Ultrasonic vibration auxiliary grinding and polishing device

Abstract

An ultrasonic vibration auxiliary grinding and polishing device comprises a shell unit, a main shaft unit, a power supply unit, a vibration unit, a vibration reduction unit and a grinding and polishing unit. The main shaft unit includes a rotating shaft that is rotatable and defines a hollow portion. The vibration unit is arranged in the hollow part in a penetrating mode, is spaced from the rotating shaft and is used for converting electric energy into vibration energy of ultrasonic waves. The vibration reduction unit comprises a plurality of buffering pieces arranged between the rotating shaft and the vibration unit in a surrounding mode. The grinding and polishing unit comprises a conduction disc connected with the rotating shaft and the vibration unit and a grinding wheel detachably installed on the conduction disc. The conduction disc is used for conducting the vibration energy to the grinding wheel. Therefore, the vibration unit is supported by the buffer piece, vibration conducted to the rotating shaft is reduced, and the concentricity and the stability of the vibration unit and the rotating shaft are improved.

Description

Technical Field

[0001] The invention relates to a grinding and polishing device, in particular to an ultrasonic vibration assisted grinding and polishing device. Background Art

[0002] See also Figure 1 , a known grinding and polishing device 1 disclosed in Korean Patent Publication No. KR1020120114700A is described, comprising a grinding wheel 11 for grinding the edge of a glass panel 2, and a spindle 12 connected to the grinding wheel 11 and used to drive the grinding wheel 11 to rotate. The spindle 12 can transmit ultrasonic waves to the grinding wheel 11. In this way, during the process of the grinding wheel 11 processing the glass panel 2, the grinding efficiency is improved by ultrasonic vibration, and processing damage is reduced.

[0003] However, since the ultrasonic wave must be transmitted to the grinding wheel 11 through the spindle 12, there is a technical problem of generating noise and vibration. In addition, the vibration directly transmitted to the spindle 12 will damage the spindle 12 and the matching components, thereby causing the surface accuracy of the glass panel 2 to be low. Summary of the invention

[0004] The object of the present invention is to provide an ultrasonic vibration assisted grinding and polishing device which can improve stability, reduce noise and vibration, and thus effectively improve processing efficiency and processing quality.

[0005] The ultrasonic vibration assisted grinding and polishing device of the present invention comprises a shell unit, a spindle unit, a power supply unit, a vibration unit, a vibration reduction unit, and a grinding and polishing unit.

[0006] The spindle unit is installed on the shell unit, and includes a motor and a rotating shaft that can be driven by the motor and defines a hollow portion around an axis.

[0007] The power supply unit is used for inputting electric energy.

[0008] The vibration unit is installed in the hollow part and is spaced apart from the rotating shaft. The vibration unit is used to convert the electrical energy into ultrasonic vibration energy and has an extension portion passing through the shell unit along the direction of the axis.

[0009] The vibration reduction unit includes a plurality of buffer components surrounding the rotating shaft and the vibration unit and used for limiting the vibration unit and blocking the vibration energy.

[0010] The grinding and polishing unit includes a conduction plate connected to the rotating shaft and the extension part and outside the shell unit, and a grinding wheel detachably mounted on the conduction plate, wherein the conduction plate is suitable for conducting the vibration energy to the grinding wheel.

[0011] The ultrasonic vibration assisted grinding and polishing device of the present invention, the rotating shaft also defines a channel that is connected to the outside world and extends from one end face to the other end face along the direction of the axis, and has a wiring through hole that connects the outside world and the hollow part and extends along the direction of the axis. The channel is suitable for guiding the external fluid to pass through the rotating shaft, and the wiring through hole is suitable for guiding at least one wire from the outside world into the hollow part. The conductive disk also has at least one outlet that connects the outside world and the channel, and the at least one outlet is used to discharge the fluid, so that the fluid is suitable for cooling or lubricating the workpiece.

[0012] The ultrasonic vibration assisted grinding and polishing device of the present invention, the vibration reduction unit also includes a plurality of rings spaced apart along the axis, each of the rings surrounds the vibration unit, and each of the buffers is blocked between the corresponding ring and the rotating shaft.

[0013] The ultrasonic vibration assisted grinding and polishing device of the present invention, the grinding and polishing unit also includes a central bolt, the conductive disk has a central portion located in the center, and a centrifugal portion surrounding the central portion, the central portion has a groove, the central bolt passes through the groove along the direction of the axis, and abuts against the central portion and is connected to the vibration unit.

