Electronic device and method of manufacturing same

Abstract

An electronic device and a method of manufacturing the electronic device. In one example, an electronic device includes a substrate including a dielectric structure and a conductive structure; a first electronic component over the top side of the substrate and coupled with the conductive structure; a cover over the first electronic component and coupled with a top side of the substrate, where the cover includes a top plate having a plurality of apertures; and a cover material covering a lateral side of the first electronic component and extending between the top side of the substrate and a bottom side of the top plate of the cover. Other examples and related methods are also disclosed herein.

Description

Technical Field

[0001] The present disclosure relates generally to electronic devices, and more particularly to electronic devices and methods of manufacturing electronic devices. Background Art

[0002] Previous electronic packages and methods for forming electronic packages are inadequate, for example resulting in excessive cost, reduced reliability, relatively low performance, or excessive package size. Other limitations and disadvantages of conventional and traditional methods will become apparent to those skilled in the art by comparing such methods with the present disclosure and referring to the drawings. Summary of the invention

[0003] One aspect of the present invention is an electronic device comprising: a substrate comprising a dielectric structure and a conductive structure; a first electronic component above the top side of the substrate and coupled to the conductive structure; a cover above the first electronic component and coupled to the top side of the substrate, wherein the cover comprises a top plate having a plurality of holes; and a covering material covering a lateral side of the first electronic component and extending between the top side of the substrate and the bottom side of the top plate of the cover.

[0004] In the electronic device according to an aspect of the present invention, the covering material includes: a thermal interface material between the first electronic component and the top plate; and a filling material surrounding the thermal interface material.

[0005] In the electronic device according to an aspect of the present invention, the covering material includes a liquid thermal interface material.

[0006] The electronic device according to an aspect of the present invention comprises: a second electronic component over the top side of the substrate and coupled to the conductive structure; wherein the covering material covers a lateral side of the second electronic component.

[0007] In the electronic device described in accordance with an aspect of the present invention, the cover includes a leg extending from the top plate of the cover and coupled to the top side of the substrate between the first electronic component and the side wall of the cover; the inward side of the leg defines a first cavity; the outward side of the leg and the inward side of the side wall of the cover define a second cavity; the first electronic component is in the first cavity; and the covering material is inside the first cavity and contacts the inward side of the leg.

[0008] The electronic device according to an aspect of the present invention comprises: a second electronic component over the top side of the substrate and in the second cavity; wherein the second cavity is free of the covering material.

[0009] In the electronic device according to an aspect of the present invention, the cover material contacts the top side of the substrate and the top side of the first electronic component.

[0010] Another aspect of the present invention is an electronic device comprising: a substrate comprising a dielectric structure and a conductive structure; a first electronic component above the top side of the substrate and coupled to the conductive structure; a cover above the first electronic component and coupled to the top side of the substrate, wherein the cover comprises a top plate having a plurality of holes; and a covering material covering the lateral sides of the first electronic component.

[0011] In the electronic device described in another aspect of the present invention, the covering material is between the top side of the first electronic component and the bottom side of the top plate of the cover; and the bottom side of the first electronic component does not contain the covering material.

[0012] According to another aspect of the present invention, the electronic device comprises: hole plugs in the plurality of holes.

[0013] In another aspect of the electronic device according to the present invention, the covering material includes liquid metal.

[0014] In the electronic device according to another aspect of the present invention, the covering material contacts the side wall of the cover.

[0015] In an electronic device described in another embodiment of the present invention, the cover includes a leg extending from the top plate of the cover and coupled to the top side of the substrate between the first electronic component and the side wall of the cover; wherein the leg defines a first cavity containing the first electronic component and a second cavity between the leg and the side wall; and wherein the covering material is in the first cavity and contacts the lateral sides of the leg.

[0016] In another aspect of the electronic device according to the present invention, the side wall of the cover does not contain the covering material.

[0017] According to another aspect of the present invention, the electronic device comprises: a second electronic component above the top side of the substrate and coupled to the conductive structure; wherein the second electronic component is in the second cavity and does not contain the covering material.

[0018] Another aspect of the present invention is a method for manufacturing an electronic device, comprising: providing a substrate, the substrate comprising a dielectric structure and a conductive structure; providing a first electronic component, the first electronic component being above the top side of the substrate and coupled to the conductive structure; providing a cover, the cover being above the first electronic component and coupled to the top side of the substrate, wherein the cover comprises a top plate having a plurality of holes; and providing a covering material into one of the plurality of holes; wherein the covering material covers the lateral sides of the first electronic component and extends from the top side of the substrate to the top plate of the cover.

[0019] According to yet another aspect of the invention, the method includes providing a thermal interface material between a top side of the first electronic component and a bottom side of the cover; wherein the cover material includes a filler material different from the thermal interface material.

[0020] In the method according to another aspect of the present invention, the covering material includes a thermal interface material; and the thermal interface material is between the top side of the first electronic component and the bottom side of the cover and contacts the side wall of the cover.

[0021] In a method described in accordance with another aspect of the present invention, the cover includes a leg extending from the top plate of the cover and coupled to the top side of the substrate between the first electronic component and the side wall of the cover; wherein the leg defines a first cavity containing the first electronic component and a second cavity between the leg and the side wall; and wherein the covering material is in the first cavity and contacts the lateral sides of the leg.

[0022] According to yet another aspect of the invention, the method includes providing a second electronic component above the top side of the substrate and coupled to the conductive structure; wherein the second electronic component is in the second cavity and is free of the covering material. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A cross-sectional view of an example electronic device is shown.

[0024] FIG. 2A to FIG. 2F A cross-sectional view illustrating an example method for manufacturing an example electronic device.

[0025] Figure 3 A cross-sectional view of an example electronic device is shown.

[0026] Figure 4 A cross-sectional view of an example electronic device is shown.

[0027] FIG. 5A to FIG. 5E A cross-sectional view illustrating an example method for manufacturing an example electronic device.

[0028] Figure 6 A cross-sectional view of an example electronic device is shown. DETAILED DESCRIPTION

[0029] In one example, an electronic device includes a substrate including a dielectric structure and a conductive structure, a first electronic component over a top side of the substrate and coupled to the conductive structure, a cover over the first electronic component and coupled to the top side of the substrate, the cover including a top plate having a plurality of holes, and a covering material covering lateral sides of the first electronic component and extending between the top side of the substrate and a bottom side of the top plate of the cover.

