Gypsum board defect detection method, system, device and storage medium

Abstract

The present application discloses a gypsum board defect detection method, system, equipment and storage medium. First, a first surface point coordinate parameter set and a thickness distribution parameter set of the gypsum board to be inspected are collected, and then an actual three-dimensional model of the gypsum board to be inspected is generated according to the first surface point coordinate parameter set and the thickness distribution parameter set. Then, a standard model is called according to the specification parameters of the gypsum board, and the actual three-dimensional model and the standard model are compared. Finally, it is determined whether the flatness of the gypsum board to be inspected is qualified. Compared with the existing technology, the present application not only realizes the automatic detection of the flatness of the gypsum board surface, but also completes the flatness detection of all planes in one detection process. Compared with the surface-by-surface detection, it not only simplifies the process, but also shortens the detection time by half, effectively improving the detection efficiency of the gypsum board surface flatness.

Description

Technical Field

[0001] The present application relates to the technical field of gypsum board detection equipment, and specifically to a gypsum board defect detection method, system, equipment and storage medium. Background Art

[0002] The production process of gypsum board generally includes crushing, mixing, pouring, drying and testing. During the testing process, it is necessary not only to check whether there are surface quality problems such as cracks and stains on the surface of the gypsum board, but also to check whether the surface flatness of the gypsum board meets the requirements;

[0003] The existing technology mainly uses manual inspection to detect the flatness of the gypsum surface. This not only has poor detection accuracy but also consumes a lot of manpower. Currently, some factories have introduced automatic detection equipment, but the above equipment can only detect the top or bottom surface of the gypsum board in one process. Then the board must be turned over to complete the inspection of the other side. The inspection process is cumbersome and the inspection efficiency is low. Summary of the Invention

[0004] The main purpose of this application is to provide a gypsum board defect detection method, system, equipment and storage medium, aiming to solve the defect of low flatness detection efficiency in the existing technology.

[0005] This application achieves the above objectives through the following technical solutions:

[0006] A method for detecting defects in gypsum boards, comprising the following steps:

[0007] Collecting a first surface point coordinate parameter set of the gypsum board to be inspected;

[0008] Collecting a thickness distribution parameter set of the gypsum board to be tested;

[0009] generating an actual three-dimensional model of the gypsum board to be inspected according to the first surface point coordinate parameter set and the thickness distribution parameter set;

[0010] Retrieve the standard model according to the specification parameters of the gypsum board to be tested;

[0011] The actual three-dimensional model is compared with the standard model to determine whether the flatness of the gypsum board to be tested is qualified.

[0012] Optionally, collecting a first surface point coordinate parameter set of the gypsum board to be inspected includes the following steps:

[0013] Set the sampling period T and the conveying speed V of the gypsum board to be tested;

[0014] Construct the initial coordinate system and obtain the initial coordinate set of each measurement point {(X1, Y1, Z1), (X1, Y2, Z1), ..., (X1, Yn , Z1)}; where n represents the number of each measurement point;

[0015] Get the distance parameter h of each detection point 11 , h 12 ,...,h 1m ,...,h 1M , h 21 , h 22 ,...,h nm ..., h nM ; Where n represents the number of each measurement point, M represents the total number of sampling times, m represents the number of sampling times, and m≤M;

[0016] Calculate the X-axis coordinate and Y-axis coordinate of each detection point according to the sampling period T, the conveying speed V and the initial coordinate set;

[0017] Calculate the Z-axis coordinates of each detection point according to the initial coordinates and the distance parameters;

[0018] The X-axis coordinate, the Y-axis coordinate, and the Z-axis coordinate are integrated to obtain a first surface point coordinate parameter set.

[0019] Optionally, the expression for the X-axis coordinate is: nm =(m-1)TV+X1; the expression of the Y-axis coordinate is Y nM =...=Y nm =...=Y n1 =Y n ; The expression of the Z-axis coordinate is ; Where n represents the number of each measurement point, M represents the total number of sampling times, m represents the number of sampling times, and m≤M.

[0020] Optionally, collecting a thickness distribution parameter set of the gypsum board to be tested includes the following steps:

[0021] Obtain the sampling period T and the conveying speed V of the gypsum board to be tested;

[0022] Collect the thickness parameters d of each detection point 11 , d 12 ,...,d 1m ,...,d 1M , d 21 , d 22 ,...,d nm ..., d nM ; Where n represents the number of each measurement point, M represents the total number of sampling times, m represents the number of sampling times, and m≤M;

[0023] A thickness distribution parameter set is generated according to the sampling period, the conveying speed and the thickness parameters.

[0024] Optionally, generating an actual three-dimensional model of the gypsum board to be inspected according to the first surface point coordinate parameter set and the thickness distribution parameter set comprises the following steps:

[0025] generating a second surface point coordinate parameter set of the gypsum board to be inspected according to the first surface point coordinate parameter set and the thickness distribution parameter set;

[0026] generating a plurality of tangent curves according to the first surface point coordinate parameter set and the second surface point coordinate parameter set;

[0027] The section curves are sequentially connected using smooth surfaces to generate an actual three-dimensional model of the gypsum board to be inspected.

