Integrated thermal comprehensive test environment system

Abstract

The invention belongs to the technical field of aircraft tests, and relates to an integrated thermal comprehensive test environment system. A test piece (1) of the system is fixed in a vacuum chamber (3), the vacuum chamber (3) is communicated with a vacuum pump set (5), an air compressor (8), a quartz lamp radiation heating system (14) and a heat exchanger (17), the vacuum pump set (5) and the air compressor (8) are subjected to linkage control by a hot pressure coupling control system (4) so as to adjust the pressure of the vacuum chamber, the quartz lamp radiation heating system (14) heats the surface of the test piece (1), and the heat exchanger (17) controls the temperature in the chamber. The test piece (1) is connected with the cooling medium storage tank (21) and is controlled by the heat management control system (20) so as to adjust the temperature in the test piece (1). According to the invention, high-precision dynamic simulation of the external pressure environment of the structure and the thermal load on the surface of the structure can be realized, the coupling effect among the systems is solved, and formation of a thermal comprehensive design method of a hypersonic aircraft is supported.

Description

Technical Field

[0001] The present application belongs to the field of aircraft test technology, and in particular relates to an integrated thermal comprehensive test environment system. Background Art

[0002] The flight environment of hypersonic aircraft has the characteristics of low ultimate pressure and high pressure change rate. At the same time, the surface of the aircraft will also be subjected to severe aerodynamic heat loads during flight. On the one hand, the external aerodynamic heat load causes the structural temperature and the internal cabin environment temperature to rise through the heat transfer of the aircraft structure. On the other hand, the pressure difference between the inside and outside of the cabin causes the high-temperature gas outside the aircraft to leak into the cabin, causing the internal cabin environment temperature to rise and the pressure to change. The high temperature environment of the cabin may cause the equipment in the cabin to fail or even be damaged, thus affecting the safety of the aircraft. Compared with traditional aircraft, the environmental characteristics of hypersonic aircraft pose great challenges to the design of the aircraft's structural thermal protection, thermal sealing and cabin thermal management.

[0003] The coupling of aerodynamic heating and low-pressure environment of hypersonic aircraft has a significant impact on the structural strength and stiffness, flight stability, and thermal management system functions of the aircraft. It is difficult to complete the aircraft thermal integrated design efficiently and with high quality by relying solely on theory and simplified simulation analysis. In order to support the refined creation of thermal integrated simulation models for hypersonic aircraft structure thermal protection, thermal sealing, and cabin thermal management, form an integrated thermal integrated design method, and achieve rapid optimization and verification of the overall design solution, it is necessary to establish an integrated thermal integrated test environment system for thermal protection / thermal sealing / thermal management.

[0004] The design of this type of test environment system is difficult and complex, and it mainly has the following technical characteristics and difficulties:

[0005] 1) Traditional structural thermal protection tests are usually only carried out under atmospheric pressure. Most of them cannot consider the impact of low-pressure environment on structural thermal protection performance. The few low-pressure thermal protection tests are only conducted under steady-state pressure environment, which cannot achieve dynamic pressure environment test assessment of the actual aircraft flight profile.

[0006] 2) Traditional structural thermal sealing tests are usually constant pressure tests at the material or component level, which can only assess the sealing performance of the components or materials themselves. In addition, the test method adopted is also a pressure environment with fixed pressure and fixed pressure difference on both sides of the test piece. It is impossible to assess the structural dynamic thermal sealing performance of structural assemblies under the coupling of dynamic pressure environment and thermal environment.

[0007] 3) Traditional cabin thermal management tests usually involve pasting heating plates on the inner wall of the structure and the pressure environment is a stable pressure. On the one hand, it is difficult to simulate the strong time-varying non-uniform thermal load distribution law of the real structure on the pasted structural thermal wall. On the other hand, the stable pressure environment cannot evaluate the dynamic pressure control strategy of the thermal management system.

[0008] 4) Traditional thermal sealing, thermal protection and thermal management tests not only have significant differences between the single-professional assessment test environment and the actual flight environment, but also fail to consider and resolve the strong coupling effects between the various disciplines. For example, the thermal protection test cannot assess the effect of the cabin environment on the heat transfer of the structure, the thermal sealing test cannot assess the effect of the cabin thermal management on the sealing, and the thermal management test cannot assess the actual effect of the thermal load on the inner wall of the structure and the effect of the sealing on the cabin environment. Summary of the invention

[0009] In order to solve the above problems, the present application provides an integrated thermal comprehensive test environment system to realize an integrated thermal comprehensive test environment system that can simultaneously simulate the dynamic pressure environment and aerodynamic heating environment coupling of the structural thermal protection, thermal sealing and thermal management systems.