[0030] In another example, an electronic device includes a substrate including a dielectric structure and a conductive structure; a first electronic component over a top side of the substrate and coupled to the conductive structure; a cover over the first electronic component and coupled to the top side of the substrate, wherein the cover includes a top plate having a plurality of holes; and a covering material covering lateral sides of the first electronic component.

[0031] In another example, a method of manufacturing an electronic device includes providing a substrate including a dielectric structure and a conductive structure; providing a first electronic component over a top side of the substrate and coupled to the conductive structure; providing a cover over the first electronic component and coupled to the top side of the substrate, wherein the cover includes a top plate having a plurality of holes; and providing a covering material into one of the plurality of holes. The covering material covers a lateral side of the first electronic component and extends from the top side of the substrate to the top plate of the cover.

[0032] Other examples are included in the present disclosure. Such examples can be found in the drawings, claims, or description of the present disclosure.

[0033] The following discussion provides various examples of electronic devices and methods of making electronic devices. Such examples are non-limiting, and the scope of the appended claims should not be limited to the specific examples disclosed. In the following discussion, the terms "example" and "for example" are non-limiting.

[0034] Each figure illustrates a general manner of construction, and descriptions and details of well-known features and techniques may be omitted to avoid unnecessarily obscuring the present disclosure. In addition, the elements in the drawings are not necessarily drawn to scale. For example, the size of some elements in the various figures may be enlarged relative to other elements to help improve the understanding of the examples discussed in the present disclosure. The same reference numerals in different figures represent the same elements.

[0035] The term "or" means any one or more of the items in the list connected by "or". As an example, "x or y" means any one of the three-element set {(x), (y), (x, y)}. As another example, "x, y or z" means any one of the seven-element set {(x), (y), (z), (x, y), (x, z), (y, z), (x, y, z)}.

[0036] The terms "comprises / comprising" and "include / includes / including" are "open" terms and specify the presence of stated features but do not preclude the presence or addition of one or more other features. The terms "first," "second," etc. may be used herein to describe various elements; however, the elements described should not be limited by these terms. These terms are only used to distinguish one element from another. Thus, for example, a first element discussed in the present disclosure may be referred to as a second element without departing from the teachings of the present disclosure.

[0037] Unless otherwise specified, the term "coupled" may be used to describe two elements that are in direct contact with each other or to describe two elements that are indirectly coupled through one or more other elements. For example, if element A is coupled to element B, element A may be in direct contact with element B or indirectly coupled to element B through an intervening element C. Similarly, the terms "on" or "on" may be used to describe two elements that are in direct contact with each other or to describe two elements that are indirectly coupled through one or more other elements. As used herein, the term "coupled" may refer to electrical coupling or mechanical coupling.

[0038] Figure 1 1 shows a cross-sectional view of the electronic device 100. Figure 1 In the example shown, electronic device 100 may include electronic component 110, substrate 120, underfill 130, thermal interface material (TIM) 140, cover 150, external interconnect 160, and fill material 180. In some examples, electronic device 100 may include electronic component 170, which may include passive or active components.

[0039] Electronic component 110 may include side 111 and side 112 opposite side 111. Electronic component 110 may include contact pads 113 and connectors 114. Substrate 120 may include inboard side 121 and outboard side 122 opposite inboard side 121. Substrate 120 may include dielectric structure 123 and conductive structure 124. Electronic component 110 may be above the top side or inboard side 121 of substrate 120 and may be coupled with conductive structure 124. Conductive structure 124 may include substrate inboard terminal 124a and substrate outboard terminal 124b. Cover 150 may include cover hole 155 and cover adhesive 156. Cover 150 may include top plate 150a and sidewall 150b. Top plate 150a of cover 150 may include a plurality of cover holes 155. Cover 150 may be above electronic component 110 and may be coupled with top side or inboard side 121 of substrate 120. The fill material 180 may include a covering material covering the lateral sides of the electronic component 110. The fill material 180 may extend between the top side or inboard side 121 of the substrate 120 and the bottom side or top plate 150a of the cover 150. In some examples, the covering material may include the TIM 140 and the fill material 180 surrounding the TIM 140. In some examples, the electronic component 170 may be above the top side or inboard side 121 of the substrate 120 and may be coupled to the conductive structure 124. In some examples, the covering material such as the fill material 180 may cover the lateral sides of the electronic component 170.

[0040] FIG. 2A to FIG. 2F A cross-sectional view of an example method for manufacturing an example electronic device 100 is shown. Figure 2A 1 shows a cross-sectional view of an electronic device 100 at an early stage of manufacture. Figure 2A In the example shown in FIG. 1 , the electronic component 110 may be provided on the inward-facing side 121 of the substrate 120 . In some examples, the electronic component 170 may be provided on the inward-facing side 121 or the outward-facing side 122 of the substrate 120 .

[0041] The substrate 120 may include a dielectric structure 123 and a conductive structure 124. In some instances, the dielectric structure 123 may include or be referred to as one or more stacked dielectric layers. For example, the one or more dielectric layers may include one or more core layers, polymer layers, prepreg layers, or solder mask layers stacked together. One or more layers or elements of the conductive structure 124 may be interlaced with the dielectric structure 123. In some instances, the dielectric structure 123 may include or be referred to as polyimide (PI), benzocyclobutene (BCB), polybenzoxazole (PBO), resin, Ajinomoto built-up film (ABF), epoxy resin, or ceramic. In some instances, the thickness of the dielectric structure 123 may range from approximately 10 micrometers (μm) to 1000 μm.

[0042] Conductive structure 124 may include one or more conductive layers and may define a conductive path having elements such as traces, pads, vias, or wiring patterns. Conductive structure 124 may include substrate inward terminals 124a provided on the inward side 121 of substrate 120, or substrate outward terminals 124b provided on the outward side 122 of substrate 120.

[0043] The substrate inward terminal 124a may be provided on the inward side 121 of the substrate 120, and the substrate outward terminal 124b may be provided on the outward side 122 of the substrate 120. In some examples, the substrate inward terminal 124a or the substrate outward terminal 124b may be arranged in a matrix pattern, for example, provided in rows or columns. In some examples, the substrate inward terminal 124a and the substrate outward terminal 124b may include or be referred to as a conductor, a conductive material, a substrate connection pad, a conductive connection pad, a substrate pad, a wiring pad, a connection pad, a micro pad, or an under-bump metal (UBM). In some examples, the thickness of the substrate inward terminal 124a or the substrate outward terminal 124b may each be in the range from approximately 1 μm to 100 μm. The conductive structure 124 may be provided in the dielectric structure 123 to couple the substrate inward terminal 124a with the substrate outward terminal 124b. In some examples, the conductive structure 123 may include copper, iron, nickel, gold, silver, palladium, or tin.

