Substrate processing apparatus

Abstract

A substrate processing apparatus (1) includes a transfer block (5), a processing block (7), and a buffer section (33). The transfer block (5) is provided with: a simultaneous conveyance mechanism (HTR) that accommodates the substrate (W) in the carrier (C); and a first posture conversion mechanism 15 that converts the substrate W into a vertical posture. The processing block (7) has a batch processing region (R1), a single-sheet processing region (R3), a single-sheet substrate conveyance region (R2), and a batch substrate conveyance region (R4). The batch processing area R1 is provided with: batch processing tanks BT1 to BT6; and a second posture conversion mechanism 31 that converts the substrate W into a horizontal posture. For example, a monolithic processing chamber SW1 is provided in the monolithic processing region R3. And a central manipulator CR is arranged in the single substrate conveying area R2. A first conveyance mechanism WTR1 is provided in a batch substrate conveyance area R4. The integrated transport mechanism HTR transports the substrate W to the first posture conversion mechanism 15 and transports the substrate W from the buffer portion 33.

Description

Technical Field

[0001] The present invention relates to a substrate processing device for processing a substrate. Examples of the substrate include semiconductor substrates, substrates for FPD (flat panel display), glass substrates for photomasks, substrates for optical disks, substrates for magnetic disks, ceramic substrates, and substrates for solar cells. Examples of FPD include liquid crystal display devices, organic EL (electroluminescence) display devices, and the like. Background Art

[0002] As a conventional substrate processing apparatus, there is a hybrid substrate processing apparatus (see, for example, patent documents 1 and 2), which comprises: a batch processing module (batch processing unit) for processing a plurality of substrates at a time; and a single-wafer processing module (single-wafer processing unit) for processing substrates processed by the batch processing module one by one.

[0003] The substrate processing device of patent document 1 comprises: a loadport for receiving a cassette; a first robot; two rotating mechanisms for rotating the wafer between a vertical position and a horizontal position; two slots arranged in a row between the two rotating mechanisms; a second robot capable of transporting the wafer in a vertical position between the two rotating mechanisms and the two slots; a plurality of single-wafer cleaning modules for cleaning and drying; and a third robot.

[0004] A plurality of single-wafer cleaning modules are arranged in a row. A first robot takes out five wafers from a cassette at a time and transports the five wafers to a first rotating mechanism. A third robot takes out a wafer from a second rotating mechanism and transports the wafer to a single-wafer cleaning module. The first robot takes out a wafer from a single-wafer cleaning module among a plurality of single-wafer cleaning modules and returns the wafer to the cassette.

[0005] The substrate processing apparatus of Patent Document 2 includes a loading and unloading section, a single-wafer processing section (area), an interface section, and a batch processing section (area). The loading and unloading section includes a cassette stage. The substrate processing apparatus of Patent Document 3 includes a posture conversion mechanism.

[0006] Prior art literature

[0007] Patent Literature

[0008] Patent Document 1: Japanese Patent Application No. 2016-502275

[0009] Patent Document 2: Japanese Patent Application Publication No. 2021-064652

[0010] Patent Document 3: Japanese Patent Application Publication No. 2018-056341 Summary of the invention

[0011] Problems to be solved by the invention

[0012] Conventional substrate processing devices have the following problems. In the substrate processing device of Patent Document 1, the first robot moves along a plurality of single-wafer cleaning modules while taking out five wafers from the cassette at one time and transporting the five wafers to the first rotating mechanism. In addition, the first robot moves along a plurality of single-wafer cleaning modules while taking out a wafer from one of the plurality of single-wafer cleaning modules and returning the wafer to the cassette. Therefore, there is a possibility that the first robot is busy, thereby reducing the throughput of the substrate processing device.

[0013] In addition, in the substrate processing apparatus of Patent Document 2, the loading and unloading section, the single-wafer processing section, the interface section, and the batch processing section are arranged in this order. Therefore, in order to transport the substrate from the loading and unloading section to the batch processing section, it is necessary to pass through the single-wafer processing section. Therefore, there is a possibility that the processing capacity of the substrate processing apparatus is reduced.

[0014] The present invention has been made in view of such circumstances, and an object of the present invention is to provide a substrate processing apparatus capable of improving the processing throughput.

[0015] Means for solving problems

[0016] In order to achieve this purpose, the present invention adopts the following structure. That is, the substrate processing device of the present invention is used to continuously perform batch processing of processing multiple substrates at a time and single-wafer processing of processing substrates one by one, and is characterized in that the substrate processing device has: a storage block; a transfer block adjacent to the storage block; a processing block adjacent to the transfer block; and a substrate loading section for loading multiple substrates in a horizontal posture at a predetermined interval along a vertical direction; the storage block is used to accommodate at least one carrier, and has at least one carrier loading shelf for taking out and accommodating substrates, and the carrier accommodates multiple substrates in a horizontal posture at the predetermined interval along a vertical direction, The carrier loading rack is used for the carrier to load and unload substrates relative to the carrier; the transfer block has: a substrate operating mechanism for taking out and accommodating a plurality of substrates relative to the carrier loaded on the carrier loading rack; and a first posture conversion mechanism for converting a plurality of substrates from a horizontal posture to a vertical posture; the processing block has: a batch processing area extending in a direction away from the transfer block; a single-chip processing area, one end of which is located close to the transfer block and the other end of which extends in a direction away from the transfer block; a single-chip substrate conveying area sandwiched between the batch processing area and The single-wafer processing area has one end adjacent to the transfer block and the other end extending in a direction away from the transfer block; and a batch substrate conveying area is arranged along the batch processing area, one end extending to the transfer block and the other end extending in a direction away from the transfer block; in the batch processing area, a plurality of batch processing tanks for simultaneously immersing and processing a plurality of substrates are arranged in the direction in which the batch processing area extends, and a second posture conversion mechanism for converting a plurality of substrates from a vertical posture to a horizontal posture is also provided; in the single-wafer processing area, a plurality of batch processing tanks for simultaneously immersing and processing a plurality of substrates are arranged in the direction in which the batch processing area extends A single-wafer processing chamber for processing substrates one by one is arranged on the transfer block; a single-wafer substrate conveying mechanism for conveying substrates between the second posture conversion mechanism, the single-wafer processing chamber and the substrate loading section is arranged in the single-wafer substrate conveying area; a batch substrate conveying mechanism for conveying a plurality of substrates at a time between a substrate handover position set in the transfer block, a plurality of the batch processing slots and the second posture conversion mechanism is arranged in the batch substrate conveying area; the substrate operating mechanism of the transfer block also conveys a plurality of substrates to the first posture conversion mechanism at a time, and conveys a plurality of substrates from the substrate loading section at a time.

[0017] According to the substrate processing device of the present invention, the batch processing area, the single-wafer processing area, and the single-wafer substrate conveying area are formed in a manner extending from the transfer block side. A plurality of batch processing tanks are arranged in the direction in which the batch processing area extends. In addition, a plurality of single-wafer processing chambers are arranged in the direction in which the single-wafer processing area extends. In addition, a single-wafer substrate conveying mechanism is provided in the single-wafer substrate conveying area sandwiched by the plurality of batch processing tanks and the plurality of single-wafer processing chambers. The batch substrate conveying mechanism is provided in the batch substrate conveying area along the plurality of batch processing tanks. Therefore, the substrate processing device of the present invention can smoothly convey substrates.

[0018] Specifically described. The substrate handling mechanism of the transfer block can take out a plurality of substrates from the carrier at a time, and can transport the plurality of substrates to the first posture conversion mechanism at a time. In addition, the batch substrate transport mechanism transports a plurality of substrates between the substrate handover position, the batch processing tank, and the second posture conversion mechanism. In addition, the single-chip substrate transport mechanism transports substrates between the second posture conversion mechanism, the single-chip processing chamber, and the substrate loading unit. In addition, the substrate handling mechanism receives a plurality of substrates from the substrate loading unit at a time, and accommodates the plurality of substrates in the carrier at a time.

[0019] Therefore, a plurality of substrates can be directly transported from the transfer block to the batch processing area without being transported to the single-wafer processing area before being transported to the batch substrate processing area. In addition, the substrate handling mechanism does not access each single-wafer processing chamber, but transports a plurality of substrates at a time between the carrier, the first posture conversion mechanism, and the substrate loading portion. Thus, a plurality of substrates can be quickly transported from the carrier to the first posture conversion mechanism, and a plurality of substrates can be quickly transported from the substrate loading portion to the carrier. Therefore, the substrate processing device of the present invention can smoothly transport substrates. Therefore, the processing volume can be improved.

[0020] Furthermore, preferably, in the substrate processing apparatus, the second posture conversion mechanism is provided on the opposite side of the transfer block across the plurality of batch processing tanks.

[0021] The plurality of substrates can be transported from the transfer block to the second posture conversion mechanism while being processed in batches through the batch processing tank, and then the plurality of substrates can be transported from the second posture conversion mechanism to the transfer block while being processed in single wafers through the single wafer processing chamber. Therefore, the plurality of substrates can be transported in a circular shape within the processing block, thereby smoothly transporting the substrates.

[0022] Furthermore, preferably, in the substrate processing apparatus, the second posture conversion mechanism is provided between two batch processing tanks among the plurality of batch processing tanks.

[0023] Since the second posture conversion mechanism is disposed between the two batch processing tanks, the distance from the second posture conversion mechanism to each single-wafer processing chamber can be set to be relatively uniform. Therefore, the single-wafer substrate conveying mechanism can convey the substrate with the center of the single-wafer substrate conveying area as the reference point. Therefore, the moving distance of the single-wafer substrate conveying mechanism can be reduced, thereby improving the conveying efficiency of the substrate.

[0024] In addition, preferably, in the substrate processing device, the second posture conversion mechanism is disposed between the transfer block and the plurality of batch processing tanks. Thus, the second posture conversion mechanism is disposed near the transfer block. Therefore, the substrate can be transported with the transfer block side as a reference point.

[0025] Furthermore, preferably, in the substrate processing apparatus, the substrate placement unit is fixedly disposed at a boundary between the transfer block and the single-piece substrate conveying region, the transfer block, or any one of the single-piece substrate conveying region. Since the substrate placement unit is fixedly disposed and does not move, the structure of the substrate placement unit and the periphery of the substrate placement unit can be simplified.

[0026] In addition, preferably, the substrate processing device further comprises a loading unit moving mechanism; the substrate loading unit is movably disposed in the single-chip substrate conveying region; the loading unit moving mechanism moves the substrate loading unit in the direction in which the single-chip substrate conveying region extends. Since the loading unit is moved by the loading unit moving mechanism, the single-chip substrate conveying mechanism does not need to be moved to the vicinity of the substrate operation mechanism, thereby improving the conveying efficiency of the substrate.

[0027] Furthermore, preferably, in the substrate processing apparatus, the loading unit moving mechanism moves the substrate loading unit in the direction in which the single-chip substrate conveying region extends in a manner that follows the single-chip substrate conveying mechanism. Since the substrate loading unit follows the movement of the single-chip substrate conveying mechanism, the single-chip substrate conveying mechanism can quickly convey the substrate to the substrate loading unit.

[0028] Furthermore, preferably, in the substrate processing device, the single-chip substrate conveying mechanism comprises: a mechanism body; and an upper track, which is arranged above and along the single-chip substrate conveying area; the mechanism body is configured to be suspended from the upper track and move along the upper track. It is possible to prevent the droplets falling from the wet substrate from contaminating the mechanism body (e.g., the advancing and retreating part and the lifting and rotating part). For example, the single-chip substrate conveying mechanism may malfunction because the mechanism body is contaminated by droplets, but this can be prevented.

[0029] Furthermore, preferably, in the substrate processing apparatus, the second posture conversion mechanism comprises: a substrate holding portion for holding a plurality of substrates in a vertical posture conveyed by the batch substrate conveying mechanism; a substrate extraction mechanism for extracting two or more substrates from the plurality of substrates held by the substrate holding portion; and a posture conversion portion for converting the postures of the two or more substrates extracted by the substrate extraction mechanism from a vertical posture to a horizontal posture. Thus, the posture conversion portion can convert the postures of the two or more substrates extracted by the substrate extraction mechanism.

[0030] Effects of the Invention

[0031] According to the substrate processing apparatus of the present invention, it is possible to improve the processing throughput. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 This is a plan view showing a schematic structure of the substrate processing apparatus according to the first embodiment.

[0033] Figure 2 It is a side view showing the collective transport mechanism.

[0034] Figure 3 (a) to (f) are side views for explaining the posture conversion portion and the pusher mechanism of the transfer block.

[0035] Figure 4 (a) is a top view showing the second posture conversion mechanism, and (b) is a front view showing the second posture conversion mechanism.

