Highly-integrated automatic production equipment and method
By designing highly integrated automated production equipment and integrating multiple processes in chip production, the problems of poor reusability and low production efficiency of existing equipment are solved, and efficient automation of chip production is achieved.
Patent Information
- Application Number
- CN202510132909.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-06
- Publication Date
- 2025-04-25
AI Technical Summary
The existing chip automatic production equipment needs to be equipped with loading and unloading mechanisms in each process, resulting in poor equipment reusability, large space occupied and reduced production efficiency.
Design a highly integrated automated production equipment to integrate various processes in chip production, including loading module, tin dot module, transfer module, dispensing module, cap buckle module and unloading module, and realize the loading, tin dot, dispensing, cap buckle and unloading of the chip through an automated process.
Through highly integrated automated production equipment, automated operations in the chip production process are realized, production efficiency is improved, and equipment complexity and space occupied are reduced.
Smart Images
Figure CN119890096A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of automatic chip production equipment, and in particular to highly integrated automatic production equipment and method. Background Art
[0002] In the chip production process, the chip needs to be spot welded, glued, and covered. In the prior art, these operations require human intervention. For example, when covering, the chip is covered manually to ensure that the chip cover can be accurately buckled on the chip body. At the same time, between different production processes of the chip, the processing mechanisms involved in the process are different. Usually, a loading mechanism and a unloading mechanism need to be set separately in each process. The chips are sorted by the unloading mechanism and transported to the transfer device, and then the chips are transported by the transfer device, so as to realize the circulation of chips in different production processes. However, in the prior art, each process is equipped with a loading mechanism and an unloading mechanism, and the reusability of the production equipment is poor. At the same time, it will take up a large production space, which is undoubtedly a waste of production equipment and sites. At the same time, each process needs to load and unload materials, and the sorting and transportation of chips need to take up production time, which reduces the efficiency of chip automation production. Therefore, there is an urgent need for a chip automation production equipment that can integrate multiple processes and improve production efficiency. Summary of the invention
[0003] One of the purposes of the present invention is to provide a highly integrated automated production equipment that can integrate multiple processes in chip production and improve production efficiency.
[0004] The first basic solution provided by the present invention is a highly integrated automated production equipment, comprising a loading module, a tinning module, a transfer module, a glue dispensing module, a capping module, a unloading module and a material tray which are sequentially arranged along the moving direction of the chip body. The loading module is used to sort the chip bodies and move the sorted chip bodies to the tinning module one by one; the tinning module is used to tin each chip body; the transfer module is used to move the chip bodies after tinning to the gluing module one by one; the gluing module is used to glue the chip bodies after tinning and move the chip bodies after gluing to the bottom of the capping module; the capping module is used to cap the glued chip bodies; the unloading module is used to unload the chip bodies after capping one by one and place the chip bodies after capping on the material tray.
[0005] Furthermore, it also includes an upper cover feeding module, which is used to feed the chip upper cover and a buckle cover module to move the chip upper cover to the chip body after glue dispensing for buckle cover.
[0006] Furthermore, the tinning module includes a tinning channel for the chip body to move, a tinning device for tinning the chip body, and a material shifting plate for changing the position of the chip body on the tinning channel; The material stripping plate is located at one side of the tinning channel. A plurality of material stripping teeth are arranged on the side of the material stripping plate facing the tinning channel. The plurality of material stripping teeth are evenly distributed along the length direction of the tinning channel. The material stripping plate can reciprocate along the length direction of the tinning channel and can reciprocate in the direction toward the tinning channel.
[0007] Furthermore, there are two soldering tools and three pick teeth. The pick teeth at the head end can be pressed against the chip body moved from the loading module to the soldering module, and the pick teeth at the middle and the end can be pressed against the chip body under the two soldering tools respectively and pass through the bottom of the two soldering tools respectively.
[0008] Furthermore, the transfer module includes a transfer clamp and a belt transmission mechanism. The transfer clamp is connected to the belt transmission mechanism. The transfer clamp is used to clamp the chip body at the end of the tinning channel and release the chip body when moving to the top of the glue dispensing module. The belt transmission mechanism is used to move the transfer clamp to the top of the glue dispensing module. The moving direction of the transfer clamp is perpendicular to the length direction of the tinning channel.
