Vertical vacuum heating process transmission mechanism and operation method thereof

Abstract

The invention provides a vertical vacuum heating process transmission mechanism and an operation method thereof. The vertical vacuum heating process transmission mechanism comprises a vertical lifting cavity chamber and a process cavity chamber. The vertical lifting cavity chamber is provided with a vertical lifting table. A first placement area of the vertical lift platform receives a first carrier through the access gate valve, and the vertical lift platform then moves such that a second placement area of the vertical lift platform then receives a second carrier through the access gate valve. The process chamber receives the first carrier and performs a vacuum heating process. After the vacuum heating process of the wafer in the first bearing part is completed, the first bearing part is cooled in the first placing area. When the first bearing part is not cooled in the first placing area, the process cavity chamber receives the second bearing part and performs a vacuum heating process on the wafer in the second bearing part.

Description

Technical Field

[0001] The present disclosure relates to a transmission mechanism and an operating method of the transmission mechanism, and more particularly to a vertical vacuum heating process transmission mechanism and an operating method thereof that uses a first placement area and a second placement area of ​​a vertical lifting platform and a division of labor configuration of a process chamber to shorten the wafer process time. Background Art

[0002] Generally speaking, operators usually transport the carrier containing wafers to the heating furnace tube to perform a growth process on the wafers in the carrier, such as a chemical vapor deposition (CVD) process. However, after the wafer completes the growth process, the carrier containing the wafer needs to be cooled in the gas chamber connected to the heating furnace tube. The waiting time for this cooling is about three to four hours. The carrier after the growth process can only be taken out after waiting for its own temperature to return to room temperature in the gas chamber, thus occupying a large amount of operating time of the heating furnace tube and the gas chamber. In other words, the heating furnace tube needs to receive the next group of second group of carriers ready for the process after the temperature of the first group of carriers reaches room temperature and is sent out of the gas chamber. Such a manufacturing process not only spends a lot of time waiting for the cooling of the wafers, but also reduces the delivery speed of the wafers. Summary of the invention

[0003] The object of the present invention is to provide a vertical vacuum heating process transmission mechanism and an operating method thereof to solve at least one of the above problems.

[0004] One technical method disclosed in the present invention is a vertical vacuum heating process transfer mechanism, which can, when a first wafer completes a vacuum heating process and is cooled in a first placement area of ​​a vertical lifting platform, simultaneously enable a second wafer to be transferred from a second placement area of ​​the vertical lifting platform to a process chamber for a vacuum heating process. This can shorten the cooling waiting time for manufacturing multiple groups of wafers and the time for performing a vacuum heating process.

[0005] The embodiment of the present disclosure provides a vertical vacuum heating process transmission mechanism, which sequentially transports a first carrier, a second carrier, and a third carrier, and includes a vertical lifting chamber and a process chamber. The vertical lifting chamber has a vertical lifting platform, an inlet and outlet gate valve disposed on one side of the vertical lifting platform, and a process gate valve disposed on the other side of the vertical lifting platform, wherein the vertical lifting platform includes a first placement area and a second placement area adjacent to the first placement area, the first placement area and the second placement area are aligned in a first direction, wherein the first placement area is configured to receive the first carrier through the inlet and outlet gate valve, and the vertical lifting platform is configured to move so that the second placement area then receives the second carrier through the inlet and outlet gate valve. The process chamber is connected to the process gate valve disposed in the vertical lifting chamber, and is configured to receive the first carrier and perform a vacuum heating process on the first wafer in the first carrier. After the first wafer completes the vacuum heating process, the first placement area is further configured to receive the first carrier that has completed the vacuum heating process. The vertical lifting platform then moves along the first direction to allow the first carrier to be cooled in the first placement area. When the first carrier is cooled in the first placement area without breaking the vacuum, the process chamber is further configured to receive the second carrier and perform a vacuum heating process on the second wafer in the second carrier.

[0006] According to one embodiment of the present disclosure, when the first wafer has completed cooling and the second wafer in the second carrier is still undergoing a vacuum heating process in the process chamber, the vertical lifting platform then moves along a second direction opposite to the first direction to expose the first placement area from the inlet and outlet gate valve again, the first carrier is used to be taken out and the first placement area is further configured to receive a third carrier.

