Vapor chamber, electronic equipment and processing method

Abstract

The invention provides a uniform temperature plate, which comprises a lower cover body provided with a containing groove and a plurality of strip-shaped grooves, and the plurality of strip-shaped grooves are formed in the bottom wall of the containing groove at intervals and are arranged in parallel; the upper cover body covers the containing groove in a sealing mode, and a containing cavity is defined by the upper cover body and the lower cover body; the capillary structure is connected with the bottom wall of the containing groove and seals and covers the strip-shaped grooves; the supporting body is contained in the containing cavity, one end of the supporting body is connected with the upper cover body, and the other end of the supporting body abuts against the capillary structure; and the fluid medium is filled in the accommodating cavity. The invention further provides electronic equipment comprising the electronic element and the vapor chamber, and a processing method for forming the vapor chamber. According to the vapor chamber, the electronic equipment and the processing method, the capillary structures directly cover the strip-shaped grooves in a sealing mode, the fluid medium condensed through the capillary structures can directly flow into the strip-shaped grooves along the capillary structures to form backflow, the flowing distance from the fluid medium after condensation to the fluid medium before backflow is shortened, the backflow efficiency is improved, and the service life of the vapor chamber is prolonged. Therefore, the heat dissipation efficiency of the vapor chamber is improved.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a temperature homogenizing plate, an electronic device and a processing method. Background Art

[0002] The temperature equalizer is widely used in electronic devices because of its good heat transfer performance. It is used to quickly conduct away the heat generated by the electronic devices to improve the heat dissipation effect of the electronic devices. At present, the temperature equalizer generally includes an upper cover, a lower cover and a support body. The inner surface of the upper cover and the inner surface of the lower cover are respectively provided with capillary structures. The space between the upper cover and the lower cover is filled with a fluid medium. During operation, the upper cover or the lower cover contacts the electronic components in the electronic device, and the heat generated by the electronic components is conducted through the condensation reflux of the fluid medium. However, there is a certain gap between the capillary structures on the upper cover and the lower cover due to the support body provided, which reduces the speed of the condensation reflux of the fluid medium, resulting in low heat dissipation efficiency of the temperature equalizer. Summary of the invention

[0003] In view of the above, it is necessary to provide a temperature homogenizer, an electronic device and a processing method to improve the heat dissipation efficiency.

[0004] The present application provides a temperature homogenizing plate, comprising:

[0005] The lower cover body is provided with a receiving groove and a plurality of strip grooves, wherein the plurality of strip grooves are spaced apart and arranged in parallel on the bottom wall of the receiving groove;

[0006] An upper cover body, covering the receiving groove, and enclosing with the lower cover body to form a receiving cavity;

[0007] A capillary structure connected to the bottom wall of the containing groove and covering the plurality of strip grooves;

[0008] A support body is received in the accommodating cavity, one end of the support body is connected to the upper cover body, and the other end of the support body is in contact with the capillary structure;

[0009] A fluid medium is filled in the containing cavity.

[0010] In some embodiments, the depth of each of the strip-shaped grooves is equal to the depth of the receiving groove.

[0011] In some embodiments, the width and depth of each of the strip-shaped grooves are equal, and the width of each of the strip-shaped grooves ranges from 0.04 mm to 0.1 mm.

[0012] In some embodiments, the sum of the depth of each of the strip-shaped grooves and the depth of the receiving groove is less than or equal to half of the thickness of the lower cover body.

[0013] In some embodiments, the plurality of strip-shaped grooves are arranged at equal intervals, and the interval between two adjacent strip-shaped grooves is greater than the width of the strip-shaped grooves.

[0014] In some embodiments, the capillary structure is a grid structure, and the mesh number of the capillary structure ranges from 100 mesh to 200 mesh.

[0015] In some embodiments, the capillary structure is formed by etching a copper plate.

[0016] In some embodiments, the support comprises:

[0017] A plurality of support blocks are arranged in an array on a side of the upper cover body facing the lower cover body, one end of each of the support blocks is connected to the upper cover body, the other end of each of the support blocks is abutted against the capillary structure, and the cross-sectional area of ​​each of the support blocks is larger than the cross-sectional area of ​​the hole in the capillary structure.

[0018] The present application also provides an electronic device, including:

[0019] Electronic components;

[0020] In the temperature equalizing plate described in the above embodiment, the side of the lower cover body facing away from the capillary structure is attached to the electronic component.