[0044] In some examples, the substrate 120 may include or be referred to as a laminate substrate, a ceramic substrate, a rigid substrate, a glass substrate, a silicon substrate, a printed circuit board, a multilayer substrate, or a molded lead frame. In some examples, the substrate 120 may include or be referred to as a redistribution layer (RDL) substrate, a build-up substrate, or a coreless substrate. The area or "footprint" of the substrate 120 may vary based on the area or number of electronic components 110, 170 located above the substrate 120. In some examples, the substrate 120 may have an area of ​​about 20 millimeters (mm) x20 mm to about 100 mm x 100 mm. The substrate 120 may have a thickness of about 0.1 mm to about 4 mm.

[0045] In some examples, substrate 120 may be an RDL substrate. The RDL substrate may include one or more conductive redistribution layers and one or more dielectric layers, and (a) may be formed layer by layer above the electronic device to which the RDL substrate will be coupled, or (b) may be formed layer by layer above the carrier, and may be completely or at least partially removed after the electronic device and the RDL substrate are coupled together. The RDL substrate may be manufactured layer by layer as a wafer-level substrate on a circular wafer with a wafer-level process, or may be manufactured layer by layer as a panel-level substrate on a rectangular or square panel carrier with a panel-level process. The RDL substrate may be formed by an additive lamination process, and may include one or more dielectric layers alternately stacked with one or more conductive layers, and define corresponding conductive redistribution patterns or traces, which are configured to collectively (a) fan the electrical traces out of the occupied space of the electronic device, or (b) fan the electrical traces into the occupied space of the electronic device. A plating process such as an electroplating process or an electroless plating process may be used to form the conductive pattern. The conductive pattern may include a conductive material, such as copper or other plateable metals. The location of the conductive pattern can be made using a photopatterning process, such as a photolithography process and a photoresist material for forming a photolithography mask. The dielectric layer of the RDL substrate can be patterned using a photopatterning process and can include a photolithography mask through which light is exposed to the desired features of the photopattern, such as through holes in the dielectric layer. The dielectric layer can be made of a photodefinable organic dielectric material such as PI, BCB or PBO. Such dielectric materials can be spin-coated or otherwise applied in liquid form rather than attached in the form of a preformed film. In order to allow the desired photodefinable features to be properly formed, such photodefinable dielectric materials can omit structural reinforcing agents, or can be filler-free, without strands, woven fabrics or other particles, and can interfere with light from the photopatterning process. In some instances, such filler-free properties of filler-free dielectric materials can reduce the thickness of the resulting dielectric layer. Although the photoimageable dielectric material described above can be an organic material, in some instances, the dielectric material of the RDL substrate can include one or more inorganic dielectric layers. Some examples of one or more inorganic dielectric layers may include silicon nitride (Si3N4), silicon oxide (SiO2), or silicon oxynitride (SiON). One or more inorganic dielectric layers may be formed by growing inorganic dielectric layers using an oxidation or nitridation process rather than using a photo-defined organic dielectric material. Such inorganic dielectric layers may be filler-free without strands, woven fabrics, or other different inorganic particles. In some examples, the RDL substrate may omit a permanent core structure or carrier, such as a dielectric material including bismaleimide triazine (BT) or FR4, and these types of RDL substrates may include or be referred to as coreless substrates.

[0046] In some examples, substrate 120 may be a preformed substrate. The preformed substrate may be manufactured before being attached to an electronic device and may include a dielectric layer between corresponding conductive layers. The conductive layer may include copper and may be formed using an electroplating process. The dielectric layer may be a relatively thick non-photodefinable layer and may be attached in the form of a preformed film rather than in the form of a liquid, and may include a resin having fillers such as strands, woven fabrics or other inorganic particles for rigidity or structural support. Since the dielectric layer is not photoimageable, features such as through holes or openings may be formed by using drilling or lasers. In some examples, the dielectric layer may include prepreg materials or ABF. The preformed substrate may include a permanent core structure or carrier, such as a dielectric material including BT or FR4, and the dielectric layer and the conductive layer may be formed on the permanent core structure. In other examples, the preformed substrate may be a coreless substrate and the permanent core structure may be omitted, and the dielectric layer and the conductive layer may be formed on a sacrificial carrier, which is removed after the dielectric layer and the conductive layer are formed and before being attached to the electronic device. The preformed substrate may also be referred to as a printed circuit board (PCB) or a laminate substrate. Such a preformed substrate may be formed by a semi-additive process or a modified semi-additive process. Other substrates in the present disclosure may also include a preformed substrate.

[0047] Electronic component 110 may be provided on an inward side 121 of substrate 120. In some examples, electronic component 110 may be located proximate to the center of inward side 121 of substrate 120. Electronic component 110 may include side 111 and side 112. Side 112 of electronic component 110 may be opposite side 111 of electronic component 110. In some examples, side 111 of electronic component 110 may include or be referred to as an active side, and side 112 of electronic component 110 may include or be referred to as an inactive side. Electronic component 110 may include a sidewall connecting side 111 of electronic component 110 to side 112 of electronic component 110. In some examples, electronic component 110 may include or be referred to as a die, a chip, or a package.

[0048] Electronic component 110 may include contact pads 113. Contact pads 113 may be provided in rows or columns on side 111 of electronic component 110. Contact pads 113 may be input / output terminals of electronic component 110. In some examples, contact pads 113 may be RDL pads exposed through a dielectric material of electronic component 110. In some examples, the dielectric material of electronic component 110 may be silicon nitride (SiN) or silicon dioxide (SiO2).