[0007] According to one embodiment of the present disclosure, when the third carrier is located in the first placement area and the second wafer in the second carrier completes the vacuum heating process, the vertical lifting platform is further configured to move along the first direction so that the second placement area receives the second carrier that has completed the vacuum heating process.

[0008] According to one embodiment of the present disclosure, after the second placement area receives the second carrier that has completed the vacuum heating process, the vertical lifting platform is further configured to move along the second direction to allow the second carrier to be cooled down in the second placement area without breaking the vacuum, and the process chamber is further configured to receive the third carrier and perform a vacuum heating process on the third wafer in the third carrier, and when the second wafer has completed cooling and the third wafer in the third carrier is still undergoing the vacuum heating process in the process chamber, the vertical lifting platform then moves along the first direction to expose the second placement area from the inlet and outlet gate valve so that the second carrier can be taken out.

[0009] According to one embodiment of the present disclosure, the vertical lift chamber has a delivery gate valve, and the process gate valve and the delivery gate valve are located on opposite sides of the vertical lift platform.

[0010] According to an embodiment of the present disclosure, the vertical vacuum heating process transmission mechanism further includes a transverse conveying device. The transverse conveying device is connected to the conveying gate valve disposed in the vertical lifting chamber and has a transverse gripper. The transverse gripper is configured to push the first carrier and the second carrier from the first placement area and the second placement area into the process chamber, respectively, or pull them back from the process chamber to the first placement area and the second placement area, respectively.

[0011] Another embodiment of the present disclosure is an operating method of a vertical vacuum heating process transfer mechanism, which can enable a first wafer to complete a vacuum heating process and be cooled in a first placement area of ​​a vertical lifting platform while a second wafer is transferred to a process chamber in a second placement area of ​​the vertical lifting platform for a vacuum heating process. This can shorten the cooling waiting time for manufacturing multiple groups of wafers and the time for performing a vacuum heating process.

[0012] The embodiment of the present disclosure provides an operation method of a vertical vacuum heating process transmission mechanism, which is used to sequentially transport a first carrier, a second carrier and a third carrier, and includes: a first placement area of ​​a vertical lifting platform of a vertical lifting chamber receives the first carrier through an inlet and outlet gate valve of the vertical lifting platform, and the vertical lifting platform then moves vertically so that a second placement area of ​​the vertical lifting platform receives the second carrier through the inlet and outlet gate valve, wherein the first placement area of ​​the vertical lifting platform is aligned with a second placement area adjacent to the first placement area in a first direction, and the inlet and outlet gate valve is arranged on one side of the vertical lifting platform; the process chamber receives the first carrier and performs a vacuum heating process on a first wafer in the first carrier; after the vacuum heating process is completed on the first wafer, the first placement area of ​​the vertical lifting platform receives the first carrier that has completed the vacuum heating process and then moves vertically; and when the first carrier is cooled down in the first placement area without breaking the vacuum, the process chamber receives the second carrier and performs a vacuum heating process on the second wafer in the second carrier.

[0013] According to one embodiment of the present disclosure, the above-mentioned operating method also includes: when the first wafer has completed cooling and the second wafer in the second carrier is still undergoing a vacuum heating process in the process chamber, the vertical lifting platform then moves along a second direction opposite to the first direction to expose the first placement area from the inlet and outlet gate valve again; and the first carrier is taken out and the first placement area receives the third carrier.

[0014] According to one embodiment of the present disclosure, the above-mentioned operating method also includes: when the third carrier is located in the first placement area and the second wafer in the second carrier completes the vacuum heating process, the vertical lifting platform then moves along the first direction so that the second placement area receives the second carrier that has completed the vacuum heating process.

[0015] According to one embodiment of the present disclosure, the above-mentioned operating method also includes: after the second placement area receives the second carrier that has completed the vacuum heating process, the vertical lifting platform then moves along the second direction to allow the second carrier to be cooled down in the second placement area without breaking the vacuum, and the process chamber receives the third carrier and performs a vacuum heating process on the third wafer in the third carrier; and when the second wafer has completed cooling and the third wafer in the third carrier is still undergoing a vacuum heating process in the process chamber, the vertical lifting platform then moves along the first direction to expose the second placement area from the inlet and outlet gate valve, and the second carrier is taken out.

