Semi-solid adhesive film, display module and packaging method of module lamp panel

Abstract

The invention discloses a packaging method of a semi-solid adhesive film, a display module and a module lamp panel, and the packaging method of the module lamp panel comprises the following steps: providing a first lamp panel prototype and the semi-solid adhesive film, placing the first lamp panel prototype on a carrier in a manner that the lamp surface of the first lamp panel prototype faces upwards, and tearing off a first release film layer of the semi-solid adhesive film, the lamp surface of the first lamp panel prototype is covered with a semi-solid adhesive film, and the surface of the side, away from the second release film layer, of the semi-solid adhesive film layer makes contact with the lamp surface of the first lamp panel prototype; after the semi-solid adhesive film layer and the lamp face of the first lamp panel prototype are completely attached and cured in a preset mode, a second release film layer of the semi-solid adhesive film is torn off, and a second lamp panel prototype is obtained; and carrying out preset anti-glare treatment on the lamp surface of the second lamp panel prototype to obtain a target module lamp panel. According to the technical scheme, the production efficiency of the display module can be improved, and the attractiveness and the display effect of the display module are ensured.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a packaging method for a semi-solid adhesive film, a display module, and a module light board. Background Art

[0002] The packaging process of Mini LED display modules is mainly based on COB packaging. Since Mini LED requires high precision, all manufacturers currently use molding technology to seal and protect it. The commonly used packaging glue is a thermosetting material, such as epoxy resin or silicone resin, which has a very long curing time. It is generally divided into two stages of curing, with an initial curing time of more than 4 minutes and a long curing time of about 3 hours. As a result, the production efficiency of the display module is relatively low. At the same time, in order to obtain a better display module effect, each manufacturer will also add diffusion materials or melanin and other materials to the packaging glue. When the temperature of the packaging glue rises during the molding process, the viscosity changes greatly, which can easily lead to uneven distribution of the doped diffusion materials or melanin and other materials during the flow of the glue, which in turn leads to uneven ring marks (commonly known as carrot patterns) or flow marks on the cured packaging colloid, which in turn affects the appearance and luminous effect of the display module. Summary of the invention

[0003] The embodiments of the present application provide a packaging method for a semi-solid adhesive film, a display module and a module light board, aiming to improve the existing display module which adopts the method of sealing and protecting by molding with packaging glue, which not only makes the production efficiency of the display module low, but also when the diffusion material or melanin and other materials are added to the packaging glue, it is easy to cause uneven ring marks or flow marks on the cured packaging colloid, thereby affecting the appearance and luminous effect of the display module. Technical problem.

[0004] To this end, an embodiment of the present application provides a semi-solid adhesive film, which is used in the packaging operation of the module light board, including a first release film layer, a semi-solid adhesive film layer and a second release film layer stacked in sequence, the release force of the first release film layer is smaller than the release force of the second release film layer, and the semi-solid adhesive film layer is a sticky gel structure at room temperature.

[0005] Optionally, in some embodiments of the present application, the semi-solid adhesive film layer is a modified epoxy resin adhesive layer doped with a curing agent and an auxiliary agent, the content of the curing agent is 10% to 50%, and the content of the auxiliary agent is 1% to 20%.

[0006] Optionally, in some embodiments of the present application, the auxiliary agent includes a diffusion material, and the content of the diffusion material is 5% to 20%; and / or, the auxiliary agent includes a black material, and the content of the black material is 1% to 5%.

[0007] Optionally, in some embodiments of the present application, both the first release film layer and the second release film layer are polyester film layers doped with a release agent; and / or,

[0008] The release force of the first release film layer is 3 gf / in to 12 gf / in, and the release force of the second release film layer is 30 gf / in to 60 gf / in.

[0009] Optionally, in some embodiments of the present application, the thickness of the semi-solid adhesive film layer is 50 μm to 500 μm; and / or,

[0010] The thickness of the first release film layer is 50 μm to 100 μm; and / or,

[0011] The thickness of the second release film layer is 50 μm to 100 μm.