[0036] Figure 5 It is a side view for explaining the second conveying mechanism and the posture conversion unit.

[0037] Figure 6 (a) is a plan view showing the auxiliary clamp opening and closing portion of the posture conversion unit, and (b) is a side view showing the advancing and retreating portion of the posture conversion unit.

[0038] Figure 7 (a) and (b) are diagrams for explaining the operation of the advancing and retreating section of the posture conversion section.

[0039] Figure 8 This is a flowchart for explaining the operation of the substrate processing apparatus.

[0040] Fig. 9 This is a flowchart for explaining the operation of the first half of the second posture transition mechanism.

[0041] Fig.10 This is a flowchart for explaining the operation of the second half of the second posture transition mechanism.

[0042] Fig.11(a) to (d) are plan views for explaining the operation of the second posture conversion mechanism.

[0043] Fig.12 (a) to (d) are front views for explaining the second posture conversion mechanism.

[0044] Fig.13 (a) and (b) are plan views for explaining the operation of the second posture conversion mechanism, and (c) and (d) are front views for explaining the operation of the second posture conversion mechanism.

[0045] Fig.14 (a) is a longitudinal sectional view showing the pusher mechanism of the second posture conversion mechanism of the second embodiment, and (b) is a top view showing the second posture conversion mechanism of the second embodiment.

[0046] Fig.15 This is a plan view showing a schematic structure of a substrate processing apparatus according to a third embodiment.

[0047] Fig.16 (a) and (b) are side views for explaining the buffer portion of Example 3.

[0048] Fig.17 This is a plan view showing a schematic structure of a substrate processing apparatus according to a fourth embodiment.

[0049] Fig.18 This is a plan view showing the schematic structure of the substrate processing apparatus of Example 5.

[0050] Fig.19 It is a plan view showing a schematic structure of a substrate processing apparatus according to a modified example.

[0051] Fig. 20 It is a side view showing a ceiling-mounted center robot according to a modified example. DETAILED DESCRIPTION

[0052] Example 1

[0053] Hereinafter, Embodiment 1 of the present invention will be described with reference to the drawings. Figure 1 1 is a plan view showing a schematic structure of a substrate processing apparatus 1 according to the first embodiment. Figure 2 It is a side view which shows the collective transport mechanism HTR. Figure 3 (a) to Figure 3 (f) is used to illustrate the side view of the posture conversion part and the pusher mechanism in the transfer block.

[0054] <1. Overall structure>

[0055] Reference Figure 1The substrate processing apparatus 1 includes a storage block 3, a transfer block 5, and a processing block 7. The storage block 3, the transfer block 5, and the processing block 7 are arranged in a row in this order in the horizontal direction.

[0056] The substrate processing device 1 performs, for example, chemical liquid processing, cleaning processing, and drying processing on the substrate W. The substrate processing device 1 continuously performs batch processing and single-wafer processing on the substrate W. That is, the substrate processing device 1 performs single-wafer processing on the substrate W after performing batch processing. Batch processing is a processing method for processing a plurality of substrates W at once. Single-wafer processing is a processing method for processing substrates W one by one.

[0057] For the sake of convenience in this specification, the direction in which the storage block 3, the transfer block 5, and the processing block 7 are arranged is referred to as the "front-to-back direction X". The front-to-back direction X is horizontal. The direction from the transfer block 5 toward the storage block 3 in the front-to-back direction X is referred to as the "front". The direction opposite to the front is referred to as the "rear". The horizontal direction perpendicular to the front-to-back direction X is referred to as the "width direction Y". One direction of the width direction Y is appropriately referred to as the "right". The direction opposite to the right is referred to as the "left". The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z". For example, in Figure 1 In the figure, the front, rear, left, right, top and bottom are appropriately shown as references.

[0058] <2. Storage Block 3>

[0059] The storage block 3 is used to accommodate at least one carrier C. One or more (for example, two) loading ports 9 are provided in the storage block 3. The storage block 3 has a carrier transport mechanism (robot) 11 and a rack 13.

[0060] The carrier transport mechanism 11 transports the carrier C between the loading port 9 and the rack 13. The carrier transport mechanism 11 has a gripping portion or hand for gripping a protrusion on the upper surface of the carrier C and for supporting the carrier C while contacting the bottom surface of the carrier C. The rack 13 is classified into a rack 13A for taking out and accommodating the substrate W and a rack 13B for storage.

[0061] The shelf 13A is arranged adjacent to the transfer block 5. The shelf 13A may also be provided with a mechanism for loading and unloading a cover of the carrier C. At least one shelf 13A is provided. The shelf 13A carries the carrier C. The carrier C accommodates a plurality of substrates W (for example, twenty-five) in a horizontal posture at predetermined intervals (for example, 10 mm intervals) along the vertical direction Z. In addition, the substrates W are neatly arranged in the thickness direction of the substrate W. As the carrier C, for example, a FOUP (Front Opening Unify Pod; front-opening wafer transfer box) can be used. FOUP is a closed container. The carrier C may also be an open container, regardless of its type. In addition, the shelf 13A is equivalent to the carrier mounting shelf of the present invention.

[0062] <3. Transfer Block>

[0063] The transfer block 5 is disposed adjacent to the rear of the storage block 3. The transfer block 5 includes a batch transport mechanism (robot) HTR and a first posture conversion mechanism 15. The batch transport mechanism HTR corresponds to the substrate handling mechanism of the present invention.

[0064] The collective transport mechanism HTR is provided on the right Y side in the transfer block 5. The collective transport mechanism HTR collectively transports a plurality of (e.g., twenty-five) substrates W in a horizontal posture. The collective transport mechanism HTR collectively takes out a plurality of substrates W from the carrier C mounted on the rack 13A and collectively accommodates the plurality of substrates W in the carrier C mounted on the rack 13A. In addition, the collective transport mechanism HTR is configured to collectively transfer a plurality of substrates W between the collective transport mechanism HTR and the first posture conversion mechanism 15 and between the collective transport mechanism HTR and the buffer section 33 described later. That is, the collective transport mechanism HTR can transport a plurality of substrates W between the carrier C mounted on the rack 13A, the first posture conversion mechanism 15, and the buffer section 33.

[0065] Reference Figure 2 The collective transport mechanism HTR has a plurality of (for example, twenty-five) hands 17. Figure 2 For ease of illustration, the collective transport mechanism HTR is depicted as having three hands 17. Each hand 17 holds a single substrate W.

[0066] In addition, the transport mechanism HTR includes a hand support part 19, an advance and retreat part 20, and a lifting and rotating part 21. The hand support part 19 supports a plurality of hands 17. Thus, the plurality of hands 17 move integrally. The advance and retreat part 20 advances and retreats the plurality of hands 17 via the hand support part 19. The lifting and rotating part 21 rotates the advance and retreat part 20 around the vertical axis AX1, thereby rotating the plurality of hands 17 and the like around the vertical axis AX1. In addition, the lifting and rotating part 21 raises and lowers the advance and retreat part 20, thereby raising and lowering the plurality of hands 17 and the like. The lifting and rotating part 21 is fixed to the ground. That is, the lifting and rotating part 21 does not move in the horizontal direction. In addition, the advance and retreat part 20 and the lifting and rotating part 21 each include an electric motor. In addition, in addition to the hand 17 and the hand support part 19, the transport mechanism HTR may also include a hand (not shown) for transporting a substrate W.

[0067] Reference Figure 1 The first posture conversion mechanism 15 converts the plurality of substrates W from a horizontal posture to a vertical posture. The first posture conversion mechanism 15 includes a posture conversion unit 23 and a pusher mechanism 25. Figure 1 In FIG. 2 , the collective transport mechanism HTR, the posture conversion unit 23 and the pusher mechanism 25 are arranged in this order on the left side Y. As shown in FIG. Figure 3 (a) to Figure 3 (f) is a diagram for explaining the first posture conversion mechanism 15 .

[0068] like Figure 1 as well as Figure 3 As shown in (a) in FIG. 1 , the posture conversion unit 23 includes a support table 23A, a pair of horizontal holding units 23B, a pair of vertical holding units 23C, and a rotation drive unit 23D. The pair of horizontal holding units 23B and the pair of vertical holding units 23C are provided on the support table 23A. The horizontal holding units 23B and the vertical holding units 23C receive a plurality of substrates W transported by the collective transport mechanism HTR. When the substrate W is in a horizontal posture, the pair of horizontal holding units 23B supports the substrate W from below while contacting the lower surface of each substrate W. In addition, when the substrate W is in a vertical posture, the pair of vertical holding units 23C holds the substrate W.

[0069] The rotation drive unit 23D supports the support table 23A so that the support table 23A can rotate around the horizontal axis AX2. The rotation drive unit 23D rotates the support table 23A around the horizontal axis AX2 to change the posture of the plurality of substrates W held by the holding units 23B and 23C from horizontal to vertical.

[0070] like Figure 1 as well as Figure 3As shown in (f) in FIG. 1 , the pusher mechanism 25 includes a pusher 25A, a lifting and rotating part 25B, a horizontal moving part 25C, and a rail 25D. The pusher 25A supports the lower part of each of a plurality of (e.g., fifty) substrates W in a vertical posture. Figure 3 (a) to Figure 3 In (f) , for ease of illustration, the pusher 25A is configured to support six substrates W.

[0071] The lifting and rotating part 25B is connected to the lower surface of the pusher 25A. The lifting and rotating part 25B lifts the pusher 25A in the up and down direction by telescoping. In addition, the lifting and rotating part 25B rotates the pusher 25A around the vertical axis AX3. The horizontal moving part 25C supports the lifting and rotating part 25B. The horizontal moving part 25C moves the pusher 25A and the lifting and rotating part 25B horizontally along the track 25D. The track 25D is formed in a manner extending along the width direction Y. In addition, the rotation drive part 23D, the lifting and rotating part 25B and the horizontal moving part 25C each have an electric motor.

[0072] Here, the operation of the first posture conversion mechanism 15 is described. The batch processing tanks BT1 to BT6 described later in the processing block 7 process, for example, fifty substrates W of two carriers C at a time. The first posture conversion mechanism 15 converts the postures of the fifty substrates W twenty-five by twenty-five. In addition, the first posture conversion mechanism 15 arranges the plurality of substrates W face to face at a predetermined interval (half pitch). The half pitch is, for example, 5 mm interval. The pusher mechanism 25 transports the fifty substrates W to the first transport mechanism WTR1.

[0073] In addition, the twenty-five substrates W in the first carrier C are described as substrates W1 of the first substrate group. The twenty-five substrates W in the second carrier C are described as substrates W2 of the second substrate group. Figure 3 (a) to Figure 3 For the convenience of illustration, (f) is illustrated by assuming that the number of substrates W1 in the first substrate group is three and the number of substrates W2 in the second substrate group is three. In addition, when there is no particular distinction between substrates W1 and W2, substrates W1 and W2 are recorded as "substrates W".

[0074] Reference Figure 3(a) in the figure. The posture conversion unit 23 receives the twenty-five substrates W1 of the first substrate group transported by the collective transport mechanism HTR with the holding units 23B and 23C. At this time, the twenty-five substrates W1 are in a horizontal posture with the device side facing upward. The twenty-five substrates W1 are arranged at a predetermined interval (full pitch). The full pitch is, for example, 10 mm interval. The full pitch is also called a normal pitch.

[0075] In addition, the half pitch is the interval of half the full pitch. In addition, the device surface of the substrate W (W1, W2) refers to the surface on which the electronic circuit is formed, also referred to as the "front surface". In addition, the back surface of the substrate W refers to the surface on which the electronic circuit is not formed. The surface on the opposite side of the device surface is the back surface.

[0076] Reference Figure 3 (b) in FIG. 1. The posture conversion unit 23 rotates the holding units 23B and 23C by 90 degrees (angle) around the horizontal axis AX2, thereby converting the postures of the twenty-five substrates W1 from horizontal to vertical. Figure 3 (c) in the figure. The pusher mechanism 25 causes the pusher 25A to rise to a position higher than the holding parts 23B and 23C of the posture conversion part 23. As a result, the pusher 25A receives the twenty-five substrates W from the holding parts 23B and 23C. The twenty-five substrates W1 held by the pusher 25A face the left direction Y. In addition, Figure 3 (a) to Figure 3 In (f) of FIG. 8 , an arrow AR added to the substrate W indicates the direction of the device surface of the substrate W.

