Chip sample condensation prevention structure of high-voltage accelerated aging test box
By designing a combined structure of the copper refrigeration end device and heater in the high-pressure accelerated aging test chamber, the condensation problem of the test chamber during the test chamber is solved, ensuring the temperature uniformity of the chip sample and the accuracy of the test results.
Patent Information
- Application Number
- CN202510046726.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-13
- Publication Date
- 2025-04-22
AI Technical Summary
The high-pressure accelerated aging test chamber is prone to condensation problems during the test process, especially when the size, shape, material and quantity of the sample are different, resulting in uneven temperature during the heating process, and the absolute humidity in the local area exceeds the critical value, resulting in condensation, which seriously affects the test results of the chip sample.
A high-pressure accelerated aging test chamber anti-chip sample condensation structure is designed, using a combination of a copper refrigeration end device and a heater. The cold end structure makes the cold end heat up later than the sample when the temperature rises and cools down earlier than the sample, thereby avoiding the sample condensation. Meanwhile, the copper refrigeration end device is fixed to the cavity by a Teflon fixing member to achieve heat insulation from the cavity and grind the front of the cold end to promote condensation.
It effectively avoids the influence of the equipment on chip samples during the heating, cooling and humidification process, and ensures the temperature uniformity of the sample during the test process and the accuracy of the test results.
Smart Images
Figure CN119861278A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of aging test chambers, in particular to a high-voltage accelerated aging test chamber anti-condensation structure for chip samples. Background Art
[0002] High-voltage accelerated aging test chambers are prone to condensation during the test process, which has always been a major problem that plagues the industry. The root cause is that the humidity changes during the humidification process of the equipment are unstable, causing the local absolute humidity to exceed the critical value and produce condensation. Although we can perfectly solve the condensation problem in no-load tests, in the actual test process, we put in different samples in each test, such as size, shape, material, quantity, etc., which will cause the samples to heat slowly or unevenly during the heating process, resulting in the absolute humidity of the local area exceeding the critical value and condensation. During the test, condensation is the most unacceptable for chip samples. Summary of the invention
[0003] 1. Technical issues to be resolved
[0004] In view of the deficiencies in the prior art, the present invention provides a high-voltage accelerated aging test chamber chip sample condensation protection structure, which has the advantage of being able to effectively avoid the influence of condensation on the sample during the heating and humidification process of the equipment, and solves the problems raised in the background technology.
[0005] (II) Technical solution
[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a high-voltage accelerated aging test box chip sample condensation prevention structure, comprising a frame and a device shell, the device shell is arranged on the inner side of the frame, one side of the device shell is an opening, the outer side of the opening is abutted against a cover plate, the cover plate is fixedly connected to the device shell through a locking fastener, a sample holder is arranged inside the device shell, a chip sample is placed on the upper surface of the sample holder, a copper refrigeration end device is arranged on the lower side of the sample holder, one end of the copper refrigeration end device extends to the outside of the device shell, a heater is arranged inside the device shell and located at the lower side of the copper refrigeration end device, a heat-conducting cylinder is arranged on the upper side of the heater, a rotating frame is arranged on one side of the frame, a connecting mechanism is arranged between the cover plate and the rotating frame, connecting blocks are fixedly arranged at both ends of the rotating frame away from the cover plate, a vertical rod is fixedly sleeved between the two connecting blocks, both ends of the vertical rod are rotatably connected with side plates, one side of the side plate is fixedly connected to the outer wall of the frame, and a limiting mechanism for limiting the rotation of the vertical rod is arranged on one side of the lower end of the frame.
[0007] Preferably, the connecting mechanism includes a double-headed screw and a nut, the two double-headed screws are fixedly sleeved on both sides of the interior of the cover plate, the first U-shaped plate is fixedly set on both sides of the upper end of the sample holder, the second U-shaped plate is fixedly set on both sides of the interior of the rotating frame, through holes are opened in the middle of the first U-shaped plate and the second U-shaped plate, both ends of the double-headed screw pass through the corresponding through holes, and the multiple nuts are respectively abutted on both sides of the corresponding first U-shaped plate and the second U-shaped plate, and the multiple nuts are threadedly sleeved with one end of the corresponding double-headed screw.
