Method for monitoring level of grinding table of chamfering machine

Abstract

The invention relates to a method for monitoring the level of a grinding table of a chamfering machine table, which belongs to the technical field of silicon wafer processing, and comprises the following operation steps of: 1, deploying high-precision infrared laser ray emission modules, and respectively installing the high-precision infrared laser ray emission modules in the 0-degree direction and the 90-degree direction of the grinding table; 2, reasonably configuring infrared laser ray receiving modules, wherein the infrared laser ray receiving modules are mounted in the 180-degree direction and the 270-degree direction of a grinding table respectively; 3, before the machine table starts a machining program, the system sends a starting signal to the infrared laser ray emission module, so that the infrared laser ray emission module begins to emit a laser beam; and meanwhile, the machine table can automatically execute a series of preset actions, so that the grinding table rotates by one circle. And fourthly, when the infrared laser can be smoothly received by the receiving module, the machining requirement is met, and the machine normally conducts machining operation. Real-time monitoring and precise adjustment of the horizontal state of the grinding table are achieved, and the machining precision and the production efficiency are effectively improved.

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer processing, and in particular to a method for monitoring the level of a grinding table of a chamfering machine. Background Art

[0002] In the semiconductor wafer manufacturing process, chamfering the edge of the wafer is a crucial step. When the ingot is cut into wafers, its edge becomes sharp and may be accompanied by edges, burrs, cracks, and even tiny cracks or other defects, and the surface roughness is high. Considering that wafer materials such as silicon (Si), germanium (Ge), indium phosphide (InP), gallium arsenide (GaAs), silicon carbide (SiC), etc. are all brittle, it is particularly important to perform edge chamfering. This step aims to trim the sharp edge of the wafer into a smooth arc, thereby preventing edge cracking and the formation of lattice defects, enhancing the mechanical strength of the wafer edge, and reducing the risk of particle contamination.

[0003] In addition, it can effectively prevent edge cracking problems that occur in subsequent processing, transportation, inspection and other links. The edges of the chamfered wafers are smoother, reducing the possibility of cracking and significantly improving the yield rate of subsequent processes. During the polishing process, if the wafer is not chamfered, its sharp edge will scratch the polishing cloth, shorten its service life, and may have an adverse effect on product quality, such as leaving scratches on the wafer surface.

[0004] At present, the core equipment for chamfering in our company is the W-GM series chamfering machine manufactured by Tokyo Precision in Japan. In this equipment, the grinding table plays a vital role. It is responsible for firmly adsorbing the wafer during the processing process to prevent it from shifting. However, during the machining process, the grinding table may be affected by multiple factors such as environmental factors, human operation, machine failure or natural wear, all of which may cause the grinding table to shift in the horizontal or vertical direction. Once the position of the grinding table shifts, it will directly affect the width of the subsequent processed products, resulting in an increase in the defective rate. Even more regrettable is that the equipment currently lacks an effective monitoring mechanism to promptly detect and prevent such abnormal situations. Summary of the invention

[0005] The present invention mainly solves the deficiencies in the prior art and provides a method for monitoring the level of a grinding table of a chamfering machine, which has the advantages of simple structure and good operating stability. It solves the problem of offset of the position of the monitoring grinding table. It realizes real-time monitoring and precise adjustment of the level of the grinding table, effectively improving the processing accuracy and production efficiency.

[0006] The above technical problems of the present invention are mainly solved by the following technical solutions: A method for monitoring the level of a grinding table of a chamfering machine comprises the following steps: Step 1: Deployment of high-precision infrared laser ray emitting modules. A high-precision infrared laser ray emitting module is installed at the 0° and 90° directions of the grinding table.

[0007] Step 2: Reasonable configuration of infrared laser beam receiving modules. Infrared laser beam receiving modules are installed at 180° and 270° directions of the grinding table.

[0008] Step 3: Perform pre-inspection and automatic calibration before starting the machine. Before the machine starts the processing program, the system sends a start signal to the infrared laser ray emission module to start emitting the laser beam. At the same time, the machine automatically performs a series of preset actions to rotate the grinding table one circle.

[0009] Step 4: When the infrared laser can be successfully received by the receiving module, it means that the horizontal position offset of the grinding table does not exceed 10 microns, which meets the processing requirements and the machine can perform processing operations normally.