[0009] Further, the glue dispensing module includes a moving plate capable of reciprocating linear motion, a glue dispensing clamp located above the moving plate, and a glue dispenser located above the moving plate, and the moving direction of the moving plate is parallel to the length direction of the spot welding channel; Multiple fixed fixtures are installed on the mobile plate, and the fixed fixtures can be detachably connected to the chip body. The glue dispensing clamp is used to clamp the chip body on the fixed fixture, and after the mobile plate moves linearly, the chip body is placed in the next fixed fixture. The glue dispensing device is used to dispense glue on the chip body on the fixed fixture.
[0010] Furthermore, the cover snapping module includes a cover snapping clamp that can move back and forth, and the movement direction of the cover snapping clamp is perpendicular to the movement direction of the movable plate. The cover snapping clamp is used to clamp the chip cover and move to above the fixed tooling of the movable plate; it is also used to control the descent of the chip cover and snap it onto the chip body.
[0011] Furthermore, the unloading module includes a unloading clamp capable of reciprocating motion, and the unloading clamp is used to clamp the chip body after the cover is buckled on the fixed tooling located at the end of the movable plate, and move the chip body after the cover is buckled to the material tray.
[0012] The exercise process and beneficial effects of basic plan 1: When in use, the chip body is transferred to the loading module through the transfer device. The transfer device can be a material tube or a material tray, which can transfer a large number of chip bodies at one time. The loading module takes out the chip body from the transfer device, sorts the chip body, and controls the chip body to move one by one to the tinning module. By sorting and moving one by one, the chip body is separated to avoid the chip body being too close to interfere with the tinning operation of the subsequent tinning module.
[0013] The chip body is located at the head end of the tinning channel. Under the action of the material shifting plate, the chip body moves along the length direction of the tinning channel to the bottom of the tinning tool. At this time, the tinning tool tins the chip body. Then, under the action of the material shifting plate, the chip body after tinning moves to the end of the tinning channel. The setting of the tinning channel limits the moving direction of the chip body. Combined with the movement of the material shifting plate, the position of the chip body on the tinning channel is changed, thereby realizing the movement and tinning of the chip body.
[0014] The transfer clamp clamps the chip body at the end of the tinning channel, and under the drive of the belt transmission mechanism, drives the chip body to move above the head end of the moving plate, then the transfer clamp descends to place the chip body in the fixed tooling at the head end of the moving plate, and resets the chip body after releasing it. The setting of the transfer clamp realizes the clamping of the chip body, and under the action of the belt transmission mechanism, the position of the chip body is changed. At the same time, the transfer clamp has a certain force, so that the chip body can be clamped by the fixed tooling.
[0015] Under the movement of the moving plate, the chip body moves to the bottom of the glue dispenser and the glue dispensing clamp, and the chip body is glued by the glue dispenser. At the same time, the position of the chip body is changed by the glue dispensing clamp, and the chip body after glue dispensing is moved to the bottom of the buckle cover clamp. Prior to this, the upper cover feeding module has moved the chip upper cover to the specified position, and the buckle cover clamp clamps the chip upper cover and moves to the top of the moving plate. Therefore, when the chip after glue dispensing moves to the bottom of the buckle cover clamp, the buckle cover clamp buckles the chip body after glue dispensing. The buckle cover clamp has a certain force when buckling the cover, so that the chip upper cover is buckled on the chip body, and the glue dispensing of the glue dispenser further increases the stability of the connection between the chip upper cover and the chip body.
[0016] The chip body after the cap is buckled is located at the fixed tooling at the end of the movable plate. When the chip body is located below the unloading clamp, the unloading clamp descends to clamp the chip body after the cap is buckled, and moves to the top of the material tray. Then the unloading clamp descends to release the chip body after the cap is buckled, completing the automatic loading, tinning, gluing, capping and unloading of the chip body.
[0017] In summary, this solution highly integrates the automatic loading, tinning, gluing, capping and unloading processes in the chip production process, and effectively improves production efficiency through automated production.
[0018] A second object of the present invention is to provide a highly integrated automated production method.
[0019] The present invention provides basic solution 2: a highly integrated automated production method using the highly integrated automated production equipment mentioned above.
