Material matching processing method, electronic equipment and storage medium

Abstract

The invention provides a material matching processing method, electronic equipment and a storage medium. The method comprises the following steps: generating a required processing block structure corresponding to a material preparation requirement; combining and grouping the plurality of material preparation demands to obtain a candidate material preparation demand group set; any candidate material preparation demand group in the candidate material preparation demand group set comprises at least two material preparation demands; according to a set combination rule, combining demand processing block structures corresponding to material preparation demands in the candidate material preparation demand group to obtain one or more candidate processing block structures corresponding to the candidate material preparation demand group, and constructing a candidate processing block structure set; with the purpose that the candidate machining block structures do not exceed the appearance size of the target remaining metal blank, the target machining block structures are screened out of the candidate machining block structure set; and carrying out warehouse-out processing on the target residual metal blank according to the candidate material preparation demand group corresponding to the target processing block structure. By means of the method, the target remaining metal blank can be effectively utilized, and therefore the utilization rate of the remaining materials can be increased.

Description

Technical Field

[0001] The present application belongs to the technical field of material storage and processing, and relates to a material matching and processing method, an electronic device and a storage medium. Background Art

[0002] In the metal processing process of the manufacturing industry, it is usually necessary to perform CNC processing such as cutting and shaping on the raw metal materials according to the processing requirements. The warehouse needs to repeatedly carry out and put in the raw metal materials and the remaining metal materials according to production needs.

[0003] How to improve the storage efficiency of gold processing materials is a technical problem that needs to be solved urgently. Summary of the invention

[0004] In view of the above, it is necessary to provide a material matching processing method, electronic equipment and storage medium to improve the storage efficiency of gold processing materials.

[0005] On the one hand, the present application provides a material matching processing method, the method comprising: obtaining multiple material preparation requirements, and generating demand processing block structures corresponding to the material preparation requirements, combining and grouping the multiple material preparation requirements to obtain a candidate material preparation requirement group set; wherein, any candidate material preparation requirement group in the candidate material preparation requirement group set contains at least two of the material preparation requirements, and according to the set combination rules, the demand processing block structures corresponding to the material preparation requirements in the candidate material preparation requirement group are combined to obtain one or more candidate processing block structures corresponding to the candidate material preparation requirement group, and a candidate processing block structure set is constructed, with the purpose of the candidate processing block structure not exceeding the appearance size of the target remaining metal blank, a target processing block structure is screened out from the candidate processing block structure set; wherein, the target remaining metal blank is a selected metal blank that has undergone at least one cutting process, and according to the candidate material preparation requirement group corresponding to the target processing block structure, the target remaining metal blank is subjected to outbound processing.

[0006] In some embodiments of the present application, the step of generating a required processing block structure corresponding to the material preparation demand includes: if the material preparation demand is a processing demand for a square material, then according to the size data of the square material and the processing allowance required for processing the square material, a rectangular structure corresponding to the square material is fitted, and the rectangular structure corresponding to the square material is used as the required processing block structure corresponding to the material preparation demand; if the material preparation demand is a processing demand for a round material, then according to the size data of the round material and the processing allowance required for processing the round material, a rectangular structure corresponding to the round material is fitted, and the rectangular structure corresponding to the round material is used as the required processing block structure corresponding to the material preparation demand.

[0007] In some embodiments of the present application, the step of combining the required processing block structures corresponding to the material preparation requirements in the candidate material preparation requirement group according to the set combination rules to obtain one or more candidate processing block structures corresponding to the candidate material preparation requirement group, and constructing a set of candidate processing block structures includes: using one or more set processing directions contained in the combination rules as the combined flipping degrees of freedom of the required processing block structures, flipping and combining the required processing block structures corresponding to the material preparation requirements in the candidate material preparation requirement group, obtaining the candidate processing block structures corresponding to each of the candidate material preparation requirement groups, and constructing the set of candidate processing block structures, wherein the combination rules also include a rule that at least two of the required processing block structures in the candidate processing block structures are in contact and connected.

[0008] In some embodiments of the present application, the step of screening out a target processing block structure from the set of candidate processing block structures with the purpose of ensuring that the candidate processing block structure does not exceed the appearance dimensions of the target remaining metal blank comprises: determining whether the appearance dimensions of the candidate processing block structures in the set of candidate processing block structures are within the appearance dimension range of the target remaining metal blank, and if so, taking the candidate processing block structure within the appearance dimension range of the target remaining metal blank as the target processing block structure.

[0009] In some embodiments of the present application, before determining whether the appearance size of the candidate processing block structure in the candidate processing block structure set is within the appearance size range of the target remaining metal blank, the method further includes: determining whether the maximum appearance size of the candidate processing block structure in the candidate processing block structure set in a set direction is greater than the appearance size of the target remaining metal blank in the set direction; if so, removing the candidate processing block structure whose maximum appearance size in the set direction is greater than the appearance size of the target remaining metal blank in the set direction from the candidate processing block structure set, and updating the candidate processing block structure set.

[0010] In some embodiments of the present application, before taking the candidate processing block structure whose appearance dimensions are within the appearance dimension range of the target remaining metal blank as the target processing block structure, the method also includes: determining whether the number of the candidate processing block structures whose appearance dimensions are within the appearance dimension range of the target remaining metal blank is greater than 1, and if so, taking the candidate processing block structures whose appearance dimensions are within the appearance dimension range of the target remaining metal blank as a first screening set, and taking the candidate processing block structure in the first screening set that contains the largest number of material preparation requirements as the target processing block structure.