[0012] In addition, the embodiment of the present application also provides a packaging method for a module light board, comprising the following steps:

[0013] Providing a first light board prototype and the above-mentioned semi-solid adhesive film, placing the first light board prototype on a carrier with the lamp surface facing upward, and after tearing off the first release film layer of the semi-solid adhesive film, covering the semi-solid adhesive film on the lamp surface of the first light board prototype, and making the side surface of the semi-solid adhesive film layer away from the second release film layer contact with the lamp surface of the first light board prototype;

[0014] After the semi-solid adhesive film layer is completely attached to the lamp surface of the first lamp panel prototype in a preset manner and cured, the second release film layer of the semi-solid adhesive film is torn off to obtain a second lamp panel prototype;

[0015] The lamp surface of the second lamp panel prototype is subjected to a preset anti-glare treatment to obtain a target module lamp panel.

[0016] Optionally, in some embodiments of the present application, the step of making the semi-solid adhesive film layer completely adhere to the lamp surface of the first lamp panel prototype in a preset manner includes:

[0017] A roller laminating device is provided, and the semi-solid adhesive film is subjected to a roller pressing process by the roller laminating device, and then subjected to a degassing process, so that the semi-solid adhesive film layer is completely laminated with the lamp surface of the first lamp panel prototype.

[0018] Optionally, in some embodiments of the present application, the step of making the semi-solid adhesive film layer completely adhere to the lamp surface of the first lamp panel prototype in a preset manner includes:

[0019] A rolling device and a vacuum chamber are provided, and the semi-solid adhesive film is rolled by the rolling device in the vacuum chamber so that the semi-solid adhesive film layer is completely fitted with the lamp surface of the first lamp panel prototype.

[0020] Optionally, in some embodiments of the present application, the step of performing a preset anti-glare treatment on the lamp surface of the second lamp board prototype to obtain a target module lamp board includes:

[0021] A black functional film is attached to the lamp surface of the second lamp board prototype, or the lamp surface of the second lamp board prototype is sprayed with matte treatment to obtain a target module lamp board.

[0022] In addition, an embodiment of the present application further provides a display module, including a module light board, and the module light board is manufactured by the above-mentioned packaging method.

[0023] The technical solution provided by the present application mainly adopts a semi-solid adhesive film in the process of encapsulating the lamp surface of the module lamp board, and the semi-solid adhesive film layer of the semi-solid adhesive film is a sticky gel structure at room temperature. Therefore, in the process of encapsulation, the semi-solid adhesive film layer of the semi-solid adhesive film can be quickly bonded to the lamp surface of the module lamp board by methods such as roller bonding. In this way, since the semi-solid adhesive film layer after bonding can be quickly cured, it can greatly improve the production efficiency of the display module. At the same time, since the semi-solid adhesive film layer after bonding will remain flat under the surface tension of the second release film layer due to the high elasticity of the gel structure itself, it is ensured that the surface of the encapsulation adhesive layer formed after the semi-solid adhesive film layer is cured has excellent flatness, and because of the uniform characteristics of the gel structure itself, the material will not change and flow during the rapid curing process, ensuring that the encapsulation adhesive layer formed after the semi-solid adhesive film layer is cured is uniform and will not have ring marks or flow marks, thereby ensuring the beauty and display effect of the display module. It can be seen that the present technical solution can effectively improve the existing display module which adopts the encapsulation glue molding method for sealing and protection, which not only makes the production efficiency of the display module low, but also when the diffusion material or melanin and other materials are added to the encapsulation glue, it is easy to cause uneven ring marks or flow marks on the encapsulation colloid after curing, thereby affecting the appearance and luminous effect of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0025] Figure 1 This is a schematic diagram of the structure of the semi-solid film in the embodiment of the present application;

[0026] Figure 2 This is a flowchart of a packaging method for a module light board in an embodiment of the present application;

[0027] Figure 3 This is a schematic diagram of the structure of the module light board in the embodiment of the present application;

[0028] Figure 4 This is a schematic diagram of the roller laminating equipment in the embodiment of the present application individually laminating the module light board;

[0029] Figure 5 It is a schematic diagram of the roller lamination equipment in the embodiment of the present application performing roller lamination on the module light board under the vacuum chamber. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0031] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0032] In addition, the descriptions of "first", "second", etc. in this application are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0033] In one embodiment, Figure 1 As shown, an embodiment of the present application provides a semi-solid adhesive film 100, which mainly includes a first release film layer 110, a semi-solid adhesive film layer 120 and a second release film layer 130 stacked in sequence, the release force of the first release film layer 110 is smaller than the release force of the second release film layer 130, and the semi-solid adhesive film layer 120 is a viscous gel structure at room temperature.

