Chip routing transmission mechanism

Abstract

The invention discloses a chip routing transmission mechanism which comprises a first base, first conveying tracks used for transmitting chip substrates are arranged on the two opposite inner walls of a first supporting frame correspondingly, and feeding plates are located between the two first conveying tracks and installed at the two ends of the first supporting frame correspondingly. A corrugated plate is arranged above the square hole and between every two adjacent feeding plates, third supporting frames are arranged between the two first supporting frames and are symmetrical about the axis of the first base, a second conveying crawler belt is arranged in each third supporting frame, and a bottom plate is arranged between the two third supporting frames. A double-end cylinder is arranged below the bottom plate, and a wire bonding mechanism used for chips is arranged above the bottom plate. According to the chip routing transmission mechanism, the position precision of the chip is guaranteed, meanwhile, the contact friction area of the chip is reduced, the situation that the chip is scratched is reduced, the situation that the chip is damaged due to the fact that the chip is excessively clamped and pressed is avoided, and the machining quality is improved.

Description

Technical Field

[0001] The invention relates to the technical field of chip processing, in particular to a chip wire bonding transmission mechanism. Background Art

[0002] Wire bonding is also called pressure welding, also known as binding, bonding or wire bonding. It refers to the use of metal wires (gold wire, aluminum wire, etc.) to complete the connection of internal interconnection wiring in solid-state circuits in microelectronic devices by using heat pressure or ultrasonic energy, that is, the connection between the chip and the circuit or lead frame. It is common in surface packaging processes, such as COB processes. In the production process of chips, it is often due to After searching, the Chinese patent publication number CN114582752A discloses a chip bonding device and method, including a base, an operating table, a bonding box, a conveyor belt, a support assembly, a moving assembly and a bonding assembly. By placing the chips in the placement grooves set in the placement blocks of the support assemblies, multiple groups of support assemblies are placed on the conveyor belt; after the multiple groups of support assemblies are placed stably, the conveyor belt is started, and the conveyor belt conveys the support assemblies to the inside of the bonding box; after the support assemblies convey the chips to the inside of the bonding box, the moving assembly inside the bonding box is started, and the moving assembly drives the bonding assembly set on the side to perform bonding on the multiple chips placed above the support assemblies; after the bonding process is completed, the chips are conveyed out through the opening set on the side of the bonding box for collection, so that the bonding process can be performed on the multiple chips.

[0003] When using the above device, it is necessary to clamp the chip through a robot or other equipment and place the chip in the placement slot. In the process of the robot picking up the chip, it is easy for the chip to be damaged due to excessive clamping and pressing, affecting the yield rate of product production. In addition, the robot rubs and contacts with the chip surface during movement, which can easily cause scratches on the chip and affect the yield rate of the product. Summary of the invention

[0004] The purpose of the present invention is to provide a chip wire transmission mechanism, which reduces the contact friction area of ​​the chip while ensuring the chip position accuracy, reduces chip scratches, avoids damage to the chip caused by excessive clamping and pressing, and improves the processing quality.

[0005] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a chip wire transmission mechanism, comprising: a first base, one or two first support frames with square holes are installed at intervals on the top of the first base, a first conveying crawler for transmitting chip substrates is arranged on two opposite inner walls of the first support frame, and a loading plate is respectively installed between the two first conveying crawlers and at both ends of the first support frame, and a corrugated plate is arranged above the square hole and between two adjacent loading plates; A third support frame with a second conveyor belt inside is located between the two first support frames and symmetrically arranged about the axis of the first base, and a bottom plate is arranged between the two third support frames, and both ends of the bottom plate respectively correspond to the loading plate, and a double-headed cylinder is arranged below the bottom plate, and both ends of the double-headed cylinder are respectively fixedly connected to a third support frame, and a wire bonding mechanism for chips is arranged above the bottom plate.

[0006] The further improved scheme in the above technical scheme is as follows: 1. In the above scheme, a support shell with an internally-arranged ventilator is disposed on one side of the wire-breaking mechanism and on one of the first support frames, and a filter is detachably installed on the side of the support shell relative to the wire-breaking mechanism. A ventilation shell connected to the ventilator is disposed on the side of the support shell opposite to the wire-breaking mechanism, and a condensing sheet is detachably installed on the ventilation shell having a plurality of air holes.

