A wafer detection method

Abstract

The present invention relates to the technical field of wafer detection, and in particular to a detection method. The wafer carrying device includes a plurality of carrying units circumferentially distributed on a turntable; the number of the carrying units is multiple and they are circumferentially distributed on the turntable; each carrying unit includes a horizontal moving mechanism and a vertical moving mechanism. The horizontal sliding block reciprocates along the radial direction of the turntable under the action of a horizontal driving member. The vertical moving mechanism is arranged on the horizontal sliding block, and the vertical sliding block reciprocates up and down along the vertical direction on the horizontal sliding block under the action of a vertical driving member; a jaw for clamping the wafer is fixedly connected to the vertical sliding block. In the present invention, the carrying unit at the position to be detected can retract the jaw alone, so as to completely expose the edge area of the wafer; through one rotation, the detection of the complete edge area of the wafer can be achieved, without the need to cooperate with other devices, effectively simplifying the device structure, shortening the detection time, and improving the accuracy and quality of the detection result.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer detection, and particularly to a wafer detection method. Background Art

[0002] During the semiconductor manufacturing process, it is necessary to detect the edges of wafers to improve the yield rate and meet the requirements of advanced processes. During the wafer detection process, tooling is required to clamp and position the wafers, and the wafers need to be continuously rotated during the detection process to complete the detection of multiple edge regions or the entire edge. However, in the prior art, the tooling supports and clamps the outer edge of the wafer from the bottom of the wafer, resulting in occlusion at the bottom of the wafer edge and unable to complete the detection process through one rotation. To address the above problems, in the prior art, a clamping mechanism is used to lift and rotate the wafer, and then the wafer is placed back and the occluded area is detected for improvement. However, this improvement scheme has a complex structure and operation steps, a long operation time, and the results of multiple detections need to be complexly processed to obtain a complete edge detection result, resulting in a high detection cost. Summary of the Invention

[0003] The present invention aims to solve the above problems and provides a detection method, and the technical solution adopted is as follows:

[0004] A wafer carrying device includes a plurality of carrying units and a turntable. The turntable is arranged horizontally, and the number of the carrying units is multiple and circumferentially distributed on the turntable. Each carrying unit includes a horizontal moving mechanism and a vertical moving mechanism. The horizontal moving mechanism includes a horizontal driving member and a horizontal sliding block. The horizontal sliding block reciprocates along the radial direction of the turntable under the action of the horizontal driving member. The vertical moving mechanism is arranged on the horizontal sliding block and includes a vertical driving member and a vertical sliding block. The vertical sliding block reciprocates vertically on the horizontal sliding block under the action of the vertical driving member. A clamping jaw for clamping the wafer is fixedly connected to the vertical sliding block.

[0005] On the basis of the above solution, each carrying unit further includes a limiting mechanism. The limiting mechanism includes a limiting nut and a limiting stud connected by threads. The limiting stud is arranged vertically on the horizontal sliding block and is threadedly connected to the horizontal sliding block. When the vertical sliding block moves up to the limit position, the bottom end of the limiting stud abuts against the vertical sliding block.

[0006] Preferably, the number of the carrying units is 5 and they are evenly circumferentially distributed on the turntable.

[0007] Preferably, the clamping jaw includes a receiving arm extending radially outward along the turntable. A clamping block extends upward from the outer end of the receiving arm, and the clamping block abuts against the outer edge of the wafer.

[0008] On the basis of the above solution, a flexible device is arranged on the side of the clamping block facing the wafer along the radial direction of the wafer.

[0009] Preferably, the horizontal movement mechanism further includes a horizontal slide rail, and the vertical movement mechanism further includes a vertical slide rail. The horizontal slide rail is fixedly installed on the turntable along the radial direction, a horizontal sliding block is movably arranged on the horizontal slide rail, the vertical slide rail is fixedly arranged on the horizontal sliding block along the vertical direction, and a vertical sliding block is slidably arranged on the vertical slide rail.

[0010] A wafer detection device, characterized in that it includes the above-mentioned wafer carrying device, as well as a sliding mechanism, a rotating mechanism and a detection mechanism. The rotating mechanism includes a rotation driving member, the turntable is installed on the rotation driving member and is driven by the rotation driving member to rotate; the sliding mechanism includes a first sliding guide rail fixedly arranged on the upper bottom plate, the first sliding guide rail is arranged along the horizontal direction, the rotating mechanism is slidably arranged on the first sliding guide rail and moves between a placement position and a detection position, and the detection mechanism is arranged at the detection position.

