[0035] Each MOS chip is equidistantly distributed on the electrostatic chucking table 14, thereby avoiding the phenomenon that the MOS chips are concentrated together. The clamping assembly can clamp and feed the MOS chips. At the same time, the clamping assembly can position and place the MOS chips through the driver 3 and the guide rod 5, thereby realizing the effect that the MOS chips are placed at intervals.

[0036] In some embodiments, the control assembly comprises a controller 20 and a control plate 21, the top end of the controller 20 is slidably connected with the etching machine body 1, the bottom end of the controller 20 is fixedly connected with the control plate 21, the control plate 21 is fixedly connected with a plurality of spray heads 22, when the control assembly operates, the controller 20 moves on the inner wall of the top of the etching machine body 1, the controller 20 drives the plurality of spray heads 22 to move through the control plate 21, the spray heads 22 spray the MOS chip with etching liquid, wherein the plurality of spray heads 22 spray the MOS chip placed in the corresponding position, and the controller 20 can synchronously operate the plurality of spray heads 22 through the control plate 21.

[0037] In some embodiments, the inner wall of the both ends of the etching machine body 1 is respectively provided with a sliding groove 8, the inner wall of the sliding groove 8 is slidably connected with a blocking door 7, in order to ensure that the MOS chip is in a sealed environment during etching, when the MOS chip is placed on the electrostatic chucking table 14, the etching machine body 1 controls the blocking door 7 to slide along the inner wall of the sliding groove 8, when the bottom end of the blocking door 7 moves to the electrostatic chucking table 14, the blocking door 7 blocks the inlet and outlet 12, thereby providing a sealed environment for the MOS chip in the etching machine body 1, so as to avoid the etching liquid sprayed by the spray head 22 from splashing out of the inlet and outlet 12.

[0038] In some embodiments, the blocking door 7 is clamped and connected with the inner wall of the sliding groove 8, the clamping and connecting of the inner wall of the sliding groove 8 with the blocking door 7 can provide a limiting support for the blocking door 7, so as to avoid the blocking door 7 from deviating or shaking when blocking the splashing etching liquid, wherein the both ends of the blocking door 7 can be fixedly connected with sealing pads, the sealing pads can further seal the gap between the blocking door 7 and the sliding groove 8.

[0039] In some embodiments, the bottom end of the guide rod 5 is provided with a conveyor 2, the conveyor 2 is provided with two groups and is fixedly connected with the both sides of the etching machine body 1, the side end of the conveyor 2 is fixedly connected with a driver 3, the clamping assembly is located at the top of the conveyor 2, the bottom end of the driver 3 away from the clamping assembly is fixedly connected with a support plate 4, the MOS chip can be conveyed through the conveyor 2, when the MOS chip moves to the bottom of the clamping assembly through the conveyor 2, the conveyor 2 stops operating, the clamping assembly clamps the MOS chip to move, when the MOS chip is etched, the clamping assembly clamps the MOS chip to move to another group of conveyors 2 for discharging, the conveyor 2 realizes the effects of automatically feeding and discharging the MOS chip, wherein the support plate 4 can provide support for the side end of the driver 3.

[0040] In some specific embodiments, the clamping assembly comprises a clamping device 10 and a clamping plate 11, the clamping device 10 is fixedly connected to the guide rod 5, the clamping plate 11 is provided with two groups and is slidably connected to the bottom of the clamping device 10, when the clamping assembly is running, the clamping device 10 is running, the clamping device 10 controls the clamping plate 11 to clamp the MOS chip, the clamping plate 11 clamps both ends of the MOS chip, and then the clamping device 10 moves the MOS chip to the electrostatic adsorption table 14 through the control of the clamping plate 11 to place it.

[0041] In some specific embodiments, the clamping device 10 is fixedly connected to the positioner 9 at the side end, the fixed positioner 9 at the side end of the clamping device 10 can position the position of the movement of the clamping assembly, so as to ensure that the clamping assembly moves the MOS chip to the corresponding position of the electrostatic adsorption table 14 through the movement of the guide rod 5.