[0077] Reference Figure 3 (d) in the figure. The pusher mechanism 25 rotates the twenty-five substrates W in the vertical posture 180 degrees around the vertical axis AX3. As a result, the twenty-five substrates W1 are flipped over and face the right direction Y. Moreover, the flipped twenty-five substrates W1 move half the pitch (for example, 5 mm) to the left direction Y from the position before the rotation. In addition, the holding parts 23B and 23C of the posture conversion part 23 are rotated -90 degrees around the horizontal axis AX2 to become a state capable of receiving the next substrate W2. Thereafter, the posture conversion part 23 receives the twenty-five substrates W2 of the second substrate group transported by the simultaneous transport mechanism HTR with the holding parts 23B and 23C. At this time, the twenty-five substrates W2 are in a horizontal posture with the device surface facing upward. In addition, the posture conversion part 23 and the pusher mechanism 25 operate in a manner that does not interfere with each other.

[0078] Reference Figure 3(e) in the figure. The pusher mechanism 25 lowers the pusher 25A for holding the twenty-five substrates W1 of the first substrate group to the retracted position. Then, the posture conversion unit 23 converts the posture of the twenty-five substrates W2 from horizontal to vertical. The twenty-five substrates W2 after the posture conversion face the left direction Y. Figure 3 (f) in the figure. Then, the pusher mechanism 25 raises the pusher 25A for holding the twenty-five substrates W2 of the second substrate group. Thus, the pusher mechanism 25 further receives twenty-five substrates W2 from the posture conversion unit 23.

[0079] Thus, the pusher 25A holds fifty substrates W (W1, W2) of the first substrate group and the second substrate group. The fifty substrates W are configured such that twenty-five substrates W1 and twenty substrates W2 are arranged alternately one by one. The fifty substrates W are arranged at half pitch (e.g., 5 mm interval). Moreover, the twenty-five substrates W1 face the opposite direction to the twenty-five substrates W2. Therefore, the fifty substrates W are arranged face to face. That is, the two device surfaces (or two back surfaces) of the two adjacent substrates W1 and W2 are opposite to each other.

[0080] Thereafter, the pusher mechanism 25 moves the pushers 25A holding the fifty substrates W along the rails 25D to the substrate taking-over position PP below the pair of clamps 49 and 50 of the first transport mechanism WTR1 .

[0081] <4. Processing Block 7>

[0082] The processing block 7 is adjacent to the transfer block 5. The processing block 7 is arranged at the rear X of the transfer block 5. The processing block 7 has a batch processing area R1, a single substrate transfer area R2, a single substrate processing area R3, and a batch substrate transfer area R4. The substrate processing apparatus 1 has an electrical installation area R5.

[0083] <4-1. Batch processing area R1>

[0084] The batch processing area R1 is adjacent to the transfer block 5, the single substrate conveying area R2, and the batch substrate conveying area R4. In addition, the batch processing area R1 is arranged between the single substrate conveying area R2 and the batch substrate conveying area R4. One end side of the batch processing area R1 is adjacent to the transfer block 5, and the other end side of the batch processing area R1 extends in the direction away from the transfer block 5, that is, backward.

[0085] In the batch processing region R1, for example, six batch processing tanks BT1 to BT6 and a second posture conversion mechanism 31 are provided. The six batch processing tanks BT1 to BT6 are arranged in a row in the front-rear direction X extending in the batch processing region R1. In addition, the second posture conversion mechanism 31 is arranged on the opposite side of the transfer block 5 across the six batch processing tanks BT1 to BT6. That is, the six batch processing tanks BT1 to BT6 are arranged between the transfer block 5 and the second posture conversion mechanism 31. In addition, the second posture conversion mechanism 31 (push mechanism 61) is arranged on the extension line of the row of the six batch processing tanks BT1 to BT6. In addition, the number of batch processing tanks is not limited to six, as long as it is a plurality of batch processing tanks.

[0086] The six batch processing tanks BT1 to BT6 respectively perform immersion processing on a plurality of substrates W in a vertical posture. For example, the six batch processing tanks BT1 to BT6 are composed of four liquid processing tanks BT1 to BT4 and two water washing processing tanks BT5 and BT6. Specifically, the two liquid processing tanks BT1 and BT2 and the water washing processing tank BT5 are used as a group. In addition, the two liquid processing tanks BT3 and BT4 and the water washing processing tank BT6 are used as another group.

[0087] The four chemical liquid treatment tanks BT1 to BT4 perform etching treatment using chemical liquid, respectively. As the chemical liquid, phosphoric acid, for example, can be used. The chemical liquid treatment tank BT1 stores the chemical liquid supplied from the chemical liquid discharge pipe not shown. The chemical liquid discharge pipe is provided on the inner wall of the chemical liquid treatment tank BT1. The three chemical liquid treatment tanks BT2 to BT4 are respectively configured to be the same as the chemical liquid treatment tank BT1.

[0088] The two water washing treatment tanks BT5 and BT6 respectively perform a pure water washing treatment for washing the chemical solution attached to the plurality of substrates W with pure water. As the pure water, for example, deionized water (DIW) can be used. The two water washing treatment tanks BT5 and BT6 respectively store pure water supplied from a washing liquid discharge pipe not shown. The washing liquid discharge pipe is provided on the inner wall of each of the water washing treatment tanks BT5 and BT6.

[0089] Six lifts LF1 to LF6 are provided in the six batch processing tanks BT1 to BT6, respectively. For example, lift LF1 holds a plurality of substrates W arranged in a vertical posture at a predetermined interval (half pitch). In addition, lift LF1 lifts and lowers a plurality of substrates W between a processing position inside the batch processing tank (chemical liquid processing tank) BT1 and a handover position above the batch processing tank BT1. The other five lifts LF2 to LF6 are configured in the same manner as lift LF1.

[0090] The second posture conversion mechanism 31 converts the postures of the plurality of substrates W from vertical to horizontal all at once. The details of the second posture conversion mechanism 31 will be described later.

[0091] <4-2. Single-piece substrate transport area R2>

[0092] The single-chip substrate transport area R2 is adjacent to the transfer block 5, the batch processing area R1, the single-chip processing area R3, and the electrical installation area R5. In addition, the single-chip substrate transport area R2 is sandwiched between the batch processing area R1 and the single-chip processing area R3. One end side of the single-chip substrate transport area R2 is adjacent to the transfer block 5. In addition, the other end side of the single-chip substrate transport area R2 extends in the direction away from the transfer block 5, that is, in the rear.

[0093] The single-wafer substrate transfer region R2 includes a central robot CR and a buffer section 33. The central robot CR transfers the substrate W between the second posture conversion mechanism 31, the single-wafer processing chambers SW1 to SW4 described later, and the buffer section 33. The central robot CR includes two hands 35, an advance and retreat section 37, a lifting and rotating section 39, and a horizontal moving section 41 (including a guide rail).

[0094] The two hands 35 each hold a substrate W in a horizontal posture. The advancing and retreating portion 37 supports the hand 35 so that it can move, and enables the hand 35 to advance and retreat respectively. The lifting and rotating portion 39 rotates the hand 35 and the advancing and retreating portion 37 around the vertical axis AX11. In addition, the lifting and rotating portion 39 enables the hand 35 and the advancing and retreating portion 37 to rise and fall. The guide rail is provided along the direction in which the single-chip substrate conveying area R2 extends, and is provided on the ground of the single-chip substrate conveying area R2. The horizontal moving portion 41 enables the hand 35 and the advancing and retreating portion 37 to move in the front-back direction X along the guide rail. In addition, the advancing and retreating portion 37, the lifting and rotating portion 39, and the horizontal moving portion 41 each have an electric motor.

[0095] For example, the advancing and retreating unit 37 advances the two hands 35 and takes out two substrates W from the second posture conversion mechanism 31. After that, the advancing and retreating unit 37 may advance one hand 35 for holding one substrate W and transport one substrate W to one single-wafer processing chamber. In addition, the central robot CR may have one or more than three hands 35. In the case of having more than three hands 35, the central robot CR advances and retreats the three or more hands 35 respectively.

[0096] The buffer section 33 has a plurality of loading racks. The plurality of loading racks are in a horizontal posture. The plurality of loading racks can each carry one substrate W. The buffer section 33 carries the plurality of substrates W in a horizontal posture at a predetermined interval (full pitch) along the vertical direction Z. That is, the plurality of loading racks are arranged at a predetermined interval (full pitch) and along the vertical direction Z. The buffer section 33 is configured to carry at least twenty-five substrates W that can be carried by the collective transport mechanism HTR. The buffer section 33 is configured to carry, for example, fifty substrates W.

[0097] In addition, if Figure 1 As shown, in detail, the buffer section 33 is arranged across the transfer block 5 and the single-chip substrate conveying area R2. That is, the buffer section 33 is set at the boundary between the transfer block 5 and the single-chip substrate conveying area R2. In addition, the buffer section 33 can also be set only in the transfer block 5 or the single-chip substrate conveying area R2. Therefore, the buffer section 33 only needs to be fixedly set at the boundary between the transfer block 5 and the single-chip substrate conveying area R2, the transfer block 5, and the single-chip substrate conveying area R2. Since the buffer section 33 is fixedly set and does not move, the structure of the buffer section 33 and the surrounding of the buffer section 33 can be simplified.

[0098] The buffer section 33 corresponds to the substrate placement section of the present invention. The central robot CR corresponds to the single-substrate transfer mechanism of the present invention.

[0099] <4-3. Single chip processing area R3>

[0100] The single-wafer processing area R3 is adjacent to the single-wafer substrate conveying area R2 and the electrical installation area R5. One end side of the single-wafer processing area R3 is located close to the transfer block 5 across the electrical installation area R5. The electrical installation area R5 is provided with circuits required for the substrate processing apparatus 1 and a control unit 59 described later. In addition, the other end side of the single-wafer processing area R3 extends in a direction away from the transfer block 5, that is, in the rear X. In addition, the single-wafer processing area R3 is provided along the batch processing area R1 and the single-wafer substrate conveying area R2.

[0101] A plurality of (for example, four) single-wafer processing chambers SW1 to SW4 are provided in the single-wafer processing area R3. The four single-wafer processing chambers SW1 to SW4 are arranged in the front-to-back direction X extending from the single-wafer processing area R3. Each single-wafer processing chamber SW1 to SW4 processes the substrate W one by one. The first single-wafer processing chamber SW1 is arranged at the position farthest from the transfer block 5. The second single-wafer processing chamber SW2 is arranged in front of the first single-wafer processing chamber SW1. The third single-wafer processing chamber SW3 is arranged in front of the second single-wafer processing chamber SW2. The fourth single-wafer processing chamber SW4 is arranged in front of the third single-wafer processing chamber SW3. The single-wafer processing chambers SW1 to SW4 may also be composed of a plurality of segments. For example, the twelve single-wafer processing chambers may also be arranged with four in the front-to-back direction X (horizontally) and three in the vertical direction Z.

[0102] For example, the single-wafer processing chambers SW1 and SW2 each include a rotating processing unit 45 and a nozzle 47. The rotating processing unit 45 includes: a rotating fixture that holds a substrate W in a horizontal position; and an electric motor that rotates the rotating fixture around a vertical axis passing through the center of the substrate W. The rotating fixture may also hold the lower surface of the substrate W by vacuum adsorption. In addition, the rotating fixture may also include three or more fixture pins for clamping the outer edge of the substrate W.

[0103] The nozzle 47 supplies the processing liquid to the substrate W held by the rotating processing unit 45. The nozzle 47 moves over a standby position and a supply position, the standby position being a position away from the rotating processing unit 45, and the supply position being a position above the rotating processing unit 45. As the processing liquid, for example, pure water (DIW) and IPA (isopropyl alcohol) can be used. Each of the single-wafer processing chambers SW1 and SW2 can also form an IPA liquid film on the upper surface of the substrate W by, for example, performing a cleaning process on the substrate W with pure water and then performing a preliminary drying process with IPA.

[0104] The single-wafer processing chambers SW3 and SW4 respectively perform a drying process using a supercritical fluid. As a fluid, for example, carbon dioxide can be used. The single-wafer processing chambers SW3 and SW4 respectively have a chamber body (container) 48, a support tray, and a cover. The chamber body 48 has a processing space provided inside, an opening for placing the substrate W into the processing space, a supply port, and an exhaust port. The substrate W is supported by the support tray and accommodated in the processing space. The cover blocks the opening of the chamber body 48. For example, the single-wafer processing chambers SW3 and SW4 respectively change the fluid into a supercritical state, and supply the supercritical fluid from the supply port to the processing space in the chamber body 48. At this time, the processing space in the chamber body 48 is exhausted from the exhaust port. The substrate W is dried by the supercritical fluid supplied to the processing space.

[0105] The supercritical state can be obtained by changing the fluid to its inherent critical temperature and critical pressure. Specifically, when the fluid is carbon dioxide, the critical temperature is 31°C and the critical pressure is 7.38MPa. In the supercritical state, the surface tension of the fluid is approximately zero. Therefore, the pattern of the substrate W is not affected by the gas-liquid interface. Therefore, it is difficult to cause pattern collapse in the substrate W.