[0011] In some embodiments of the present application, before taking the candidate processing block structure with the largest number of material preparation requirements in the first screening set as the target processing block structure, the method also includes: determining whether the number of the candidate processing block structures with the largest number of material preparation requirements in the first screening set is greater than 1, and if so, taking the candidate processing block structures with the largest number of material preparation requirements in the first screening set as the second screening set, obtaining the target remaining metal blank volume after processing corresponding to each candidate processing block structure in the second screening set, and taking the candidate processing block structure with the largest target remaining metal blank volume after processing in the second screening set as the target processing block structure.

[0012] In some embodiments of the present application, before taking the candidate processing block structure with the largest volume after processing the target remaining metal blank in the second screening set as the target processing block structure, the method also includes: determining whether the number of the candidate processing block structures with the largest volume after processing the target remaining metal blank in the second screening set is greater than 1, and if so, taking the candidate processing block structure with the largest volume after processing the target remaining metal blank in the second screening set as the third screening set, obtaining the maximum rectangular volume percentage of each candidate processing block structure in the third screening set, and taking the candidate processing block structure with the largest maximum rectangular volume percentage in the third screening set as the target processing block structure.

[0013] On the other hand, the present application provides an electronic device, comprising: a memory storing at least one instruction; and a processor executing the at least one instruction to implement the material matching processing method.

[0014] On the other hand, the present application provides a computer-readable storage medium, wherein at least one instruction is stored in the computer-readable storage medium, and when the at least one instruction is executed by a processor in an electronic device, the material matching processing method is implemented. In the material matching processing method of the embodiment of the present application, the demand processing block structure can reflect the morphological data and size data and other characteristics of the material required by the corresponding material preparation demand. By flexibly combining and grouping the material preparation demand, it is convenient to combine the corresponding demand processing block structure below. According to the set combination rule, the demand processing block structure in the candidate material preparation demand group is combined to obtain a candidate processing block structure with a larger size and diversified posture. Since the posture of the candidate processing block structure is diverse, the candidate processing block structure is screened out from the candidate processing block structure set based on the appearance size of the target residual metal blank that the candidate processing block structure does not exceed the target residual metal blank as the screening standard, which can ensure the screening success rate of the target processing block structure and make the target processing block match the morphological data and size data and other characteristics of the target residual metal blank. Since the size of the candidate processing block structure obtained by the combination is larger than that of the demand processing block structure, it can not only maximize the use of the target residual metal blank, but also reduce the number of matches between the candidate processing block structure and the target residual metal blank, thereby improving the matching efficiency. The target remaining metal billets are processed out of the warehouse according to the candidate demand preparation group corresponding to the target processing block structure, which can effectively utilize the target remaining metal billets and reduce resource waste, thereby improving the utilization rate of remaining materials and ultimately improving the storage efficiency of metal processing materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a flow chart of a material matching processing method provided in one embodiment of the present application.

[0016] Figure 2 It is a flowchart of a method for streamlining a candidate processing block structure set provided in one embodiment of the present application.

[0017] Figure 3 It is a flow chart of a method for screening a target processing block structure provided in one embodiment of the present application.

[0018] Figure 4 It is a flow chart of a method for screening a target processing block structure provided in another embodiment of the present application.

[0019] Figure 5 This is a flow chart of a method for screening a target processing block structure provided in yet another embodiment of the present application.

[0020] Figure 6 It is a structural diagram of an electronic device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0021] It should be noted that in this application, "at least one" means one or more, and "more than one" means two or more than two. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone, where A and B can be singular or plural. The terms "first", "second", "third", "fourth", etc. (if any) in the specification, claims and drawings of this application are used to distinguish similar objects, rather than to describe a specific order or sequence.

[0022] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a concrete way. The following embodiments and features in the embodiments may be combined with each other without conflict.

[0023] The embodiment of the present application provides a material matching processing method, which can effectively utilize the target remaining metal billets and reduce resource waste, thereby improving the utilization rate of the remaining materials.

[0024] The material matching processing method provided in the embodiment of the present application can be applied to one or more electronic devices. The electronic device can be a server, an industrial computer, a computer, a mobile phone, a laptop computer, etc., wherein the server can be a cloud server or a server cluster. The present application does not limit the type of electronic device.

[0025] like Figure 1 FIG. 1 is a flow chart of a material matching processing method provided by an embodiment of the present application. According to different requirements, the order of each step in the flow chart can be adjusted according to actual requirements, and some steps can be omitted. The material matching processing method is applied to electronic equipment, such as Figure 6 An electronic device 10 is shown.

[0026] S11, obtaining multiple material preparation requirements and generating a demand processing block structure corresponding to the material preparation requirements.

[0027] In some embodiments of the present application, material preparation requirements may come from a material requirement contact form in a warehouse management system. Each material preparation requirement may include requirement data. The requirement data may correspond to a required material. The requirement data includes but is not limited to: shape data, size data, processing allowance, quantity and / or delivery time.

[0028] Among them, the shape data may include square and round. According to the shape data, the materials required for the stocking demand may be divided into square pieces and round pieces. The square pieces may be plain plates and square billets, etc., and the round materials may be polished rods and round billets, etc. Plain plates may be square plates with smooth surfaces, square billets may be square block materials, polished rods may be cylindrical rods with polished surfaces, and round billets may be cylindrical materials.