[0011] On the basis of the above solution, the rotating mechanism further includes a slip ring and a rotating frame. The rotating frame is fixedly connected to the turntable coaxially. The rotating frame is fixedly connected to the rotor of the slip ring coaxially through a connecting rod. A hollow groove communicating with the rotor is arranged in the middle of the rotating frame and the connecting rod, and the connecting rod penetrates through the rotation driving member.

[0012] A wafer detection method, using the above wafer detection device, includes the following steps:

[0013] S1. Adjust the relative positions of the respective loading units so that the respective jaws are in the same horizontal plane, and the center of the circle formed by the clamping positions of the respective jaws is coaxial with the turntable.

[0014] S2. The rotating mechanism moves to the placement position, and the wafer to be detected is placed on the respective jaws of the carrying device, and the inner sides of the respective jaws are in contact with the edge of the wafer.

[0015] S3. The rotating mechanism moves to the detection position, and the rotation driving member drives the turntable to rotate.

[0016] S4. When a certain jaw moves towards the direction of the detection mechanism and there is a predetermined distance from the detection mechanism, the jaw extends radially outwards and then moves downwards, and then retracts radially inwards, exposing the bottom surface and side surface of the wafer at the supporting position of the jaw within the detection range of the detection mechanism.

[0017] S5. After the detection mechanism completes the detection of the wafer at this position, the jaw extends radially outwards, moves upwards, and then retracts radially inwards until it returns to the original position and is in contact with the wafer.

[0018] S6. Repeat steps S4 and S5 until the area to be detected of the wafer is completely detected.

[0019] Based on the above solution, when leveling the clamping jaws in step S1, the following steps are included:

[0020] A1. Place the wafer standard on the carrying device;

[0021] A2. Place a level at the center position of the wafer standard;

[0022] A3. According to the detection result of the level, rotate the limit screw of the carrying unit in the direction of abnormal height, adjust the height of the bottom of the limit screw, and then adjust the height of the vertical sliding block and the clamping jaws;

[0023] A4. After rotating the level by a predetermined angle, repeat step A3;

[0024] A5. Rotate the level to the initial direction when it was placed, and determine whether the wafer standard is in a horizontal state at this time; if the wafer standard is not in a horizontal state, repeat steps A4 and A5.

[0025] Preferably, the horizontal moving mechanism further includes a first horizontal travel switch and a second horizontal travel switch, and a horizontal sliding member is fixedly connected to the horizontal sliding block; when the horizontal sliding block retracts inward to the first predetermined position, the horizontal sliding member enters the detection range of the first horizontal travel switch, and when the horizontal sliding block retracts inward to the second predetermined position, the horizontal sliding member enters the detection range of the second horizontal travel switch; the vertical moving mechanism further includes a vertical displacement sensor, and when the vertical sliding block moves upward to the third predetermined position, the vertical displacement sensor detects the position signal of the vertical sliding block;

[0026] In steps S2 and S5, when the vertical sliding block moves upward to the third predetermined position, the clamping jaws are in contact with the wafer, and the vertical driving member stops operating; when the horizontal sliding block retracts inward to the first predetermined position, the first horizontal travel switch is triggered, and the horizontal driving member stops operating. At this time, the inner side of the clamping jaws is in contact with the edge of the wafer;

[0027] In step S4, after the clamping jaws extend radially outward and then move downward, when they retract radially inward to the second predetermined position, the second horizontal travel switch is triggered. At this time, the clamping jaws move out of the detection range of the detection mechanism, and the horizontal driving member stops operating.

[0028] The beneficial effects of the present invention are as follows: The wafer is stably supported by the individually controllable carrying units. During the detection of the wafer edge, the carrying unit at the position to be detected can retract the clamping jaws individually, so as to completely expose the wafer edge area, without affecting the stability of the wafer support and avoiding the detection result error caused by the offset of the wafer position; the detection of the complete edge area of the wafer can be completed by one rotation, without the need to cooperate with other devices, effectively simplifying the device structure, shortening the detection time, and improving the accuracy and quality of the detection results. Description of the Drawings

[0029] Figure 1 : Schematic structural diagram of the present invention;

[0030] Figure 2 : Schematic diagram of the state of the wafer carried by the present invention;

[0031] Figure 3 : Cross-sectional view of the structure of the present invention;

[0032] Figure 4 : Schematic diagram of the installation state of the carrier monomer of the present invention;