[0049] The electronic component 110 may include a connector 114 coupled to a contact pad 113 of the electronic component 110. In some examples, the connector 114 may include or be referred to as a bump, a tin-lead (SnPb) solder bump, a lead-free bump, a copper-phosphorus (CuP), a pillar bump, a pillar, or a pillar. In some examples, the connector 114 may be provided on the contact pad 113 of the electronic component 110 by electroless plating, sputtering, deposition, such as physical vapor deposition (PVD), chemical vapor deposition (CVD), metal organic chemical vapor deposition (MOCVD), atomic layer deposition (ALD), low pressure chemical vapor deposition (LPCVD), or plasma enhanced chemical vapor deposition (PECVD). For example, after a photoresist pattern for exposing the contact pad 113 of the electronic component 110 is provided on the side 111 of the electronic component 110, the connector 114 may be provided so as to contact the exposed contact pad 113 of the electronic component 110. In some examples, the thickness of connector 114 may be from approximately 1.0 μm to approximately 50 μm.

[0050] In some examples, a pick-and-place device may pick up the electronic component 110 and place the electronic component 110 on the inward side 121 of the substrate 120. The connector 114 of the electronic component 110 may be positioned on the substrate inward terminal 124a. Subsequently, the connector 114 of the electronic component 110 may be coupled to the substrate inward terminal 124a of the substrate 120 by a reflow process, a thermal compression process, a laser assisted bonding (LAB) process, or a hybrid bonding process. The electronic component 110 may be coupled to the conductive structure 124 of the substrate 120 through the connector 114. In some examples, the overall thickness of the electronic component 110 may range from approximately 0.05 mm to approximately 4.0 mm, and the area of ​​the electronic component 110 may range from approximately 0.1 mm x 0.1 mm to approximately 70 mm x 70 mm.

[0051] In some examples, the electronic component 110 can include a metallization layer 115 in contact with the side 112 of the electronic component 110. In some examples, the metallization layer 115 can include or be referred to as a backside metallization (BSM), a plating layer, a conductive film, or a conductive layer. The metallization layer can include, for example, one or more layers of nickel (Ni), copper (Cu), titanium (Ti), or gold (Au).

[0052] In some examples, one or more electronic components 170 may be disposed over the inward side 121 of the substrate 120. The electronic components 170 may be positioned outside the electronic component 110. For example, the electronic components 170 may be laterally located between the electronic component 110 and the lateral edge of the substrate 120. In some examples, one or more of the electronic components 170 may include passive components, such as capacitors, resistors, inductors, etc. In some examples, one or more of the electronic components 170 may include active components, such as semiconductor dies, chips, or packages. In some examples, one or more of the electronic components 170 may include antenna patches. Component terminals of the electronic components 170 may be coupled to substrate inward terminals 124a on the inward side 121 of the substrate 120. In some examples, one or more of the electronic components may be coupled to substrate outward terminals 124b on the outward side 122 of the substrate 120. In some examples, the electronic components 170 may be electrically coupled to the electronic component 110 through the conductive structure 124.

[0053] Figure 2B The electronic device 100 is shown in a later stage of manufacturing. Figure 2B In the example shown, bottom filler 130 may be provided between electronic component 110 and substrate 120. Bottom filler 130 may contact side 111 of electronic component 110 and inward side 121 of substrate 120. In some examples, bottom filler 130 does not cover the lateral side of electronic component 110. In other examples, bottom filler may partially cover or completely cover the lateral side of electronic component 110. In some examples, bottom filler 130 may contact connector 114 of electronic component 110. Bottom filler 130 may include or be referred to as a dielectric layer or non-conductive paste, or may not contain inorganic filler. In some examples, bottom filler 130 may include or be referred to as capillary bottom filler (CUF), non-conductive paste (NCP), non-conductive film (NCF), anisotropic conductive film (ACF) or anisotropic conductive paste (ACP).

[0054] In some examples, the underfill 130 may be cured after being inserted between the electronic component 110 and the substrate 120. The underfill 130 may prevent or reduce separation of the electronic component 110 from the substrate 120 due to, for example, physical or chemical influences.

[0055] Figure 2C The electronic device 100 is shown in a later stage of manufacturing. Figure 2CIn the example shown, a thermal interface material (TIM) 140 may be provided on the side 112 of the electronic component 110, and a cover adhesive 156 may be provided on the inward side 121 of the substrate 120. The TIM 140 may contact the side 112 of the electronic component 110. When the electronic component 110 includes a metallization layer 115 provided on the side 112, the bonding strength and thermal conduction between the TIM 140 and the electronic component 110 may be increased (e.g., the metallization layer 115 may improve the bonding of the TIM 140 to the electronic component 110 and the heat transfer from the electronic component 110 to the TIM 140). It should be understood that the metallization layer 115 may be considered as part of the electronic component 110, such that contact with the top side of the electronic component 110 may mean contact with the metallization layer 115 of the electronic component 110. In some examples, the TIM 140 may include a metal TIM or a polymer TIM. The TIM 140 may include a thermally conductive material. Examples of such thermal interface materials include metal alloy materials such as gallium, gallium alloys (e.g., alloys with indium, tin, and zinc), silver alloys, tin-silver, indium, and indium alloys. The thermally conductive material of TIM 140 allows heat generated by electronic component 110 to be easily transferred to cover 150 ( Figure 1 ). TIM 140 may be applied to side 112 of electronic component 110 by dispensing or printing. In some examples, TIM 140 may be attached to side 112 of electronic component 110 in the form of a film. The thickness of TIM 140 may range from approximately 10 μm to approximately 300 μm.

[0056] The cover adhesive 156 may be provided along the edge of the inner side 121 of the substrate 120. The cover adhesive 156 may include a dielectric material or a conductive material. For example, the cover adhesive 156 may include a polymer or a solder. The cover adhesive 156 may be applied to the inner side 121 of the substrate 120 by dispensing or printing. The height of the cover adhesive 156 may range from approximately 10 μm to approximately 300 μm.

[0057] Figure 2D The electronic device 100 is shown in a later stage of manufacturing. Figure 2D In the example shown, the cover 150 can be provided on the inner side 121 of the substrate 120. The cover 150 can be located above the electronic components 110 and 170. The cover 150 may include a top plate 150a and a side wall 150b. The side wall 150b may extend downward from the edge (or periphery) of the top plate 150a. In some examples, the top plate 150a may include a rectangular, square, quadrilateral or any other desired shape. In some examples, the top plate 150a may include one or more grooves, one or more protrusions or one or more fins on the top side of the top plate 150a for enhancing heat dissipation efficiency.

