A production and processing equipment for oxygen-free copper alloy thick strip and a processing method thereof

Abstract

The present invention discloses an oxygen-free copper alloy thick strip production and processing equipment and a processing method thereof, which relate to the technical field of oxygen-free copper alloy processing. The equipment comprises a cooling box and a pickling box, wherein a transmission mechanism is installed inside the cooling box and the pickling box, wherein a relief mechanism for rapidly cooling the oxygen-free copper alloy plate and reducing the thickness of the oxide layer is installed inside the cooling box; a pumping mechanism is installed inside the cooling box, and a cleaning mechanism for pickling the oxide layer is installed inside the pickling box; a polishing mechanism for removing the oxide layer on the surface of the oxygen-free copper alloy plate is installed inside the pickling box, and flushing mechanisms for removing the oxide layer at the edge of the side wall of the oxygen-free copper alloy plate are installed at both ends of the pickling box. The oxygen-free copper alloy thick strip production and processing equipment and the processing method thereof provided by the present invention have the advantages of rapidly cooling the oxygen-free copper alloy plate, reducing the thickness of the oxide layer, and rapidly cleaning the oxide layer on the surface of the alloy plate.

Description

Technical Field

[0001] The present invention relates to the technical field of oxygen-free copper alloy processing, in particular to oxygen-free copper alloy thick strip production and processing equipment and a processing method thereof. Background Art

[0002] Oxygen-free copper (Oxygen-free copper) is pure copper that contains neither oxygen nor any deoxidizer residues. However, it does contain trace amounts of oxygen and some impurities. Standards stipulate that the oxygen content should be no greater than 0.003%, the total impurity content should be no greater than 0.05%, and the copper purity should be greater than 99.95%. Due to its high electrical conductivity and excellent machining and welding properties, Oxygen-free copper is commonly used in the manufacture of high-end electrical equipment, wire and cable, motors, high-vacuum electronics, and other devices, and is widely favored in the power electronics field.

[0003] Thick oxygen-free copper alloy strips are widely used in the electric vacuum industry. In the process of producing thick oxygen-free copper alloy strips, the oxygen-free copper alloy plates need to undergo processes such as hot rolling and annealing. During the hot rolling and annealing processes, the temperature of the oxygen-free copper alloy plates is higher than 600°C, which causes oxidation of the oxygen-free copper alloy plates. The temperature of the oxygen-free copper alloy plates after hot rolling is about 350°C, and the temperature of the oxygen-free copper alloy plates after annealing is about 200°C. At this time, the oxygen-free copper alloy plates need to be placed in a water pool for rapid cooling. However, since the temperature of the oxygen-free copper alloy plates is too high, a large amount of water vapor and other gases will be generated when they are placed in the water. The gases will produce bubbles in the water and float on the surface of the copper alloy, causing copper to react with water and oxygen. The thickness of the oxide layer on the surface of the oxygen-free copper alloy plates increases, which is not convenient for subsequent treatment of the oxide layer. Summary of the Invention

[0004] The object of the present invention is to provide an oxygen-free copper alloy thick strip production and processing equipment and a processing method thereof, so as to solve the problems raised in the above background technology.

[0005] To achieve the above objectives, the present invention provides the following technical solutions: an oxygen-free copper alloy thick strip production and processing equipment, comprising a cooling box and a pickling box, wherein the cooling box and the pickling box are both equipped with a transmission mechanism for driving the oxygen-free copper alloy plate to move, and the cooling box is equipped with a relief mechanism for rapidly cooling the oxygen-free copper alloy plate and reducing the thickness of the oxide layer;

[0006] The relief mechanism includes a delivery pipe and a baffle. A baffle with an arc-shaped edge is installed inside the top of the cooling box. The cooling box is provided with delivery pipes symmetrically installed on the upper and lower sides of the transmission mechanism.

[0007] A plurality of nozzles and a steering nozzle are installed on the upper side of the delivery pipe below the transmission mechanism, and a plurality of downward pressure nozzles are installed on the bottom end of the delivery pipe above the transmission mechanism;

[0008] The inclination angle of the nozzle increases from the middle position of the delivery pipe to the edge position of the delivery pipe, and the steering nozzle is fixed at both ends of the delivery pipe and is located outside the nozzle;

[0009] The distance between adjacent downward pressure nozzles and the inclination angle of the downward pressure nozzles gradually increase along the edge of the delivery pipe toward the middle of the delivery pipe;

[0010] The cooling box is internally installed with a pumping mechanism for conveying water and gas into the pickling box, and the pickling box is internally installed with a cleaning mechanism for pickling the oxide layer;

[0011] The cleaning mechanism includes a support rod, a plurality of support rods are installed inside the pickling box, the support rods are connected to the connecting pipe through a joint, a rotating shaft and a compression rod are rotatably connected inside the joint so that the rotating shaft can rotate freely inside the joint, and a plurality of compression rods are fixedly connected to the side wall of the rotating shaft;

[0012] A lever is rotatably connected to the joint and the support rod, and one spherical end of the lever abuts against the bottom of the compression rod;

[0013] The interior of the support rod is slidably connected to the piston and the slide rod, and the top end of the slide rod is sleeved in the piston;

[0014] The bottom end of the lever abuts against the top of the piston, and the lever is mounted on the inner side wall of the support rod through a support;

[0015] The side wall of the slide rod is sheathed with a spring, and the two ends of the spring respectively abut against the bottom surface of the piston and the bottom sealing surface of the support rod;

[0016] The bottom end of the sliding rod is fixedly connected to the pressing plate, the side wall of the pressing plate is installed with a rubber pad, and a plurality of the rubber pads are slidably connected to the top and bottom surfaces of the oxygen-free copper alloy plate;

[0017] A polishing mechanism for removing the surface oxide layer of the oxygen-free copper alloy plate is installed inside the pickling box, and flushing mechanisms for removing the oxide layer at the edge of the side wall of the oxygen-free copper alloy plate are installed at both ends of the pickling box.

[0018] Preferably, the transmission mechanism includes a transmission rod and a slide, the transmission rod is located at the end of the slide and extends to the end of the cooling box, the slide is arranged at the entrance of the cooling box, and a plurality of unloading rollers are provided at the junction of the transmission rod and the slide. A plurality of protrusions are installed on the side wall of the unloading roller, and the lengths of the protrusions on the surfaces of two adjacent unloading rollers increase successively from top to bottom.

[0019] Preferably, two rows of transmission rods with opposite rotation directions are provided at both ends of the pickling box, and one end of each of the two transmission rods is provided with a connecting gear for changing the rotation direction of the transmission rod, and the connecting gears are meshed with each other;

[0020] The side walls of the cooling box and the pickling box are both connected to an installation box, the interior of the installation box is rotatably connected to a main gear, the connecting gear meshes with the main gear, and one end of the main gear is connected to a drive motor;

[0021] The conveying rod and the side wall of the unloading roller are both fixedly connected with sprockets, and a chain belt is set between the sprockets.

