Substrate processing apparatus

Abstract

The invention relates to a substrate processing apparatus, a carrier conveying method, and a carrier buffer apparatus. The carrier transport mechanism (51) transports a carrier (C) between the mounting table (13) of the two opening mechanisms (9, 10) and the plurality of carrier storage racks (53). The plurality of carrier storage racks (53) and the carrier conveyance mechanism (51) are respectively mounted on the first processing block (3). Therefore, a plurality of carrier storage racks (53) and carrier conveying mechanisms (51) can be arranged without extending in the horizontal direction from the loading block as in the prior art, and the arrangement area extending in the horizontal direction can be reduced. That is, the occupied area of the substrate processing apparatus (1) can be reduced.

Description

[0001] Information about divisional applications

[0002] This case is a divisional application. The parent case of the divisional application is an invention patent application with application date of December 24, 2019, application number 201911348442.4, and invention name “Substrate processing device, carrier transfer method and carrier buffer device”. Technical Field

[0003] The present invention relates to a substrate processing device, a carrier transport method and a carrier buffer device for processing a substrate. Examples of the substrate include semiconductor substrates, FPD (Flat Panel Display) substrates, photomask substrates, optical disk substrates, magnetic disk substrates, ceramic substrates and solar cell substrates. Examples of FPD include liquid crystal display devices, organic EL (electroluminescence) display devices and the like. Background Art

[0004] Conventional substrate processing devices include a substrate processing device body and a carrier buffer device (storage device) (for example, refer to Japanese Patent Publication No. 2011-187796). The substrate processing device body includes a loading block and a processing block. The processing block is connected to the loading block in the horizontal direction. The loading block is equipped with a substrate transfer robot. A carrier placement table is provided on the outer wall of the loading block. The carrier placement table is used to place a carrier capable of accommodating multiple substrates. The carrier placement table is provided on the opposite side of the processing block across the transfer robot.

[0005] The carrier buffer device includes a plurality of carrier storage racks for storing carriers and a carrier transport mechanism. The carrier transport mechanism is configured to transport the carriers between the plurality of carrier storage racks and the carrier placement table. Summary of the invention

[0006] [Problems to be solved by the invention]

[0007] The conventional carrier buffer device is arranged on the opposite side of the processing block across the loading block, that is, extends horizontally from the loading block to the carrier mounting table side. Such a conventional carrier buffer device may increase the installation area, that is, the occupied area, of the substrate processing apparatus.

[0008] The present invention has been made in view of such circumstances, and an object of the present invention is to provide a substrate processing apparatus, a carrier transfer method, and a carrier buffer device capable of reducing the occupied area of ​​the substrate processing apparatus.

[0009] [Technical means to solve the problem]

[0010] In order to achieve this object, the present invention adopts the following structure. That is, the substrate processing device for processing a substrate of the present invention includes the following elements: a first loading block provided with at least one first carrier mounting table for mounting a carrier capable of accommodating a plurality of substrates; a first processing block connected to the first loading block in a horizontal direction; a plurality of carrier storage racks mounted on at least one of the first loading block and the first processing block to store the carriers respectively; and a carrier transport mechanism mounted on at least one of the first loading block and the first processing block to transport the carriers between the at least one first carrier mounting table and the plurality of carrier storage racks.

[0011] According to the substrate processing device of the present invention, the carrier transport mechanism transports the carrier between at least one first carrier loading platform and a plurality of carrier storage racks. The plurality of carrier storage racks and the carrier transport mechanism are respectively mounted on at least one of the first loading block and the first processing block. Therefore, the plurality of carrier storage racks and the carrier transport mechanism may not be arranged to extend in the horizontal direction from the loading block, and the installation area extended in the horizontal direction can be reduced. That is, the occupied area of ​​the substrate processing device can be reduced.

[0012] In addition, in the substrate processing device, it is preferred that the first processing block includes a plurality of processing blocks arranged in a row, the first loading block is connected to the first processing block at one end of the plurality of processing blocks in a horizontal direction, the plurality of carrier storage racks are mounted on the first loading block and at least any one of the plurality of processing blocks to respectively store the carriers, and the carrier transport mechanism is mounted on the first loading block and at least any one of the plurality of processing blocks to transport the carriers between the at least one first carrier placement table and the plurality of carrier storage racks.

[0013] Thus, in a substrate processing apparatus including a plurality of processing blocks arranged in a row, the footprint of the substrate processing apparatus can be reduced.