[0058] In some examples, the sidewall 150b may be in the form of a ring that extends continuously around the periphery of the top plate 150a or the substrate 120. A cavity may be provided inside the sidewall 150b and the top plate 150a of the cover 150. For example, the sidewall 150b, the top plate 150a, and the inward side 121 of the substrate 120 may define a cavity. The electronic component 110 may be located in the cavity of the cover 150. The cover 150 may cover the electronic component 110. In some examples, the lower side of the top plate 150a may be coupled to the side 112 of the electronic component 110 through the TIM 140. The lower side of the sidewall 150b may be coupled to the inward side 121 of the substrate 120 through the cover adhesive 156.

[0059] According to various examples, the cover 150 includes a cover hole 155. The cover hole 155 may be provided in the top plate 150a and may extend between a top-facing or outward-facing side and a bottom-facing or inward-facing side of the top plate 150a of the cover 150. The cover 150 may include two or more cover holes 155. For example, Figure 2DA and Figure 2DB A plan view of an example cover 150 is shown. Figure 2DA In the example shown, the cover holes 155 may include two cover holes in the top plate 150a. Figure 2DB In the example shown, the cover holes 155 may include three cover holes in the top plate 150a. The cover holes 155 may include: a filling hole 155a for inserting Figure 2E The fill material 180 shown is injected into the cavity of the cover 150; and one or more discharge holes 155b, through which a fluid such as air can be discharged in response to the injection of the fill material 180. In some examples, the cover holes 155 can be provided at symmetrical positions around the top plate 150a. In some examples, the cover hole 155 can also be located at the center of the top plate 150a, such as Figure 2DB As shown. Although the cover hole 155 is shown as being close to the corner area of ​​the top plate 150a, it is further contemplated and understood that the location of the filling hole 155a and the discharge hole 155b can be at any desired location in the top plate 150a. In addition, the top plate 150a can include any number of filling holes 155a and any number of discharge holes 155b. In some examples, the cover hole 155 may include or be referred to as an opening or orifice. In some examples, the size or diameter of the cover hole 155 can range from approximately 500μm to approximately 3000μm.

[0060] The cover 150 may be made of a metal with high thermal conductivity and radiation. For example, the cover 150 may include aluminum, nickel, or copper. In some examples, the cover 150 may include or be referred to as a heat sink, a heat sink, a cap cover, an encapsulation, a protective portion, a package, or a body. Although the sidewall 150b is shown as not being orthogonal to the top plate 150a, it is contemplated and understood that in some examples, the sidewall 150b may be orthogonal to the top plate 150a.

[0061] Figure 2E The electronic device 100 is shown in a later stage of manufacturing. Figure 2E In the example shown, the filling material 180 may be provided in the cavity of the cover 150. The filling material 180 may be cured after being provided to the cavity of the cover 150. The filling material 180 may be provided into the cavity through the cover hole 155 of the cover 150. Two or more cover holes 155 may be provided, so that even when the filling material 180 is injected through one cover hole 155, internal fluid such as air may be discharged through the other cover holes 155. Since two or more cover holes 155 are provided, the generation of voids in the filling material 180 may be prevented or mitigated.

[0062] The fill material 180 may contact the sidewalls of the electronic component 110, the inner side 121 of the substrate 120, the sidewalls of the bottom fill 130, the sidewalls of the TIM 140, and the electronic component 170. The fill material 180 may also contact the inner side of the cover 150. The fill material 180 may surround the TIM 140. The fill material 180 may prevent or ease the separation of the TIM 140 from the electronic component 110. The fill material 180 may prevent or ease the separation of the TIM 140 from the cover 150. In some examples, the fill material 180 may include a covering material including an epoxy resin adhesive, such as a liquid molding compound (LMC), CUF, NCP, or ACP. In some examples, the fill material 180 and the TIM 140 may include the same material. In other examples, the fill material 180 and the TIM 140 may include different materials. In some examples, underfill 130 may be eliminated and fill material 180 may include a mold underfill. For example, fill material 180 may be located between side 111 of electronic component 110 and inward side 121 of substrate 120. Generally, TIM 140 and fill material 180 may be referred to as a capping material.

[0063] Figure 2F The electronic device 100 is shown in a later stage of manufacturing. Figure 2FIn the example shown, the external interconnect 160 may be provided on the outer side 122 of the substrate 120. The external interconnect 160 may be coupled to the substrate outward terminal 124b. In some examples, the external interconnect 160 may include tin (Sn), silver (Ag), lead (Pb), copper (Cu), Sn-Pb, Sn37-Pb, Sn95-Pb, Sn-Pb-Ag, Sn-Cu, Sn-Ag, Sn-Au, Sn-Bi, or Sn-Ag-Cu. For example, the external interconnect 160 may be provided by a reflow process after forming a conductive material containing solder on the substrate outward terminal 124b by a ball drop method. The external interconnect 160 may include or be referred to as a conductive ball such as a solder ball, a conductive pillar such as a copper pillar, a conductive pillar having a solder cap formed over a copper pillar, a bump, or a pad. In some examples, the size of the external interconnect 160 may range from approximately 25 μm to approximately 350 μm. In some examples, the external interconnect 160 may be referred to as an external input / output terminal of the electronic device 100. In some examples, the electronic device 100 may be a land grid array (LGA) in which the substrate-outward terminals 124 b serve as external input / output terminals without the external interconnect 160.

[0064] In some examples, singulation may be performed to separate the substrate 120 into individual electronic devices 100. In some examples, the cover 150 may also be cut / segmented during singulation. According to various examples, the electronic device 100 may include an electronic component 110, a substrate 120, an underfill 130, a TIM 140, a cover 150, an external interconnect 160, an electronic component 170, and a filler material 180. In the electronic device 100, the filler material 180 may prevent or mitigate separation or peeling of the TIM 140 from the electronic component 110 or the cover 150 by reducing thermal stress. For example, the filler material 180 may reduce or eliminate distortion or deformation caused by a thermal expansion coefficient of the substrate 120 being different from a thermal expansion coefficient of the cover 150. Reducing distortion or deformation reduces the occurrence of separation of the TIM 140 from the electronic component 110 or the cover 150.

[0065] Figure 3 A cross-sectional view of an example electronic device 200 is shown. Figure 3 In the example shown, the electronic device 200 may include the electronic component 110 , the substrate 120 , the underfill 130 , the TIM 140 , the cover 250 , the external interconnect 160 , the electronic component 170 , and the fill material 280 .