[0016] In summary of the above, in the present disclosure, first, the first wafer of the first carrier can be cooled in the first placement area of ​​the vertical lifting platform after completing the vacuum heating process, and will not occupy the working space of the process chamber and the second placement area of ​​the vertical lifting platform. Therefore, when the first carrier is waiting for cooling in the first placement area, the second carrier located in the second placement area of ​​the vertical lifting platform can enter the process chamber to perform the vacuum heating process. In addition, when the first carrier completes cooling in the first placement area and the second carrier is still performing the vacuum heating process in the process chamber, the vertical lifting platform can be moved so that the first carrier is taken out from the inlet and outlet gate valve, and the first placement area then receives the third carrier. When the second carrier completes the vacuum heating process, it can be transferred to the second placement area of ​​the vertical lifting platform and cooled in the second placement area, and the third carrier can then enter the process chamber to perform the vacuum heating process. Such repeated operations make the division of labor of the vertical vacuum heating process transfer mechanism not only shorten the cooling waiting time for manufacturing multiple groups of wafers and the time for the vacuum heating process, but also improve the wafer shipment efficiency using the vertical vacuum heating process transfer mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] One embodiment of the present disclosure is best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be emphasized that, in accordance with standard practice in the industry, various features are not drawn to scale and are only used for illustration purposes. In fact, the size of various features may be arbitrarily increased or reduced for clarity of discussion.

[0018] Figure 1 A schematic diagram showing a vertical vacuum heating process transmission mechanism according to an embodiment of the present disclosure.

[0019] Figure 2A side view of a vertical lift chamber according to an embodiment of the present disclosure is shown.

[0020] Figure 3 A flow chart showing an operating method of a vertical vacuum heating process transfer mechanism according to an embodiment of the present disclosure.

[0021] Figure 4 , Figure 7 , Figure 8 , Fig.10 as well as Fig.11 Schematic diagram showing the operation method of the vertical vacuum heating process transfer mechanism at different stages according to some embodiments of the present disclosure.

[0022] Figure 5 , Figure 6 , Fig. 9 as well as Figures 12 to 15 Side views of a vertical lift chamber of a vertical vacuum heating process transfer mechanism at different stages are shown according to some embodiments of the present disclosure.

[0023] The reference numerals are as follows:

[0024] 100: Vertical vacuum heating process transmission mechanism

[0025] 110: Vertical lift chamber

[0026] 111: Inlet and outlet gate valve

[0027] 112: Vertical lift

[0028] 113: Process gate valve

[0029] 114: First placement area

[0030] 115: Delivery gate valve

[0031] 116: Second placement area

[0032] 120: Process chamber

[0033] 130: Horizontal conveying device

[0034] 132: Horizontal grabber

[0035] 200: First bearing member

[0036] 210: First Wafer

[0037] 300: Second bearing member

[0038] 310: Second wafer

[0039] 400: The third bearing member

[0040] 410: The third wafer

[0041] D1: First direction

[0042] D2: Second direction

[0043] S1, S2, S3, S4: Steps DETAILED DESCRIPTION

[0044] The following disclosed embodiments provide many different embodiments, or examples, for implementing the different features of the subject matter provided. Specific examples of components and arrangements are described below to simplify the present invention. Of course, multiple examples are only examples and are not intended to be limiting. In addition, the present invention may repeat element symbols and / or letters in each example. This repetition is used for the purpose of simplicity and clarity, and does not itself specify the relationship between the various embodiments and / or configurations discussed.

[0045] Spatially relative terms such as "below," "beneath," "lower," "above," "upper," and the like may be used herein for descriptive purposes to describe the relationship of one element or feature to another element or feature as illustrated in the accompanying drawings. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation illustrated in the accompanying drawings. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein should likewise be interpreted accordingly.