[0010] The integrated thermal comprehensive test environment system provided by Benshen mainly includes:

[0011] The test piece is a structural compartment containing a thermal protection system, fixed in a vacuum chamber;

[0012] A vacuum pump group is connected to the vacuum chamber through a first pipeline, and a first regulating valve is provided on the first pipeline;

[0013] The air compressor is connected to the vacuum chamber through a second pipeline, and a second regulating valve is provided on the second pipeline;

[0014] The quartz lamp radiation heating system is arranged in the vacuum chamber, and the output power is adjusted by the thyristor outside the vacuum chamber;

[0015] A heat exchanger connected to the vacuum chamber;

[0016] A cooling medium storage tank is connected to a cooling system inside the test piece through a cooling pipeline, and a flow regulating valve is provided on the cooling pipeline;

[0017] A thermal pressure coupling control system is configured to adjust the first regulating valve and the second regulating valve according to the pressure in the vacuum chamber and the control rate, adjust the thyristor according to the temperature of the surface of the test piece and the control rate, and adjust the valve of the heat exchanger according to the temperature in the vacuum chamber;

[0018] The thermal management control system is configured to adjust the flow regulating valve according to the temperature inside the test piece.

[0019] Preferably, a first baffle valve is further provided on the first pipeline, and a second baffle valve is further provided on the second pipeline, and both the first baffle valve and the second baffle valve are connected to a thermal pressure coupling control system.

[0020] Preferably, the specimen is supported in the vacuum chamber by a specimen support system.

[0021] Preferably, the test piece support system includes a load-bearing device, a heat insulation system and a water cooling system. The test piece is supported on the bottom platform of the vacuum chamber by the load-bearing device. The heat insulation system includes a non-heated area wrapped around the outer surface of the test piece. The water cooling system connects the load-bearing device and a water supply pipeline outside the vacuum chamber.

[0022] Preferably, the vacuum chamber comprises a moving platform, and the test piece is fixed on the moving platform of the vacuum chamber.

[0023] Preferably, the vacuum chamber further comprises:

[0024] Vacuum flange, used to connect the first pipeline of the vacuum pump unit and the second pipeline of the air compressor;

[0025] Aviation plug connector, used to connect the cabin sensor with the thermal pressure coupling control system or thermal management control system outside the cabin;

[0026] Electrodes, used to connect the quartz lamp radiation heating system inside the cabin and the thyristor outside the cabin;

[0027] Mechanical interface, used to connect the cooling medium tank outside the cabin with the cooling system inside the cabin.

[0028] Preferably, the quartz lamp radiation heating system includes a plurality of partitions corresponding to a plurality of heated areas on the outer surface of the test piece, each partition is respectively connected to a thyristor, and each partition includes a plurality of quartz lamp tubes.

[0029] Preferably, the voltage of the quartz lamp is set to 70V.

[0030] This application can achieve high-precision dynamic simulation of the external pressure environment of the structure and the thermal load on the surface of the structure, solve the coupling effect between the various systems, support the formation of a comprehensive thermal design method for hypersonic aircraft, and accelerate the iteration process of the solution. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a system architecture diagram of a preferred embodiment of the integrated thermal comprehensive test environment system of the present application.

[0032] Figure 2 It is a schematic diagram of the thermal-pressure coupling curve control in the cabin.

[0033] Figure 3 It is a schematic diagram of the composition of the test piece support system.

[0034] Figure 4 This is a schematic diagram of the vacuum chamber composition.

[0035] Among them, 1-test piece, 2-test piece support system, 3-vacuum chamber, 4-thermal pressure coupling control system, 5-vacuum pump group, 6-first damper valve, 7-first regulating valve, 8-air compressor, 9-second damper valve 9, 10-second regulating valve, 11-thin film silicon, 12-first temperature sensor, 13-thyristor, 14-quartz lamp radiation heating system, 15-second temperature sensor 15, 16-cooling tower, 17-heat exchanger 17, 18-third temperature sensor, 19-pressure sensor, 20-thermal management control system, 21-cooling medium storage tank, 22-switch valve, 23-flow regulating valve, 24-low temperature flow meter, 25-cooling system;

[0036] 201-carrying device, 202-thermal insulation system, 203-water cooling system, 301-mobile platform, 302-vacuum flange, 303-aviation plug connector, 304-electrode, 305-mechanical interface. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical scheme and advantages of the implementation of this application clearer, the technical scheme in the implementation of this application will be described in more detail in combination with the drawings in the implementation of this application. In the drawings, the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The described implementation is a part of the implementation of this application, not all of the implementations. The implementation described below with reference to the drawings is exemplary and is intended to be used to explain this application, and cannot be understood as a limitation on this application. Based on the implementation in this application, all other implementations obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application. The implementation of this application is described in detail below in combination with the drawings.

