Refrigeration equipment and control method

Abstract

The invention particularly relates to refrigeration equipment and a control method. The refrigeration equipment comprises a compressor and further comprises a closed compressor bin, and the compressor is arranged in the compressor bin. The refrigeration equipment further comprises a semiconductor refrigeration component and a circulating fan, wherein the semiconductor refrigeration component comprises a refrigeration surface and a heat dissipation surface; at least part of the refrigeration surface is arranged in the press cabin, and at least part of the heat dissipation surface is exposed out of the press cabin; and the circulating fan is arranged in the compressor cabin so as to convey the cooling capacity of the refrigeration surface to the compressor. By arranging the closed press bin, noise of the compressor is effectively prevented from being transmitted to the outer space of the press bin, at least part of the refrigerating face of the semiconductor refrigerating component is arranged in the press bin, and the circulating fan cools the compressor by promoting flowing of cold air of the press bin; the noise reduction device has the advantages of being simple in structure, good in noise reduction effect, high in heat dissipation efficiency, good in user experience, capable of saving energy and reducing emission and mute.

Description

Technical Field

[0001] The present invention relates to the field of refrigeration technology, in particular to refrigeration equipment and a control method. Background Art

[0002] The compressor, as the "heart" of the refrigerator refrigeration system, provides the necessary power for the refrigeration system, but the compressor also generates heat and operating noise when working; the traditional compressor compartment achieves heat dissipation by designing heat dissipation holes, but the compressor noise will be transmitted to the outside through the heat dissipation holes, causing noise pollution.

[0003] Similarly, the traditional silent refrigerator achieves the silent effect by sealing the heat dissipation holes of the compressor compartment and blocking the propagation path of the sound energy. However, the heat dissipation of the sealed compressor compartment is poor and the exhaust temperature is high, resulting in low refrigeration efficiency and increased energy consumption. Therefore, it is necessary to study a refrigeration device and control method to solve the above problems. Summary of the invention

[0004] The present invention aims to provide a refrigeration device with good noise reduction effect and high heat dissipation efficiency.

[0005] In order to achieve the above objectives, an embodiment of the present invention provides a refrigeration device, including a compressor and a closed compressor chamber, wherein the compressor is arranged in the compressor chamber;

[0006] The refrigeration equipment further comprises a semiconductor refrigeration component and a circulation fan, wherein the semiconductor refrigeration component comprises a refrigeration surface and a heat dissipation surface;

[0007] The refrigeration surface is at least partially disposed in the press chamber, and the heat dissipation surface is at least partially exposed outside the press chamber;

[0008] The circulating fan is arranged in the compressor chamber to transport the cold energy of the refrigeration surface to the compressor.

[0009] As a further improvement of an embodiment of the present invention, a fixing hole for fixing the semiconductor refrigeration component is provided on the wall of the press chamber, and the fixing hole is adapted to be arranged with the semiconductor refrigeration component;

[0010] Wherein, the refrigeration surface is arranged toward the inside of the press chamber, and the heat dissipation surface is arranged toward the outside of the press chamber.

[0011] As a further improvement of an embodiment of the present invention, it further includes an air duct partition plate arranged in the press chamber, wherein the air duct partition plate divides the press chamber into a first chamber and a second chamber which are adjacently arranged;

[0012] The compressor and the semiconductor refrigeration component are arranged in the same chamber of the first chamber and the second chamber; or the compressor is arranged in one of the first chamber and the second chamber, and the semiconductor refrigeration component is arranged in the other chamber;

[0013] Wherein, the refrigeration equipment further includes an air outlet and an air return outlet connecting the first chamber and the second chamber.

[0014] As a further improvement of an embodiment of the present invention, one of the first chamber and the second chamber is a receiving chamber, and the other chamber is an air duct chamber;

[0015] Wherein, the semiconductor refrigeration component, the circulating fan, and the compressor are arranged side by side in the accommodating chamber along the direction of air flow.

[0016] As a further improvement of an embodiment of the present invention, it includes a press chamber bottom plate and a press chamber rear cover plate, and the air duct partition plate is spaced apart from the press chamber rear cover plate;

[0017] The circulating fan is arranged between the rear cover plate of the compressor chamber and the air duct plate, and the circulating fan divides the accommodating chamber into a refrigeration chamber accommodating the semiconductor refrigeration component and a compressor chamber accommodating the compressor;

[0018] The side of the air duct plate away from the rear cover plate of the press chamber forms the air duct chamber;

[0019] Wherein, the air outlet and the air return outlet are respectively arranged on two opposite sides of the semiconductor refrigeration component.