[0034] It can be understood that the semi-solid adhesive film 100 in the embodiment of the present application is mainly used in the packaging operation of the module light board, that is, by pressing the semi-solid adhesive film layer 120 of the semi-solid adhesive film 100 on the lamp surface of the module light board and solidifying it, the lamp surface of the module light board is packaged and protected. Since the semi-solid adhesive film layer 120 is a viscous gel structure at room temperature, when the semi-solid adhesive film 100 in this example is not used for the packaging of the module light board, the first release film layer 110 and the second release film layer 130 located on both sides of the semi-solid adhesive film layer 120 can form a good enclosure protection for the semi-solid adhesive film layer 120, and in order to further ensure the enclosure protection effect of the first release film layer 110 and the second release film layer 130 on the semi-solid adhesive film layer 120, the size of the first release film layer 110 and the size of the second release film layer 130 should be larger than the size of the semi-solid adhesive film layer 120. Generally speaking, the semi-solid film 100 is mainly a rectangular structure, so the above-mentioned dimensions mainly refer to the length and width, that is, the length of the first release film layer 110 and the length of the second release film layer 130 should both be greater than the length of the semi-solid film layer 120, and the width of the first release film layer 110 and the width of the second release film layer 130 should both be greater than the width of the semi-solid film layer 120.

[0035] In this way, the semi-solid adhesive film in the embodiment of the present application, since its semi-solid adhesive film layer 120 is a sticky gel structure at room temperature, when it is not used for the lamp surface packaging of the module light board, the stickiness of the semi-solid adhesive film layer 120 itself can ensure that the first release film layer 110 and the second release film layer 130 are well adhered to the corresponding side surfaces of the semi-solid adhesive film layer 120. When it is used for encapsulating the lamp surface of the module lamp board, the first release film layer 110 can be quickly torn apart by the release force of the first release film layer 110 itself, and then the semi-solid adhesive film layer 120 can be quickly bonded to the lamp surface of the module lamp board by methods such as roller bonding. After bonding, the semi-solid adhesive film layer 120 can not only be quickly cured to greatly improve the production efficiency of the display module, but also remain flat under the surface tension of the second release film layer 130 due to the high elasticity of the gel structure itself, ensuring that the surface of the encapsulation adhesive layer formed after the semi-solid adhesive film layer 120 is cured has excellent flatness, and the uniformity of the gel structure itself will not cause material changes and flows during the rapid curing process, ensuring that the encapsulation adhesive layer formed after the semi-solid adhesive film layer is cured is uniform and will not have ring marks or flow marks, thereby ensuring the beauty and display effect of the display module.

[0036] In some examples, such as Figure 1As shown, the semi-solid adhesive film layer 120 can be specifically a modified epoxy resin adhesive layer doped with a curing agent and an auxiliary agent, the curing agent content is 10% to 50%, and the auxiliary agent content is 1% to 20%. In this way, through the above-mentioned structural setting, on the one hand, the main body of the semi-solid adhesive film layer 120 can be an epoxy system with a higher hardness through the setting of the modified epoxy resin adhesive layer, thereby ensuring that the encapsulation adhesive layer formed after the semi-solid adhesive film layer 120 is cured has good protection performance for the lamp surface of the module light board. On the other hand, by setting a certain proportion of curing agent, the curing efficiency of the semi-solid adhesive film layer 120 and the lamp surface of the module light board can be effectively improved, and by setting a certain proportion of auxiliary agent, the semi-solid adhesive film layer 120 can be cured to form an encapsulation adhesive layer, which can have a corresponding additive effect on the display effect of the display module.

[0037] It is understood that the curing agent mentioned in this example includes but is not limited to UV curing agent, thermal curing agent, etc. The auxiliary agent mentioned in this example includes but is not limited to diffusion material, black material, defoaming agent, etc.

[0038] In some examples, such as Figure 1 As shown, the additive includes a diffusion material, and the content of the diffusion material is 5% to 20%. Thus, through the above-mentioned structural setting, it can be effectively ensured that the semi-solid film layer 120 formed after curing to form a packaging adhesive layer has good light diffusion performance, so as to achieve uniform light distribution of the display module.

