Circuit board welding tool for electronic computer production
By designing a circuit board welding tool with multiple functions, the problems of single tin brushing direction, insufficient solder paste, low template adhesion and low welding efficiency are solved, and multi-directional tin brushing is achieved, preventing adhesion, and uniform heating and cooling are improved, and the welding quality and efficiency are improved.
Patent Information
- Application Number
- CN202510320559.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-18
- Publication Date
- 2025-04-18
- Estimated Expiration
- 2045-03-18
AI Technical Summary
During the reflow process of existing circuit boards, the direction of brushing solder paste is single, resulting in insufficient solder paste and insolid soldering; after brushing tin, the template is stuck to the circuit board, affecting the effect of brushing tin; during the welding process, there are many equipment, and staff need to frequently transfer the circuit board to reduce efficiency, and may cause component shifting, affecting the quality of the finished product.
A circuit board welding tool for electronic computer production is designed, including a base, a patch mechanism, a heating mechanism, a cooling mechanism, a rotary table, a positioning mechanism, a tin brushing mechanism, a lifting mechanism, an auxiliary linkage mechanism and an ejection mechanism. Through the collaborative work of these components, the functions of brushing tin from four directions, preventing solder paste from sticking, and rotating in segments for even heating and cooling are achieved.
By brushing tin in multiple directions, ensuring sufficient solder paste, preventing adhesion between the solder paste and the template, and improving solder quality; rotating in segments and heating and cooling evenly, avoiding the problems of incomplete melting of local solder paste and uneven cooling, and improving soldering efficiency and finished product quality.
Smart Images

Figure CN119855068A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of circuit board processing, and in particular to a circuit board welding tool for electronic computer production. Background Art
[0002] In the process of PCB circuit board manufacturing, SMT (surface mount technology) technology is widely used, and reflow soldering is a commonly used technical means.
[0003] When reflow soldering is performed on existing circuit boards, the solder paste is applied in a single direction, and it is difficult to fully apply the solder paste to the soldering position of the circuit board from multiple directions, which may easily lead to a loose soldering between the electronic components and the circuit board due to insufficient solder paste. Secondly, after applying the solder paste, when the template is separated from the circuit board, there will be varying degrees of adhesion between the template and the solder paste on the circuit board, which will affect the effect of applying the solder paste and further affect the quality of subsequent soldering of electronic components. In addition, when soldering circuit boards, tinning, patching, heating, and cooling are usually performed on different equipment, which requires workers to transfer semi-finished circuit boards multiple times, resulting in low circuit board welding processing efficiency. In addition, during the transfer of the circuit board, the electronic components on the circuit board may be displaced, affecting the quality of the finished circuit board. Summary of the invention
[0004] The purpose of the present invention is to provide a circuit board welding tool for electronic computer production to solve the above-mentioned shortcomings in the prior art.
[0005] In order to achieve the above-mentioned object, the present invention provides the following technical solution: a circuit board welding tool for electronic computer production, comprising a base, a patch mechanism, a heating mechanism and a cooling mechanism, and also comprising: a turntable, which is rotatably connected to the top of the base; A positioning mechanism, which is provided in plurality and is installed inside the base and is used to position the circuit board; A tin brushing mechanism is arranged above the base and is used to brush the solder paste onto the circuit board from different directions and to prevent the solder paste from separating from the circuit board; A lifting mechanism, which is provided in plurality and is respectively connected to the tin brushing mechanism, the patch mechanism, the heating mechanism and the cooling mechanism, and is used to drive the tin brushing mechanism, the patch mechanism, the heating mechanism and the cooling mechanism to rise and fall respectively; An auxiliary linkage mechanism, which is connected to the positioning mechanism and is used to drive the circuit board to rotate; The ejection mechanism is installed inside the base and is used to eject the soldered circuit board.
[0006] Furthermore, a driving mechanism is installed inside the base, and the driving mechanism includes a first motor installed on the inner wall of the bottom of the base and a driving shaft fixedly connected to the center of the bottom of the turntable; The first motor output shaft is externally fixedly sleeved with a first gear; The bottom end of the driving shaft is rotatably connected to the inner wall of the bottom of the base, and a first one-way gear is installed outside the driving shaft, and the first gear is meshed with the first one-way gear.