[0007] 2. In the above solution, the filter is fixedly installed inside a second support frame, and a first slot for plugging the second support frame is provided on the top of the support shell.

[0008] 3. In the above scheme, an L-shaped support frame with an air inlet is installed on the other side of the wire-breaking mechanism, a suction fan is arranged on the top of the L-shaped support frame, and the suction fan with an air outlet on the top is connected to the air inlet through a ventilation elbow.

[0009] 4. In the above scheme, a second base with a slide groove is installed below the third support frame and on the top of the first base. The slide groove is arranged parallel to the double-headed cylinder, and the bottom of the third support frame has a sliding block that cooperates with the slide groove.

[0010] 5. In the above solution, a limiting rod is arranged between the two third support frames and parallel to the double-headed cylinder.

[0011] 6. In the above scheme, a first support plate and a second support plate are provided on opposite sides of the two third support frames, both ends of the double-headed cylinder are fixedly connected to the first support plate, and both ends of the limit rod are respectively connected to the second support plate.

[0012] 7. In the above scheme, a through hole is provided in the first base corresponding to the square hole, and the corrugated plate is a metal corrugated plate, a grounder is provided below the corrugated plate, and the corrugated plate and the grounder are fixedly connected by a grounding wire.

[0013] 8. In the above solution, the corrugated plate has a plurality of platforms, and the platform at the highest point is flush with the loading plate.

[0014] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art: 1. The chip bonding transmission mechanism of the present invention has a first conveying crawler for transmitting chip substrates on two opposite inner walls of the first support frame, a loading plate is installed at both ends of the first support frame, and a corrugated plate is arranged between two adjacent loading plates. The chip is transmitted through the two first conveying crawlers on the opposite sides of the first support frame, and during the transmission process, the bottom of the chip will contact the loading plate and the metal corrugated plate, thereby achieving the initial positioning of the chip and reducing the friction contact area with the chip. Then the chip is transmitted to the bottom plate through the loading plate, and a symmetrical inner surface with The third support frame of the second conveyor belt is provided with a base plate between the two third support frames, and a double-headed cylinder is provided under the base plate. The two third support frames are driven closer by controlling the contraction of the double-headed cylinder. While the base plate carries the chip, the second conveyor belt clamps the chip, which not only reduces the contact area between the chip and the transmission mechanism, but also reduces the friction resistance of the chip, greatly reduces the chip scratches, improves the chip positioning accuracy, and avoids the damage of the chip caused by excessive clamping of the second conveyor belt, and also facilitates the simultaneous bonding of multiple chips, thereby improving production efficiency.

[0015] 2. The chip bonding transmission mechanism of the present invention is located on one side of the bonding mechanism and has a support shell with an internal guide fan on one of the first support frames, and a filter is detachably installed on the side of the support shell opposite to the bonding mechanism, and a ventilation shell connected to the guide fan is arranged on the side of the support shell opposite to the bonding mechanism, and a condensing sheet is detachably installed on the ventilation shell with a plurality of air holes, which forms a unidirectional flow of cold wind between the support shell and the air inlet of the support frame, so as to blow and cool the chip surface, thereby increasing the shaping speed of the bonding and improving the processing quality, and the filter is conducive to dispersing the cold wind, avoiding the situation where the wind gathers to blow the metal wire off or even break it, and is also conducive to unidirectional gathering and diversion of the odor generated during bonding, so as to facilitate the subsequent treatment of the odor. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Attached Figure 1 This is a schematic diagram of the chip wire bonding transmission mechanism structure of the present invention; Attached Figure 2 The local structure decomposition of the chip wire transmission mechanism of the present invention Figure 1 ; Attached Figure 3 It is a schematic diagram of the local structure of the chip wire bonding transmission mechanism of the present invention; Attached Figure 4 The local structure decomposition of the chip wire transmission mechanism of the present invention Figure 2 ; Attached Figure 5 It is a schematic diagram of the internal structure of the local chip bonding transmission mechanism of the present invention.