[0039] It can be understood that the diffusion material mentioned in this example includes but is not limited to glass beads, silicon dioxide, and silicone.

[0040] In some examples, such as Figure 1 As shown, the additive includes a black material, and the content of the black material is 1% to 5%. In this way, through the above-mentioned structural setting, it is ensured that the semi-solid film layer 120 forms a packaging adhesive layer after curing, which can effectively cover the base color of the module light board, so as to improve the ink color consistency of the lamp surface of the module light board, so as to meet the contrast requirements of the lamp surface of the module light board.

[0041] It can be understood that the black material mentioned in this example includes but is not limited to carbon black, carbon powder, and black dye.

[0042] In some examples, such as Figure 1As shown, the first release film layer 110 and the second release film layer 130 are both polyester film layers doped with release agents. In this way, through the above-mentioned structural setting, when the semi-solid film 100 in this example is not used for the encapsulation of the module light board, the polyester film layers located on both sides of the semi-solid film layer 120 can form a good enclosure protection for the semi-solid film layer 120. When the semi-solid film 100 in this example is used for the encapsulation of the module light board, the polyester film layers located on both sides of the semi-solid film layer 120 can be successively peeled off from the surface of the corresponding side of the semi-solid film layer 120 through the setting of the corresponding release agent, so as to ensure the encapsulation effect of the semi-solid film layer 120 on the module light board. Furthermore, the release force of the first release film layer 110 is 3gf / in~12gf / in, and the release force of the second release film layer 130 is 30gf / in~60gf / in. In this way, through the above-mentioned parameter settings, the release force of the second release film layer 130 can be much greater than the release force of the first release film layer 110. When the semi-solid adhesive film 100 in this example is used for the encapsulation of the module light board, the first release film layer 110 can be quickly peeled off first, and the surface on the corresponding side of the semi-solid adhesive film layer 120 is exposed to contact with the lamp surface of the module light board. Then, a pressure bonding method such as roller bonding is performed on the top of the second release film layer 130 to make the semi-solid adhesive film layer 120 completely bonded to the lamp surface of the module light board. Finally, after the semi-solid adhesive film layer 120 is cured, the second release film layer 110 is quickly peeled off (since the release force of the second release film layer 130 is much greater than the release force of the first release film layer 110, even after pressure is applied to the second release film layer 130 and the semi-solid adhesive film layer 120 is cured, the second release film layer 130 can still be quickly peeled off) to complete the packaging operation of the entire semi-solid adhesive film 100.

[0043] In some examples, such as Figure 1 As shown, the thickness of the semi-solid film layer 120 is 50 μm to 500 μm. Thus, by setting the above parameters, it is possible to ensure that the encapsulation adhesive layer formed after the semi-solid film layer 120 is cured can protect the lamp surface of the module lamp board.

[0044] It is understandable that the specific thickness of the semi-solid film layer 120 in this example may depend on the height of the lamp beads of the module light board. Generally speaking, the thickness of the encapsulation adhesive layer formed after the semi-solid film layer 120 is cured must be at least 50 microns greater than the height of the lamp beads of the module light board.

[0045] In some examples, such as Figure 1 As shown, the thickness of the first release film layer 110 is 50 μm to 100 μm. The thickness of the second release film layer 110 is 50 μm to 100 μm. Thus, by setting the above parameters, it can be ensured that the first release film layer 110 and the second release film layer 110 respectively form a good enclosure protection for the surface of the corresponding side of the semi-solid adhesive film layer 120.

[0046] In one embodiment, Figure 2 As shown, the embodiment of the present application also provides a packaging method for a module light board, comprising the following steps:

[0047] Step S110: Provide a first light board prototype and the semi-solid adhesive film in the above embodiment, place the first light board prototype with the lamp surface facing upward on a carrier, tear off the first release film layer of the semi-solid adhesive film, cover the semi-solid adhesive film on the lamp surface of the first light board prototype, and make the side surface of the semi-solid adhesive film layer away from the second release film layer contact with the lamp surface of the first light board prototype.