[0028] Optionally, generating a second surface point coordinate parameter set of the gypsum board to be inspected according to the first surface point coordinate parameter set and the thickness distribution parameter set includes the following steps:

[0029] Obtaining a first surface point coordinate parameter set and a thickness distribution parameter set;

[0030] Establishing a one-to-one mapping between the first surface point coordinate parameter set and the thickness distribution parameter set based on the same X-axis coordinate and Y-axis coordinate;

[0031] Extracting a plurality of groups of Z-axis coordinate calculation units according to a one-to-one mapping;

[0032] The Z-axis coordinates of each second surface are calculated respectively according to each Z-axis coordinate calculation unit; wherein the calculation formula of the Z-axis coordinate of the second surface is Z' nm =Z1+h nm +d nm ;

[0033] A second surface point coordinate parameter set is generated according to each of the second surface Z-axis coordinates.

[0034] Optionally, comparing the actual three-dimensional model with the standard model to determine whether the flatness of the gypsum board to be tested is qualified includes the following steps:

[0035] Set the upper and lower deviations of flatness as needed;

[0036] generating an upper deviation standard model according to the upper deviation and the standard model;

[0037] generating a lower deviation standard model according to the lower deviation and the standard model;

[0038] integrating the actual three-dimensional model, the upper deviation standard model, and the lower deviation standard model;

[0039] If the actual three-dimensional model is completely located between the upper deviation standard model and the lower deviation standard model, the gypsum board to be tested is determined to be qualified; otherwise, it is determined to be unqualified.

[0040] Accordingly, the present application also discloses a detection system based on the above method, including:

[0041] A coordinate parameter acquisition module, used to acquire a coordinate parameter set of a first surface point of the gypsum board to be inspected;

[0042] A thickness parameter acquisition module is used to acquire a thickness distribution parameter set of the gypsum board to be tested;

[0043] a three-dimensional model generation module, configured to generate an actual three-dimensional model of the gypsum board to be inspected based on the first surface point coordinate parameter set and the thickness distribution parameter set;

[0044] The model calling module is used to call the standard model according to the specification parameters of the gypsum board to be tested;

[0045] The comparison and judgment module is used to compare the actual three-dimensional model with the standard model to determine whether the flatness of the gypsum board to be tested is qualified.

[0046] In addition, to achieve the above-mentioned purpose, the present application also provides an electronic device, which includes a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the above-mentioned method.

[0047] In addition, to achieve the above objectives, the present application also provides a computer-readable storage medium, on which a computer program is stored, and a processor executes the computer program to implement the above method.

[0048] Compared with the prior art, this application has the following beneficial effects:

[0049] The present application first collects a first surface point coordinate parameter set and a thickness distribution parameter set of the gypsum board to be tested, then generates an actual three-dimensional model of the gypsum board to be tested based on the first surface point coordinate parameter set and the thickness distribution parameter set, then calls a standard model based on the specification parameters of the gypsum board, and compares the actual three-dimensional model with the standard model to determine whether the flatness of the gypsum board to be tested is qualified;

[0050] Correspondingly, the present application also discloses a detection system based on the above detection method, including a coordinate parameter acquisition module and a thickness parameter acquisition module, wherein the coordinate parameter acquisition module and the thickness parameter acquisition module are respectively electrically connected to the three-dimensional model generation module to upload relevant data. The detection system also includes a comparison and determination module, wherein the input end of the comparison and determination module is respectively electrically connected to the three-dimensional model generation module and the model calling module;

[0051] The detection principle of the present application is as follows: the gypsum board passes between the coordinate parameter acquisition module and the thickness parameter acquisition module, thereby acquiring the coordinate distribution parameters of the top or bottom surface and the thickness distribution parameters of the gypsum board;

[0052] When the gypsum board fluctuates due to surface flatness, the spacing between each detection point on its top surface and the coordinate parameter acquisition module will also change, that is, the Z coordinate will change; and since the coordinate parameter acquisition module is fixed in position, the X-axis coordinate and Y-axis coordinate of each detection point can be quantitatively calculated, and the Z-axis coordinate can be quantitatively calculated based on the change in spacing. Therefore, the present application calibrates several detection points on a certain surface of the gypsum board using three-dimensional coordinates, that is, the first surface point coordinate parameter set;

[0053] Project the test points involved in the first surface point coordinate parameter set onto the other side of the gypsum board in the vertical direction. The X-axis and Y-axis coordinates of each projection point and each test point are exactly the same. The difference in the Z-axis coordinate is the thickness value of the point. The surface flatness distribution of the other side can be quickly determined through the above conversion relationship.