[0020] As a further improvement of an embodiment of the present invention, the air duct partition is arranged between the compressor and the semiconductor refrigeration component;

[0021] One of the first chamber and the second chamber is a refrigeration chamber for accommodating the semiconductor refrigeration component, and the other chamber is a compressor chamber for accommodating the compressor;

[0022] The circulating fan is arranged in the refrigeration chamber;

[0023] Wherein, the air outlet and the air return outlet are respectively arranged at the junction of the refrigeration chamber and the compressor chamber.

[0024] As a further improvement of one embodiment of the present invention, it includes a press chamber bottom plate and a press chamber rear cover plate;

[0025] The press chamber bottom plate and the press chamber rear cover plate are respectively provided with a semiconductor refrigeration component.

[0026] As a further improvement of one embodiment of the present invention, it includes a press chamber bottom plate, a press chamber rear cover plate, a press chamber top plate, and a press chamber side plate used to jointly form the press chamber;

[0027] Wherein, the press chamber top plate and the press chamber side plates are respectively provided with sound insulation and heat preservation structures.

[0028] As a further improvement of one embodiment of the present invention, it further includes a condenser, a condenser bin disposed adjacent to the outside of the compressor bin and used to place the condenser, and a condensing fan disposed in the condenser bin;

[0029] Wherein, the condenser compartment has an air inlet and an air outlet which are connected to the inside and the outside respectively.

[0030] As a further improvement of one embodiment of the present invention, it also includes a condenser and a box;

[0031] The condenser is arranged outside the press chamber, and the condenser is arranged on the side or back of the box body or outside the box body.

[0032] In order to solve the above problem, the present invention also provides a control method for refrigeration equipment.

[0033] A control method for a refrigeration device as described above comprises:

[0034] Get the temperature T of the compressor in the compressor compartment away from the circulating fan, and determine whether T satisfies T≥T ON , T ON Defined as the preset temperature value for the compressor chamber to meet the individual cooling requirements;

[0035] When T satisfies T ≥ T ON When the semiconductor refrigeration component is turned on, the working circuit is turned on and the circulating fan is turned on.

[0036] As a further improvement of an embodiment of the present invention, it includes:

[0037] When the working circuit of the semiconductor refrigeration component is in the on state, obtain and judge whether T satisfies T≤T OFF , T OFF Defined as the preset temperature value at which the compressor chamber meets the end of refrigeration, T OFF <T ON ;

[0038] When T satisfies T≤T OFF When the semiconductor refrigeration component is turned off, the working circuit is cut off and the circulating fan is turned off after a preset time t.

[0039] Compared with the prior art, the beneficial effect of the present invention is that the refrigeration equipment and control method provided by the present invention effectively block the noise of the compressor from being transmitted to the external space of the compressor compartment by setting up a closed compressor compartment, thereby playing a role in noise reduction. At the same time, the refrigeration surface of the semiconductor refrigeration component is at least partially arranged in the compressor compartment to absorb the heat generated when the compressor is working. The heat dissipation surface of the semiconductor refrigeration component is used to dissipate heat to the environment outside the compressor compartment. The circulating fan promotes the flow of cold air in the compressor compartment, and delivers the coldness of the refrigeration surface to the compressor in the form of cold air, so as to cool the compressor, taking into account both noise reduction and heat dissipation, which not only ensures the normal operation of the compressor, but also improves the refrigeration efficiency of the refrigeration equipment and improves the user experience. At the same time, it also saves energy and reduces energy consumption. It has the advantages of simple structure, good noise reduction effect, high heat dissipation efficiency, good user experience, energy saving and emission reduction, and quietness. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 This is the first embodiment of the refrigeration device of the present invention;

[0041] Figure 2 The second embodiment of the refrigeration device of the present invention

[0042] Figure 3 A schematic diagram of a structure in which a condenser bin of the refrigeration equipment of the present invention is separately arranged;

[0043] Figure 4 The figure is a flow chart of the control method of the refrigeration equipment of the present invention.