[0048] It is understandable that if Figure 1 and Figure 3 As shown, the packaging method of the embodiment of the present application can be specifically applied to the packaging of the module light board 200 of the display module. The semi-solid adhesive film in the steps of this method specifically refers to the semi-solid adhesive film 100 in the above-mentioned embodiment, that is, it includes a first release film layer 110, a semi-solid adhesive film layer 120 and a second release film layer 130 stacked in sequence. The first light board prototype in the steps of this method specifically refers to the module light board before packaging, which generally includes a light board body 210, a plurality of lamp beads 220 (that is, a plurality of LED chip units, each LED chip unit may specifically include three chips of R / G / B) arranged on the surface of one side of the light board body 210, and a plurality of driver ICs (not shown in the figure, the setting method thereof is the same as that of the lamp beads, and both may adopt conventional component patch settings, which will not be described here in detail to ensure the normal display function drive of the module light board) arranged on the surface of the other side of the light board body 210. Therefore, the lamp surface of the first lamp board prototype in the step of the method mainly refers to the side surface of the lamp board body 210 provided with a plurality of lamp beads 220, so that when the lamp surface of the first lamp board prototype is placed on the carrier with the lamp surface facing upward in the step of the method, the semi-solid adhesive film 100 of the first release film layer 110 is torn off, so that the lamp surface of the first lamp board prototype can be better covered, and the side surface of the semi-solid adhesive film layer 120 away from the second release film layer 120 can contact the lamp surface of the first lamp board prototype.

[0049] Step S120: After the semi-solid adhesive film layer is completely attached to the lamp surface of the first lamp panel prototype in a preset manner and solidified, the second release film layer of the semi-solid adhesive film is torn off to obtain the second lamp panel prototype.

[0050] It is understandable that if Figure 1 and Figure 3As shown, after the above-mentioned method steps are used to make the side surface of the semi-solid adhesive film layer 120 away from the second release film layer 120 contact the lamp surface of the first light board prototype, the semi-solid adhesive film layer 120 can be further made to completely adhere to the lamp surface of the first light board prototype in a preset manner and after curing, the second release film layer 120 of the semi-solid adhesive film 100 is torn off to obtain the second light board prototype. At this time, the second light board prototype has a packaging adhesive layer 230 formed after the semi-solid adhesive film layer 120 is cured.

[0051] Generally speaking, the semi-solid adhesive film layer 120 can be completely bonded to the lamp surface of the first lamp panel prototype by applying pressure on the second release film layer 120, and then the semi-solid adhesive film layer 120 can be quickly cured by a corresponding curing method such as UV curing, thermal curing, etc., depending on the type of curing agent added to the semi-solid adhesive film layer 120.

[0052] Step S130: performing a preset anti-glare treatment on the lamp surface of the second lamp board prototype to obtain a target module lamp board.

[0053] It is understandable that if Figure 1 and Figure 3 As shown, after the second lamp board prototype is obtained through the above method steps, the lamp surface of the second lamp board prototype can be further subjected to a preset anti-glare treatment to obtain a target module lamp board. At this time, the target module lamp board has a corresponding anti-glare layer 240.

[0054] In this way, the packaging method of the module light board in the embodiment of the present application, through the above method steps, mainly uses the semi-solid adhesive film 100 in the above embodiment in the process of packaging the lamp surface of the module light board 200. Therefore, in the packaging process, the semi-solid adhesive film layer 120 of the semi-solid adhesive film 100 can be quickly bonded to the lamp surface of the module light board 200 by means such as roller bonding. In this way, since the semi-solid adhesive film layer 120 after bonding can be quickly cured, it can greatly improve the production efficiency of the display module. At the same time, since the semi-solid adhesive film layer 120 after bonding can be kept flat due to the surface tension of the second release film layer 130, it can ensure that the surface of the encapsulation adhesive layer 230 formed after the semi-solid adhesive film layer 120 is cured has excellent flatness, and ensure that the encapsulation adhesive layer 230 formed after the semi-solid adhesive film layer 120 is uniform and does not have ring marks or flow marks, thereby ensuring the beauty and display effect of the display module.

[0055] In some examples, such as Figure 4As shown, the process of executing the above method step of "making the semi-solid adhesive film layer completely fit with the lamp surface of the first lamp board prototype by a preset method" can be specifically as follows: provide a roller laminating device 300, and perform a degassing treatment on the semi-solid adhesive film 100 after rolling the semi-solid adhesive film 100 by the roller laminating device 300, so that the semi-solid adhesive film layer 120 is completely fit with the lamp surface of the first lamp board prototype. In this way, through the above method step setting, the semi-solid adhesive film layer 120 can be better and completely fit with the lamp surface of the first lamp board prototype, so as to ensure that the encapsulation adhesive layer 230 formed after the subsequent curing of the semi-solid adhesive film layer 120 can better protect the corresponding lamp beads 220.