[0106] <4-4. Batch substrate transport area R4>

[0107] The batch substrate transfer area R4 is adjacent to the transfer block 5 and the batch processing area R1. The batch substrate transfer area R4 is provided along the batch processing area R1. The batch substrate transfer area R4 extends in the front-rear direction X. The four areas R1, R2, R3, and R4 are provided to extend parallel to each other.

[0108] The batch substrate transport region R4 has a first transport mechanism (robot) WTR1. That is, the batch substrate transport region R4 is provided with the first transport mechanism WTR1. The first transport mechanism WTR1 transports a plurality of (e.g., fifty) substrates W at a time between the substrate transfer position PP set in the transfer block 5, for example, each of the six batch processing tanks BT1 to BT6, and the second posture conversion mechanism 31.

[0109] The first transport mechanism WTR1 has a pair of clamps 49, 50 and a guide rail 53. The clamps 49, 50 each have, for example, fifty holding grooves to hold fifty substrates W. When viewed from above, the two clamps 49, 50 are respectively aligned with the Y direction ( Figure 1 ) extend in parallel. The first transport mechanism WTR1 opens or closes the two clamps 49 and 50. The first transport mechanism WTR1 moves the pair of clamps 49 and 50 along the guide rail 53. The first transport mechanism WTR1 is driven by an electric motor.

[0110] <5. Control Unit>

[0111] The substrate processing apparatus 1 includes a control unit 59 and a storage unit (not shown). The control unit 59 controls the various structures of the substrate processing apparatus 1. The control unit 59 includes, for example, one or more processors such as a central processing unit (CPU (Central Processing Unit)). The storage unit includes, for example, at least one of a ROM (Read Only Memory), a RAM (Random Access Memory) and a hard disk. The storage unit stores computer programs required for controlling the various structures of the substrate processing apparatus 1.

[0112] <6. Second posture conversion mechanism>

[0113] Figure 4 (a) is a plan view showing the second posture conversion mechanism 31 . Figure 4 (b) is a front view showing the second posture conversion mechanism 31 . Figure 5 3 is a side view for explaining the second transport mechanism WTR2 and the posture conversion unit 63. The second posture conversion mechanism 31 includes a pusher mechanism 61, a second transport mechanism (second batch substrate transport mechanism) WTR2, and a posture conversion unit 63. The second transport mechanism WTR2 corresponds to the substrate extraction mechanism of the present invention.

[0114] <6-1. Pusher mechanism>

[0115] The pusher mechanism 61 receives the plurality of substrates W from the first transport mechanism WTR1 . The pusher mechanism 61 can hold the plurality of substrates W in a vertical posture and rotate the plurality of substrates W around the vertical axis AX4 . The pusher mechanism 61 includes a pusher 65 and a lifting and rotating unit 67 .

[0116] The pusher 65 is transported by the first transport mechanism WTR1 and holds a plurality of substrates W arranged in a vertical posture at a predetermined interval (e.g., half pitch). The lifting and rotating unit 67 lifts and lowers the pusher 65 and rotates the pusher 65 around the vertical axis AX4. The lifting and rotating unit 67 has, for example, one or more electric motors. In addition, the pusher 65 is equivalent to the substrate holding unit of the present invention.

[0117] <6-2. Second batch transport mechanism (second transport mechanism)>

[0118] The second transport mechanism (robot) WTR2 extracts and transports a plurality of substrates W from the pusher 65. The second transport mechanism WTR2 includes two clamps (horizontal clamps) 69 and 70, an opening and closing section 71, a lifting section 73, and a horizontal moving section 75. Figure 5 As shown, the clamps 69 and 70 hold the plurality of substrates W while clamping both side portions of the outer edge of each of the plurality of substrates W in the vertical posture in the radial direction.

[0119] The two clamps 69 and 70 each have a plurality of (for example, twenty-five) V-shaped holding grooves 78 and a plurality of (for example, twenty-five) through grooves 80. The V-shaped holding grooves 78 and the through grooves 80 are arranged alternately one by one. The inner side of each V-shaped holding groove 78 is formed into a V-shaped cross section. In addition, the V-shaped holding groove 78A of the clamp 69 is opposite to the V-shaped holding groove 78B of the clamp 70. Thus, a pair of V-shaped holding grooves 78A and 78B hold a substrate W. The twenty-five pairs of V-shaped holding grooves 78 of the two clamps 69 and 70 respectively hold twenty-five substrates W in a vertical posture.

[0120] The substrate W is not held by the groove 80. The V-shaped holding grooves 78 are arranged at a predetermined interval (e.g., full pitch). In addition, the grooves 80 are also arranged at a predetermined interval (e.g., full pitch). Thus, the second transport mechanism WTR2 can extract the substrate W from the plurality of substrates W arranged at half pitch one by one.

[0121] Figure 4The opening and closing portion 71 shown in (a) causes the clamp 69 to swing (rotate) around the horizontal axis AX5, and also causes the clamp 70 to swing around the horizontal axis AX6. Thus, the opening and closing portion 71 can clamp and hold the substrate W, or can release the state of clamping the substrate W. When the substrate W is clamped by a pair of clamps 69 and 70, the width of the two inner parts of the V-shaped holding grooves 78A and 78B becomes smaller than the diameter of each substrate W. Therefore, the substrate W is held. In addition, the two horizontal axes AX5 and AX6 extend in the front-to-back direction X in which the substrates W are neatly arranged. In addition, the horizontal axis AX5 extends parallel to the horizontal axis AX6.

[0122] The lifting unit 73 lifts the clamps 69, 70 and the opening and closing unit 71. The horizontal moving unit 75 moves the clamps 69, 70 and the lifting unit 73 in the width direction Y (see Figure 4 (a) in the figure). The horizontal moving part 75 moves the clamps 69 and 70 between a position above the pusher 65 and a handover position relative to the posture conversion part 63. The opening and closing part 71, the lifting part 73, and the horizontal moving part 75 each include an electric motor, for example.

[0123] In addition, the upper end of each of the clamps 69 and 70 is preferably lower than the upper end of each substrate W held. In addition, the lower end of each of the clamps 69 and 70 is preferably higher than the lower end of each substrate W held. Thus, the clamps 69 and 70 holding the substrate W can easily pass between the upper clamp 81 and the lower clamp 83 described later. Therefore, the clamps 69 and 70 can smoothly transfer the substrate W to the upper and lower clamps 81 and 83.

[0124] <6-3. Posture conversion unit>

[0125] Figure 6 (a) is a plan view showing the auxiliary jig opening and closing portion 87 of the posture conversion portion 63 . Figure 6 (b) is a side view showing the advancing and retreating portion 88 of the posture conversion portion 63 . Figure 7 (a) and Figure 7 (b) is a diagram for explaining the operation of the advancing and retreating portion 88 of the posture conversion portion 63 .

[0126] Reference Figure 4 (a) Figure 4 (b) and Figure 6 (a) in the figure. The posture conversion unit 63 converts the posture of the substrate W transported by the second transport mechanism WTR2 from vertical to horizontal. The posture conversion unit 63 includes an upper clamp 81, a lower clamp 83, an upper clamp moving unit 84, two auxiliary clamps 85 and 86, an auxiliary clamp opening and closing unit 87, an advance and retreat unit 88, an upper and lower clamp rotating unit 89, a support arm 90, and a base frame 91.

[0127] The upper clamp 81 and the lower clamp 83 (hereinafter simply referred to as "upper and lower clamps 81, 83") clamp the upper and lower portions of the outer edges of the plurality of substrates W held in a vertical position by the two clamps 69, 70 in the radial direction. Therefore, the upper clamp 81 and the lower clamp 83 can directly receive the substrates W from the two clamps 69, 70 of the second transport mechanism WTR2.

[0128] The upper clamp 81 is provided on the support arm 90 so as to be movable up and down. The upper clamp moving part 84 can make the upper clamp 81 approach the lower clamp 83, or can make the upper clamp 81 away from the lower clamp 83. The upper clamp moving part 84 is provided on the support arm 90. The upper clamp moving part 84 has, for example, a linear actuator having an electric motor. The lower clamp 83 is fixed to the support arm 90 and cannot move.

[0129] like Figure 5 As shown, the upper clamp 81 has a plurality of (e.g., twenty-five) first horizontal placement guide grooves 93. Similarly, the lower clamp 83 has a plurality of (e.g., twenty-five) second horizontal placement guide grooves 94. For example, the twenty-five first horizontal placement guide grooves 93 are configured to accommodate the outer edges of twenty-five substrates W, respectively. In addition, the twenty-five second horizontal placement guide grooves 94 are configured to accommodate the outer edges of twenty-five substrates W, respectively. In addition, the horizontal placement guide grooves 93, 94 each have a placement surface 95 for placing a substrate W (see Figure 7 (a) in the figure.

[0130] In addition, each of the horizontal placement guide grooves 93 and 94 has a width WD wider than the thickness TC of each substrate W. That is, from the entrance to the inner side of each of the horizontal placement guide grooves 93 and 94, the width WD of each of the horizontal placement guide grooves 93 and 94 is wider than the thickness TC of each substrate W. Therefore, when the hand 35 of the central robot CR takes out a substrate W in a horizontal posture from the horizontal placement guide grooves 93 and 94, the substrate W in a horizontal posture can be lifted up in the horizontal placement guide grooves 93 and 94. That is, the horizontal placement guide grooves 93 and 94 have a space in which the substrate W can move freely.

[0131] Furthermore, when the upper clamp 81 and the lower clamp 83 clamp the substrate W, a gap GP (space) for moving the substrate W in the radial direction of the substrate W is provided in the horizontal placement guide grooves 93 and 94 .

[0132] The auxiliary clamps 85 and 86 hold the lower side of each substrate W. The two auxiliary clamps 85 and 86 are provided on both sides of the lower clamp 83 along the circumferential direction of each substrate W. Figure 5Specifically, when the two clamps 69 and 70, the upper clamp 81, and the lower clamp 83 clamp each substrate W, the first auxiliary clamp 85 is disposed between the clamp 69 and the lower clamp 83. In addition, the second auxiliary clamp 86 is disposed between the clamp 70 and the lower clamp 83.

[0133] Similar to the jigs 69 and 70, each of the two auxiliary jigs 85 and 86 has a plurality of (for example, twenty-five) V-shaped holding grooves 97. The inner side of each V-shaped holding groove 97 is formed in a V-shaped cross section.

[0134] When the upper clamp 81 and the lower clamp 83 hold the substrate W in a "vertical posture", the auxiliary clamps 85 and 86 respectively accommodate the outer edge of the substrate W in the V-shaped holding groove 97, thereby holding the substrate W in a vertical posture. In addition, when the upper clamp 81 and the lower clamp 83 hold the substrate W in a "horizontal posture", the two auxiliary clamps 85 and 86 respectively disengage the substrate W from the V-shaped holding groove 97 and move away from the substrate W to a position that does not hinder the central robot CR from taking out the substrate W.

[0135] The auxiliary clamp opening and closing section 87 is provided on the support arm 90 via the advancing and retreating section 88. The auxiliary clamp opening and closing section 87 causes the first auxiliary clamp 85 to swing (rotate) around the horizontal axis AX7 and causes the second auxiliary clamp 86 to swing around the horizontal axis AX8. Figure 6 The auxiliary jig opening and closing portion 87 includes an electric motor 87A, a first gear 87B, a second gear 87C, a third gear 87D, a fourth gear 87E, a first shaft 87F, and a second shaft 87G.

[0136] The first gear 87B is fixed to the output shaft 87H of the electric motor 87A. The second gear 87C is fixed to the first shaft 87F. The first shaft 87F is supported in a manner that can rotate around the horizontal axis AX7. In addition, a first auxiliary clamp 85 is connected to the top of the first shaft 87F. The third gear 87D is supported in a manner that can rotate around the horizontal axis. The fourth gear 87E is fixed to the second shaft 87G. The second shaft 87G is supported in a manner that can rotate around the horizontal axis AX8. In addition, a second auxiliary clamp 86 is connected to the top of the second shaft 87G.

[0137] The two gears 87B and 87C are meshed. The two gears 87B and 87D are meshed. In addition, the two gears 87D and 87E are meshed. When the electric motor 87A rotates the output shaft 87H in the forward direction, the auxiliary clamps 85 and 86 hold the substrate W. On the other hand, when the electric motor 87A rotates the output shaft 87H in the reverse direction, the auxiliary clamps 85 and 86 are separated from the substrate W, and the state of holding the substrate W is released.