[0042] In some specific embodiments, the electrostatic adsorption table 14 is slidably connected to the removal plate 16 at the top, the electrostatic adsorption table 14 is provided with a recovery groove 18 at the side end, and the electrostatic adsorption table 14 is provided with a getter 23 at the side end, the getter 23 is fixedly connected to the end of the etching machine body 1 away from the clamping assembly, when the MOS chip is etched, the clamping assembly clamps the MOS chip to unload it from the electrostatic adsorption table 14, when the MOS chip passes through the inlet and outlet 12, the getter 23 absorbs the etching liquid left on the MOS chip, so as to avoid the MOS chip from taking the left etching liquid to the external environment, thereby affecting the external environment, when the MOS chip is completely unloaded from the electrostatic adsorption table 14, the removal plate 16 can slide along the surface of the electrostatic adsorption table 14, the removal plate 16 pushes the etching liquid left on the surface of the electrostatic adsorption table 14, the removal plate 16 pushes the etching liquid into the recovery groove 18, and the recovery groove 18 recovers the etching liquid, so as to avoid the etching liquid left on the surface of the electrostatic adsorption table 14 from corroding the bottom of the subsequent MOS chip.

[0043] In some specific embodiments, the removal plate 16 is fixedly connected to the telescopic rod 15 at the side end, the etching machine body 1 is provided with a positioning hole 17, the telescopic rod 15 is slidably connected to the inner wall of the etching machine body 1, the telescopic rod 15 is fixedly connected to the telescopic device 6 at the side end, the telescopic device 6 is fixedly connected to the side end of the etching machine body 1, when the removal plate 16 needs to be moved, the telescopic device 6 is running, the telescopic device 6 drives the telescopic rod 15 to move, the telescopic rod 15 slides along the inner wall of the positioning hole 17, the telescopic rod 15 abuts against the removal plate 16 to slide along the top of the electrostatic adsorption table 14, and the two ends of the removal plate 16 can be bent back to the direction of the recovery groove 18, when the removal plate 16 pushes the etching liquid, the etching liquid will flow to both sides along the surface of the removal plate 16, the two ends of the removal plate 16 can limit the etching liquid, and at the same time, the removal plate 16 can collect the etching liquid.

[0044] In some specific embodiments, the recovery tank 18 is provided with a discharge pipe 13 at the side end, the electrostatic adsorption table 14 is provided with a connecting hole 19 at the side end, the discharge pipe 13 is fixedly connected with the side end of the electrostatic adsorption table 14, and the connecting hole 19 is in communication with the recovery tank 18 and the discharge pipe 13 at the two ends, respectively. When the recovery tank 18 collects the etching liquid, the etching liquid can pass through the connecting hole 19 and then enter the discharge pipe 13, so that the etching liquid is recovered by the discharge pipe 13.

[0045] In order to facilitate the understanding of the person skilled in the art to the embodiment of the present application, the working principle of the present application will be briefly described in combination with specific application scenarios:

[0046] The MOS chip can be conveyed by the conveyor 2. When the MOS chip moves to the bottom of the clamping assembly through the conveyor 2, the conveyor 2 stops running, the clamping assembly clamps the MOS chip to move, the driver 3 controls the guide rod 5 to move in and out, the guide rod 5 moves with the clamping assembly, the clamping assembly clamps the MOS chip to pass through the inlet and outlet 12, and the clamping assembly places the MOS chips on the electrostatic adsorption table 14 one by one, and the MOS chips are kept equidistant. At this time, the electrostatic adsorption table 14 runs, the electrostatic adsorption table 14 adsorbs the MOS chip, and then the control assembly controls the plurality of spray heads 22 to spray the etching liquid on the MOS chip. When the MOS chip is etched, the clamping assembly discharges the MOS chip, the extender 6 runs, the extender 6 drives the extension rod 15 to move, the extension rod 15 slides along the inner wall of the positioning hole 17, the extension rod 15 abuts against the removal plate 16 to slide along the top of the electrostatic adsorption table 14, and the removal plate 16 pushes the etching liquid into the recovery tank 18, and the recovery tank 18 recovers the etching liquid;

[0047] Each MOS chip is equidistantly distributed on the electrostatic adsorption table 14, so as to avoid the phenomenon that the MOS chips are concentrated together. The clamping assembly can clamp and feed the MOS chip, and the clamping assembly can position and place the MOS chip through the driver 3 and the guide rod 5, so as to realize the effect that the MOS chips are kept apart. The plurality of spray heads 22 spray the etching liquid on the MOS chip, so as to realize the effect that the plurality of MOS chips are etched in a targeted manner, and ensure that each MOS chip can be fully etched by the etching liquid.