[0010] Preferably, the infrared laser beam emission module has a beam accuracy of 0.1 microns and can emit an extremely stable and precise laser beam.

[0011] Preferably, during the installation process, the level of the module is adjusted to ensure that the laser beam is exactly parallel to the table surface of the grinding table, and the spacing between the two laser beams is accurately controlled within the range of 10 microns ± 0.1 microns.

[0012] Preferably, when the emitted infrared rays encounter an obstacle during propagation and are reflected and deflected, causing the infrared signal received by the receiving module to weaken or disappear completely, the system will immediately determine that the grinding table has undergone a horizontal offset and the offset exceeds a threshold of 10 microns.

[0013] As a preference, when the system detects that the grinding table position is offset, the machine will immediately trigger an alarm mechanism to stop processing subsequent products, and automatically send a clear and unambiguous warning signal to the technician, thereby effectively preventing the loss of defective products caused by the horizontal offset of the grinding table.

[0014] Preferably, the warning signal is presented in the form of a visual alarm, an audible alarm, or an error message displayed on a digital display screen, ensuring that technicians can detect abnormal conditions at the first time.

[0015] Preferably, the time interval from the occurrence of a problem to its discovery is shortened through an instant feedback mechanism, providing technicians with valuable processing time so that they can quickly take measures to make adjustments or repairs, thereby effectively avoiding further expansion of the deviation.

[0016] The present invention can achieve the following effects: The present invention provides a method for monitoring the level of a grinding table of a chamfering machine, which has the advantages of simple structure and good operation stability compared with the prior art. The problem of the position deviation of the monitoring grinding table is solved. The real-time monitoring and precise adjustment of the level of the grinding table are realized, which effectively improves the processing accuracy and production efficiency.

[0017] Through the precise sensor system and infrared detection device, it can capture the tiny displacement changes of the grinding table during the processing in real time. Not only is it highly sensitive and can respond quickly to any abnormal offset, but its intelligent characteristics enable the system to analyze data instantly. Once an offset exceeding the preset threshold is detected, the alarm mechanism will be triggered immediately. Real-time monitoring and precise adjustment of the horizontal state of the grinding table are realized. It not only improves processing accuracy and production efficiency, but also provides strong support for the company's quality control and cost control. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of the present invention. DETAILED DESCRIPTION

[0019] The technical solution of the invention is further specifically described below through embodiments and in conjunction with the accompanying drawings.

[0020] Example: Figure 1 As shown, a method for monitoring the level of a grinding table of a chamfering machine includes the following steps: The first step: deployment of high-precision infrared laser ray emission modules, a high-precision infrared laser ray emission module is installed at the 0° and 90° directions of the grinding table. The infrared laser ray emission module has a ray accuracy of 0.1 microns and can emit an extremely stable and precise laser beam.

[0021] During the installation process, the module's horizontal height is adjusted to ensure that the laser beam is parallel to the table surface of the grinding table, and the spacing between the two laser beams is precisely controlled within the range of 10 microns ± 0.1 microns. This not only ensures that the laser beam can accurately reflect the horizontal state of the grinding table, but also lays a solid foundation for subsequent signal reception and processing.

[0022] Step 2: Reasonable configuration of infrared laser beam receiving modules. Infrared laser beam receiving modules are installed at 180° and 270° directions of the grinding table. With high sensitivity and stability, they can accurately capture and identify laser signals, thus realizing real-time monitoring of the horizontal state of the grinding table.

[0023] Step 3: Perform pre-inspection and automatic calibration before starting the machine. Before the machine starts the processing program, the system sends a start signal to the infrared laser ray emission module to start emitting the laser beam. At the same time, the machine automatically performs a series of preset actions to rotate the grinding table one circle.

[0024] Step 4: When the infrared laser can be successfully received by the receiving module, it means that the horizontal position offset of the grinding table does not exceed 10 microns, which meets the processing requirements and the machine can perform processing operations normally.

[0025] When the emitted infrared rays encounter an obstacle during propagation and are reflected and deflected, causing the infrared signal received by the receiving module to weaken or disappear completely, the system will immediately determine that the grinding table has a horizontal offset and the offset exceeds the threshold of 10 microns.

