Semiconductor device

Abstract

A semiconductor device improves reliability. According to one embodiment, a semiconductor device includes: a first member having a side wall surrounding an opening portion for housing an electronic component, and a receiving portion provided so as to protrude from the side wall toward the opening portion; and a second member that extends in the first direction, has an engagement portion that engages with the receiving portion, and covers at least a part of the opening portion, the engagement portion having: an extension portion that extends in the first direction; and a pair of engaging claws protruding from the extension portion from the lower end of the extension portion toward one end side and the other end side in a second direction orthogonal to the first direction, each engaging claw having a first engaging surface continuous with a side surface of the extension portion intersecting the first direction and inclined with respect to the first direction, the receiving portion having a pair of protruding portions, the pair of protrusions includes protruding surfaces that are provided so as to face the first engagement surfaces and that are inclined with respect to the first direction, and the lower sides of the first engagement surfaces and the lower sides of the protruding surfaces are inclined so as to be higher in a third direction orthogonal to the first direction and the second direction toward the side wall.

Description

Technical Field

[0001] Embodiments relate to a semiconductor device. Background Art

[0002] As a semiconductor device, a semiconductor module having a housing that accommodates electronic components and a cover of the housing is known. In such a semiconductor device, the electronic components arranged in the housing are protected.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Utility Model Publication No. 6-033597

[0006] Patent Document 2: Japanese Patent No. 6141807

[0007] Patent Document 3: Japanese Patent No. 6480990

[0008] Patent Document 4: Japanese Patent Application Publication No. 2021-090009 Summary of the invention

[0009] Technical problem to be solved by the invention

[0010] Improve the reliability of semiconductor devices.

[0011] Solutions for solving technical problems

[0012] The semiconductor device of the embodiment comprises: a first component having a side wall surrounding an opening portion for accommodating an electronic component, and a receiving portion arranged in a manner protruding from the side wall toward the opening portion; and a second component extending in a first direction, having a locking portion engaged with the receiving portion and covering at least a portion of the opening portion, the locking portion comprising: an extension portion extending in the first direction; and a pair of locking claws, which protrude from the extension portion at a lower end thereof at one end side and the other end side thereof in a second direction orthogonal to the first direction, respectively, each of the locking claws having a first locking surface which is continuous with a side surface of the extension portion intersecting the first direction and inclined relative to the first direction, the receiving portion having a pair of protrusions, the pair of protrusions including protrusion surfaces arranged in a manner opposite to each of the first locking surfaces and inclined relative to the first direction, the lower side of the first locking surface and the lower side of the protrusion surface being inclined in a manner that becomes higher as they approach the side wall in a third direction orthogonal to the first direction and the second direction.

[0013] A semiconductor device in another embodiment comprises: a first component having a side wall surrounding an opening for accommodating electronic components, and a receiving portion arranged in a manner protruding from the side wall toward the opening; and a second component extending in a first direction, having a snap-fitting portion engaged with the receiving portion and covering at least a portion of the opening, the snap-fitting portion comprising: an extension portion extending in the first direction; and a pair of snap-fitting claws, which protrude from the extension portion at the lower end thereof at one end side and the other end side of the extension portion in a second direction orthogonal to the first direction, respectively, each of the snap-fitting claws having a snap-fitting surface which is continuous with a side surface of the extension portion intersecting with the first direction and inclined relative to the first direction, the receiving portion having a pair of protrusions, the pair of protrusions including protrusion surfaces arranged in a manner opposite to each of the snap-fitting surfaces and inclined relative to the first direction, the snap-fitting surfaces and the protrusion surfaces being surfaces that have been roughened. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a perspective view for explaining an example of the structure of the semiconductor device according to the embodiment.

[0015] Figure 2 It is a perspective view for explaining an example of the structure of the semiconductor device according to the embodiment.

[0016] Figure 3 It is a perspective view for explaining an example of the structure of a receiving portion and an engaging portion of the semiconductor device according to the embodiment.

[0017] Figure 4 It is a plan view showing an example of the structure of the receiving portion of the semiconductor device according to the embodiment, when viewed from the X direction.

[0018] Figure 5 It is a plan view showing an example of the structure of a portion included in a receiving portion of the semiconductor device according to the embodiment, as viewed from the Y direction.

[0019] Figure 6 It is a plan view showing an example of the structure of the engaging portion of the semiconductor device according to the embodiment, as viewed from the X direction.

