Grinding vibration suppression method and device, electronic equipment and storage medium
By using the predictive model of vibration and contact force data, the displacement compensation amount is determined and applied, the problem of vibration of low-stiff workpieces during grinding is solved, and a more efficient and quality grinding process is achieved.
Patent Information
- Application Number
- CN202510352289.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-25
- Publication Date
- 2025-04-22
- Estimated Expiration
- 2045-03-25
AI Technical Summary
When robots grind large thin-walled parts or carbon fiber structural parts, low-stiff workpieces are prone to vibration, resulting in reduced surface quality and unstable grinding force, and may even lead to separation of tool and workpiece.
By obtaining the original vibration data and contact force during the grinding process of workpieces, the vibration position compensation prediction model and force-controlled position compensation model are used to determine the displacement compensation amount and input it into the position controller to perform position control of the end effector and suppress workpiece vibration.
It effectively suppresses the vibration of the workpiece, improves grinding efficiency and quality, and ensures the consistency and efficiency of processing quality.
Smart Images

Figure CN119858069A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of automated grinding, and in particular to a grinding vibration suppression method, device, electronic equipment and storage medium. Background Art
[0002] Large thin-walled metal parts such as wind turbine blades, engine blades, aircraft skins and new carbon fiber composite structures are widely used in industries such as aerospace, rail transportation and energy production. The final surface processing of these parts or structures must meet the industry's requirements for surface quality and dimensional accuracy, usually by grinding. However, the current automatic grinding methods for large thin-walled parts or carbon fiber structures are limited in quantity and use, and a large number of workpieces are still processed by manual grinding. The underdeveloped automatic grinding of large thin-walled parts or carbon fiber structures is largely due to their inherent low stiffness characteristics, which often cause grinding chatter and forced vibration of the workpiece to be ground, which has a catastrophic effect on the surface quality. Even worse, it can lead to unstable grinding forces, which in some cases can cause separation between the tool and the workpiece.
[0003] In the prior art, CNC machining personnel solve vibration control problems by optimizing process parameters to reduce the intensity of vibration sources, by designing vibration absorbers, auxiliary fixtures and additional dampers to change the vibration transmission path, and by using piezoelectric actuators and control algorithms to manipulate structural responses. Robotic machining personnel often focus on the vibration control of robots and tools, and when grinding large thin-walled parts or carbon fiber components, low-rigidity workpieces are a key factor in grinding stability, and vibration control must be considered. However, until recently, vibration suppression methods for robotic grinding of low-rigidity workpieces were rare. Therefore, the problem involved is further defined as how to suppress workpiece vibration through effective force and position control in robotic grinding of weak-rigidity parts to improve grinding efficiency and quality. Summary of the invention
[0004] The present disclosure provides a grinding vibration suppression method, device, electronic device and storage medium to at least solve the above technical problems existing in the prior art.
[0005] According to a first aspect of the present disclosure, a grinding vibration suppression method is provided, the method comprising: Obtain the original vibration data during the workpiece grinding process; Inputting the original vibration data into a vibration position compensation prediction model to determine a vibration position compensation prediction value; Obtain the contact force during workpiece grinding; Inputting the contact force into a force-controlled position compensation model to determine a force-controlled position compensation prediction value; Determining a displacement compensation amount according to the vibration position compensation prediction value and the force control position compensation prediction value; The displacement compensation amount is input to a position controller to perform position control on the end effector.
[0006] In one possible implementation manner, inputting the original vibration data into a vibration position compensation prediction model to determine a vibration position compensation prediction value includes: Step S1: determining a first vibration mode function of the original vibration data according to empirical mode decomposition; Step S2: Eliminating the first vibration modal function from the original vibration data to determine a first function; Step S3: determining whether the mean curve of the upper envelope and the lower envelope of the first function is a monotonic function; If it is a monotonic function, substituting the first vibration modal function into the vibration position compensation prediction model to determine the vibration position compensation prediction value; If it is not a monotonic function, the first function is used as new original vibration data, and steps S1 to S3 are repeatedly performed until a p-th vibration mode function and a p-th function are obtained, and the mean curve of the upper envelope and the lower envelope of the p-th function is a monotonic function; Step S4: selecting three vibration mode functions with the largest frequencies from the first vibration mode function to the pth vibration mode function; Step S5: Substitute the three vibration mode functions with the largest frequencies into the vibration position compensation prediction model to determine the vibration position compensation prediction value.