[0046] Please refer to Figure 1 and Figure 2 , Figure 1 A schematic diagram showing a vertical vacuum heating process transmission mechanism 100 according to an embodiment of the present disclosure is shown. Figure 2 FIG. 1 shows a side view of a vertical lift chamber 110 according to an embodiment of the present disclosure. Figure 1 and Figure 2In the embodiment, the vertical vacuum heating process transfer mechanism 100 can be used to sequentially transfer the first carrier 200, the second carrier 300 and the third carrier 400 (to be described in detail later), and the vertical vacuum heating process transfer mechanism 100 includes a vertical lifting chamber 110, a process chamber 120 and a horizontal transfer device 130. The vertical lifting chamber 110 has a vertical lifting platform 112, an inlet and outlet gate valve 111 disposed on one side of the vertical lifting platform 112, and a process gate valve 113 disposed on the other side of the vertical lifting platform 112. The vertical lifting platform 112 includes a first placement area 114 and a second placement area 116 adjacent to the first placement area 114, and the first placement area 114 and the second placement area 116 are aligned in the first direction D1. For example, the first placement area 114 and the second placement area 116 are aligned in the vertical direction. A partition may be provided between the first placement area 114 and the second placement area 116 to separate the first placement area 114 from the second placement area 116.

[0047] In some embodiments, the process chamber 120 is connected to the process gate valve 113 disposed in the vertical lift chamber 110. The vertical lift chamber 110 has a delivery gate valve 115, and the process gate valve 113 and the delivery gate valve 115 are located on opposite sides of the vertical lift platform 112. For example, the process gate valve 113 is located on the left side of the vertical lift platform 112, the delivery gate valve 115 is located on the right side of the vertical lift platform 112, and the in-out gate valve 111 is located on the front side of the vertical lift platform 112. In addition, the lateral transport device 130 is connected to the delivery gate valve 115 disposed in the vertical lift chamber 110 and has a lateral gripper 132.

[0048] In the following description, the operation method of the vertical vacuum heating process transmission mechanism will be described. The connection relationship, materials and functions of the components described above will not be repeated, but will be described first.

[0049] Please refer to Figure 3 , Figure 3 A flow chart showing an operating method of a vertical vacuum heating process transmission mechanism according to an embodiment of the present disclosure. Figure 3In the invention, the operation method of the vertical vacuum heating process transmission mechanism includes the following steps. The operation method of the vertical vacuum heating process transmission mechanism can sequentially transport the first carrier, the second carrier and the third carrier. First, in step S1, the first placement area of ​​the vertical lifting platform of the vertical lifting chamber receives the first carrier through the inlet and outlet gate valve of the vertical lifting platform, and the vertical lifting platform then moves vertically so that the second placement area of ​​the vertical lifting platform receives the second carrier through the inlet and outlet gate valve, wherein the first placement area of ​​the vertical lifting platform is aligned with the second placement area adjacent to the first placement area in the first direction, and the inlet and outlet gate valve is arranged on one side of the vertical lifting platform. Then, in step S2, the process chamber receives the first carrier and performs a vacuum heating process on the first wafer in the first carrier. Then, in step S3, after the first wafer completes the vacuum heating process, the first placement area of ​​the vertical lifting platform receives the first carrier that has completed the vacuum heating process and then moves vertically. Next, in step S4, when the first carrier is cooled in the first placement area without breaking vacuum, the process chamber receives the second carrier and performs a vacuum heating process on the second wafer in the second carrier. In the following description, the above steps will be described in detail.

[0050] Figure 4 , Figure 7 , Figure 8 , Fig.10 as well as Fig.11 Schematic diagram showing the operation method of the vertical vacuum heating process transfer mechanism at different stages according to some embodiments of the present disclosure. Figure 5 , Figure 6 , Fig. 9 as well as Figures 12 to 15 1 shows a side view of a vertical lifting chamber 110 of a vertical vacuum heating process transfer mechanism 100 at different stages according to some embodiments of the present disclosure. Figures 4 to 6 First, when the first placement area 114 of the vertical lifting platform 112 of the vertical lifting chamber 110 is exposed from the inlet and outlet gate valve 111 of the vertical lifting chamber 110 (i.e., the inlet and outlet gate valve 111 is opened so that the first placement area 114 can be observed), the first placement area 114 is configured to receive the first carrier 200 through the inlet and outlet gate valve 111, and the vertical lifting platform 112 then moves vertically (e.g., moves along the first direction D1), so that the second placement area 116 is exposed from the inlet and outlet gate valve 111 (i.e., the inlet and outlet gate valve 111 is opened so that the second placement area 116 can be observed) and receives the second carrier 300 through the inlet and outlet gate valve 111, as shown in FIG. Figure 5 After the second placement area 116 receives the second carrier 300, the vertical lifting platform 112 then moves vertically (for example, moves along the second direction D2) so that the first carrier 200 is ready to enter the process chamber 120. Figure 6 For clarity, Figure 4 The sizes of the first carrier 200 and the second carrier 300 are different. However, in practical applications, the sizes of the first carrier 200 and the second carrier 300 can be the same or different, and the sizes of the first carrier 200 and the second carrier 300 are not limited thereto.