[0020] Figure 7 It is a plan view showing an example of the structure of the engaging portion of the semiconductor device according to the embodiment, when viewed from the Y direction.

[0021] Figure 8 It is a perspective view for explaining an example of the structure of a receiving portion and an engaging portion of the semiconductor device according to the embodiment.

[0022] Fig. 9 It is a perspective view showing an example of the structure of the engaging portion of the semiconductor device according to the modification as viewed from the X direction.

[0023] Fig.10 It is a plan view showing an example of the structure of the engaging portion of the semiconductor device according to the modification as viewed from the Y direction. DETAILED DESCRIPTION

[0024] Hereinafter, the embodiments will be described with reference to the accompanying drawings. In the following description, the same reference numerals are used for components having substantially the same functions and structures. In addition, the dimensions and ratios of the accompanying drawings are not necessarily the same as those in reality.

[0025] 1. Implementation Method

[0026] A semiconductor device according to an embodiment will be described.

[0027] The semiconductor device of the embodiment is, for example, a semiconductor module including an electronic component. More specifically, the semiconductor device of the embodiment is, for example, a power module semiconductor device including a power semiconductor element.

[0028] use Figure 1 An example of the overall structure of the semiconductor device according to the embodiment will be described. Figure 1 It is a perspective view for explaining an example of the structure of the semiconductor device according to the embodiment.

[0029] In the following description, the Z direction corresponds to, for example, a direction perpendicular to a surface on one side of a semiconductor device where a cover is provided, the X direction is a direction parallel to the surface, and the Y direction is a direction parallel to the surface and perpendicular to the X direction.

[0030] The semiconductor device 1 includes a housing 10, covers 20 and 30, and terminals T1, T2, and T3. In the following description, the side where the covers 20 and 30 are provided and the side covered by the housing in the semiconductor device 1 is referred to as the upper side. In addition, the side where the covers 20 and 30 are provided and the side covered by the housing is referred to as the lower side.

[0031] The housing 10 protects the electronic components of the semiconductor device 1 on the side and the bottom surface, for example. The housing 10 contains, for example, a synthetic resin. Terminals T1 and T2 are provided on the housing 10, for example. Each terminal T1 and T2 has, for example, a threaded hole capable of threading a connecting terminal and a busbar. For the terminals T1 and T2, for example, power and signals for driving the semiconductor device 1 are supplied from the outside of the semiconductor device 1. In addition, in the example involved in the embodiment, an example in which two types of terminals T1 and T2 are provided on the housing 10 is shown, but it is not limited to this. The types of terminals provided on the housing 10 may be 0, 1, or 3 or more. In addition, in the following description, the terminal T1 side of the terminals T1 and T2 is referred to as one end side in the Y direction. In addition, the terminal T2 side of the terminals T1 and T2 is referred to as the other end side in the Y direction.

[0032] The covers 20 and 30 are provided, for example, to cover at least a portion of the upper surface of the housing 10. The covers 20 and 30 are provided, for example, to be arranged in the Y direction. The covers 20 and 30 are made of, for example, synthetic resin.

[0033] For example, a terminal T3 is provided on the cover 20. The structure of the terminal T3 is the same as that of the terminals T1 and T2. As with the terminals T1 and T2, for example, power or a signal for driving the semiconductor device 1 is supplied to the terminal T3 from the outside of the semiconductor device 1. In the example of the embodiment, an example is shown in which the terminal T3 is provided on the cover 20 and the terminal is not provided on the cover 30, but the present invention is not limited thereto. The covers 20 and 30 may each be provided with a terminal or may not be provided with a terminal.

[0034] Next, use Figure 2 An example of the overall structure of the semiconductor device according to the embodiment will be described. Figure 2 1 is a perspective view for explaining an example of the structure of a semiconductor device according to an embodiment. Figure 2 , the semiconductor device 1 is shown in a state where the covers 20 and 30 are removed.

[0035] The housing 10 also includes a side wall 12. An opening 11 is provided in the housing 10, which is formed in a manner surrounded by the side wall 12 and is open at the top. A semiconductor part 40 in which a plurality of semiconductor elements are mounted is accommodated in the opening 11. The housing 10 also includes receiving parts 50-1 and 50-2, which are provided in a manner protruding from the side wall 12 and are used to fix the cover 20. In addition, in the following description, when the receiving parts 50-1 and 50-2 are not distinguished, the receiving parts 50-1 and 50-2 are referred to as receiving parts 50, respectively. The details of the structure of the receiving part 50 will be described later. In addition, in the following description, the side of the receiving part 50-1 in the receiving parts 50-1 and 50-2 is referred to as one end side in the X direction. The side of the receiving part 50-2 in the receiving parts 50-1 and 50-2 is referred to as the other end side in the X direction.