[0014] The ultrasonic vibration assisted grinding and polishing device of the present invention, the grinding and polishing unit also includes a plurality of first bolts, and a plurality of first protrusions formed between the conductive disk and the rotating shaft, the conductive disk also has a first disk surface formed on one side, the first bolts are equiangularly distributed around the axis, each of the first bolts passes through the conductive disk along the direction of the axis, and abuts against the conductive disk and is connected to the rotating shaft, and the first protrusion contacts the rotating shaft and the first disk surface of the conductive disk.

[0015] The ultrasonic vibration assisted grinding and polishing device of the present invention, the grinding and polishing unit also includes a plurality of second bolts, the conductive disk also has a second disk surface formed on the other side opposite to the first disk surface, and an annular rib surrounding the axis and formed on the second disk surface, the annular rib abuts against the grinding wheel, the second bolts are equiangularly distributed around the axis, each of the second bolts passes through the conductive disk along the direction of the axis and abuts against the conductive disk and is connected to the grinding wheel.

[0016] The ultrasonic vibration assisted grinding and polishing device of the present invention, the grinding and polishing unit also includes a plurality of second protrusions formed between the conductive disk and the grinding wheel, the second disk surface is spaced apart from the grinding wheel, the second protrusions are in contact with the second disk surface of the conductive disk and the grinding wheel, and are suitable for transmitting the vibration energy to the grinding wheel, and the amplitude of the portion of the conductive disk adjacent to the second protrusion is greater than the amplitude of the portion adjacent to the first protrusion.

[0017] In the ultrasonic vibration assisted grinding and polishing device of the present invention, each of the second bolts defines a distance from the axis along a direction perpendicular to the axis, and the distance is between 80 mm and 100 mm, 85 mm and 95 mm, between 60 mm and 80 mm, between 80 mm and 120 mm, or between 90 mm and 110 mm. In the process in which the vibration energy is transmitted from the vibration unit to the grinding wheel via the conduction disk, the conduction disk vibrates at a high frequency in a resonance mode, and the resonance mode is a concentric circle resonance mode.

[0018] The ultrasonic vibration assisted grinding and polishing device of the present invention, the grinding and polishing unit also includes a connecting member surrounding the vibration unit and located between the first disk surface of the conductive disk and the rotating shaft, and a plurality of first bolts, the first bolts are distributed around the axis, each of the first bolts passes through the connecting member along the direction of the axis, and abuts against the connecting member and is connected to the rotating shaft.

[0019] In the ultrasonic vibration-assisted grinding and polishing device of the present invention, the power supply unit includes a first induction element installed on the shell unit and used to transmit the electric energy, and a second induction element installed on the rotating shaft and electrically connected to the vibration unit, and the second induction element and the first induction element transmit the electric energy through electromagnetic induction.

[0020] The beneficial effect of the present invention is that supporting the vibration unit by the buffer component can not only reduce the vibration transmission to the rotating shaft, but also improve the concentricity and stability of the vibration unit and the rotating shaft, and reduce noise and vibration, thereby effectively improving processing efficiency and processing quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Other features and effects of the present invention will be clearly presented in the embodiments with reference to the accompanying drawings, in which:

[0022] Figure 1 is a front view schematic diagram illustrating a known grinding and polishing device disclosed in Korean Patent Publication No. KR1020120114700A;

[0023] Figure 2 is a perspective view illustrating a first embodiment of the ultrasonic vibration assisted grinding and polishing device of the present invention;

[0024] Figure 3 is a cross-sectional view of the first embodiment;

[0025] Figure 4 is a perspective exploded view of the first embodiment;

[0026] Figure 5 is an incomplete exploded perspective view illustrating the conductive disc and the grinding wheel of the first embodiment;

[0027] Figure 6 is a partially enlarged cross-sectional view of the first embodiment;

[0028] Figure 7 is a partial enlarged cross-sectional view illustrating that a plurality of first protrusions are spaced between the conducting disk and the rotating shaft of the first embodiment;

[0029] Figure 8 is a partial enlarged cross-sectional view illustrating that a plurality of second protrusions are spaced between the conductive disk and the grinding wheel of the first embodiment;

[0030] Fig. 9 It is along Figure 6 a cross-sectional view taken along line IX-IX;

[0031] Fig.10 is a frequency response curve diagram, which illustrates that when the conductive disk of the first embodiment has grooves, periodic vibration can be generated;