[0044] In the figure: 11. compressor; 12. condenser; 2. circulation fan; 21. volute; 22. impeller; 3. box; 31. compressor compartment; 32. fixing hole; 33. compressor compartment rear cover; 35. compressor compartment side panel; 36. temperature sensor; 40. air duct partition; 41. air outlet; 42. return air outlet; 43. air duct chamber; 44. refrigeration chamber; 45. compressor chamber; 51. condenser compartment; 52. condensing fan; 53. air inlet; 54. exhaust outlet; 6. semiconductor refrigeration component; 61. refrigeration surface; 62. heat dissipation surface. DETAILED DESCRIPTION

[0045] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0046] The terms "including" and "having" and any variations thereof in the present invention are intended to cover non-exclusive inclusions. Reference to "embodiments" herein means that the specific features, structures, or characteristics described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0047] As shown in the figure, the present invention mainly relates to: a refrigeration device, including a compressor 11. The compressor 11 is a driven fluid machine that lifts low-pressure gas to high-pressure gas, and is the heart of the refrigeration system of the refrigeration device. The compressor 11 generates heat and noise when working.

[0048] The refrigeration system also includes a refrigeration circuit formed by a condenser 12, a throttling device, and a refrigeration evaporator. The compressor 11, the condenser 12, the throttling device, and the refrigeration evaporator are sequentially connected to form a circulating refrigeration circuit, and the refrigeration evaporator is used to provide coldness for the storage chamber of the refrigeration equipment.

[0049] Reference Figure 1 As shown, the refrigeration device further includes a closed compressor chamber 31, and the compressor 11 is arranged in the compressor chamber 31. The closed compressor chamber 31 effectively blocks the noise of the compressor 11 from being transmitted to the external space of the compressor chamber 31, thereby playing a role in noise reduction.

[0050] The refrigeration device also includes a semiconductor refrigeration component 6. The semiconductor refrigeration component 6 includes a refrigeration surface 61 and a heat dissipation surface 62. The refrigeration surface 61 is a low temperature area for absorbing heat. The heat dissipation surface 62 is a high temperature area for releasing heat. The semiconductor refrigeration component 6 independently completes the process of refrigeration and heat dissipation.

[0051] The cooling surface 61 is at least partially disposed in the compressor chamber 31. The cooling surface 61 is exposed in the compressor chamber 31. The cooling surface 61 is used to absorb the heat generated by the compressor 11 in the compressor chamber 31 when it is working.

[0052] The heat dissipation surface 62 is at least partially exposed outside the press chamber 31. The heat dissipation surface 62 is in contact with the external environment outside the press chamber 31, and the heat dissipation surface 62 is used to dissipate heat to the environment outside the press chamber 31.

[0053] The refrigeration equipment also includes a circulation fan 2 disposed in the compressor chamber 31 to transport the coldness of the refrigeration surface 61 to the compressor 11. The circulation fan 2 promotes the flow of cold air in the compressor chamber 31, transports the coldness of the refrigeration surface 61 to the compressor 11 in the form of cold air, cools the compressor 11, and dissipates heat for the compressor 11. Considering both noise reduction and heat dissipation, it has the advantages of simple structure, good noise reduction effect, and high heat dissipation efficiency.

[0054] Furthermore, a fixing hole 32 for fixing the semiconductor refrigeration component 6 is provided on the wall of the press chamber 31, and the fixing hole 32 is adapted to the semiconductor refrigeration component 6. The formation and size of the fixing hole 32 are adapted to the contour of the semiconductor refrigeration component 6. The semiconductor refrigeration component 6 is used to replace a part of the wall of the press chamber 31, so as to define the press chamber 31 together with the wall of the other part of the press chamber 31.

[0055] The cooling surface 61 is disposed toward the inside of the compressor chamber 31, and the heat dissipation surface 62 is disposed toward the outside of the compressor chamber 31. The cooling capacity of the cooling surface 61 is fully contacted with the compressor 11 under the promotion of the circulation fan 2.

[0056] Further, the refrigeration device includes a box body 3. The box body 3 includes a press bin bottom plate and a press bin rear cover plate 33. The box body 3 also includes a press bin top plate and a press bin side plate 35. The press bin bottom plate, the press bin rear cover plate 33, the press bin top plate, and the press bin side plate 35 together define a press bin 31.

[0057] The compressor chamber bottom plate and the compressor chamber rear cover plate 33 are respectively provided with a semiconductor refrigeration component 6 to increase the cooling capacity of the compressor chamber 31 and improve the heat dissipation efficiency in the compressor chamber 31.