[0056] It can be understood that the roller laminating device 300 in this example is a common roller laminating device, which mainly includes a vacuum suction carrier plate 310 and a rubber roller 320. The method steps in this example are mainly operated in a conventional dust-free workshop. After the module lamp board 200 (mainly the first lamp board prototype mentioned above) is placed on the carrier 400, the rubber roller 320 moves up and down to press one end of the semi-solid adhesive film 100 to one end of the lamp surface of the first lamp board prototype, and the vacuum suction carrier plate 310 moves to the other end of the lamp surface of the module first lamp board prototype, dragging the rubber roller 320 to roll, so as to press the semi-solid adhesive film layer 120 onto the lamp surface of the first lamp board prototype, because the semi-solid adhesive film layer 120 is a gel structure at room temperature and has high viscosity and high filling properties, so it can be well and completely laminated with the lamp surface of the first lamp board prototype (the whole surface can be sprayed for protection in advance to make it easier for the semi-solid adhesive film layer 120 to fill the gaps between several lamp beads 220). The above roller lamination process is generally completed in 3s to 10s, and the speed is adjusted according to the lamination effect. Degassing treatment is also required after lamination to ensure that the encapsulation adhesive layer 230 formed after the semi-solid adhesive film layer 120 is cured has a better display effect.

[0057] In some examples, such as Figure 5 As shown, the process of executing the above method step of "making the semi-solid adhesive film layer completely fit with the lamp surface of the first lamp board prototype by a preset method" can also be specifically as follows: provide a roller laminating device 300 and a vacuum chamber 500, and roll the semi-solid adhesive film 100 in the vacuum chamber 500 by the roller laminating device 300, so that the semi-solid adhesive film layer 120 is completely fitted with the lamp surface of the first lamp board prototype. In this way, through the above method step setting, the semi-solid adhesive film layer 120 can also be better and completely fitted with the lamp surface of the first lamp board prototype, so as to ensure that the encapsulation adhesive layer 230 formed after the subsequent curing of the semi-solid adhesive film layer 120 can better protect the corresponding lamp beads 220.

[0058] It can be understood that the method steps in this example are different from the method steps in the previous example in that a vacuum chamber 500 is added in this example to move the entire rolling process of the above-mentioned roller-laminating device 300 to the vacuum chamber 500 for completion, that is, the roller-laminating device 300 is completely placed in the vacuum chamber 500. At the same time, a first material box 510 for temporarily storing the semi-solid adhesive film 100 and a second material box 520 for temporarily storing the first light board prototype are also provided in the vacuum chamber 500.

[0059] Generally speaking, in this example, the vacuum chamber 500 can be vacuumed once (usually for 20-50 seconds) to perform the laminating operation of multiple modules. At the same time, the method steps in this example do not require the entire surface of the lamp surface of the first lamp board prototype to be sprayed for protection in advance, and rolling in a vacuum environment can ensure that there is no air between the film and the module, so there is no need for degassing treatment later.

[0060] In some examples, the specific process of performing the above method step S130 is as follows: a black functional film is attached to the lamp surface of the second lamp board prototype, or the lamp surface of the second lamp board prototype is sprayed with matte treatment to obtain the target module lamp board. In this way, through the above method steps, the target module lamp board can be better provided with good anti-glare properties.

[0061] It can be understood that the black functional film in this example may specifically include an anti-glare layer and an adhesive layer, wherein the thickness of the anti-glare layer is 75-100 μm. The thickness of the adhesive layer is 50-100 μm, and the light transmittance of the adhesive layer is 30% to 70%, preferably 40% to 50%. In this way, by setting the above parameters, the anti-glare properties of the black functional film can be ensured while the light transmittance of the black functional film can better meet the light transmittance requirements of the module light board.

[0062] In one embodiment, Figure 3 As shown, an embodiment of the present application further provides a display module, which may specifically include a module light board 200, and the module light board 200 is manufactured by the packaging method of the module light board in the above embodiment.