[0021] The present application also provides a processing method, including:

[0022] Etching the upper substrate to form an upper cover and a support connected to the upper cover;

[0023] Etching the lower substrate to form a lower cover and a receiving groove opened on the lower cover;

[0024] Etching the bottom wall of the receiving groove to form a plurality of strip grooves that are spaced apart and arranged in parallel;

[0025] Punching the upper cover body and the lower cover body to form an upper cover groove and a lower cover groove respectively, wherein the upper cover groove is formed at one end of the upper cover body and is located on the same side of the upper cover body as the support body, and the lower cover groove is formed at one end of the lower cover body and is located on the same side of the lower cover body as the receiving groove and is in communication;

[0026] Welding a capillary structure to the bottom wall of the containing groove, and making the capillary structure cover the plurality of strip grooves;

[0027] Welding the edges of the upper cover body and the lower cover body so that the upper cover body and the lower cover body enclose a receiving cavity, and the upper cover groove and the lower cover groove enclose a liquid injection hole;

[0028] Injecting fluid medium into the containing cavity through the injection hole;

[0029] Extracting air from the accommodating chamber through the injection hole to form a negative pressure in the accommodating chamber;

[0030] The injection hole is sealed.

[0031] In the above-mentioned temperature equalizing plate, electronic device and processing method, the capillary structure is directly sealed on the multiple strip grooves, and the fluid medium condensed by the capillary structure can flow directly into the multiple strip grooves along the capillary structure to form a reflux, thereby shortening the flow distance of the fluid medium from condensation to reflux, accelerating the reflux efficiency of the fluid medium, and thus improving the heat dissipation efficiency of the temperature equalizing plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 This is a schematic diagram of the structure of the temperature equalizing plate according to an embodiment of the present application.

[0033] Figure 2 for Figure 1 Schematic diagram of the exploded view of the vapor chamber shown.

[0034] Figure 3 for Figure 2 Schematic diagram of the temperature distribution plate from another perspective.

[0035] Figure 4 for Figure 1 The cross-sectional schematic diagram of the temperature homogenizing plate along the AA direction is shown.

[0036] Figure 5 for Figure 2 An enlarged schematic diagram of the lower cover body at point B is shown.

[0037] Figure 6 This is a schematic diagram of the process of the processing method of the embodiment of the present application.

[0038] Main component symbols

[0039] Temperature plate 100

[0040] Accommodating chamber 100a

[0041] Lower cover 110

[0042] Accommodating groove 110a

[0043] Strip groove 110b

[0044] Upper cover 120

[0045] Capillary structure 130

[0046] Support body 140

[0047] Support block 141 DETAILED DESCRIPTION

[0048] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0049] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0050] The following is a detailed description of various embodiments of the present invention in conjunction with the accompanying drawings.

[0051] See also Figure 1 and Figure 2 The embodiment of the present application provides a temperature equalizing plate 100, including a lower cover 110, an upper cover 120, a capillary structure 130, a support body 140 and a fluid medium (not shown). The temperature equalizing plate 100 is used to be installed in electronic devices, such as mobile phones, tablets, micro transmitters, etc., to dissipate the heat generated in the electronic devices. Among them, the fluid medium can be at least one of ultrapure water, ethanol, acetone or other low-boiling point liquids. The liquid fluid medium absorbs heat at the heat source and converts into a gas state. When the gaseous fluid medium flows to a place far away from the heat source, it is converted from a gas state to a liquid due to the decrease in temperature, thereby achieving heat dissipation.

[0052] See also Figures 2 to 4 The lower cover body 110 is provided with a receiving groove 110a and a plurality of strip grooves 110b. The plurality of strip grooves 110b are provided on the bottom wall of the receiving groove 110a and are spaced apart and arranged in parallel. The upper cover body 120 covers the receiving groove 110a and is enclosed with the lower cover body 110 to form a receiving cavity 100a. The capillary structure 130 is connected to the bottom wall of the receiving groove 110a and covers the plurality of strip grooves 110b. The support body 140 is received in the receiving cavity 100a, and one end of the support body 140 is connected to the upper cover body 120, and the other end of the support body 140 is abutted against the capillary structure 130. The fluid medium is filled in the receiving cavity 100a.

[0053] In this embodiment, the upper cover 120, the lower cover 110 and each strip groove 110b are generally U-shaped. It can be understood that in other embodiments, the upper cover 120, the lower cover 110 and each strip groove 110b can also be in other shapes respectively. Preferably, the shapes of the upper cover 120, the lower cover 110 and each strip groove 110b are adapted to each other, which is conducive to reducing the difficulty of manufacturing the temperature evaporating plate 100 and improving the heat dissipation efficiency of the temperature evaporating plate 100.