[0032] Fig.11 is an energy gradient simulation diagram, illustrating the energy distribution of the conductive disk of the first embodiment;

[0033] Fig.12 is similar to Fig.11 The energy gradient simulation diagram is shown in FIG. 1 , but the amplitude of the portion where the conductive disk is connected to the grinding wheel is greater than the amplitude of the portion where the conductive disk is connected to the rotating shaft;

[0034] Fig.13 is a cross-sectional view illustrating a second embodiment of the ultrasonic vibration assisted grinding and polishing device of the present invention;

[0035] Fig.14 is a cross-sectional view illustrating another aspect of the second embodiment. DETAILED DESCRIPTION

[0036] See also Figure 2 to Figure 5 A first embodiment of the ultrasonic vibration assisted grinding and polishing device of the present invention includes a shell unit 3, a spindle unit 4, a power supply unit 5, a vibration unit 6, a vibration reduction unit 7, and a grinding and polishing unit 8.

[0037] The housing unit 3 includes a housing 31, a rear cover 32 connected to one end of the housing 31, and a front cover 33 connected to the other end of the housing 31. The housing 31 defines a rear space 311 around an axis X, and a front space 312 along the axis X in a direction opposite to the rear space 311. The rear cover 32 defines a rear opening 321 connected to the rear space 311 around the axis X. The front cover 33 defines a front opening 331 connected to the front space 312 around the axis X.

[0038] The spindle unit 4 includes a motor 41 installed in the housing 31 and inserted into the rear space 311 , a rotating shaft 42 rotatably passing through the motor 41 and the housing 31 along the direction of the axis X, and a plurality of bearings 43 .

[0039] In this embodiment, the center line of the rotating shaft 42 coincides with the axis X. The rotating shaft 42 can be driven by the motor 41 to rotate. The rotating shaft 42 has a rear portion 421 passing through the motor 41, a front portion 422 opposite to the rear portion 421 and surrounding the axis X to define a hollow portion 420, and a channel 423 connected to the outside and extending from one end face along the direction of the axis X toward the other end face. The front portion 422 is inserted into the front space 312 and passes through the shell unit 3 through the front opening 331. The channel 423 is suitable for guiding a fluid from the outside to enter the rotating shaft 42. The channel 423 has a main branch section 424 extending along the axis X, a plurality of first branch sections 425 connected to the main branch section 424 and distributed around the axis X, and a plurality of second branch sections 426 connected to the main branch section 424 and the hollow portion 420. In this embodiment, the fluid can be, but is not limited to, gas or water.

[0040] The bearing 43 is installed between the housing 31 and the rotating shaft 42 and is located in the rear space 311 and the front space 312. The bearing 43 is used to support the rear portion 421 and the front portion 422 of the rotating shaft 42.

[0041] The power supply unit 5 includes a first induction element 51 installed on the back cover 32 and used for transmitting electric energy, and a second induction element 52 installed on the rotating shaft 42. The second induction element 52 and the first induction element 51 transmit the electric energy through electromagnetic induction.

[0042] See also Figure 3 to Figure 6, the vibration unit 6 is disposed in the hollow portion 420 along the direction of the axis X and is spaced apart from the rotating shaft 42. The vibration unit 6 defines a first maximum diameter d1 along a direction perpendicular to the axis X, and is electrically connected to the second induction element 52. The vibration unit 6 includes a transducer 61 for converting the electrical energy into an ultrasonic vibration energy, and a horn 62 connected to the transducer 61 and extending along the direction of the axis X. The horn 62 is used to amplify the amplitude of the vibration energy, and has an extension portion 621 that passes through the front opening 331 along the direction of the axis X. In this embodiment, the center line of the horn 62 coincides with the axis X. The frequency range of the vibration energy is between 15kHz and 100kHz, preferably, between 15kHz and 25kHz.

[0043] The vibration reduction unit 7 includes two rings 71 spaced apart in the direction of the axis X, and two buffers 72. Each of the rings 71 surrounds the vibration unit 6 and has a mounting groove 711 formed on the outer peripheral surface. Each of the buffers 72 is sleeved in the corresponding mounting groove 711 and surrounds the rotating shaft 42 and the corresponding ring 71. The buffer 72 is used to limit the vibration unit 6 so that the vibration unit 6 is consistent with the center of the rotating shaft 42, and to block the vibration energy from being transmitted by the vibration unit 6 in a direction perpendicular to the axis X.