[0058] Furthermore, the refrigeration device is a refrigerator. The refrigerator comprises a box body 3, and a press chamber 31 is arranged at the rear side of the bottom of the box body 3.

[0059] Furthermore, the refrigeration device also includes an air duct partition 40 disposed in the compressor chamber 31. The air duct partition 40 divides the compressor chamber 31 into a first chamber and a second chamber that are adjacent to each other. The air duct partition 40 is spaced apart from the inner wall of the compressor chamber 31, and one side of the air duct partition 40 forms the first chamber, and the other side of the air duct partition 40 forms the second chamber. In other words, a distance is preset between the air duct partition 40 and the inner wall of the compressor chamber 31. The first chamber and the second chamber are arranged to communicate with each other.

[0060] In one embodiment of the compressor 11 and the semiconductor refrigeration component 6, the compressor 11 and the semiconductor refrigeration component 6 are arranged in the same chamber of the first chamber and the second chamber. Specifically, the compressor 11 and the semiconductor refrigeration component 6 are both arranged in the first chamber, or the compressor 11 and the semiconductor refrigeration component 6 are both arranged in the second chamber.

[0061] Combination Figure 4 As shown, another embodiment of the compressor 11 and the semiconductor refrigeration component 6, the compressor 11 is arranged in one of the first chamber and the second chamber, and the semiconductor refrigeration component 6 is arranged in the other chamber. For example, the compressor 11 is arranged in the first chamber, and the semiconductor refrigeration component 6 is arranged in the second chamber.

[0062] The refrigeration device further includes an air outlet 41 and an air return port 42 connecting the first chamber and the second chamber. Under the action of the circulating fan 2, cold air circulates along the air path from the air outlet 41 to the air return port 42 to cool the compressor 11.

[0063] Preferably, the air outlet 41 and the air return port 42 are arranged on opposite sides of the semiconductor refrigeration component 6. After the cold air contacts the compressor 11, it becomes hot air, contacts the semiconductor refrigeration component 6 fully for heat exchange, and then becomes cold air again.

[0064] Combination Figure 1 As shown, in a first embodiment of the first chamber and the second chamber, one of the first chamber and the second chamber is a receiving chamber, and the other chamber is an air duct chamber 43. The receiving chamber is formed on one side of the air duct partition 40, and the air duct chamber 43 is formed on the other side of the air duct partition 40. The air outlet 41 and the return air outlet 42 communicate with the receiving chamber and the air duct chamber 43.

[0065] The semiconductor refrigeration component 6, the circulating fan 2, and the compressor 11 are arranged side by side in the receiving chamber along the direction of the air flow. The air flow direction is to circulate around the air duct partition 40. In other words, it is to circulate from the air outlet 41 to the return air outlet 42.

[0066] The air duct partition 40 plays the role of guiding the air flow, and at the same time realizes the reasonable layout of the refrigeration space and the heat dissipation space in the compressor chamber 31, realizes the heat dissipation of the closed compressor chamber 11, takes into account both noise reduction and heat dissipation, and has the advantages of simple structure, reasonable heat dissipation air path, good noise reduction effect and high heat dissipation efficiency.

[0067] Specifically, the circulating fan 2 adjusts the direction of the airflow, and the cold air contacts the compressor 11 through the air outlet 41, becomes hot air, and contacts the semiconductor refrigeration component 6 through the air duct chamber 43 and the return air outlet 42 for heat exchange, and then becomes cold air. Alternatively, the cold air contacts the compressor 11 through the air outlet 41 and the air duct chamber 43, becomes hot air, and contacts the semiconductor refrigeration component 6 through the receiving chamber and the return air outlet 42 for heat exchange, and then becomes cold air.

[0068] Further, the refrigeration device includes a compressor chamber bottom plate and a compressor chamber rear cover plate 33. The air duct partition plate 40 is spaced apart from the compressor chamber rear cover plate 33. Preferably, the air duct partition plate 40 is arranged parallel to the compressor chamber rear cover plate 33. The air duct partition plate 40 is extended in the left-right direction.

[0069] The circulating fan 2 is arranged between the rear cover plate 33 of the press chamber and the air duct partition plate 40, and the side of the air duct partition plate 40 close to the rear cover plate 33 of the press chamber is a receiving chamber. Preferably, the circulating fan 2 includes a volute 21 and an impeller 22 arranged in the volute 21. The volute 21 is arranged on the bottom plate of the press chamber, and is fixedly connected to the rear cover plate 33 of the press chamber and the air duct partition plate 40, respectively, so as to improve the stability of the fixing of the volute 21.