[0022] Preferably, a plurality of hydraulic rods are installed on the side wall of the cooling box, and one end of the hydraulic rod is connected to a top plate for pushing the oxygen-free copper alloy plate to move upward and a push plate for pushing the oxygen-free copper alloy plate into the pickling box;

[0023] A limiting block with a triangular side wall is installed on the inner side wall of the cooling box, and the limiting block contacts the side wall of the oxygen-free copper alloy plate.

[0024] Preferably, the pumping mechanism includes a high-pressure water pump and an air pump, and the high-pressure water pump and the air pump are installed on the surface of the cooling box. The high-pressure water pump is connected to the cooling box and the pickling box through a water pipe, and the bottom end of the water pipe is connected to a steel pipe, and the steel pipe is vertically connected to a floating plate.

[0025] Preferably, the vacuum pump quickly draws the gas inside the cooling box into the interior of the pickling pipe through the gas pipe, and the interior of the pickling pipe is symmetrically installed with funnel-shaped mixing plates, and a block is installed between the two mixing plates;

[0026] A flushing pipe is installed at one end of the pickling tank, the flushing pipe is connected to the water pipe inside the pickling tank, and a plurality of flushing nozzles are installed at the bottom end of the flushing pipe.

[0027] Preferably, the grinding mechanism includes a fixed shaft and a box body, the I-shaped box body is symmetrically mounted on the surface of the pickling box, and a first gear and a second gear meshing with each other are rotatably connected inside the box body, the first gear is connected to the driving motor, and the diameter of the first gear is larger than the diameter of the second gear;

[0028] The first gear, the second gear and the top end of the fixed shaft are all fixedly connected to the sprocket;

[0029] The bottom end of the fixed shaft is fixedly connected to the first grinding wheel and the second grinding wheel respectively, and the first grinding wheel and the second grinding wheel are staggered.

[0030] Preferably, between the adjacent cleaning mechanism and the flushing mechanism, the first grinding wheel and the second grinding wheel are in opposite directions, wherein the top ends of the four fixed shafts are fixedly connected to the third gear used to change the direction of the first grinding wheel and the second grinding wheel, and the adjacent third gears are engaged with each other.

[0031] Preferably, the flushing mechanism includes a cylinder, and the inner side wall of the pickling tank is fixedly connected to a plurality of the cylinders, and the center of the side wall of the cylinder is connected to the water pipe inside the pickling tank through a connecting pipe;

[0032] The cylinder is internally rotatably connected to a turbine, the sprocket on the side wall of the turbine is connected to the sprocket on the side wall of the speed-increasing gear via the chain belt, the speed-increasing gear is engaged with the main gear, and the diameter of the speed-increasing gear is smaller than the diameter of the main gear;

[0033] The side wall of the cylinder is connected to a high-pressure nozzle for removing the oxide layer on the side wall of the oxygen-free copper alloy plate. The upper and lower ends of the high-pressure nozzle are equipped with partitions with arc-shaped side walls, and the oxygen-free copper alloy plate is slidably connected between the partitions.

[0034] A processing method specifically comprises the following steps:

[0035] Step 1: High-purity cathode copper is placed in a vacuum induction furnace for smelting. Before smelting, vacuum is first evacuated for preheating and the high-purity cathode copper is dried. The dried charcoal is used as a covering agent, and an inert gas is introduced into the bottom of the induction furnace. The smelting is carried out at 1150-1200°C. During the smelting process, the inert gas causes the gas in the copper liquid in the furnace to enter the inert bubbles. As the bubbles float to the surface of the copper liquid, they react with the charcoal covered in the furnace to produce CO and remove it. After it is completely melted, rare earth purifiers and Composite deoxidizer, adding magnesium and tin to the furnace, continuing stirring for 2-5 minutes, and standing for 20-30 minutes to obtain an oxygen-free copper alloy melt: pouring the oxygen-free copper alloy melt into a preheated mold to obtain an oxygen-free copper alloy ingot; the proportions of each raw material are calculated by weight: 100 parts of high-purity cathode copper, 0.02-0.1 parts of rare earth purifier, 0.1-0.5 parts of composite deoxidizer, 0.004-0.008 parts of magnesium, and 0.005-0.01 parts of tin;

[0036] Step 2: hot rolling the oxygen-free copper alloy ingot at 800-860°C to form an oxygen-free copper alloy plate, connecting the device to an external power supply, placing the hot-rolled oxygen-free copper alloy plate on the surface of the slide, and placing the oxygen-free copper alloy plate cooled in the cooling box into the pickling box; placing the oxygen-free copper alloy plate into the cooling box, and operating the relief mechanism to cause water to flow rapidly along the surface of the oxygen-free copper alloy plate, thereby accelerating heat dissipation efficiency and quickly taking away the temperature of the oxygen-free copper alloy plate and surrounding gas, thereby reducing oxidation efficiency;

[0037] Step 3: When the oxygen-free copper alloy plate moves inside the pickling box, the oxygen-free copper alloy plate slides over the side wall of the rubber pad, and the acid liquid mixes with the gas inside the cooling box and enters the interior of the rubber pad; the acid liquid contacts the surface of the oxygen-free copper alloy plate inside the rubber pad, and the acid liquid reacts with the oxide layer. Since the acid liquid contains a large number of bubbles, the bubbles churn inside the rubber pad and push the acid liquid to continuously contact the oxide layer. The gas generated when the oxygen-free copper alloy plate is cooled is used to push the acid liquid to move, thereby accelerating the reaction rate between the oxide layer and the acid liquid. The acid liquid flows through the compression rod and the lever to make the rubber pad move up and down continuously. When the elastic rubber pad moves downward, it spreads one end distance on the surface of the oxygen-free copper alloy plate, increasing the cleaning range of the acid liquid. At the same time, the continuous contraction and spreading of the rubber pad pushes the acid liquid to move up and down continuously, so that the acid liquid continuously moves and contacts the surface of the oxygen-free copper alloy plate, further improving the reaction efficiency of the oxide layer and the acid liquid.

[0038] Step 4: The pickled oxygen-free copper alloy plate is brought into contact with the rotating grinding mechanism to remove the oxide layer, so that the oxide layer on the surface of the oxygen-free copper alloy plate is removed, and the oxygen-free copper alloy plate continues to move and contacts the flushing mechanism to remove the oxide layer on the side wall of the oxygen-free copper alloy plate and clean the surface of the oxygen-free copper alloy plate; the oxygen-free copper alloy plate cleaned by the high-pressure nozzle is pickled, polished, and flushed again to further remove the oxide layer, and then the water sprayed by the flushing nozzle is used to clean the oxygen-free copper alloy plate; the above operation is repeated to cool the oxygen-free copper alloy plate inside the cooling box and the pickling box and remove the oxide layer;

[0039] Step 5: After cleaning, drying and pre-finish rolling the oxygen-free copper alloy plate, the plate is sent to an annealing furnace for annealing. The oxygen-free copper alloy plate taken out of the annealing furnace is placed in the cooling box and the pickling box again to remove the oxide layer. Finally, the oxygen-free copper alloy plate is finish rolled to obtain an oxygen-free copper alloy thick strip.