[0036] In addition, the housing 10 further includes connecting parts 13 and 14. The connecting parts 13 and 14 are formed of, for example, a metal-containing conductor. The connecting part 13 is provided to electrically connect the semiconductor part 40 to the terminal T1. The connecting part 14 is provided to electrically connect the semiconductor part 40 to the terminal T2. Figure 2 , only a part of the structure of each of the connection parts 13 and 14 is shown.

[0037] The cover 20 further includes engaging parts 60-1 and 60-2. The engaging parts 60-1 and 60-2 are respectively provided corresponding to the receiving parts 50-1 and 50-2 of the housing 10. The engaging parts 60-1 and 60-2 are made of, for example, synthetic resin. The synthetic resin contains, for example, polyamide. The engaging parts 60-1 and 60-2 are respectively engaged with the receiving parts 50-1 and 50-2, thereby fixing the cover 20 to the housing 10. In addition, in the following description, when the engaging parts 60-1 and 60-2 are not distinguished, the engaging parts 60-1 and 60-2 are respectively referred to as the engaging parts 60. The details of the structure of the engaging part 60 will be described later.

[0038] In addition, the cover 20 further includes, for example, a connection portion 21. The connection portion 21 is made of, for example, a conductor containing metal. The connection portion 21 is electrically connected to the terminal T3 in a region not shown. The connection portion 21 is provided to electrically connect the semiconductor portion 40 to the terminal T3.

[0039] The cover 30 is fixed to the housing 10 by, for example, an adhesive member not shown. Although not shown, the cover 30 may include an engaging portion for fixing the cover 30 to the housing 10, similarly to the cover 20. In this case, the housing 10 further includes a receiving portion corresponding to the engaging portion of the cover 30.

[0040] Next, the structure of the receiving portion 50 in the embodiment will be described. In addition, the receiving portions 50-1 and 50-2 are provided symmetrically with respect to the YZ plane, for example. Figure 3 , Figure 4 as well as Figure 5 The structure of the receiving portion 50 - 1 will be described, and the description of the structure of the receiving portion 50 - 2 will be omitted. Figure 3 It is a perspective view showing an example of the structure of a receiving portion and an engaging portion of the semiconductor device according to the embodiment.

[0041] Figure 4 It is a plan view showing an example of the structure of the receiving portion of the semiconductor device according to the embodiment, when viewed from the X direction. Figure 5 1 is a plan view showing an example of a structure of a portion included in the receiving portion 50 of the embodiment as viewed from the Y direction. Figure 4 , the structure of the receiving portion 50-1 according to the embodiment is shown when viewed from the other end side toward the one end side in the X direction. Figure 5 2 shows a structure of a portion included in one end side in the Y direction of the receiving portion 50 - 1 according to the embodiment when viewed from the other end side in the Y direction toward the one end side.

[0042] The receiving portion 50 is provided so as to protrude from the side wall 12 toward the opening 11 in the X direction. In addition, two guide portions 70 are provided on the side wall 12 to protrude from the side wall 12 toward the opening 11 in the X direction. The receiving portion 50 is clamped by the two guide portions 70 in the Y direction. More specifically, the receiving portion 50 is clamped by the side surfaces of the two guide portions 70 on one end side and the other end side in the Y direction that are opposite to each other in the Y direction. Figure 3 In FIG. 1 , the guide portion 70 on the other end side in the Y direction of the two guide portions 70 is indicated by a dotted line.

[0043] The receiving portion 50 includes a wall portion 51, two protrusions 52, two first inclined portions 53 and a second inclined portion 54. Figure 5 In the figure, the wall portion 51 and the second inclined portion 54 are omitted.

[0044] The wall portion 51 has a plane along the YZ plane, for example. The plane is in contact with the side surfaces at one end and the other end of the guide portion 70 in the X direction.