[0033] Figure 5 : Schematic structural diagram of the carrier monomer of the present invention;

[0034] Figure 6 : Schematic structural diagram of the carrier monomer of the present invention from another perspective;

[0035] Figure 7 : Schematic structural diagram of the limiting mechanism of the carrier monomer of the present invention. Detailed implementation manners

[0036] The present invention will be further described below in conjunction with the accompanying drawings and embodiments:

[0037] In the present invention, unless otherwise clearly defined and limited, terms such as "installation", "connection", "connection", "fixation" and other terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be directly connected, or indirectly connected through an intermediate medium, and can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by terms such as "center", "length", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise stated, the meaning of "plurality" is two or more.

[0039] In the present invention, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may include direct contact between the first and second features, or may include the first and second features not being in direct contact but being in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the horizontal height of the first feature is less than that of the second feature.

[0040] As Figure 1 and Figure 2 shown, a wafer carrying device includes a carrying unit and a turntable 22. The turntable 22 is arranged in the horizontal direction and rotates in the horizontal plane. The number of the carrying units is multiple and circumferentially distributed on the turntable 22; preferably, the number of the carrying units is 5 and evenly circumferentially distributed on the turntable 22, so as to realize stable support for the wafer 6, and at the same time ensure that when any one of the carrying units does not provide the carrying function, the wafer 6 can still maintain a stable position without deflection or shaking.

[0041] As Figures 4 to 6 shown, the carrying unit includes a horizontal moving mechanism and a vertical moving mechanism. The horizontal moving mechanism includes a horizontal driving member 31 and a horizontal sliding block 33. The horizontal sliding block 33 reciprocates radially along the turntable 22 under the action of the horizontal driving member 31. The vertical moving mechanism is arranged on the horizontal sliding block 33 and includes a vertical driving member 41 and a vertical sliding block 43. The vertical sliding block 43 reciprocates vertically on the horizontal sliding block 33 under the action of the vertical driving member 41. The horizontal driving member 31 and the vertical driving member 41 can be linear driving elements such as motors, cylinders, and hydraulic cylinders. Preferably, the horizontal moving mechanism further includes a horizontal slide rail 32, and the vertical moving mechanism further includes a vertical slide rail 44. The horizontal slide rail 32 is fixedly installed on the turntable 22 along the radial direction, the horizontal sliding block 33 is movably arranged on the horizontal slide rail 32, the vertical slide rail 44 is fixedly arranged on the horizontal sliding block 33 along the vertical direction, and the vertical sliding block 43 is slidably arranged on the vertical slide rail 44, so as to ensure the stability and accuracy of the moving paths of the horizontal sliding block 33 and the vertical sliding block 43 through the horizontal slide rail 32 and the vertical slide rail 44.

[0042] A clamping jaw 5 for clamping a wafer 6 is fixedly connected to the vertical sliding block 43. The clamping jaw 5 includes a receiving arm extending radially outward along the turntable 22. The outer end of the receiving arm extends upward to form a clamping block, and the clamping block abuts against the outer edge of the wafer 6. The receiving arm supports the wafer 6 from the bottom of the wafer 6. Combining with the abutting action of the clamping block on the edge of the wafer 6, the support and positioning of the wafer 6 are completed.

[0043] Since the edge of the wafer 6 is relatively thin, when radially clamping at the edge, if the clamping force is too large, it is easy to cause damage such as breakage at the edge. If the clamping force is too small, there may be problems such as unstable positioning and clamping, and wafer eccentricity. Therefore, a flexible device is arranged on the side of the clamping block facing the wafer 6 along the radial direction of the wafer 6 to improve the clamping effect while preventing damage to the wafer edge. The flexible device can be structures such as springs and buffer sheets, and the size changes in the form of elastic deformation along the radial direction of the wafer 6.

[0044] The loading unit further includes a limiting mechanism, such as Figure 7 As shown, the limiting mechanism includes a limiting nut 45 and a limiting stud 46 connected by threads. The limiting nut 45 is sleeved outside the limiting stud 46 to position the limiting stud 46. The limiting stud 46 is arranged vertically on the horizontal sliding block 33 and is threadedly connected to the horizontal sliding block 33. When the vertical sliding block 43 moves up to the limit position, the bottom end of the limiting stud 46 abuts against the vertical sliding block 43. By rotating the limiting stud 46 to adjust the height, the limit position when the vertical sliding block 43 and the clamping jaw 5 move to the top is restricted, and then leveling operation is performed when the loading device loads the wafer 6 to ensure the accuracy of the horizontal position and angle of the wafer 6.