[0014] In addition, in the substrate processing device, it is preferred to further include a second loading block, which is horizontally connected to the processing block at the other end of the multiple processing blocks and is provided with at least one second carrier loading platform for loading the carrier, the multiple carrier storage racks are mounted on the first loading block, the multiple processing blocks and at least one of the second loading blocks, and store the carriers respectively, and the carrier transport mechanism is mounted on the first loading block, the multiple processing blocks and at least one of the second loading blocks, and transports the carrier between the at least one first carrier loading platform, the multiple carrier storage racks and the at least one second carrier loading platform.

[0015] Thus, for a substrate processing apparatus in which a plurality of processing blocks are arranged between two loading blocks, the footprint of the substrate processing apparatus can be reduced.

[0016] In addition, in the substrate processing device, it is preferred to further include a second loading block, which is arranged between a processing block on one end side and a processing block on the other end side of the multiple processing blocks, and is provided with at least one second carrier loading platform for loading the carrier, the multiple carrier storage racks are mounted on the first loading block, the multiple processing blocks and at least one of the second loading blocks, and store the carriers respectively, and the carrier transport mechanism is mounted on the first loading block, the multiple processing blocks and at least one of the second loading blocks, and transports the carrier between the at least one first carrier loading platform, the multiple carrier storage racks and the at least one second carrier loading platform.

[0017] Thus, in a substrate processing apparatus in which the second loading block is disposed between two processing blocks, the footprint of the substrate processing apparatus can be reduced.

[0018] In addition, the substrate processing apparatus preferably further comprises a second carrier transport mechanism, which is mounted on the processing block on the other end side of the carrier transport mechanism, that is, the opposite side of the first carrier transport mechanism, via the second loading block, to transport the carrier. Since two carrier transport mechanisms are used to transport the carrier, the carrier transport efficiency can be improved. Therefore, the processing capacity of the substrate processing apparatus can be increased.

[0019] In addition, the substrate processing apparatus preferably further comprises a relay carrier stage disposed on the second loading block, the first carrier transport mechanism uses the relay carrier stage to transport the carrier to the second carrier transport mechanism, and the second carrier transport mechanism uses the relay carrier stage to transport the carrier to the first carrier transport mechanism. The area on the second loading block can be used as a relay stage for two carrier transport mechanisms. Therefore, the delivery of the carrier can be performed more smoothly.

[0020] In addition, in the substrate processing apparatus, the carrier transport mechanism preferably includes: a holding portion that holds the carrier; an arm portion that is mounted with the holding portion; a driving portion that supports the arm portion; and a guide rail that is mounted on at least two of the plurality of processing blocks and the second loading block; the driving portion is configured to move the holding portion and the arm portion along the guide rail, and the guide rail is mounted on a groove portion formed in the second loading block. Since the guide rail is mounted on the groove portion formed in the second loading block, the height of the carrier transport mechanism can be suppressed, and the area on the opposite side of the carrier transport mechanism across the second loading block can be used as a carrier storage rack.

[0021] In addition, in the substrate processing apparatus, the carrier transport mechanism preferably comprises: a holding portion for holding the carrier; an arm portion for mounting the holding portion; a driving portion for supporting the arm portion; and a guide rail mounted on at least two of the plurality of processing blocks; the driving portion is configured to move the holding portion and the arm portion along the guide rail. The carrier transport range of the carrier transport mechanism can be expanded, and a plurality of areas can be used as carrier storage racks.

[0022] In addition, in the substrate processing device, it is preferred to further include a second loading block, which is connected to the opposite side of the first loading block relative to the first processing block and is provided with at least one second carrier mounting table for mounting the carrier, the multiple carrier storage racks are mounted on at least any one of the first loading block, the first processing block and the second loading block, and respectively store the carriers, and the carrier transport mechanism is mounted on at least any one of the first loading block, the first processing block and the second loading block, and transports the carrier between the at least one first carrier mounting table, the multiple carrier storage racks and the at least one second carrier mounting table.

[0023] Thus, for a substrate processing apparatus having a single processing block sandwiched between two loading blocks, the footprint of the substrate processing apparatus can be reduced.

[0024] In addition, in the substrate processing apparatus, the at least one first carrier mounting table is preferably provided at a position higher than the upper surface of the first processing block. The carrier transport mechanism mounted on at least one of the first loading block and the first processing block can easily transport the carrier mounted on the first carrier mounting table.