[0007] Furthermore, the positioning mechanism includes a turntable rotatably connected to the inside of the turntable, a material discharge trough opened on the top of the turntable, and a positioning groove arranged at the bottom of the material discharge trough; The rotating disks in the plurality of positioning mechanisms are distributed in a circular array with the driving shaft as the center.
[0008] Furthermore, the tin brushing mechanism includes a shell, a template, a magnetic suction component, a tin scraping component, a feeding component, a receiving component and a protective component; The template is arranged at the bottom of the housing, and a plurality of tin guide grooves corresponding to the welding positions of the circuit board are opened on the template; The magnetic attraction assembly includes two electromagnets installed inside the shell and two groups of iron blocks installed inside the template, and the electromagnets cooperate with the iron blocks; The tin scraper assembly includes a screw rod rotatably connected to the inside of the shell, a linkage frame screwed to the outside of the screw rod, and a scraper strip fixed to the bottom of the linkage frame. The top of the linkage frame is slidably connected to the inner wall of the top of the shell. One end of the screw rod is connected to a second motor, and the second motor is installed on the outer wall of the shell. An oblique groove is provided at the bottom of one side of the scraper strip.
[0009] Further, the protection assembly includes a fixing plate installed inside the housing, a plurality of first electric push rods installed at the bottom of the fixing plate, and a lifting plate fixed to the extended ends of the plurality of first electric push rods; The fixing plate is located on the inner side of the linkage frame, so the fixing plate will not affect the movement of the linkage frame. The width of the lifting plate is smaller than the inner diameter of the linkage frame, so the linkage frame will not contact the lifting plate when moving left and right. A plurality of limit blocks are installed at the bottom of the lifting plate, and the plurality of limit blocks are respectively matched with a plurality of tin guide grooves on the template; The feeding assembly includes a material guide tube installed inside the fixed plate, one end of the material guide tube extends to the outside of the shell, and the other end of the material guide tube is equipped with multiple diversion tubes facing vertically downward, the lower edge of the diversion tube is higher than the upper edge of the scraper strip, and the multiple diversion tubes are all located on the inner side of the moving path of the linkage frame, so the linkage frame will not contact the diversion tube when moving.
[0010] Furthermore, the material receiving assembly includes a material guide platform fixedly connected to the inner wall of one side of the shell, a material receiving trough opened inside the shell, and a scraper plate arranged inside the material receiving trough; The material guide platform is adapted to the oblique groove; A material guide groove is provided on the inner wall of one side of the shell, the material guide groove is located on the top of the material guide platform and is connected to the material receiving groove; A second electric push rod is installed inside the housing, and an extended end of the second electric push rod is fixedly connected to the top of the scraper plate; A tin discharge groove is provided on the outer wall of the shell body close to the material receiving groove. After the shell body moves upward and leaves the material discharging groove, the solder paste in the material receiving groove is discharged through the tin discharge groove.
[0011] Further, the lifting mechanism includes a bracket installed on the top of the base and a cylinder installed inside the bracket; The tin brushing mechanism, the patch mechanism, the heating mechanism and the cooling mechanism are respectively installed at the extended ends of the cylinders in the plurality of lifting mechanisms.
[0012] Further, the auxiliary linkage mechanism includes a driven shaft fixedly connected to the center of the bottom of the rotating disk and a second one-way gear installed outside the driven shaft; The base is internally rotatably connected with a gear ring, and a third motor is also installed on the inner wall of the bottom of the base. The output end of the third motor is fixedly connected to a second gear, and the upper edge of the second gear is lower than the lower edge of the second one-way gear. The second one-way gear and the second gear are both meshed with the gear ring.
[0013] Further, the ejection mechanism includes an ejection plate arranged inside the positioning groove, a lifting rod installed at the bottom of the ejection plate, and a transmission shaft rotatably connected to the inner wall of the bottom of the base; The lifting rod is arranged to penetrate the driven shaft, and the lower edge of the lifting rod is higher than the upper edge of the second gear; A third one-way gear is installed outside the transmission shaft, and the third one-way gear is meshed with the first gear; The outside of the transmission shaft is also fixedly sleeved with a reciprocating screw, the outside of the reciprocating screw is screwed with a jacking block, the top of the jacking block is fixedly connected with a jacking rod, and the jacking rod is located directly below the lifting rod in a static state; A limiting rod is also fixedly connected to the inner wall of the bottom of the base, and the lifting block is also slidably sleeved on the outside of the limiting rod.