[0045] A wafer detection device includes the above-mentioned wafer loading device, as well as a sliding mechanism, a rotating mechanism and a detection mechanism. The rotating mechanism includes a rotating driving member 21. The turntable 22 is installed on the rotating driving member 21 and is driven by the rotating driving member 21 to rotate. The rotating driving member 21 can be a rotating driving element such as a motor, a motor, a gear mechanism, etc. Since there are multiple connecting lines in the loading device, to prevent the connecting lines from being wound during the rotation of the turntable 22, as Figure 3 As shown, the rotating mechanism further includes a slip ring 23 and a rotating frame 24. The slip ring 23 includes a stator and a rotor. The rotating frame 24 is coaxially and fixedly connected to the turntable 22. The rotating frame 24 is coaxially and fixedly connected to the rotor of the slip ring 23 through a connecting rod. A hollow groove communicating with the rotor is provided in the middle of the rotating frame 24 and the connecting rod. The connecting rod penetrates through the rotating driving member 21. The connecting lines of the loading device are correspondingly connected to the stator through the rotating frame 24, the connecting rod and the rotor.

[0046] The sliding mechanism includes a first sliding guide rail 12 fixedly arranged on the upper bottom plate 11. The first sliding guide rail 12 is arranged in the horizontal direction. The rotating mechanism is slidably arranged on the first sliding guide rail 12 and moves between the placing position and the detecting position. Specifically, a first sliding seat 13 is slidably arranged on the first sliding guide rail 12, and the rotating mechanism is fixedly arranged on the first sliding seat 13. The sliding mechanism may further include a second sliding guide rail 15 fixedly arranged on the lower bottom plate 14. The second sliding guide rail 15 is arranged parallel to the first sliding guide rail 12 in the horizontal plane. A second sliding seat 16 is slidably arranged on the second sliding guide rail 15, and the stator of the slip ring 23 is fixedly installed on the second sliding seat 16.

[0047] The detecting mechanism is arranged at the detecting position. The detecting mechanism may be a device such as a camera or a sensor for detecting the wafer.

[0048] A wafer detecting method using the above-mentioned wafer detecting device includes the following steps:

[0049] S1. Adjust the relative positions of the respective loading units so that the respective clamping jaws 5 are in the same horizontal plane, and the center of the circle formed by the clamping positions of the respective clamping jaws 5 is coaxial with the turntable 22. When leveling the clamping jaws 5, the following steps are included:

[0050] A1. Place the wafer standard on the loading device.

[0051] A2. Place a spirit level at the center position of the wafer standard.

[0052] A3. According to the detection result of the spirit level, rotate the limit screw 46 of the loading unit in the direction of abnormal height, adjust the height of the bottom of the limit screw 46, and further adjust the height of the vertical sliding block 43 and the clamping jaw 5.

[0053] A4. After rotating the spirit level by a predetermined angle, repeat step A3.

[0054] A5. Rotate the spirit level to the initial direction when it was placed, and judge whether the wafer standard is in a horizontal state at this time. If the wafer standard is not in a horizontal state, repeat steps A4 and A5 until the wafer standard is in a horizontal state.

[0055] S2. The rotating mechanism moves to the placing position, and the wafer 6 to be detected is placed on the respective clamping jaws 5 of the loading device, and the inner sides of the respective clamping jaws 5 are in contact with the edge of the wafer 6.

[0056] S3. The rotating mechanism moves to the detecting position, and the rotating driving member 21 drives the turntable 22 to rotate.

[0057] S4. When a certain clamping jaw 5 moves toward the detection mechanism and there is a predetermined distance from the detection mechanism, the clamping jaw 5 extends radially outward and then moves downward, and then retracts radially inward, exposing the bottom and side surfaces of the wafer 6 at the supporting position of the clamping jaw 5 to the detection range of the detection mechanism;

[0058] S5. After the detection mechanism completes the detection of the wafer 6, the clamping jaw 5 extends radially outward and moves upward, and then retracts radially inward until it returns to its original position and abuts against the wafer 6;

[0059] S6. Repeat steps S4 and S5 until the inspection area at the edge of the wafer 6 is inspected.