[0054] Finally, the actual three-dimensional model of the gypsum board to be tested can be generated by curve fitting;

[0055] Compared with the existing technology, the present invention realizes the automatic detection of the flatness of the gypsum board surface, which can improve the detection accuracy and effectively improve the detection efficiency of the flatness;

[0056] Secondly, the present application can simultaneously determine the flatness of the top and bottom surfaces of the gypsum board to be inspected through dual detection of coordinates and thickness, that is, the flatness detection of all planes is completed in one detection process. Compared with the surface-by-surface detection, the present application not only simplifies the process, but also shortens the detection time by half, effectively improving the detection efficiency of the gypsum board surface flatness. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0058] Figure 2 A schematic diagram of the structure of the detection system provided in the embodiment of the present application;

[0059] Figure 3 A schematic diagram of the structure of a detection device provided in an embodiment of the present application;

[0060] Figure 4 A flow chart of a gypsum board defect detection method provided in an embodiment of the present application;

[0061] Figure 5 This is the construction principle diagram of the initial coordinate system;

[0062] Figure 6 It is a simplified diagram of the distribution of detection points in the initial coordinate system;

[0063] Figure 7 Schematic diagram for the generation of the actual 3D model of the gypsum board to be inspected;

[0064] Reference numerals: 1-coordinate parameter acquisition module, 2-thickness parameter acquisition module, 3-three-dimensional model generation module, 4-model calling module, 5-comparison and determination module, 101-infrared distance sensor, 201-ultrasonic thickness sensor, 1001-processor, 1002-communication bus, 1003-user interface, 1004-network interface, 1005-memory;

[0065] The purpose, features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0066] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0067] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0068] In the present invention, unless otherwise specified or limited, the terms "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can mean fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will be able to understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0069] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the meaning of "and / or" appearing throughout the text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme in which A and B are satisfied at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0070] Implementation Method 1

[0071] Figure 1 This is a schematic diagram of the electronic device structure of the hardware operating environment involved in the embodiment of the present application.

[0072] like Figure 1 As shown, the electronic device may include: a processor 1001, such as a central processing unit (CPU), a communication bus 1002, a user interface 1003, a network interface 1004, and a memory 1005. The communication bus 1002 is used to implement connection and communication between these components.

[0073] The user interface 1003 may include a display screen (Display) and an input unit such as a keyboard (Keyboard). Optionally, the user interface 1003 may also include a standard wired interface or a wireless interface.

[0074] The network interface 1004 may optionally include a standard wired interface or a wireless interface (such as a wireless fidelity (WI-FI) interface).

[0075] The memory 1005 may be a high-speed random access memory (RAM) memory or a stable non-volatile memory (NVM), such as a disk memory. Alternatively, the memory 1005 may be a storage device independent of the processor 1001 .

[0076] Those skilled in the art will understand that Figure 1 The structure shown in the figure does not constitute a limitation to the electronic device, and may include more or fewer components than shown in the figure, or combine certain components, or arrange the components differently.

[0077] exist Figure 1 In the electronic device shown, the network interface 1004 is mainly used for data communication with a network server; the user interface 1003 is mainly used for data interaction with a user; the processor 1001 and the memory 1005 in the electronic device of the present invention can be set in the electronic device, and the electronic device calls the gypsum board defect detection system stored in the memory 1005 through the processor 1001 and executes the gypsum board defect detection method provided in the embodiment of the present application;

[0078] Reference Figure 2 The detection system includes a coordinate parameter acquisition module 1, a thickness parameter acquisition module 2, a three-dimensional model generation module 3, a model calling module 4 and a comparison and judgment module 5.

[0079] The coordinate parameter acquisition module 1 and the thickness parameter acquisition module 2 are respectively connected to the three-dimensional model generation module 3 to upload the corresponding parameters; the model calling module 4 is connected to the database pre-stored with various gypsum board standard models to call different standard models in real time;

[0080] The three-dimensional model generation module 3 and the model calling module 4 are respectively connected to the comparison and determination module 5 for uploading corresponding model parameters;

[0081] Reference Figure 3 This embodiment also discloses a gypsum board defect detection device, comprising a frame and a plurality of conveying rollers disposed on the frame, wherein the conveying rollers are arranged in sequence along the length direction of the frame; it should be noted that the conveying rollers are independent of each other; and a detection gap is provided between two adjacent conveying rollers;

[0082] In the vertical direction, a plurality of infrared distance sensors 101 are provided on the top of the rack, and a plurality of ultrasonic thickness sensors 201 are provided on the bottom of the rack. It should be noted that each infrared distance sensor 101 corresponds to each ultrasonic thickness sensor 201 one by one, and in the vertical direction, the corresponding infrared distance sensors 101 and the ultrasonic thickness sensors 201 are directly opposite each other;

[0083] Reference Figure 3 , brackets are provided at the top and bottom of the frame, and the brackets are provided along the width direction of the frame, thereby crossing the axis direction of the conveying roller to avoid affecting the conveyance of the gypsum board;

[0084] Along the length direction of the bracket, the infrared distance sensors are arranged in sequence, and at the same time, the ultrasonic thickness sensors are arranged in sequence on the bottom bracket;