[0070] The circulation fan 2 is disposed between the semiconductor refrigeration component 6 and the compressor 11. The circulation fan 2 divides the accommodation chamber into a refrigeration chamber 44 for accommodating the semiconductor refrigeration component 6 and a compressor chamber 45 for accommodating the compressor 11.

[0071] The side of the air duct partition plate 40 facing away from the compressor chamber rear cover plate 33 forms an air duct chamber 43. The air duct chamber 43 is arranged adjacent to the front side of the accommodating chamber.

[0072] The air outlet 41 and the air return port 42 are respectively arranged on opposite sides of the semiconductor refrigeration component 6. Preferably, the side of the semiconductor refrigeration component 6 close to the compressor 11 is set as the air outlet 41, and the side of the semiconductor refrigeration component 6 away from the compressor 11 is set as the air return port 42. The circulation fan 2 is arranged at the air outlet 41. The circulation fan 2 blows the cold energy generated by the semiconductor refrigeration component 6 to the compressor 11 in the form of cold air, so as to cool and dissipate heat for the compressor 11.

[0073] Combination Figure 2 As shown, in the second embodiment of the first chamber and the second chamber, one of the first chamber and the second chamber is a refrigeration chamber 44 for accommodating the semiconductor refrigeration component 6, and the other chamber is a compressor chamber 45 for accommodating the compressor 11. The air duct partition 40 is arranged between the compressor 11 and the semiconductor refrigeration component 6. The circulation fan 2 is arranged in the refrigeration chamber 44.

[0074] In the present embodiment, the refrigeration chamber 44 and the press chamber 45 are disposed adjacent to each other on the left and right.

[0075] The air outlet 41 and the return air outlet 42 are respectively arranged at the junction of the refrigeration chamber 44 and the compressor chamber 45. In this embodiment, the air outlet 41 and the return air outlet 42 are arranged front to back. The air duct partition plate 40 is extended in the front-to-back direction.

[0076] The direction of air flow is to circulate around the air duct partition 40. The air duct partition 40 plays the effect of guiding the air flow. At the same time, a reasonable layout of the refrigeration chamber 44 and the compressor chamber 45 in the compressor chamber 31 is realized, and the heat dissipation of the closed compressor chamber 11 is realized. It takes both noise reduction and heat dissipation into consideration, and has the advantages of simple structure, reasonable heat dissipation air path, good noise reduction effect and high heat dissipation efficiency.

[0077] Furthermore, the press chamber 31 is soundproof. Specifically, the refrigeration device includes a box body 3. The box body 3 includes a press chamber bottom plate, a press chamber rear cover plate 33, a press chamber top plate, and a press chamber side plate 35, which are used to form the press chamber 31 together.

[0078] The press chamber top plate and the press chamber side plate 35 are respectively provided with a sound insulation structure, which is a foam layer or other sound insulation structure.

[0079] By respectively providing the press chamber top plate and the press chamber side plate 35 with sound insulation and heat preservation structures, the noise of the compressor 11 is further blocked from being transmitted to the external space of the press chamber 31, thereby playing a role in noise reduction, having the advantage of ultra-quietness, and improving the user experience.

[0080] There are two implementation methods for arranging the condenser 12 outside the compressor 11:

[0081] Combination Figure 3 As shown, in the first embodiment, a separate condenser bin 51 is provided. The refrigeration device further comprises a condenser bin 51 adjacent to the outside of the compressor bin 31 and used to place the condenser 12 , and a condensing fan 52 provided in the condenser bin 51 .

[0082] The condenser compartment 51 has an air inlet 53 and an air outlet 54 which are connected to the inside and the outside respectively. The condenser compartment 51 is connected to the environment outside the refrigeration device.

[0083] A heat dissipation air path is formed between the air inlet 53 and the air outlet 54 by the condensing fan 52. This has the advantage of high heat dissipation efficiency. By separating the compressor compartment 31 from the condenser compartment 51, the heat dissipation effect of the condenser 12 is not affected while ensuring the noise reduction and heat dissipation of the compressor 11.

[0084] In the second embodiment, the condenser 12 is provided with a natural convection heat dissipation structure. The refrigeration device includes a box body 3 .