[0051] Please refer to Figures 7 to 9 In some embodiments, the lateral gripper 132 of the lateral conveying device 130 can push the first carrier 200 from the first placement area 114 into the process chamber 120, such as Figure 7 As shown. In other embodiments, the lateral gripper 132 of the lateral conveying device 130 may not be used, and the first carrier 200 may be pushed from the first placement area 114 into the process chamber 120 by a robot arm (not shown) of the vertical lifting chamber 110. The method of pushing the first carrier 200 into the process chamber 120 is not limited. The process chamber 120 is connected to the process gate valve 113 disposed in the vertical lifting chamber 110. The process chamber 120 can receive the first carrier 200 and perform a vacuum heating process on the first wafer 210 in the first carrier 200, such as Figure 8 and Fig. 9 In addition, the first carrier 200 can be pulled back from the process chamber 120 to the first placement area 114 by the lateral gripper 132 of the lateral conveying device 130 or the robot arm (not shown) of the vertical lifting chamber 110. The method of pulling the first carrier 200 back from the process chamber 120 to the first placement area 114 is not limited.

[0052] Please refer to Figures 10 to 12 After the first wafer 210 completes the vacuum heating process, the first placement area 114 is further configured to receive the first carrier 200 that has completed the vacuum heating process, and the vertical lifting platform 112 then moves along the first direction D1 to cool the first carrier 200 in the first placement area 114. In addition, when the first carrier 200 is cooled in the first placement area 114 without breaking the vacuum, the process chamber 120 is further configured to receive the second carrier 300 and perform the vacuum heating process on the second wafer 310 in the second carrier 300, such as Fig.11 and Fig.12 shown.

[0053] Please refer to Figures 13 to 15When the first wafer 210 has finished cooling down and the second wafer 310 in the second carrier 300 is still undergoing the vacuum heating process in the process chamber 120, the vertical lift 112 then moves along the second direction D2 opposite to the first direction D1, so that the first placement area 114 is exposed from the inlet and outlet gate valve 111 again (i.e., the inlet and outlet gate valve 111 is opened after breaking the vacuum so that the first carrier 200 can be observed). The first carrier 200 can be taken out and the first placement area 114 is further configured to receive the third carrier 400, such as Fig.13 When the third carrier 400 is located in the first placement area 114 and the second wafer 310 in the second carrier 300 has completed the vacuum heating process, the vertical lifting platform 112 is further configured to move along the first direction D1, so that the second placement area 116 receives the second carrier 300 that has completed the vacuum heating process, and the second carrier 300 is cooled in the second placement area 116 without breaking the vacuum, as shown. Fig.14 The vertical lifting platform 112 is further configured to move along the second direction D2 and the process chamber 120 is further configured to receive the third carrier 400 and perform a vacuum heating process on the third wafer 410 in the third carrier 400. Fig.15 shown.

[0054] Next, when the second wafer 310 has finished cooling down and the third wafer 410 in the third carrier 400 is still undergoing the vacuum heating process in the process chamber 120, the vertical lifting platform 112 then moves along the first direction D1, so that the second placement area 116 is exposed from the inlet and outlet gate valve 111 (i.e., the inlet and outlet gate valve 111 is opened after breaking the vacuum so that the second carrier 300 can be observed), and the second carrier 300 is taken out. Such repeated operations can shorten the cooling waiting time of the wafer and the time for the vacuum heating process.