[0085] Furthermore, a marker may be provided on the bracket, and the origin can be quickly marked by the marker, thereby improving the efficiency and accuracy of constructing the initial coordinate system;

[0086] Secondly, since the positions of the marker, each infrared distance sensor and each ultrasonic thickness sensor are fixed, the distance between the marker and each infrared distance sensor is a fixed value, thereby quickly and accurately determining the initial coordinates;

[0087] It should be noted that the marker can also be any infrared distance sensor, among which the infrared distance sensors located at both ends of the length direction of the bracket are preferred;

[0088] Reference Figure 4 , the present application also discloses a gypsum board defect detection method, comprising the following steps:

[0089] S1, collecting the first surface point coordinate parameter set of the gypsum board to be tested;

[0090] S11, setting the sampling period T and the conveying speed V of the gypsum board to be tested;

[0091] Set the sampling period T and the conveying speed V of the gypsum board to be tested according to the detection accuracy requirements;

[0092] It should be noted that the sampling period T refers to the time interval between two adjacent samplings by the coordinate parameter acquisition module and the thickness parameter acquisition module, which together with the conveying speed V will determine the density of the sampling points;

[0093] By adjusting the above parameters, the density of the sampling points can be controlled, and thus the generation accuracy of the actual three-dimensional model of the gypsum board to be tested can be controlled, while taking into account the computer's computing power and accuracy requirements to meet different testing requirements.

[0094] S12, construct the initial coordinate system, and obtain the initial coordinate set of each measurement point {(X1, Y1, Z1), (X1, Y2, Z1), ..., (X1, Y n , Z1)}; where n represents the number of each measurement point;

[0095] Construct an initial coordinate system in the computer. The construction of the initial coordinate system can be determined according to the actual production situation;

[0096] Preferably, the moving direction of the gypsum board to be inspected is the X-axis, the vertical direction is the Z-axis, and the Y-axis is determined based on the X-axis and the Z-axis. The infrared distance sensors at both ends of the coordinate parameter acquisition module are used as the origin, or a pre-set marker can be selected as the origin.

[0097] Reference Figure 5In actual operation, the infrared distance sensor at the end of the bracket is selected as the origin to construct the initial coordinate system, with the length of the rack as the X-axis, the positive direction of the X-axis pointing to the moving direction of the gypsum board, the width of the rack as the Y-axis, the positive direction of the Y-axis pointing to each infrared distance sensor, the height direction as the Z-axis, and the vertical downward direction as the positive direction of the Z-axis;

[0098] In the above manner, the initial coordinate system can be combined with the movement direction of the gypsum board to be detected and the fixed structure of the equipment, which is conducive to simplifying subsequent calculations.

[0099] After the initial coordinate system is constructed, the initial coordinate sets of each measurement point {(X1, Y1, Z1), (X1, Y2, Z1), ..., (X1, Y n , Z1)}; where n represents the number of each measurement point;

[0100] It should be noted that each measuring point specifically refers to the location of each infrared distance sensor, and each detection point refers to each point determined by the infrared distance sensor on the surface of the gypsum board to be detected during the sampling process.

[0101] Combined with the above coordinate system settings, we can see that in the above example, X1=Y1=0, Y n =Y n-1 +d, Z1=0; where n is the number of the infrared distance sensor. Since the location of each infrared distance sensor is the measurement point, n also represents the number of each measurement point; d represents the distance between two adjacent infrared distance sensors, that is, the distance between two adjacent detection points in the Y direction; Z1 represents the distance between the infrared distance sensor and the origin in the Z-axis direction;

[0102] S13. Obtain the distance parameter h of each detection point 11 , h 12 ,...,h 1m ,...,h 1M , h 21 , h 22 ,...,h nm ..., h nM ; Where n represents the number of each measurement point, M represents the total number of sampling times, m represents the number of sampling times, and m≤M;

[0103] It should be noted that h nm It should be understood as the distance parameter of the detection point determined by the measurement point numbered n at the mth sampling. The detection point can only be determined by the numbers n and m.

[0104] The gypsum board to be inspected is controlled by the conveyor roller to pass through the inspection area in a stable posture with a conveying speed of V. At the same time, each infrared distance sensor and each ultrasonic thickness sensor is controlled to perform uninterrupted sampling according to the sampling period T;

[0105] After all sampling is completed, each infrared distance sensor will collect the distance parameter h of each detection point. 11 , h 12 ,...,h 1m ,...,h 1M , h 21 , h 22 ,...,h nm ..., h nM ; Where n represents the number of each measurement point, M represents the total number of sampling times, m represents the number of sampling times, and m≤M;

[0106] The above parameters are simplified and arranged in the form of a matrix as shown below:

[0107] ;

[0108] S14, calculating the X-axis coordinate and the Y-axis coordinate of each detection point according to the sampling period T, the conveying speed V and the initial coordinate set;