[0025] In addition, in the substrate processing apparatus, it is preferred that the at least one first carrier stage is disposed above the first processing block. The first carrier stage can be directed toward the carrier transport mechanism. Thus, the carrier transport mechanism can easily transport the carrier mounted on the first carrier stage. In addition, since the first carrier stage can be prevented from protruding from the first loading block when viewed from above, the occupied area of ​​the substrate processing apparatus can be further reduced.

[0026] In addition, in the substrate processing apparatus, it is preferred that the at least one first carrier stage is arranged so as to be accommodated in at least one area of ​​the first loading block and the first processing block when viewed from above. Relatively speaking, the first carrier stage can be directed toward the carrier transport mechanism. Thus, the carrier transport mechanism can easily transport the carrier mounted on the first carrier stage.

[0027] In addition, in the substrate processing apparatus, the at least one second carrier stage is preferably provided at a position higher than the upper surface of the first processing block. The carrier transport mechanism mounted on at least one of the first loading block and the first processing block can easily transport the carrier mounted on the second carrier stage.

[0028] In addition, in the substrate processing apparatus, the second loading block preferably includes a substrate transfer mechanism for transferring a substrate, and the at least one second carrier placement table is a plurality of second carrier placement tables, and the plurality of second carrier placement tables are arranged around the substrate transfer mechanism when viewed from above. A carrier can be transferred to the plurality of second carrier placement tables by using one substrate transfer mechanism.

[0029] In addition, the substrate processing apparatus preferably further comprises a lifting mechanism, which is disposed on the first loading block and lifts the at least one first carrier stage between the upper surface side and the ground side of the first loading block. By lifting the first carrier stage by the lifting mechanism, the first carrier stage can be lowered to a height at which an operator can directly place a carrier on the first carrier stage. For example, when the substrate processing apparatus is used during non-production such as evaluation or maintenance, the operator usually transports the substrate by hand rather than using an external transport mechanism. At this time, since the operator can directly place the carrier on the first carrier stage, the substrate processing apparatus can be used flexibly during evaluation or maintenance, thereby improving operating efficiency.

[0030] In addition, the substrate processing apparatus preferably includes: an opening for allowing a substrate to pass through the carrier placed on the first carrier stage; a shutter member for opening and closing the opening; and a shutter member driving mechanism for moving the shutter member in a horizontal direction along the opening. A space for arranging a substrate placement unit, for example, can be ensured in a region below the opening.

[0031] In addition, the carrier transport method of the substrate processing device of the present invention includes the following steps. The substrate processing device comprises: a first loading block provided with at least one first carrier mounting table for mounting a carrier capable of accommodating a plurality of substrates; and a first processing block connected to the first loading block in a horizontal direction. The steps are: using a plurality of carrier storage racks mounted on at least one of the first loading block and the first processing block to store the carriers respectively; and using a carrier transport mechanism mounted on at least one of the first loading block and the first processing block to transport the carriers between the at least one first carrier mounting table and the plurality of carrier storage racks.

[0032] According to the carrier transport method of the present invention, the carrier transport mechanism transports the carrier between at least one first carrier loading platform and a plurality of carrier storage racks. The plurality of carrier storage racks and the carrier transport mechanism are respectively mounted on at least one of the first loading block and the first processing block. Therefore, the plurality of carrier storage racks and the carrier transport mechanism may not be arranged to extend in the horizontal direction from the loading block, and the installation area extended in the horizontal direction can be reduced. That is, the occupied area of ​​the substrate processing device can be reduced.

[0033] In addition, the carrier buffer device of the present invention is arranged on a substrate processing device body, and the substrate processing device body comprises: a first loading block, which is provided with at least one first carrier mounting table for mounting a carrier capable of accommodating a plurality of substrates; and a first processing block, which is connected to the first loading block in a horizontal direction; and the carrier buffer device includes the following elements: a plurality of carrier storage racks, which are mounted on at least any one of the first loading block and the first processing block, and respectively store the carriers; and a carrier conveying mechanism, which is mounted on at least any one of the first loading block and the first processing block, and conveys the carriers between the at least one first carrier mounting table and the plurality of carrier conveying racks.