[0020] Further, the following are included: In the loading step, the chip bodies are sorted and the sorted chip bodies are moved one by one to the soldering module; Tinning step, tinning each chip body; The transfer step is to move the chip bodies after soldering to the glue dispensing module one by one; the moving direction of the chip bodies in the transfer step is perpendicular to the moving direction of the chip bodies in the soldering step; The glue dispensing step is to dispense glue to the chip body after tinning, and move the chip body after glue dispensing to the bottom of the buckle cover module; the moving direction of the chip body in the glue dispensing step is parallel to the moving direction of the chip body in the tinning step; A capping step is to cap the glued chip body; In the step of unloading, the chip bodies after the covers are unloaded one by one, and the chip bodies after the covers are placed on the material tray in sequence.
[0021] Beneficial effects of basic solution 2: By adopting this solution, the automatic loading, tinning, gluing, capping and unloading processes in the chip production process are highly integrated, and the production efficiency is effectively improved through automated production. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 It is a structural schematic diagram of an embodiment of a highly integrated automated production equipment of the present invention; Figure 2 It is a structural schematic diagram of another perspective of an embodiment of a highly integrated automated production equipment of the present invention; Figure 3 It is a structural schematic diagram of a feeding module of an embodiment of a highly integrated automated production equipment of the present invention; Figure 4 This is a structural schematic diagram of a tinning module of an embodiment of a highly integrated automated production equipment of the present invention; Figure 5 It is a structural schematic diagram of a transfer module of an embodiment of a highly integrated automated production equipment of the present invention; Figure 6 It is a structural schematic diagram of a dispensing module of a highly integrated automated production equipment embodiment of the present invention; Figure 7 It is a structural schematic diagram of a capping module of an embodiment of a highly integrated automated production equipment of the present invention; Figure 8 It is a structural schematic diagram of a material unloading module of an embodiment of a highly integrated automated production equipment of the present invention. DETAILED DESCRIPTION
[0023] The following is further described in detail through specific implementation methods: The figure marks in the drawings of the specification include: loading module 1, loading tray 101, loading drive 102, drive rod 103, loading channel 104, loading tray guide rail 105, loading clamp 106, longitudinal slide rail 107, tinning module 2, tinning channel 201, tinning device 202, material shifting plate 203, material shifting mounting seat 204, transverse drive mechanism 205, longitudinal drive mechanism 206, transfer module 3, transfer clamp 301, belt transmission mechanism 302, transfer mounting block 303, glue dispensing module 4, moving plate 401, third glue dispensing clamp 402, glue dispensing device 403, moving mounting seat 404, fourth fixed tooling 405, upper cover feeding module 5, cover buckle module 6, cover buckle clamp 601, unloading module 7, unloading clamp 701, linear guide mechanism 702, material tray 8.
[0024] Example A highly integrated automated production equipment, such as Figure 1 , 2 As shown, it includes a loading module 1, a tinning module 2, a transfer module 3, a glue module 4, a capping module 6, a unloading module 7 and a material tray 8 which are arranged in sequence along the moving direction of the chip body. The loading module 1 is used to sort the chip bodies and move the sorted chip bodies one by one to the tinning module 2; the tinning module 2 is used to tin each chip body; the transfer module 3 is used to move the chip bodies after tinning to the glue module 4 one by one; the glue module 4 is used to glue the chip bodies after tinning, and move the chip bodies after glueing to the bottom of the capping module 6; the capping module 6 is used to cap the chip bodies after glueing; the unloading module 7 is used to unload the chip bodies after capping one by one, and place the chip bodies after capping on the material tray 8.
[0025] It also includes an upper cover feeding module 5, which is used to feed the chip upper cover, and a buckle cover module 6 that moves the chip upper cover to the chip body after glue dispensing for buckle cover.
[0026] Specific: As attached Figure 3As shown, the loading module 1 includes a loading tray 101 and a loading drive 102, and the loading tray 101 and the loading drive 102 are used for automatic loading of the chip body, and the chip body at this time lacks a chip cover. The loading tray 101 is used to place the chip body to be loaded, and multiple chip bodies are placed side by side, and multiple rows of chip bodies are placed on the loading tray 101. The loading drive 102 can be against the chip body and push the chip body to move on the loading tray 101. Specifically: the loading drive 102 adopts a linear slide rail, and a slider is slidably connected to the linear slide rail. The slider is located above the loading tray 101, and a driving rod 103 facing the loading tray 101 is provided on the slider. The driving rod 103 moves under the drive of the linear slide rail and contacts the chip body on the loading tray 101 to push the chip body to move.