[0048] The above describes several embodiments of the present application in detail, but the embodiments of the present application are not limited thereto, and cannot be considered as limiting the scope of the present application. Any equivalent changes and improvements made within the scope of the present application shall still belong to the patent scope of the present application.

Claims

1. A MOS chip etching apparatus, characterized in that, include: The etching machine body (1) has an inlet and outlet (12) at both ends, an electrostatic adsorption platform (14) is fixedly connected to the bottom end of the etching machine body (1), and a control component is slidably connected to the top of the inner wall of the etching machine body (1). Spray head (22), the spray head (22) is provided in several groups and is distributed at equal intervals along the length direction of the control component, and the spray head (22) is fixedly connected to the control component; A driver (3) is provided on the side of the etching machine body (1). A guide rod (5) is slidably connected to the driver (3). A clamping assembly is fixedly connected to the side of the guide rod (5). The bottom of the guide rod (5) is provided with a conveyor (2), and the clamping assembly is located at the top of the conveyor (2); The electrostatic adsorption table (14) is slidably connected to the top of the removal plate (16), and a recycling trough (18) is opened on the side of the electrostatic adsorption table (14). A telescopic rod (15) is fixedly connected to the side of the removal plate (16). The driver (3) controls the guide rod (5) to extend and retract. The guide rod (5) moves with the clamping assembly. The clamping assembly clamps the MOS chip through the inlet and outlet (12). The clamping assembly places the MOS chips one by one on the electrostatic adsorption stage (14). The MOS chips are kept at equal distances.

2. The MOS chip etching apparatus according to claim 1, characterized in that, The control components include: a controller (20) and a control board (21). The top of the controller (20) is slidably connected to the etching machine body (1), and the bottom of the controller (20) is fixedly connected to the control board (21). The control board (21) is fixedly connected to several spray heads (22).

3. The MOS chip etching apparatus according to claim 1, characterized in that, The etching machine body (1) has grooves (8) at both ends, and a sealing door (7) is slidably connected to the inner wall of the groove (8).

4. The MOS chip etching apparatus according to claim 3, characterized in that, The sealing door (7) is engaged with the inner wall of the slide (8).

5. The MOS chip etching apparatus according to claim 1, characterized in that, The conveyor (2) is provided in two sets and is fixedly connected to both sides of the etching machine body (1). The side end of the conveyor (2) is fixedly connected to the driver (3). The driver (3) has a support plate (4) fixedly connected to the bottom of the end away from the clamping assembly.

6. The MOS chip etching apparatus according to claim 5, characterized in that, The clamping assembly includes a clamp (10) and a clamping plate (11). The side end of the clamp (10) is fixedly connected to the guide rod (5). The clamping plate (11) is provided in two sets and is slidably connected to the bottom of the clamp (10) respectively.

7. The MOS chip etching apparatus according to claim 6, characterized in that, A positioner (9) is fixedly connected to the side end of the clamp (10).

8. A MOS chip etching apparatus according to claim 1, characterized in that... An impeller (23) is provided on the side of the electrostatic adsorption stage (14), and the impeller (23) is fixedly connected to the end of the etching machine body (1) away from the clamping assembly.

9. A MOS chip etching apparatus according to claim 8, characterized in that, The etching machine body (1) has a positioning hole (17), the telescopic rod (15) is slidably connected to the inner wall of the etching machine body (1), and a telescopic device (6) is fixedly connected to the side end of the telescopic rod (15), and the telescopic device (6) is fixedly connected to the side end of the etching machine body (1).

10. A MOS chip etching apparatus according to claim 8, characterized in that, The recycling tank (18) is provided with a discharge pipe (13) on its side end, and the electrostatic adsorption platform (14) is provided with a connecting hole (19) through its side end. The discharge pipe (13) is fixedly connected to the side end of the electrostatic adsorption platform (14), and the two ends of the connecting hole (19) are respectively connected to the recycling tank (18) and the discharge pipe (13).

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