[0029] The dimensional data of square parts can include length, width and height, and the dimensional data of round parts can include diameter and height. The machining allowance can be the additional dimensional data on the basis of the required material dimensional data, which is used to compensate for the loss during the machining process to ensure that the corresponding size of the material can be obtained.

[0030] In some embodiments of the present application, the electronic device may obtain the stocking requirements through various methods, and the present application does not limit the method for obtaining the stocking requirements.

[0031] Exemplarily, the electronic device may obtain a material preparation work order from a warehouse management system, a production scheduling system, an order management system, etc., extract demand data of required materials from the material preparation work order, and thereby obtain material preparation requirements.

[0032] For example, the demand data of the materials required in the material preparation demand can be obtained through user input. The above examples of the method for obtaining the material preparation demand are only examples, and are not limited to this in actual applications.

[0033] In some embodiments of the present application, the step of generating a required processing block structure corresponding to the material preparation demand includes: if the material preparation demand is the processing demand of a square material, the electronic device fits a rectangular structure corresponding to the square material according to the size data of the square material and the processing allowance required for processing the square material, and uses the rectangular structure corresponding to the square material as the required processing block structure corresponding to the material preparation demand; if the material preparation demand is the processing demand of a round material, the electronic device fits a rectangular structure corresponding to the round material according to the size data of the round material and the processing allowance required for processing the round material, and uses the rectangular structure corresponding to the round material as the required processing block structure corresponding to the material preparation demand.

[0034] According to the shape data in each material preparation requirement, it can be determined that each material preparation requirement is a processing requirement for a square material or a processing requirement for a round material. For example, if the shape data in the material preparation requirement is a square, it can be determined that the material preparation requirement is a processing requirement for a square material. If the shape data in the material preparation requirement is a circle, it can be determined that the material preparation requirement is a processing requirement for a round material.

[0035] In this embodiment, the demand processing block structure can reflect the shape data and size characteristics of the material required for the corresponding material preparation demand. Since the machining allowance can compensate for the loss during the machining process, the rectangular parallelepiped structure corresponding to the square material is fitted according to the size data and machining allowance of the square material as the demand processing block structure corresponding to the material preparation demand of the square material, and the rectangular parallelepiped structure corresponding to the round material is fitted according to the size data and machining allowance of the round material as the demand processing block structure corresponding to the material preparation demand of the round material, which can effectively offset the machining error, thereby ensuring that the processed material meets the size data requirements in the corresponding material preparation demand.

[0036] S12: Combining and grouping the multiple material preparation requirements to obtain a candidate material preparation requirement group set.

[0037] In some embodiments of the present application, any candidate material preparation requirement group in the candidate material preparation requirement group set includes at least two material preparation requirements, that is, the present application embodiment is aimed at the combination of two or more material processing requirements to perform material selection.

[0038] In some embodiments of the present application, the electronic device may combine and group the multiple stocking requirements according to the similarity and priority between the stocking requirements to obtain multiple candidate stocking requirement groups, thereby obtaining a candidate stocking requirement group set consisting of the multiple candidate stocking requirement groups.

[0039] Among them, the similarity between the material preparation requirements can be calculated by data such as morphological data and size data, and similar material preparation requirements can be determined based on the similarity between the material preparation requirements. For example, the electronic device determines the material preparation requirements corresponding to the similarities within a preset numerical range as similar material preparation requirements, and the preset numerical range can be customized. The priority between the material preparation requirements can be determined by the delivery time. For example, the smaller the delivery time, the higher the priority of the material preparation requirement.

[0040] Exemplarily, the electronic device may classify similar stocking requirements among the multiple stocking requirements into a candidate stocking requirement group; or, if there are multiple similar stocking requirements, the electronic device may freely combine the similar stocking requirements to obtain multiple candidate stocking requirement groups.

[0041] Exemplarily, the electronic device may divide the stock preparation requirements having the same priority among the multiple stock preparation requirements into a candidate stock preparation requirement group, obtain multiple candidate stock preparation requirement groups, and thus obtain a candidate stock preparation requirement group set.

[0042] Exemplarily, the electronic device may randomly combine the multiple stock requirements according to the rule that each candidate stock requirement group includes at least two stock requirements to obtain multiple candidate stock requirement groups, thereby obtaining a candidate stock requirement group set consisting of the multiple candidate stock requirement groups.

[0043] The above examples of the combination and grouping methods of the multiple stock preparation requirements are only examples and are not limited thereto in actual applications.

[0044] In this embodiment, the material preparation requirements are flexibly combined and grouped to facilitate the combination of the corresponding required processing block structures below.

[0045] S13, combining the demand processing block structures corresponding to the material preparation requirements in the candidate material preparation requirement group according to the set combination rule, obtaining one or more candidate processing block structures corresponding to the candidate material preparation requirement group, and constructing a candidate processing block structure set.

[0046] In some embodiments of the present application, according to the set combination rules, the requirement processing block structures corresponding to the material preparation requirements in the candidate material preparation requirement group are combined to obtain one or more candidate processing block structures corresponding to the candidate material preparation requirement group, and the step of constructing a set of candidate processing block structures includes: the electronic device uses one or more set processing directions contained in the combination rules as the combination flipping freedom of the requirement processing block structure, flips and combines the requirement processing block structures corresponding to the material preparation requirements in the candidate material preparation requirement group, obtains the candidate processing block structure corresponding to each candidate material preparation requirement group, and constructs a set of candidate processing block structures.