[0014] Compared with the prior art, the circuit board welding tool for electronic computer production provided by the present invention has the following beneficial effects: 1. Through the tin brushing mechanism and the auxiliary linkage mechanism, the circuit board is brushed with tin from four directions in turn, so that the solder paste is fully brushed on the soldering position of the circuit board through the tin guide slot, avoiding the problem of the single direction of automatic solder paste brushing in the existing technology that it is difficult to ensure the sufficiency of solder paste brushing, and further ensuring the quality of subsequent electronic component welding; 2. After the solder paste is applied to the circuit board, when the template is separated from the circuit board, the protective component is used to prevent the solder paste on the circuit board from adhering to the template, further ensuring the quality of soldering; 3. Through the setting of the auxiliary linkage mechanism, the circuit board is driven to rotate in sections and the direction of the circuit board is changed, so that the circuit board can be tinned from different directions. After the circuit board is mounted, the circuit board after the mounting is driven to rotate in sections, and the circuit board after the mounting can be uniformly preheated through the heat-conductive material. When the circuit board is heated, the temperature inside the discharge trough can be made more uniform by driving the circuit board to rotate in sections, so that the solder paste melts more evenly, avoiding the problem of incomplete melting of local solder paste. When the circuit board is cooled, the melted solder paste can be cooled from different directions by driving the circuit board to rotate in sections, reducing the difference in cooling speed between the melted solder paste at each position. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.
[0016] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the positioning mechanism structure of the present invention; Figure 3 It is a schematic diagram of the internal structure of the base of the present invention; Figure 4 It is a schematic diagram of the external structure of the tin brushing mechanism of the present invention; Figure 5 It is a schematic diagram of the magnetic attraction component and template structure of the present invention; Figure 6 It is a schematic diagram of the internal structure of the housing of the present invention; Figure 7 It is a schematic diagram of the structure of the material receiving component of the present invention; Figure 8 It is a schematic diagram of the structure of the protection component and the feeding component of the present invention; Fig. 9 It is a schematic diagram of the ejection mechanism structure of the present invention.
[0017] Description of reference numerals: 1. Base; 2. SMT mechanism; 3. Heating mechanism; 4. Cooling mechanism; 5. Turntable; 6. First motor; 7. Driving shaft; 8. First gear; 9. First one-way gear; 10. Turntable; 11. Discharging trough; 12. Positioning slot; 13. Shell; 14. Template; 15. Electromagnet; 16. Iron block; 17. Screw rod; 18. Linkage frame; 19. Scraper; 20. Second motor; 21. Fixed plate; 22. First electric push rod; 23. Lifting plate; 24. Limit block; 25. Material guide pipe; 26. Diverter pipe; 27. Material guide platform; 28. Material collection trough; 29. Scraper plate; 30. Material guide trough; 31. Second electric push rod; 32. Bracket; 33. Cylinder; 34. Driven shaft; 35. Second one-way gear; 36. Ring gear; 37. Third motor; 38. Second gear; 39. Ejector plate; 40. Lifting rod; 41. Transmission shaft; 42. Third one-way gear; 43. Reciprocating screw; 44. Lifting block; 45. Lifting rod; 46. Limit rod. DETAILED DESCRIPTION
[0018] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.
[0019] Example 1: Please refer to Figure 1 - Fig. 9 A circuit board welding tool for electronic computer production includes a base 1, a patch mechanism 2, a heating mechanism 3 and a cooling mechanism 4. The patch mechanism 2 is a prior art and is used to place different types of electronic components at corresponding positions of the circuit board after tinning. The heating mechanism 3 is a prior art and is used to heat the circuit board with the electronic components placed thereon to melt the solder paste. The cooling mechanism 4 is a prior art and is used to cool the heated circuit board to cool and solidify the melted solder paste again so that the electronic components and the circuit board are fixed together.
