Electronic water pump with control board waterproof structure

Abstract

The application relates to the technical field of electronic water pumps, in particular to an electronic water pump with a waterproof structure of a control panel, which comprises a pump shell, a control panel and an end cover, one end of the pump shell is internally provided with a mounting cavity, the control panel is arranged in the mounting cavity, the end cover is arranged on one side end of the pump shell, a convex part extending to the inside of the pump shell is arranged on the inner end face of the end cover, the convex part is attached to the control panel, a gap sealing mechanism is arranged between the convex part and the inner side wall of the pump shell, and a heat conduction mechanism connected with the convex part is arranged in the bottom of the mounting cavity and the inner side wall of the pump shell corresponding to the mounting cavity. The application solves the problem that there is a certain gap between the pump shell and the end cover, and under certain conditions, condensate water is generated in the air in the pump shell, and when the condensate water is attached to the printed circuit and components of the control panel, metal oxidation, corrosion and other problems may be caused.

Description

Technical Field

[0001] This invention relates to the field of electronic water pump technology, specifically to an electronic water pump with a waterproof control board structure. Background Technology

[0002] Electric water pumps, with their high output efficiency and precise flow control, are widely used in automobiles, home appliances, and industrial equipment. New energy vehicles, in particular, typically have two or more electric water pumps. These pumps are the power source for the entire cooling system of new energy vehicles, as the power battery and drive motor rely on them to circulate and cool the coolant. The control board is one of the core components of the electric water pump, used to control the operation of the stator assembly, enabling it to generate a rotating magnetic field that drives the rotor assembly. Because the control board houses the main controller, power electronic devices for driving the stator assembly, and other necessary peripheral circuits, it generates a significant amount of heat. In existing electronic water pumps, the control board is usually installed inside the pump casing. When the control board is running or stopping, the temperature changes, which in turn causes temperature changes in the internal environment of the pump casing. In addition, there is a certain gap between the pump casing and the end cover. Under certain conditions, condensation will be generated in the air inside the pump casing. When the condensation adheres to the printed circuit and components of the control board, it may cause problems such as metal oxidation and corrosion, ultimately leading to open circuit, short circuit or other malfunctions in the control board, making it unable to drive the stator assembly normally. Summary of the Invention

[0003] To address the aforementioned technical problems, this invention proposes an electronic water pump with a waterproof control board structure.

[0004] The technical problem to be solved by this invention is achieved by the following technical solution:

[0005] An electronic water pump with a waterproof control board structure includes a pump housing, a control board, and an end cap. One end of the pump housing has an internal mounting cavity, and the control board is disposed within the mounting cavity. The end cap is mounted on one side of the pump housing. The inner end face of the end cap has a protrusion extending into the pump housing, which is fitted with the control board. A gap-sealing mechanism is provided between the protrusion and the inner sidewall of the pump housing. A heat-conducting mechanism connected to the protrusion is provided inside the pump housing sidewall corresponding to the mounting cavity and at the bottom of the mounting cavity.

[0006] After absorbing the heat generated by the control board during operation, the protrusion conducts the heat to the outside of the end cover for heat dissipation. On the other hand, it conducts the heat to the inner wall of the pump housing in contact with it, causing the gap sealing mechanism to expand due to heat and seal the gap between the pump housing and the end cover. The heat is also conducted to the side wall of the pump housing and the bottom of the mounting cavity through the heat conduction mechanism, so that the temperature of the mounting cavity is uniform on the top, bottom and all sides, avoiding the formation of condensation in the mounting cavity due to uneven temperature, thereby achieving the purpose of waterproofing.