[0047] Among them, the combination rule also includes a rule that at least two required processing block structures are in contact and connected in the candidate processing block structures. The processing direction can be set by custom settings, and the present application does not impose any restrictions on this. For example, the axial direction of the required processing block structure can be used as the set processing direction. Since the required processing block structure is a rectangular parallelepiped structure, an axial direction of the required processing block structure can correspond to three groups of faces of the required processing block structure, where the axial direction can be the direction indicated by the length, width and height of the required processing block structure, and the faces opposite to each other are a group of faces. Therefore, a required processing block structure can be flipped three times along an axial direction, corresponding to three postures.

[0048] In this embodiment, one or more set processing directions included in the combination rules are used as the combined flipping degrees of freedom of the required processing block structure, and the required processing block structures corresponding to the material preparation requirements in the candidate material preparation requirement group are flipped and combined, so that a candidate processing block structure with a larger size and diverse postures can be obtained.

[0049] S14, with the purpose of ensuring that the candidate processing block structure does not exceed the appearance size of the target remaining metal blank, a target processing block structure is selected from the candidate processing block structure set.

[0050] In some embodiments of the present application, the target remaining metal blank is a selected metal blank that has undergone at least one cutting process.

[0051] In some embodiments of the present application, with the purpose of ensuring that the candidate processing block structures do not exceed the appearance dimensions of the target remaining metal blank, the step of screening out the target processing block structure from the candidate processing block structure set includes: the electronic device determines whether the appearance dimensions of each candidate processing block structure in the candidate processing block structure set are within the appearance dimension range of the target remaining metal blank; if the candidate processing block structure set includes candidate processing block structures whose appearance dimensions are within the appearance dimension range of the target remaining metal blank, the electronic device may use the candidate processing block structures whose appearance dimensions are within the appearance dimension range of the target remaining metal blank as the target processing block structure.

[0052] Among them, the appearance size of the candidate processing block structure can be determined by the posture of the candidate processing block structure, the appearance size of the candidate processing block structure includes length, width and height, and the appearance size range of the target remaining metal blank can include the range composed of length, width and height.

[0053] The case where the appearance size of the candidate processing block structure is within the appearance size range of the target remaining metal blank may be that each appearance size of the candidate processing block structure is smaller than or equal to a corresponding appearance size in the appearance size of the target remaining metal blank.

[0054] In some embodiments of the present application, the electronic device can determine whether each appearance dimension of each candidate processing block structure is less than or equal to the corresponding appearance dimension in the appearance dimension of the target remaining metal blank, thereby determining whether to use each candidate processing block structure as the target processing block structure.

[0055] For example, if the length of a candidate processing block structure is 10 cm, the width is 12 cm, and the height is 3 cm, and the length of the target remaining metal blank is 10 cm, the width is 15 cm, and the height is 6 cm, the length of the candidate processing block structure 10 cm is the same as the length of the target remaining metal blank 10 cm, the width of the candidate processing block structure 12 cm is smaller than the width of the target remaining metal blank 15 cm, and the height of the candidate processing block structure 3 cm is smaller than the height of the target remaining metal blank 16 cm. Therefore, the appearance dimensions of the candidate processing block structure are within the appearance dimension range of the target remaining metal blank, and the candidate processing block structure can be determined to be the target processing block structure.

[0056] In other embodiments of the present application, the electronic device can construct a three-dimensional rectangular coordinate system according to the size and axial direction of the target remaining metal blank, and import each candidate processing block structure into the three-dimensional rectangular coordinate system, so that each candidate processing block structure has a maximum overlap with the target remaining metal blank in the three-dimensional rectangular coordinate system, wherein each candidate processing block structure has a corresponding boundary coordinate point in the three-dimensional rectangular coordinate system, and the boundary coordinate point can be determined by the appearance size of each candidate processing block structure, and the material boundary of the target remaining metal blank in the three-dimensional rectangular coordinate system is determined, and the target processing block structure is determined according to the material boundary, and all boundary coordinate points of the target processing block structure are located within the material boundary, and the material boundary of the target remaining metal blank can be determined by the appearance size range of the target remaining metal blank.

[0057] In this embodiment, since the postures of the candidate processing block structures are diverse, the target processing block structure is selected from the candidate processing block structure set based on the screening criteria that the candidate processing block structure does not exceed the appearance size of the target remaining metal blank, which can ensure the screening success rate of the target processing block structure and match the morphological data and size data of the target remaining metal blank. Compared with the required processing block structure, the size of the combined candidate processing block structure is larger, so it can not only maximize the use of the target remaining metal blank, but also reduce the number of matches between the candidate processing block structure and the target remaining metal blank, thereby improving the matching efficiency.

[0058] S15, performing outbound processing on the target remaining metal blanks according to the candidate material preparation requirement group corresponding to the target processing block structure. In some embodiments of the present application, the electronic device can cut the target remaining metal blank according to the processing allowance, size data, shape data, etc. of the material preparation requirements in the candidate material preparation requirement group corresponding to the target processing block structure, and obtain the material required for each material preparation requirement in the candidate material preparation requirement group corresponding to the target processing block structure.