[0020] Also includes: The turntable 5 is rotatably connected to the top of the base 1. A driving mechanism is also installed inside the base 1. The driving mechanism includes a first motor 6 installed on the inner wall of the bottom of the base 1 and a driving shaft 7 fixedly connected to the center of the bottom of the turntable 5. The first motor 6 output shaft is sleeved with a first gear 8 on the outside. The bottom end of the driving shaft 7 is rotatably connected to the inner wall of the bottom of the base 1. A first one-way gear 9 is installed outside the driving shaft 7. The first gear 8 is meshed with the first one-way gear 9. The first motor 6 is controlled to drive the first gear 8 to rotate counterclockwise, and the first gear 8 is meshed with the first one-way gear 9 to drive the driving shaft 7 to rotate clockwise, thereby driving the turntable 5 to rotate clockwise, wherein the first motor 6 is controlled to drive the turntable 5 to pause every quarter turn, thereby driving the turntable 10 inside the turntable 5 to rotate from directly below the shell 13 to directly below the patch mechanism 2, directly below the heating mechanism 3 and directly below the cooling mechanism 4 in sequence, and finally return to directly below the shell 13; In addition, when the first gear 8 rotates counterclockwise, the third one-way gear 42 also rotates therewith, but the transmission shaft 41 does not rotate therewith.
[0021] The positioning mechanism is provided with multiple ones and is installed inside the base 1. In this embodiment, the number of the positioning mechanisms is four, which are used to position the circuit board. The positioning mechanism includes a turntable 10 rotatably connected to the inside of the turntable 5, a material discharge trough 11 opened on the top of the turntable 10, and a positioning groove 12 arranged at the bottom of the material discharge trough 11; the turntables 10 in the multiple positioning mechanisms are distributed in a circular array with the drive shaft 7 as the center; The staff places the circuit board to be welded in the positioning groove 12 below the housing 13 , and the circuit board is matched with the positioning groove 12 , which facilitates the positioning of the circuit board.
[0022] The tin brushing mechanism is arranged above the base 1, and is used to brush the solder paste on the circuit board from different directions, and is also used to prevent the solder paste from separating from the circuit board. The tin brushing mechanism includes a shell 13, a template 14, a magnetic suction component, a tin scraping component, a feeding component, a material receiving component and a protective component; the template 14 is arranged at the bottom of the shell 13, and a plurality of tin guide grooves corresponding to the welding positions of the circuit board are opened on the template 14; the magnetic suction component includes two electromagnets 15 installed in the shell 13 and two groups of iron blocks 16 installed in the template 14, and the electromagnetic The iron 15 cooperates with the iron block 16; the tin scraping assembly includes a screw rod 17 rotatably connected to the inside of the housing 13, a linkage frame 18 screwed to the outside of the screw rod 17, and a scraping strip 19 fixed to the bottom of the linkage frame 18. The top of the linkage frame 18 is slidably connected to the inner wall of the top of the housing 13. One end of the screw rod 17 is connected to a second motor 20, which is mounted on the outer wall of the housing 13. An oblique groove is provided at the bottom of one side of the scraping strip 19. The feeding assembly includes a guide pipe 25 mounted inside the fixed plate 21, and one end of the guide pipe 25 extends The guide tube 25 extends to the outside of the shell 13. The other end of the guide tube 25 is equipped with a plurality of vertically downward shunt tubes 26. The lower edge of the shunt tube 26 is higher than the upper edge of the scraper 19. The plurality of shunt tubes 26 are located on the inner side of the moving path of the linkage frame 18. Therefore, the linkage frame 18 will not contact the shunt tube 26 when it moves. The material receiving assembly includes a guide table 27 fixed to the inner wall of one side of the shell 13, a material receiving trough 28 opened inside the shell 13, and a scraper plate 29 arranged inside the material receiving trough 28. The guide table 27 is adapted to the oblique groove; the shell A material guide groove 30 is provided on the inner wall of one side of the housing 13, and the material guide groove 30 is located on the top of the material guide platform 27 and is connected to the material receiving groove 28; a second electric push rod 31 is installed inside the housing 13, and the extended end of the second electric push rod 31 is fixedly connected to the top of the scraper plate 29; a tin discharge groove is provided on the outer wall of the housing 13 near the material receiving groove 28. After the housing 13 moves upward and leaves the inside of the material discharge groove 11, the second electric push rod 31 is controlled to drive the scraper plate 29 to continue to move downward, and all the solder paste inside the material receiving groove 28 is discharged through the tin discharge groove; After the circuit board is placed in the positioning groove 12 below the shell 13, the shell 13 is driven downward by the lifting mechanism, and the shell 13 moves downward along the inner wall of the material discharge groove 11 until the template 14 fits the top of the circuit board. At this time, the tin guide groove on the template 14 corresponds to each tin brushing position on the circuit board, and the solder paste is guided to the top of the template 14 through the material guide pipe 25 and the shunt pipe 26, and is located on the left side of the scraper 19, and then the second motor 20 is controlled to drive the screw rod 17 to rotate clockwise, driving the linkage frame 18 to move left, and the scraper 