[0008] Preferably, the limiting mechanism includes a first gear and a second gear, the first gear is fixedly sleeved on the lower end of the vertical rod, the second gear is meshingly arranged on one side of the first gear, a horizontal plate is fixedly arranged on the outer wall of the frame and located at the lower side of the second gear, a screw rod is sleeved on the internal thread of the horizontal plate, the upper end of the screw rod is rotatably connected to the second gear, sliding rods are arranged on both sides of the screw rod, two sliding holes are opened on the surface of the horizontal plate, the lower ends of the two sliding rods pass through the corresponding sliding holes, and the upper ends of the two sliding rods are fixedly connected to the second gear.
[0009] Preferably, a rotating wheel is fixedly sleeved on the lower end of the screw rod.
[0010] Preferably, the connection parts between the heater and the copper refrigeration end device and the device housing are all provided with sealing components.
[0011] Preferably, a heat dissipation fan is fixedly installed on an inner wall of one side of the rack at a position corresponding to the copper refrigeration end device.
[0012] Preferably, a sealing gasket is provided on the side close to the cover plate and the device housing.
[0013] Preferably, the copper refrigeration end device is fixed to the cavity via a Teflon fixing piece.
[0014] (III) Beneficial effects
[0015] Compared with the prior art, the present invention provides a high-voltage accelerated aging test chamber to prevent chip sample condensation structure, which has the following beneficial effects:
[0016] 1. The anti-condensation structure of the chip sample in the high-voltage accelerated aging test chamber uses the cold end structure to ensure that in the same test space, the cold end heats up later than the sample and cools down earlier than the sample. This ensures that during the test heating and cooling process, the sample temperature is higher than the cold end. Even if a small amount of condensation occasionally occurs during the heating and cooling process, the cold end will condense before the sample, thereby achieving the purpose of avoiding sample condensation.
[0017] 2. The anti-condensation structure of the chip sample in the high-voltage accelerated aging test chamber is fixed to the cavity by a copper cooling end device using Teflon fixings to achieve heat insulation from the cavity. Part of the cold end is inside the cavity and part is outside the cavity. The inner part is bent and placed under the sample holder, between the sample and the heat conducting tube. The front part of the cold end is roughened with 1000-grit sandpaper to facilitate condensation. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 A schematic diagram of the anti-condensation structure of chip samples in the high-voltage accelerated aging test chamber proposed by the present invention;
[0019] Figure 2 for Figure 1 A magnified view of the structure of part A;
[0020] Figure 3 for Figure 1 A magnified view of the structure of part B;
[0021] Figure 4 for Figure 2 Schematic diagram of the top view of the first gear and the second gear.
[0022] In the figure: 1. rack; 2. cooling fan; 3. device housing; 4. cover plate; 5. locking fastener; 6. sample holder; 7. chip sample; 8. cold end device; 9. heater; 10. heat conducting tube; 11. rotating frame; 12. connecting block; 13. vertical rod; 14. side plate; 15. first gear; 16. second gear; 17. horizontal plate; 18. screw rod; 19. sliding rod; 20. double-headed screw; 21. nut; 22. first U-shaped plate; 23. second U-shaped plate. DETAILED DESCRIPTION
[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0024] See also Figure 1-4, a high-pressure accelerated aging test chamber anti-condensation structure for chip samples, 1. It includes a frame 1 and a device shell 3, the device shell 3 is arranged on the inner side of the frame 1, one side of the device shell 3 is an opening, and a cover plate 4 is arranged against the outer side of the opening, and the cover plate 4 is fixedly connected to the device shell 3 through a locking fastener 5, and a sealing gasket is arranged on the side close to the cover plate 4 and the device shell 3 to improve the sealing between the cover plate 4 and the device shell 3, and a sample holder 6 is arranged inside the device shell 3, and a chip sample 7 is placed on the upper surface of the sample holder 6, and a copper refrigeration end device 8 is arranged on the lower side of the sample holder 6, and a scattering is fixedly installed on the inner wall of one side of the frame 1 and at a position corresponding to the copper refrigeration end device 8. A hot fan 2 is provided to improve the cooling efficiency of the cold end. One end of the copper cold end device 8 extends to the outside of the device shell 3. A heater 9 is provided inside the device shell 3 and located at the lower side of the copper cold end device 8. A heat conductive tube 10 is provided on the upper side of the heater 9. A sealing component is provided at the connection between the heater 9 and the copper cold end device 8 and the device shell 3 to improve the sealing between the heater 9 and the copper cold end device 8 and the device shell 3. A rotating frame 11 is provided on one side of the interior of the frame 1. Connecting blocks 12 are fixedly provided at both ends of the side of the rotating frame 11 away from the cover plate 4. A vertical rod 13 is fixedly sleeved between the two connecting blocks 12. Both ends of the vertical rod 13 are rotatably connected to side plates 14.