[0109] Since the gypsum board to be tested moves linearly along the X direction, its Y-axis coordinate will not change when each testing point is fixed, that is, the expression of the Y-axis coordinate is Y nM =...=Y nm =...=Y n1 =Y n , M represents the total number of sampling times, m represents the number of sampling times, and m≤M;

[0110] Specifically, Y 11 =Y 12 =...=Y 1m =...=Y 1M =Y1=0;

[0111] Similarly, Y 21 =Y 22 =...=Y 2m =...=Y 2M =Y2=Y1+d=d;

[0112] The calculation of other Y-axis coordinates is similar;

[0113] The Y-axis coordinates are simplified and arranged in the form of a matrix, as shown below

[0114]

[0115] During the movement of the gypsum board to be detected, the moving distance of the gypsum board in each sampling period is TV. At the same time, the moving distance of the first detection is 0, so the expression of the X-axis coordinate is X nm =(m-1)TV+X1; m represents the number of sampling times;

[0116] The X-axis coordinates are simplified and arranged in the form of a matrix, as shown below:

[0117]

[0118] S15. Calculate the Z-axis coordinates of each detection point according to the initial coordinates and the distance parameters; the expression of the Z-axis coordinates is: ;

[0119] In the vertical direction, the calculation of the Z-axis coordinate needs to consider both the origin position and the data misalignment caused by the movement of the gypsum board to be inspected;

[0120] Combined with the matrix in step S13, it can be seen that there is an inverted relationship in the data correspondence; that is, relative to the origin of the initial coordinate system, the distance parameter of the first sampling should correspond to the farthest sampling point, while the distance parameter of the last sampling should correspond to the closest sampling point;

[0121] Therefore, the calculation expression of the Z-axis coordinate is , where n represents the number of each measurement point, M represents the total number of sampling times, m represents the number of sampling times, and m≤M;

[0122] S16, integrating the X-axis coordinate, the Y-axis coordinate, and the Z-axis coordinate to obtain a first surface point coordinate parameter set;

[0123] Since the X, Y, and Z axis coordinates are calculated in steps S14 and S15 respectively, the first point coordinate parameter set can be obtained by integrating the different coordinates of the same detection point;

[0124] Specifically, the expression of the first point coordinate parameter set is: {(X1, Y1, Z1+h 1M ), (X1, Y2, Z1+h 2M ),...,(X1,Y n , Z1+h nM ), (X1+TV,Y1,Z1+h 1(M-1) ), (X1+TV,Y2,Z1+h 2(M-1) )..., (X1+TV, Y n , Z1+h n(M-1) ),..., ((M-1)TV+X1, Y1, Z1+h 11 ), ((M-1)TV+X1, Y2, Z1+h21 ), ((M-1)TV+X1, Y n , Z1+h n1 )}.

[0125] S2. Collecting a thickness distribution parameter set of the gypsum board to be tested;

[0126] S21, obtaining a sampling period T and a conveying speed V of the gypsum board to be tested;

[0127] Retrieve the sampling period T and the conveying speed V of the gypsum board to be tested set in step S11;

[0128] S22, collect the thickness parameters d of each detection point 11 , d 12 ,...,d 1m ,...,d 1M , d 21 , d 22 ,...,d nm ..., d nM ; Where n represents the number of each measurement point, M represents the total number of sampling times, m represents the number of sampling times, and m≤M;

[0129] The thickness parameters are continuously obtained by the ultrasonic thickness sensor according to the sampling period T;

[0130] It should be noted that the same number is used based on the positional relationship between the infrared distance sensors and the ultrasonic thickness sensors.

[0131] S23, generating a thickness distribution parameter set according to the sampling period, the conveying speed and the thickness parameters;

[0132] Since the ultrasonic thickness sensor is located directly below the infrared distance sensor, the X-axis and Y-axis coordinates of each detection point corresponding to the ultrasonic thickness sensor are the same as those of the infrared distance sensor.

[0133] It should also be noted that the thickness parameter and the distance parameter are also inverted;

[0134] Based on the above similarities, a corresponding relationship can be established between thickness parameters and points, and a thickness distribution parameter set can be generated at the same time;

[0135] That is {(X1, Y1)-d 1M , (X1, Y2)-d 2M ,...,(X1,Y n )-d nM , (X1+TV, Y1)-d 1(M-1) , (X1+TV, Y2)-d 2(M-1),...,(X1+TV,Y n )-d n(M-1) ,..., ((M-1)TV+X1, Y1)-d 11 ,((M-1)TV+X1,Y2)-d 21 ,...,((M-1)TV+X1,Y n )-d n1};

[0136] S3. Generate an actual three-dimensional model of the gypsum board to be inspected according to the first surface point coordinate parameter set and thickness distribution parameter set;

[0137] S31, generating a second surface point coordinate parameter set of the gypsum board to be inspected according to the first surface point coordinate parameter set and the thickness distribution parameter set;

[0138] S311, obtaining a first surface point coordinate parameter set and a thickness distribution parameter set;