[0007] In one possible implementation, determining the first vibration mode function of the original vibration data according to empirical mode decomposition includes: Step S1-1: determining, according to the original vibration data, an upper envelope formed by all maximum value points of the original vibration data, and a lower envelope formed by all minimum value points of the original vibration data; Step S1-2: determining the original vibration modal function of the original vibration data according to the upper envelope and the lower envelope; Step S1-3: Determine whether the original vibration mode function satisfies the following two conditions: Condition 1: The mean values of the upper envelope and the lower envelope at any time are zero; Condition 2: The number of points exceeding zero is equal to or differs by one from the number of extreme points; If the original vibration mode function satisfies both the above conditions 1 and 2, the original vibration mode function is recorded as the first vibration mode function; If the original vibration mode function does not satisfy condition 1 and condition 2 at the same time, the original vibration mode function is used as new original vibration data, and steps S1-1 to S1-3 are re-executed until the vibration mode function finally obtained satisfies condition 1 and condition 2. Step S1-4: Record the vibration modal function that finally satisfies conditions 1 and 2 as the first vibration modal function.
[0008] In one possible implementation manner, substituting the three vibration mode functions with the largest frequencies into the vibration position compensation prediction model to determine the vibration position compensation prediction value includes: Perform Fourier transform on the three vibration mode functions with the largest frequencies; Obtain the maximum amplitudes of the three vibration mode functions after Fourier transformation respectively; The maximum amplitude is substituted into a vibration position compensation prediction model to determine a vibration position compensation prediction value.
[0009] In one embodiment, the vibration position compensation prediction model is as shown in the following formula:
[0010] in, is the vibration position compensation prediction value, , , is the proportionality coefficient, and 1, , , are the maximum amplitudes of the three vibration mode functions respectively.
[0011] In one possible implementation manner, inputting the contact force into a force-controlled position compensation model to determine a force-controlled position compensation prediction value includes: Determining a dynamic equation of the end effector according to a dynamic model of the end effector; Performing Laplace transformation on the dynamic equation to obtain a force-controlled position compensation prediction model; A force control position compensation prediction value is determined according to the force control position compensation prediction model.
[0012] In one possible implementation manner, determining the displacement compensation amount according to the vibration position compensation prediction value and the force control position compensation prediction value includes: Determine the displacement compensation amount according to the following formula:
[0013] in, is the displacement compensation amount, is the vibration position compensation prediction value, It is the predicted value of force control position compensation.
[0014] According to a second aspect of the present disclosure, there is provided a grinding vibration suppression device, the device comprising: A first acquisition unit is configured to acquire raw vibration data during the grinding process of the workpiece; A first determination unit is configured to input the original vibration data into a vibration position compensation prediction model to determine a vibration position compensation prediction value; a second acquisition unit configured to acquire the contact force during the grinding process of the workpiece; a second determining unit configured to input the contact force into a force-controlled position compensation model to determine a force-controlled position compensation prediction value; a third determining unit, configured to determine a displacement compensation amount according to the vibration position compensation prediction value and the force control position compensation prediction value; The control unit is configured to input the displacement compensation amount to the position controller to perform position control on the end effector.
[0015] According to a third aspect of the present disclosure, there is provided an electronic device, including: at least one processor; and a memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the method described in the present disclosure.
[0016] According to a fourth aspect of the present disclosure, a non-transitory computer-readable storage medium storing computer instructions is provided, wherein the computer instructions are used to cause the computer to execute the method described in the present disclosure.
[0017] The grinding vibration suppression method, device, electronic device and storage medium disclosed in the present invention convert complex robot control into simple end effector control, establish a mathematical model for the end effector grinding process to obtain a force control position compensation prediction value, and at the same time, combine the vibration data of the workpiece to obtain the vibration position compensation prediction value, so as to improve the force control effect, avoid the increase of vibration amplitude caused by excessive force control error during force control, and thus improve the vibration suppression effect of the workpiece.