[0085] The condenser 12 is disposed outside the press chamber 31 . The condenser 12 is disposed on the side or back of the box body 3 or outside the box body 3 .

[0086] Combination Figure 4 As shown, in order to solve the above problems, the present invention also provides a control method for refrigeration equipment.

[0087] A control method for a refrigeration device as described above comprises:

[0088] Obtain the temperature T of the compressor 11 in the compressor chamber 31 away from the circulating fan 2, and determine whether T satisfies T≥T ON , T ON It is defined as the preset temperature value that the compressor chamber 31 meets for individual refrigeration;

[0089] When T satisfies T ≥ T ON When the semiconductor refrigeration component 6 is turned on, the working circuit is turned on and the circulating fan 2 is turned on.

[0090] When the working circuit of the semiconductor refrigeration component 6 is turned on, the semiconductor refrigeration component 6 starts to work, and the refrigeration surface 61 starts to absorb the heat generated by the compressor 11 in the compressor chamber 31 when it works.

[0091] Specifically, according to the inventor's experience, T ON Not exceeding 90℃, the value is determined according to actual needs. When T satisfies T≥T ON When the compressor 11 is not cooled and heat-dissipated, the high temperature environment of the compressor chamber 31 will affect the normal refrigeration work of the compressor 11. Therefore, the working circuit of the semiconductor refrigeration component 6 needs to be connected, and the semiconductor refrigeration component 6 provides cold air for the compressor chamber 31. The circulating fan 2 cools the compressor 11 by promoting the flow of cold air in the compressor chamber 31, thereby dissipating heat for the compressor 11. It has the advantages of easy implementation, good noise reduction effect, high heat dissipation efficiency, good user experience, energy saving and emission reduction, and quietness.

[0092] Preferably, a temperature sensor for acquiring the temperature T is provided on the side of the compressor 11 in the internal compressor compartment 31 away from the circulation fan 2 .

[0093] Furthermore, the control method includes,

[0094] When the working circuit of the semiconductor refrigeration component 6 is in the on state, it is determined whether T satisfies T≤T OFF , T OFF It is defined as the preset temperature value at which the compressor chamber 31 meets the end of refrigeration, T OFF <T ON ;

[0095] When T satisfies T≤T OFF When the semiconductor refrigeration component 6 is turned off, the working circuit is cut off and the circulating fan 2 is turned off after a preset time t.

[0096] Specifically, during the delayed shutdown of the circulating fan 2, the compressor chamber 31 continues to be cooled by the residual cooling on the cooling surface 61 of the semiconductor refrigeration component 6. OFFWhen the semiconductor refrigeration component 6 is turned off, the working circuit is cut off, thereby saving energy.

[0097] Compared with the prior art, the refrigeration equipment and control method provided by the present invention effectively block the noise of the compressor 11 from being transmitted to the external space of the compressor chamber 31 by setting a closed compressor chamber 31, thereby playing a role in noise reduction. At the same time, the refrigeration surface 61 of the semiconductor refrigeration component 6 is at least partially arranged in the compressor chamber 31 to absorb the heat generated by the compressor 11 when it is working. The heat dissipation surface 62 of the semiconductor refrigeration component 6 is used to dissipate heat to the environment outside the compressor chamber 31. The circulating fan 2 promotes the flow of cold air in the compressor chamber 31, and delivers the coldness of the refrigeration surface 61 to the compressor 11 in the form of cold air, so as to cool the compressor 11, taking into account both noise reduction and heat dissipation, which not only ensures the normal operation of the compressor 11, but also improves the refrigeration efficiency of the refrigeration equipment and improves the user experience, while also saving energy and reducing energy consumption. It has the advantages of simple structure, good noise reduction effect, high heat dissipation efficiency, good user experience, energy saving and emission reduction, and quietness.

[0098] In the description of this specification, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance unless otherwise clearly specified and limited; the terms "installed", "connected", "connected" and the like should be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0099] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail through the above preferred embodiments, those skilled in the art should understand that various changes can be made in form and details without departing from the scope defined by the claims of the present invention.

Claims

1. A refrigeration device, comprising a compressor, characterized in that: It also includes a closed press chamber, in which the compressor is arranged; The refrigeration equipment further comprises a semiconductor refrigeration component and a circulation fan, wherein the semiconductor refrigeration component comprises a refrigeration surface and a heat dissipation surface; The refrigeration surface is at least partially disposed in the press chamber, and the heat dissipation surface is at least partially exposed outside the press chamber; The circulating fan is arranged in the compressor chamber to transport the cold energy of the refrigeration surface to the compressor.