[0138] In addition, the two horizontal axes AX7 and AX8 extend in the front-rear direction X in which the substrates W are arranged in a straight line. In addition, the horizontal axis AX7 extends parallel to the horizontal axis AX8. When the auxiliary clamps 85 and 86 do not hold the substrate W, Figure 5 As shown by the dotted line, the auxiliary clamp opening and closing portion 87 moves the pair of auxiliary clamps 85 and 86 to the outside of the one-dot chain line 101.

[0139] like Figure 6 As shown in (b) of FIG. 1 , the advance / retract portion 88 is provided on the support arm 90. The advance / retract portion 88 moves (advances and retreats) the auxiliary clamps 85 and 86 relative to the upper and lower clamps 81 and 83 in the front-to-back direction X in which the substrates W are arranged in an orderly manner. The advance / retract portion 88 includes, for example, an electric motor 88A, a screw shaft 88B, a slide 88C, and a guide rail 88D.

[0140] The output shaft 88E of the electric motor 88A is connected to one end of the screw shaft 88B. The screw shaft 88B penetrates the slider 88C while meshing with the nut portion 88F of the slider 88C. The guide rail 88D penetrates the slider 88C. The slider 88C can move freely relative to the guide rail 88D. The slider 88C is connected to the auxiliary clamp opening and closing portion 87. The screw shaft 88B and the guide rail 88D extend in the front-to-back direction X in which the substrates W are neatly arranged. When the electric motor 88A rotates the output shaft 88E forward, the auxiliary clamps 85 and 86 advance relative to the upper and lower clamps 81 and 83. In contrast, when the electric motor 88A rotates the output shaft 88E reversely, the auxiliary clamps 85 and 86 retreat relative to the upper and lower clamps 81 and 83.

[0141] When the posture conversion unit 63 converts the posture of the substrate W from vertical to horizontal, the advancing and retreating unit 88 moves the two auxiliary clamps 85 and 86 so that the vertically positioned substrate W accommodated in the V-shaped holding groove 97 contacts the mounting surface 95 . Figure 7 (a) and Figure 7 (b) in detail. Figure 7 (a) and Figure 7 In (b) of FIG. 1 , for ease of illustration, it is drawn that upper and lower clamps 81 and 83 are arranged at the left end of the substrate W, and auxiliary clamps 85 and 86 are arranged at the right end of the substrate W.

[0142] Figure 7 (a) shows the state where the posture conversion unit 63 has just received the substrate W from the second transport mechanism WTR2 using the upper and lower clamps 81, 83 and the auxiliary clamps 85, 86. That is, the outer edge of the substrate W is located on the inner side of the V-shaped holding groove 97 and at the center of the width WD of the horizontally placed guide grooves 93, 94.

[0143] The advance and retreat section 88 can move the auxiliary clamps 85 and 86 between the contact position and the standby position. When the substrate W is changed in posture, the advance and retreat section 88 moves the auxiliary clamps 85 and 86 from the standby position to the contact position (moves backward X). Figure 7 As shown in (b) of FIG. 1 , the back surface of the substrate W held in a vertical position by the V-shaped holding groove 97 is brought into contact with or close to the mounting surfaces 95 of the horizontal guide grooves 93 and 94 of the upper and lower clamps 81 and 83 , respectively.

[0144] When the auxiliary clamps 85 and 86 do not hold the substrate W, the substrate W can move freely in the horizontal guide grooves 93 and 94. However, when the posture is changed, the substrate W moves and collides in the horizontal guide grooves 93 and 94. As a result, particles may be generated. Therefore, the impact caused by the collision of the substrate W can be reduced by making the substrate W contact the mounting surface 95 through the advance and retreat portion 88. Therefore, the generation of particles can be suppressed.

[0145] Figure 4 The upper and lower clamp rotating parts 89 shown in (b) rotate the upper and lower clamps 81 and 83 around the horizontal axis AX9, which is orthogonal to the arrangement direction (front-back direction X) of the 25 substrates W in the vertical posture maintained by the upper and lower clamps 81 and 83. Thus, the posture of the 25 substrates W received by the two clamps 69 and 70 is changed from vertical to horizontal. In addition, the horizontal axis AX9 extends in the width direction Y.

[0146] The upper and lower clamp rotating part 89 is provided on the base frame 91. The base frame 91 includes, for example, a beam member 91A extending horizontally in the front-rear direction X, and two column members 91B supporting both ends of the beam member 91A. The upper and lower clamp rotating part 89 supports the upper and lower clamps 81 and 83 via an L-shaped support arm 90 so as to be rotatable around the horizontal axis AX9. The upper and lower clamp rotating part 89 includes, for example, an electric motor.

[0147] <7. Action Description>

[0148] Next, refer to Figures 8 to 10 The operation of the substrate processing apparatus 1 is described in the flowchart. Figure 1 The external transport robot (not shown) transports the two carriers C to the loading port 9 in sequence.

[0149] [Step S01] Transferring a substrate from a carrier

[0150] The carrier transport mechanism 11 of the storage block 3 transports the first carrier C from the loading port 9 to the rack 13A. The collective transport mechanism HTR of the transfer block 5 takes out 25 substrates W1 in a horizontal posture from the first carrier C placed on the rack 13A and transports them to the posture conversion unit 23. Then, the carrier transport mechanism 11 transports the empty first carrier C to the rack 13B. Then, the carrier transport mechanism 11 transports the second carrier C from the loading port 9 to the rack 13A. The collective transport mechanism HTR takes out 25 substrates W2 in a horizontal posture from the second carrier C placed on the rack 13A and transports them to the posture conversion unit 23.

[0151] [Step S02] Posture transition to vertical posture

[0152] The fifty substrates W (W1, W2) on the two carriers C are transported to the posture conversion unit 23. Figure 3 (a) to Figure 3 As shown in (f) in FIG. 5 , the posture conversion unit 23 and the pusher mechanism 25 arrange the fifty substrates W in a face-to-face manner and at a half pitch (5 mm), and convert the posture of the fifty substrates W from a horizontal posture to a vertical posture. The pusher mechanism 25 transports the fifty substrates W in the vertical posture to the substrate transfer position PP set in the transfer block 5.

[0153] [Step S03] Chemical solution processing (batch processing)

[0154] The first transport mechanism WTR1 receives fifty substrates W in a vertical posture from the pusher mechanism 25 at the substrate taking-over position PP, and transports the fifty substrates W to any one of the four lifts LF1 to LF4 of the four chemical processing tanks BT1 to BT4.

[0155] For example, the first transport mechanism WTR1 transports fifty substrates W to the elevator LF1 of the chemical liquid treatment tank BT1. The elevator LF1 receives the fifty substrates W at a position above the chemical liquid treatment tank BT1. The elevator LF1 immerses the fifty substrates W in phosphoric acid as a treatment liquid in the chemical liquid treatment tank BT1. Thus, the fifty substrates W are etched. After the etching, the elevator LF1 picks up the fifty substrates W from the phosphoric acid in the chemical liquid treatment tank BT1. In addition, when the fifty substrates W are transported to each of the elevators LF2 to LF4 of the other chemical liquid treatment tanks BT2 to BT4, the same treatment as that of the chemical liquid treatment tank BT1 is also performed.

[0156] [Step S04] Pure water cleaning process (batch process)

[0157] The first transport mechanism WTR1 receives fifty substrates W in a vertical position from, for example, the lift LF1 (or lift LF2), and transports the fifty substrates W to the lift LF5 of the water washing treatment tank BT5. The lift LF5 receives the fifty substrates W at a position above the water washing treatment tank BT5. The lift LF5 immerses the fifty substrates W in the pure water in the water washing treatment tank BT5. Thus, the fifty substrates W are cleaned.

[0158] Furthermore, when the first transport mechanism WTR1 receives fifty substrates W in a vertical position from one of the elevators LF3 and LF4, the first transport mechanism WTR1 transports the fifty substrates W to the elevator LF6 of the water washing treatment tank BT6. The elevator LF6 receives the fifty substrates W at a position above the water washing treatment tank BT6. The elevator LF6 immerses the fifty substrates W in the pure water in the water washing treatment tank BT6.

[0159] In this embodiment, the second posture conversion mechanism 31 is disposed on the opposite side of the transfer block 5 across the six batch processing tanks BT1 to BT6. The first transport mechanism WTR1 transports fifty substrates W from the batch processing tank BT1 (BT3) on the side close to the transfer block 5 to the second posture conversion mechanism 31 via the batch processing tank BT5 (BT6) on the side far from the transfer block 5.

[0160] [Step S05] Posture transition to horizontal posture

[0161] The second posture conversion mechanism 31 converts the posture of the substrate W that has been cleaned from the vertical posture to the horizontal posture. Here, there is the following problem. That is, when the postures of fifty substrates W arranged at half pitch (5 mm interval) are converted at the same time, one hand 35 of the central robot CR cannot properly enter the gap between two adjacent substrates W among the fifty substrates W.

[0162] Furthermore, when the substrates W are arranged face to face, the substrates W that have been converted to a horizontal posture may have their device surfaces facing upward or downward. For example, it is not preferable that the hand 35 of the central robot CR contacts the device surface of the substrate W. Furthermore, it is not preferable that the substrates W with their device surfaces facing different directions are transported to the individual single-wafer processing chambers SW1 to SW4.

[0163] Therefore, in this embodiment, the interval between two adjacent substrates W is widened and the orientations of the device surfaces of the fifty substrates W are made consistent with each other. Fig. 9 Flowchart of Fig.10 Flowchart of Fig.11 (a) to Fig.11 (d) Fig.12 (a) to Fig.12 (d) and Fig.13 (a) to Fig.13 (d) in the figure is described in detail.

[0164] [Step S11] Conveying the substrate to the pusher mechanism

[0165] Reference Fig.11 In addition, Fig.11 (a) to Fig.11 (d) is a top view for explaining the operation of the second posture conversion mechanism 31. The first transport mechanism WTR1 transports fifty substrates W from one of the lifts LF5 and LF6 to the pusher mechanism 61 of the second posture conversion mechanism 31 (see FIG. Figure 1 The pusher 65 of the pusher mechanism 61 holds the fifty substrates W in a vertical posture arranged in a half-pitch and face-to-face manner. In addition, the fifty substrates W are aligned along the width direction Y.

[0166] The second transport mechanism WTR2 stands by on the posture conversion unit 63 side so as not to interfere with the first transport mechanism WTR1. After the substrate W is transported to the pusher mechanism 61, the first transport mechanism WTR1 moves from above the pusher mechanism 61.

[0167] [Step S12] Rotation of the substrate about the vertical axis by the pusher mechanism

[0168] Reference Fig.11 (b) in the figure. When viewed from above, the lifting and rotating part 67 of the pusher mechanism 61 rotates the fifty substrates W 90 degrees (angle) to the left with the vertical axis AX4 as the center. Thus, the pusher mechanism 61 can transfer the substrates W to the second transport mechanism WTR2, and can turn the device surface of each of the twenty-five substrates W1 of the first substrate group upward when the posture is changed.

[0169] [Step S13] The second batch transport mechanism transports the substrate (W1)

[0170] The second transport mechanism WTR2 moves to the substrate standby side. That is, the second transport mechanism WTR2 moves so that the clamps 69 and 70 are located above the fifty substrates W held by the pusher 65. The opening and closing section 71 opens the clamps 69 and 70 so that the fifty substrates W can pass between the clamps 69 and 70.

[0171] Reference Fig.11(c) in FIG. 1 . After the clamps 69 and 70 reach above the substrate W, the lifting unit 73 of the second transport mechanism WTR2 lowers the clamps 69 and 70 to below the center of the substrate W. Then, the opening and closing unit 71 closes the clamps 69 and 70, thereby clamping fifty substrates W. At this time, the twenty-five substrates W1 are respectively located in the twenty-five V-shaped holding grooves 78, and the twenty-five substrates W2 are respectively located in the twenty-five passing grooves 80.

[0172] After the fifty substrates W are clamped by the clamps 69 and 70, the lifting unit 73 raises the clamps 69 and 70. Thus, the second transport mechanism WTR2 can extract the twenty-five substrates W1 arranged at full pitch (e.g., 10 mm intervals) from the fifty substrates W (W1, W2) held by the pusher 65. That is, the twenty-five substrates W2 of the second substrate group remain on the pusher 65.

[0173] Reference Fig.11 (d) in the figure. The second transport mechanism WTR2 transports the twenty-five substrates W1 to between the upper and lower clamps 81 and 83 of the posture conversion unit 63. At this time, the upper clamp 81 is moved to an open position away from the lower clamp 83 by the upper clamp moving unit 84. In addition, the auxiliary clamps 85 and 86 are in a closed state so as to maintain the substrate W in a vertical posture. In addition, the auxiliary clamps 85 and 86 may also be in an open state.