[0038] The first aspect of the present application provides an integrated thermal comprehensive test environment system, such as Figure 1-Figure 4 As shown, it mainly includes:

[0039] Test piece 1 is a structural cabin section containing a thermal protection system, fixed in a vacuum cabin 3;

[0040] The vacuum pump group 5 is connected to the vacuum chamber 3 through a first pipeline, and a first regulating valve 7 is provided on the first pipeline;

[0041] The air compressor 8 is connected to the vacuum chamber 3 through a second pipeline, and a second regulating valve 10 is provided on the second pipeline;

[0042] The quartz lamp radiation heating system 14 is arranged in the vacuum chamber 3, and the output power is adjusted by the thyristor 13 outside the vacuum chamber 3;

[0043] The heat exchanger 17 is connected to the vacuum chamber 3;

[0044] A cooling medium storage tank 21 is connected to a cooling system 25 inside the test piece 1 through a cooling pipeline, and a flow regulating valve 23 is provided on the cooling pipeline;

[0045] The thermal pressure coupling control system 4 is configured to adjust the first regulating valve 7 and the second regulating valve 10 according to the pressure and the control rate in the vacuum chamber 3, adjust the thyristor 13 according to the temperature and the control rate on the surface of the test piece 1, and adjust the valve of the heat exchanger 17 according to the temperature in the vacuum chamber 3;

[0046] The thermal management control system 20 is configured to adjust the flow control valve 23 according to the temperature inside the test piece 1 .

[0047] The test piece 1 of the present application is a structural cabin section containing a thermal protection system, which is fixed in a vacuum chamber 3. To this end, the present application controls the pressure and temperature in the vacuum chamber 3 through a thermal-pressure coupling control system 4, and controls the temperature inside the structural cabin of the test piece 1 through a thermal management control system 20.

[0048] refer to Figure 2 The thermo-pressure coupling control system 4 is used to control the pressure environment in the vacuum chamber 3 and the thermal load on the surface of the test piece 1. In terms of the control of the descending section of the pressure curve: a vacuum pump group 5 is used to provide a low-pressure environment for the vacuum chamber 3. The vacuum pump group 5 is composed of a series of vacuum pumps with large and small pumping speeds. In the design of the test environment system, it is necessary to ensure that the pumping speed of the vacuum pump group 5 has the ability to realize the pressure curve. The opening of the first regulating valve 7 is adjusted by the thermo-pressure coupling control system 4 to realize the pressure curve adjustment in the vacuum chamber. The environmental pressure value in the chamber is measured by thin film silicon 11. When the vacuuming causes the environmental pressure curve in the chamber to drop too fast, the air compressor 8 is used to replenish air in the chamber. The thermo-pressure coupling control system 4 realizes the air replenishment adjustment in the vacuum chamber by adjusting the opening of the second regulating valve 10. At the same time, the vacuuming and air replenishment are adjusted to ensure that the pressure curve in the vacuum chamber can be dynamically simulated with high precision.

[0049] Similarly, in terms of controlling the rising section of the pressure curve: an air compressor 8 is used to replenish air and increase the pressure in the vacuum cabin 3, and the opening of the second regulating valve 10 is controlled by the thermal-pressure coupling control system 4 to increase the pressure in the cabin. When the air replenishment speed is too fast, the control system 4 simultaneously adjusts the first regulating valve 7 connected to the vacuum pump 5 to achieve high-precision dynamic adjustment of the pressure-rising section of the cabin pressure curve.

[0050] In some optional implementations, a first flapper valve 6 is further provided on the first pipeline, and a second flapper valve 9 is further provided on the second pipeline. Both the first flapper valve 6 and the second flapper valve 9 are connected to the thermal pressure coupling control system 4 .

[0051] In this embodiment, the first flapper valve 6 and the second flapper valve 9 are used to realize the switch two-position control of vacuuming or gas replenishing of the first pipeline and the second pipeline, which is mainly used in Figure 2 The pressure holding section control aspect of the pressure curve of the illustrated embodiment. In this embodiment, the first baffle valve 6 and the second baffle valve 9 are respectively controlled to be closed by the thermal pressure coupling control system 4 to ensure that the pressure in the vacuum chamber is stable within the error range.