[0017] In the above figures: 101, first conveyor crawler; 102, first support frame; 103, square hole; 104, loading plate; 105, corrugated plate; 106, first base; 107, grounding wire; 108, grounding device; 109, platform; 201, suction fan; 202, air outlet; 203, ventilation elbow; 204, L-shaped support frame; 205, air inlet; 206, support shell; 207, ventilation shell; 208, ventilation hole ; 209, condenser; 210, handle; 211, second support frame; 212, filter; 213, fan guide; 3, wire-beating mechanism; 401, third support frame; 402, second conveyor track; 403, slider; 404, slide; 405, second base; 406, limit rod; 407, double-headed cylinder; 408, first support plate; 409, bottom plate; 5, through hole; 6, second support plate; 7, first slot; 8, second slot. Implementation

[0018] The present invention can be further understood through the specific embodiments given below, but they are not intended to limit the present invention.

[0019] Embodiment 1: A chip bonding transmission mechanism comprises: a first base 106, on the top of which two first support frames 102 with square holes 103 are installed at intervals, on two opposite inner walls of the first support frame 102, a first conveying crawler 101 for conveying chip substrates is arranged, and between the two first conveying crawlers 101 and at both ends of the first support frame 102, a loading plate 104 is respectively installed, and above the square hole 103 and between two adjacent loading plates 104, a corrugated plate 105 is arranged; The chip is placed on the loading plate, and the two sets of first conveyor crawlers clamp and convey the chip. The contact area between the chip substrate and the device is reduced by clamping the two sides. At the same time, the corrugated plate arranged at the bottom can intermittently contact the bottom of the chip substrate, thereby achieving the correction effect of the conveying height of the chip substrate; A third support frame 401 having a second conveyor crawler 402 therein is symmetrically arranged between the two first support frames 102 and about the axis of the first base 106, and a bottom plate 409 is arranged between the two third support frames 401, and the two ends of the bottom plate 409 are respectively matched with the loading plate 104, and a double-headed cylinder 407 is arranged below the bottom plate 409, and the two ends of the double-headed cylinder 407 are respectively fixedly connected to a third support frame 401, and a wire bonding mechanism 3 for the chip 409 is arranged above the bottom plate 409; When the chip is transferred to the base plate, the two groups of second conveyor belts directly clamp the chip, and with the rotation of the second conveyor belts, multiple chip substrates can be synchronously conveyed at the same interval between the two groups of second conveyor belts. Therefore, when the two groups of second conveyor belts are controlled to stop, the multiple groups of chip substrates are also synchronously driven to stop conveying, and then the double-headed cylinder contracts inward, and maintains stable movement under the action of the limiting plug rod, driving the two groups of second conveyor belts inward to increase the clamping force on the chip, thereby ensuring its stability during the wiring process. Under this structure, the synchronous clamping of multiple groups of chips can be achieved by extending the length of the second conveyor belts to achieve synchronous wiring, and the control structure is simple, which can reduce cost requirements.

[0020] A support shell 206 with an internal guide fan 213 is disposed on one side of the above-mentioned wire bonding mechanism 3 and on one of the first support frames 102, and a filter screen 212 is detachably installed on the side of the support shell 206 relative to the wire bonding mechanism 3. A ventilation shell 207 connected to the guide fan 213 is disposed on the side of the support shell 206 opposite to the wire bonding mechanism 3, and a condensing sheet 209 is detachably installed on the ventilation shell 207 having a plurality of air holes 208.

[0021] The filter screen 212 is fixedly installed inside a second support frame 211 , and a first slot 7 for plugging the second support frame 211 is provided on the top of the support shell 206 .

[0022] An L-shaped support frame 204 with an air inlet 205 is installed on the other side of the above-mentioned wire bonding mechanism 3. A suction fan 201 is arranged on the top of the L-shaped support frame 204, and the suction fan 201 with an air outlet 202 on the top is connected to the air inlet 205 through a ventilation elbow 203; By forming a unidirectional flow of cold air between the air inlet of the support shell and the support frame, the chip surface can be blown and cooled, which increases the shaping speed of the wire bonding and improves the processing quality. The filter is conducive to the dispersion of cold air, avoiding the situation where wind force gathers and blows the metal wire off or even breaks it. It is also beneficial to gather and guide the odor generated during wire bonding in one direction, which is convenient for subsequent treatment of the odor.