[0045] The protrusion 52 on one end side in the Y direction of the two protrusions 52, for example, contacts the side surface of the guide portion 70 on one end side in the Y direction. The protrusion 52 on the other end side in the Y direction of the two protrusions 52, for example, contacts the side surface of the guide portion 70 on the other end side in the Y direction. The protrusion 52 is provided, for example, in a manner protruding from the wall portion 51. Figure 5 As shown, the protrusion 52 has a thickness W1 in the X direction. The thickness W1 is, for example, 1 mm or more. Figure 3 The thickness W2 of the portion of the guide portion 70 included in the other end side of the wall portion 51 in the X direction is smaller than that shown. In addition, the two protrusions 52 are provided symmetrically with respect to the XZ plane. Therefore, the following mainly describes the structure of the protrusion 52 on one end side in the Y direction, and the description of the structure of the protrusion 52 on the other end side in the Y direction is omitted.

[0046] The protrusion 52 has protrusion surfaces 52a and 52b. The protrusion surface 52a has a plane along the YZ plane, for example. Figure 4 As shown, the protrusion surface 52a has, for example, a triangular shape having a side along the Y direction, a side along the Z direction connected to the side surface of the guide portion 70, and an oblique side intersecting the Y direction and the Z direction. Figure 4 As shown, the angle between the side along the Z direction and the hypotenuse has an angle θ1. The angle θ1 is, for example, less than 90°. With the above structure, the two protrusions 52 in the receiving portion 50 are arranged so that the width of the area sandwiched by the two protrusions 52 becomes wider as it moves from the top to the bottom. The protrusion surface 52b has, for example, a plane inclined relative to the Y direction. Figure 5As shown, when viewed from the Y direction, the protrusion surface 52b has, for example, a quadrilateral shape, which has two sides along the Z direction and an upper side and a lower side respectively intersecting the Z direction, and the upper side and the lower side become higher as they approach one end side from the other end side of the X direction. More specifically, the protrusion surface 52b has, for example, a parallelogram shape. The angle θ2 of the acute angle formed by the lower side of the protrusion surface 52b and the X direction is, for example, greater than 5° and less than 20° (5≤θ2≤20). The protrusion surface 52b is a surface that has been roughened by mechanical grinding treatment on the surface, chemical treatment using a drug on the surface, and treatment of the surface portion corresponding to the protrusion surface in the inner surface of the mold when the receiving portion 50 is formed. As a result, the surface roughness (Ra) of the protrusion surface 52b is, for example, greater than 10μm (micrometers). In addition, the protrusion surface 52b is rougher (larger surface roughness) than other surfaces included in the receiving portion 50.

[0047] The two first inclined portions 53 are respectively provided corresponding to the two protrusions 52. Each first inclined portion 53 is connected to the upper end of the corresponding protrusion 52 of the two protrusions 52. The first inclined portion 53 on one end side of the two first inclined portions 53 in the Y direction is in contact with the side surface of the guide portion 70 on one end side of the Y direction. The first inclined portion 53 on the other end side of the two first inclined portions 53 in the Y direction is in contact with the side surface of the guide portion 70 on the other end side of the Y direction. The two first inclined portions 53 are respectively provided, for example, in a manner protruding from the wall portion 51. The two first inclined portions 53 are provided in a manner that the area sandwiched by the two first inclined portions 53 is separated by a spacing W3 in the Y direction. The spacing W3 is, for example, about 10 mm. In addition, the two first inclined portions 53 are provided symmetrically with respect to the XZ plane. Therefore, the following mainly describes the structure of the first inclined portion 53 on one end side of the Y direction, and the description of the structure of the first inclined portion 53 on the other end side of the Y direction is omitted.

[0048] The first inclined portion 53 has inclined surfaces 53a and 53b. Figure 4 As shown, the inclined surface 53a has a rectangular shape, for example. Figure 5 As shown, the inclined surface 53a has, for example, a plane along a surface obtained by rotating the YZ plane by a preset angle with the Y direction as an axis. More specifically, the inclined surface 53a is inclined in a manner that approaches the side wall 12 as it approaches from the bottom to the top. The inclined surface 53a is, for example, connected to the upper end of the protruding surface 52a at the lower end. In addition, the inclined surface 53a is connected to the side surface of the guide portion 70 on one end side of the Y direction. The inclined surface 53b has, for example, a plane along the XZ plane. The inclined surface 53b has, for example, a triangular shape. The inclined surface 53b is connected to the upper end of the protruding surface 52b at the lower end.