[0066] Electronic device 200 may be similar to electronic device 100. For example, electronic device 200 may be similar to electronic device 100 in terms of electronic component 110, substrate 120, underfill 130, TIM 140, external interconnect 160, and electronic component 170. In addition, electronic device 200 may include cover 250 and fill material 280.

[0067] Cover 250 may include a top plate 150a and sidewalls 150b extending downward from the edge of top plate 150a. The elements, features, materials or manufacturing methods of top plate 150a and sidewalls 150b of cover 250 may be similar or identical to those of top plate 150a and sidewalls 150b of cover 150, respectively.

[0068] The cover 250 may include a leg 257 spaced apart from the side wall 150b in the inward direction of the cover. The leg 257 may extend downward from the top plate 150a of the cover 250. The leg 257 may cover the side wall of the electronic component 110. In some examples, the leg 257 may include a ring that extends continuously around the electronic component 220. The inwardly facing side wall of the leg 257 and the inwardly facing side of the top plate 150a may form or define a first cavity or an inner cavity of the cover 250. The outwardly facing side wall of the leg 257, the inwardly facing side of the top plate 150a, and the inwardly facing side of the side wall 150b may form or define a second (or outer) cavity of the cover 250. The electronic component 110 may be located in the inner cavity defined by the leg 257, such as the first cavity, and the electronic component 170 may be located in the outer cavity between the leg 257 and the side wall 150b, such as the second cavity. The lower side of the legs 257 may be coupled to the inward side 121 of the substrate 120 via the cover adhesive 256 .

[0069] The cover 250 may include a cover hole 155 that penetrates between the top side and the bottom side of the top plate 150a. The cover hole 155 may be more centrally located than the legs 257 on the cover 250. For example, the legs 257 may be located between the cover hole 155 and the edge of the cover plate 150a. The cover hole 155 may be provided in the area between the legs 257 and the electronic component 110. The elements, features, or manufacturing methods of the cover hole 155 of the cover 250 may be similar to or the same as those of the cover hole 155 of the cover 150.

[0070] The fill material 280 may be provided in the inner cavity defined by the legs 257. The fill material 280 may contact the sidewalls of the electronic component 110, the inner side 121 of the substrate 120, the sidewalls of the bottom fill 130, the sidewalls of the TIM 140, and the inner side of the cover 250. The fill material 280 may contact the top plate 150a of the cover 250 and the legs 257. The fill material 280 may surround the TIM 140. The elements, features, materials, or manufacturing methods of the fill material 280 may be similar to or the same as those of the fill material 180. In the illustrated example, since the fill material 280 is provided only in the legs 257 defined by the inner cavity, unnecessary material consumption may be prevented or the weight of the device 200 may be reduced. In some examples, the legs 257 may allow the use of a conductive material for the fill material 280 because the legs 257 block the fill material from contacting the electronic component 170. In some examples, fill material 280 and TIM 140 may include the same material. In other examples, fill material 280 and TIM 140 may include different materials. In general, TIM 140 and fill material 280 may be referred to as a capping material.

[0071] Figure 4 A cross-sectional view of an example electronic device 300 is shown. Figure 4 In the example shown, the electronic device 300 may include the electronic component 110, the substrate 120, the bottom filler 130, the TIM 340, the cover 350, and the external interconnect 160. The electronic device 300 may be similar to the electronic device 100. For example, the electronic device 300 may be similar to the electronic device 100 in terms of the electronic component 110, the substrate 120, the bottom filler 130, and the external interconnect 160. In the example shown, the electronic device 300 may include the TIM 340 and the cover 350. In some examples, the electronic device 300 may not contain the electronic component 170. The cover 350 may include the cover hole 155, the cover adhesive 156, and the hole plug 358. The cover 350 may include the top plate 150a and the sidewall 150b. Generally speaking, the TIM 340 may be referred to as a cover material.

[0072] In some examples, the substrate 120 may include a dielectric structure 123 and a conductive structure 124. The electronic component 110 may be above the top side or inner side 121 of the substrate 120 and may be coupled to the conductive structure 120. The cover 350 may be above the substrate 120 and may be coupled to the top side or inner side 121 of the substrate 120. The cover 350 may include a top plate 150a having a plurality of cover holes 155. A cover material such as a TIM 340 may cover the lateral sides of the electronic component 110. The cover material including the TIM 340 may be between the top side 112 of the electronic component 110 and the bottom side of the top plate 150a of the cover 350. In some examples, the bottom side 111 of the electronic component 110 may be free or include the cover material of the TIM 340. In some examples, the TIM 340 may include a liquid such as a liquid metal. In some examples, the TIM 340 may cover or contact the sidewall 150b of the cover 350.

[0073] FIG. 5A to FIG. 5E A cross-sectional view of an example method for fabricating an example electronic device, such as electronic device 300 , is shown. Figure 5A Shown in a similar Figure 2A and Figure 2B The electronic device 300 is an early stage of manufacturing process after the manufacturing process steps of the electronic device 100 shown in FIG. Figure 5A In the example shown, the cover adhesive 156 may be provided on the inner side 121 of the substrate 120. The cover adhesive 156 may be provided along the edge of the inner side 121 of the substrate 120. The elements, features, materials, or manufacturing methods of the cover adhesive 156 may be similar or the same as those of the cover adhesive 156 of the electronic device 100.

[0074] Figure 5B The electronic device 300 is shown in a later stage of manufacturing. Figure 5B In the example shown, the cover 350 may be provided on the inner side 121 of the substrate 120. The cover 350 may include a top plate 150a and a side wall 150b extending downward from the top plate 150a. The lower side of the side wall 150b may couple the cover 350 to the inner side 121 of the substrate 120 through a cover adhesive 156. The electronic component 110 may be located in a cavity defined by the top plate 150a and the side wall 150b of the cover 350. Two or more cover holes 155 may be provided in the top plate 150a of the cover 350. The elements, features, materials, or manufacturing methods of the cover 350 may be similar to or the same as those of the cover 150. According to various examples, the lower side of the top plate 150a may be spaced apart from the side 112 of the electronic component 110.