[0023] A second base 405 having a slide groove 404 is installed below the third support frame 401 and on the top of the first base 106 . The slide groove 404 is arranged parallel to the double-head cylinder 407 , and the bottom of the third support frame 401 has a slider 403 that cooperates with the slide groove 404 .

[0024] A limiting rod 406 is disposed between the two third support frames 401 and parallel to the double-headed cylinder 407 .

[0025] The first base 106 has a through hole 5 corresponding to the square hole 103, and the corrugated plate 105 is a metal corrugated plate. A grounding device 108 is disposed below the corrugated plate 105. The corrugated plate 105 and the grounding device 108 are fixedly connected via a grounding wire 107. By setting the grounding wire and grounder synchronously, when the chip substrate contacts the platform position of the corrugated plate, the static electricity on the substrate can be quickly eliminated, thereby reducing the possibility of scratches on the bottom of the chip and achieving the effect of eliminating static electricity synchronously.

[0026] The corrugated plate 105 has a plurality of platforms 109 , and the platform 109 at the highest point is flush with the loading plate 104 .

[0027] The second support frame 211 has a handle 210 .

[0028] Embodiment 2: A chip bonding transmission mechanism comprises: a first base 106, on the top of which two first support frames 102 with square holes 103 are installed at intervals, on two opposite inner walls of the first support frame 102, a first conveying crawler 101 for transmitting chip substrates is arranged, and a loading plate 104 is respectively installed between the two first conveying crawlers 101 and at both ends of the first support frame 102, and a corrugated plate 105 is arranged above the square hole 103 and between two adjacent loading plates 104; The chip is transported by two first conveyor tracks on opposite sides of the first support frame, and during the transport process, the bottom of the chip contacts the loading plate and the metal corrugated plate, thereby achieving the initial positioning of the chip and reducing the contact area with the chip, and then the chip is transported to the bottom plate through the loading plate; A third support frame 401 having a second conveyor crawler 402 therein is symmetrically arranged between the two first support frames 102 and about the axis of the first base 106, and a bottom plate 409 is arranged between the two third support frames 401, and the two ends of the bottom plate 409 are respectively matched with the loading plate 104, and a double-headed cylinder 407 is arranged below the bottom plate 409, and the two ends of the double-headed cylinder 407 are respectively fixedly connected to a third support frame 401, and a wire bonding mechanism 3 for the chip 409 is arranged above the bottom plate 409; By controlling the contraction of the double-headed cylinder to drive the two third support frames closer together, the bottom plate carries the chip while the second conveyor belt clamps the chip, which not only reduces the contact area between the chip and the transmission mechanism, but also reduces the friction resistance of the chip, greatly reduces chip scratches, improves the chip positioning accuracy, avoids excessive clamping of the second conveyor belt on the chip and causes damage to it, and also facilitates the simultaneous bonding of multiple chips, thereby improving production efficiency.

[0029] A support shell 206 with a guide fan 213 disposed therein is disposed on one side of the above-mentioned wire bonding mechanism 3 and on one of the first support frames 102, and a filter screen 212 is detachably mounted on the side of the support shell 206 relative to the wire bonding mechanism 3, and a ventilation shell 207 connected to the guide fan 213 is disposed on the side of the support shell 206 opposite to the wire bonding mechanism 3, and a condensing sheet 209 is detachably mounted on the ventilation shell 207 having a plurality of air holes 208; During the bonding process, the wind is guided by the wind guide of the fan and sucked into the support shell through multiple air holes. After being cooled by the condenser, the wind is then dispersed by the flow-evening effect of the filter, reducing the force of the wind on the chip undergoing bonding and avoiding affecting the bonding effect. After the initial cooling, when the chip moves to the bottom of the support shell, it can be directly affected by the cold wind for a second cooling.

[0030] The filter screen 212 is fixedly installed inside a second support frame 211 , and a first slot 7 for plugging the second support frame 211 is provided on the top of the support shell 206 .