[0059] The target remaining metal blank has a corresponding number, which corresponds to the storage position of the target remaining metal blank in the warehouse. The electronic device can control the manipulator to grab the target remaining metal blank from the storage position for cutting.

[0060] After cutting the materials required for stock preparation, the electronic equipment can process the cut materials for delivery, or control the robot to grab the cut materials and move them to the next processing step.

[0061] In other embodiments of the present application, after cutting the target remaining metal blank, if there is any remaining metal blank, the electronic device can store the remaining metal blank as the target remaining metal blank in a corresponding storage position in the warehouse for the next material matching processing.

[0062] In other embodiments of the present application, if there are remaining metal blanks, the electronic device can determine the number of the remaining metal blanks based on the number of the target remaining metal blanks, obtain the size data of the remaining metal blanks, and associate the size data of the remaining metal blanks with the corresponding numbers to facilitate matching of the appearance dimensions during the next material matching processing.

[0063] Exemplarily, the serial number of the remaining metal blank can be obtained by adding a serial number before or after the serial number of the target remaining metal blank. For example, if the serial number of the target remaining metal blank is ABC, the serial number of the remaining metal blank can be ABC-1.

[0064] In the material matching processing method of the embodiment of the present application, the demand processing block structure can reflect the features such as the morphological data and size data of the materials required for the corresponding material preparation demand. By flexibly combining and grouping the material preparation demand, it is convenient to combine the corresponding demand processing block structure below. According to the set combination rule, the demand processing block structures in the candidate material preparation demand group are combined to obtain a candidate processing block structure with a larger size and diversified posture. Since the posture of the candidate processing block structure is diverse, the candidate processing block structure is screened out from the candidate processing block structure set based on the appearance size of the candidate processing block structure not exceeding the target residual metal blank as the screening standard, which can ensure the screening success rate of the target processing block structure and make the target processing block match the features such as the morphological data and size data of the target residual metal blank. Since the size of the candidate processing block structure obtained by the combination is larger than that of the demand processing block structure, it is not only possible to maximize the use of the target residual metal blank, but also possible to reduce the number of matches between the candidate processing block structure and the target residual metal blank, thereby improving the matching efficiency. The target remaining metal billets are processed out of warehouse according to the candidate demand preparation group corresponding to the target processing block structure, which can effectively utilize the target remaining metal billets and reduce resource waste, thereby improving the utilization rate of the remaining materials.

[0065] In some embodiments of the present application, before determining whether the appearance size of the candidate processing block structure in the candidate processing block structure set is within the appearance size range of the target remaining metal blank, the electronic device may perform a simplification process on the candidate processing block structure set. Figure 2 FIG. 1 is a flowchart of a simplified processing method for a candidate processing block structure set provided by an embodiment of the present application, comprising the following steps: S21, determining whether the maximum apparent size of a candidate processing block structure in the candidate processing block structure set in a set direction is greater than the apparent size of a target remaining metal blank in the set direction.

[0066] Wherein, the set direction may be any axial direction. For example, if the set direction is the direction indicated by the length, the maximum apparent dimension of the candidate processing block structure in the set direction may be the maximum length of the candidate processing block structure in the direction indicated by the length, and the apparent dimension of the target remaining metal blank in the set direction may be the length of the target remaining metal blank in the direction indicated by the length.

[0067] S22, removing the candidate processing block structures whose maximum apparent dimensions in the set direction are larger than the apparent dimensions of the target remaining metal blank in the set direction from the candidate processing block structure set, and updating the candidate processing block structure set.

[0068] In this embodiment, the candidate processing block structure set is eliminated, and the candidate processing block structures whose maximum appearance dimensions in a set direction are larger than the appearance dimensions of the target remaining metal blank in the set direction are eliminated from the candidate processing block structure set. This can reasonably streamline the candidate processing block structure set, thereby reducing the computational complexity of the matching operation.

[0069] In some embodiments of the present application, following the above embodiments, a candidate processing block structure whose appearance size is within the appearance size range of the target remaining metal blank is determined from the candidate processing block structure set, and the electronic device can select the target processing block structure from the candidate processing block structures whose appearance size is within the appearance size range of the target remaining metal blank, such as Figure 3 FIG. 1 is a flow chart of a method for screening a target processing block structure provided by an embodiment of the present application, comprising the following steps: S31, determining whether the number of candidate processing block structures whose appearance dimensions are within the appearance dimension range of the target remaining metal blank is greater than 1.

[0070] In some embodiments of the present application, by judging whether the number of candidate processing block structures whose appearance dimensions are within the appearance dimension range of the target remaining metal blank is greater than 1, it is possible to determine whether the number of candidate processing block structures whose appearance dimensions are within the appearance dimension range of the target remaining metal blank is multiple.

[0071] In this embodiment, if the number of candidate processing block structures whose appearance dimensions are within the appearance dimension range of the target remaining metal blank is greater than 1, step S32 is executed; if the number of candidate processing block structures whose appearance dimensions are within the appearance dimension range of the target remaining metal blank is 1, step S34 is executed.

[0072] S32, taking candidate processing block structures whose appearance dimensions are within the appearance dimension range of the target remaining metal blank as a first screening set.

[0073] In this embodiment, if there are multiple candidate processing block structures whose appearance dimensions are within the appearance dimension range of the target remaining metal blank, the multiple candidate processing block structures whose appearance dimensions are within the appearance dimension range of the target remaining metal blank are taken as the first screening set to facilitate screening of the target processing block structure from the first screening set.