[0034] According to the carrier buffer device of the present invention, the carrier transport mechanism transports the carrier between at least one first carrier loading platform and a plurality of carrier storage racks. The plurality of carrier storage racks and the carrier transport mechanism are respectively mounted on at least one of the first loading block and the first processing block. Therefore, the plurality of carrier storage racks and the carrier transport mechanism may not be arranged to extend in the horizontal direction from the loading block, and the installation area extended in the horizontal direction can be reduced. That is, the occupied area of ​​the substrate processing device can be reduced.

[0035] [Effects of the Invention]

[0036] According to the substrate processing apparatus, the carrier transfer method and the carrier buffer device of the present invention, the occupied area of ​​the substrate processing apparatus can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Several embodiments currently considered to be preferred are shown in the drawings for the purpose of illustrating the invention, but it should be understood that the invention is not limited to the configurations and embodiments shown in the drawings.

[0038] Figure 1 This is a longitudinal sectional view of the substrate processing apparatus of Example 1.

[0039] Figure 2A is a cross-sectional view of the substrate processing apparatus of Example 1, Figure 2B It is a diagram showing an opening, a shutter member, and a shutter member driving mechanism.

[0040] Figure 3 It is a right side view of the substrate processing apparatus of Example 1.

[0041] Figure 4 It is a left side view of the substrate processing apparatus of Example 1.

[0042] Figure 5 It is a top view showing the carrier buffer device of Example 1.

[0043] Figure 6 It is a diagram showing a carrier transport mechanism.

[0044] Figure 7 It is a longitudinal sectional view of the substrate processing apparatus of Example 2.

[0045] Figure 8 It is a cross-sectional view of the substrate processing apparatus of Example 2.

[0046] Fig. 9 It is a right side view of the substrate processing apparatus of Example 2.

[0047] Fig.10 It is a left side view of the substrate processing apparatus of Example 2.

[0048] Fig.11 It is a top view showing the carrier buffer device of the second embodiment.

[0049] Fig.12 It is a longitudinal sectional view of the substrate processing apparatus of Example 3.

[0050] Fig.13 It is a cross-sectional view of the substrate processing apparatus of Example 3.

[0051] Fig.14 It is a right side view of the substrate processing apparatus of Example 3.

[0052] Fig.15 It is a top view showing the carrier buffer device of the third embodiment.

[0053] Fig.16 It is a top view of a carrier cushioning device showing a variation of the third embodiment.

[0054] Fig.17A is a partial front view showing the groove portion provided on the second loading block and the longitudinal portion on the groove portion, Fig. 17B This is a diagram showing a portion of the right side thereof.

[0055] Fig.18 This is a longitudinal sectional view of a substrate processing apparatus according to a fourth embodiment.

[0056] Fig.19 It is a cross-sectional view of a substrate processing apparatus according to a fourth embodiment.

[0057] Fig. 20It is a right side view of the substrate processing apparatus of Example 4.

[0058] Fig.21 It is a top view showing the carrier buffer device of the fourth embodiment.

[0059] Fig. 22 It is a diagram for explaining the structure and operation of the substrate processing apparatus according to a modified example.

[0060] Fig.23 It is a diagram for explaining the structure and operation of the substrate processing apparatus according to a modified example.

[0061] Fig.24 It is a diagram showing the arrangement of an opening mechanism (mounting table) according to a modified example.

[0062] Fig.25A 2 is a diagram showing the configuration of an opening mechanism (mounting table) according to a variation. Fig.25B This is a diagram showing a portion of the right side thereof.

[0063] Fig.26A 2 is a diagram showing the configuration of an opening mechanism (mounting table) according to a variation. Fig.26B This is a diagram showing a portion of the right side thereof.

[0064] Fig. 27 It is a diagram showing the arrangement of an opening mechanism (mounting table) according to a modified example.

[0065] Fig.28 It is a top view showing a carrier cushioning device according to a modified example.

[0066] Fig.29 FIG. 1 is a cross-sectional view showing a substrate processing apparatus according to a modified example. DETAILED DESCRIPTION

[0067] [Example 1]

[0068] Hereinafter, Embodiment 1 of the present invention will be described with reference to the drawings. Figure 1 This is a longitudinal sectional view of the substrate processing apparatus of Example 1. Figure 2A is a cross-sectional view of a substrate processing apparatus. Figure 3 It is a right side view of the substrate processing apparatus. Figure 4 is a left side view of the substrate processing device. Figure 2A As shown, the substrate mounting portion PS4A is disposed between the liquid processing portion 28 and the heat processing portion 29. Figure 3 , Figure 4 In the figure, for example, the substrate mounting portion PS4A is shown near the liquid processing portion 28 or the heat processing portion 29 for the purpose of explanation.