[0052] In terms of structural thermal load control, the thermal-pressure coupling control system 4 collects the temperature value of the test piece surface through the first temperature sensor 12, and adjusts the output power of the thyristor 13 to adjust the thermal load curve control of the structural thermal surface by the low-voltage quartz lamp radiation heating system 14.

[0053] In order to control the non-uniform heat load on the thermal surface of the structure, in some optional embodiments, the quartz lamp radiation heating system 14 includes multiple partitions, corresponding to the multiple heated areas on the outer surface of the test piece 1, each partition is connected to a thyristor 13, and each partition includes multiple quartz lamp tubes. In this embodiment, multiple thyristors 13 are independently connected to the multi-partition low-voltage quartz lamp radiation heating system 14 to achieve independent control of the heat load of different partitions. When designing the test plan, the maximum power of each partition of the low-voltage quartz lamp radiation heating system 14 must be able to meet the requirements of the thermal load curve of the structure.

[0054] In order to prevent electrode discharge from occurring in the low-pressure environment of the vacuum chamber 3 during the heating test, in some optional implementations, the voltage of the quartz lamp is set to 70V.

[0055] The second temperature sensors 15 are evenly arranged on the inner wall of the vacuum chamber 3, and the number of the second temperature sensors 15 is determined according to the size of the vacuum chamber 3. During the test heating process, the measurement value of the second temperature sensor 15 is fed back to the thermal-pressure coupling control system 4. Based on the measurement result, the thermal-pressure coupling control system 4 adjusts the heat exchanger 17 to ensure that the temperature of the vacuum chamber is within a safe temperature range. The cooling tower 16 is upstream of the heat exchanger 17 to provide cooling medium for the heat exchanger.

[0056] In terms of temperature control inside the structural cabin of the test piece 1, the thermal management control system 20 collects the temperature and pressure values ​​of the third temperature sensor 18 and the pressure sensor 19 inside the test piece 1, adjusts the flow control valve 23 downstream of the cooling medium storage tank 21 to control the flow, and collects and monitors the flow of the low-temperature pipeline through the low-temperature flow meter 24. The switch valve 22 is connected to the cooling medium storage tank 21 to realize the switch state of the cooling medium storage tank 21. The cooling medium enters the cooling system 25 through the low-temperature pipeline to control the temperature inside the cabin of the test piece 1.

[0057] In some optional embodiments, the specimen 1 is supported in the vacuum chamber 3 by a specimen supporting system 2 .

[0058] In some optional embodiments, the test piece support system 2 includes a carrying device 201, an insulation system 202 and a water cooling system 203. The test piece 1 is supported on the bottom platform of the vacuum chamber 3 by the carrying device 201. The insulation system 202 includes a non-heated area wrapped on the outer surface of the test piece 1. The water cooling system 203 connects the carrying device 201 and a water supply pipeline outside the vacuum chamber 3.

[0059] refer to Figure 3 In this embodiment, the carrying device 201 ensures that the test piece can be stably placed in the vacuum chamber 3. The heat insulation system 202 of the test environment uses heat insulation materials to wrap the non-heated area on the outer surface of the test piece to prevent the non-heated area from being irradiated by the low-voltage quartz lamp radiation heating system 14 during the heating process. The water cooling system 203 of the test fixture is placed in the external area of ​​the vacuum chamber 3. The water cooling system 203 cools the test piece carrying device 201 through the flange connection on the vacuum chamber 3 to prevent the carrying device from being heated during the test to reduce its strength and rigidity, thereby affecting the test and even the safety of the test.

[0060] In some optional embodiments, the vacuum chamber 3 includes a moving platform 301 , and the test piece 1 is fixed on the moving platform 301 of the vacuum chamber 3 .

[0061] In this embodiment, the vacuum chamber 3 is a vacuum pressure device used to provide a pressure-sealed environment for the test piece 1. Figure 4 The test piece 1 and the test piece support system 2 are placed on a mobile platform 301, and the mobile platform 301 can be moved to ensure the installation work such as the hoisting of the test piece.

[0062] In some optional embodiments, the vacuum chamber 3 further includes:

[0063] The vacuum flange 302 is used to connect the first pipeline of the vacuum pump group 5 and the second pipeline of the air compressor 8;

[0064] The aviation plug connector 303 is used to connect the cabin sensor with the thermal pressure coupling control system 4 or the thermal management control system 20 outside the cabin;

[0065] Electrode 304, used to connect the quartz lamp radiation heating system 14 in the cabin and the thyristor 13 outside the cabin;

[0066] The mechanical interface 305 is used to connect the cooling medium storage tank 21 outside the cabin with the cooling system 25 inside the cabin.