[0074] S33: taking the candidate processing block structure with the largest number of material preparation requirements in the first screening set as the target processing block structure.

[0075] In this embodiment, the candidate processing block structure with the largest number of stock preparation requirements in the first screening set is used as the target processing block structure, so as to achieve maximum utilization of the target metal blank.

[0076] S34, determining the candidate processing block structure whose appearance size is within the appearance size range of the target remaining metal blank as the target processing block structure.

[0077] In some embodiments of the present application, following the above embodiments, a candidate processing block structure with the largest number of material preparation requirements is determined from the first screening set, and the electronic device can screen a target processing block structure from the candidate processing block structure with the largest number of material preparation requirements, such as Figure 4 FIG. 1 is a flow chart of a method for screening a target processing block structure provided by another embodiment of the present application, comprising the following steps: S41, determining whether the number of candidate processing block structures having the largest number of material preparation requirements in the first screening set is greater than 1.

[0078] In some embodiments of the present application, by judging whether the number of candidate processing block structures with the largest number of material preparation requirements in the first screening set is greater than 1, it can be determined whether the number of candidate processing block structures with the largest number of material preparation requirements in the first screening set is multiple. In this case, the target processing block structure cannot be determined in the manner of step S33.

[0079] In this embodiment, if the number of candidate processing block structures with the largest number of material preparation requirements in the first screening set is greater than 1, step S42 is executed; if the number of candidate processing block structures with the largest number of material preparation requirements in the first screening set is 1, step S45 is executed.

[0080] S42: taking the candidate processing block structures with the largest number of material preparation requirements in the first screening set as the second screening set.

[0081] In this embodiment, if there are multiple candidate processing block structures with the largest number of material preparation requirements in the first screening set, the candidate processing block structures with the largest number of material preparation requirements in the first screening set are used as the second screening set to facilitate screening of the target processing block structure from the second screening set.

[0082] S43, obtaining the target remaining metal blank volume after processing corresponding to each candidate processing block structure in the second screening set.

[0083] In some embodiments of the present application, the target remaining metal blank post-processing volume corresponding to each candidate processing block structure may be the volume of the processing block structure remaining after the target remaining metal blank is cut out from each candidate processing block structure.

[0084] The target remaining metal blank volume after processing corresponding to each candidate processing block structure can be obtained by subtracting the volume of each candidate processing block structure from the target remaining metal blank volume.

[0085] In this embodiment, the target remaining metal blank volume after processing corresponding to each candidate processing block structure is calculated, so as to determine the target processing block structure from the candidate processing block structures in the second screening set.

[0086] S44, taking the candidate processing block structure with the largest volume of the target remaining metal blank after processing in the second screening set as the target processing block structure.

[0087] In this embodiment, the candidate processing block structure with the largest volume of the target remaining metal blank after processing in the second screening set is used as the target processing block structure, which can maximize the volume of the remaining metal blank after processing the target remaining metal blank, thereby facilitating the next material matching processing of the remaining metal blank.

[0088] In some embodiments of the present application, following the above embodiment, the candidate processing block structure with the largest volume after the target remaining metal blank is processed in the second screening set is determined, and the electronic device can screen the target processing block structure from the candidate processing block structure with the largest volume, such as Figure 5 FIG. 1 is a flow chart of a method for screening a target processing block structure provided by another embodiment of the present application, comprising the following steps: S51, determining whether the number of candidate processing block structures having the largest volume of the target remaining metal blank after processing in the second screening set is greater than 1.

[0089] In some embodiments of the present application, by judging whether the number of candidate processing block structures with the largest volume after processing the target remaining metal blank in the second screening set is greater than 1, it can be determined whether the number of candidate processing block structures with the largest volume in the second screening set is multiple. In this case, the target processing block structure cannot be determined in the manner of step S44.

[0090] In this embodiment, if the number of candidate processing block structures with the largest volume of the target remaining metal blank after processing in the second screening set is greater than 1, step S52 is executed; if the number of candidate processing block structures with the largest volume of the target remaining metal blank after processing in the second screening set is 1, step S55 is executed.

[0091] S52, taking the candidate processing block structure with the largest volume of the target remaining metal blank after processing in the second screening set as the third screening set.

[0092] In this embodiment, if there are multiple candidate processing block structures with the largest volume of the target remaining metal blank after processing in the second screening set, the candidate processing block structure with the largest volume of the target remaining metal blank after processing in the second screening set is used as the third screening set to facilitate screening of the target processing block structure from the third screening set.

[0093] S53, obtaining the maximum cuboid volume proportion in each candidate processing block structure in the third screening set.

[0094] In some embodiments of the present application, the largest cuboid in each candidate processing block structure may be the largest cuboid within the allowed shape range of each candidate processing block structure.

[0095] The maximum cuboid volume ratio in each candidate processing block structure can be obtained by dividing the volume of the maximum cuboid within the shape allowable range of each candidate processing block structure by the volume of each candidate processing block structure.

[0096] In this embodiment, the maximum cuboid volume ratio in each candidate processing block structure is calculated so as to determine the target processing block structure from the candidate processing block structures in the third screening set.

[0097] S54, taking the candidate processing block structure with the largest cuboid volume ratio in the third screening set as the target processing block structure.