[0027] The loading module 1 also includes a loading channel 104 and a loading tray guide rail 105. The loading tray 101 is provided with a plurality of strip grooves for placing and moving the chip body. One side of the strip groove is connected to the side wall of the loading tray 101. The loading channel 104 is directly opposite to a strip groove of the loading tray 101, and the loading channel 104 and the strip groove are connected. A stopper is provided at one end of the loading channel 104 away from the loading tray 101. The chip body of the loading tray 101 enters the loading channel 104 under the push of the driving rod 103, and moves toward the stopper in turn until it is blocked by the stopper. At this time, the chip body is arranged on the loading channel 104. The position where the chip body contacts the stopper is the loading position. The loading tray guide rail 105 is located below the loading tray 101 and is slidably connected to the loading tray 101. When all the chip bodies on a strip groove enter the loading channel 104, the loading tray 101 moves so that the next strip groove faces the loading channel 104, and the chip bodies are automatically loaded again. The setting of the loading channel 104 turns the batch of chip bodies into a single independent one, making it easy to clamp and move the chip bodies.
[0028] The feeding module 1 also includes a feeding clamp 106, which includes a feeding motor, a transverse slide rail, a longitudinal slide rail 107, and a pneumatic finger. The output shaft of the feeding motor is key-connected with a connecting rod, the axial direction of the connecting rod is perpendicular to the axial direction of the output shaft, and the end of the connecting rod away from the output shaft is hinged to the top of the longitudinal slide rail 107. The longitudinal slide rail 107 is vertically arranged, and the bottom of the longitudinal slide rail 107 is fixedly connected to the pneumatic finger. A slider is slidably connected to the transverse slide rail, and the side of the slider away from the transverse slide rail is slidably connected to the longitudinal slide rail 107, and the length direction of the transverse slide rail is perpendicular to the length direction of the transverse slide rail. During the reciprocating motion of the feeding motor, the pneumatic finger is driven to reciprocate at two positions (that is, the pneumatic finger reciprocates at the end of the feeding channel 104 and on the tinning module 2), and the motion trajectory of the pneumatic finger is an arc. The clamping and release of the chip body can be achieved by controlling the pneumatic finger.
[0029] As attached Figure 4 As shown, the tinning module 2 includes a tinning channel 201 for the chip body to move, a tinning device 202 for tinning the chip body, and a material shifting plate 203 for changing the position of the chip body on the tinning channel 201. The material shifting plate 203 is located at one side of the tinning channel 201, and a plurality of material shifting teeth are arranged on the side of the material shifting plate 203 facing the tinning channel 201, and the plurality of material shifting teeth are evenly distributed along the length direction of the tinning channel 201, and the material shifting plate 203 can reciprocate along the length direction of the tinning channel 201, and can reciprocate in the direction toward the tinning channel 201.
[0030] There are two soldering tools 202 and three material-pickup teeth. The material-pickup teeth at the front end can be moved with the loading module 1 to the chip body on the soldering module 2, and the material-pickup teeth at the middle and the end can respectively be pressed against the chip body under the two soldering tools and pass through the bottom of the two soldering tools 202 respectively.
[0031] The bottom of the material-diverting plate 203 is provided with a material-diverting mounting seat 204, a transverse driving mechanism 205, and a longitudinal driving mechanism 206. The transverse driving mechanism 205 is parallel to the length direction of the tinning channel 201. The material-diverting mounting seat 204 is slidably connected to the transverse driving mechanism 205 and can move along the transverse driving mechanism 205. The longitudinal driving mechanism 206 is perpendicular to the length direction of the tinning channel 201. The longitudinal driving mechanism 206 is installed on the material-diverting mounting seat 204. The material-diverting plate 203 is slidably connected to the longitudinal driving mechanism 206 and can move along the longitudinal driving mechanism 206.
[0032] Specifically, the transverse driving mechanism 205 includes a transverse guide rail, the length direction of the transverse guide rail is parallel to the length direction of the tinning channel 201, the material-digging mounting seat 204 is slidably connected to the transverse guide rail, the material-digging mounting seat 204 is transmission-connected with a belt transmission structure, and the material-digging mounting seat 204 is fixed on the conveyor belt of the belt transmission structure. The longitudinal driving mechanism 206 includes a longitudinal guide rail and a material-digging cylinder, the length direction of the longitudinal guide rail is perpendicular to the length direction of the tinning channel 201, the material-digging cylinder is installed on the top of the material-digging mounting seat 204, the material-digging cylinder is connected to the material-digging plate 203, the longitudinal guide rail is fixed on the top of the material-digging mounting seat 204, and the material-digging plate 203 is slidably connected to the longitudinal guide rail. There are two longitudinal guide rails, the two longitudinal guide rails are arranged in parallel, and the material-digging plate 203 is integrally formed with the material-digging tooth.