[0049] The second inclined portion 54 has an inclined surface 54a. The inclined surface 54a, for example, has a plane along the surface after the YZ plane is rotated by a preset angle with the Y direction as the axis. When the YZ plane is used as a reference, the rotation angle of the inclined surface 54a with the Y direction as the axis is equal to the rotation angle of the inclined surface 53a with the Y direction as the axis. The lower end of the inclined surface 54a is connected to the upper end of the inclined surface 53a at one end and the other end along the Y direction respectively. The inclined surface 54a has, for example, a rectangular shape. Through the above structure, the inclined surface 54a is integrally provided with the two inclined surfaces 53a. The second inclined portion 54 is provided at a position closer to one end side of the X direction than the two protrusions 52 and the two first inclined portions 53, for example, in the X direction, similarly to the wall portion 51. In addition, the inclined surface 54a is connected to the side surfaces of the two guide portions 70 at one end side and the other end side in the Y direction respectively.

[0050] Next, the engaging portion 60 in the embodiment will be described. In addition, the engaging portions 60-1 and 60-2 are provided symmetrically with respect to the YZ plane, for example. Figure 3 , Figure 6 as well as Figure 7 The structure of the engaging portion 60 - 1 will be described, and the description of the structure of the engaging portion 60 - 2 will be omitted. Figure 6 It is a plan view showing an example of the structure of the engaging portion of the semiconductor device 1 according to the embodiment, as viewed from the X direction.

[0051] Figure 7 FIG. 1 is a top view showing an example of the structure of the engaging portion of the semiconductor device according to the embodiment when viewed from the Y direction. Figure 6 , the structure of the engaging portion 60-1 of the embodiment is shown when viewed from the other end side toward the one end side in the X direction. Figure 7 , the structure of the engaging portion 60 - 1 according to the embodiment is shown when viewed from one end side toward the other end side in the Y direction.

[0052] The engaging portion 60 has a plate-like structure having a plane along the YZ plane. Figure 7 As shown, the engagement portion 60 has a thickness W4 in the X direction. The thickness W4 is, for example, less than the thickness W1. The thickness W4 is, for example, about 1 mm.

[0053] The engaging portion 60 includes an extending portion 61 and a pair of engaging claws 62. The configuration of the engaging portion 60 is symmetrical about the XZ plane, for example.

[0054] like Figure 6 As shown in FIG. 1 , when viewed from the X direction, the extension portion 61 has a rectangular shape. Figure 6 The width W5 of the extension portion 61 in the Y direction is less than the interval W3.

[0055] The engaging claws 62 are provided so as to protrude symmetrically from the extension portion 61 toward one end and the other end in the Y direction. With such a structure, the engaging portion 60 has a scraper shape that is symmetrical with respect to the XZ plane. Thus, the width W6 in the Y direction of the lower side of the engaging portion 60 in the portion including the two engaging claws 62 is wider than the interval W3 and the width W5. With the above-mentioned symmetrical structure of the engaging claws 62, the structure of the engaging claws 62 on one end side in the Y direction will be mainly described below, and the structure of the engaging claws 62 on the other end side in the Y direction will be omitted.

[0056] The engaging claw 62 has, for example, an engaging surface 62 a along the YZ plane, and engaging surfaces 62 b and 62 c intersecting the YZ plane.

[0057] The engaging surface 62a has a trapezoidal shape including two sides along the Z direction, a side along the Y direction, and an oblique side intersecting the Y direction and the Z direction. The engaging surface 62a on one end side in the Y direction is provided so that the width in the Z direction becomes narrower as it approaches the one end side from the other end side in the Y direction. An angle θ3 formed by the oblique side of the engaging surface 62a and the boundary line along the Z direction of the engaging claw 62 and the extending portion 61 is equal to the angle θ1, for example.