[0174] In addition, the lifting and rotating part 67 of the pusher mechanism 61 rotates the twenty-five substrates W2 held by the pusher 65 by 180 degrees around the vertical axis AX4. As a result, the device surface of each of the twenty-five substrates W2 of the second substrate group can be facing upward when the posture is changed. In addition, by rotating 180 degrees, the position of each substrate W2 moves backward X at half the pitch compared to before the rotation. Therefore, when conveying the twenty-five substrates W2, they can be accommodated in the V-shaped holding groove 78 of the clamps 69 and 70. In addition, the 180-degree rotation of the substrate W2 is preferably performed in steps S13 to S17.

[0175] [Step S14] Handing over the substrate (W1) to the posture conversion unit

[0176] Reference Fig.12 (a) in . Fig.12 (a) to Fig.12 (d) is a front view for explaining the operation of the second posture conversion mechanism 31, that is, a view viewed from the single-chip substrate conveying area R2. Fig.12 (a) in the equation is Fig.11 (d) is a front view showing a state in which the second transport mechanism WTR2 moves twenty-five substrates W1 between the upper and lower clamps 81 and 83 .

[0177] Reference Fig.12 (b) in the figure. The auxiliary clamps 85 and 86 are in a closed state in a manner that can hold the substrate W in a vertical position. The lifting portion 73 of the second transport mechanism WTR2 lowers the twenty-five substrates W1 held by the clamps 69 and 70 until the substrates W1 contact the V-shaped holding grooves 97 of the auxiliary clamps 85 and 86. That is, the lifting portion 73 lowers the twenty-five substrates W1 until the twenty-five substrates W1 are held by the twenty-five V-shaped holding grooves 97. When the twenty-five substrates W1 are held by the twenty-five V-shaped holding grooves 97 of each of the auxiliary clamps 85 and 86, the outer edges of the twenty-five substrates W1 are accommodated in the second horizontal placement guide grooves 94 of the lower clamp 83.

[0178] After that, the upper clamp moving part 84 lowers the upper clamp 81 to bring the upper clamp 81 closer to the lower clamp 83. As a result, the outer edges of the twenty-five substrates W1 are accommodated in the first horizontal placement guide grooves 93 of the upper clamp 81. In addition, the twenty-five substrates W1 are held (gripped) by the upper and lower clamps 81, 83 and the auxiliary clamps 85, 86.

[0179] Reference Fig.12 (c) in the figure. Then, the opening and closing section 71 of the second transport mechanism WTR2 opens the clamps 69 and 70. Thus, the holding of the twenty-five substrates W1 is released. In addition, the twenty-five substrates W1 are transferred to the posture conversion section 63. Then, the lifting section 73 of the second transport mechanism WTR2 raises the clamps 69 and 70 to above the substrates W. Thus, the second transport mechanism WTR2 moves to a position where it does not interfere with the posture conversion section 63.

[0180] [Step S15] Contact of substrate (W1) with mounting surface

[0181] like Figure 6 As shown in (b) of FIG. 1 , the advancing and retreating section 88 causes the auxiliary clamps 85 and 86 to retreat (move backward in the direction X). That is, the advancing and retreating section 88 causes the twenty-five substrates W1 held by the twenty-five V-shaped holding grooves 97 to contact the mounting surface 95 of the horizontally placed guide grooves 93 and 94 (see FIG. 1 ). Figure 7 (a) Figure 7 (b) in FIG. 1 ). Thus, during the posture conversion and the opening operation of the auxiliary clamps 85 and 86, collisions caused by the movement of each substrate W1 can be suppressed.

[0182] [Step S16] Posture conversion by the posture conversion unit

[0183] Reference Fig.12(d) in the figure. Afterwards, the upper and lower clamp rotating section 89 of the posture conversion section 63 rotates the upper and lower clamps 81, 83, etc. holding the twenty-five substrates W1 counterclockwise by 90 degrees with the horizontal axis AX9 as the center. Therefore, the posture of the twenty-five substrates W1 of the first substrate group can be converted from vertical to horizontal. After rotating 90 degrees, the auxiliary clamp opening and closing section 87 opens the auxiliary clamps 85 and 86 until they reach a position that does not hinder the central robot CR from transporting the substrates W1. That is, the auxiliary clamps 85 and 86 move to Figure 5 to the position indicated by the dotted line.

[0184] [Step S17] Conveying of substrate (W1) by the central robot

[0185] After opening the auxiliary clamps 85 and 86, the central robot CR uses two hands 35 to sequentially take out the 25 substrates W1 held in a horizontal position by the upper and lower clamps 81 and 83, and transport the 25 substrates W1 to one of the single-wafer processing chambers SW1 and SW2. The spacing of the substrates W is widened from half spacing to full spacing. Therefore, the hand 35 of the central robot CR can well enter the gap between two adjacent substrates W. In addition, the substrates W can be well taken out.

[0186] The central robot CR transfers the 25 substrates W1 of the first substrate group from the posture conversion unit 63 and then converts the postures of the 25 substrates W2 of the second substrate group. Since steps S18 to S22 are similar to steps S13 to S17, the overlapping parts are briefly described.

[0187] [Step S18] The second batch transport mechanism transports the substrate (W2)

[0188] Reference Fig.13 In addition, Fig.13 (a) and Fig.13 (b) is a plan view for explaining the operation of the second posture conversion mechanism 31. The second transport mechanism WTR2 moves so that the clamps 69 and 70 are located above the twenty-five substrates W2 held by the pushers 65.

[0189] After that, the lifting unit 73 of the second transport mechanism WTR2 lowers the clamps 69 and 70 to below the center of the substrate W2. After that, the opening and closing unit 71 closes the clamps 69 and 70, thereby clamping the twenty-five substrates W2. In step S13, the substrate W2 is rotated 180 degrees, so that the position of each substrate W2 moves half the pitch. Therefore, when the clamps 69 and 70 are closed, the twenty-five substrates W2 are respectively located in the twenty-five V-shaped holding grooves 78.

[0190] Thereafter, the lifting unit 73 raises the clamps 69 and 70 . Thus, the second transport mechanism WTR2 lifts the twenty-five substrates W2 held by the pushers 65 .

[0191] Reference Fig.13 (b) in the figure. After that, the second transport mechanism WTR2 transports the twenty-five substrates W2 to between the upper and lower clamps 81 and 83 of the posture conversion unit 63. In addition, after the second transport mechanism WTR2 transports the twenty-five substrates W2, the pusher 65 changes to a state of not holding the substrates W. Therefore, the first transport mechanism WTR1 can transport the next batch of fifty substrates W from one of the elevators LF3 and LF6 to the pusher 65.

[0192] [Step S19] Handing over the substrate (W2) to the posture conversion unit

[0193] Reference Fig.13 In addition, Fig.13 (c) and Fig.13 (d) is a front view of the second posture conversion mechanism 31. The twenty-five substrates W2 held by the clamps 69 and 70 are located between the upper and lower clamps 81 and 83. In addition, the auxiliary clamps 85 and 86 are closed in a manner that can hold the substrates W2 in a vertical posture. In addition, the auxiliary clamps 85 and 86 are moved from the contact position ( Figure 7 (b) in the state) moves to the standby position ( Figure 7 state of (a) in the figure).

[0194] Then, the lifting unit 73 of the second transport mechanism WTR2 lowers the twenty-five substrates W2 held by the clamps 69 and 70 until the twenty-five V-shaped holding grooves 97 of the auxiliary clamps 85 and 86 hold the twenty-five substrates W2. Then, the upper clamp moving unit 84 lowers the upper clamp 81. Thus, the twenty-five substrates W2 are held (gripped) by the upper and lower clamps 81 and 83 and the auxiliary clamps 85 and 86.

[0195] Then, the opening and closing part 71 of the second transport mechanism WTR2 opens the clamps 69 and 70. Thus, the twenty-five substrates W2 are released from being held and transferred to the posture conversion part 63. Then, the lifting part 73 of the second transport mechanism WTR2 raises the clamps 69 and 70 to a position where they do not interfere with the posture conversion part 63 above the substrates W.

[0196] [Step S20] Contact of substrate (W2) with mounting surface

[0197] Then, the advancing and retreating section 88 brings the twenty-five substrates W2 held by the twenty-five V-shaped holding grooves 97 into contact with the mounting surface 95 of the horizontally placed guide grooves 93 and 94 (see Figure 7(a) and Figure 7 (b) in the figure.

[0198] [Step S21] Posture conversion by the posture conversion unit

[0199] Reference Fig.13 (d) in the figure. After that, the upper and lower clamp rotating section 89 of the posture conversion section 63 rotates the upper and lower clamps 81, 83, etc. holding the twenty-five substrates W2 counterclockwise by 90 degrees with the horizontal axis AX9 as the center. Thus, the posture of the twenty-five substrates W2 is converted from a vertical posture to a horizontal posture. After rotating 90 degrees, the auxiliary clamp opening and closing section 87 opens the auxiliary clamps 85, 86 to Figure 5 to the position indicated by the dotted line.

[0200] [Step S22] The central robot carries out the transportation of the substrate (W2)

[0201] After opening the auxiliary clamps 85 and 86 , the central robot CR sequentially takes out the 25 substrates W2 in a horizontal position, and transports the 25 substrates W2 to one of the first single-wafer processing chamber SW1 and the second single-wafer processing chamber SW2 .

[0202] [Step S06] First Single-Way Processing

[0203] Back to Figure 8 For example, the central robot CR transfers the substrate W (W1, W2) from the posture conversion unit 63 to the first single-wafer processing chamber SW1. The first single-wafer processing chamber SW1, for example, rotates the substrate W with the device surface facing upward through the rotation processing unit 45 while supplying pure water to the device surface from the nozzle 47. Thereafter, the first single-wafer processing chamber SW1 supplies IPA to the device surface (upper surface) of the substrate W from the nozzle 47, and replaces the pure water of the substrate W with IPA.

[0204] [Step S07] Second single-wafer process (drying process)

[0205] After that, the central robot CR takes out the substrate W wetted with IPA from the first single-wafer processing chamber SW1 (SW2), and transports the substrate W to one of the single-wafer processing chambers SW3 and SW4. The single-wafer processing chambers SW3 and SW4 respectively dry the substrate W using carbon dioxide (supercritical fluid) in a supercritical state. The pattern collapse of the pattern surface of the substrate W is suppressed by the drying process using the supercritical fluid.

[0206] [Step S08] Transferring the substrate from the buffer to the carrier

[0207] The central robot CR transfers the substrates W after drying from any one of the single-wafer processing chambers SW3 and SW4 to any one of the loading racks in the buffer 33. When a lot (25 substrates) of substrates W1 are transferred to the buffer 33, the collective transfer mechanism HTR collectively transfers the 25 substrates W1 from the buffer 33 to the first empty carrier C placed on the rack 13A. After that, the carrier transfer mechanism 11 in the storage block 3 transfers the first carrier C to the loading port 9.

[0208] Furthermore, when a batch of substrates W2 is placed in the buffer 33, the collective transport mechanism HTR collectively transports 25 substrates W2 from the buffer 33 to the second empty carrier C placed in the rack 13A. Thereafter, the carrier transport mechanism 11 in the storage block 3 transports the second carrier C to the loading port 9. The external transport mechanism (not shown) transports the two carriers C in sequence to the next destination.

[0209] According to the present embodiment, the batch processing area R1, the single-wafer processing area R3, and the single-wafer substrate conveying area R2 are formed in a manner extending from the side of the transfer block 5. The six batch processing tanks BT1 to BT6 are arranged in the front-to-back direction X extending from the batch processing area R1. In addition, the four single-wafer processing chambers SW1 to SW4 are arranged in the front-to-back direction X extending from the single-wafer processing area R3. In addition, a central robot CR is provided in the single-wafer substrate conveying area R2, and the single-wafer substrate conveying area R2 is sandwiched by the six batch processing tanks BT1 to BT6 and the four single-wafer processing chambers SW1 to SW4. The first conveying mechanism WTR1 is provided in the batch substrate conveying area R4 along the six batch processing tanks BT1 to BT6. Therefore, the substrate processing device 1 of the present embodiment can smoothly convey the substrate W.

[0210] Specifically described. The collective transport mechanism HTR of the transfer block 5 collectively takes out a plurality of substrates W from the carrier C and collectively transports the plurality of substrates W to the first posture conversion mechanism 15. In addition, the first transport mechanism WTR1 transports a plurality of substrates W between the substrate handover position PP, the batch processing tanks BT1 to BT6, and the second posture conversion mechanism 31. In addition, the central robot CR transports the substrates W between the second posture conversion mechanism 31, the four single-wafer processing chambers SW1 to SW4, and the buffer section 33. In addition, the collective transport mechanism HTR collectively receives a plurality of substrates W from the buffer section 33 and collectively accommodates the plurality of substrates W in the carrier C.

