Wafer thinning machine based on electromagnetic damping vibration absorption

Abstract

The invention discloses a wafer thinning machine based on electromagnetic damping, and belongs to the field of wafer thinning. Comprising a machine frame, a grinding system, a workbench, a transmission system and a vibration reduction system, the machine frame is composed of a base, a main machine frame, an upper supporting frame and a lower supporting frame, the grinding system drives a grinding wheel through a main shaft to grind wafers, the workbench is provided with a lifting and rotating mechanism to ensure accurate positioning of the wafers, and a dust cover is arranged outside a vacuum suction cup. The transmission system adopts a guide rail and sliding block structure to realize motion transmission. The vibration reduction system comprises four sets of vibration isolation sizing blocks, a double-air-cylinder self-weight vibration reduction structure on the top of the shaft barrel and an electromagnetic damper, two acceleration sensors carried by the shaft barrel monitor vibration signals in real time, and the electromagnetic damper achieves active vibration absorption by adjusting the magnetic field intensity. According to the device, real-time vibration absorption can be achieved in the grinding process through the multi-stage vibration reduction synergistic effect, the machining precision and the equipment stability are effectively improved, and meanwhile the service life of the thinning machine is prolonged. The method has the technical advantages of high response speed and high control precision.

Description

Technical field:

[0001] The invention relates to the technical field of wafer thinning, and in particular to a wafer thinning machine based on electromagnetic damping vibration absorption. Background technology:

[0002] With the continuous development of the semiconductor industry, wafer thinning technology plays an increasingly important role in the integrated circuit manufacturing process. The wafer thinning process aims to reduce the thickness of the wafer through a high-precision grinding process to meet the needs of high-performance chip manufacturing. However, due to the vibration and instability during the grinding process, it often has an adverse effect on the wafer thinning effect, processing accuracy and equipment service life.

[0003] Although the existing wafer thinning machines can complete the wafer thinning operation to a certain extent, in actual use, wear and tear and equipment vibration have a great impact on the wafers during the thinning process, resulting in low processing accuracy; traditional vibration reduction technology mostly relies on passive vibration reduction technology, which is difficult to respond in time, thus affecting the processing quality and stability; due to the use of passive vibration reduction technology, the existing equipment lacks vibration monitoring devices and cannot quickly capture vibration signals, making it impossible for the vibration reduction device to produce a vibration absorption effect in time.

[0004] In order to overcome the above technical bottlenecks and improve the processing accuracy, working stability and service life of wafer thinning machines, there is an urgent need for a wafer thinning device with active vibration absorption function and precise control of the grinding process. Such equipment can not only effectively reduce the interference of vibration on the processing process, but also improve the overall performance and reliability of the equipment, so as to better meet the requirements of high precision and long life. The present invention aims to solve the above problems and proposes a new type of wafer thinning machine. By adopting an electromagnetic damper in combination with multiple vibration reduction devices, combined with a precise transmission system and a grinding system, it can achieve high-precision thinning operations on wafers, while effectively reducing vibration interference and improving the stability and service life of the equipment. Summary of the invention:

[0005] In order to solve the above problems, the purpose of the present invention is to provide a wafer thinning machine based on electromagnetic damping vibration absorption, which is used to reduce the vibration of the wafer thinning process and improve the stability of the processing process.

[0006] The wafer thinning machine includes a frame, a grinding system, a workbench, a transmission system and a vibration reduction system. The frame includes a thinning machine base, a thinning machine main frame, a lower support frame and an upper support frame. The grinding system includes a spindle, an external shaft barrel and a grinding wheel. The workbench includes a lifting device, a rotating device, a vacuum suction cup and a dust cover. The transmission system includes a guide rail and a slider. The vibration reduction system includes a vibration isolation pad, a double-cylinder deadweight vibration reduction device, an electromagnetic damper and an acceleration sensor.

[0007] The four vibration isolation pads of the vibration reduction system are located under the base, which have an overall vibration reduction effect on the entire thinning machine; the double-cylinder deadweight vibration reduction device connects the shaft barrels suspended in the air through the connecting shaft barrel sleeves, reducing the vibration caused by the deadweight of the grinding system and improving the grinding stability of the grinding wheel; the electromagnetic damper is installed above the shaft barrel, and two acceleration sensors are installed at the same time.