[0058] The engagement surface 62b is connected to the side surface along the XZ plane of the extension portion 61. In addition, as described above, the hypotenuse of the engagement surface 62a is inclined, so that the engagement surface 62b has a plane inclined relative to the Y direction like the protrusion surface 52b. Figure 7 As shown, the engaging surface 62b has, for example, a quadrilateral shape having two sides along the Z direction and an upper side and a lower side respectively crossing the Z direction, and the upper side and the lower side become higher as they go from the other end side of the X direction toward one end side. More specifically, the engaging surface 62b has, for example, a parallelogram shape. The angle θ4 formed by the lower side of the engaging surface 62b and the X direction is greater than 0°. The angle θ4 is, for example, greater than 5° and less than 20° (5≤θ4≤20). In addition, the angle θ4 is, for example, equal to the angle θ2. The engaging surface 62b is a surface that has been roughened by mechanical grinding treatment of the surface, chemical treatment using a drug on the surface, and treatment of the portion of the inner surface of the mold corresponding to the engaging surface when the engaging portion 60 is formed. As a result, the surface roughness (Ra) of the engaging surface 62b is, for example, greater than 10μm. In addition, the engaging surface 62b is rougher (has a larger surface roughness) than other surfaces included in the engaging portion 60. In addition, as Figure 7 As shown, the engagement surface 62c has, for example, a quadrilateral shape having two sides along the Z direction, a side along the X direction, and a side intersecting the X direction and the Z direction.

[0059] Next, use Figure 8A description will be given of a structure for fixing the engaging portion 60 to the receiving portion 50 in the semiconductor device 1 according to the embodiment. Figure 8 It is a perspective view showing an example of the structure of a receiving portion and an engaging portion of the semiconductor device according to the embodiment.

[0060] In the semiconductor device 1 of the embodiment, the engaging portion 60 is fixed to the receiving portion 50 by sliding the engaging portion 60 downward. More specifically, as the engaging portion 60 slides downward, the engaging portion 60 is deformed along the plane of the protruding surface 52a, the inclined surface 53a, and the second inclined portion 54. And, for example, if the engaging claw 62 is further slid downward so as to be located below the first inclined portion 53, the engaging portion 60 returns to its original shape. And, part of the engaging portion 60 is arranged between the two protruding portions 52 and the two first inclined portions 53.

[0061] With the above-described structures of the receiving portion 50 and the engaging portion 60 , when the engaging portion 60 is fitted into the receiving portion 50 , the engaging surface 62 b can be in contact with the entire protrusion surface 52 a .

[0062] According to the embodiment, the reliability of the semiconductor device can be improved. Hereinafter, improvement of the reliability of the semiconductor device 1 according to the embodiment will be described.

[0063] The semiconductor device 1 of the embodiment includes: a frame 10 having an opening 11 for accommodating a semiconductor unit 40, and a receiving portion 50 provided in a manner protruding from a side wall 12 inside the opening 11 and for engaging a locking portion 60 to be engaged; and a cover 20 having a locking portion 60 extending in the Z direction. The locking portion 60 includes an extension portion 61 and a pair of locking claws 62 protruding from the extension portion 61 in the Y direction at the lower end of the extension portion 61. Each locking claw 62 has a locking surface 62b that is continuous with the side surface of the extension portion 61 and inclined with respect to the Z direction. The receiving portion 50 has a protrusion 52 provided in a manner opposite to the locking surface 62b and having a protrusion surface 52b inclined with respect to the Z direction. In addition, the lower side of the locking surface 62b and the lower side of the protrusion surface 52b are inclined in a manner that they are higher as they approach the side wall along the X direction. With such a structure, when the engagement portion 60 is fixed to the receiving portion 50, the engagement surface 62b can be prevented from being dislocated from the receiving portion 50 due to the engagement surface 62b being displaced toward the opening 11. Therefore, by preventing the cover 20 of the semiconductor device 1 from being dislocated, the reliability of the semiconductor device 1 can be improved.

[0064] As a supplementary explanation, when the protruding surface of the receiving portion is a rectangular shape including the lower side along the X direction when viewed from the Y direction, the engaging surface of the engaging portion connected to the protruding surface is also set to be a rectangular shape including the lower side along the X direction when viewed from the Y direction. In such a case, due to the application of force to the cover and the positional displacement of the receiving portion and the engaging portion when the engaging portion is fixed to the receiving portion, the balance of the force acting on the engaging portion and the receiving portion is destroyed, and the engaging surface is offset to the opening side of the housing. As a result, there is a case where the engaging portion is detached from the receiving portion. Therefore, for example, there is a case where the cover of the semiconductor device falls off even though no force is applied to physically break the engaging portion.