[0211] Therefore, the plurality of substrates W can be directly transported from the transfer block 5 to the batch processing area R1 without being transported to the single-wafer processing area R3 before being transported to the batch processing area R1. In addition, the collective transport mechanism HTR does not access each of the single-wafer processing chambers SW1 to SW4, but collectively transports the plurality of substrates W between the carrier C, the first posture conversion mechanism 15, and the buffer section 33. Thus, the plurality of substrates W can be quickly transported from the carrier C to the first posture conversion mechanism 15, and the plurality of substrates W can be quickly transported from the buffer section 33 to the carrier C. Therefore, the substrate processing device 1 of the present embodiment can smoothly transport the substrates W. Therefore, the processing volume can be improved. In addition, since the single-wafer processing chambers SW1 to SW4 are provided in the direction in which the single-wafer substrate transport area R2 extends, more single-wafer processing chambers can be provided.

[0212] In addition, the second posture conversion mechanism 31 is provided on the opposite side of the transfer block 5 across the six batch processing tanks BT1 to BT6. For example, the central robot CR transports a plurality of substrates W from the batch processing tank BT1 (BT4) on the side close to the transfer block 5 to the second posture conversion mechanism 31 via the batch processing tank BT5 (BT6) on the side far from the transfer block 5.

[0213] While the plurality of substrates W are batch-processed through the batch processing tanks BT1 to BT6, they are transferred from the transfer block 5 to the second posture conversion mechanism 31. Thereafter, while the plurality of substrates W are single-processed through the single-wafer processing chambers SW1 to SW4, they are transferred from the second posture conversion mechanism 31 to the transfer block 5. Therefore, the plurality of substrates W can be transferred in a circular shape within the processing block 7, thereby enabling the substrates W to be smoothly transferred.

[0214] In addition, the second posture conversion mechanism 31 includes: a pusher 65 for holding the plurality of substrates W conveyed by the first conveying mechanism WTR1 in a vertical posture; a second conveying mechanism WTR2 for extracting two or more substrates W from the plurality of substrates W held by the pusher 65; and a posture conversion unit 63 for converting the postures of the two or more substrates W extracted by the second conveying mechanism WTR2 from the vertical posture to the horizontal posture. Thus, the posture conversion unit 63 can convert the postures of the two or more substrates W extracted by the second conveying mechanism WTR2.

[0215] Example 2

[0216] Next, a second embodiment of the present invention will be described with reference to the drawings. Note that descriptions overlapping with those of the first embodiment will be omitted. Fig.14 (a) is a longitudinal sectional view showing the pusher mechanism 61 of the second posture conversion mechanism 31 of the second embodiment. Fig.14 (b) is a plan view showing the second posture conversion mechanism 31 of the second embodiment.

[0217] Reference Fig.14 (a) in the figure. The pusher mechanism 61 of the second posture conversion mechanism 31 of Example 2 has: a standby tank 107 storing liquid for immersing the substrate W held by the pusher 65 in the liquid when the pusher 65 is lowered; and two ejection pipes 109 for supplying, for example, pure water (DIW) as liquid to the standby tank 107. The ejection pipe 109 is formed in a manner extending linearly in the front-to-back direction X or in the width direction Y. The ejection pipe 109 has a plurality of ejection ports 109A (nozzles for the holding portion) in the direction in which the ejection pipe 109 extends. The plurality of ejection ports 109A eject pure water respectively. The standby tank 107 stores the pure water ejected by the ejection pipe 109.

[0218] For example, Fig.11 As shown in (d) in FIG. 1 , when the posture changing section 63 changes the posture of the substrate W1 , the substrate W2 on standby is immersed in the pure water in the standby tank 107 , thereby preventing the substrate W from drying out.

[0219] In addition, the standby tank 107 may not store pure water. In this case, the ejection port 109A of the ejection pipe 109 may supply pure water to the substrate W held by the pusher 65 in a spray or mist form. Fig.14 As shown by the dotted line of (a), the discharge pipe 109 is arranged at a position higher than the substrate W. When the pure water is supplied to the substrate W in a shower or mist form, the standby tank 107 may or may not be provided.

[0220] Next, refer to Fig.14 (b) in the figure. The second posture conversion mechanism 31 has a first group of nozzles 111 and a second group of nozzles 112. The nozzles 111 and 112 are nozzles for the posture conversion section 63. The nozzles 111 and 112 supply, for example, pure water (DIW) as liquid in a spray or mist form to the substrate W held by the upper and lower clamps 81 and 83 of the posture conversion section 63, respectively. The first group of nozzles 111 and the second group of nozzles 112 are arranged in a manner so as to sandwich the substrate W when viewed from above. The nozzles 111 and 112 are disposed at a position higher than the substrate W. In addition, the nozzles 111 and 112 may also be configured to be movable in a manner that does not interfere with the second transport mechanism WTR2.

[0221] The upper and lower clamp rotating part 89 changes the posture of the substrate W held by the upper and lower clamps 81 and 83 to one of a vertical posture and an inclined posture. In this state, the nozzles 111 and 112 supply pure water in a shower or mist form to the substrate W held by the upper and lower clamps 81 and 83. In addition, the inclined posture is a posture in which the device surface of the substrate faces upward.

[0222] For example, when the center robot CR interrupts the conveyance of the substrate W, the substrate W held by the upper and lower clamps 81 and 83 can be prevented from drying. In addition, when the substrate W is in a horizontal position during supply, it is difficult for the spray or mist pure water to spread over the entire device surface. However, by changing the substrate W to a vertical position or an inclined position with the device surface facing upward, the spray or mist pure water can be easily spread over the entire device surface.

[0223] In addition, the substrate processing device 1 may also adopt Fig.14 The structure shown in (a) and Fig.14 In addition, the substrate processing device 1 may also only adopt the structure shown in (b) Fig.14 The structure shown in (a) and Fig.14 One of the structures shown in (b).

[0224] Example 3

[0225] Next, a third embodiment of the present invention will be described with reference to the drawings. Note that descriptions overlapping with those of the first and second embodiments will be omitted. Fig.15 It is a plan view showing a schematic structure of a substrate processing apparatus 1 according to a third embodiment. Fig.16 (a) and Fig.16 (b) is a side view for explaining the buffer parts 114 and 116 of the third embodiment.

[0226] The buffer 33 of Embodiments 1 and 2 is fixed to the floor surface at the boundary between the transfer block 5 and the substrate conveying region R2 without moving. In this regard, the two buffers 114 and 116 of Embodiment 3 are movable in the front-rear direction X extending in the substrate conveying region R2.

[0227] Reference Fig.15 as well as Fig.16 (a) in the figure. The substrate processing device 1 has a first buffer section 114, a second buffer section 116, a horizontal moving section 118, and a horizontal moving section 120. The two buffer sections 114 and 116 each have a plurality of (for example, twenty-five) loading racks arranged at a predetermined interval (full pitch) in the vertical direction Z. In addition, the horizontal moving sections 118 and 120 each correspond to the loading section moving mechanism of the present invention. In addition, although Fig.15 2 , the horizontal moving unit 120 is shown cut off in the middle; however, the horizontal moving unit 120 has the same structure as the horizontal moving unit 118 .

[0228] The two buffers 114 and 116 are movably provided in the single-chip substrate conveying region R2. The horizontal moving section 118 moves the first buffer 114 in the front-back direction X. The horizontal moving section 120 moves the second buffer 116 in the front-back direction X. The two horizontal moving sections 118 and 120 each have a linear actuator including an electric motor. The horizontal moving sections 118 and 120 are respectively provided in a manner not to interfere with the central robot CR.

[0229] like Fig.16 As shown in (a), the buffers 114 and 116 move between, for example, the boundary between the single-wafer conveying region R2 and the transfer block 5 and the vicinity of the fourth single-wafer processing chamber SW4. Specifically, the buffers 114 and 116 move between the recovery position PP2 and the collective return position PP3.

[0230] The recovery position PP2 is a position where, when viewed from the width direction Y (refer to Fig.16 (a)) is a position adjacent to the transfer block 5 side of the fourth single-wafer processing chamber SW4. Alternatively, the recovery position PP2 is a position that is between the nearest fourth single-wafer processing chamber SW4 and the transfer block 5 when viewed from the width direction Y, and is a position farther from the transfer block 5 than the collective return position PP3. The collective return position PP3 is a position that can be accessed by the collective transport mechanism HTR and is closer to the transfer block 5 than the recovery position PP2. The recovery position PP2 and the collective return position PP3 are both preset positions.

[0231] The substrate processing apparatus 1 of the third embodiment operates as follows: For example, the horizontal moving unit 118 moves the first buffer unit 114 to the recovery position PP2.

[0232] The central robot CR transfers the substrate W1 dried in either of the single wafer processing chambers SW3 and SW4 to the first buffer 114. Since the central robot CR does not need to move to the vicinity of the collective transport robot HTR, the transport efficiency of the substrate W can be improved.

[0233] When the twenty-five substrates W1 are transported to the first buffer 114, the horizontal moving unit 118 moves the first buffer 114 from the collection position PP2 to the collective return position PP3. Then, the collective transport mechanism HTR collectively transports the twenty-five substrates W1 from the first buffer 114 to the empty carrier C placed on the shelf 13A. When the first buffer 114 becomes empty, the horizontal moving unit 118 moves the empty first buffer 114 from the collective return position PP3 to the collection position PP2.

[0234] After the twenty-five substrates W1 are conveyed to the first buffer 114 , the central robot CR conveys the substrates W2 that have been dried in either of the single-wafer processing chambers SW3 and SW4 to the second buffer 116 at the recovery position PP2 .

[0235] When the twenty-five substrates W2 are transported to the second buffer 116, the horizontal moving unit 120 moves the second buffer 116 from the collection position PP2 to the collective return position PP3. After that, the collective transport mechanism HTR collectively transports the twenty-five substrates W2 from the second buffer 116 to the empty carrier C placed on the shelf 13A. When the second buffer 116 becomes empty, the horizontal moving unit 120 moves the second buffer 116 from the collective return position PP3 to the collection position PP2. In this way, the movement of the two buffers 114 and 116 is repeated.

[0236] Next, a modified example of Embodiment 3 is described. In Embodiment 3, the two buffers 114 and 116 move between a preset recovery position PP2 (fixed position) and a collective return position PP3. In this regard, the recovery position PP2 may not be set, but the two buffers 114 and 116 may be moved in a manner that follows the central robot CR.

[0237] like Fig.16 As shown in (b) of FIG. 1 , the horizontal moving unit 118 moves the first buffer 114 in the front-to-back direction X in a manner following the central robot CR. In addition, the horizontal moving unit 120 moves the second buffer 116 in the front-to-back direction X in a manner following the central robot CR. Thus, since the buffers 114 and 116 move following the central robot CR, the central robot CR can quickly transport the substrate W to the buffers 114 and 116.

[0238] For example, when a preset number of substrates W1 (W2) (e.g., twenty-five) are transported to the first buffer 114, the horizontal moving unit 118 moves the first buffer 114 to the collective return position PP3. Therefore, the collective transport mechanism HTR can return the twenty-five substrates W1 (W2) to the carrier C. When the first buffer 114 becomes empty by the collective transport mechanism HTR, the horizontal moving unit 118 moves the first buffer 114 in the front-rear direction X again in a manner following the central robot CR.

[0239] In addition, according to the present embodiment, the buffers 114 and 116 are movably disposed in the substrate transport region R2. The horizontal moving parts 118 and 120 move the buffers 114 and 116 in the direction in which the substrate transport region R2 extends. Since the buffers 114 and 116 are moved by the horizontal moving parts 118 and 120, the central robot CR does not need to move to the vicinity of the collective transport mechanism HTR, thereby improving the transport efficiency of the substrate W.

[0240] Furthermore, the horizontal moving units 118 and 120 move the buffers 114 and 116 in the front-rear direction X along which the substrate transfer region R2 extends, respectively, so as to follow the central robot CR. Since the buffers 114 and 116 move along with the central robot CR, the central robot CR can quickly transfer the substrates W to the buffers 114 and 116 .

[0241] Example 4

[0242] Next, a fourth embodiment of the present invention will be described with reference to the drawings. Note that descriptions overlapping with those of the first to third embodiments will be omitted. Fig.17 It is a plan view showing a schematic structure of a substrate processing apparatus 1 according to a fourth embodiment.