[0033] When in use, the movement of the material shifting plate 203 is controlled by the transverse driving mechanism 205 and the longitudinal driving mechanism 206. The material shifting plate 203 can move along the length direction of the spot welding channel, and can also move in a direction perpendicular to the length direction of the spot welding channel, so as to shift the chip body located at the head end of the spot welding channel to the bottom of the spot welder. At this time, the spot welder descends to spot weld the chip body, and rises and resets after spot welding, waiting for spot welding of the next chip body. At the same time, under the continuous shifting of the material shifting plate 203, the chip body can move to the end of the spot welding channel.
[0034] As attached Figure 5 As shown, the transfer module 3 includes a transfer clamp 301 and a belt transmission mechanism 302. The transfer clamp 301 is connected to the belt transmission mechanism 302 in a transmission manner. The transfer clamp 301 is used to clamp the chip body at the end of the tinning channel 201 and release the chip body when moving to the top of the glue dispensing module 4. The belt transmission mechanism 302 is used to move the transfer clamp 301 to the top of the glue dispensing module 4. The moving direction of the transfer clamp 301 is perpendicular to the length direction of the tinning channel 201. In this embodiment, the structures of the two belt transmission mechanisms 302 are the same. The conveyor belt of the belt transmission mechanism 302 is fixedly connected with a transfer mounting block 303. The transfer mounting block 303 moves with the conveyor belt. The transfer clamp 301 is installed on one side of the transfer mounting block 303. The transfer clamp 301 includes a lifting cylinder and a pneumatic finger connected to the piston rod of the lifting cylinder. The lifting cylinder is used to control the descent and ascent of the pneumatic finger.
[0035] As attached Figure 6 As shown, the glue dispensing module 4 includes a moving plate 401 capable of reciprocating linear motion, a glue dispensing clamp located above the moving plate 401, and a glue dispensing device 403 located above the moving plate 401, and the moving direction of the moving plate 401 is parallel to the length direction of the spot welding channel. A plurality of fixed fixtures are installed on the moving plate 401, and the fixed fixtures can be detachably connected to the chip body. The glue dispensing clamp is used to clamp the chip body on the fixed fixture, and after the moving plate 401 moves linearly, the chip body is placed in the next fixed fixture, and the glue dispensing device 403 is used to dispense glue to the chip body on the fixed fixture. The bottom of the moving plate 401 is fixedly connected with a mobile mounting seat 404, and the bottom of the mobile mounting seat 404 is slidably connected with a mobile guide rail, and the mobile mounting seat 404 is transmission-connected with the lead screw pair, that is, the mobile mounting seat 404 is fixedly connected with the nut of the lead screw pair, and the screw of the lead screw pair is connected with a motor through a coupling. Driven by the motor, the screw rotates, and the nut drives the movable mounting seat 404 to move along the screw, thereby driving the movable plate 401 to reciprocate. The length direction of the movable guide rail, the moving direction of the movable plate 401, and the axial direction of the screw are parallel to each other.
[0036] The upper cover feeding module 5 includes a rotating loading plate and a feeding channel. The rotating loading plate is used to sort the chip upper covers and convey the chip upper covers to the feeding channel. The rotating loading plate is used for automatic loading of the chip upper covers. Specifically: the rotating loading plate adopts an existing component vibration plate, and the discharge port of the component vibration plate is connected to the feeding channel. The length direction of the feeding channel is parallel to the movement direction of the moving plate 401.
[0037] As attached Figure 7 As shown, the cover-locking module 6 includes a cover-locking clamp 601 capable of reciprocating movement, the movement direction of the cover-locking clamp 601 is perpendicular to the movement direction of the moving plate 401, and the cover-locking clamp 601 is used to clamp the chip cover and move to the top of the fixed tooling of the moving plate 401; it is also used to control the chip cover to descend and snap on the chip body. The cover-locking module 6 also includes a belt transmission mechanism 302 for controlling the reciprocating movement of the cover-locking clamp 601. The three belt transmission mechanisms 302 have the same structure. The cover-locking clamp 601 is fixedly connected to the conveyor belt of the belt transmission mechanism 302. Under the action of the transmission belt, the cover-locking clamp 601 reciprocates at the end of the feeding channel and above the moving plate 401.