[0044] It should be noted that the ring 71 can be configured to be integral with the vibration unit 6, or configured to be detachably sleeved on the vibration unit 6.

[0045] The grinding and polishing unit 8 includes a conductive plate 81 outside the housing unit 3 , a grinding wheel 82 , a plurality of first protrusions 83 , a plurality of second protrusions 84 , a central bolt 85 , a plurality of first bolts 86 , and a plurality of second bolts 87 .

[0046] The conductive disc 81 is connected to the horn 62, and has a central portion 811 substantially perpendicular to the axis X and located at the center, a centrifugal portion 812 surrounding the central portion 811, a first disc surface 813 formed on one side, a second disc surface 814 formed on the other side opposite to the first disc surface 813, a ring rib 815 formed on the second disc surface 814 and surrounding the axis X, and a plurality of outlets 816 extending from the first disc surface 813 to the second disc surface 814. The central portion 811 has a groove 817. The first disc surface 813 contacts the extension portion 621 of the horn 62 and is spaced apart from the rotating shaft 42. Each of the outlets 816 is connected to the first branch section 425 corresponding to the first disc surface 813, and is used to discharge the fluid.

[0047] In this embodiment, the conductive disk 81 is circular and defines a maximum diameter D centered on the axis X. The maximum diameter D is greater than the first maximum diameter d1.

[0048] In this embodiment, the grinding wheel 82 is a grinding wheel and defines a second maximum diameter d2 that is larger than the maximum diameter D in a direction perpendicular to the axis X. The grinding wheel 82 is detachably mounted on the conductive disk 81 and has a wheel frame 821 and a plurality of abrasives 822 connected to the wheel frame 821. The wheel frame 821 has an inner annular surface 823 surrounding the axis X, an outer annular surface 824 surrounding the inner annular surface 823, a frame surface 825 connecting the inner annular surface 823 and the outer annular surface 824, and a wheel surface 826 opposite to the frame surface 825. The inner annular surface 823 abuts against the annular rib 815. The frame surface 825 is spaced apart from the second disk surface 814. The abrasive 822 is connected to the wheel surface 826 and is adjacent to a peripheral edge of the wheel surface 826. The abrasive 822 is suitable for grinding a workpiece, such as a wafer (not shown).

[0049] See also Figure 6 , Figure 7 and Figure 8 In this embodiment, the number of the first protrusions 83 is six, which are formed on the first disk surface 813 of the conductive disk 81 and are approximately circular. The first protrusions 83 are in contact with the rotating shaft 42 and the first disk surface 813 .

[0050] In this embodiment, the number of the second protrusions 84 is six, which are formed on the second disk surface 814 of the conductive disk 81 and are approximately semicircular. The second protrusions 84 contact the frame surface 825 of the grinding wheel 82 and the second disk surface 814 .

[0051] It should be noted that the first protrusion 83 is not limited to being formed on the end surface of the first disk surface 813, and in other variations of this embodiment, it can also be formed on the rotating shaft 42. In addition, the second protrusion 84 is not limited to being formed on the second disk surface 814, and in other variations of this embodiment, it can also be formed on the frame surface 825 of the grinding wheel 82. In addition, in this embodiment, the first protrusion 83 and the second protrusion 84 are integrally formed with the conductive disk 81. The first protrusion 83 and the second protrusion 84 can also be gaskets separated from the conductive disk 81.

[0052] The central bolt 85 has a central bolt head 851 that abuts against the central portion 811 of the conductive disk 81 and penetrates the groove 817 along the axis X, and a central bolt rod 852 that passes through the conductive disk 81 along the direction of the axis X from the central bolt head 851 and is connected to the horn 62.

[0053] The first bolts 86 are equiangularly distributed around the axis X. Each of the first bolts 86 has a first bolt head 861 abutting against the conductive disk 81 , and a first bolt rod 862 extending from the first bolt head 861 through the conductive disk 81 along the axis X and connected to the rotating shaft 42 .

[0054] It is worth noting that the conductive plate 81 uses the first bolt 86 as a node to distinguish the central portion 811 and the centrifugal portion 812 . That is, the portion between the first bolt 86 and the axis X is defined as the central portion 811 , and the remaining portion is the centrifugal portion 812 .