[0065] According to the embodiment, when viewed from the Y direction, the protruding surface 52b of the receiving portion 50 and the engaging surface 62b of the engaging portion 60 each have, for example, a parallelogram shape including two sides along the Z direction. In addition, when viewed from the Y direction, the lower sides of the protruding surface 52b and the engaging surface 62b are respectively configured to become higher toward the side wall 12. With such a structure, when the engaging portion 60 is fixed to the receiving portion 50, for example, the situation in which the engaging portion 60 is separated from the receiving portion 50 due to the destruction of the balance state between the supporting force of the receiving portion 50 and the tensile force of the engaging portion 60 is suppressed.

[0066] In addition, the protruding surface 52b and the engaging surface 62b are roughened surfaces. Thus, the friction coefficient between the protruding surface 52b and the engaging surface 62b can be suppressed from decreasing, and the friction force acting between the protruding surface 52b and the engaging surface 62b can be increased. Therefore, by exerting the anchoring effect, the engaging portion 60 can be suppressed from detaching from the receiving portion 50.

[0067] In addition, the angle θ2 formed by the lower side of the protruding surface 52b and the X direction and the angle θ4 formed by the lower side of the engaging surface 62b and the X direction are equal to each other. Thus, the engaging surface 62b can contact the protruding surface 52b as a whole. Therefore, the friction force acting between the protruding surface 52b and the engaging surface 62b can be effectively increased.

[0068] In addition, in the semiconductor device 1 of the embodiment, the angles θ2 and θ4 are respectively greater than 5° and less than 20°. If the angles θ2 and θ4 are greater than 5°, it is possible to effectively suppress the engagement portion 60 from being separated from the receiving portion 50. In addition, if the angles θ2 and θ4 are less than 20°, it is possible to effectively suppress the damage of the receiving portion 50 and the engagement portion 60 caused by low strength or the like.

[0069] 2. Modification

[0070] Next, a semiconductor device according to a modified example will be described. Hereinafter, descriptions of the same structures as those in the embodiment will be omitted, and descriptions will be mainly made of structures different from those in the embodiment.

[0071] In the above embodiment, the engagement claw 62 of the engagement portion 60 includes one engagement surface 62b and one engagement surface 62c when viewed from the Y direction, but the present invention is not limited thereto. The engagement claw 62 of the engagement portion 60 may include two engagement surfaces 62b when viewed from the Y direction.

[0072] In the semiconductor device 1 of the modified example, the structure of the housing 10 including the receiving portion 50, the terminal T3 and the connecting portion 21 in the cover 20, and the cover 30 is the same as that of the embodiment. Fig. 9 and Fig.10 A configuration different from the structure of the engaging portion 60 included in the semiconductor device 1 according to the embodiment will be described. Fig. 9 It is a perspective view showing an example of the structure of the engaging portion of the semiconductor device according to the modification as viewed from the X direction. Fig.10 FIG. 1 is a top view showing an example of the structure of the engaging portion of the semiconductor device of the modified example as viewed from the Y direction. More specifically, Fig.10 , the structure of the engagement portion 60-1 of the modified example is shown when viewed from one end side toward the other end side in the Y direction. In addition, the structure of the engagement portion of the semiconductor device of the modified example viewed from the X direction can be similar to that of the semiconductor device using Figure 6 The structure of the engaging portion of the semiconductor device according to the embodiment described above when viewed from the X direction is substantially the same, and thus the description thereof will be omitted.

[0073] The structure of the extending portion 61 of the engaging portion 60 of the modification is substantially the same as the structure of the extending portion 61 of the engaging portion 60 of the embodiment.

[0074] In a modified example, the engaging claw 62 has engaging surfaces 62b1, 62b2 and 62c that intersect the YZ plane. The engaging surfaces 62b1 and 62b2 are surfaces that have been roughened by mechanical grinding treatment on these surfaces, chemical treatment using chemicals on these surfaces, and treatment of the portions of the inner surface of the mold corresponding to these engaging surfaces when forming the engaging portion 60. As a result, the surface roughness (Ra) of the engaging surfaces 62b1 and 62b2 is, for example, not less than 10 μm. In addition, the engaging surfaces 62b1 and 62b2 are rougher (have a larger surface roughness) than the other surfaces included in the engaging portion 60. The engaging surface 62b1 is provided corresponding to the protruding surface 52b. As shown in FIG. Fig.10 As shown, the engagement surface 62b1 has, for example, a quadrilateral shape having two sides along the Z direction and an upper side and a lower side respectively crossing the Z direction, and the upper side and the lower side become higher as they move from the other end side of the X direction toward one end side. More specifically, the engagement surface 62b1 has, for example, a parallelogram shape. The angle formed between the lower side of the engagement surface 62b1 and the X direction is an angle θ4. As shown in FIG. Fig.10As shown, the engagement surface 62b2 is symmetrically arranged with respect to the YZ plane with respect to the engagement surface 62b1. The engagement surface 62c has a pentagonal shape including, for example, an edge along the X direction, two edges along the Z direction, and two edges intersecting the X direction and the Z direction, by means of the structures of the engagement surfaces 62b1 and 62b2 as described above.