[0063] It is understandable that the display module of the embodiment of the present application can be used for independent display or can be specifically applied to the display module, so that a number of display modules are arranged in a certain way to form a corresponding display module. The display module of the embodiment of the present application can adopt a bottom shell structure design or a bottom shell-free structure design. When it adopts a bottom shell structure design, in addition to the module light board 200, it also includes a module bottom shell, and the module bottom shell is installed on the side surface of the module light board 200 away from the lamp beads 220.

[0064] In this way, since the display module in the embodiment of the present application, its module light board 200 is manufactured using the method steps in the above method embodiment, it has the same functions and technical effects as the above method embodiment, and will not be repeated here.

[0065] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application is described in detail with reference to the above embodiments, a person skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some of the technical features can be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A semi-solid adhesive film, used in the packaging operation of module light panels, characterized in that: It comprises a first release film layer, a semi-solid adhesive film layer and a second release film layer which are stacked in sequence, wherein the release force of the first release film layer is smaller than the release force of the second release film layer, and the semi-solid adhesive film layer is a viscous gel structure at room temperature.

2. The semi-solid adhesive film according to claim 1, characterized in that: The semi-solid adhesive film layer is a modified epoxy resin adhesive layer doped with a curing agent and an auxiliary agent, wherein the content of the curing agent is 10% to 50%, and the content of the auxiliary agent is 1% to 20%.

3. The semi-solid adhesive film according to claim 2, characterized in that: The auxiliary agent includes a diffusion material, and the content of the diffusion material is 5% to 20%; and / or the auxiliary agent includes a black material, and the content of the black material is 1% to 5%.

4. The semi-solid adhesive film according to claim 1, characterized in that: The first release film layer and the second release film layer are both polyester film layers doped with a release agent; and / or, The release force of the first release film layer is 3 gf / in to 12 gf / in, and the release force of the second release film layer is 30 gf / in to 60 gf / in.

5. The semi-solid adhesive film according to claim 1, characterized in that: The thickness of the semi-solid adhesive film layer is 50 μm to 500 μm; and / or, The thickness of the first release film layer is 50 μm to 100 μm; and / or, The thickness of the second release film layer is 50 μm to 100 μm.

6. A packaging method for a module light board, characterized in that: The following steps are involved: Providing a first light board prototype and the semi-solid adhesive film according to any one of claims 1 to 5, placing the first light board prototype on a carrier with the lamp surface facing upward, and after tearing off the first release film layer of the semi-solid adhesive film, covering the semi-solid adhesive film on the lamp surface of the first light board prototype, and making the side surface of the semi-solid adhesive film layer away from the second release film layer contact the lamp surface of the first light board prototype; After the semi-solid adhesive film layer is completely attached to the lamp surface of the first lamp panel prototype in a preset manner and cured, the second release film layer of the semi-solid adhesive film is torn off to obtain a second lamp panel prototype; The lamp surface of the second lamp panel prototype is subjected to a preset anti-glare treatment to obtain a target module lamp panel.

7. The packaging method according to claim 6, characterized in that: The step of making the semi-solid adhesive film layer completely adhere to the lamp surface of the first lamp panel prototype in a preset manner comprises: A roller laminating device is provided, and the semi-solid adhesive film is subjected to a roller pressing process by the roller laminating device, and then subjected to a degassing process, so that the semi-solid adhesive film layer is completely laminated with the lamp surface of the first lamp panel prototype.

8. The packaging method according to claim 6, characterized in that: The step of making the semi-solid adhesive film layer completely adhere to the lamp surface of the first lamp panel prototype in a preset manner comprises: A rolling device and a vacuum chamber are provided, and the semi-solid adhesive film is rolled by the rolling device in the vacuum chamber so that the semi-solid adhesive film layer is completely fitted with the lamp surface of the first lamp panel prototype.

9. The packaging method according to claim 6, characterized in that: The step of performing a preset anti-glare treatment on the lamp surface of the second lamp panel prototype to obtain a target module lamp panel comprises: A black functional film is attached to the lamp surface of the second lamp board prototype, or the lamp surface of the second lamp board prototype is sprayed with matte treatment to obtain a target module lamp board.

10. A display module, characterized in that: It comprises a module light board, and the module light board is packaged by the packaging method according to any one of claims 6 to 9.

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