[0040] Compared with the prior art, the present invention has the following beneficial effects:

[0041] When the oxygen-free copper alloy plate enters the cooling box, it moves above the nozzle. The nozzle sprays water toward the bottom surface of the oxygen-free copper alloy plate. The nozzle's inclination angle gradually increases from the center of the delivery pipe toward the end of the delivery pipe, causing the water sprayed from the nozzle to push the water on the bottom surface of the oxygen-free copper alloy plate toward the edge of the oxygen-free copper alloy plate. The water sprayed from the deflection nozzle is directed upward toward the edge of the oxygen-free copper alloy plate, thereby pushing the water at the edge of the oxygen-free copper alloy plate upward.

[0042] The downward pressure nozzle moves obliquely downward, and the distance between adjacent downward pressure nozzles and the inclination angle of the downward pressure nozzle gradually increase along the end of the delivery pipe toward the center of the delivery pipe, so that the water sprayed from the downward pressure nozzle pushes the water moving upward at the edge of the oxygen-free copper alloy plate to move toward the center of the top surface of the oxygen-free copper alloy plate. When the oxygen-free copper alloy plate is cooled, the water flows rapidly along the surface of the oxygen-free copper alloy plate, thereby accelerating the heat dissipation efficiency and quickly taking away the gas generated by the high temperature of the oxygen-free copper alloy plate, so that the flowing low-temperature water is constantly in contact with the surface of the oxygen-free copper alloy plate. , to prevent the oxygen-free copper alloy plate from being rapidly oxidized in water and reducing the oxidation efficiency; the water and gas generated by the cooling of the oxygen-free copper alloy plate are transported into the interior of the pickling box by the pumping mechanism, at this time the oxygen-free copper alloy plate moves inside the pickling box to remove the oxide layer, and the gas and acid liquid are mixed and enter the interior of the rubber pad through the connecting pipe, the joint, the support rod and the sliding rod, the rubber pad is fitted with the oxygen-free copper alloy plate, the acid liquid contacts the surface of the oxygen-free copper alloy plate inside the rubber pad, the acid liquid reacts with the oxide layer, and since the acid liquid contains a large number of bubbles, the bubbles are in the rubber pad The churning inside the pad pushes the acid to continuously contact the oxide layer, thereby accelerating the reaction rate of the oxide layer and the acid; and when the acid is ejected from the inside of the connecting pipe, it contacts the rotating shaft and the compression rod, and the rotation of the compression rod pushes the lever to rotate, and the end of the lever farther from the support contacts the compression rod, and the end of the lever farther from the support contacts the piston, thereby reducing the resistance of the compression rod to the rotation of the lever. By utilizing the principle of leverage, the rotation of the lever pushes the sliding rod and the pressure plate to move downward to squeeze the spring and the rubber pad. After the rubber pad is squeezed by the pressure plate, it approaches the airtight The oxygen-free copper alloy plate is provided with a plurality of springs, and the plurality of springs are connected to the oxygen-free copper alloy plate. When the compression rod is rotated and separated from the lever, the spring pushes the sliding rod and the lever to reset. As the compression rod rotates, the rubber pad is continuously spread out and contracted on the surface of the oxygen-free copper alloy plate; the elastic rubber pad is spread out over a certain distance on the surface of the oxygen-free copper alloy plate, thereby increasing the cleaning range of the acid liquid. At the same time, the continuous contraction and spreading of the rubber pad pushes the acid liquid to continuously move up and down, so that the acid liquid continuously moves and contacts the surface of the oxygen-free copper alloy plate, further improving the reaction rate of the oxide layer and the acid liquid, and accelerating the cleaning efficiency of the oxide layer on the surface of the oxygen-free copper alloy plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 This is a structural diagram of a preferred embodiment of the present invention;

[0044] Figure 2 for Figure 1 Side view of the internal structure of the inner cooling box;

[0045] Figure 3 for Figure 1Schematic diagram of the internal structure of the pickling box shown;

[0046] Figure 4 for Figure 3 A top view of the internal structure of the pickling tank is shown;

[0047] Figure 5 for Figure 3 Schematic diagram of the internal structure of the pickling tube shown;

[0048] Figure 6 for Figure 3 Schematic diagram of the flushing mechanism and oxygen-free copper alloy plate structure shown;

[0049] Figure 7 for Figure 1 A top view of the cooling box structure shown;

[0050] Figure 8 for Figure 4 Schematic diagram of the sprocket structure shown;

[0051] Figure 9 for Figure 3 The top view of the internal structure of the box is shown;

[0052] Figure 10 for Figure 1 An enlarged schematic diagram of the structure at point A is shown;

[0053] Figure 11 for Figure 1 An enlarged schematic diagram of the structure at point B is shown;

[0054] Figure 12 for Figure 3 An enlarged schematic diagram of the structure at position C is shown;

[0055] Figure 13 This is a schematic diagram of cooling the oxygen-free copper alloy plate provided by the present invention.

[0056] In the figure: 1. Cooling box, 11. Hydraulic rod, 12. Push plate, 13. Top plate, 14. Limit block, 2. Transmission mechanism, 21. Conveying rod, 22. Slide, 23. Driving motor, 24. Sprocket, 25. Chain belt, 26. Mounting box, 27. Main gear, 28. Connecting gear, 29. Unloading roller, 210. Bump, 3. Oxygen-free copper alloy plate, 4. Pickling box, 41. Pickling pipe, 42. Flushing nozzle, 43. Flushing pipe, 44. Mixing plate, 45. Block, 5. Relief mechanism, 51. Conveying pipe, 52. Nozzle, 53. Steering nozzle, 54. Down-pressure nozzle, 55. Baffle, 6. Pumping mechanism, 61. Floating plate, 62. Steel pipe , 63. High-pressure water pump, 64. Vacuum, 65. Air pipe, 66. Water pipe, 7. Flushing mechanism, 71. Cylinder, 72. Turbine, 73. Connecting pipe, 74. High-pressure nozzle, 75. Partition, 76. Speed ​​increasing gear, 8. Clearing mechanism, 81. Rubber pad, 82. Pressure plate, 83. Slide rod, 84. Spring, 85. Piston, 86. Support, 87. Lever, 88. Support rod, 89. Joint, 810. Connecting pipe, 811. Rotating shaft, 812. Compression rod, 9. Grinding mechanism, 91. Fixed shaft, 92. First grinding wheel, 93. Second grinding wheel, 94. Box, 95. First gear, 96. Second gear, 97. Third gear. DETAILED DESCRIPTION

[0057] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0058] See also Figures 1 to 13 The present invention provides a technical solution: an oxygen-free copper alloy thick strip production and processing equipment, comprising a cooling box 1 and a pickling box 4, wherein a transmission mechanism 2 for driving an oxygen-free copper alloy plate 3 is installed inside the cooling box 1 and the pickling box 4, and a relief mechanism 5 for rapidly cooling the oxygen-free copper alloy plate 3 and reducing the thickness of the oxide layer is installed inside the cooling box 1;