[0060] The horizontal movement mechanism further includes a first horizontal travel switch 35 and a second horizontal travel switch 36. The horizontal sliding block 33 is fixedly connected to a horizontal sliding member 34. When the horizontal sliding block 33 retracts inward to a first predetermined position, the horizontal sliding member 34 enters the detection range of the first horizontal travel switch 35. When the horizontal sliding block 33 retracts inward to a second predetermined position, the horizontal sliding member 34 enters the detection range of the second horizontal travel switch 36. The vertical movement mechanism further includes a vertical displacement sensor 42. When the vertical sliding block 43 moves upward to a third predetermined position, the vertical displacement sensor 42 detects a position signal of the vertical sliding block 43.

[0061] In steps S2 and S5, when the vertical sliding block 43 moves upward to the third predetermined position, the clamping jaw 5 abuts against the wafer 6, specifically, the top surface of the receiving arm of the clamping jaw 5 abuts against the bottom surface of the wafer 6, and the vertical driving member 41 stops to ensure the horizontal state of the wafer 6; when the horizontal sliding block 33 retracts inward to the first predetermined position, the first horizontal travel switch 35 is triggered, and the horizontal driving member 31 stops, at which time the inner side of the clamping jaw 5 abuts against the edge of the wafer 6, completing the clamping action of the wafer 6;

[0062] In step S4, the clamp 5 extends radially outward and then moves downward, and then retracts radially inward to a second predetermined position, triggering the second horizontal travel switch 36. At this time, the clamp 5 moves out of the detection range of the detection mechanism, and the clamp 5 does not interfere with the detection mechanism, and the horizontal drive member 31 stops moving, thereby preventing the clamp 5 from colliding with the detection mechanism during rotation, and ensuring that the detection mechanism can completely detect or sample the edge area of ​​the wafer.

[0063] By setting various travel switches and sensors, the moving range of each action part can be limited, and the corresponding action signal can be sent to the upper computer to accurately monitor the machine control detection process.

[0064] The present invention has been described above by way of example, but the present invention is not limited to the above specific embodiments, and any modification or variation based on the present invention falls within the scope of protection required by the present invention.

Claims

1. A wafer detection method, characterized in that, Using a wafer detection device, the wafer detection device includes a wafer carrying device, as well as a sliding mechanism, a rotating mechanism, and a detection mechanism. The rotating mechanism includes a rotation driving member (21), and a turntable (22) is installed on the rotation driving member (21) and is driven by the rotation driving member (21) to rotate; the sliding mechanism includes a first sliding guide rail (12) fixedly arranged on an upper bottom plate (11), the first sliding guide rail (12) is arranged in a horizontal direction, the rotating mechanism is slidably arranged on the first sliding guide rail (12) and moves between a placement position and a detection position, and the detection mechanism is arranged at the detection position; The wafer carrying device includes a carrying unit and a turntable (22), the turntable (22) is arranged in a horizontal direction, the number of the carrying units is multiple, and they are circumferentially distributed on the turntable (22); each carrying unit includes a horizontal moving mechanism and a vertical moving mechanism, the horizontal moving mechanism includes a horizontal driving member (31) and a horizontal sliding block (33), the horizontal sliding block (33) reciprocates along the radial direction of the turntable (22) under the action of the horizontal driving member (31), the vertical moving mechanism is arranged on the horizontal sliding block (33) and includes a vertical driving member (41) and a vertical sliding block (43), the vertical sliding block (43) reciprocates vertically on the horizontal sliding block (33) under the action of the vertical driving member (41); a jaw (5) for clamping a wafer (6) is fixedly connected to the vertical sliding block (43); The wafer detection method includes the following steps: S1. Adjust the relative positions of the respective carrying units so that the respective jaws (5) are in the same horizontal plane, and the center of the circle formed by the clamping positions of the respective jaws (5) is coaxial with the turntable (22); S2. The rotating mechanism moves to the placement position, and the wafer (6) to be detected is placed on the respective jaws (5) of the carrying device, and the inner sides of the respective jaws (5) are in contact with the edge of the wafer (6); S3. The rotating mechanism moves to the detection position, and the rotation driving member (21) drives the turntable (22) to rotate; S4. When a certain jaw (5) moves towards the detection mechanism and there is a predetermined distance from the detection mechanism, the jaw (5) extends radially outwards and then moves downwards, and then retracts radially inwards, exposing the bottom surface and side surface of the wafer (6) at the supporting position of the jaw (5) within the detection range of the detection mechanism; the positions of the remaining jaws (5) remain unchanged, and continue to support the wafer (6); S5. After the detection mechanism completes the detection of this part of the wafer (6), the jaw (5) extends radially outwards, and then moves upwards, and then retracts radially inwards until it returns to the original position and is in contact with the wafer (6); S6. Repeat steps S4 and S5 until the area to be detected of the wafer (6) is completely detected.