19 moves left along the top of the template 14. The scraper 19 pushes the solder paste to move left along the top of the template 14 synchronously. When the solder paste reaches the tin guide groove position, the scraper 19 presses the solder paste into the inside of the tin guide groove, so that the solder paste contacts the soldering position of the circuit board. After the scraper 19 moves to the left and abuts against the material guide table 27, the remaining solder paste passes through the material guide The groove 30 is squeezed into the inside of the material receiving groove 28, and then the second electric push rod 31 is controlled to drive the scraper plate 29 to move downward along the inner wall of the material receiving groove 28 and the outer wall on the left side of the scraper bar 19, so that the solder paste squeezed into the material receiving groove 28 is separated from the scraper bar 19, and then the second motor 20 is controlled to drive the screw rod 17 to rotate counterclockwise, drive the linkage frame 18 and the scraper bar 19 to move rightward and reset, and then drive the housing 13 to move up and reset through the lifting mechanism, and drive the turntable 10 and the circuit board inside it to rotate 90° through the auxiliary linkage mechanism, repeat the above-mentioned tin brushing operation, and brush the circuit board from another direction. In this cycle, the circuit board is brushed from four directions in turn, so that the solder paste is fully brushed on the circuit board welding position through the tin guide groove, avoiding the problem of the single direction of automatic solder paste brushing in the prior art that it is difficult to ensure the sufficiency of solder paste brushing, and further ensuring the quality of subsequent electronic component welding; Among them, after the circuit board is brushed with solder paste for the first time, the electromagnet 15 is controlled to be de-energized to separate the template 14 from the shell 13, and then when the shell 13 moves upward, the template 14 is still attached to the top of the circuit board. After the circuit board is brushed with solder paste from four directions, the electromagnet 15 is energized to fix the shell 13 and the template 14 together again, and then when the shell 13 is moved up and reset, the template 14 is driven to move upward synchronously.
[0023] The protection component includes a fixed plate 21 installed inside the housing 13, a plurality of first electric push rods 22 installed at the bottom of the fixed plate 21, and a lifting plate 23 fixed to the extended ends of the plurality of first electric push rods 22; the fixed plate 21 is located on the inner side of the linkage frame 18, so the fixed plate 21 will not affect the movement of the linkage frame 18, and the width of the lifting plate 23 is smaller than the inner diameter of the linkage frame 18, so the linkage frame 18 will not contact the lifting plate 23 when moving left and right; a plurality of limit blocks 24 are installed at the bottom of the lifting plate 23, and the plurality of limit blocks 24 are respectively adapted to the plurality of tin guide grooves on the template 14; After the solder paste is applied to the circuit board, the first electric push rod 22 is controlled to drive the lifting plate 23 and the limit block 24 to move downward, so that the lower edge of the limit block 24 is at the same horizontal height as the upper edge of the tin guide groove, and then the shell 13 and the template 14 are driven to move upward synchronously. In this process, the first electric push rod 22 is controlled to drive the limit block 24 to move downward at the same speed along the inner wall of the tin guide groove, so that the solder paste on the circuit board will not stick to the template 14, further ensuring the quality of soldering.
[0024] The lifting mechanism is provided in multiple pieces. In the present embodiment, there are four lifting mechanisms, which are respectively connected to the tin brushing mechanism, the patch mechanism 2, the heating mechanism 3 and the cooling mechanism 4, and are used to drive the tin brushing mechanism, the patch mechanism 2, the heating mechanism 3 and the cooling mechanism 4 to lift and lower respectively. The lifting mechanism comprises a bracket 32 mounted on the top of the base 1 and a cylinder 33 mounted inside the bracket 32; the tin brushing mechanism, the patch mechanism 2, the heating mechanism 3 and the cooling mechanism 4 are respectively mounted on the extended ends of the cylinders 33 in the multiple lifting mechanisms, wherein the tin brushing mechanism is a shell 13 mounted on the extended end of the cylinder 33; When the circuit board is tinned, the housing 13 is driven to move downward by controlling the cylinder 33. After the tinning is completed, the housing 13 is driven to move upward by controlling the cylinder 33. When mounting the circuit board, the control cylinder 33 drives the mounting mechanism 2 to move downward to the top of the material discharge trough 11, and each electronic component is placed at the corresponding welding position; after the mounting is completed, the control cylinder 33 drives the mounting mechanism 2 to move upward and reset; When the circuit board is heated, the control cylinder 33 drives the heating mechanism 3 to move downward to the top of the discharge trough 11, and the heating mechanism 3 is started to heat the circuit board inside the positioning groove 12 to melt the solder paste. After the circuit board is heated, the control cylinder 33 drives the heating mechanism 3 to move upward and reset; When the circuit board is cooled, the control cylinder 33 drives the cooling mechanism 4 to move downward to the top of the discharge trough 11, and the cooling mechanism 4 is started to cool the circuit board to fix the electronic components and the circuit board together. After cooling is completed, the control cylinder 33 drives the cooling mechanism 4 to move upward and reset.