[0139] First, call the first surface point coordinate parameter set {(X1, Y1, Z1+h 1M ), (X1, Y2, Z1+h 2M ),...,(X1,Y n , Z1+h nM ), (X1+TV,Y1,Z1+h 1(M-1) ), (X1+TV,Y2,Z1+h 2(M-1) )..., (X1+TV, Y n , Z1+h n(M-1) ),..., ((M-1)TV+X1, Y1, Z1+h 11 ), ((M-1)TV+X1, Y2, Z1+h 21 ), ((M-1)TV+X1, Y n , Z1+h n1 )}

[0140] At the same time, the thickness distribution parameter set {(X1, Y1)-d 1M , (X1, Y2)-d 2M ,...,(X1,Y n )-d nM , (X1+TV, Y1)-d 1(M-1) , (X1+TV, Y2)-d 2(M-1) ,...,(X1+TV,Y n )-d n(M-1) ,..., ((M-1)TV+X1, Y1)-d 11 ,((M-1)TV+X1,Y2)-d21 ,...,((M-1)TV+X1,Y n )-d n1};

[0141] S312, establishing a one-to-one mapping between the first surface point coordinate parameter set and the thickness distribution parameter set based on the same X-axis coordinate and Y-axis coordinate;

[0142] Since the infrared distance sensor and the ultrasonic thickness sensor are arranged opposite to each other, they have the same X-axis coordinate and Y-axis coordinate, thereby establishing a one-to-one mapping relationship;

[0143] S313, extracting several groups of Z-axis coordinate calculation units according to the one-to-one mapping;

[0144] According to the one-to-one mapping relationship established in step S312, several groups of Z-axis coordinate calculation units can be extracted; (Z1+h 1M , d 1M ), (Z1+h 2M , d 2M ),...,(Z1+h nM , d nM );

[0145] S314, respectively calculating the Z-axis coordinates of each second surface according to each Z-axis coordinate calculation unit; wherein the calculation formula of the Z-axis coordinate of the second surface is Z' nm =Z1+h nm +d nm ;

[0146] Based on the structural relationship, when the infrared distance sensor detects the coordinates of a point, the difference between the Z-axis coordinate of the projection point of the same point on the other surface and the Z-axis coordinate on the surface is the thickness of the gypsum board at that point. Therefore, the calculation formula for the Z-axis coordinate of the second surface is Z' nm =Z1+h nm +d nm ;

[0147] It should be noted that the calculation of the Z-axis coordinate of the second surface above requires attention to the direction of the coordinate axis;

[0148] S315: Generate a second surface point coordinate parameter set based on the Z-axis coordinates of each of the second surfaces.

[0149] Combined with the calculation results in step S314, the X-axis coordinate and the Y-axis coordinate can be integrated to obtain the second surface point coordinate parameter set, which is expressed as {(X1, Y1, Z1+h 1M +d 1M ), (X1, Y2, Z1+h 2M +d 2M),...,(X1,Y n , Z1+h nM +d nM ), (X1+TV,Y1,Z1+h 1(M-1) -d 1(M-1) ), (X1+TV,Y2,Z1+h 2(M-1) +d 2(M-1) )..., (X1+TV, Y n , Z1+h n(M-1) +d n(M-1) ),..., ((M-1)TV+X1, Y1, Z1+h 11 +d 11 ), ((M-1)TV+X1, Y2, Z1+h 21 +d 21 ), ((M-1)TV+X1, Y n , Z1+h n1 +d n1 )}.

[0150] S32. Generate a plurality of tangent curves according to the first surface point coordinate parameter set and the second surface point coordinate parameter set;

[0151] Acquire the second surface point coordinate parameter set obtained in step S315, and simultaneously call the first surface point coordinate parameter set obtained in step S16;

[0152] Reference Figure 6 , according to the first surface point coordinate parameter set, a point is taken in the initial coordinate system, and then the points with the same X-axis coordinate are smoothly connected by a curve; for example, the coordinates are (X1, Y1, Z1+h 1M ), (X1, Y2, Z1+h 2M ),...,(X1,Y n , Z1+h nM ) points are smoothly connected;

[0153] Repeat the above operation to obtain M curves;

[0154] Similarly, according to the second surface point coordinate parameter set, points are taken in the initial coordinate system, and then the points with the same X-axis coordinates are smoothly connected by a curve; for example, the coordinates are (X1, Y1, Z1+h 1M +d 1M ), (X1, Y2, Z1+h 2M +d 2M ),...,(X1,Y n , Z1+h nM +d nM ) points are smoothly connected;

[0155] Repeat the above operation to obtain M curves;

[0156] The above curves are the cross-sectional curves of the gypsum board to be tested;

[0157] S33: Use a smooth surface to connect the section curves in sequence to generate an actual three-dimensional model of the gypsum board to be tested.