[0098] In this embodiment, the candidate processing block structure with the largest rectangular volume ratio in the third screening set is used as the target processing block structure, and the optimal processing block combination method can be determined from the processing block combination methods of the candidate processing blocks in the third screening set, thereby maximizing the utilization of the target remaining metal blank and further reducing the scrap rate of the target remaining metal blank.

[0099] like Figure 6 As shown in FIG. 1 , it is a structural diagram of an electronic device provided by an embodiment of the present application. Figure 6 As shown, the electronic device 10 may include a communication module 101, a memory 102, a processor 103, an input / output (I / O) interface 104 and a bus 105. The processor 103 is coupled to the communication module 101, the memory 102, and the input / output interface 104 through the bus 105.

[0100] The communication module 101 may include a wired communication module and / or a wireless communication module. The wired communication module may provide one or more wired communication solutions such as universal serial bus (USB), controller area network bus (CAN, Controller Area Network). The wireless communication module may provide one or more wireless communication solutions such as wireless fidelity, Bluetooth, mobile communication network, frequency modulation (FM), near field communication technology (NFC), infrared technology (IR), etc.

[0101] The memory 102 may include one or more random access memories (RAM) and one or more non-volatile memories (NVM). The random access memory can be directly read and written by the processor 103, and can be used to store executable programs (such as machine instructions) of other running programs, and can also be used to store user and application data. The random access memory may include static random-access memory (SRAM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous dynamic random access memory (DDR SDRAM), etc.

[0102] The non-volatile memory may also store executable programs and user and application data, etc., and may be loaded into the random access memory in advance for direct reading and writing by the processor 103. The non-volatile memory may include a disk storage device and a flash memory.

[0103] The memory 102 is used to store one or more computer programs. The one or more computer programs are configured to be executed by the processor 103. The one or more computer programs include multiple instructions, and when the multiple instructions are executed by the processor 103, the material matching processing method executed on the electronic device 10 can be implemented.

[0104] In other embodiments, Figure 6 The electronic device 10 shown also includes an external memory interface for connecting to an external memory to expand the storage capacity of the electronic device 10 .

[0105] The processor 103 may include one or more processing units, for example, the processor 103 may include an application processor (AP), a modem processor, a graphics processor (GPU), an image signal processor (ISP), a controller, a video codec, a digital signal processor (DSP), and / or a neural-network processing unit (NPU), etc. Different processing units may be independent devices or integrated into one or more processors.

[0106] The processor 103 provides computing and control capabilities. For example, the processor 103 is used to execute a computer program stored in the memory 102 to implement the above-mentioned material matching processing method.

[0107] The input / output interface 104 is used to provide a channel for user input or output. For example, the input / output interface 104 can be used to connect various input and output devices, such as a mouse, keyboard, touch device, display screen, etc., so that the user can enter information or visualize information.

[0108] The bus 105 is at least used to provide a channel for mutual communication among the communication module 101 , the memory 102 , the processor 103 , and the input / output interface 104 in the electronic device 10 .

[0109] It is to be understood that the structure illustrated in the embodiment of the present application does not constitute a specific limitation on the electronic device 10. In other embodiments of the present application, the electronic device 10 may include more or fewer components than shown in the figure, or combine some components, or split some components, or arrange the components differently. The components shown in the figure may be implemented in hardware, software, or a combination of software and hardware.

[0110] An embodiment of the present application further provides a computer-readable storage medium, on which a computer program is stored. The computer program includes program instructions. The method implemented when the program instructions are executed can refer to the methods in the above-mentioned embodiments of the present application.

[0111] The computer-readable storage medium may be an internal memory of the electronic device described in the above embodiment, such as a hard disk or memory of the electronic device. The computer-readable storage medium may also be an external storage device of the electronic device, such as a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (SecureDigital, SD) card, a flash card (Flash Card), etc. equipped on the electronic device.

[0112] In some embodiments, the computer-readable storage medium may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function, etc.; the data storage area may store data created according to the use of the electronic device, etc.

[0113] It is to be understood that the structure illustrated in the embodiments of the present application does not constitute a specific limitation on the electronic device. In other embodiments of the present application, the electronic device may include more or fewer components than shown in the figure, or combine certain components, or split certain components, or arrange the components differently. The components shown in the figure may be implemented in hardware, software, or a combination of software and hardware.

[0114] In the several embodiments provided in this application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only illustrative, for example, the division of the modules is only a logical function division, and there may be other division methods in actual implementation.

[0115] The modules described as separate components may or may not be physically separated, and the components shown as modules may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0116] In addition, each functional module in each embodiment of the present application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The above integrated unit can be implemented in the form of hardware or in the form of hardware plus software functional modules.

[0117] Therefore, no matter from which point of view, the embodiments should be regarded as illustrative and non-restrictive, and the scope of the present application is limited by the appended claims rather than the above description, so it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present application. Any attached figure mark in the claims should not be regarded as limiting the claims involved.

[0118] In addition, it is clear that the word "comprising" does not exclude other units or steps, and the singular does not exclude the plural. Multiple units or devices stated in this application can also be implemented by one unit or device through software or hardware. The words first, second, etc. are used to indicate names, and do not indicate any particular order.

[0119] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present application and are not intended to limit it. Although the present application has been described in detail with reference to the preferred embodiments, a person of ordinary skill in the art should understand that the technical solution of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present application.