[0025] See also Figure 1-4 A connecting mechanism is provided between the cover plate 4 and the rotating frame 11, and the connecting mechanism includes a double-headed screw 20 and a nut 21. The two double-headed screws 20 are fixedly sleeved on both sides of the inner part of the cover plate 4. The first U-shaped plate 22 is fixedly provided on both sides of the upper end of the sample holder 6, and the second U-shaped plate 23 is fixedly provided on both sides of the inner part of the rotating frame 11. Through holes are provided in the middle parts of the first U-shaped plate 22 and the second U-shaped plate 23, and both ends of the double-headed screw 20 pass through the corresponding through holes. A plurality of nuts 21 are respectively abutted against each other on both sides of the corresponding first U-shaped plate 22 and the second U-shaped plate 23, and the plurality of nuts 21 are threadedly sleeved with one end of the corresponding double-headed screw 20.
[0026] See also Figure 1-4One side of the side plate 14 is fixedly connected to the outer wall of the frame 1, and a limiting mechanism for limiting the rotation of the vertical rod 13 is provided on one side of the lower end of the frame 1. The limiting mechanism includes a first gear 15 and a second gear 16. The first gear 15 is fixedly sleeved on the lower end of the vertical rod 13, and the second gear 16 is meshed and arranged on one side of the first gear 15. A horizontal plate 17 is fixedly arranged on the outer wall of the frame 1 and located at the lower side of the second gear 16. A screw rod 18 is provided on the internal thread sleeve of the horizontal plate 17. The upper end of the screw rod 18 is rotatably connected to the second gear 16, and the two ends of the screw rod 18 are A slide bar 19 is provided on both sides, and two slide holes are provided on the surface of the horizontal plate 17. The lower ends of the two slide bars 19 pass through the corresponding slide holes, and the upper ends of the two slide bars 19 are fixedly connected to the second gear 16. The lower end of the screw rod 18 is fixedly sleeved with a rotating wheel to facilitate the rotation of the screw rod 18. By rotating the screw rod 18, the second gear 16 moves longitudinally, that is, the second gear 16 is separated from the first gear 15, that is, the limit on the vertical rod 13 can be released, that is, the vertical rod 13 can be rotated, and the device housing 3 can be rotated out of the frame 1, so as to facilitate the maintenance of the equipment.
[0027] See also Figure 1-4 The copper cold end device 8 is fixed to the cavity through a Teflon fixing to achieve thermal insulation with the cavity. A part of the cold end is inside the cavity and a part is outside the cavity. The inner part is bent and placed under the sample holder 6, between the sample and the heat conducting tube 10. The front part of the cold end is roughened with 1000-grit sandpaper to facilitate condensation.
[0028] In summary, the high-voltage accelerated aging test chamber has a condensation-proof structure for chip samples. When in use, during the test heating process, the chip sample 7 and the copper refrigeration end device 8 are heated by heat radiation at the same time. Since one end of the copper refrigeration end device 8 is outside, affected by the room temperature, the temperature rise of the copper refrigeration end device 8 continues to be slower than that of the chip sample 7. At this time, if condensation occurs, the copper refrigeration end device 8 will condense first. When the temperature is constant, the copper refrigeration end device 8 is located close to the heat conducting tube 10, and the temperature is basically the same as that of the chip sample 7. When the test is cooled, since the outside of the copper refrigeration end device 8 is between the cooling fan 2 and the cavity, when the cooling fan 2 is started, the copper refrigeration end device 8 will cool down before the cavity and the chip sample 7. If a small amount of condensation occurs, it will only condense on the copper refrigeration end device 8. This effectively avoids the influence of condensation on the chip sample 7 during the heating and humidification process of the equipment.