[0055] In summary, after the vacuum heating process is completed, the first wafer 210 of the first carrier 200 can be cooled in the first placement area 114 of the vertical lifting platform 112, and will not occupy the working space of the process chamber 120 and the second placement area 116 of the vertical lifting platform 112. Therefore, when the first carrier 200 is waiting for cooling in the first placement area 114, the second carrier 300 located in the second placement area 116 of the vertical lifting platform 112 can enter the process chamber to perform the vacuum heating process. In addition, when the first carrier 200 has completed cooling in the first placement area 114 and the second carrier 300 is still in the process chamber 120. The movable vertical lifting platform 112 allows the first carrier 200 to be taken out from the inlet and outlet gate valve 111, and the first placement area 114 then receives the third carrier 400. When the second carrier 300 completes the vacuum heating process, it can be transferred to the second placement area 116 of the vertical lifting platform 112 and cooled in the second placement area 116, and the third carrier 400 can then enter the process chamber 120 to perform the vacuum heating process. Such repeated operations make the division of labor of the vertical vacuum heating process transfer mechanism 100 not only shorten the cooling waiting time for manufacturing multiple groups of wafers and the time for performing the vacuum heating process, but also improve the wafer shipping efficiency using the vertical vacuum heating process transfer mechanism 100.

[0056] The foregoing summarizes the features of several embodiments so that those skilled in the art can better understand the manner of the present disclosure. Those skilled in the art should understand that they can easily use the present disclosure as a basis for designing or modifying other processes and structures to achieve the same purpose and / or achieve the same advantages as the embodiments described herein. Those skilled in the art should also recognize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they can make various changes, substitutions and modifications here without departing from the spirit and scope of the present disclosure.

Claims

1. A vertical vacuum heating process transmission mechanism for sequentially transmitting a first carrier (200), a second carrier (300) and a third carrier (400), comprising: A vertical lift chamber (110) having a vertical lift platform (112), an inlet and outlet gate valve (111) disposed on one side of the vertical lift platform (112), and a process gate valve (113) disposed on the other side of the vertical lift platform (112), wherein the vertical lift platform (112) comprises a first placement area (114) and a second placement area (116) adjacent to the first placement area (114), the first placement area (114) and the second placement area (116) being aligned in a first direction (D1), wherein the first placement area (114) is configured to receive the first carrier (200) through the inlet and outlet gate valve (111), and the vertical lift platform (112) is configured to move so that the second placement area (116) then receives the second carrier (300) through the inlet and outlet gate valve (111); and A process chamber (120) is connected to the process gate valve (113) arranged in the vertical lifting chamber (110), and is configured to receive the first carrier (200) and perform a vacuum heating process on a first wafer (210) in the first carrier (200), wherein after the vacuum heating process is completed on the first wafer (210), the first placement area (114) is further configured to receive the first carrier (200) that has completed the vacuum heating process, and the vertical lifting platform (112) then moves along the first direction (D1) to cool the first carrier (200) in the first placement area (114), and when the first carrier (200) is cooled in the first placement area (114) without breaking the vacuum, the process chamber (120) is further configured to receive the second carrier (300) and perform a vacuum heating process on a second wafer (310) in the second carrier (300).

2. The vertical vacuum heating process transfer mechanism as described in claim 1, wherein when the first wafer (210) has completed cooling and the second wafer (310) in the second carrier (300) is still undergoing a vacuum heating process in the process chamber (120), the vertical lifting platform (112) then moves along a second direction (D2) opposite to the first direction (D1) to expose the first placement area (114) from the inlet and outlet gate valve (111) again, the first carrier (200) is used to be taken out and the first placement area (114) is further configured to receive the third carrier (400).

3. The vertical vacuum heating process transfer mechanism as described in claim 2, wherein when the third carrier (400) is located in the first placement area (114) and the second wafer (310) in the second carrier (300) completes the vacuum heating process, the vertical lifting platform (112) is further configured to then move along the first direction (D1) so that the second placement area (116) receives the second carrier (300) that has completed the vacuum heating process.