[0018] In the present disclosure, in order to solve the vibration suppression problem of weak rigid workpieces during the grinding process, the grinding head position is adjusted in real time according to the vibration mode and contact force. The vibration suppression effect is obvious, the force control accuracy is improved, and the consistency of processing quality and processing efficiency can be well guaranteed.
[0019] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] The above and other objects, features and advantages of the exemplary embodiments of the present disclosure will become readily understood by reading the detailed description below with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present disclosure are shown in an exemplary and non-limiting manner, in which: In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.
[0021] Figure 1 A flow chart of a grinding vibration suppression method provided by an embodiment of the present disclosure; Figure 2 A detailed processing diagram of the grinding vibration suppression method provided by an embodiment of the present disclosure; Figure 3 Schematic diagram of original vibration data and its corresponding vibration modal function curve of the embodiment of the present disclosure; Figure 4 A comparison diagram of the vibration amplitude of a workpiece during the grinding process using a conventional grinding method and using the method of an embodiment of the present disclosure; Figure 5 This is the surface quality diagram after grinding the weak rigid workpiece using conventional methods; Figure 6 This is a surface quality diagram after a weak rigid workpiece is polished using the method of an embodiment of the present disclosure; Figure 7 A schematic diagram of a grinding vibration suppression device provided in an embodiment of the present disclosure; Figure 8 A schematic diagram of the structure of an electronic device according to an embodiment of the present disclosure is shown. DETAILED DESCRIPTION
[0022] In order to make the purpose, features, and advantages of the present disclosure more obvious and easy to understand, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present disclosure.
[0023] The force / position hybrid control method of industrial robotic arms mainly obtains the change in robot torque through contact force, and further controls the robot displacement to reach the specified position to achieve force control. For workpieces with strong rigidity, better grinding effects can be achieved. However, for weak rigid workpieces, violent vibrations are very likely to occur during the grinding process. The grinding quality of the robot without considering the vibration of the workpiece is difficult to guarantee. At the same time, the different degrees of open source of different robots will make it difficult to obtain and control the internal joint torque information of the robot.
[0024] Based on this, the embodiment of the present disclosure provides a grinding vibration suppression method. Figure 1 This is a flow chart of the grinding vibration suppression method provided by an embodiment of the present disclosure. Figure 2 A detailed processing diagram of the grinding vibration suppression method provided by the embodiment of the present disclosure, such as Figure 1 and Figure 2 As shown, the method comprises the following steps: Step 101, obtaining original vibration data during the grinding process of the workpiece.
[0025] Specifically, the original vibration data during the grinding process within a time period of t may be collected by a vibration sensor, and the original vibration data may be recorded as X(t).
[0026] Step 102: Inputting the original vibration data into a vibration position compensation prediction model to determine a vibration position compensation prediction value.
[0027] In one embodiment, the raw vibration data is input into a vibration position compensation prediction model to determine a vibration position compensation prediction value, including: Step S1: determining the first vibration mode function of the original vibration data according to empirical mode decomposition; Step S2: Eliminate the first vibration mode function from the original vibration data to determine the first function; Step S3: determining whether the mean curve of the upper envelope and the lower envelope of the first function is a monotonic function; If it is a monotonic function, the first vibration mode function is substituted into the vibration position compensation prediction model to determine the vibration position compensation prediction value; If it is not a monotonic function, the first function is used as the new original vibration data, and steps S1 to S3 are repeatedly performed until the p-th vibration mode function and the p-th function are obtained, and the mean curve of the upper envelope and the lower envelope of the p-th function is a monotonic function; Step S4: selecting three vibration mode functions with the largest frequencies from the first vibration mode function to the pth vibration mode function; Step S5: Substitute the three vibration mode functions with the largest frequencies into the vibration position compensation prediction model to determine the vibration position compensation prediction value.