2. The refrigeration equipment according to claim 1, characterized in that: A fixing hole for fixing the semiconductor refrigeration component is provided on the wall of the press chamber, and the fixing hole is adapted to the semiconductor refrigeration component; Wherein, the refrigeration surface is arranged toward the inside of the press chamber, and the heat dissipation surface is arranged toward the outside of the press chamber.

3. The refrigeration device according to claim 1, characterized in that: It also includes an air duct partition plate disposed in the press chamber, wherein the air duct partition plate divides the press chamber into a first chamber and a second chamber that are adjacently disposed; The compressor and the semiconductor refrigeration component are arranged in the same chamber of the first chamber and the second chamber; or the compressor is arranged in one of the first chamber and the second chamber, and the semiconductor refrigeration component is arranged in the other chamber; Wherein, the refrigeration equipment further includes an air outlet and an air return outlet connecting the first chamber and the second chamber.

4. The refrigeration device according to claim 3, characterized in that: One of the first chamber and the second chamber is a receiving chamber, and the other chamber is an air duct chamber; Wherein, the semiconductor refrigeration component, the circulating fan, and the compressor are arranged side by side in the accommodating chamber along the direction of air flow.

5. The refrigeration device according to claim 4, characterized in that: It includes a press chamber bottom plate and a press chamber rear cover plate, and the air duct partition plate is spaced apart from the press chamber rear cover plate; The circulating fan is arranged between the rear cover plate of the compressor chamber and the air duct plate, and the circulating fan divides the accommodating chamber into a refrigeration chamber accommodating the semiconductor refrigeration component and a compressor chamber accommodating the compressor; The side of the air duct plate away from the rear cover plate of the press chamber forms the air duct chamber; Wherein, the air outlet and the air return outlet are respectively arranged on two opposite sides of the semiconductor refrigeration component.

6. The refrigeration device according to claim 3, characterized in that: The air duct partition is arranged between the compressor and the semiconductor refrigeration component; One of the first chamber and the second chamber is a refrigeration chamber for accommodating the semiconductor refrigeration component, and the other chamber is a compressor chamber for accommodating the compressor; The circulating fan is arranged in the refrigeration chamber; Wherein, the air outlet and the air return outlet are respectively arranged at the junction of the refrigeration chamber and the compressor chamber.

7. The refrigeration device according to claim 2, characterized in that: Including press chamber bottom plate and press chamber rear cover plate; The press chamber bottom plate and the press chamber rear cover plate are respectively provided with a semiconductor refrigeration component.

8. The refrigeration device according to claim 1, characterized in that: It includes a press chamber bottom plate, a press chamber rear cover plate, a press chamber top plate, and a press chamber side plate which are used to form the press chamber; Wherein, the press chamber top plate and the press chamber side plates are respectively provided with sound insulation and heat preservation structures.

9. The refrigeration device according to claim 1, characterized in that: It also includes a condenser, a condenser bin disposed adjacent to the outside of the compressor bin and used to place the condenser, and a condensing fan disposed in the condenser bin; Wherein, the condenser compartment has an air inlet and an air outlet which are connected to the inside and the outside respectively.

10. The refrigeration device according to claim 1, characterized in that: It also includes a condenser and a cabinet; The condenser is arranged outside the press chamber, and the condenser is arranged on the side or back of the box body or outside the box body.

11. A control method for a refrigeration device according to any one of claims 1 to 10, characterized in that: include, Get the temperature T of the compressor in the compressor compartment away from the circulating fan, and determine whether T satisfies T≥T ON , T ON Defined as the preset temperature value for the compressor chamber to meet the requirements of separate cooling; When T satisfies T ≥ T ON When the semiconductor refrigeration component is turned on, the working circuit is turned on and the circulating fan is turned on.

12. The control method according to claim 11, characterized in that: include, When the working circuit of the semiconductor refrigeration component is in the on state, obtain and judge whether T satisfies T≤T OFF , T OFF Defined as the preset temperature value at which the compressor chamber meets the end of refrigeration, T OFF <T ON ; When T satisfies T≤T OFF When the semiconductor refrigeration component is turned off, the working circuit is cut off and the circulating fan is turned off after a preset time t.

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