[0025] The auxiliary linkage mechanism is connected to the positioning mechanism and is used to drive the circuit board to rotate. The auxiliary linkage mechanism includes a driven shaft 34 fixedly connected to the bottom center of the turntable 10 and a second one-way gear 35 installed outside the driven shaft 34; the base 1 is internally rotatably connected to a ring gear 36, and a third motor 37 is also installed on the inner wall of the bottom of the base 1. The output end of the third motor 37 is fixedly connected to a second gear 38, and the upper edge of the second gear 38 is lower than the lower edge of the second one-way gear 35. The second one-way gear 35 and the second gear 38 are both meshed with the ring gear 36; Wherein, a heat conducting material or a heat insulating material is disposed between two adjacent rotating disks 10, and the heat conducting material and the heat insulating material are alternately disposed in a clockwise direction, such as Figure 2 As shown, at this time, there is a heat insulating material between the left turntable 10 (the turntable 10 under the housing 13) and the front turntable 10 (the turntable 10 under the patch mechanism 2), a heat conductive material between the right turntable 10 of the front turntable 10 (the turntable 10 under the heating mechanism 3), a heat insulating material between the right turntable 10 and the rear turntable 10 (the turntable 10 under the cooling mechanism 4), and a heat conductive material between the rear turntable 10 and the left turntable 10; When the turntable 5 rotates clockwise, it drives each second one-way gear 35 to move along a clockwise circular track. In this process, the second one-way gear 35 is driven to rotate counterclockwise through the meshing effect between the second one-way gear 35 and the ring gear 36. When the second one-way gear 35 rotates counterclockwise, the driven shaft 34 does not rotate accordingly. The third motor 37 is controlled to drive the second gear 38 to rotate clockwise. The meshing effect between the second gear 38 and the gear ring 36 drives the gear ring 36 to rotate clockwise, thereby driving each second one-way gear 35 to rotate clockwise synchronously. When the second one-way gear 35 rotates clockwise, the driven shaft 34 is driven to rotate synchronously, thereby driving the turntable 10 to rotate synchronously. The turntable 10 is driven to pause every 90° rotation, thereby facilitating the change of the direction of the circuit board, thereby tinning the circuit board from different directions. At the same time, after the circuit board is mounted, the circuit board after the mounting is driven to pause every 90° rotation. Through the heat conductive material, the circuit board after the mounting can be uniformly preheated. When the circuit board is heated, the temperature inside the discharge trough 11 can be made more uniform by driving the circuit board to pause every 90° rotation, thereby making the solder paste melt more uniformly, thereby avoiding the problem of incomplete melting of the local solder paste. When the circuit board is cooled, the melted solder paste can be cooled from different directions by driving the circuit board to pause every 90° rotation, thereby reducing the difference in the cooling speed of the melted solder paste.