[0029] It should be noted that the term "comprises" or any other variation thereof is intended to cover non-exclusive inclusion, so that a process, method, article, or device that includes a series of elements includes not only those elements, but also includes other elements that are not explicitly listed, or also includes elements inherent to such process, method, article, or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article, or device that includes the element.
[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A high-voltage accelerated aging test chamber for preventing chip sample condensation, comprising a frame (1) and a device housing (3), characterized in that: The device housing (3) is arranged on the inner side of the frame (1); one side of the device housing (3) is provided with an opening; a cover plate (4) is arranged against the outer side of the opening; the cover plate (4) is fixedly connected to the device housing (3) via a locking fastener (5); a sample holder (6) is arranged inside the device housing (3); a chip sample (7) is placed on the upper surface of the sample holder (6); a copper refrigeration end device (8) is arranged on the lower side of the sample holder (6); one end of the copper refrigeration end device (8) extends to the outside of the device housing (3); and a A heater (9), wherein a heat-conducting tube (10) is arranged on the upper side of the heater (9), a rotating frame (11) is arranged on one side inside the frame (1), a connecting mechanism is arranged between the cover plate (4) and the rotating frame (11), connecting blocks (12) are fixedly arranged at both ends of the rotating frame (11) on a side away from the cover plate (4), a vertical rod (13) is fixedly sleeved between the two connecting blocks (12), both ends of the vertical rod (13) are rotatably connected to side plates (14), one side of the side plate (14) is fixedly connected to the outer wall of the frame (1), and a limiting mechanism for limiting the rotation of the vertical rod (13) is arranged on one side of the lower end of the frame (1).
2. The high-voltage accelerated aging test chamber anti-condensation structure for chip samples according to claim 1, characterized in that: The connection mechanism comprises a double-headed screw (20) and a nut (21); the two double-headed screws (20) are fixedly sleeved on both sides of the interior of the cover plate (4); a first U-shaped plate (22) is fixedly arranged on both sides of the upper end of the sample holder (6); a second U-shaped plate (23) is fixedly arranged on both sides of the interior of the rotating frame (11); through holes are opened in the middle of the first U-shaped plate (22) and the second U-shaped plate (23); both ends of the double-headed screw (20) pass through the corresponding through holes; a plurality of nuts (21) are respectively abutted against each other on both sides of the corresponding first U-shaped plate (22) and the second U-shaped plate (23); and the plurality of nuts (21) are threadedly sleeved on one end of the corresponding double-headed screw (20).
3. The high-voltage accelerated aging test chamber anti-condensation structure for chip samples according to claim 1, characterized in that: The limiting mechanism comprises a first gear (15) and a second gear (16), wherein the first gear (15) is fixedly sleeved on the lower end of the vertical rod (13), and the second gear (16) is meshedly arranged on one side of the first gear (15). A transverse plate (17) is fixedly arranged on the outer wall of the frame (1) and located at the lower side of the second gear (16). A screw rod (18) is sleeved on the internal thread of the transverse plate (17), and the upper end of the screw rod (18) is rotatably connected to the second gear (16). Slide rods (19) are arranged on both sides of the screw rod (18), and two slide holes are provided on the surface of the transverse plate (17). The lower ends of the two slide rods (19) pass through the corresponding slide holes, and the upper ends of the two slide rods (19) are fixedly connected to the second gear (16).
4. The high-voltage accelerated aging test chamber anti-condensation structure for chip samples according to claim 3, characterized in that: The lower end of the screw rod (18) is fixedly sleeved with a rotating wheel.
5. The high-voltage accelerated aging test chamber anti-condensation structure for chip samples according to claim 1, characterized in that: The connection parts between the heater (9) and the copper refrigeration end device (8) and the device housing (3) are all provided with sealing components.
6. The high-voltage accelerated aging test chamber chip sample condensation prevention structure according to claim 1, characterized in that: A heat dissipation fan (2) is fixedly mounted on an inner wall of one side of the frame (1) at a position corresponding to the copper refrigeration end device (8).
7. The high-voltage accelerated aging test chamber chip sample condensation prevention structure according to claim 1, characterized in that: The cover plate (4) and the device housing (3) are both provided with sealing gaskets on the sides close to each other.
8. The high-voltage accelerated aging test chamber chip sample condensation prevention structure according to claim 1, characterized in that: The copper refrigeration end device (8) is fixed to the cavity via a Teflon fixing piece.