[0028] In one embodiment, determining a first vibration mode function of the original vibration data according to empirical mode decomposition includes: Step S1-1: determining, based on the original vibration data, an upper envelope formed by all the maximum value points of the original vibration data, and a lower envelope formed by all the minimum value points of the original vibration data; Step S1-2: determining the original vibration modal function of the original vibration data according to the upper envelope and the lower envelope; Step S1-3: Determine whether the original vibration mode function meets the following two conditions: Condition 1: The mean of the upper envelope and the lower envelope at any time is zero; Condition 2: The number of points exceeding zero is equal to or differs by one from the number of extreme points; If the original vibration mode function satisfies both the above conditions 1 and 2, the original vibration mode function is recorded as the first vibration mode function; If the original vibration mode function does not satisfy condition 1 and condition 2 at the same time, the original vibration mode function is used as the new original vibration data, and steps S1-1 to S1-3 are re-executed until the vibration mode function finally obtained satisfies condition 1 and condition 2. Step S1-4: Record the vibration modal function that finally satisfies conditions 1 and 2 as the first vibration modal function.
[0029] Specifically, step S1-1 is first performed to collect the original vibration data. Use the window function to truncate and obtain The mean curve of the upper and lower envelopes :
[0030] in, To connect with a curve The upper envelope formed by all the maximum points of To connect with a curve The lower envelope formed by all the minimum points of .
[0031] Next, step S1-2 is performed to decompose the original vibration data by empirical mode decomposition. Screening to obtain the original vibration mode function :
[0032] Next, execute step S1-3 to determine Whether conditions 1 and 2 are met at the same time; Condition 1: The mean of the upper envelope and the lower envelope at any time is zero; Condition 2: The number of points exceeding zero is equal to or differs by one from the number of extreme points; like If both condition 1 and condition 2 are met, As The first vibration mode function ,remember ; like If conditions 1 and 2 are not met at the same time, the original vibration mode function As the new original vibration data, re-execute steps S1-1 to S1-3 to obtain The mean curve of the upper and lower envelopes ,beg :
[0033] judge Whether conditions 1 and 2 are met at the same time, if not, As new raw vibration data, continue to repeat the method of step S1-1 to step S1-3 until the obtained Both conditions 1 and 2 are met.
[0034] Next, execute step S1-4 to obtain the vibration mode function that satisfies conditions 1 and 2. The first vibration mode function is , that is, for The first vibration mode function of It is through The method of repeating steps S1-1 to S1-3 is obtained.
[0035] Next, execute step S2 to The first vibration mode function from Eliminate from the equation, and we get the first function ,remember .
[0036] Next, execute step S3. If The mean curve of the upper and lower envelope curves is a monotonic function, then the screening is terminated; if The mean curve of the upper and lower envelope curves is not a monotonic function, then As the new original vibration data, continue to execute according to step S1 to step S3 to obtain The second vibration mode function of and the second function , if the second function The mean curve of the upper and lower envelope curves is a monotonic function, then the screening is terminated. If the mean curve of the upper and lower envelope curves is not a monotonic function, then repeat steps S1 to S3, and repeat the above steps to obtain satisfies both condition 1 and condition 2 The vibration mode function of the original vibration data is completed The modal analysis is written as:
[0037] in, The mean curve of the upper and lower envelope curves is a monotonic function.
[0038] Next, execute step S4 to obtain indivual The vibration mode functions of are sorted from high to low in frequency, and the first three are recorded as , , .
[0039] Next, step S5 is executed to substitute the three vibration mode functions with the largest frequencies into the vibration position compensation prediction model to determine the vibration position compensation prediction value.
[0040] In one embodiment, substituting the three vibration mode functions with the largest frequencies into the vibration position compensation prediction model to determine the vibration position compensation prediction value includes: Perform Fourier transform on the three vibration mode functions with the largest frequencies; Obtain the maximum amplitudes of the three vibration mode functions after Fourier transformation respectively; Substitute the maximum amplitude into the vibration position compensation prediction model to determine the vibration position compensation prediction value.
[0041] Specifically, , , Perform Fourier transform and obtain , , ,remember The largest value is , The largest value is , The largest value is , establish a vibration position compensation prediction model:
[0042] in, is the vibration position compensation prediction value, , , is the proportionality coefficient, and 1. If you obtain The number of vibration mode functions , then according to 1. Set; if obtained The number of vibration mode functions , then according to , , set up.