4. The vertical vacuum heating process transmission mechanism as described in claim 3, wherein after the second placement area (116) receives the second carrier (300) that has completed the vacuum heating process, the vertical lifting platform (112) is further configured to move along the second direction (D2) to cool the second carrier (300) in the second placement area (116) without breaking the vacuum, and the process chamber (120) is further configured to receive the third carrier (400) and A third wafer (410) in (400) undergoes a vacuum heating process, and when the second wafer (310) has completed cooling and the third wafer (410) in the third carrier (400) is still undergoing a vacuum heating process in the process chamber (120), the vertical lifting platform (112) then moves along the first direction (D1) to expose the second placement area (116) from the inlet and outlet gate valve (111), and the second carrier (300) is used to be taken out.

5. The vertical vacuum heating process transfer mechanism as described in claim 1, wherein the vertical lifting chamber (110) has a transfer gate valve (115), and the process gate valve (113) and the transfer gate valve (115) are located on opposite sides of the vertical lifting platform (112).

6. The vertical vacuum heating process transmission mechanism according to claim 5, further comprising: A transverse conveying device (130) is connected to the conveying gate valve (115) arranged in the vertical lifting chamber (110) and has a transverse grasping member (132), wherein the transverse grasping member (132) is configured to push the first carrier (200) and the second carrier (300) from the first placement area (114) and the second placement area (116) into the process chamber (120) respectively, or pull them back from the process chamber (120) to the first placement area (114) and the second placement area (116) respectively.

7. An operating method of a vertical vacuum heating process transmission mechanism for sequentially transmitting a first carrier (200), a second carrier (300) and a third carrier (400), comprising: A first placement area (114) of a vertical lifting platform (112) of a vertical lifting chamber (110) receives the first carrier (200) through an inlet and outlet gate valve (111) of the vertical lifting platform (112), and the vertical lifting platform (112) then moves vertically so that a second placement area (116) of the vertical lifting platform (112) receives the second carrier (300) through the inlet and outlet gate valve (111), wherein the first placement area (114) of the vertical lifting platform (112) is aligned with the second placement area (116) adjacent to the first placement area (114) in a first direction (D1), and the inlet and outlet gate valve (111) is arranged on one side of the vertical lifting platform (112); A process chamber (120) receives the first carrier (200) and performs a vacuum heating process on a first wafer (210) in the first carrier (200); After the first wafer (210) completes the vacuum heating process, the first placement area (114) of the vertical lifting platform (112) receives the first carrier (200) that has completed the vacuum heating process and then moves vertically; and When the first carrier (200) is cooled down in the first placement area (114) without breaking the vacuum, the process chamber (120) receives the second carrier (300) and performs a vacuum heating process on a second wafer (310) in the second carrier (300).

8. The method for operating the vertical vacuum heating process transmission mechanism according to claim 7, further comprising: When the first wafer (210) has finished cooling down and the second wafer (310) in the second carrier (300) is still undergoing a vacuum heating process in the process chamber (120), the vertical lifting platform (112) then moves along a second direction (D2) opposite to the first direction (D1) to expose the first placement area (114) from the inlet and outlet gate valve (111) again; and The first carrier (200) is taken out and the first placement area (114) receives the third carrier (400).

9. The method for operating the vertical vacuum heating process transmission mechanism according to claim 8, further comprising: When the third carrier (400) is located in the first placement area (114) and the second wafer (310) in the second carrier (300) completes the vacuum heating process, the vertical lifting platform (112) then moves along the first direction (D1) so that the second placement area (116) receives the second carrier (300) that has completed the vacuum heating process.

10. The method for operating the vertical vacuum heating process transmission mechanism according to claim 9, further comprising: After the second placement area (116) receives the second carrier (300) that has completed the vacuum heating process, the vertical lifting platform (112) then moves along the second direction (D2) to cool the second carrier (300) in the second placement area (116) without breaking the vacuum, and the process chamber (120) receives the third carrier (400) and performs a vacuum heating process on a third wafer (410) in the third carrier (400); and When the second wafer (310) has completed cooling and the third wafer (410) in the third carrier (400) is still undergoing a vacuum heating process in the process chamber (120), the vertical lifting platform (112) then moves along the first direction (D1) to expose the second placement area (116) from the inlet and outlet gate valve (111), and the second carrier (300) is taken out.

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