[0055] The second bolts 87 are equiangularly distributed around the axis X. Each of the second bolts 87 has a second bolt head 871 abutting against the centrifugal portion 812 of the conductive disk 81 , and a second bolt rod 872 extending from the second bolt head 871 through the conductive disk 81 along the direction of the axis X and connected to the grinding wheel 82 .

[0056] In this embodiment, each of the second bolts 87 defines a distance T with the axis X along a direction perpendicular to the axis X. The distance T is between 50 mm and 120 mm, preferably, between 80 mm and 100 mm, 85 mm and 95 mm, 60 mm and 80 mm, 80 mm and 120 mm, or 90 mm and 110 mm.

[0057] See also Figure 6 to Figure 9 In the process of transmitting the vibration energy from the amplitude change rod 62 to the grinding wheel 82 via the conduction disk 81, firstly, the amplitude change rod 62 will be subjected to the stress of the vibration energy and produce telescopic deformation along the direction of the axis X, and vibrate at a high frequency in a first mode.

[0058] When the vibration energy is transmitted from the horn 62 to the conducting disc 81, the central portion 811 of the conducting disc 81 is easily deformed due to the presence of the groove 817. At this time, in addition to the expansion and contraction deformation of the central portion 811 of the conducting disc 81 along the direction of the axis X, the centrifugal portion 812 of the conducting disc 81 is also twisted and bent with the first bolt 86 as a node, and shear deformation is generated in a direction perpendicular to the axis X. As a result, the conducting disc 81 vibrates at a high frequency in a second mode.

[0059] See also Figure 6 ,and Fig.10 From the frequency response curve shown, it can be seen that when the conduction plate 81 has the groove 817, it is more capable of generating periodic vibrations than the design without the groove 817. Thus, the effectiveness and stability of conducting the vibration energy are improved.

[0060] When the vibration energy is transmitted from the conductive plate 81 to the grinding wheel 82 via the second protrusion 84, the conductive plate 81 and the grinding wheel 82 will vibrate at a high frequency in a resonance mode. Fig.11 Shown are concentric resonant modes. Fig. 9 and Fig.11 , that is, the vibration energy can be transmitted from the central bolt 85 toward the annular rib 815 in a concentric circle mode.

[0061] It is worth noting that, during the process of transmitting the vibration energy, the vibration energy will also be transmitted from the transmission plate 81 to the rotating shaft 42 via the first protrusion 83. Fig.11 , Fig.12 From the energy gradient simulation diagram shown, it can be found that the central part 811 is directly connected to the horn 62, and the vibration energy is the largest. However, from the perspective of the concentric circle resonance mode, the darker concentric circles are the parts with smaller vibration energy, and the amplitude is close to 0. The lighter concentric circles are the parts with larger vibration energy, and the amplitude is close to the peak. Among them, the innermost dark concentric circle 9a is equivalent to the part of the conductive disk 81 adjacent to the first protrusion 83. The outermost light concentric circle 9b is equivalent to the part of the conductive disk 81 adjacent to the second protrusion 84. Obviously, the amplitude of the part of the conductive disk 81 adjacent to the second protrusion 84 is greater than the amplitude of the part adjacent to the first protrusion 83.

[0062] Thereby, when the abrasive 822 is adjacent to the second protrusion 84 and vibrates at a high frequency together with the centrifugal portion 812, the vibration amplitude of the abrasive 822 is effectively increased, and through the telescopic cutting force along the direction of the axis X and the shear cutting force along the direction perpendicular to the axis X, the workpiece is ground more quickly and the probability of damaging the workpiece is greatly reduced.

[0063] It is worth noting that, during the process of the vibration energy transmission, the external fluid can be introduced into the channel 423 of the rotating shaft 42 through a pressurizing device (such as a pump). At this time, the fluid entering the first branch section 425 and the second branch section 426 from the main branch section 424 of the channel 423 will flow toward the outlet 816 of the conduction disk 81 and the hollow portion 420. Finally, the fluid is discharged from the outlet 816, the gap between the rotating shaft 42 and the conduction disk 81, and sprayed between the workpiece and the abrasive 822. In this way, the fluid exchanges heat with the abrasive 822, the workpiece, and the vibration unit 6 to achieve the effect of heat dissipation, cooling or lubrication.

[0064] It should be noted that the outlet 816 for discharging the fluid is not limited to being directly connected to the outside. In other variations of this embodiment, a flow channel (not shown) connecting the outside and the outlet 816 may be formed on the grinding wheel 82, so that the fluid is discharged from the flow channel after passing through the outlet 816. In addition, when the fluid is configured as gas, the channel 423 can also provide power for the wire (not shown) connecting the second sensing element 52 and the vibration unit 6 to pass through.