[0043] Figure 3 Schematic diagram of the original vibration data and the corresponding vibration modal function curve of the embodiment of the present disclosure. In this embodiment, the original vibration data of the grinding process within 800ms is collected by a vibration sensor, wherein (a) is the original vibration data, (b) is the corresponding first vibration modal function curve, (c) is the corresponding second vibration modal function curve, (d) is the corresponding third vibration modal function curve, (e) is the corresponding fourth vibration modal function curve, (f) is the corresponding fifth vibration modal function curve, (g) is the corresponding sixth vibration modal function curve, and (h) is the corresponding seventh vibration modal function curve.
[0044] Step 103, obtaining the contact force during the workpiece grinding process.
[0045] Specifically, the contact force during the workpiece grinding process can be obtained through a torque sensor.
[0046] Step 104 : input the contact force into a force-controlled position compensation model to determine a force-controlled position compensation prediction value.
[0047] In one embodiment, the contact force is input into a force-controlled position compensation model to determine a force-controlled position compensation prediction value, including: According to the dynamic model of the end effector, the dynamic equation of the end effector is determined; The dynamic equation is Laplace transformed to obtain the force-controlled position compensation prediction model; According to the force control position compensation prediction model, a force control position compensation prediction value is determined.
[0048] Specifically, based on the dynamic model of the end effector during the grinding process, the dynamic equation of the end effector is obtained:
[0049] In the formula, For expectation, is the contact force, is the inertia coefficient matrix, is the damping coefficient matrix, is the stiffness coefficient matrix, , , are the desired acceleration vector, desired velocity and desired position of the end effector, respectively. , , are the acceleration vector, velocity and position of the end effector respectively.
[0050] When contact force When the contact force is axial, the contact force is controlled by the axial contact force, and the inertia coefficient matrix , damping coefficient matrix , stiffness coefficient matrix is a positive definite matrix, choose , , , , , , , , , , replace , , , , , , , , , , To represent the variables and coefficients in the axial direction, the dynamic equation of the end effector is further simplified as follows:
[0051] Performing Laplace transform on the above equation, and Transformed into and , and Transformed into and , and Transformed into and , and Transformed into and ; where s is the complex frequency in the Laplace transform, then:
[0052] Simplified:
[0053] Therefore, the force control position compensation prediction model is:
[0054] Among them, ,in, It is the predicted value of force control position compensation.
[0055] It should be explained that the above steps are for controlling the axial contact force, wherein the control method of the longitudinal contact force and the lateral contact force is the same as the control method of the axial contact force, which will not be repeated here.
[0056] Step 105: Determine the displacement compensation amount according to the vibration position compensation prediction value and the force control position compensation prediction value.
[0057] In one embodiment, determining the displacement compensation amount according to the vibration position compensation prediction value and the force control position compensation prediction value includes: Determine the displacement compensation amount according to the following formula:
[0058] in, is the displacement compensation amount, is the vibration position compensation prediction value, It is the predicted value of force control position compensation.
[0059] Step 106: Input the displacement compensation amount to the position controller to perform position control on the end effector.
[0060] Figure 4 This is a comparison chart of the vibration amplitude of the workpiece during the grinding process using a conventional grinding method and using the method of an embodiment of the present disclosure.
[0061] The conventional grinding method and the method of the embodiment of the present disclosure are used to grind weak rigid workpieces of the same specifications, wherein: Figure 4 The upper middle curve is the workpiece vibration amplitude curve using the conventional grinding method (suppression off), and the lower curve is the workpiece vibration amplitude curve using the method of this embodiment (suppression on). Obviously, the method of this embodiment can effectively suppress the vibration generated by the weak rigidity workpiece during the grinding process.
[0062] Figure 5 This is the surface quality diagram after grinding the weak rigid workpiece using conventional methods; Figure 6 This is a surface quality diagram after a weakly rigid workpiece is polished using the method of an embodiment of the present disclosure.