[0026] When the system detects that the grinding table position is offset, the machine will immediately trigger the alarm mechanism and stop processing subsequent products; at the same time, it will automatically send a clear and unambiguous warning signal to the technician. The warning signal is presented in the form of visual alarm, sound alarm or error information displayed on the digital display to ensure that the technician can detect the abnormal situation at the first time. The instant feedback mechanism shortens the time interval from the occurrence of the problem to its discovery, providing technicians with valuable processing time, allowing them to quickly take measures to make adjustments or repairs, thereby effectively preventing the offset from further expanding.

[0027] In summary, the method for monitoring the level of the grinding table of the chamfering machine has the advantages of simple structure and good operation stability. It solves the problem of the offset of the position of the monitoring grinding table. It realizes the real-time monitoring and precise adjustment of the horizontal state of the grinding table, effectively improving the processing accuracy and production efficiency.

[0028] Preventing the width change of the subsequent processed products caused by the position deviation of the grinding table plays a vital role. In the field of precision machining, even a small position deviation may have a significant impact on the dimensional accuracy and overall quality of the final product. Therefore, by timely discovering and correcting the deviation of the grinding table, it can ensure that each batch of processed products meets the established width requirements, thereby significantly improving the production yield and reducing the scrap rate and rework costs. It not only reflects the pursuit of precise control of the processing process, but also deeply reflects the dual guarantee of production efficiency and product quality. It is an important technological advancement in the field of modern intelligent manufacturing.

[0029] The above description is only a specific embodiment of the present invention, but the structural features of the present invention are not limited thereto. Any changes or modifications made by any technician in the field of the present invention are included in the patent scope of the present invention.

Claims

1. A method for monitoring the level of a grinding table of a chamfering machine, characterized in that The steps are as follows: Step 1: Deployment of high-precision infrared laser ray emission modules. A high-precision infrared laser ray emission module is installed at the 0° and 90° directions of the grinding table. Step 2: Reasonable configuration of infrared laser ray receiving modules. Infrared laser ray receiving modules are installed at 180° and 270° directions of the grinding table respectively; Step 3: Perform pre-inspection and automatic calibration before starting the machine. Before the machine starts the processing program, the system sends a start signal to the infrared laser ray emission module to start emitting laser beams. At the same time, the machine automatically performs a series of preset actions to make the grinding table rotate one circle. Step 4: When the infrared laser can be successfully received by the receiving module, it means that the horizontal position offset of the grinding table does not exceed 10 microns, which meets the processing requirements and the machine can perform processing operations normally.

2. The method for monitoring the level of a grinding table of a chamfering machine according to claim 1, characterized in that: The infrared laser ray emission module has a ray accuracy of 0.1 microns and can emit an extremely stable and precise laser beam.

3. The method for monitoring the level of a chamfering machine grinding table according to claim 1 or 2, characterized in that: During the installation process, the level of the module is adjusted to ensure that the laser beam is just parallel to the table of the grinding table, and the distance between the two laser beams is precisely controlled within the range of 10 microns ± 0.1 microns.

4. The method for monitoring the level of a grinding table of a chamfering machine according to claim 1, characterized in that: When the emitted infrared rays encounter an obstacle during propagation and are reflected and deflected, causing the infrared signal received by the receiving module to weaken or disappear completely, the system will immediately determine that the grinding table has a horizontal offset and the offset exceeds the threshold of 10 microns.

5. The method for monitoring the level of a grinding table of a chamfering machine according to claim 4, characterized in that: When the system detects that the position of the grinding table is offset, the machine will immediately trigger the alarm mechanism and stop processing subsequent products; at the same time, it will automatically send a clear and unambiguous warning signal to the technician.

6. The method for monitoring the level of a grinding table of a chamfering machine according to claim 5, characterized in that: Warning signals are presented in the form of visual alarms, audible alarms or error messages displayed on digital displays, ensuring that technicians can detect abnormal situations at the first time.

7. The method for monitoring the level of a chamfering machine grinding table according to claim 6, characterized in that: The instant feedback mechanism shortens the time interval from the occurrence of a problem to its discovery, providing technicians with valuable processing time so that they can quickly take measures to make adjustments or repairs, thereby effectively preventing further expansion of the deviation.

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