[0059] In this embodiment, the transmission mechanism 2 includes a transmission rod 21 and a slide 22. The transmission rod 21 is located at the end of the slide 22 and extends to the end of the cooling box 1. The slide 22 is arranged at the entrance of the cooling box 1. A plurality of unloading rollers 29 are provided at the junction of the transmission rod 21 and the slide 22. A plurality of protrusions 210 are installed on the side walls of the unloading rollers 29. The lengths of the protrusions 210 on the surfaces of two adjacent unloading rollers 29 increase from top to bottom. When the oxygen-free copper alloy plate 3 that has been hot-rolled and annealed is placed on the surface of the slide 22, the oxygen-free copper alloy plate 3 moves downward along the slide 22 and contacts the unloading roller 29. The unloading roller 29 and the protrusions 210 rotate continuously, and the unloading roller 29 rotates. The oxygen-free copper alloy plate 3 is pushed to move toward the inside of the cooling box 1, and the protrusion 210 on the side wall of the blanking roller 29 intermittently squeezes the oxygen-free copper alloy plate 3 upward, so that the oxygen-free copper alloy plate 3 continuously vibrates on the surface of the slide 22 and the blanking roller 29, which facilitates the oxygen-free copper alloy plate 3 to move downward and fall to the surface of the conveying rod 21. The lengths of the protrusions 210 on the surfaces of two adjacent blanking rollers 29 gradually increase from top to bottom; as the oxygen-free copper alloy plate 3 moves downward, the vibration amplitude of the oxygen-free copper alloy plate 3 becomes larger and larger, which facilitates the protrusion 210 to push the oxygen-free copper alloy plate 3 to move to the surface of the conveying rod 21, so that the conveying rod 21 pushes the oxygen-free copper alloy plate 3 to move inside the cooling box 1.

[0060] The relief mechanism 5 includes a delivery pipe 51 and a baffle 55. The baffle 55 with an arc-shaped edge is installed inside the top of the cooling box 1. The cooling box 1 is provided with a delivery pipe 51 symmetrically installed on the upper and lower sides of the transmission mechanism 2.

[0061] A plurality of nozzles 52 and a steering nozzle 53 are installed on the upper side of the delivery pipe 51 below the transmission mechanism 2, and a plurality of downward pressure nozzles 54 are installed on the bottom end of the delivery pipe 51 above the transmission mechanism 2;

[0062] The inclination angle of the nozzle 52 increases from the middle position of the delivery pipe 51 to the edge position of the delivery pipe 51. The steering nozzle 53 is fixed at an angle at both ends of the delivery pipe 51 and is located outside the nozzle 52.

[0063] In this embodiment, the distance between adjacent downward pressure nozzles 54 and the inclination angle of the downward pressure nozzles 54 gradually increase along the edge of the delivery pipe 51 toward the middle of the delivery pipe 51;

[0064] In this embodiment, the oxygen-free copper alloy plate 3 is moved by the conveying rod 21 to the top of the nozzle 52 as shown in the attached figure. Figure 1As shown, at this time, the delivery pipe 51 is connected to an external water pump, so that the nozzle 52 sprays water toward the bottom surface of the oxygen-free copper alloy plate 3, and the inclination angle of the nozzle 52 gradually increases along the center of the delivery pipe 51 toward the end of the delivery pipe 51, so that the water sprayed by the nozzle 52 pushes the bottom surface water of the oxygen-free copper alloy plate 3 toward the edge of the oxygen-free copper alloy plate 3, and the water sprayed by the steering nozzle 53 rushes obliquely upward toward the edge of the oxygen-free copper alloy plate 3, thereby pushing the oxygen-free copper alloy plate 3 The water at the edge moves upward; the downward pressure nozzle 54 moves obliquely downward, and the spacing between adjacent downward pressure nozzles 54 and the inclination angle of the downward pressure nozzle 54 gradually increase along the end of the delivery pipe 51 toward the center of the delivery pipe 51, so that the water sprayed from the downward pressure nozzle 54 pushes the water moving upward at the edge of the oxygen-free copper alloy plate 3 to move toward the center of the top surface of the oxygen-free copper alloy plate 3. When the oxygen-free copper alloy plate 3 is cooled, the water flows rapidly along the surface of the oxygen-free copper alloy plate 3 as shown in the attached figure. Figure 13 As shown, the heat dissipation efficiency is accelerated, and the gas generated by the high temperature of the oxygen-free copper alloy plate 3 is quickly taken away, so that the flowing low-temperature water is continuously in contact with the surface of the oxygen-free copper alloy plate 3, thereby avoiding the rapid oxidation of the oxygen-free copper alloy plate 3 in the water and reducing the oxidation efficiency.

[0065] The cooling box 1 is internally installed with a pumping mechanism 6 for conveying water and gas to the pickling box 4, and the pickling box 4 is internally installed with a cleaning mechanism 8 for pickling the oxide layer;

[0066] The cleaning mechanism 8 includes a support rod 88. A plurality of support rods 88 are installed inside the pickling tank 4. The support rods 88 are connected to the connecting pipe 810 through a joint 89. A rotating shaft 811 and a compression rod 812 are rotatably connected inside the joint 89 so that the rotating shaft 811 can rotate freely inside the joint 89. The side wall of the rotating shaft 811 is fixedly connected to a plurality of compression rods 812.

[0067] The joint 89 and the support rod 88 are internally rotatably connected to a lever 87 , and one spherical end of the lever 87 abuts against the bottom of the compression rod 812 ;

[0068] The support rod 88 is internally slidably connected to the piston 85 and the slide rod 83, and the top end of the slide rod 83 is sleeved in the piston 85;

[0069] The bottom end of the lever 87 abuts against the top of the piston 85 , and the lever 87 is mounted on the inner side wall of the support rod 88 via a support 86 ;

[0070] The side wall of the slide rod 83 is provided with a spring 84, and the two ends of the spring 84 respectively contact the bottom surface of the piston 85 and the bottom sealing surface of the support rod 88;

[0071] The bottom end of the slide rod 83 is fixedly connected to the pressure plate 82. The side wall of the pressure plate 82 is installed with a rubber pad 81. A plurality of rubber pads 81 are slidably connected to the top and bottom surfaces of the oxygen-free copper alloy plate 3.