[0063] Depend on Figure 5 and Figure 6It can be seen that the surface quality of the weak rigid workpiece after being polished by the method of this embodiment is significantly better than the surface quality of the weak rigid workpiece after being polished by the conventional method, and the surface quality of the weak rigid workpiece after being polished by the method of this embodiment has good consistency.
[0064] The disclosed embodiment also provides a grinding vibration suppression device, Figure 7 Schematic diagram of a grinding vibration suppression device provided in an embodiment of the present disclosure, as shown in Figure 7 As shown, the device comprises: A first acquisition unit 701 is configured to acquire raw vibration data during the grinding process of the workpiece; A first determination unit 702 is configured to input the original vibration data into a vibration position compensation prediction model to determine a vibration position compensation prediction value; A second acquisition unit 703 is configured to acquire the contact force during the grinding process of the workpiece; A second determining unit 704 is configured to input the contact force into the force-controlled position compensation model to determine a force-controlled position compensation prediction value; A third determining unit 705 is configured to determine a displacement compensation amount according to the vibration position compensation prediction value and the force control position compensation prediction value; The control unit 706 is configured to input the displacement compensation amount to the position controller to perform position control on the end effector.
[0065] In one embodiment, the first determining unit 702 includes: A first sub-determination unit is configured to execute step S1 to determine a first vibration mode function of the original vibration data according to empirical mode decomposition; a second sub-determining unit, configured to execute step S2, eliminate the first vibration modal function from the original vibration data, and determine the first function; A first sub-judgment unit is configured to execute step S3 to determine whether the mean curve of the upper envelope and the lower envelope of the first function is a monotonic function; If it is a monotonic function, the first vibration mode function is substituted into the vibration position compensation prediction model to determine the vibration position compensation prediction value; If it is not a monotonic function, the first function is used as the new original vibration data, and steps S1 to S3 are repeatedly performed until the p-th vibration mode function and the p-th function are obtained, and the mean curve of the upper envelope and the lower envelope of the p-th function is a monotonic function; A selection unit is configured to execute step S4, selecting three vibration mode functions with the largest frequencies from the first vibration mode function to the pth vibration mode function; The third sub-determination unit is configured to execute step S5, substitute the three vibration mode functions with the largest frequencies into the vibration position compensation prediction model to determine the vibration position compensation prediction value.
[0066] In one embodiment, the first sub-determining unit includes: The fourth sub-determining unit is configured to execute step S1-1, and determine, according to the original vibration data, an upper envelope formed by all maximum value points of the original vibration data, and a lower envelope formed by all minimum value points of the original vibration data; a fifth sub-determining unit, configured to execute step S1-2, and determine an original vibration modal function of the original vibration data according to the upper envelope and the lower envelope; The second sub-judgment unit is configured to execute step S1-3 to determine whether the original vibration mode function satisfies the following two conditions: Condition 1: The mean of the upper envelope and the lower envelope at any time is zero; Condition 2: The number of points exceeding zero is equal to or differs by one from the number of extreme points; If the original vibration mode function satisfies both the above conditions 1 and 2, the original vibration mode function is recorded as the first vibration mode function; If the original vibration mode function does not satisfy condition 1 and condition 2 at the same time, the original vibration mode function is used as the new original vibration data, and steps S1-1 to S1-3 are re-executed until the vibration mode function finally obtained satisfies condition 1 and condition 2. The sixth sub-determining unit is configured to execute step S1-4: record the vibration modal function that finally satisfies condition 1 and condition 2 as the first vibration modal function.
[0067] In one embodiment, the third sub-determining unit includes: a transform unit configured to perform Fourier transform on the three vibration mode functions with the largest frequencies; A first sub-acquisition unit is configured to respectively acquire the maximum amplitudes of the three vibration mode functions after Fourier transformation; The seventh sub-determination unit is configured to substitute the maximum amplitude into the vibration position compensation prediction model to determine the vibration position compensation prediction value.
[0068] In one embodiment, the second determining unit 704 includes: an eighth sub-determining unit, configured to determine a dynamic equation of the end effector according to a dynamic model of the end effector; A unit is obtained, configured to perform Laplace transformation on the dynamic equation to obtain a force-controlled position compensation prediction model; The ninth sub-determining unit is configured to determine the force control position compensation prediction value according to the force control position compensation prediction model.