[0075] Figure 5C The electronic device 300 is shown in a later stage of manufacturing. Figure 5CIn the example shown, TIM 340 may be deposited in the cavity of cover 350. TIM 340 may contact side 112 and sidewalls of electronic component 110, inward side 121 of substrate 120, inner side of sidewall 150b, and sidewalls of bottom filler 130. In some examples, TIM 340 may fill the cavity of cover 350 and contact the lower side of top plate 150a. In some examples, at least a portion of one or more sidewalls of electronic component 110 are exposed from bottom filler 130, and TIM 340 may contact one or more of the sidewalls of electronic component 110. In some examples, TIM 340 may be inserted between side 112 of electronic component 110 and top plate 150a of cover 350. TIM 340 may transfer heat generated from electronic component 110 to cover 350. When the electronic component 110 includes the metallization layer 115, the contact or bonding force between the TIM 340 and the side 112 of the electronic component 110 can be enhanced. It should be understood that the metallization layer 115 can be considered as part of the electronic component 110, so that contact with the top side of the electronic component 110 can mean contact with the metallization layer 115 of the electronic component 110.

[0076] Two or more cover holes 155 may be provided in the cover 350 so that when the TIM 340 is injected through one of the cover holes 155, internal fluid such as air may be discharged through the other cover holes 155. Since two or more cover holes 155 are provided, generation of voids in the TIM 340 may be prevented or mitigated. Elements, features, or manufacturing methods of the cover holes 155 in the cover 350 may be similar to or the same as those of the cover holes 155 of the cover 150.

[0077] In some examples, TIM 340 may include a metal TIM or a polymer TIM. For example, TIM 340 may include a thermally conductive material such as a metal material, such as solder or solder paste. The thermally conductive material of TIM 340 allows heat generated from electronic component 110 to be easily transferred to cover 350. In some examples, TIM 340 may include a gallium-indium-based alloy, such as eutectic gallium-indium (EGaIn) or a gallium (Ga), indium (In), and tin (Sn) alloy (e.g., ). In some examples, EGaIn may include 75.5% by weight Ga and 24.5% by weight In. In some examples, the Ga, In, and Sn alloy may include about 68.5% by weight Ga, about 21.5% by weight In, and about 10.0% by weight Sn, as used only in the preceding context, the term "about" means ±5.0%.

[0078] According to various examples, the TIM 340 may include or be referred to as a cover material, which may be in liquid form at room temperature. The liquid state of the TIM 340 may allow the TIM 340 to remain in contact with the cover 350 and the electronic component 110, even if distortion or deformation occurs due to the difference in thermal expansion coefficients of the substrate 120 and the cover 350. The TIM 340 maintaining contact with the electronic component 110 and the cover 350 allows heat generated from the electronic component 110 to be transferred to the cover 350, even if one or more components of the electronic device 300 are distorted. In this regard, the TIM 340 tends to improve the thermal reliability of the electronic device 300. In some examples, the TIM 340 may contact the side 112 of the electronic component 100 and the side wall of the electronic component 110. In this arrangement, heat may be dissipated from the side 112 of the electronic component 110 into the TIM 340 in the vertical direction, and heat may also be dissipated from the side wall of the electronic component 110 into the TIM 340 in the horizontal direction. In some examples, electronic device 300 may include TIM 140 between side 112 of electronic component 110 and top plate 150a, and TIM 340 may surround or contact TIM 140. Generally, TIM 340 or a combination of TIM 340 and TIM 140 may be referred to as a cover material.

[0079] Figure 5D The electronic device 300 is shown in a later stage of manufacturing. Figure 5D In the example shown, a hole plug 358 may be provided to the cover hole 155 of the cover 350. The cover hole 155 may be closed and sealed by the hole plug 358. The hole plug 358 may prevent the TIM 340 in the cavity of the cover 350 from leaking out of the cover hole 155. The hole plug 358 may be made of metal or an insulating material. The hole plug 358 may be provided by applying solder paste or epoxy resin adhesive to the cover hole 155. The hole plug 358 may include an elastic member, such as rubber, and may be inserted into the cover hole 155 in a state of being pressed into the cover hole 150. For example, before being inserted into the cover hole 155, the hole plug 358 may have a larger diameter than the cover hole 155, and the cover plug 358 may be held in place by friction coupling. In some examples, the cover plug 358 may be coupled to the top plate 150a using an adhesive.

[0080] Figure 5E The electronic device 300 is shown in a later stage of manufacturing. Figure 5E In the example shown, external interconnect 160 may be provided on outer side 122 of substrate 120. Elements, features, materials, or manufacturing methods of external interconnect 160 of electronic device 300 may be similar or identical to those of external interconnect 160 of electronic device 100.

[0081] In some examples, singulation may be performed to separate the substrate 120 into individual electronic devices 300. In some examples, the cover 350 may also be cut / segmented during singulation. According to various examples, the electronic device 300 may include the electronic component 110, the substrate 120, the underfill 130, the TIM 340, the cover 350, and the external interconnect 160. In the electronic device 300, separation of the TIM 340 from the electronic component 110 or the cover 350 may be prevented or mitigated. For example, the TIM 340 being in a liquid form allows the TIM 340 to maintain contact with the electronic component 110 and the cover 350 even in response to distortion or deformation, which may be caused, for example, by a difference in thermal expansion coefficients of the electronic component 110 and the cover 350.

[0082] Figure 6 A cross-sectional view of an example electronic device 400 is shown. Figure 4 In the example shown, electronic device 400 may include electronic component 110, substrate 120, underfill 130, TIM 440, cover 450, external interconnect 160, and electronic component 170. Electronic device 400 may be similar to electronic device 100. For example, electronic device 400 may be similar to electronic device 100 in terms of electronic component 110, substrate 120, underfill 130, external interconnect 160, and electronic component 170. Electronic device 400 may include cover 450 and TIM 440.

[0083] In the electronic device 400, the electronic component 110 may be located in an internal cavity defined by the inward-facing side of the legs 257 and the inward-facing side of the top plate 150a, and one or more of the electronic components 170 may be located in an outward cavity defined between the outward-facing side of the legs 257, the inward-facing side of the top plate 150a, and the inward-facing side of the sidewall 250b. In some examples, the legs 257 may extend from the top plate 150a of the cover 450 between the electronic component 110 and the sidewall 150b of the cover 450. The lower side of the legs 257 may be coupled to the top side or inward side 121 of the substrate 120 by the cover adhesive 256. The elements, features, materials, or manufacturing methods of the cover 450 may be similar to or the same as those of the cover 250 of the electronic device 200. In the current example, the cover 450 may include a hole plug 458. Elements, features, materials, or manufacturing methods of the via plug 458 may be similar or identical to those of the via plug 358 of the electronic device 300 .