[0038] In this embodiment, the number of glue dispensing clamps is three, and the number of glue dispensing devices 403 is two. For the convenience of distinction, they are respectively defined as the first glue dispensing clamp, the second glue dispensing clamp, the third glue dispensing clamp 402, the first glue dispensing device 403, and the second glue dispensing device 403. The number of fixed fixtures is four, and the four fixed fixtures are evenly distributed along the movement direction of the movable plate 401. For the convenience of distinction, from the head end to the end of the movable plate 401, they are respectively defined as the first fixed fixture, the second fixed fixture, the third fixed fixture and the fourth fixed fixture 405. The glue dispensing clamp and the cover clamp 601 both include a lifting cylinder and a pneumatic finger connected to the piston rod of the lifting cylinder. The lifting cylinder is used to control the descent and ascent of the pneumatic finger, and the pneumatic finger is used to clamp the chip body. The glue dispensing device 403 can also be lifted and lowered, and its structure is prior art and will not be repeated. Above the movable plate 401, from the head end to the end of the movable plate 401, the first glue dispenser 403, the first glue dispenser clamp, the second glue dispenser 403, the second glue dispenser clamp, the cover clamp 601 and the third glue dispenser clamp 402 are arranged in sequence.
[0039] When in use, the chip body is placed on the first fixed tooling, and driven by the movable plate 401, the chip body is located under the first glue dispenser 403, and further driven by the movable plate 401, the chip body is located under the first glue dispenser clamp, and the first glue dispenser clamps the chip body.
[0040] Then the movable plate 401 moves in the opposite direction, and the second fixed tool is located under the first glue dispensing clamp. The first glue dispensing clamp places the chip body on the second fixed tool. Driven by the movable plate 401, the chip body is located under the second glue dispensing clamp 403. Further driven by the movable plate 401, the chip body is located under the second glue dispensing clamp, and the second glue dispensing clamp clamps the chip body.
[0041] Then the movable plate 401 moves in the opposite direction, and the third fixed tooling is located below the second glue dispensing clamp, and the second glue dispensing clamp places the chip body on the third fixed tooling. Driven by the movable plate 401, the chip body faces the cover clamp 601, and the cover clamp 601 covers the chip body. Further, driven by the movable plate 401, the chip body is located below the third glue dispensing clamp 402, and the third glue dispensing clamp 402 clamps the chip body.
[0042] Then the movable plate 401 moves in the opposite direction, and the fourth fixing fixture 405 is located below the third glue dispensing clamp 402 . The third glue dispensing clamp 402 places the chip body on the fourth fixing fixture 405 , which is located at the end of the movable plate 401 .
[0043] As attached Figure 8 As shown, the material unloading module 7 includes a material unloading clamp 701 capable of reciprocating motion, and the material unloading clamp 701 is used to clamp the chip body after the cover is buckled on the fixed tooling at the end of the moving plate 401, and move the chip body after the cover is buckled to the material tray 8. The movement direction of the material unloading clamp 701 is parallel to the movement direction of the moving plate 401. The material unloading module 7 also includes a linear guide mechanism 702 for controlling the reciprocating motion of the material unloading clamp 701. The material unloading clamp 701 reciprocates along the linear guide mechanism 702 at the end of the moving plate 401 and above the material tray 8. The material unloading clamp 701 includes a lifting cylinder, and a pneumatic finger connected to the piston rod of the lifting cylinder. The lifting cylinder is used to control the descent and ascent of the pneumatic finger, and the pneumatic finger is used to clamp the chip body.
[0044] A highly integrated automated production method, using the highly integrated automated production equipment described above, includes the following: The loading step is to sort the chip bodies and move the sorted chip bodies one by one to the tinning module 2; Tinning step, tinning each chip body; The transfer step is to move the chip bodies after soldering to the glue dispensing module 4 one by one; the moving direction of the chip bodies in the transfer step is perpendicular to the moving direction of the chip bodies in the soldering step; Glue dispensing step, dispensing glue on the chip body after tinning, and moving the chip body after glue dispensing to below the buckle cover module 6; the moving direction of the chip body in the glue dispensing step is parallel to the moving direction of the chip body in the tinning step; A capping step is to cap the glued chip body; In the step of unloading, the chip bodies with the covers are unloaded one by one, and the chip bodies with the covers are placed on the material tray 8 in sequence.