[0054] In this embodiment, the upper cover 120 and the lower cover 110 can be made of a material with thermal conductivity such as copper, aluminum, titanium, magnesium, etc., which is beneficial to improving the heat dissipation efficiency of the temperature evaporating plate 100. Preferably, the upper cover 120 and the lower cover 110 are made of copper, which is beneficial to reducing the manufacturing cost of the temperature evaporating plate 100.

[0055] It should be noted that the accommodating cavity 100a is not completely filled with the fluid medium, which is conducive to the rapid flow of the fluid medium during the mutual transformation between the liquid and gaseous states. Preferably, the accommodating cavity 100a is in a vacuum state, which can prevent the loss of the fluid medium and prevent the fluid medium from being affected by impurities such as air during the transformation between the liquid and gaseous states, thereby facilitating the improvement of the heat dissipation efficiency of the temperature homogenizing plate 100.

[0056] See also Figure 2 and Figure 5 In some embodiments, the depth of each strip groove 110b is equal to the depth of the receiving groove 110a, which is conducive to reducing the difficulty of manufacturing the lower cover 110, thereby reducing the manufacturing cost of the lower cover 110. Specifically, the strip groove 110b and the receiving groove 110a can be obtained by etching twice using an etching solution with the same chemical parameters but different etching positions.

[0057] In some embodiments, the width and depth of each strip groove 110b are equal, and the width of each strip groove 110b ranges from 0.04mm to 0.1mm, for example: 0.04mm, 0.06mm, 0.08mm, 0.1mm. Preferably, the width and depth of each strip groove 110b are both 0.04mm.

[0058] Therefore, the width and depth of the strip groove 110 b are equal, which is beneficial to improving the stability of the flow of the fluid medium in the strip groove 110 b.

[0059] In some embodiments, the sum of the depth of each strip-shaped groove 110 b and the depth of the receiving groove 110 a is less than or equal to half of the thickness of the lower cover 110 .

[0060] Therefore, by properly configuring the strip grooves 110b and the receiving grooves 110a to occupy the thickness range of the lower cover 110, it is beneficial to ensure the strength of the lower cover 110 on the basis of improving the heat dissipation efficiency. Specifically, if the sum of the depth of each strip groove 110b and the depth of the receiving groove 110a is greater than half the thickness of the lower cover 110, the strength of the lower cover 110 itself is reduced, and when subjected to external forces, it will be concave toward the direction of the receiving groove 110a, causing the lower cover 110 to deform.

[0061] See also Figure 5 In some embodiments, the plurality of strip grooves 110b are arranged at equal intervals, which is beneficial to improving the uniformity of the flow of the fluid medium in the plurality of strip grooves 110b. The interval d between two adjacent strip grooves 110b is greater than the width w of the strip groove 110b, which is beneficial to ensure the strength of the lower cover 110.

[0062] In some embodiments, the capillary structure 130 is a grid structure, and the mesh number of the capillary structure 130 ranges from 100 mesh to 200 mesh, for example: 100 mesh, 150 mesh, 200 mesh. Preferably, the mesh number of the capillary structure 130 is 200 mesh.

[0063] In this embodiment, there are two capillary structures 130 , which are stacked and received in the receiving groove 110 a. It can be understood that in other embodiments, there may be one, three or more capillary structures 130 .

[0064] In some embodiments, the capillary structure 130 is formed by etching a copper plate, so as to reduce the manufacturing cost of the capillary structure 130 .

[0065] See also Figure 3 In some embodiments, the support body 140 includes a plurality of support blocks 141. The plurality of support blocks 141 are arranged in an array on the side of the upper cover body 120 facing the lower cover body 110, one end of each support block 141 is connected to the upper cover body 120, and the other end of each support block 141 is abutted against the capillary structure 130, and the cross-sectional area of ​​each support block 141 is greater than the cross-sectional area of ​​the hole in the capillary structure 130.

[0066] Therefore, a space for the fluid medium to flow is formed between the upper cover 120 and the capillary structure 130 through the plurality of support blocks 141. In addition, the plurality of support blocks 141 are easy to process, which is beneficial to reducing the manufacturing cost of the temperature homogenizing plate 100.

[0067] The embodiment of the present application also provides an electronic device (not shown), such as a mobile phone, a tablet, a micro transmitter, etc. The electronic device includes an electronic component and the temperature equalizing plate 100 of the above embodiment, and the side of the lower cover 110 away from the capillary structure 130 is attached to the electronic component. For example, the electronic component can be a processor.