[0065] See also Fig.13 and Fig.14 , is a second embodiment of the present invention, which is the same as the first embodiment, and also includes the shell unit 3, the spindle unit 4, the power supply unit 5, the vibration unit 6, the vibration reduction unit 7, and the grinding and polishing unit 8. The difference is:

[0066] The rotating shaft 42 further includes two wiring through holes 427. The channel 423 extends along the direction of the axis X and is connected to the hollow portion 420 and the outside world, and is used to guide the fluid from the outside world into the hollow portion 420. The wiring through holes 427 are parallel to the channel 423 and are connected to the hollow portion 420 and the outside world, and the wires (not shown) for connecting the second sensing element 52 and the vibration unit 6 pass through them.

[0067] The grinding and polishing unit 8 further includes a connecting member 88 surrounding the vibration unit 6 and located between the first disk surface 813 of the conductive disk 81 and the rotating shaft 42 .

[0068] The first bolt rod 862 of the first bolt member 86 passes through the connecting member 88 along the direction of the axis X until each of the first bolt heads 861 abuts against the connecting member 88 , and each of the first bolt rods 862 is connected to the rotating shaft 42 .

[0069] It is worth noting that the vibration unit 6 is not limited to converting the electrical energy into the vibration energy. In other variations of this embodiment, the vibration unit 6 further defines a flow channel 60 extending from one end surface to the other end surface along the axis X. The central bolt 85 further has a central hole 853 along the axis X that penetrates the central bolt head 851 and the central bolt rod 852.

[0070] Thereby, the fluid can flow from the channel 423 through the flow passage 60 and the center hole 853 , and can also perform heat exchange with the abrasive 822 , the workpiece, and the vibration unit 6 to achieve heat dissipation, cooling or lubrication effects.

[0071] Through the above description, the advantages of the above embodiments can be summarized as follows:

[0072] 1. The vibration unit 6 of the present invention is in point contact with the rotating shaft 42 only through the ring 71 and the buffer 72. In addition to maintaining the concentricity of the vibration unit 6 and the rotating shaft 42 through the ring 71, the buffer 72 can also reduce the transmission of vibration waves to the rotating shaft 42.

[0073] 2. The present invention can also reduce the loss of the vibration energy by the special spacing T between the first bolt 86 and the axis X, and the special design of the first protrusion 83, the second protrusion 84, and the groove 817, and increase the vibration energy of the portion of the conductive plate 81 adjacent to the second protrusion 84, and reduce the vibration energy of the portion adjacent to the first protrusion 83. In this way, not only can the vibration of the rotating shaft 42 be effectively avoided and the noise reduced, but also the vibration amplitude of the abrasive 822 can be increased, so that the workpiece to be processed can be ground faster, and the grinding wheel 82 with a larger size or heavier weight can be used. In addition, dust can be prevented from adhering to the grinding wheel 82, thereby extending the service life.

[0074] 3. In addition, the first induction element 51 and the second induction element 52 of the present invention transmit electrical energy through electromagnetic induction without the need for wire connection, which not only avoids direct physical contact but also reduces wear and tear, thereby increasing service life.

[0075] 4. The present invention can also make the external fluid flow from the channel 423 to the workpiece through the outlet 816 through the special design of the channel 423. In this way, the fluid exchanges heat with the abrasive 822, the workpiece, and the vibration unit 6 to achieve the effect of heat dissipation, cooling or lubrication.

[0076] The above descriptions are merely embodiments of the present invention and should not be used to limit the scope of the present invention. That is, any simple equivalent changes and modifications made according to the claims and description of the present invention still fall within the scope of the present invention.

Claims

1. An ultrasonic vibration-assisted grinding and polishing device, characterized in that: The ultrasonic vibration assisted grinding and polishing device comprises: Shell elements; A spindle unit, mounted on the housing unit, comprising a motor, a rotating shaft driven by the motor and defining a hollow portion around an axis; A power supply unit, used for inputting electric energy; a vibration unit installed in the hollow portion and spaced apart from the rotating shaft, the vibration unit being used to convert the electrical energy into ultrasonic vibration energy and having an extension portion passing through the shell unit in the direction of the axis; A vibration reduction unit, comprising a plurality of buffer members surrounding the rotating shaft and the vibration unit and used to limit the vibration unit and block the vibration energy; and The grinding and polishing unit comprises a conduction disc connected to the rotating shaft and the extension part and outside the shell unit, and a grinding wheel detachably mounted on the conduction disc, wherein the conduction disc is suitable for conducting the vibration energy to the grinding wheel.