[0007] The beneficial effects of this invention are:

[0008] This invention provides an electronic water pump with a waterproof control board structure. Through a protruding part, a gap-sealing mechanism, and a heat-conducting mechanism, during control board operation, the protruding part absorbs the heat generated by the control board. On one hand, it conducts the heat to the outside of the end cover for heat dissipation; on the other hand, it conducts the heat to the inner wall of the pump casing, causing the gap-sealing mechanism to expand and seal the gap between the pump casing and the end cover. The heat-conducting mechanism then conducts the heat to the side wall of the pump casing and the bottom of the mounting cavity, ensuring a uniform temperature throughout the mounting cavity and preventing condensation due to uneven temperature distribution, thus achieving waterproofing. This invention solves the problem that existing pumps with a certain gap between the pump casing and the end cover can produce condensation in the air inside the pump casing under certain conditions. When this condensation adheres to the printed circuits and components of the control board, it can cause metal oxidation and corrosion. Attached Figure Description

[0009] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0010] Figure 1 This is a schematic diagram of the external structure of the present invention;

[0011] Figure 2 This is a schematic diagram of the internal structure of the present invention;

[0012] Figure 3 for Figure 2 Enlarged structural diagram at point A in the diagram;

[0013] Figure 4 This is a schematic diagram of the gap-sealing sealing ring structure in this invention;

[0014] Figure 5 This is a schematic diagram of the connection structure between the lateral heat-conducting strip and the heat-conducting sheet in this invention.

[0015] In the diagram: 1. Pump casing; 2. Control panel; 3. End cover; 4. Mounting cavity; 5. Protrusion; 6. Annular internal groove; 7. Gap sealing ring; 8. Isolation plate; 9. Mounting protrusion; 10. Lateral heat conduction groove; 11. Internal heat conduction groove; 12. Lateral heat conduction strip; 13. Heat conduction plate. Detailed Implementation

[0016] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0017] like Figures 1 to 5 As shown, an electronic water pump with a waterproof control board structure includes a pump housing 1, a control board 2, and an end cap 3. One end of the pump housing 1 has an internal mounting cavity 4, and the control board 2 is disposed within the mounting cavity 4. The end cap 3 is mounted on one side of the pump housing 1. The end cap 3 is characterized by having a protrusion 5 extending into the pump housing 1 on its inner end face. The protrusion 5 and the end cap 3 are integrally formed and made of the same material to facilitate heat absorption and dissipation. The protrusion 5 is fitted to the control board 2, and a gap sealing mechanism is provided between the protrusion 5 and the inner wall of the pump housing 1 in contact with it. A heat-conducting mechanism connected to the protrusion 5 is provided inside the side wall of the pump housing 1 corresponding to the mounting cavity 4 and at the bottom of the mounting cavity 4.

[0018] After absorbing the heat generated by the control board 2 during operation, the protrusion 5 conducts the heat to the outside of the end cover 3 for heat dissipation. On the other hand, it conducts the heat to the inner wall of the pump housing 1 in contact with it, causing the gap sealing mechanism to expand due to heat and seal the gap between the pump housing 1 and the end cover 3. The heat is also conducted to the side wall of the pump housing 1 and the bottom of the mounting cavity 4 through the heat conduction mechanism, so that the temperature of the mounting cavity 4 is uniform on the top, bottom and all sides, and the condensation caused by uneven temperature is avoided, thereby achieving the purpose of waterproofing.

[0019] Specifically, as a further improvement of this embodiment, the gap sealing mechanism includes an annular built-in groove 6 disposed on the inner sidewall of the pump housing 1 and a gap sealing ring 7 installed in the annular built-in groove 6. The inner ring surface of the gap sealing ring 7 is flush with the inner sidewall of the pump housing 1. In this embodiment, the gap sealing ring 7 is an expanded graphite sealing ring. The expanded graphite sealing ring expands after being heated and makes an interference fit with the circumferential sidewall of the protrusion 5. This achieves the purpose of sealing the gap between the pump housing 1 and the end cover 3, thereby solving the problem that in the existing pump housing and end cover, there is a certain gap, and under certain conditions, condensation will be generated in the air inside the pump housing. When the condensation adheres to the printed circuit and components of the control board, it may cause problems such as metal oxidation and corrosion.