[0026] The ejection mechanism is installed inside the base 1 and is used to eject the soldered circuit board. The ejection mechanism includes an ejection plate 39 arranged inside the positioning groove 12, a lifting rod 40 installed at the bottom of the ejection plate 39, and a transmission shaft 41 rotatably connected to the inner wall of the bottom of the base 1; the lifting rod 40 is arranged to penetrate the driven shaft 34 and does not contact the driven shaft 34, and the lower edge of the lifting rod 40 is higher than the upper edge of the second gear 38; a third one-way gear 42 is installed on the outside of the transmission shaft 41, and the third one-way gear 42 is meshed with the first gear 8; a reciprocating screw 43 is also fixedly sleeved on the outside of the transmission shaft 41, and a lifting block 44 is screwed on the outside of the reciprocating screw 43, and a lifting rod 45 is fixedly connected to the top of the lifting block 44, and the lifting rod 45 is located directly below the lifting rod 40 in a static state; a limit rod 46 is also fixedly connected to the inner wall of the bottom of the base 1, and the lifting block 44 is also slidably sleeved on the outside of the limit rod 46; After the circuit board is cooled and the cooling mechanism 4 is moved up and reset, the first motor 6 is controlled to drive the first gear 8 to rotate clockwise, and the first gear 8 is meshed with the third one-way gear 42 to drive the transmission shaft 41 to rotate counterclockwise. At this time, the first one-way gear 9 also rotates accordingly, but the driving shaft 7 does not rotate accordingly. When the transmission shaft 41 rotates, the reciprocating screw 43 is driven to rotate synchronously, and then the lifting block 44 is driven to move from the bottom end of the reciprocating screw 43 to the top end thereof. In this process, the lifting rod 45 drives the lifting rod 40 to move upward synchronously, and the ejection plate 39 moves upward synchronously, so that the circuit board after cooling is ejected upward from the inside of the discharge trough 11, so that the staff can take it out easily. After the circuit board is taken out, the reciprocating screw 43 is driven to continue to rotate by the first motor 6, driving the lifting block 44 and the lifting rod 45 to move down and reset. The lifting rod 40 and the ejection plate 39 are affected by their own gravity and move down and reset accordingly.
[0027] It should be noted that the device structure and drawings of the present invention mainly describe the principle of the present invention. In terms of the technology of the design principle, the settings of the power mechanism, power supply system and control system of the device are not fully described. On the premise that the technical personnel in the field understand the principle of the above invention, the specific details of the power mechanism, power supply system and control system can be clearly known. The control method of the application document is to automatically control by a controller, and the control circuit of the controller can be realized by simple programming by the technical personnel in the field; the above only describes some exemplary embodiments of the present invention by way of explanation. Undoubtedly, for ordinary technicians in the field, the described embodiments can be modified in various different ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.
Claims
1. A circuit board welding tool for electronic computer production, comprising a base (1), a patch mechanism (2), a heating mechanism (3) and a cooling mechanism (4), characterized in that: Also includes: A turntable (5) rotatably connected to the top of the base (1); A positioning mechanism, which is provided in plurality and is installed inside the base (1) and is used to position the circuit board; A tin brushing mechanism, which is arranged above the base (1) and is used to brush the solder paste onto the circuit board from different directions and is also used to prevent the solder paste from separating from the circuit board; A plurality of lifting mechanisms are provided and are respectively connected to the tinning mechanism, the patch mechanism (2), the heating mechanism (3) and the cooling mechanism (4), and are used to respectively drive the tinning mechanism, the patch mechanism (2), the heating mechanism (3) and the cooling mechanism (4) to rise and fall; An auxiliary linkage mechanism, which is connected to the positioning mechanism and is used to drive the circuit board to rotate; An ejection mechanism is installed inside the base (1) and is used to eject a soldered circuit board.
2. The circuit board welding tool for electronic computer production according to claim 1, characterized in that: A driving mechanism is also installed inside the base (1), and the driving mechanism comprises a first motor (6) installed on the inner wall of the bottom of the base (1) and a driving shaft (7) fixedly connected to the center of the bottom of the turntable (5); The first motor (6) has an output shaft which is fixedly sleeved externally with a first gear (8); The bottom end of the driving shaft (7) is rotatably connected to the inner wall of the bottom of the base (1); a first one-way gear (9) is mounted on the outside of the driving shaft (7); and the first gear (8) is meshed with the first one-way gear (9).
3. The circuit board welding tool for electronic computer production according to claim 2, characterized in that: The positioning mechanism comprises a turntable (10) rotatably connected to the inside of the turntable (5), a material discharge trough (11) provided on the top of the turntable (10), and a positioning groove (12) provided at the bottom of the material discharge trough (11); The rotating disks (10) in the plurality of positioning mechanisms are distributed in a ring array with the driving shaft (7) as the center.