[0072] In this embodiment, when removing the oxide layer, the oxygen-free copper alloy plate 3 slides on the surface of the rubber pad 81, and the mixed gas and acid enter the interior of the rubber pad 81 through the connecting pipe 810, the joint 89, the support rod 88 and the sliding rod 83. The rubber pad 81 is in contact with the oxygen-free copper alloy plate 3, and the acid contacts the surface of the oxygen-free copper alloy plate 3 inside the rubber pad 81. The acid reacts with the oxide layer, and because the acid contains a large number of bubbles, the bubbles churn inside the rubber pad 81 and push the acid to continuously contact the oxide layer, thereby accelerating the reaction rate of the oxide layer and the acid. When the acid is ejected from the inside of the connecting pipe 810, it contacts the rotating shaft 811 and the compression rod 812. The rotation of the compression rod 812 pushes the lever 87 to rotate. The end of the lever 87 farther from the support 86 contacts the compression rod 812, and the end of the lever 87 farther from the support 86 contacts the piston 85, reducing the The compression rod 812 pushes the resistance of the lever 87 to rotate. Using the principle of leverage, the lever 87 rotates to push the sliding rod 82 and the pressure plate 82 to move downward and squeeze the spring 84 and the rubber pad 81. The rubber pad 81 is squeezed by the pressure plate 82 and approaches the oxygen-free copper alloy plate 6. When the compression rod 812 rotates and separates from the lever 87, the spring 84 pushes the sliding rod 83 and the lever 87 to reset. As the compression rod 812 rotates, the rubber pad 81 is continuously spread and contracted on the surface of the oxygen-free copper alloy plate 3; the elastic rubber pad 81 is spread over a distance on the surface of the oxygen-free copper alloy plate 6, increasing the cleaning range of the acid. At the same time, the continuous contraction and spreading of the rubber pad 81 pushes the acid to move up and down continuously, so that the acid continuously moves and contacts the surface of the oxygen-free copper alloy plate 3, further improving the reaction rate between the oxide layer and the acid, and accelerating the cleaning efficiency of the oxide layer on the surface of the oxygen-free copper alloy plate 3.

[0073] A polishing mechanism 9 for removing the surface oxide layer of the oxygen-free copper alloy plate 3 is installed inside the pickling box 4 , and flushing mechanisms 7 for removing the oxide layer at the edge of the side wall of the oxygen-free copper alloy plate 3 are installed at both ends of the pickling box 4 .

[0074] In this embodiment, two rows of transmission rods 21 with opposite rotation directions are provided at both ends of the pickling box 4, and one end of two of the transmission rods 21 is installed with a connecting gear 28 for changing the rotation direction of the transmission rod 21, and the connecting gears 28 are meshed with each other;

[0075] The side walls of the cooling box 1 and the pickling box 4 are both connected to a mounting box 26, the interior of the mounting box 26 is rotatably connected to a main gear 27, the connecting gear 28 engages with the main gear 27, and one end of the main gear 27 is connected to a drive motor 23;

[0076] The side walls of the conveying rod 21 and the unloading roller 29 are fixedly connected with sprockets 24, and a chain belt 25 is installed between the sprockets 24;

[0077] The side walls of the conveying rod 21 and the discharge roller 29 are fixedly connected to the sprocket 24, and a chain belt 25 is installed between the sprockets 24. In order to facilitate the operation of the drive motor 23 to drive the main gear 27 to rotate, the main gear 27 drives the connecting gear 28 to rotate, and the connecting gear 28 drives the conveying rod 21 and the discharge roller 29 to rotate through the chain belt 25 and the sprocket 24, so that the conveying rod 21 and the discharge roller 29 can push the oxygen-free copper alloy plate 3 to move.

[0078] In this embodiment, a plurality of hydraulic rods 11 are installed on the side wall of the cooling box 1, and one end of the hydraulic rod 11 is connected to a top plate 13 for pushing the oxygen-free copper alloy plate 3 upward and a push plate 12 for pushing the oxygen-free copper alloy plate 3 into the pickling box 4;

[0079] A triangular-shaped limit block 14 is installed on the inner side wall of the cooling box 1, and the limit block 14 contacts the side wall of the oxygen-free copper alloy plate 3; in order to facilitate the limit block 14 to neatly fix the oxygen-free copper alloy plate 3 inside one end of the cooling box 1, the hydraulic rod 11 drives the top plate 13 to move to lift the oxygen-free copper alloy plate 3, and the push plate 12 moves to push the oxygen-free copper alloy plate 3 into the interior of the pickling box 4.

[0080] In this embodiment, the pumping mechanism 6 includes a high-pressure water pump 63 and an air pump 64. The high-pressure water pump 63 and the air pump 64 are installed on the surface of the cooling box 1. The high-pressure water pump 63 is connected to the cooling box 1 and the pickling box 4 through a water pipe 66. The bottom end of the water pipe 66 is connected to the steel pipe 62. The steel pipe 62 is vertically connected to a float plate 61. During the cooling process of the oxygen-free copper alloy plate 3, the water temperature inside the cooling box 1 increases. The float plate 61 carries the steel pipe 62 to float on the water surface. One end of the steel pipe 62 passes through the float plate 61 and extends into the water, so that the high-pressure water pump 63 can pump out the water inside the cooling box 1 through the water pipe 66 and the steel pipe 62, and the relief mechanism 5 continuously transports low-temperature water to the inside of the cooling box 1 to maintain the water level and water temperature inside the cooling box 1.

[0081] In this embodiment, a flushing pipe 43 is installed at one end of the pickling tank 4, and the flushing pipe 43 is connected to the water pipe 66 inside the pickling tank 4, and a plurality of flushing nozzles 42 are installed at the bottom end of the flushing pipe 43. The air pump 64 quickly draws the gas inside the cooling box 1 into the interior of the pickling pipe 41 through the air pipe 65. The interior of the pickling pipe 41 is symmetrically equipped with funnel-shaped mixing plates 44, and a block 45 is installed between the two mixing plates 44. A flushing pipe 43 is installed at one end of the pickling tank 4, and the flushing pipe 43 is connected to the water pipe 66 inside the pickling tank 4, and the flushing pipe A plurality of flushing nozzles 42 are installed at the bottom end of 43, in order to facilitate the flushing nozzles 42 to clean the surface of the oxygen-free copper alloy plate 3; the gas inside the cooling box 1 is sent into the pickling pipe 41 and mixed with the acid solution, and then passes through the internal funnel-shaped mixing plate 44, so that the gas and the acid solution are preliminarily mixed. The preliminarily mixed gas and acid solution slide from the side wall of the block 45, so that the gas and the acid solution move toward the inner wall of the acid solution pipe 41, so that the gas and the acid solution are mixed again, and the mixed gas and acid solution pass through the internal funnel-shaped mixing plate 44 again, so that the gas and the acid solution are more uniform after multiple mixing.

[0082] In this embodiment, the grinding mechanism 9 includes a fixed shaft 91 and a housing 94. The I-shaped housing 94 is symmetrically mounted on the surface of the pickling tank 4. A first gear 95 and a second gear 96 are rotatably connected inside the housing 94 and mesh with each other. The first gear 95 is connected to the drive motor 23, and the diameter of the first gear 95 is larger than the diameter of the second gear 96.

[0083] The first gear 95, the second gear 96 and the top end of the fixed shaft 91 are all fixedly connected to the sprocket 24;

[0084] The bottom ends of the fixed shaft 91 are fixedly connected to the first grinding wheel 92 and the second grinding wheel 93 respectively, and the first grinding wheel 92 and the second grinding wheel 93 are staggered.