[0069] According to an embodiment of the present disclosure, the present disclosure also provides an electronic device and a readable storage medium.
[0070] Figure 8 A schematic block diagram of an example electronic device 800 that can be used to implement an embodiment of the present disclosure is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present disclosure described and / or required herein.
[0071] like Figure 8 As shown, the device 800 includes a computing unit 801, which can perform various appropriate actions and processes according to a computer program stored in a read-only memory (ROM) 802 or a computer program loaded from a storage unit 808 to a random access memory (RAM) 803. In the RAM 803, various programs and data required for the operation of the device 800 can also be stored. The computing unit 801, the ROM 802, and the RAM 803 are connected to each other via a bus 804. An input / output (I / O) interface 805 is also connected to the bus 804.
[0072] A number of components in the device 800 are connected to the I / O interface 805, including: an input unit 806, such as a keyboard, a mouse, etc.; an output unit 807, such as various types of displays, speakers, etc.; a storage unit 808, such as a disk, an optical disk, etc.; and a communication unit 809, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 809 allows the device 800 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.
[0073] The computing unit 801 may be a variety of general and / or special processing components with processing and computing capabilities. Some examples of the computing unit 801 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various computing units running machine learning model algorithms, digital signal processors (DSPs), and any appropriate processors, controllers, microcontrollers, etc. The computing unit 801 performs the various methods and processes described above, such as the grinding vibration suppression method. For example, in some embodiments, the grinding vibration suppression method may be implemented as a computer software program, which is tangibly contained in a machine-readable medium, such as a storage unit 808. In some embodiments, part or all of the computer program may be loaded and / or installed on the device 800 via the ROM 802 and / or the communication unit 809. When the computer program is loaded into the RAM 803 and executed by the computing unit 801, one or more steps of the grinding vibration suppression method described above may be performed. Alternatively, in other embodiments, the computing unit 801 may be configured to perform the grinding vibration suppression method in any other appropriate manner (e.g., by means of firmware).
[0074] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), complex programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.
[0075] The program code for implementing the method of the present disclosure may be written in any combination of one or more programming languages. These program codes may be provided to a processor or controller of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that the program code, when executed by the processor or controller, enables the functions / operations specified in the flow chart and / or block diagram to be implemented. The program code may be executed entirely on the machine, partially on the machine, partially on the machine and partially on a remote machine as a stand-alone software package, or entirely on a remote machine or server.
[0076] In the context of the present disclosure, a machine-readable medium may be a tangible medium that may contain or store a program for use by or in conjunction with an instruction execution system, device, or equipment. A machine-readable medium may be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium may include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device, or device, or any suitable combination of the foregoing. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.
[0077] To provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the computer. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).
[0078] The systems and techniques described herein may be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), and the Internet.
[0079] A computer system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The relationship of client and server is generated by computer programs running on respective computers and having a client-server relationship with each other. The server may be a cloud server, a server of a distributed system, or a server combined with a blockchain.
[0080] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps recorded in this disclosure can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solutions disclosed in this disclosure can be achieved, and this document does not limit this.
[0081] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0082] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.
Claims
1. A grinding vibration suppression method, characterized in that: The method comprises: Obtain the original vibration data during the workpiece grinding process; Inputting the original vibration data into a vibration position compensation prediction model to determine a vibration position compensation prediction value; Obtain the contact force during workpiece grinding; Inputting the contact force into a force-controlled position compensation model to determine a force-controlled position compensation prediction value; Determining a displacement compensation amount according to the vibration position compensation prediction value and the force control position compensation prediction value; The displacement compensation amount is input to a position controller to perform position control on the end effector.