4. The circuit board welding tool for electronic computer production according to claim 3 is characterized in that: The tin brushing mechanism comprises a housing (13), a template (14), a magnetic suction component, a tin scraping component, a material feeding component, a material receiving component and a protective component; The template (14) is arranged at the bottom of the housing (13), and a plurality of tin guide grooves corresponding to the welding positions of the circuit board are provided on the template (14); The magnetic attraction assembly comprises two electromagnets (15) installed inside the housing (13) and two groups of iron blocks (16) installed inside the template (14), wherein the electromagnets (15) cooperate with the iron blocks (16); The tin scraping assembly comprises a screw rod (17) rotatably connected to the inside of the housing (13), a linkage frame (18) screwed to the outside of the screw rod (17), and a scraping strip (19) fixed to the bottom of the linkage frame (18), the top of the linkage frame (18) is slidably connected to the inner wall of the top of the housing (13), one end of the screw rod (17) is connected to a second motor (20), and the second motor (20) is mounted on the outer wall of the housing (13), and an oblique groove is provided at the bottom of one side of the scraping strip (19).
5. The circuit board welding tool for electronic computer production according to claim 4, characterized in that: The protection assembly comprises a fixing plate (21) installed inside the housing (13), a plurality of first electric push rods (22) installed at the bottom of the fixing plate (21), and a lifting plate (23) fixed to the extended ends of the plurality of first electric push rods (22); A plurality of limit blocks (24) are installed at the bottom of the lifting plate (23), and the plurality of limit blocks (24) are respectively adapted to a plurality of tin guide grooves on the template (14); The feeding assembly comprises a material guide pipe (25) installed inside the fixed plate (21), one end of the material guide pipe (25) extends to the outside of the shell (13), and the other end of the material guide pipe (25) is installed with a plurality of vertically downward diversion pipes (26).
6. A circuit board welding tool for electronic computer production according to claim 5, characterized in that: The material receiving assembly comprises a material guide platform (27) fixedly connected to an inner wall of one side of the shell (13), a material receiving trough (28) provided inside the shell (13), and a scraper plate (29) provided inside the material receiving trough (28); The material guide platform (27) is adapted to the oblique groove; A material guide groove (30) is provided on the inner wall of one side of the shell (13), and the material guide groove (30) is located on the top of the material guide platform (27) and is connected to the material receiving groove (28); A second electric push rod (31) is installed inside the housing (13), and an extended end of the second electric push rod (31) is fixedly connected to the top of the scraper plate (29); A tin discharge groove is provided on the outer wall of the housing (13) on a side close to the material receiving groove (28).
7. A circuit board welding tool for electronic computer production according to claim 6, characterized in that: The lifting mechanism comprises a bracket (32) installed on the top of the base (1) and a cylinder (33) installed inside the bracket (32); The tin brushing mechanism, the patch mechanism (2), the heating mechanism (3) and the cooling mechanism (4) are respectively installed at the extended ends of the cylinders (33) in the plurality of lifting mechanisms.
8. The circuit board welding tool for electronic computer production according to claim 7, characterized in that: The auxiliary linkage mechanism comprises a driven shaft (34) fixedly connected to the bottom center of the rotating disk (10) and a second one-way gear (35) installed outside the driven shaft (34); A gear ring (36) is rotatably connected inside the base (1), a third motor (37) is also mounted on the inner wall of the bottom of the base (1), a second gear (38) is fixedly connected to the output end of the third motor (37), and the second one-way gear (35) and the second gear (38) are both meshed with the gear ring (36).
9. A circuit board welding tool for electronic computer production according to claim 8, characterized in that: The ejection mechanism comprises an ejection plate (39) arranged inside the positioning groove (12), a lifting rod (40) installed at the bottom of the ejection plate (39), and a transmission shaft (41) rotatably connected to the inner wall of the bottom of the base (1); The lifting rod (40) is disposed through the driven shaft (34); A third one-way gear (42) is installed outside the transmission shaft (41), and the third one-way gear (42) is meshed with the first gear (8); The outside of the transmission shaft (41) is also fixedly sleeved with a reciprocating screw (43), the outside of the reciprocating screw (43) is screwed with a lifting block (44), the top of the lifting block (44) is fixedly connected with a lifting rod (45), and the lifting rod (45) is located directly below the lifting rod (40) in a static state; A limiting rod (46) is also fixedly connected to the inner wall of the bottom of the base (1), and the lifting block (44) is also slidably sleeved on the outside of the limiting rod (46).
Citation Information
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Fully automatic tin paste printing machine
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