Claims

1. A material matching processing method, characterized in that: The method comprises: Acquire multiple material preparation requirements, and generate a demand processing block structure corresponding to the material preparation requirements; Combining and grouping the multiple material preparation requirements to obtain a candidate material preparation requirement group set; wherein any candidate material preparation requirement group in the candidate material preparation requirement group set contains at least two of the material preparation requirements; According to the set combination rule, the required processing block structures corresponding to the material preparation requirements in the candidate material preparation requirement group are combined to obtain one or more candidate processing block structures corresponding to the candidate material preparation requirement group, and to construct a candidate processing block structure set; The target processing block structure is selected from the candidate processing block structure set with the purpose of ensuring that the candidate processing block structure does not exceed the appearance size of the target remaining metal blank; wherein the target remaining metal blank is a selected metal blank that has been cut at least once; According to the candidate material preparation requirement group corresponding to the target processing block structure, the target remaining metal blank is processed out of the warehouse.

2. The material matching processing method according to claim 1, characterized in that: The step of generating a required processing block structure corresponding to the material preparation requirement includes: If the material preparation requirement is a processing requirement for a square material, a rectangular parallelepiped structure corresponding to the square material is fitted according to the size data of the square material and the processing allowance required for processing the square material, and the rectangular parallelepiped structure corresponding to the square material is used as the required processing block structure corresponding to the material preparation requirement; If the material preparation requirement is a processing requirement for a round material, a rectangular structure corresponding to the round material is fitted based on the size data of the round material and the processing allowance required for processing the round material, and the rectangular structure corresponding to the round material is used as the required processing block structure corresponding to the material preparation requirement.

3. The material matching processing method according to claim 1, characterized in that: The step of combining the required processing block structures corresponding to the material preparation requirements in the candidate material preparation requirement group according to the set combination rule, obtaining one or more candidate processing block structures corresponding to the candidate material preparation requirement group, and constructing a candidate processing block structure set includes: Using one or more set processing directions included in the combination rule as the combined flipping freedom of the required processing block structure, flipping and combining the required processing block structures corresponding to the material preparation requirements in the candidate material preparation requirement group, obtaining the candidate processing block structure corresponding to each candidate material preparation requirement group, and constructing the candidate processing block structure set; The combination rule further includes a rule that at least two of the required processing block structures in the candidate processing block structures are in contact and connected.

4. The material matching processing method according to claim 1, characterized in that: The step of selecting a target processing block structure from the set of candidate processing block structures with the purpose of ensuring that the candidate processing block structure does not exceed the appearance size of the target remaining metal blank comprises: Determine whether the appearance size of the candidate processing block structure in the candidate processing block structure set is within the appearance size range of the target remaining metal blank; If so, the candidate processing block structure whose appearance size is within the appearance size range of the target remaining metal blank is used as the target processing block structure.

5. The material matching processing method according to claim 4, characterized in that: Before determining whether the appearance size of the candidate processing block structure in the candidate processing block structure set is within the appearance size range of the target remaining metal blank, the method further comprises: Determine whether the maximum apparent size of the candidate processing block structure in the candidate processing block structure set in a set direction is greater than the apparent size of the target remaining metal blank in the set direction; If so, the candidate processing block structure whose maximum apparent dimension in the set direction is larger than the apparent dimension of the target remaining metal blank in the set direction is removed from the candidate processing block structure set, and the candidate processing block structure set is updated.

6. The material matching processing method according to claim 4, characterized in that: Before taking the candidate processing block structure whose appearance size is within the appearance size range of the target remaining metal blank as the target processing block structure, the method further includes: Determine whether the number of the candidate processing block structures within the range of the appearance size of the target remaining metal blank is greater than 1; If yes, the candidate processing block structures whose appearance size is within the appearance size range of the target remaining metal blank are taken as the first screening set; The candidate processing block structure containing the largest number of the material preparation requirements in the first screening set is used as the target processing block structure.

7. The material matching processing method according to claim 6, characterized in that: Before taking the candidate processing block structure containing the largest number of material preparation requirements in the first screening set as the target processing block structure, the method further includes: Determine whether the number of the candidate processing block structures in the first screening set that contain the largest number of the material preparation requirements is greater than 1; If so, the candidate processing block structure containing the largest number of the material preparation requirements in the first screening set is used as the second screening set; Obtaining a target remaining metal blank volume after processing corresponding to each of the candidate processing block structures in the second screening set; The candidate processing block structure with the largest volume of the target remaining metal blank after processing in the second screening set is used as the target processing block structure.

8. The material matching processing method according to claim 7, characterized in that: Before taking the candidate processing block structure with the largest volume after processing the target remaining metal blank in the second screening set as the target processing block structure, the method further includes: Determine whether the number of the candidate processing block structures having the largest volume of the target remaining metal blank after processing in the second screening set is greater than 1; If yes, taking the candidate processing block structure with the largest volume of the target remaining metal blank after processing in the second screening set as the third screening set; Obtaining the maximum cuboid volume ratio in each of the candidate processing block structures in the third screening set; The candidate processing block structure with the largest cuboid volume accounting for the largest proportion in the third screening set is used as the target processing block structure.

9. An electronic device, characterized in that: The electronic device comprises: a memory storing at least one instruction; and A processor executes the at least one instruction to implement the material matching processing method as described in any one of claims 1 to 8.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores at least one instruction, and when the at least one instruction is executed by a processor in an electronic device, the material matching processing method according to any one of claims 1 to 8 is implemented.

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