2. The method according to claim 1, characterized in that The step of inputting the original vibration data into a vibration position compensation prediction model to determine a vibration position compensation prediction value comprises: Step S1: determining a first vibration mode function of the original vibration data according to empirical mode decomposition; Step S2: Eliminating the first vibration modal function from the original vibration data to determine a first function; Step S3: determining whether the mean curve of the upper envelope and the lower envelope of the first function is a monotonic function; If it is a monotonic function, substituting the first vibration modal function into the vibration position compensation prediction model to determine the vibration position compensation prediction value; If it is not a monotonic function, the first function is used as new original vibration data, and steps S1 to S3 are repeatedly performed until a p-th vibration mode function and a p-th function are obtained, and the mean curve of the upper envelope and the lower envelope of the p-th function is a monotonic function; Step S4: selecting three vibration mode functions with the largest frequencies from the first vibration mode function to the pth vibration mode function; Step S5: Substitute the three vibration mode functions with the largest frequencies into the vibration position compensation prediction model to determine the vibration position compensation prediction value.
3. The method according to claim 2, characterized in that Determining a first vibration mode function of the original vibration data according to empirical mode decomposition includes: Step S1-1: determining, according to the original vibration data, an upper envelope formed by all maximum value points of the original vibration data, and a lower envelope formed by all minimum value points of the original vibration data; Step S1-2: determining the original vibration modal function of the original vibration data according to the upper envelope and the lower envelope; Step S1-3: Determine whether the original vibration mode function satisfies the following two conditions: Condition 1: The mean values of the upper envelope and the lower envelope at any time are zero; Condition 2: The number of points exceeding zero is equal to or differs by one from the number of extreme points; If the original vibration mode function satisfies both the above conditions 1 and 2, the original vibration mode function is recorded as the first vibration mode function; If the original vibration mode function does not satisfy condition 1 and condition 2 at the same time, the original vibration mode function is used as new original vibration data, and steps S1-1 to S1-3 are re-executed until the vibration mode function finally obtained satisfies condition 1 and condition 2. Step S1-4: Record the vibration modal function that finally satisfies conditions 1 and 2 as the first vibration modal function.
4. The method according to claim 2, characterized in that: Substituting the three vibration mode functions with the largest frequencies into the vibration position compensation prediction model to determine the vibration position compensation prediction value includes: Perform Fourier transform on the three vibration mode functions with the largest frequencies; Obtain the maximum amplitudes of the three vibration mode functions after Fourier transformation respectively; The maximum amplitude is substituted into a vibration position compensation prediction model to determine a vibration position compensation prediction value.
5. The method according to claim 4, characterized in that The vibration position compensation prediction model is shown in the following formula: in, is the vibration position compensation prediction value, , , is the proportionality coefficient, and 1, , , are the maximum amplitudes of the three vibration mode functions respectively.
6. The method according to claim 1, characterized in that Inputting the contact force into a force-controlled position compensation model to determine a force-controlled position compensation prediction value includes: Determining a dynamic equation of the end effector according to a dynamic model of the end effector; Performing Laplace transformation on the dynamic equation to obtain a force-controlled position compensation prediction model; A force control position compensation prediction value is determined according to the force control position compensation prediction model.
7. The method according to claim 1, characterized in that The determining of the displacement compensation amount according to the vibration position compensation prediction value and the force control position compensation prediction value comprises: Determine the displacement compensation amount according to the following formula: in, is the displacement compensation amount, is the vibration position compensation prediction value, It is the predicted value of force control position compensation.
8. A grinding vibration suppression device, characterized in that: The device comprises: A first acquisition unit is configured to acquire raw vibration data during the grinding process of the workpiece; A first determination unit is configured to input the original vibration data into a vibration position compensation prediction model to determine a vibration position compensation prediction value; a second acquisition unit configured to acquire the contact force during the grinding process of the workpiece; a second determining unit configured to input the contact force into a force-controlled position compensation model to determine a force-controlled position compensation prediction value; a third determining unit, configured to determine a displacement compensation amount according to the vibration position compensation prediction value and the force control position compensation prediction value; The control unit is configured to input the displacement compensation amount to the position controller to perform position control on the end effector.
9. An electronic device, characterized in that: include: at least one processor; as well as a memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the method according to any one of claims 1 to 7.
10. A non-transitory computer-readable storage medium storing computer instructions, characterized in that: The computer instructions are used to make a computer execute the method according to any one of claims 1-7.
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