[0069] <Configuration of substrate processing apparatus 1>

[0070] Reference Figure 1 , Figure 2A The substrate processing apparatus 1 includes a first loading block (hereinafter referred to as “first ID block” as appropriate) 2 , a first processing block 3 , and a carrier buffer device 8 .

[0071] (Configuration of the first loading block 2)

[0072] The first ID block 2 has two opening mechanisms 9 and 10 (see Figure 2A ) and two substrate transfer mechanisms (robots) TM1, TM2. Two opening mechanisms (carrier placement parts) 9, 10 provided in the first ID block 2 are used to place carriers C, respectively.

[0073] The carrier C can store multiple (e.g., 25) substrates W in a horizontal position. The carrier C uses, for example, a FOUP (Front Open Unified Pod), but may also be a container other than a FOUP (e.g., a SMIF (Standard Mechanical Interface Face) box). The carrier C includes, for example, a carrier body having an opening for inserting and removing the substrates W, and a cover for covering the opening of the carrier body.

[0074] Each opening mechanism 9, 10 comprises: a stage 13 for placing the carrier C; an opening 14 for allowing the substrate W to pass through; a baffle member 16 (see Figure 2B ), opens and closes the opening 14 and attaches and detaches the cover to the carrier body; and a baffle member driving mechanism 18, drives the baffle member 16. The baffle member driving mechanism 18 includes an electric motor. In addition, after the cover is removed from the carrier body, the baffle member 16 moves, for example, downward or in the horizontal direction (Y direction) along the opening 14.

[0075] The mounting table 13 is disposed on the top platform of the processing block 3. Figure 1 As shown in the figure, the mounting table 13 is arranged at a position higher than the processing block 3, that is, above the processing block 3. The mounting table 13 can also be arranged on the processing block 3, that is, it can be arranged in contact with the upper surface of the processing block 3. In addition, the mounting table 13 is equivalent to the first carrier mounting table of the present invention. In addition, the ID block 2 and the first processing block 3 are equivalent to the substrate processing device body of the present invention.

[0076] The two substrate transport mechanisms TM1 and TM2 are respectively provided with two hands 21, an advance / retract drive unit 23, and an elevation / rotation drive unit 25. The two hands 21 respectively hold the substrate W. In addition, the two hands 21 are respectively movably mounted on the advance / retract drive unit 23. The advance / retract drive unit 23 can make both of the two hands 21 enter the carrier C at the same time. In addition, the advance / retract drive unit 23 can make the two hands 21 advance / retract respectively. Therefore, the advance / retract drive unit 23 can make one of the two hands 21 enter the carrier C.

[0077] The lifting and rotating driving unit 25 lifts and rotates the two hands 21 by lifting and rotating the advance and retreat driving unit 23. That is, the lifting and rotating driving unit 25 can move the advance and retreat driving unit 23 in the up and down direction (Z direction) and can rotate the advance and retreat driving unit 23 around the vertical axis AX1. The advance and retreat driving unit 23 and the lifting and rotating driving unit 25 each include an electric motor. In addition, the two substrate transport mechanisms TM1 and TM2 are fixed to the bottom of the first ID block 2 in a manner that they cannot move in the horizontal direction (especially the Y direction).

[0078] Between the first ID block 2 and the four processing layers 3A to 3D described below, there are provided four substrate placement parts PS1A to PS4A for conveyance and four substrate placement parts PS1B to PS4B for return. The eight substrate placement parts PS1A to PS4A and PS1B to PS4B may be capable of placing one substrate W or two or more substrates W. In addition, the substrate placement parts described below (for example, the substrate placement part PS11 or the placement and cooling part P-CP) may be capable of placing one substrate W or two or more substrates W.

[0079] The first substrate transport mechanism TM1 can transport a substrate W between the carrier C mounted on the opening mechanism 9 and the eight substrate mounting parts PS1A to PS4A, PS1B to PS4B. The second substrate transport mechanism TM2 can transport a substrate W between the carrier C mounted on the opening mechanism 10 and the eight substrate mounting parts PS1A to PS4A, PS1B to PS4B. In addition, the first substrate transport mechanism TM1 cannot take out or store a substrate W for the carrier C mounted on the opening mechanism 10. In addition, the second substrate transport mechanism TM2 cannot take out or store a substrate W for the carrier C mounted on the opening mechanism 9.