[0158] Reference Figure 7 In the above curves, each section curve obtained by the first surface point coordinate parameter set is located on the top surface, and each section curve obtained by the second surface point coordinate parameter set is located on the bottom surface. By connecting the section curves of the top surface in sequence through a smooth surface, a surface diagram of the top surface of the gypsum board to be inspected can be obtained;

[0159] Similarly, the bottom surface graph can be obtained by smoothly connecting the cross-sectional curve graphs on the lower side through another smooth surface;

[0160] The actual three-dimensional model of the gypsum board to be inspected can be generated by combining the top surface image and the bottom surface image.

[0161] S4. Retrieving a standard model according to the specification parameters of the gypsum board to be tested;

[0162] First, the specification parameters of the gypsum board to be tested, such as length, width, and height, are obtained, and then a model with the above parameters is called as a standard model according to the above specification parameters.

[0163] S5. Comparing the actual three-dimensional model with the standard model to determine whether the flatness of the gypsum board to be tested is qualified;

[0164] S51, setting the upper deviation and lower deviation of flatness as needed;

[0165] Set the upper and lower deviations of the gypsum board flatness according to technical standards. For example, if the upper deviation is 0.1mm, the lower deviation is also 0.1mm.

[0166] S52, generating an upper deviation standard model according to the upper deviation and the standard model;

[0167] The standard model obtained in step S4 is called, and the upper deviation is called at the same time, and then the top surface of the standard model is shifted upward and the bottom surface is shifted downward according to the upper deviation value, and the shift amount is the upper deviation value;

[0168] The model after migration is the upper deviation standard model;

[0169] S53, generating a lower deviation standard model according to the lower deviation and the standard model;

[0170] Similarly, the top surface of the standard model is offset downward, and the bottom surface is offset upward. The offset amount is the lower deviation value. The model after offset is the lower deviation standard model.

[0171] S54, integrating the actual three-dimensional model, the upper deviation standard model, and the lower deviation standard model;

[0172] The actual three-dimensional model, the upper deviation standard model and the lower deviation standard model are called, and then a center plane in a height direction is automatically generated for each model by a computer;

[0173] The integration of the models can be completed by overlapping the center planes of each model;

[0174] S55: If the actual three-dimensional model is completely between the upper deviation standard model and the lower deviation standard model, the gypsum board to be tested is determined to be qualified; otherwise, it is determined to be unqualified.

[0175] After the integration is completed, it can be clearly seen whether the actual three-dimensional model is completely located between the upper deviation standard model and the lower deviation standard model. If so, the flatness of the top and bottom surfaces of the gypsum board to be tested are qualified, otherwise it is unqualified;

[0176] Compared with the existing technology, the present application realizes the automatic detection of the flatness of the gypsum board surface, which can improve the accuracy of the detection and effectively improve the efficiency of the flatness detection;

[0177] Secondly, the present application can simultaneously determine the flatness of the top and bottom surfaces of the gypsum board to be inspected through dual detection of coordinates and thickness, that is, the flatness detection of all planes is completed in one detection process. Compared with the surface-by-surface detection, the present application not only simplifies the process, but also shortens the detection time by half, effectively improving the detection efficiency of the gypsum board surface flatness.

[0178] Finally, the above comparison clearly shows the flatness change trend of the actual 3D model, that is, it can quickly identify which areas of the gypsum board have flatness close to the allowable error limit and which areas have better flatness, thereby providing data support for the improvement and adjustment of front-end equipment.

[0179] The above are only preferred embodiments of the present application and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A method for detecting defects in gypsum boards, characterized in that: The following steps are involved: Set the sampling period T and the conveying speed V of the gypsum board to be tested; Construct the initial coordinate system and obtain the initial coordinate set of each measurement point {(X1, Y1, Z1), (X1, Y2, Z1), ..., (X1, Y n , Z1)}; where n represents the number of each measurement point; Get the distance parameter h of each detection point 11 , h 12 ,...,h 1m ,...,h 1M , h 21 , h 22 ,...,h nm ..., h nM ; Where n represents the number of each measurement point, M represents the total number of sampling times, m represents the number of sampling times, and m≤M; Calculate the X-axis coordinate and Y-axis coordinate of each detection point according to the sampling period T, the conveying speed V and the initial coordinate set; Calculate the Z-axis coordinates of each detection point according to the initial coordinates and the distance parameters; Integrating the X-axis coordinate, the Y-axis coordinate, and the Z-axis coordinate to obtain a first surface point coordinate parameter set; Collecting a thickness distribution parameter set of the gypsum board to be tested; Obtaining a first surface point coordinate parameter set and a thickness distribution parameter set; Establishing a one-to-one mapping between the first surface point coordinate parameter set and the thickness distribution parameter set based on the same X-axis coordinate and Y-axis coordinate; Extracting a plurality of groups of Z-axis coordinate calculation units according to a one-to-one mapping; The Z-axis coordinates of each second surface are calculated respectively according to each Z-axis coordinate calculation unit; wherein the calculation formula of the Z-axis coordinate of the second surface is Z' nm =Z1+h nm +d nm ; where d nm Indicates the thickness parameter of the detection point determined at the mth sampling of the measurement point numbered n; h nm Indicates the distance parameter of the detection point position determined by the measurement point numbered n at the mth sampling; generating a second surface point coordinate parameter set according to each of the second surface Z-axis coordinates; generating a plurality of tangent curves according to the first surface point coordinate parameter set and the second surface point coordinate parameter set; Connecting the section curves in sequence using smooth surfaces to generate an actual three-dimensional model of the gypsum board to be inspected; Retrieve the standard model according to the specification parameters of the gypsum board to be tested; The actual three-dimensional model is compared with the standard model to determine whether the flatness of the gypsum board to be tested is qualified.