[0068] The working process of the temperature equalizing plate 100 in the above-mentioned electronic device is roughly as follows: the temperature equalizing plate 100 corresponding to the part where the lower cover 110 contacts the electronic component is the hot end of the temperature equalizing plate 100, and the part of the temperature equalizing plate 100 opposite to and far away from the hot end is the cold end of the temperature equalizing plate 100. The fluid medium at the hot end of the temperature equalizing plate 100 absorbs the heat generated by the electronic component and is converted from liquid to gas. The gaseous fluid medium flows from the hot end of the temperature equalizing plate 100 to the cold end of the temperature equalizing plate 100 along the capillary structure 130, and liquefies and releases heat at the cold end of the temperature equalizing plate 100. The liquefied fluid medium flows to the multiple strip grooves 110b through the capillary structure 130, and flows to the hot end of the temperature equalizing plate 100 under the guidance of the strip grooves 110b. This reciprocating cycle is repeated to achieve heat dissipation of the electronic device.

[0069] See also Figure 6 The present application also provides a processing method for processing and forming the temperature homogenizing plate 100 in the above embodiment, which specifically includes:

[0070] S110, etching the upper substrate to form an upper cover 120 and a support 140 connected to the upper cover 120. The etching method is chemical etching.

[0071] Specifically, the upper substrate can be made of a thermally conductive material such as copper, aluminum, titanium, magnesium, etc., which is beneficial to improving the heat dissipation efficiency of the upper cover 120. Preferably, the upper substrate is made of copper, which is beneficial to reducing the manufacturing cost of the upper cover 120.

[0072] S120, etching the lower substrate to form the lower cover 110 and the receiving groove 110a opened on the lower cover 110. The etching method is chemical etching.

[0073] Specifically, the lower substrate can be made of a thermally conductive material such as copper, aluminum, titanium, magnesium, etc., which is beneficial to improving the heat dissipation efficiency of the formed lower cover 110. Preferably, the lower substrate is made of copper, which is beneficial to reducing the manufacturing cost of the lower cover 110.

[0074] S130, etching the bottom wall of the receiving groove 110a to form a plurality of strip grooves 110b spaced apart and arranged in parallel.

[0075] Specifically, the etching method adopted for etching the bottom wall of the receiving groove 110 a is chemical etching, and the etching liquid adopted is the same as the etching liquid used for etching the upper substrate in step S110 .

[0076] S140, stamping the upper cover body 120 and the lower cover body 110 to respectively form an upper cover groove and a lower cover groove, wherein the upper cover groove is formed at one end of the upper cover body 120 and is located on the same side of the upper cover body 120 as the support body 140, and the lower cover groove is formed at one end of the lower cover body 110 and is located on the same side of the lower cover body 110 as the accommodating groove 110a and is communicated with each other.

[0077] In this embodiment, the upper cover groove and the lower cover groove have the same shape, so that the upper cover groove and the lower cover groove can correspond to each other later.

[0078] S150 , welding the capillary structure 130 to the bottom wall of the receiving groove 110 a , and making the capillary structure 130 cover the plurality of strip grooves 110 b .

[0079] Specifically, the capillary structure 130 is a grid structure, and the number can be one or two or more, and the mesh number of the capillary structure 130 ranges from 100 mesh to 200 mesh, for example: 100 mesh, 150 mesh, 200 mesh. Preferably, the mesh number of the capillary structure 130 is 200 mesh.

[0080] Further, the width and depth of each strip groove 110b are equal, and the width of each strip groove 110b ranges from 0.04mm to 0.1mm, for example: 0.04mm, 0.06mm, 0.08mm, 0.1mm. Preferably, the width and depth of each strip groove 110b are both 0.04mm. The plurality of strip grooves 110b are arranged at equal intervals, and the interval between two adjacent strip grooves 110b is greater than the width of the strip groove 110b.

[0081] Furthermore, the sum of the depth of each strip groove 110 b and the depth of the receiving groove 110 a is less than or equal to half of the thickness of the lower cover 110 .

[0082] S160, welding the edges of the upper cover body 120 and the lower cover body 110, so that the upper cover body 120 and the lower cover body 110 are enclosed to form a receiving cavity 100a, and the upper cover groove and the lower cover groove are enclosed to form a liquid injection hole.

[0083] S170, injecting fluid medium into the containing chamber 100a through the injection hole.

[0084] Specifically, the receiving chamber 100a is not completely filled with the fluid medium. The fluid medium may be at least one of ultrapure water, ethanol, acetone or other low-boiling-point liquids.

[0085] S180, extracting air from the accommodating chamber 100a through the injection hole to form a negative pressure in the accommodating chamber 100a.

[0086] S190, seal the injection hole.

[0087] Specifically, the sealing of the injection hole can be achieved by filling with copper material.