[0008] The electromagnetic damper includes a damper base, a guide rail, a motor, a lead screw, a slider, a lead screw nut, a back baffle, a conductor bracket, a side baffle, a lead screw knob, a conductor plate, a permanent magnet and a magnet plate.

[0009] The conductor bracket is placed in the middle of the damper base, and a conductor plate is arranged on the bracket to amplify the vibration of the grinding process and cut the magnetic flux lines in the magnetic field to generate magnetic force to achieve the vibration absorption effect.

[0010] The permanent magnet array is placed on the magnet plate and moves laterally through a slider and a lead screw nut. A motor is installed on the lead screw. According to the size of the vibration signal transmitted by the acceleration sensor, the lead screw is rotated by the motor to adjust the distance between the two permanent magnet arrays. The size of the magnetic field can be adjusted at any time during the operation, thereby realizing active vibration absorption. A knob is set at the other end for manual rotation to adjust the distance between the two permanent magnet arrays.

[0011] The electromagnetic damper provides a magnetic field through two opposing permanent magnet arrays, and can adjust the permanent magnet array mode after shutdown to change the maximum adjustment range of the magnetic field according to the vibration magnitude of the thinning machine during operation.

[0012] The base is placed on four vibration isolation pads, and the main frame of the thinning machine is placed above it to carry the workbench, transmission system, grinding system and vibration reduction system.

[0013] There are two guide rails above the main frame of the thinning machine for the movement of the slider under the workbench. The workbench is placed above the slider of the transmission system. The lifting device of the workbench can adjust the longitudinal position of the wafer and the distance between the wafer and the grinding wheel. The rotating device can make the wafer rotate at high speed so that the entire circumferential surface of the wafer can be ground to ensure that the wafer thickness is evenly thinned. The wafer is fixed by the vacuum suction cup of the workbench and is surrounded by a dust cover.

[0014] The grinding system mainly relies on the spindle in the shaft barrel to drive the grinding wheel to rotate, grinding and thinning the wafer on the workbench. The shaft barrel is fixed to the external shaft barrel sleeve through a flange.

[0015] An upper support frame is installed above the lower support frame, and two guide rails are installed on the side of the upper support frame. There is a protruding platform above the side of the lower support frame, and the lower parts of the two guide rails are in contact with it to increase the stability of the guide rails. Two cylinder arms are installed above the upper support frame, and the cylinder arms are connected to two deadweight cylinders. The deadweight cylinders are connected to the shaft barrel sleeves to connect the shaft barrels suspended in the air to reduce the vibration caused by the deadweight of the grinding system. The shaft barrel sleeves are connected together through the shaft barrel sleeve back plates, and their longitudinal positions are adjusted by sliders.

[0016] The present invention establishes a vibration reduction system on the wafer thinning machine, especially installs an electromagnetic damper and an acceleration sensor on the shaft barrel, monitors the vibration signal through the acceleration sensor, adjusts the magnetic field size at any time with the electromagnetic damper, responds in time, and actively absorbs vibration, thereby improving the stability of the wafer thinning machine's working process and the service life of the thinning machine. Description of the drawings:

[0017] Figure 1 , front view of the wafer thinning machine;

[0018] Figure 2 , structural diagram of electromagnetic damper;

[0019] Figure 3 , shaft barrel-electromagnetic damper-acceleration sensor structure diagram;

[0020] Figure 4 , top view of the wafer thinning machine;

[0021] Figure 5 , rear view of the wafer thinning machine;

[0022] Figure 6 , right view of the wafer thinning machine;

[0023] Figure 7 , Wafer thinning machine left view structure diagram;

[0024] Among them: 1-vibration isolation pad; 2-thinning machine base; 3-thinning machine main frame; 4-guide rail 1; 5-slider 1; 6-stage lifting device; 7-stage rotating device; 8-dust cover; 9-vacuum suction cup; 10-grinding wheel; 11-axle barrel sleeve; 12-lower support frame; 13-axle barrel; 14-flange; 15-guide rail 2; 16-upper support frame; 17-self-weight cylinder; 18-acceleration sensor; 19-electromagnetic damper; 20-axle barrel sleeve back plate; 21-slider 2; 22-cylinder arm; 23-damper base; 24-guide rail 3; 25-motor; 26-screw screw; 27-slider 3; 28-screw nut; 29-back baffle; 30-conductor bracket; 31-side baffle; 32-screw knob; 33-conductor plate; 34-permanent magnet; 35-magnet plate. Specific implementation method:

[0025] The technical solutions in the embodiments of the present invention are clearly and completely described below in conjunction with specific implementation methods. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0026] A wafer thinning machine based on electromagnetic damping vibration absorption, such as Figure 1 It includes a frame, a grinding system, a workbench, a transmission system and a vibration reduction system. The frame includes a thinning machine base, a thinning machine main frame, a lower support frame and an upper support frame. The grinding system includes a spindle, an external shaft barrel and a grinding wheel. The workbench includes a lifting device, a rotating device, a vacuum suction cup and a dust cover. The transmission system includes a guide rail and a slider. The vibration reduction system includes a vibration isolation pad, a double-cylinder deadweight vibration reduction device, an electromagnetic damper and an acceleration sensor.

[0027] The four vibration isolation pads of the vibration reduction system are located under the base, which have an overall vibration reduction effect on the entire thinning machine; the double-cylinder deadweight vibration reduction device connects the shaft barrels suspended in the air through the connecting shaft barrel sleeves, reducing the vibration caused by the deadweight of the grinding system and improving the grinding stability of the grinding wheel; the electromagnetic damper is installed above the shaft barrel, and two acceleration sensors are installed at the same time.

[0028] like Figure 2 The electromagnetic damper includes a damper base, a guide rail 3, a motor, a lead screw, a slider 3, a lead screw nut, a back baffle, a conductor bracket, a side baffle, a lead screw knob, a conductor plate, a permanent magnet and a magnet plate.

[0029] The conductor bracket is placed in the middle of the damper base, and a conductor plate is arranged on the bracket to amplify the vibration of the grinding process and cut the magnetic flux lines in the magnetic field to generate magnetic force to achieve the vibration reduction effect.

[0030] The permanent magnet array is placed on a magnet plate, such as Figure 2 , 20 permanent magnets are arranged, distributed in five rows, with four magnets in each row. The slider 3 and the lead screw nut can realize lateral movement. A motor is arranged on the lead screw. According to the size of the vibration signal transmitted by the acceleration sensor, the lead screw can be rotated by the motor to adjust the distance between the two permanent magnet arrays. The size of the magnetic field can be adjusted at any time during the working process, thereby realizing active vibration absorption. A knob is arranged at the other end for manual rotation to adjust the distance between the two permanent magnet arrays.

[0031] The electromagnetic damper provides a magnetic field through two opposing permanent magnet arrays, and can adjust the permanent magnet array mode to change the maximum magnetic field after stopping the machine according to the vibration magnitude during operation of the thinning machine.

[0032] The base is placed on four vibration isolation pads, and the main frame of the thinning machine is placed above it to carry the workbench, transmission system, grinding system and vibration reduction system.

[0033] Two guide rails 1 are provided above the main frame of the thinning machine for the movement of the slider 1 under the workbench. The workbench is placed above the slider 1 of the transmission system. The lifting device of the workbench can adjust the longitudinal position of the wafer and the distance between the wafer and the grinding wheel. The rotating device can make the wafer rotate at high speed so that the entire circumferential surface of the wafer can be ground to ensure that the wafer thickness is evenly thinned. The wafer is fixed by the vacuum suction cup of the workbench and is surrounded by a dust cover.

[0034] The grinding system mainly relies on the spindle in the shaft barrel to drive the grinding wheel to rotate, grinding and thinning the wafer on the workbench. The shaft barrel is fixed to the external shaft barrel sleeve through a flange.

[0035] An upper support frame is installed above the lower support frame, and two guide rails 2 are installed on the side of the upper support frame. There is a protruding platform above the side of the lower support frame, and the lower parts of the two guide rails are in contact with it to increase the stability of the guide rails. Two cylinder arms are installed above the upper support frame, and the cylinder arms are connected to two deadweight cylinders. The deadweight cylinders are connected to the shaft barrel sleeves to connect the shaft barrels suspended in the air to reduce the vibration caused by the deadweight of the grinding system. The shaft barrel sleeves are connected together through the shaft barrel sleeve back plates, and their longitudinal positions are adjusted by the slider 2.