[0067] The present application establishes an integrated thermal comprehensive test environment system for thermal protection / thermal sealing / thermal management. Through this system, high-precision dynamic simulation of the external pressure environment of the structure and the thermal load on the surface of the structure can be achieved, the coupling effect between the systems is resolved, the formation of a thermal comprehensive design method for hypersonic aircraft is supported, and the iteration process of the scheme is accelerated. The overall thermal-pressure coupling test scheme, the dynamic control strategy for vacuum extraction and air replenishment, the low-voltage quartz lamp radiation heating method, etc. of the present application have good application prospects and reference significance for other types of environmental comprehensive tests.

[0068] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. An integrated thermal comprehensive test environment system, characterized in that: include: The test piece (1) is a structural compartment containing a thermal protection system and is fixed in a vacuum chamber (3); A vacuum pump group (5) is connected to the vacuum chamber (3) via a first pipeline, wherein a first regulating valve (7) is provided on the first pipeline; An air compressor (8) is connected to the vacuum chamber (3) via a second pipeline, wherein a second regulating valve (10) is provided on the second pipeline; A quartz lamp radiation heating system (14) is arranged in the vacuum chamber (3) and has its output power adjusted by a thyristor (13) outside the vacuum chamber (3); A heat exchanger (17) connected to the vacuum chamber (3); A cooling medium storage tank (21) is connected to a cooling system (25) inside the test piece (1) via a cooling pipeline, wherein a flow regulating valve (23) is provided on the cooling pipeline; A thermal pressure coupling control system (4) is configured to adjust the first regulating valve (7) and the second regulating valve (10) according to the pressure in the vacuum chamber (3) and the control rate, to adjust the thyristor (13) according to the temperature of the surface of the test piece (1) and the control rate, and to adjust the valve of the heat exchanger (17) according to the temperature in the vacuum chamber (3); The thermal management control system (20) is configured to adjust the flow control valve (23) according to the temperature inside the test piece (1).

2. The integrated thermal comprehensive test environment system according to claim 1, characterized in that: A first flapper valve (6) is also provided on the first pipeline, and a second flapper valve (9) is also provided on the second pipeline. The first flapper valve (6) and the second flapper valve (9) are both connected to the thermal pressure coupling control system (4).

3. The integrated thermal comprehensive test environment system according to claim 1, characterized in that: The test piece (1) is supported in the vacuum chamber (3) by a test piece supporting system (2).

4. The integrated thermal comprehensive test environment system according to claim 3, characterized in that: The test piece support system (2) comprises a load-bearing device (201), a heat insulation system (202) and a water cooling system (203); the test piece (1) is supported on a bottom platform of a vacuum chamber (3) by the load-bearing device (201); the heat insulation system (202) comprises a non-heated area wrapped around the outer surface of the test piece (1); and the water cooling system (203) is connected to a water supply pipeline outside the load-bearing device (201) and the vacuum chamber (3).

5. The integrated thermal comprehensive test environment system according to claim 1, characterized in that: The vacuum chamber (3) comprises a moving platform (301), and the test piece (1) is fixed on the moving platform (301) of the vacuum chamber (3).

6. The integrated thermal comprehensive test environment system according to claim 1, characterized in that: The vacuum chamber (3) further comprises: A vacuum flange (302) for connecting to a first pipeline of a vacuum pump unit (5) and a second pipeline of an air compressor (8); An aviation plug connector (303) for connecting a sensor inside the cabin to a thermal pressure coupling control system (4) or a thermal management control system (20) outside the cabin; An electrode (304) for connecting a quartz lamp radiation heating system (14) inside the cabin and a thyristor (13) outside the cabin; The mechanical interface (305) is used to connect the cooling medium storage tank (21) outside the cabin and the cooling system (25) inside the cabin.

7. The integrated thermal comprehensive test environment system according to claim 1, characterized in that: The quartz lamp radiation heating system (14) comprises a plurality of partitions corresponding to a plurality of heating areas on the outer surface of the test piece (1), each partition is respectively connected to a thyristor (13), and each partition comprises a plurality of quartz lamp tubes.

8. The integrated thermal comprehensive test environment system according to claim 7, characterized in that: The voltage of the quartz lamp is set to 70V.

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