[0020] Furthermore, the bottom of the mounting cavity 4 is provided with an isolation plate 8 to isolate the mounting cavity 4 from the remaining space inside the pump housing 1. The isolation plate 8 has several mounting protrusions 9 distributed circumferentially, and the control plate 2 is correspondingly disposed on these mounting protrusions 9. In this embodiment, six mounting protrusions 9 are provided, evenly distributed circumferentially. All six mounting protrusions 9 are made of heat-insulating material.

[0021] Specifically, as a further improvement of this embodiment, the heat-conducting mechanism includes a plurality of lateral heat-conducting grooves 10 circumferentially distributed inside the side wall of the pump housing 1 corresponding to the mounting cavity 4, a built-in heat-conducting groove 11 disposed inside the insulating plate 8, a plurality of lateral heat-conducting strips 12 disposed inside the plurality of lateral heat-conducting grooves 10, and a heat-conducting sheet 13 disposed inside the built-in heat-conducting groove 11. The bottoms of the plurality of lateral heat-conducting grooves 10 are all connected to the built-in heat-conducting groove 11, and the tops of the plurality of lateral heat-conducting grooves 10 are all connected to the mounting cavity 4. The bottoms of the plurality of lateral heat-conducting strips 12 are all connected to the heat-conducting sheet 13, and the tops of the plurality of lateral heat-conducting strips 12 are all in contact with the circumferential side wall of the protrusion 5. In this embodiment, the number of lateral heat-conducting grooves 10 and lateral heat-conducting strips 12 is twelve.

[0022] Furthermore, the tops of the twelve side heat-guiding grooves 10 communicate with the mounting cavity 4 below the gap sealing mechanism and not lower than the bottom of the protrusion 5. The tops of the twelve side heat-guiding grooves 10 are all horizontal lateral communication openings, and the tops of the several side heat-guiding strips 12 are all L-shaped structures.

[0023] Through the heat conduction mechanism described above, a portion of the heat absorbed by the protrusion 5 can be conducted to the periphery and bottom of the mounting cavity 4, resulting in a uniform temperature distribution throughout the mounting cavity 4 and avoiding the problem of condensation caused by uneven temperature distribution.

[0024] Working principle and usage process of this invention:

[0025] During operation, the protrusion 5 of the control board 2 absorbs the heat it generates and dissipates it through the end cover 3. Simultaneously, some heat is dispersed to the circumferential sidewall of the protrusion 5, causing the temperature of the area between the circumferential sidewall of the protrusion 5 and the inner sidewall of the pump housing 1 to rise. The gap-sealing sealing ring 7 located in this area expands upon heating and forms an interference fit with the circumferential sidewall of the protrusion 5, sealing the gap between the protrusion 5 and the inner sidewall of the pump housing 1, thus isolating the mounting cavity 4 from the outside and achieving waterproofing. At the same time, the top of the lateral heat-guiding strip 12... When in contact with the circumferential sidewall of the protrusion 5, a portion of the heat absorbed by the protrusion 5 is conducted through the lateral heat-conducting strip 12 to the heat-conducting plate 13 inside the insulation plate 8, causing the temperature of the pump housing 1 sidewall and the insulation plate 8 corresponding to the mounting cavity 4 to rise until they reach a temperature equilibrium with the protrusion 5. At this point, the temperatures of the protrusion 5 above the mounting cavity 4, the insulation plate 8 below, and the pump housing 1 sidewall around the perimeter are basically the same, thus achieving temperature equilibrium and avoiding the problem of condensation caused by uneven temperature, thereby achieving the purpose of waterproofing.

[0026] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely prisms of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.