2. The ultrasonic vibration-assisted grinding and polishing device according to claim 1, characterized in that: The rotating shaft also defines a channel that is connected to the outside world and extends from one end face to the other end face along the direction of the axis, and has a wiring through hole that connects the outside world with the hollow part and extends along the direction of the axis. The channel is suitable for guiding external fluid to pass through the rotating shaft, and the wiring through hole is suitable for guiding at least one wire from the outside world into the hollow part. The conductive disk also has at least one outlet that connects the outside world with the channel, and the at least one outlet is used to discharge the fluid, so that the fluid is suitable for cooling or lubricating the workpiece.

3. The ultrasonic vibration assisted grinding and polishing device according to claim 1, characterized in that: The vibration reduction unit further comprises a plurality of rings spaced apart along the axis, each of the rings surrounds the vibration unit, and each of the buffers is blocked between the corresponding ring and the rotating shaft.

4. The ultrasonic vibration-assisted grinding and polishing device according to claim 1, characterized in that: The grinding and polishing unit further comprises a central bolt, the conductive disk having a central portion located in the center and a centrifugal portion surrounding the central portion, the central portion having a groove, the central bolt passing through the groove along the direction of the axis and resting against the central portion and connected to the vibration unit.

5. The ultrasonic vibration assisted grinding and polishing device according to claim 4, characterized in that: The grinding and polishing unit further includes a plurality of first bolts and a plurality of first protrusions formed between the conductive disk and the rotating shaft. The conductive disk further includes a first disk surface formed on one side. The first bolts are equiangularly distributed around the axis. Each of the first bolts passes through the conductive disk along the direction of the axis and abuts against the conductive disk and is connected to the rotating shaft. The first protrusion contacts the rotating shaft and the first disk surface of the conductive disk.

6. The ultrasonic vibration assisted grinding and polishing device according to claim 5, characterized in that: The grinding and polishing unit further comprises a plurality of second bolts. The conductive disk further comprises a second disk surface formed on the other side opposite to the first disk surface, and an annular rib surrounding the axis and formed on the second disk surface, the annular rib abuts against the grinding wheel, the second bolts are equiangularly distributed around the axis, each of the second bolts passes through the conductive disk along the direction of the axis and abuts against the conductive disk and is connected to the grinding wheel.

7. The ultrasonic vibration assisted grinding and polishing device according to claim 6, characterized in that: The grinding and polishing unit also includes a plurality of second protrusions formed between the conductive disk and the grinding wheel, the second disk surface is spaced apart from the grinding wheel, the second protrusions are in contact with the second disk surface of the conductive disk and the grinding wheel, and are suitable for transmitting the vibration energy to the grinding wheel, and the amplitude of a portion of the conductive disk adjacent to the second protrusions is greater than the amplitude of a portion adjacent to the first protrusions.

8. The ultrasonic vibration assisted grinding and polishing device according to claim 6, characterized in that: Each of the second bolts defines a distance from the axis along a direction perpendicular to the axis, and the distance is between 80 mm and 100 mm, between 85 mm and 95 mm, between 60 mm and 80 mm, between 80 mm and 120 mm, or between 90 mm and 110 mm. During the process in which the vibration energy is transmitted from the vibration unit to the grinding wheel via the conduction disk, the conduction disk vibrates at a high frequency in a resonance mode, and the resonance mode is a concentric resonance mode.

9. The ultrasonic vibration assisted grinding and polishing device according to claim 4, characterized in that: The grinding and polishing unit also includes a connecting member surrounding the vibration unit and located between the first disk surface of the conductive disk and the rotating shaft, and a plurality of first bolts, wherein the first bolts are distributed around the axis, and each of the first bolts passes through the connecting member along the direction of the axis and abuts against the connecting member and is connected to the rotating shaft.

10. The ultrasonic vibration assisted grinding and polishing device according to claim 1, characterized in that: The power supply unit includes a first induction element installed on the shell unit and used to transmit the electric energy, and a second induction element installed on the rotating shaft and electrically connected to the vibration unit, and the second induction element and the first induction element transmit the electric energy through electromagnetic induction.

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