2. A gypsum board defect detection method according to claim 1, characterized in that: The expression of the X-axis coordinate is: nm =(m-1)TV+X1; the expression of the Y-axis coordinate is: Y nM =...=Y nm =...=Y n1 =Y n ; The expression of the Z-axis coordinate is ; Where n represents the number of each measurement point, M represents the total number of sampling times, m represents the number of sampling times, and m≤M.

3. A gypsum board defect detection method according to claim 1, characterized in that: The step of collecting the thickness distribution parameter set of the gypsum board to be tested comprises the following steps: Obtain the sampling period T and the conveying speed V of the gypsum board to be tested; Collect the thickness parameters d of each detection point 11 , d 12 ,...,d 1m ,...,d 1M , d 21 , d 22 ,...,d nm ..., d nM ; Where n represents the number of each measurement point, M represents the total number of sampling times, m represents the number of sampling times, and m≤M; A thickness distribution parameter set is generated according to the sampling period, the conveying speed and the thickness parameters.

4. A gypsum board defect detection method according to claim 1, characterized in that: The comparing of the actual three-dimensional model and the standard model to determine whether the flatness of the gypsum board to be tested is qualified comprises the following steps: Set the upper and lower deviations of flatness as needed; generating an upper deviation standard model according to the upper deviation and the standard model; generating a lower deviation standard model according to the lower deviation and the standard model; integrating the actual three-dimensional model, the upper deviation standard model, and the lower deviation standard model; If the actual three-dimensional model is completely located between the upper deviation standard model and the lower deviation standard model, the gypsum board to be tested is determined to be qualified; otherwise, it is determined to be unqualified.

5. A gypsum board defect detection system, characterized in that: include: Coordinate parameter acquisition module, used to set the sampling period T and the conveying speed V of the gypsum board to be tested; Construct the initial coordinate system and obtain the initial coordinate set of each measurement point {(X1, Y1, Z1), (X1, Y2, Z1), ..., (X1, Y n , Z1)}; where n represents the number of each measurement point; Get the distance parameter h of each detection point 11 , h 12 ,...,h 1m ,...,h 1M , h 21 , h 22 ,...,h nm ..., h nM ; Where n represents the number of each measurement point, M represents the total number of sampling times, m represents the number of sampling times, and m≤M; Calculate the X-axis coordinate and Y-axis coordinate of each detection point according to the sampling period T, the conveying speed V and the initial coordinate set; Calculate the Z-axis coordinates of each detection point according to the initial coordinates and the distance parameters; Integrating the X-axis coordinate, the Y-axis coordinate, and the Z-axis coordinate to obtain a first surface point coordinate parameter set; A thickness parameter acquisition module is used to acquire a thickness distribution parameter set of the gypsum board to be tested; A three-dimensional model generation module is used to obtain a first surface point coordinate parameter set and a thickness distribution parameter set; Establishing a one-to-one mapping between the first surface point coordinate parameter set and the thickness distribution parameter set based on the same X-axis coordinate and Y-axis coordinate; Extracting a plurality of groups of Z-axis coordinate calculation units according to a one-to-one mapping; The Z-axis coordinates of each second surface are calculated respectively according to each Z-axis coordinate calculation unit; wherein the calculation formula of the Z-axis coordinate of the second surface is Z' nm =Z1+h nm +d nm ; where d nm Indicates the thickness parameter of the detection point determined at the mth sampling of the measurement point numbered n; h nm Indicates the distance parameter of the detection point position determined by the measurement point numbered n at the mth sampling; generating a second surface point coordinate parameter set according to each of the second surface Z-axis coordinates; generating a plurality of tangent curves according to the first surface point coordinate parameter set and the second surface point coordinate parameter set; Connecting the section curves in sequence using smooth surfaces to generate an actual three-dimensional model of the gypsum board to be inspected; The model calling module is used to call the standard model according to the specification parameters of the gypsum board to be tested; The comparison and judgment module is used to compare the actual three-dimensional model with the standard model to determine whether the flatness of the gypsum board to be tested is qualified.

6. An electronic device, characterized in that: The electronic device includes a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement a gypsum board defect detection method according to any one of claims 1 to 4.

7. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, and the processor executes the computer program to implement the gypsum board defect detection method according to any one of claims 1 to 4.

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