[0085] When the drive motor 23 rotates, it drives the first gear 95 and the second gear 96 to rotate, thereby driving all the fixed shaft 91, the first grinding wheel 92 and the second grinding wheel 93 to rotate. The first grinding wheel 92 and the second grinding wheel 93 rotate to grind the surface of the oxygen-free copper alloy plate 3. The first grinding wheel 92 and the second grinding wheel 93 are staggered so that the first grinding wheel 92 and the second grinding wheel 93 evenly grind the surface of the oxygen-free copper alloy plate 3 to avoid the surface of the oxygen-free copper alloy plate 3 not being polished to remove the oxide layer; and the first group of grinding wheels of the oxygen-free copper alloy plate 3 after the preliminary pickling are in contact with each other, and the second group of grinding wheels of the oxygen-free copper alloy plate 3 after the second pickling are in contact with each other. The diameter of the first gear 95 is greater than the diameter of the second gear 96, and the rotation speed of the second group of grinding wheels is greater than the rotation speed of the first group of grinding wheels, which increases the friction of the grinding wheels on the surface of the oxygen-free copper alloy plate 3 and effectively removes the oxide layer.

[0086] In this embodiment, between the adjacent cleaning mechanism 8 and the flushing mechanism 7, the first grinding wheel 92 and the second grinding wheel 93 are in opposite directions, and the top ends of the four fixed shafts 91 are fixedly connected to the third gear 97 for changing the direction of the first grinding wheel 92 and the second grinding wheel 93. The adjacent third gears 97 are engaged with each other. During the grinding process of the oxygen-free copper alloy plate 3, the first grinding wheel 92 and the second grinding wheel 93 clean the oxide layer on the surface of the oxygen-free copper alloy plate 3 from different directions, thereby improving the cleaning effect.

[0087] In this embodiment, the flushing mechanism 7 includes a cylinder 71. A plurality of the cylinders 71 are fixedly connected to the inner side wall of the pickling tank 4. The center of the side wall of the cylinder 71 is connected to the water pipe 66 inside the pickling tank 4 through a connecting pipe 73.

[0088] The cylinder 71 is internally rotatably connected to a turbine 72. The sprocket 24 on the side wall of the turbine 72 is connected to the sprocket 24 on the side wall of the speed-increasing gear 76 via the chain belt 25. The speed-increasing gear 76 engages with the main gear 27, and the diameter of the speed-increasing gear 76 is smaller than the diameter of the main gear 27.

[0089] The side wall of the cylinder 71 is connected to a high-pressure nozzle 74 for removing the oxide layer on the side wall of the oxygen-free copper alloy plate 3. The upper and lower ends of the high-pressure nozzle 74 are installed with arc-shaped partitions 75, and the oxygen-free copper alloy plate 3 is slidably connected between the partitions 75.

[0090] The water pumped by the high-pressure water pump 63 enters the interior of the cylinder 71 through the water pipe 66 and the connecting pipe 73. Since the diameter of the speed-increasing gear 76 is much smaller than the diameter of the main gear 27, the turbine 72 rotates rapidly inside the cylinder 71. The turbine 72 speeds up the water and then sprays it toward the side wall of the oxygen-free copper alloy plate 3 through the high-pressure nozzle 74, as shown in the attached figure. Figure 6 As shown, the high-pressure water washes away the oxide layer on the side wall of the oxygen-free copper alloy plate 3, and the water portion in contact with the side wall of the oxygen-free copper alloy plate 3 moves along the partition 75, so that the water continues the partition 75 to rush toward the surface of the oxygen-free copper alloy plate 3, thereby cleaning the surface of the oxygen-free copper alloy plate 3.

[0091] A method for producing and processing an oxygen-free copper alloy thick strip comprises the following steps:

[0092] Step 1: High-purity cathode copper is placed in a vacuum induction furnace for smelting. Before smelting, vacuum is first evacuated for preheating and the high-purity cathode copper is dried. The dried charcoal is used as a covering agent, and an inert gas is introduced into the bottom of the induction furnace. The smelting is carried out at 1150-1200°C. During the smelting process, the inert gas causes the gas in the copper liquid in the furnace to enter the inert bubbles. As the bubbles float to the surface of the copper liquid, they react with the charcoal covered in the furnace to produce CO and remove it. After it is completely melted, rare earth purifiers and Composite deoxidizer, adding magnesium and tin to the furnace, continuing stirring for 2-5 minutes, and standing for 20-30 minutes to obtain an oxygen-free copper alloy melt; pouring the oxygen-free copper alloy melt into a preheated mold to obtain an oxygen-free copper alloy ingot; the proportions of each raw material are calculated by weight: 100 parts of high-purity cathode copper, 0.02-0.1 parts of rare earth purifier, 0.1-0.5 parts of composite deoxidizer, 0.004-0.008 parts of magnesium, and 0.005-0.01 parts of tin;

[0093] Step 2: hot rolling the oxygen-free copper alloy ingot at 800-860°C to form an oxygen-free copper alloy plate 3, connecting the device to an external power supply, placing the hot-rolled oxygen-free copper alloy plate 3 on the surface of the slide 22, and placing the oxygen-free copper alloy plate 3 after cooling inside the cooling box 1 into the pickling box 4; placing the oxygen-free copper alloy plate 3 into the cooling box 1, and operating the relief mechanism 5 to cause water to flow rapidly along the surface of the oxygen-free copper alloy plate 3, thereby accelerating the heat dissipation efficiency and quickly taking away the temperature of the oxygen-free copper alloy plate 3 and the surrounding gas, thereby reducing the oxidation efficiency;

[0094] Step 3: When the oxygen-free copper alloy plate 3 moves inside the pickling box 4, the oxygen-free copper alloy plate 3 slides over the side wall of the rubber pad 81. At this time, the acid is mixed with the gas inside the cooling box 1 and enters the inside of the rubber pad 81; the acid contacts the surface of the oxygen-free copper alloy plate 3 inside the rubber pad 81, and the acid reacts with the oxide layer. Since the acid contains a large number of bubbles, the bubbles churn inside the rubber pad 81 and push the acid to continuously contact the oxide layer. The gas generated when the oxygen-free copper alloy plate 3 is cooled is used to push the acid to move, thereby accelerating the reaction rate between the oxide layer and the acid. The acid flows through the compression rod 812 and the lever 87 to make the rubber pad 81 move up and down continuously. When the elastic rubber pad 81 moves downward, it spreads a distance on the surface of the oxygen-free copper alloy plate 6 to increase the cleaning range of the acid. At the same time, the rubber pad 81 continuously contracts and spreads to push the acid to move up and down continuously, so that the acid is continuously in contact with the surface of the oxygen-free copper alloy plate 3, further improving the reaction efficiency of the oxide layer and the acid.