[0243] In the first to third embodiments, the second posture conversion mechanism 31 is disposed on the opposite side of the transfer block 5 across the six batch processing tanks BT1 to BT6. The position of the second posture conversion mechanism 31 is not limited thereto. For example, in the fourth embodiment, the second posture conversion mechanism 31 may also be disposed between two batch processing tanks BT5 and BT6 among the plurality of (e.g., six) batch processing tanks BT1 to BT6. In addition, the two batch processing tanks are not limited to the batch processing tanks BT5 and BT6.

[0244] Reference Fig.17 The second posture conversion mechanism 31 is disposed between the two batch processing tanks BT5 and BT6. That is, the second posture conversion mechanism 31 is disposed between the three batch processing tanks BT1, BT2, and BT5 and the three batch processing tanks BT3, BT4, and BT6. In addition, water washing tanks BT5 and BT6 are disposed on both sides of the second posture conversion mechanism 31.

[0245] exist Fig.17In the embodiment, the first transport mechanism WTR1 transports the plurality of substrates W from the batch processing tank BT1 on the side close to the transfer block 5 toward the second posture conversion mechanism 31, and transports the plurality of substrates W from the batch processing tank BT4 on the side far from the transfer block 5 toward the second posture conversion mechanism 31. That is, the plurality of substrates W (for example, fifty substrates) are sequentially transported to one of the two liquid processing tanks BT1 and BT2 and the water washing processing tank BT5, and are also sequentially transported to one of the two liquid processing tanks BT3 and BT4 and the water washing processing tank BT6.

[0246] According to the present embodiment, since the second posture conversion mechanism 31 is disposed between the two batch processing tanks BT5 and BT6, the distance from the second posture conversion mechanism 31 to each of the single-wafer processing chambers SW1 to SW4 can be set to be relatively uniform. Therefore, the central robot CR can use the center of the single-wafer substrate transfer area R2 as a reference point to transfer the substrate W. Therefore, the moving distance of the central robot CR can be shortened, thereby improving the transfer efficiency of the substrate W.

[0247] Example 5

[0248] Next, a fifth embodiment of the present invention will be described with reference to the drawings. Note that descriptions overlapping with those of the first to fourth embodiments will be omitted. Fig.18 It is a plan view showing a schematic structure of a substrate processing apparatus 1 according to the fifth embodiment.

[0249] In the first to third embodiments, the second posture conversion mechanism 31 is disposed on the opposite side of the transfer block 5 across the six batch processing tanks BT1 to BT6. The position of the second posture conversion mechanism 31 is not limited thereto. For example, in the fifth embodiment, the second posture conversion mechanism 31 is disposed between the transfer block 5 and a plurality of (for example, six) batch processing tanks BT1 to BT6.

[0250] Reference Fig.18 The second posture conversion mechanism 31 is adjacent to the transfer block 5 . The batch substrate transfer mechanism WTR1 transfers a plurality of substrates W from the batch processing tank BT1 ( BT3 ) away from the transfer block 5 to the second posture conversion mechanism 31 via the batch processing tank BT5 ( BT6 ) close to the transfer block 5 .

[0251] According to the present embodiment, the second posture conversion mechanism 31 is arranged near the transfer block 5. Therefore, the substrate W can be transported with one side of the transfer block 5 as a reference point. In addition, since the liquid treatment tanks BT1 to BT4 can be arranged at a position away from the transfer block 5, the adverse effects of corrosion of the liquid gas environment on the collective transport mechanism HTR and the like of the transfer block 5 can be suppressed. In addition, a large number of single-wafer processing chambers SW1 to SW4 can be arranged along the single-wafer substrate transport region R2.

[0252] The present invention is not limited to the above-described embodiment, and can be implemented in the following modified forms.

[0253] (1) In each of the above embodiments, Figure 1 The electrical installation area R5 of the substrate processing device 1 is adjacent to the storage block 3. In this regard, Fig.19 The electrical installation area R5 of the substrate processing device 1 may not be adjacent to the existing block 3. That is, Fig.19 One end side of the electrical installation area R5 may also be adjacent to the transfer block 5 and extend in the front-rear direction X to the single wafer processing area R3.

[0254] (2) In the above-mentioned embodiments and modifications, the guide rail of the horizontal moving part 41 of the central robot CR is set on the floor of the single-chip substrate transfer area R2. Fig. 20 As shown, the guide rail 41A of the horizontal moving part 41 of the central robot CR may be disposed above the substrate transfer region R2, and the lifting and rotating part 39 of the central robot CR may be conversely suspended from the guide rail 41A.

[0255] The central robot CR has a main body 123 (two hands 35A, 35B, an advance and retreat part 37, and an elevating and rotating part 39) and a horizontal moving part 41. The horizontal moving part 41 has, for example, a guide rail 41A, a slide 41B, a screw shaft, and an electric motor. The guide rail 41A is disposed above the single-chip substrate conveying area R2 and in the front-back direction X along the single-chip substrate conveying area R2. For example, the guide rail 41A is disposed on the top surface 125 of the single-chip substrate conveying area R2 (or the processing block 7). In addition, the guide rail 41A is equivalent to the upper rail of the present invention.

[0256] The mechanism body 123 is suspended from the guide rail 41A and moves along the guide rail 41A in the front-rear direction X. Therefore, liquid droplets dropped from the wet substrate W are prevented from contaminating, for example, the advancing and retreating portion 37 and the lifting and rotating portion 39. For example, the central robot CR may malfunction because the advancing and retreating portion 37 and the like are contaminated by liquid droplets, but this can be prevented.

[0257] In addition, if Fig. 20 As shown, when the first hand 35A is arranged above the second hand 35B, the first hand 35A is used to transport the substrate W after the drying process, and the second hand 35B is used to transport the wet substrate W from the second posture conversion mechanism 31 to one of the single-wafer processing chambers SW3 and SW4.

[0258] (3) In each of the above-mentioned embodiments and each of the modified examples, the single-wafer processing chambers SW3 and SW4 use a supercritical fluid to perform a drying process on the substrate W. In this regard, similarly to the single-wafer processing chambers SW1 and SW2, the single-wafer processing chambers SW3 and SW4 may also each include a spin processing unit 45 and a nozzle 47. In this case, the single-wafer processing chambers SW1 to SW4 sequentially supply pure water and IPA to the substrate W, and then perform a drying process (spin drying) on ​​the substrate W.

[0259] (4) In each of the above embodiments and variations, Figure 4 The structure shown in (a) in FIG. 1 is used as the second posture conversion mechanism 31. In this regard, for example, the same Figure 3 (a) to Figure 3 The second posture conversion mechanism 31 has the same structure as the first posture conversion mechanism 15 shown in (f) in FIG.

[0260] (5) In each of the above-mentioned embodiments and each of the modified examples, each of the batch processing tanks BT1 to BT6 processes fifty substrates W arranged in a face-to-face manner with half pitch. However, each of the batch processing tanks BT1 to BT6 may also process substrates W arranged in a face-to-back manner with the device surfaces of all substrates W facing the same direction. Each of the batch processing tanks BT1 to BT6 may also process twenty-five substrates W for one carrier C arranged in a full pitch. In addition, in Fig.11 In (b), when fifty substrates W are arranged face-to-back, the opening and closing section 71 moves the two clamps 69 and 70 in the front-to-back direction X in which the substrates W are arranged in order, thereby extracting twenty-five substrates W1 or twenty-five substrates W2.

[0261] Description of reference numerals:

[0262] 1: Substrate processing equipment

[0263] 3: Storage Block

[0264] 5: Move block

[0265] 7: Processing blocks

[0266] 13A: Shelf

[0267] HTR: Joint Transport Agency

[0268] 15: First posture conversion mechanism

[0269] PP: Substrate interface position

[0270] R1: Batch processing area

[0271] R2: Single substrate handling area

[0272] R3: Monolithic processing area

[0273] R4: Batch substrate handling area

[0274] 31: Second posture conversion mechanism

[0275] BT1~BT6: Batch processing tank

[0276] SW1~SW4: Single-wafer processing chamber CR: Central robot

[0277] 33: Buffer

[0278] 41: Horizontal moving part

[0279] 41A: Guide track

[0280] WTR1: First transport mechanism

[0281] 59: Control Department

[0282] 61: Pusher mechanism

[0283] WTR2: Second transport mechanism

[0284] 63: Posture Transformation Department

[0285] 114, 116: Buffer

[0286] 118, 120: Horizontal moving part

[0287] 123: Institutional Entity

[0288] 125: Top

Claims

1. A substrate processing device for continuously performing batch processing of processing a plurality of substrates at once and single processing of processing substrates one by one, characterized in that: The substrate processing device comprises: Storage blocks; a transfer block, adjacent to the storage block; a processing block, adjacent to the transfer block; as well as A substrate placement unit for placing a plurality of substrates in a horizontal position at predetermined intervals in a vertical direction; The storage block is used to accommodate at least one carrier, and has at least one carrier loading shelf for taking out and accommodating substrates, the carrier accommodates a plurality of substrates in a horizontal posture at the specified intervals along the vertical direction, and the carrier loading shelf is used for the carrier to load and unload substrates relative to the carrier; The transfer block has: A substrate operating mechanism for taking out and accommodating a plurality of substrates at once with respect to a carrier mounted on the carrier mounting rack; as well as A first posture conversion mechanism converts the plurality of substrates from a horizontal posture to a vertical posture at the same time; The processing block has: A batch processing area extending in a direction away from the transfer block; A single-wafer processing area, one end of which is located close to the transfer block and the other end of which extends away from the transfer block; A single-wafer substrate conveying area is sandwiched between the batch processing area and the single-wafer processing area, one end of which is adjacent to the transfer block and the other end of which extends in a direction away from the transfer block; as well as A batch substrate transport area is arranged along the batch processing area, one end of which extends to the transfer block and the other end of which extends in a direction away from the transfer block; In the batch processing area, a plurality of batch processing tanks for simultaneously immersing and processing a plurality of substrates are arranged in the direction in which the batch processing area extends, and a second posture conversion mechanism for converting the plurality of substrates from a vertical posture to a horizontal posture is also provided; In the single-wafer processing area, a single-wafer processing chamber for processing substrates one by one is provided in the direction in which the single-wafer processing area extends; A single-chip substrate conveying mechanism for conveying a substrate between the second posture conversion mechanism, the single-chip processing chamber, and the substrate placing portion is provided in the single-chip substrate conveying area; The batch substrate transfer area is provided with a batch substrate transfer mechanism for transferring a plurality of substrates at a time between a substrate transfer position set in the transfer block, a plurality of the batch processing tanks, and the second posture conversion mechanism; The substrate handling mechanism of the transfer block also collectively transfers a plurality of substrates to the first posture conversion mechanism, and collectively transfers a plurality of substrates from the substrate placement section.

2. The substrate processing apparatus according to claim 1, wherein: The second posture conversion mechanism is disposed on the opposite side of the transfer block across the plurality of batch processing tanks.

3. The substrate processing apparatus according to claim 1, wherein: The second posture conversion mechanism is disposed between two batch processing tanks among the plurality of batch processing tanks.

4. The substrate processing apparatus according to claim 1, wherein: The second posture conversion mechanism is disposed between the transfer block and a plurality of the batch processing tanks.

5. The substrate processing apparatus according to any one of claims 1 to 4, characterized in that: The substrate placement portion is fixedly disposed at a boundary between the transfer block and the single substrate conveying region, the transfer block, and the single substrate conveying region.

6. The substrate processing apparatus according to any one of claims 1 to 4, characterized in that: The substrate processing device also has a loading portion moving mechanism; The substrate mounting portion is movably disposed in the single-piece substrate conveying area; The placement section moving mechanism moves the substrate placement section in the direction in which the single substrate conveyance region extends.

7. The substrate processing apparatus according to claim 6, wherein: The placement section moving mechanism moves the substrate placement section in the direction in which the single substrate conveying region extends so as to follow the single substrate conveying mechanism.

8. The substrate processing apparatus according to any one of claims 1 to 4, characterized in that: The single-chip substrate transport mechanism comprises: Institutional entity; and An upper rail is arranged above the single-piece substrate conveying area and along the single-piece substrate conveying area; The mechanism main body is configured to be suspended from the upper rail and to move along the upper rail.

9. The substrate processing apparatus according to any one of claims 1 to 4, characterized in that: The second posture conversion mechanism comprises: a substrate holding unit for holding a plurality of substrates in a vertical posture conveyed by the batch substrate conveying mechanism; A substrate extraction mechanism capable of extracting two or more substrates from the plurality of substrates held by the substrate holding portion; as well as The posture conversion unit converts the postures of the two or more substrates extracted by the substrate extraction mechanism from a vertical posture to a horizontal posture.

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