[0045] The specific implementation process is as follows: When in use, the chip body is transferred to the loading module 1 through the transfer device. The transfer device can be a material tube or a material tray 8, which can transfer a large number of chip bodies at one time. The loading module 1 takes out the chip body from the transfer device, sorts the chip body, and controls the chip body to move one by one to the tinning module 2. By sorting and moving one by one, the chip body is separated to avoid the chip body being too close to interfere with the subsequent tinning operation of the tinning module 2.
[0046] The chip body is located at the head end of the tinning channel 201. Under the action of the material-dispensing plate 203, the chip body moves along the length direction of the tinning channel 201 to the bottom of the tinning tool 202. At this time, the tinning tool 202 tins the chip body. Then, under the action of the material-dispensing plate 203, the chip body after tinning moves to the end of the tinning channel 201. The setting of the tinning channel 201 limits the moving direction of the chip body. Combined with the movement of the material-dispensing plate 203, the position of the chip body on the tinning channel 201 is changed, thereby realizing the movement and tinning of the chip body.
[0047] The transport clamp 301 clamps the chip body at the end of the tinning channel 201, and under the drive of the belt transmission mechanism 302, drives the chip body to move above the head end of the moving plate 401, and then the transport clamp 301 descends to place the chip body in the fixed tooling at the head end of the moving plate 401, and resets after releasing the chip body. The setting of the transport clamp 301 realizes the clamping of the chip body, and under the action of the belt transmission mechanism 302, the position of the chip body is changed. At the same time, the transport clamp 301 has a certain force, so that the chip body can be clamped by the fixed tooling.
[0048] Under the movement of the moving plate 401, the chip body moves to the bottom of the glue dispenser 403 and the glue dispenser clamp, and the chip body is glued by the glue dispenser 403. At the same time, the position of the chip body is changed by the glue dispenser clamp, and the chip body after glue dispensing is moved to the bottom of the cover clamp 601. Prior to this, the upper cover feeding module 5 has moved the chip upper cover to the specified position, and the cover clamp 601 clamps the chip upper cover and moves to the top of the moving plate 401. Therefore, when the chip body after glue dispensing moves to the bottom of the cover clamp 601, the cover clamp 601 covers the chip body after glue dispensing. The cover clamp 601 has a certain force when covering, so that the chip upper cover is buckled on the chip body, and the stability of the connection between the chip upper cover and the chip body is further increased by the glue dispensing of the glue dispenser 403.
[0049] The chip body after the cover is buckled is located at the fixed tooling at the end of the movable plate 401. When the chip body is located below the blanking clamp 701, the blanking clamp 701 descends to clamp the chip body after the cover is buckled, and moves to above the material tray 8. Then the blanking clamp 701 descends to release the chip body after the cover is buckled, completing the automatic loading, tinning, gluing, covering and unloading of the chip body.
[0050] In summary, this solution highly integrates the automatic loading, tinning, gluing, capping and unloading processes in the chip body production process, and effectively improves production efficiency through automated production.
[0051] The above is only an embodiment of the present invention. The common sense such as the known specific structure and characteristics in the scheme is not described in detail here. The ordinary technicians in the relevant field know all the common technical knowledge in the technical field of the invention before the application date or priority date, can obtain all the existing technologies in the field, and have the ability to apply the conventional experimental means before that date. The ordinary technicians in the relevant field can improve and implement this scheme in combination with their own abilities under the enlightenment given by this application. Some typical known structures or known methods should not become obstacles for ordinary technicians in the relevant field to implement this application. It should be pointed out that for those skilled in the art, without departing from the structure of the present invention, several deformations and improvements can be made, which should also be regarded as the protection scope of the present invention, which will not affect the effect of the implementation of the present invention and the practicality of the patent. The protection scope required by this application shall be based on the content of its claims, and the specific implementation methods and other records in the specification can be used to interpret the content of the claims.