[0095] Step 4: The pickled oxygen-free copper alloy plate 3 is brought into contact with the rotating grinding mechanism 9 to remove the oxide layer, so that the oxide layer on the surface of the oxygen-free copper alloy plate 3 is removed, and the oxygen-free copper alloy plate 3 continues to move and contacts the flushing mechanism 7 to remove the oxide layer on the side wall of the oxygen-free copper alloy plate 3 and clean the surface of the oxygen-free copper alloy plate 3; the oxygen-free copper alloy plate 3 cleaned by the high-pressure nozzle 74 is pickled, polished, and flushed again to further remove the oxide layer, and then the water sprayed by the flushing nozzle 42 cleans the oxygen-free copper alloy plate 3; repeat the above operation to cool the oxygen-free copper alloy plate 3 inside the cooling box 1 and the pickling box 4 and remove the oxide layer;

[0096] Step 5: After cleaning, the oxygen-free copper alloy plate 3 is dried and pre-finished and then sent to the annealing furnace for annealing. The oxygen-free copper alloy plate 3 taken out of the annealing furnace is placed again in the cooling box 1 and the pickling box 4 to remove the oxide layer. Finally, the oxygen-free copper alloy plate 3 is finish-rolled to obtain an oxygen-free copper alloy thick strip.

[0097] It is understood from common technical knowledge that the present invention may be implemented by other embodiments that do not depart from its spirit or essential features. Therefore, the embodiments disclosed above are, in all respects, merely illustrative and not exclusive. All modifications within the scope of the present invention or equivalent to the scope of the present invention are intended to be encompassed by the present invention.

Claims

1. An oxygen-free copper alloy thick strip production and processing equipment, characterized by: The invention comprises a cooling box (1) and a pickling box (4), wherein a transmission mechanism (2) for driving an oxygen-free copper alloy plate (3) to move is installed inside the cooling box (1) and the pickling box (4), and a mitigation mechanism (5) for rapidly cooling the oxygen-free copper alloy plate (3) and reducing the thickness of the oxide layer is installed inside the cooling box (1); The relief mechanism (5) includes a delivery pipe (51) and a baffle (55), a baffle (55) with an arc-shaped edge is installed inside the top of the cooling box (1), and the cooling box (1) is provided with a delivery pipe (51) symmetrically installed on the upper and lower sides of the transmission mechanism (2); A plurality of nozzles (52) and a steering nozzle (53) are installed on the upper side of the delivery pipe (51) located below the transmission mechanism (2), and a plurality of downward pressure nozzles (54) are installed on the bottom end of the delivery pipe (51) located above the transmission mechanism (2); The tilt angle of the nozzle (52) increases from the middle position of the delivery pipe (51) toward the edge position of the delivery pipe (51), and the steering nozzle (53) is tilted and fixed at both ends of the delivery pipe (51) and is located outside the nozzle (52); The distance between adjacent downward pressure nozzles (54) and the inclination angle of the downward pressure nozzles (54) gradually increase along the edge of the delivery pipe (51) toward the middle of the delivery pipe (51); A pumping mechanism (6) for conveying water and gas to the inside of the pickling box (4) is installed inside the cooling box (1), and a cleaning mechanism (8) for pickling the oxide layer is installed inside the pickling box (4); The cleaning mechanism (8) includes a support rod (88), a plurality of support rods (88) are installed inside the pickling box (4), the support rods (88) are connected to the connecting pipe (810) through a joint (89), a rotating shaft (811) and a compression rod (812) are rotatably connected inside the joint (89), so that the rotating shaft (811) can rotate freely inside the joint (89), and a plurality of compression rods (812) are fixedly connected to the side wall of the rotating shaft (811); The joint (89) and the support rod (88) are internally rotatably connected with a lever (87), and one spherical end of the lever (87) abuts against the bottom of the compression rod (812); The support rod (88) is internally slidably connected to the piston (85) and the slide rod (83), and the top end of the slide rod (83) is sleeved inside the piston (85); The bottom end of the lever (87) abuts against the top of the piston (85), and the lever (87) is mounted on the inner side wall of the support rod (88) via a support (86); The side wall of the slide rod (83) is sheathed with a spring (84), and the two ends of the spring (84) respectively contact the bottom surface of the piston (85) and the bottom sealing surface of the support rod (88); The bottom end of the slide rod (83) is fixedly connected to the pressure plate (82), the side wall of the pressure plate (82) is installed with a rubber pad (81), and a plurality of rubber pads (81) are slidably connected to the top surface and the bottom surface of the oxygen-free copper alloy plate (3); A grinding mechanism (9) for removing the surface oxide layer of the oxygen-free copper alloy plate (3) is installed inside the pickling box (4), and flushing mechanisms (7) for removing the oxide layer at the edge of the side wall of the oxygen-free copper alloy plate (3) are installed at both ends of the pickling box (4).

2. The oxygen-free copper alloy thick strip production and processing equipment according to claim 1, characterized in that: The transmission mechanism (2) includes a transmission rod (21) and a slide (22), the transmission rod (21) is located at the end of the slide (22) and extends to the end of the cooling box (1), the slide (22) is arranged at the entrance of the cooling box (1), and a plurality of discharge rollers (29) are provided at the junction of the transmission rod (21) and the slide (22), and a plurality of protrusions (210) are installed on the side wall of the discharge roller (29), and the lengths of the protrusions (210) on the surfaces of two adjacent discharge rollers (29) increase from top to bottom.

3. The oxygen-free copper alloy thick strip production and processing equipment according to claim 2, characterized in that: Two upper and lower rows of transmission rods (21) with opposite rotation directions are provided at both ends of the pickling box (4), and one end of two of the transmission rods (21) is installed with a connecting gear (28) for changing the rotation direction of the transmission rod (21), and the connecting gears (28) are meshed with each other; The side walls of the cooling box (1) and the pickling box (4) are both connected to a mounting box (26), the interior of the mounting box (26) is rotatably connected to a main gear (27), the connecting gear (28) engages with the main gear (27), and one end of the main gear (27) is connected to a drive motor (23); The side walls of the conveying rod (21) and the unloading roller (29) are both fixedly connected with sprockets (24), and a chain belt (25) is set between the sprockets (24).

4. The oxygen-free copper alloy thick strip production and processing equipment according to claim 3, characterized in that: A plurality of hydraulic rods (11) are installed on the side wall of the cooling box (1), and one end of the hydraulic rod (11) is connected to a top plate (13) for pushing the oxygen-free copper alloy plate (3) upward and a push plate (12) for pushing the oxygen-free copper alloy plate (3) into the pickling box (4); A limiting block (14) with a triangular side wall is installed on the inner side wall of the cooling box (1), and the limiting block (14) contacts the side wall of the oxygen-free copper alloy plate (3).

5. The oxygen-free copper alloy thick strip production and processing equipment according to claim 4, characterized in that: The pumping mechanism (6) includes a high-pressure water pump (63) and an air pump (64). The high-pressure water pump (63) and the air pump (64) are installed on the surface of the cooling box (1). The high-pressure water pump (63) is connected to the cooling box (1) and the pickling box (4) through a water pipe (66). The bottom end of the water pipe (66) is connected to a steel pipe (62). The steel pipe (62) is vertically connected to a floating plate (61).

6. The oxygen-free copper alloy thick strip production and processing equipment according to claim 5, characterized in that: The air pump (64) quickly draws the gas inside the cooling box (1) into the interior of the pickling pipe (41) through the air delivery pipe (65). The interior of the pickling pipe (41) is symmetrically installed with mixing plates (44) with a funnel shape inside, and a block (45) is installed between the two mixing plates (44); A flushing pipe (43) is installed at one end of the pickling tank (4), the flushing pipe (43) is connected to the water pipe (66) inside the pickling tank (4), and a plurality of flushing nozzles (42) are installed at the bottom end of the flushing pipe (43).