[0088] It should be noted that the extraction of air in the accommodating chamber 100a and the sealing of the injection hole can be directly obtained from the disclosed content, and will not be described in detail here. For example, when the air in the accommodating chamber 100a is extracted, the injection hole is in a filled state, and after a negative pressure is formed in the accommodating chamber 100a, the injection hole can be directly sealed by the substance filled in the accommodating chamber 100a.

[0089] In the above-mentioned temperature equalizing plate 100, electronic device and processing method, the capillary structure 130 is directly sealed on the multiple strip grooves 110b, and the fluid medium condensed by the capillary structure 130 can flow directly into the multiple strip grooves 110b along the capillary structure 130 and form a reflux, which shortens the flow distance of the fluid medium from condensation to reflux, accelerates the reflux efficiency of the fluid medium, and thus improves the heat dissipation efficiency of the temperature equalizing plate 100.

[0090] It is obvious to those skilled in the art that the present application is not limited to the details of the exemplary embodiments described above, and that the present application can be implemented in other specific forms without departing from the spirit or essential features of the present application. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present application is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present application.

[0091] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present application and are not intended to limit it. Although the present application has been described in detail with reference to the preferred embodiments, a person of ordinary skill in the art should understand that the technical solution of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present application.

Claims

1. A temperature equalizing plate, characterized in that: include: The lower cover body is provided with a receiving groove and a plurality of strip grooves, wherein the plurality of strip grooves are spaced apart and arranged in parallel on the bottom wall of the receiving groove; An upper cover body, covering the receiving groove, and enclosing with the lower cover body to form a receiving cavity; A capillary structure connected to the bottom wall of the containing groove and covering the plurality of strip grooves; A support body is received in the accommodating cavity, one end of the support body is connected to the upper cover body, and the other end of the support body is in contact with the capillary structure; A fluid medium is filled in the containing cavity.

2. The temperature equalizing plate according to claim 1, characterized in that: The depth of each of the strip-shaped grooves is equal to the depth of the accommodating groove.

3. The temperature equalizing plate according to claim 1, characterized in that: The width and depth of each of the strip-shaped grooves are equal, and the width of each of the strip-shaped grooves ranges from 0.04 mm to 0.1 mm.

4. The temperature equalizing plate according to claim 1, characterized in that: The sum of the depth of each of the strip-shaped grooves and the depth of the accommodating groove is less than or equal to half of the thickness of the lower cover body.

5. The temperature equalizing plate according to claim 1, characterized in that: The plurality of strip grooves are arranged at equal intervals, and the interval between two adjacent strip grooves is greater than the width of the strip grooves.

6. The temperature equalizing plate according to claim 1, characterized in that: The capillary structure is a grid structure, and the mesh number of the capillary structure ranges from 100 meshes to 200 meshes.

7. The temperature equalizing plate according to claim 6, characterized in that: The capillary structure is formed by etching a copper plate.

8. The temperature equalizing plate according to claim 6, characterized in that: The support body comprises: A plurality of support blocks are arranged in an array on a side of the upper cover body facing the lower cover body, one end of each of the support blocks is connected to the upper cover body, the other end of each of the support blocks is abutted against the capillary structure, and the cross-sectional area of ​​each of the support blocks is larger than the cross-sectional area of ​​the hole in the capillary structure.

9. An electronic device, characterized in that: include: Electronic components; According to any one of claims 1 to 8, a side of the lower cover body facing away from the capillary structure is attached to the electronic component.

10. A processing method, characterized in that: include: Etching the upper substrate to form an upper cover and a support connected to the upper cover; Etching the lower substrate to form a lower cover and a receiving groove opened on the lower cover; Etching the bottom wall of the receiving groove to form a plurality of strip grooves that are spaced apart and arranged in parallel; Punching the upper cover body and the lower cover body to form an upper cover groove and a lower cover groove respectively, wherein the upper cover groove is formed at one end of the upper cover body and is located on the same side of the upper cover body as the support body, and the lower cover groove is formed at one end of the lower cover body and is located on the same side of the lower cover body as the receiving groove and is in communication; Welding a capillary structure to the bottom wall of the containing groove, and making the capillary structure cover the plurality of strip grooves; Welding the edges of the upper cover body and the lower cover body so that the upper cover body and the lower cover body enclose a receiving cavity, and the upper cover groove and the lower cover groove enclose a liquid injection hole; Injecting fluid medium into the containing cavity through the injection hole; Extracting air from the accommodating chamber through the injection hole to form a negative pressure in the accommodating chamber; The injection hole is sealed.

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