[0084] TIM 440 may be within the internal cavity in which electronic device 110 is located. In some examples, TIM 440 may cover or contact the inward side of leg 257. TIM 440 may cover or contact the sidewalls and side 112 of electronic component 110, the inward side 121 of substrate 120, the sidewalls of bottom filler 130, and the inner side of cover 450. TIM 440 may be inserted between the lower side of top plate 150a and side 112 of electronic component 110. The elements, features, materials, or manufacturing methods of TIM 440 may be similar to or the same as those of TIM 340. In some examples where TIM 440 is provided only in the inward cavity defined by leg 257, unnecessary material consumption may be reduced or prevented. In such examples, the outward cavity is free of covering materials such as TIM 440. In some examples, electronic component 170 may be free of covering materials such as TIM 440. Since the TIM 440 does not contact the electronic component 170, short circuits can be prevented or mitigated. In some examples, the TIM 440 can contact the side 112 of the electronic component 100 and the sidewalls of the electronic component 110. In some examples, the cover material such as the TIM 440 can contact the top side or inward side 121 of the substrate 120. In this arrangement, heat can be dissipated from the side 112 of the electronic component 110 into the TIM 440 in a vertical direction, and heat can also be dissipated from the sidewalls of the electronic component 110 into the TIM 440 in a horizontal direction. In some examples, the electronic device 400 can include the TIM 140 between the side 112 of the electronic component 110 and the top plate 150a, and the TIM 440 can surround or contact the TIM 140. In some examples, the sidewall 150b of the cover 450 can be free of the TIM 440. Generally speaking, TIM 440 or a combination of TIM 440 and TIM 140 may be referred to as a cover material.

[0085] The present disclosure includes references to certain examples. However, it will be appreciated by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the present disclosure. In addition, modifications may be made to the disclosed examples without departing from the scope of the present disclosure. Therefore, it is intended that the present disclosure is not limited to the disclosed examples, but that the present disclosure will include all examples within the scope of the appended claims.

Claims

1. An electronic device, characterized in that: include: a substrate including a dielectric structure and a conductive structure; a first electronic component over the top side of the substrate and coupled to the conductive structure; a cover over the first electronic component and coupled to the top side of the substrate, wherein the cover comprises a top plate having a plurality of holes; as well as A covering material covers lateral sides of the first electronic component and extends between the top side of the substrate and a bottom side of the top plate of the cover.

2. The electronic device according to claim 1, wherein: The covering material comprises: a thermal interface material between the first electronic component and the top plate; and A fill material is placed around the thermal interface material.

3. The electronic device according to claim 1, wherein: The cover material includes a liquid thermal interface material.

4. The electronic device according to claim 1, characterized in that: include: a second electronic component over the top side of the substrate and coupled to the conductive structure; The covering material covers lateral sides of the second electronic component.

5. The electronic device according to claim 1, wherein: the cover comprising a leg extending from the top plate of the cover and coupled to the top side of the substrate between the first electronic component and a side wall of the cover; The inboard side of the legs defines a first cavity; The outwardly facing sides of the legs and the inwardly facing sides of the sidewalls of the cover define a second cavity; The first electronic component is in the first cavity; and The covering material is interior to the first cavity and contacts the inwardly facing side of the leg.

6. The electronic device according to claim 5, characterized in that: include: a second electronic component over the top side of the substrate and in the second cavity; The second cavity does not contain the covering material.

7. The electronic device according to claim 5, characterized in that: The cover material contacts the top side of the substrate and a top side of the first electronic component.

8. An electronic device, characterized in that: include: a substrate including a dielectric structure and a conductive structure; a first electronic component over the top side of the substrate and coupled to the conductive structure; a cover over the first electronic component and coupled to the top side of the substrate, wherein the cover comprises a top plate having a plurality of holes; as well as A covering material covers lateral sides of the first electronic component.

9. The electronic device according to claim 8, characterized in that: The covering material is between a top side of the first electronic component and a bottom side of the top plate of the cover; and The bottom side of the first electronic component is free of the covering material.

10. The electronic device according to claim 8, characterized in that: include: Hole plugs are provided in the plurality of holes.

11. The electronic device according to claim 8, characterized in that: The covering material includes liquid metal.

12. The electronic device according to claim 8, characterized in that: The covering material contacts the side walls of the cover.

13. The electronic device according to claim 8, characterized in that: the cover comprising a leg extending from the top plate of the cover and coupled to the top side of the substrate between the first electronic component and a side wall of the cover; wherein the leg defines a first cavity containing the first electronic component and a second cavity between the leg and the sidewall; and Wherein the covering material is in the first cavity and contacts lateral sides of the legs.

14. The electronic device according to claim 13, characterized in that: The side walls of the cover are free of the covering material.

15. The electronic device according to claim 13, characterized in that: include: a second electronic component over the top side of the substrate and coupled to the conductive structure; The second electronic component is in the second cavity and does not contain the covering material.

16. A method for manufacturing an electronic device, characterized in that: include: providing a substrate, the substrate comprising a dielectric structure and a conductive structure; providing a first electronic component over the top side of the substrate and coupled to the conductive structure; providing a cover over the first electronic component and coupled to a top side of the substrate, wherein the cover comprises a top plate having a plurality of holes; as well as providing a covering material into one of the plurality of holes; Wherein the covering material covers lateral sides of the first electronic component and extends from the top side of the substrate to the top plate of the cover.

17. The method according to claim 16, characterized in that include: providing a thermal interface material between a top side of the first electronic component and a bottom side of the cover; The cover material includes a filling material different from the thermal interface material.

18. The method according to claim 16, characterized in that: The cover material comprises a thermal interface material; and The thermal interface material is between a top side of the first electronic component and a bottom side of the cover and contacts a sidewall of the cover.

19. The method according to claim 16, characterized in that: the cover comprising a leg extending from the top plate of the cover and coupled to the top side of the substrate between the first electronic component and a side wall of the cover; wherein the leg defines a first cavity containing the first electronic component and a second cavity between the leg and the sidewall; and Wherein the covering material is in the first cavity and contacts lateral sides of the legs.

20. The method according to claim 19, characterized in that include: providing a second electronic component over the top side of the substrate and coupled to the conductive structure; The second electronic component is in the second cavity and does not contain the covering material.

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