[0075] According to the modification, the reliability of the semiconductor device 1 can be improved similarly to the embodiment.

[0076] Furthermore, according to the modified example, the engagement surfaces 62b1 and 62b2 are provided symmetrically with respect to the YZ plane, so that versatility can be improved. That is, for example, the cover 20 can be manufactured without distinguishing the directions of the engagement portions 60-1 and 60-2.

[0077] 3. Others

[0078] Several embodiments are described above, but these embodiments are presented as examples and are not intended to limit the scope of the invention. These embodiments can be implemented in various other ways, and various omissions, substitutions, and changes can be made without departing from the scope of the subject matter of the invention. These embodiments and their variations are included in the scope or subject matter of the invention, and are included in the invention described in the claims and the scope of their equivalents.

Claims

1. A semiconductor device, characterized in that: have: A first component having a side wall surrounding an opening for storing an electronic component, and a receiving portion provided so as to protrude from the side wall toward the opening; and The second component extends in the first direction, has a locking portion engaged with the receiving portion, and covers at least a portion of the opening. The engaging portion comprises: an extending portion extending in the first direction; and a pair of engaging claws, which protrude from the lower end of the extending portion at one end side and the other end side of the extending portion in a second direction orthogonal to the first direction, respectively, Each of the engaging claws has a first engaging surface that is continuous with a side surface of the extending portion that intersects the first direction and is inclined relative to the first direction. The receiving portion has a pair of protrusions, the pair of protrusions including protrusion surfaces that are arranged in a manner opposite to the first engagement surfaces and are inclined relative to the first direction. The lower side of the first engagement surface and the lower side of the protruding surface are inclined in a third direction perpendicular to the first direction and the second direction so as to become higher as they approach the side wall.

2. The semiconductor device according to claim 1, wherein: The lower side of the first engagement surface and the lower side of the protruding surface are inclined at an angle of not less than 5° and not more than 20° with respect to the third direction.

3. The semiconductor device according to claim 1, wherein: The first engaging surface and the protruding surface are roughened surfaces.

4. The semiconductor device according to claim 3, wherein: The surface roughness of the first engaging surface and the surface roughness of the protruding surface are greater than 10 micrometers.

5. The semiconductor device according to claim 1, wherein: The engaging claw further has a second engaging surface which is continuous with the side surface of the extending portion and is inclined relative to the first direction. The lower side of the second engagement surface is inclined with respect to the third direction so as to become higher as it is farther away from the side wall.

6. The semiconductor device according to claim 5, wherein: The engaging portion is symmetrical with respect to a plane including the first direction and the second direction.

7. The semiconductor device according to claim 1, wherein: The engaging portion is symmetrical with respect to a plane including the first direction and the third direction.

8. The semiconductor device according to claim 1, wherein: The electronic component is a power semiconductor.

9. A semiconductor device, characterized in that: have: A first component having a side wall surrounding an opening for storing an electronic component, and a receiving portion provided so as to protrude from the side wall toward the opening; and The second component extends in the first direction, has a locking portion engaged with the receiving portion, and covers at least a portion of the opening. The engaging portion comprises: an extending portion extending in the first direction; and a pair of engaging claws, which protrude from the lower end of the extending portion at one end side and the other end side of the extending portion in a second direction orthogonal to the first direction, respectively, Each of the engaging claws has an engaging surface that is continuous with a side surface of the extending portion that intersects the first direction and is inclined relative to the first direction. The receiving portion has a pair of protrusions, the pair of protrusions including protrusion surfaces that are arranged in a manner opposite to the respective engagement surfaces and are inclined relative to the first direction. The engaging surface and the protruding surface are roughened surfaces.

10. The semiconductor device according to claim 9, wherein: The surface roughness of the engaging surface and the surface roughness of the protruding surface are greater than 10 micrometers.

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