[0031] An L-shaped support frame 204 with an air inlet 205 is installed on the other side of the above-mentioned wire bonding mechanism 3. A suction fan 201 is arranged on the top of the L-shaped support frame 204, and the suction fan 201 with an air outlet 202 on the top is connected to the air inlet 205 through a ventilation elbow 203; Under the action of the suction fan, the odor generated during wire bonding is absorbed while the dispersed cold air is guided so that it can act on the surface of the chip being wire bonded, accelerating the shaping speed of the wire bonding.

[0032] A second base 405 having a slide groove 404 is installed below the third support frame 401 and on the top of the first base 106 . The slide groove 404 is arranged parallel to the double-head cylinder 407 , and the bottom of the third support frame 401 has a slider 403 that cooperates with the slide groove 404 .

[0033] A first support plate 408 and a second support plate 6 are provided on opposite sides of the two third support frames 401 . Both ends of the double-headed cylinder 407 are fixedly connected to the first support plate 408 , and both ends of the limit rod 406 are insertedly connected to the second support plate 6 .

[0034] The first base 106 has a through hole 5 corresponding to the square hole 103 , and the corrugated plate 105 is a metal corrugated plate. A grounder 108 is disposed below the corrugated plate 105 , and the corrugated plate 105 and the grounder 108 are fixedly connected via a grounding wire 107 .

[0035] The corrugated plate 105 has a plurality of platforms 109 , and the platform 109 at the highest point is flush with the loading plate 104 .

[0036] A second slot 8 for inserting the condensing sheet 209 is provided on the top of the ventilation housing 207 .

[0037] The working principle is: When working, the chip is placed on the loading plate, and the two groups of first conveyor crawlers clamp and convey the chip. The contact area between the chip substrate and the device is reduced by clamping the two sides. At the same time, the corrugated plate arranged at the bottom can intermittently contact the bottom of the chip substrate, thereby achieving the correction effect on the conveying height of the chip substrate. The grounding wire and grounder are arranged synchronously. When the chip substrate contacts the platform position of the corrugated plate, the static electricity on the substrate can be quickly eliminated, thereby reducing the possibility of scratches on the bottom of the chip and achieving the effect of eliminating static electricity simultaneously. When the chip is transferred to the bottom plate, the two sets of second conveyor crawlers directly clamp the chip, and with the rotation of the second conveyor crawlers, multiple chip substrates can be synchronously conveyed at the same interval between the two sets of second conveyor crawlers. Therefore, when the two sets of second conveyor crawlers are controlled to stop, the multiple sets of chip substrates are synchronously driven to stop conveying, and then the double-headed cylinder is retracted inward, and the limited insertion rod is used to maintain stable movement, driving the two sets of second conveyor crawlers inward to increase the clamping force on the chip, thereby ensuring its stability during the wiring process. Under this structure, the synchronous clamping of multiple sets of chips can be achieved by extending the length of the second conveyor crawlers, and the synchronous wiring can be achieved. The control structure is simple, which can reduce cost requirements. During the bonding process, the wind is guided by the wind guide of the fan, sucked into the support shell after being cooled by the condenser, and then dispersed by the flow equalization effect of the filter, reducing the force of the wind on the chip undergoing bonding to avoid affecting the bonding effect. After the initial cooling, the chip moves to the bottom of the support shell and can be directly affected by the cold wind for a second cooling. Simultaneously, under the action of the suction fan, the odor generated during bonding is absorbed while the dispersed cold air is guided so that it can act on the surface of the chip undergoing bonding, thereby accelerating the shaping speed of the bonding.

[0038] When the above-mentioned chip bonding transmission mechanism is adopted, the chip is transmitted through the two first conveyor crawlers on the opposite sides of the first support frame, and during the transmission process, the bottom of the chip will contact the loading plate and the metal corrugated plate, thereby realizing the initial positioning of the chip and reducing the contact area with the chip. Then the chip is transmitted to the bottom plate through the loading plate, and the two third support frames are driven to approach by controlling the contraction of the double-headed cylinder. While the bottom plate carries the chip, the second conveyor crawler clamps the chip, which not only reduces the contact area between the chip and the transmission mechanism, but also reduces the friction resistance of the chip, greatly reduces the chip scratches, improves the chip positioning accuracy, and avoids the situation where the second conveyor crawler excessively clamps the chip and causes it to be damaged, and also facilitates the simultaneous bonding of multiple chips, thereby improving production efficiency. In addition, by forming a one-way flow of cold air between the support shell and the air inlet of the support frame, the chip surface can be blown and cooled, which increases the shaping speed of the wire bonding and improves the processing quality. The filter is conducive to the dispersion of cold air, avoiding the situation where the wind force gathers and blows the metal wire to the side or even breaks it, and is also conducive to the one-way gathering and diversion of the odor generated during wire bonding, which is convenient for subsequent odor treatment.