[0080] (Configuration of the First Processing Block 3)

[0081] The first processing block 3 is connected to the first ID block 2 in the horizontal direction. The first processing block 3 performs a coating process on the substrate W.

[0082] The first processing block 3 includes four processing layers 3A to 3D. The four processing layers 3A to 3D are arranged in a stacked manner in the vertical direction (Z direction). The four processing layers 3A to 3D are respectively provided with a third substrate transport mechanism TM3, a transport space 27, a liquid processing unit 28, and a heat treatment unit 29. The four processing layers 3A to 3D are configured to be identical to each other.

[0083] The third substrate transport mechanism TM3 transports the substrate W between the processing layers 3A to 3D. The third substrate transport mechanism TM3 includes two hands 31 , an advance / retract drive unit 32 , a rotation drive unit 33 , a first moving mechanism 34 , and a second moving mechanism 35 .

[0084] The two hands 31 hold the substrate W respectively. The two hands 31 are movably mounted on the advance / retract drive unit 32. The advance / retract drive unit 32 moves the two hands 31 forward / retract individually. The rotation drive unit 33 rotates the advance / retract drive unit 32 around the vertical axis AX2. Thus, the orientation of the two hands 31 can be changed. The first moving mechanism 34 rotates the rotation drive unit 33 in a Figure 1 The second moving mechanism 35 moves the first moving mechanism 34 in the front-rear direction (X direction). Thus, the advance-retract drive unit 32 can be moved in the X direction. The second moving mechanism 35 moves the first moving mechanism 34 in the up-down direction (Z direction). Thus, the advance-retract drive unit 32 can be moved in the Z direction.

[0085] Furthermore, the forward / retractable driving unit 32 , the rotation driving unit 33 , the first moving mechanism 34 , and the second moving mechanism 35 each include an electric motor.

[0086] like Figure 2A As shown, the third substrate transfer mechanism TM3 is provided in the transfer space 27. The transfer space 27 is configured to extend linearly in the horizontal direction (X direction). The liquid processing unit 28 and the heat processing unit 29 are arranged so as to sandwich the transfer space 27.

[0087] Figure 3 1 is a right side view showing the configuration of the liquid treatment unit 28 of the first processing block 3. The four coating processing layers 3A to 3D are respectively provided with four liquid treatment units 28. The four liquid treatment units 28 are arranged in a manner of 4 columns x 1 layer, which is 4 columns in the horizontal direction and 1 layer in the vertical direction. Two liquid treatment units 28 on the side of the first ID block 2 among the four liquid treatment units 28 are coating units BARC. In addition, the other two liquid treatment units 28 are coating units RESIST. The coating unit BARC forms an antireflection film on the substrate W. The coating unit RESIST forms a resist film such as a photoresist on the substrate W.

[0088] like Figure 2AAs shown in FIG. 2 , the liquid processing unit 28 includes a holding and rotating unit 37, a nozzle 38, and a nozzle moving mechanism 39. The holding and rotating unit 37 holds the lower surface of the substrate W by vacuum adsorption, for example, and rotates the held substrate W around a vertical axis (Z direction). The rotation is performed by, for example, an electric motor. The nozzle 38 supplies a coating liquid (for example, a liquid for forming an antireflective film or a photoresist liquid) to the substrate W. The nozzle moving mechanism 39 moves the nozzle 38 to an arbitrary position. The nozzle moving mechanism 39 includes, for example, an electric motor.

[0089] Figure 4 3 is a left side view showing the arrangement of the liquid processing unit 28 of the first processing block 3. Each processing layer 3A to 3D includes a plurality of heat treatment units 29. The heat treatment unit 29 performs heat treatment and includes a plate 41 (see FIG. 4 ) on which the substrate W is placed. Figure 2A The flat plate 41 is heated by, for example, a heater, and the flat plate 41 is cooled by, for example, a water-cooling mechanism.

[0090] In the four treatment layers 3A to 3D, the heat treatment parts 29 are configured to be arranged in 5 rows x 3 layers. Figure 4 In the embodiment, the four processing layers 3A to 3D are respectively provided with 14 heat treatment units 29. That is, the four processing layers 3A to 3D are respectively provided with 3 close contact strengthening processing units PAHP, 2 cooling units CP and 9 heating and cooling units PHP. In addition, for example, in the first processing block 3, the number and type of processing units other than the liquid processing unit 28 and the heat treatment unit 29 can be appropriately changed. For example, the processing unit can also include an edge exposure unit EEW for performing exposure processing on the peripheral portion of the substrate W.