7. The oxygen-free copper alloy thick strip production and processing equipment according to claim 6, characterized in that: The grinding mechanism (9) comprises a fixed shaft (91) and a housing (94); the surface of the pickling box (4) is symmetrically mounted with the I-shaped housing (94); the interior of the housing (94) is rotatably connected to a first gear (95) and a second gear (96) that mesh with each other; the first gear (95) is connected to the driving motor (23); the diameter of the first gear (95) is larger than the diameter of the second gear (96); The first gear (95), the second gear (96) and the top end of the fixed shaft (91) are all fixedly connected to the sprocket (24); The bottom end of the fixed shaft (91) is fixedly connected to the first grinding wheel (92) and the second grinding wheel (93), respectively. The first grinding wheel (92) and the second grinding wheel (93) are staggered.

8. The oxygen-free copper alloy thick strip production and processing equipment according to claim 7, characterized in that: Between the adjacent cleaning mechanism (8) and the flushing mechanism (7), the first grinding wheel (92) and the second grinding wheel (93) rotate in opposite directions, wherein the top ends of the four fixed shafts (91) are fixedly connected to a third gear (97) for changing the rotation direction of the first grinding wheel (92) and the second grinding wheel (93), and the adjacent third gears (97) are meshed with each other.

9. The oxygen-free copper alloy thick strip production and processing equipment according to claim 8, characterized in that: The flushing mechanism (7) comprises a cylinder (71), a plurality of the cylinders (71) are fixedly connected to the inner side wall of the pickling tank (4), and the center of the side wall of the cylinder (71) is connected to the water pipe (66) inside the pickling tank (4) through a connecting pipe (73); The cylinder (71) is internally rotatably connected to a turbine (72), the sprocket (24) on the side wall of the turbine (72) and the sprocket (24) on the side wall of the speed-increasing gear (76) are connected via the chain belt (25), the speed-increasing gear (76) is engaged with the main gear (27), and the diameter of the speed-increasing gear (76) is smaller than the diameter of the main gear (27); The side wall of the cylinder (71) is connected to a high-pressure nozzle (74) for removing the oxide layer on the side wall of the oxygen-free copper alloy plate (3). The upper and lower ends of the high-pressure nozzle (74) are equipped with partitions (75) with arc-shaped side walls, and the oxygen-free copper alloy plate (3) is slidably connected between the partitions (75).

10. A processing method using the processing equipment according to claim 9, characterized in that: The specific steps include: Step 1: High-purity cathode copper is placed in a vacuum induction furnace for smelting. Before smelting, vacuum is first evacuated for preheating and the high-purity cathode copper is dried. The dried charcoal is used as a covering agent, and an inert gas is introduced into the bottom of the induction furnace. The smelting is carried out at 1150-1200°C. During the smelting process, the inert gas causes the gas in the copper liquid in the furnace to enter the inert bubbles. As the bubbles float to the surface of the copper liquid, they react with the charcoal covered in the furnace to produce CO and remove it. After it is completely melted, rare earth purifiers and Composite deoxidizer, adding magnesium and tin to the furnace, continuing stirring for 2-5 minutes, and standing for 20-30 minutes to obtain an oxygen-free copper alloy melt; pouring the oxygen-free copper alloy melt into a preheated mold to obtain an oxygen-free copper alloy ingot; the proportions of each raw material are calculated by weight: 100 parts of high-purity cathode copper, 0.02-0.1 parts of rare earth purifier, 0.1-0.5 parts of composite deoxidizer, 0.004-0.008 parts of magnesium, and 0.005-0.01 parts of tin; Step 2: hot-rolling the oxygen-free copper alloy ingot at 800-860° C. to form an oxygen-free copper alloy plate (3), connecting the device to an external power supply, placing the hot-rolled oxygen-free copper alloy plate (3) on the surface of the slide (22), and placing the oxygen-free copper alloy plate (3) cooled inside the cooling box (1) into the pickling box (4); placing the oxygen-free copper alloy plate (3) into the cooling box (1), and operating the relief mechanism (5) to allow water to flow rapidly along the surface of the oxygen-free copper alloy plate (3), thereby accelerating heat dissipation efficiency, and quickly taking away the temperature of the oxygen-free copper alloy plate (3) and the surrounding gas, thereby reducing oxidation efficiency; Step 3: When the oxygen-free copper alloy plate (3) moves inside the pickling box (4), the oxygen-free copper alloy plate (3) slides over the side wall of the rubber pad (81), and the acid liquid mixes with the gas inside the cooling box (1) and enters the inside of the rubber pad (81); the acid liquid contacts the surface of the oxygen-free copper alloy plate (3) inside the rubber pad (81), and the acid liquid reacts with the oxide layer. Since the acid liquid contains a large number of bubbles, the bubbles churn inside the rubber pad (81) and push the acid liquid to continuously contact the oxide layer, and the oxygen-free copper alloy plate (3) is cooled. The generated gas pushes the acid liquid to move, accelerating the reaction rate between the oxide layer and the acid liquid, and the acid liquid flows through the compression rod (812) and the lever (87), causing the rubber pad (81) to continuously move up and down; when the elastic rubber pad (81) moves downward, it spreads a distance on the surface of the oxygen-free copper alloy plate (3), thereby increasing the cleaning range of the acid liquid; at the same time, the rubber pad (81) continuously contracts and spreads to push the acid liquid to continuously move up and down, causing the acid liquid to continuously move and contact the surface of the oxygen-free copper alloy plate (3), further improving the reaction efficiency of the oxide layer and the acid liquid; Step 4: The pickled oxygen-free copper alloy plate (3) is brought into contact with the rotating grinding mechanism (9) to remove the oxide layer, so that the oxide layer on the surface of the oxygen-free copper alloy plate (3) is removed, and the oxygen-free copper alloy plate (3) continues to move and contacts the flushing mechanism (7) to remove the oxide layer on the side wall of the oxygen-free copper alloy plate (3), and clean the surface of the oxygen-free copper alloy plate (3); the oxygen-free copper alloy plate (3) cleaned by the high-pressure nozzle (74) is pickled, polished, and flushed again to further eliminate the oxide layer, and then the oxygen-free copper alloy plate (3) is cleaned by water sprayed from the flushing nozzle (42); the above operation is repeated to cool the oxygen-free copper alloy plate (3) inside the cooling box (1) and the pickling box (4) and remove the oxide layer; Step 5: The cleaned oxygen-free copper alloy plate (3) is dried and then pre-finished and then sent to an annealing furnace for annealing. The oxygen-free copper alloy plate (3) taken out of the annealing furnace is again placed in the cooling box (1) and the pickling box (4) to remove the oxide layer. Finally, the oxygen-free copper alloy plate (3) is finish-rolled to obtain an oxygen-free copper alloy thick strip.

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