[0039] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A chip bonding transmission mechanism, comprising: A first base (106), characterized in that: one or two first support frames (102) with square holes (103) are installed at intervals on the top of the first base (106); a first conveying track (101) for transmitting chip substrates is provided on two opposite inner walls of the first support frame (102); and a loading plate (104) is installed between the two first conveying tracks (101) and at both ends of the first support frame (102); and a corrugated plate (105) is provided above the square hole (103) and between two adjacent loading plates (104); A third support frame (401) having a second conveyor crawler (402) therein is disposed between the two first support frames (102) and symmetrically about the axis of the first base (106), and a bottom plate (409) is disposed between the two third support frames (401), the two ends of the bottom plate (409) respectively corresponding to the loading plate (104), a double-headed cylinder (407) is disposed below the bottom plate (409), the two ends of the double-headed cylinder (407) are respectively fixedly connected to a third support frame (401), and a wire bonding mechanism (3) for a chip (409) is disposed above the bottom plate (409).

2. The chip bonding transmission mechanism according to claim 1, characterized in that: A support shell (206) with a guide fan (213) disposed therein is disposed on one side of the wire bonding mechanism (3) and on one of the first support frames (102), and a filter screen (212) is detachably mounted on the support shell (206) on a side opposite to the wire bonding mechanism (3). A ventilation shell (207) in communication with the guide fan (213) is disposed on the side of the support shell (206) opposite to the wire bonding mechanism (3), and a condensing sheet (209) is detachably mounted on the ventilation shell (207) having a plurality of air holes (208).

3. The chip bonding transmission mechanism according to claim 2, characterized in that: The filter screen (212) is fixedly mounted inside a second support frame (211), and a first slot (7) for plugging the second support frame (211) is provided on the top of the support shell (206).

4. The chip bonding transmission mechanism according to claim 2, characterized in that: An L-shaped support frame (204) having an air inlet (205) is installed on the other side of the wire-bonding mechanism (3), a suction fan (201) is arranged on the top of the L-shaped support frame (204), and the suction fan (201) having an air outlet (202) on the top is connected to the air inlet (205) via a ventilation elbow (203).

5. The chip bonding transmission mechanism according to claim 1, characterized in that: A second base (405) having a slide groove (404) is installed below the third support frame (401) and on top of the first base (106). The slide groove (404) is arranged parallel to the double-head cylinder (407), and the bottom of the third support frame (401) has a sliding block (403) that cooperates with the slide groove (404).

6. The chip bonding transmission mechanism according to claim 1, characterized in that: A limiting insertion rod (406) is disposed between the two third support frames (401) and parallel to the double-head cylinder (407).

7. The chip bonding transmission mechanism according to claim 6, characterized in that: A first support plate (408) and a second support plate (6) are provided on opposite sides of the two third support frames (401); both ends of the double-headed cylinder (407) are respectively fixedly connected to the first support plate (408); and both ends of the limiting plug rod (406) are respectively connected to the second support plate (6) in an interlaced manner.

8. The chip bonding transmission mechanism according to claim 1, characterized in that: The first base (106) is provided with a through hole (5) corresponding to the square hole (103), and the corrugated plate (105) is a metal corrugated plate. A grounding device (108) is provided below the corrugated plate (105), and the corrugated plate (105) and the grounding device (108) are fixedly connected via a grounding wire (107).

9. The chip bonding transmission mechanism according to claim 8, characterized in that: The corrugated plate (105) has a plurality of platforms (109), and the platform (109) at the highest point is flush with the loading plate (104).

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