Claims

1. An electronic water pump with a control board waterproof structure, comprising a pump shell (1), a control board (2) and an end cover (3), an installation cavity (4) is arranged in one end of the pump shell (1) internally, the control board (2) is arranged in the installation cavity (4), and the end cover (3) is installed on one side end of the pump shell (1), characterized in that: The inner end face of the end cover (3) is provided with a protrusion (5) extending to the inside of the pump shell (1), the protrusion (5) is attached to the control panel (2), and a gap sealing mechanism is arranged between the protrusion (5) and the inner side wall of the pump shell (1). The mounting cavity (4) corresponds to the inner side wall of the pump shell (1) and the bottom of the mounting cavity (4), and the protrusion (5) is connected to the heat conduction mechanism. The protrusion (5) absorbs the heat generated by the operation of the control panel (2), conducts the heat to the outside of the end cover (3) for heat dissipation, and on the other hand, conducts the heat to the inner side wall of the pump shell (1) in contact with it, so that the gap sealing mechanism is heated and expanded to seal the gap between the pump shell (1) and the end cover (3), and the heat is conducted to the side wall of the pump shell (1) and the bottom of the mounting cavity (4) through the heat conduction mechanism, so that the temperature of the mounting cavity (4) is balanced, and the condensate water is avoided. The purpose of preventing water is achieved.

2. The electronic water pump with waterproof structure of control panel according to claim 1, characterized in that: The protrusion (5) and the end cover (3) are of an integral structure and are made of the same material.

3. The electronic water pump with waterproof structure of control panel according to claim 1, characterized in that: The gap sealing mechanism includes an annular built-in groove (6) arranged on the inner side wall of the pump shell (1) and a gap sealing ring (7) installed in the annular built-in groove (6). The inner ring surface of the gap sealing ring (7) is flush with the inner side wall of the pump shell (1).

4. The electronic water pump with waterproof structure of control panel according to claim 3, characterized in that: The gap sealing ring (7) is an expanded graphite sealing ring.

5. The electronic water pump with waterproof structure of control panel according to claim 4, characterized in that: The expanded graphite sealing ring expands after being heated and is in interference fit with the circumferential side wall of the protrusion (5).

6. The electronic water pump with waterproof structure of control panel according to claim 1, characterized in that: The bottom of the mounting cavity (4) is provided with an isolation plate (8) for isolating the mounting cavity (4) from the remaining space inside the pump shell (1). The isolation plate (8) is circumferentially distributed with a plurality of mounting protrusions (9), and the control panel (2) is correspondingly arranged on the plurality of mounting protrusions (9).

7. The electronic water pump with waterproof structure of control panel according to claim 6, characterized in that: The plurality of mounting protrusions (9) are made of heat insulation material.

8. The electronic water pump with waterproof structure of control panel according to claim 6, characterized in that: The heat conduction mechanism includes a plurality of lateral heat conduction grooves (10) circumferentially distributed in the corresponding inner side wall of the pump shell (1) of the mounting cavity (4), an internal heat conduction groove (11) arranged in the internal heat conduction groove (11), a plurality of lateral heat conduction strips (12) arranged in the plurality of lateral heat conduction grooves (10), and a heat conduction sheet (13) arranged in the internal heat conduction groove (11). The bottom of the plurality of lateral heat conduction grooves (10) is connected with the internal heat conduction groove (11), and the top is connected with the mounting cavity (4). The bottom of the plurality of lateral heat conduction strips (12) is connected with the heat conduction sheet (13), and the top is in contact with the circumferential side wall of the protrusion (5).

9. The electronic water pump with waterproof structure of control panel according to claim 8, characterized in that: The top of the plurality of lateral heat conduction grooves (10) is connected with the mounting cavity (4) below the gap sealing mechanism and not lower than the bottom of the protrusion (5).

10. The electronic water pump with waterproof structure of control panel according to claim 8, characterized in that: The top of the plurality of lateral heat conduction grooves (10) is a horizontal lateral communication port, and the top of the plurality of lateral heat conduction strips (12) is an L-shaped structure.

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