Claims
1. A highly integrated automated production equipment, characterized in that: It includes a loading module, a tinning module, a transfer module, a glue dispensing module, a capping module, a unloading module and a material tray which are arranged in sequence along the moving direction of the chip body. The loading module is used to sort the chip bodies and move the sorted chip bodies to the tinning module one by one; the tinning module is used to tin each chip body; the transfer module is used to move the chip bodies after tinning to the gluing module one by one; the gluing module is used to glue the chip bodies after tinning and move the chip bodies after gluing to the bottom of the capping module; the capping module is used to cap the glued chip bodies; the unloading module is used to unload the chip bodies after capping one by one and place the chip bodies after capping on the material tray.
2. A highly integrated automated production equipment according to claim 1, characterized in that: It also includes an upper cover feeding module, which is used to feed the chip upper cover, and a buckle cover module which moves the chip upper cover to the chip body after glue dispensing for buckle cover.
3. A highly integrated automated production equipment according to claim 2, characterized in that: The tinning module includes a tinning channel for the chip body to move, a tinning device for tinning the chip body, and a material shifting plate for changing the position of the chip body on the tinning channel; The material stripping plate is located at one side of the tinning channel. A plurality of material stripping teeth are arranged on the side of the material stripping plate facing the tinning channel. The plurality of material stripping teeth are evenly distributed along the length direction of the tinning channel. The material stripping plate can reciprocate along the length direction of the tinning channel and can reciprocate in the direction toward the tinning channel.
4. A highly integrated automated production equipment according to claim 3, characterized in that: There are two soldering tools and three pick teeth. The pick teeth at the head end can be pressed against the chip body moved to the soldering module by the loading module. The pick teeth at the middle and the end can be pressed against the chip body under the two soldering tools respectively and pass through the bottom of the two soldering tools respectively.
5. A highly integrated automated production equipment according to claim 4, characterized in that: The transfer module includes a transfer clamp and a belt transmission mechanism. The transfer clamp is connected to the belt transmission mechanism. The transfer clamp is used to clamp the chip body at the end of the tinning channel and release the chip body when moving to the top of the glue dispensing module. The belt transmission mechanism is used to move the transfer clamp to the top of the glue dispensing module. The moving direction of the transfer clamp is perpendicular to the length direction of the tinning channel.
6. A highly integrated automated production equipment according to claim 5, characterized in that: The glue dispensing module includes a moving plate capable of reciprocating linear motion, a glue dispensing clamp located above the moving plate, and a glue dispenser located above the moving plate, wherein the moving direction of the moving plate is parallel to the length direction of the spot welding channel; Multiple fixed fixtures are installed on the mobile plate, and the fixed fixtures can be detachably connected to the chip body. The glue dispensing clamp is used to clamp the chip body on the fixed fixture, and after the mobile plate moves linearly, the chip body is placed in the next fixed fixture. The glue dispensing device is used to dispense glue on the chip body on the fixed fixture.
7. A highly integrated automated production equipment according to claim 6, characterized in that: The cover snapping module includes a cover snapping clamp that can reciprocate. The movement direction of the cover snapping clamp is perpendicular to the movement direction of the movable plate. The cover snapping clamp is used to clamp the chip cover and move it to above the fixed tooling of the movable plate; it is also used to control the descent of the chip cover and snap it onto the chip body.
8. A highly integrated automated production equipment according to claim 7, characterized in that: The unloading module includes an unloading clamp capable of reciprocating motion, and the unloading clamp is used to clamp the chip body after being covered on the fixed tooling located at the end of the movable plate, and move the chip body after being covered to the material tray.
9. A highly integrated automated production method, characterized in that: Use the highly integrated automated production equipment described in any one of claims 1-8.
10. A highly integrated automated production method according to claim 9, characterized in that: Includes the following: In the loading step, the chip bodies are sorted and the sorted chip bodies are moved one by one to the soldering module; Tinning step, tinning each chip body; The transfer step is to move the chip bodies after soldering to the glue dispensing module one by one; the moving direction of the chip bodies in the transfer step is perpendicular to the moving direction of the chip bodies in the soldering step; The glue dispensing step is to dispense glue to the chip body after tinning, and move the chip body after glue dispensing to the bottom of the buckle cover module; the moving direction of the chip body in the glue dispensing step is parallel to the moving direction of the chip body in the tinning step; A capping step is to cap the glued chip body; In the step of unloading, the chip bodies after the covers are unloaded one by one, and the chip bodies after the covers are placed on the material tray in sequence.