[0036] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A wafer thinning machine based on electromagnetic damping vibration absorption, comprising a frame, a grinding system, a workbench, a transmission system and a vibration reduction system, characterized in that: The frame includes a thinning machine base, a thinning machine main frame, a lower support frame and an upper support frame; the grinding system includes a main shaft, an external shaft barrel and a grinding wheel; the workbench includes a lifting device, a rotating device, a vacuum suction cup and a dust cover; the transmission system includes a guide rail and a slider; the vibration reduction system includes a vibration isolation pad, a double-cylinder deadweight vibration reduction device, an electromagnetic damper and an acceleration sensor.

2. A wafer thinning machine based on electromagnetic damping vibration absorption as claimed in claim 1, characterized in that: The four vibration isolation pads of the vibration reduction system are located under the base, which have an overall vibration reduction effect on the entire thinning machine; the double-cylinder deadweight vibration reduction device connects the shaft barrels suspended in the air through the connecting shaft barrel sleeves, reducing the vibration caused by the deadweight of the grinding system and improving the grinding stability of the grinding wheel; the electromagnetic damper is installed above the shaft barrel, and two acceleration sensors are installed at the same time.

3. A wafer thinning machine based on electromagnetic damping vibration absorption as claimed in claim 2, characterized in that: The electromagnetic damper includes a damper base, a guide rail, a motor, a lead screw, a slider, a lead screw nut, a back baffle, a conductor bracket, a side baffle, a lead screw knob, a conductor plate, a permanent magnet and a magnet plate.

4. A wafer thinning machine based on electromagnetic damping vibration absorption as claimed in claim 3, characterized in that: The conductor bracket is placed in the middle of the damper base, and a conductor plate is arranged on the bracket to amplify the vibration of the grinding process and cut the magnetic flux lines in the magnetic field to generate magnetic force to achieve the vibration absorption effect.

5. A wafer thinning machine based on electromagnetic damping vibration absorption as claimed in claim 3, characterized in that: The permanent magnet array is placed on the magnet plate and moves laterally through a slider and a lead screw nut. A motor is installed on the lead screw. According to the size of the vibration signal transmitted by the acceleration sensor, the lead screw is rotated by the motor to adjust the distance between the two permanent magnet arrays. The size of the magnetic field can be adjusted at any time during the operation, thereby realizing active vibration absorption. A knob is set at the other end for manual rotation to adjust the distance between the two permanent magnet arrays.

6. A wafer thinning machine based on electromagnetic damping vibration absorption as claimed in claim 3, characterized in that: The electromagnetic damper provides a magnetic field through two opposing permanent magnet arrays, and can adjust the permanent magnet array mode after shutdown to change the maximum adjustment range of the magnetic field according to the vibration magnitude of the thinning machine during operation.

7. A wafer thinning machine based on electromagnetic damping vibration absorption as claimed in claim 1, characterized in that: The base is placed on four vibration isolation pads, and the main frame of the thinning machine is placed above it to carry the workbench, transmission system, grinding system and vibration reduction system.

8. A wafer thinning machine based on electromagnetic damping vibration absorption as claimed in claim 1, characterized in that: There are two guide rails above the main frame of the thinning machine for the movement of the slider under the workbench. The workbench is placed above the slider of the transmission system. The lifting device of the workbench can adjust the longitudinal position of the wafer and the distance between the wafer and the grinding wheel. The rotating device can make the wafer rotate at high speed so that the entire circumferential surface of the wafer can be ground to ensure that the wafer thickness is evenly thinned. The wafer is fixed by the vacuum suction cup of the workbench and is surrounded by a dust cover.

9. A wafer thinning machine based on electromagnetic damping vibration absorption as claimed in claim 1, characterized in that: The grinding system mainly relies on the spindle in the shaft barrel to drive the grinding wheel to rotate, grinding and thinning the wafer on the workbench. The shaft barrel is fixed to the external shaft barrel sleeve through a flange.

10. The wafer thinning machine based on electromagnetic damping vibration absorption as claimed in claim 1, characterized in that: An upper support frame is installed above the lower support frame, and two guide rails are installed on the side of the upper support frame. There is a protruding platform above the side of the lower support frame, and the lower parts of the two guide rails are in contact with it to increase the stability of the guide rails. Two cylinder arms are installed above the upper support frame, and the cylinder arms are connected to two deadweight cylinders. The deadweight cylinders are connected to the shaft barrel sleeves to connect the shaft barrels suspended in the air to reduce the vibration caused by the deadweight of the grinding system. The shaft barrel sleeves are connected together through the shaft barrel sleeve back plates, and their longitudinal positions are adjusted by sliders.

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