2. The wafer detection method according to claim 1, wherein When leveling the jaws (5) in step S1, it includes the following steps: A1. Place a wafer standard on the carrying device; A2. Place a level at the center position of the wafer standard; A3. According to the level test results, rotate the limit stud (46) of the load-bearing monomer in the abnormal height direction, adjust the bottom height of the limit stud (46), and then adjust the height of the vertical sliding block (43) and the clamp (5); A4. After rotating the level to a predetermined angle, repeat step A3; A5. Rotate the level to the initial direction when placed, and determine whether the wafer standard component is in a horizontal state at this time; if the wafer standard component is not in a horizontal state, repeat steps A4 and A5.

3. A wafer inspection method according to claim 1, wherein The horizontal movement mechanism further comprises a first horizontal travel switch (35) and a second horizontal travel switch (36); the horizontal sliding member (34) is fixedly connected to the horizontal sliding block (33); when the horizontal sliding block (33) retracts inwards to a first predetermined position, the horizontal sliding member (34) enters a detection range of the first horizontal travel switch (35); when the horizontal sliding block (33) retracts inwards to a second predetermined position, the horizontal sliding member (34) enters a detection range of the second horizontal travel switch (36); the vertical movement mechanism further comprises a vertical displacement sensor (42); when the vertical sliding block (43) moves upwards to a third predetermined position, the vertical displacement sensor (42) detects a position signal of the vertical sliding block (43); In steps S2 and S5, when the vertical sliding block (43) moves upward to the third predetermined position, the clamping jaw (5) contacts the wafer (6), and the vertical driving member (41) stops moving; when the horizontal sliding block (33) retracts inward to the first predetermined position, the first horizontal travel switch (35) is triggered, and the horizontal driving member (31) stops moving, at which time the inner side of the clamping jaw (5) contacts the edge of the wafer (6); In step S4, the clamping jaw (5) extends radially outward and then moves downward, and then retracts radially inward to a second predetermined position, triggering the second horizontal travel switch (36). At this time, the clamping jaw (5) moves out of the detection range of the detection mechanism, and the horizontal driving member (31) stops moving.

4. A wafer detection method according to claim 1, characterized in that, The bearing unit also includes a limiting mechanism, which includes a limiting nut (45) and a limiting stud (46) connected in a threaded manner. The limiting stud (46) is arranged on the horizontal sliding block (33) along the vertical direction and is threadedly connected to the horizontal sliding block (33). When the vertical sliding block (43) moves upward to the limit position, the bottom end of the limiting stud (46) abuts against the vertical sliding block (43).

5. A wafer inspection method according to claim 1, characterized in that The number of the load-bearing monomers is 5, and they are evenly distributed circumferentially on the turntable (22).

6. A wafer inspection method according to claim 1, characterized in that, The clamping claw (5) comprises a receiving arm extending radially outward along the turntable (22), the outer end of the receiving arm extending upward to form a clamping block, and the clamping block abuts against the outer edge of the wafer (6).

7. A wafer inspection method according to claim 6, characterized in that, A flexible device is arranged on the side of the clamping block facing the wafer (6) along the radial direction of the wafer (6).

8. A wafer detection method according to claim 1, characterized in that, The horizontal moving mechanism further includes a horizontal slide rail (32), and the vertical moving mechanism further includes a vertical slide rail (44). The horizontal slide rail (32) is fixedly installed on the turntable (22) along the radial direction, a horizontal sliding block (33) is movably arranged on the horizontal slide rail (32), the vertical slide rail (44) is fixedly arranged on the horizontal sliding block (33) along the vertical direction, and a vertical sliding block (43) is slidably arranged on the vertical slide rail (44).

9. A wafer detection method according to claim 1, wherein, The rotating mechanism further includes a slip ring (23) and a rotating frame (24). The rotating frame (24) is coaxially and fixedly connected to the turntable (22), the rotating frame (24) is coaxially and fixedly connected to the rotor of the slip ring (23) through a connecting rod. A hollow groove communicating with the rotor is arranged in the middle of the rotating frame (24) and the connecting rod, and the connecting rod penetrates through the rotation driving member (21).

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