[0091] The adhesion enhancing treatment section PAHP improves the adhesion between the substrate W and the anti-reflection film by applying an adhesion enhancing agent such as hexamethyldisilazane (HMDS) on the substrate W and heating it. The adhesion enhancing treatment section PAHP also has the function of cooling the substrate W after heating. The cooling section CP cools the substrate W. The heating and cooling section PHP performs heating treatment and cooling treatment in sequence.

[0092] (Carrier buffer device 8)

[0093] The carrier buffer device 8 is mounted on the first ID block 2 and the processing block 3, for example. Figure 5 As shown, the carrier buffer device 8 includes a carrier conveying mechanism 51 and a carrier storage rack 53 .

[0094] Reference Figure 6 . Figure 6: is a diagram showing a carrier transport mechanism 51. The carrier transport mechanism 51 includes two multi-joint arms 61 and 62. A holding portion 63 is provided at one end of the first multi-joint arm 61, and a holding portion 64 is provided at one end of the second multi-joint arm 62. In addition, the other end of the first multi-joint arm 61 is supported on a pillar-shaped lifting drive portion 65 so as to be movable in the vertical direction, and the other end of the second multi-joint arm 62 is supported on the lifting drive portion 65 so as to be movable in the vertical direction.

[0095] The two holding parts 63 and 64 are respectively configured to hold, for example, a protrusion provided on the upper surface of the carrier C. The two holding parts 63 and 64 are respectively provided with an electric motor.

[0096] The two multi-joint arms 61 and 62 are respectively provided with one or more electric motors. The first multi-joint arm 61 is configured to enable the first holding portion 63 to be driven to rotate 360 ​​degrees around the vertical axis AX3. The first multi-joint arm 61, for example, has three arm parts 61A to 61C, and the arm part 61A is supported by the following lifting drive part 65 so as to be able to be raised and lowered. The two arm parts 61A and 61B are connected so as to be able to rotate around the vertical axis AX4. In addition, the two arm parts 61B and 61C are connected so as to be able to rotate around the vertical axis AX5. The second multi-joint arm 62 is configured in the same manner as the first multi-joint arm 61. The first multi-joint arm 61, for example, may also be responsible for Figure 5 The second multi-jointed arm 62 is responsible for transporting the upper carrier C. Figure 5 Transportation of carrier C on the lower side.

[0097] The lifting drive unit 65 is configured to enable the two multi-joint arms 61 and 62 to be lifted and lowered individually. Therefore, the first multi-joint arm 61 can be moved to a position higher than the second multi-joint arm 62, or the first multi-joint arm 61 can be moved to a position lower than the second multi-joint arm 62. The lifting drive unit 65 includes an electric motor. The lifting drive unit 65 can also include, for example, a belt and a plurality of pulleys for one multi-joint arm. In addition, the lifting drive unit 65 can also be configured to enable the two multi-joint arms 61 and 62 to be lifted and lowered integrally.

[0098] The front-rear drive unit 67 includes a support portion 67A that supports the lifting drive unit 65, a longitudinal portion 67B that extends long in the front-rear direction (X direction), and an electric motor (not shown). For example, the longitudinal portion 67B may be a track (guide rail), and the support portion 67A may be a trolley. In this case, the trolley (support portion 67A) may be moved along the track (longitudinal portion 67B) by using an electric motor.

[0099] In addition, for example, an electric motor, a plurality of pulleys, a belt, and a guide rail may be built into the longitudinal portion 67B, and the support portion 67A may be fixed to the belt. In this case, the pulley may be rotated by the electric motor to move the belt hung on the plurality of pulleys, thereby moving the support portion 67A along the guide rail. In addition, for example, an electric motor, a screw rod, and a guide rail may be built into the longitudinal portion 67B, and a nut portion meshing with the screw rod may be provided on the support portion 67A. In this case, the support portion 67A may be moved along the guide rail by rotating the screw rod using the electric motor.

[0100] The front-rear drive unit 67 can expand the carrier transport range of the carrier transport mechanism 51 , and the wider the carrier transport range, the more carrier storage racks 53 can be installed.

[0101] Return to Figure 5 The carrier storage rack 53 has an input port 71, an output port 72, an unprocessed substrate carrier rack 73, an empty carrier rack 74, and a processed substrate carrier rack 75. The input port 71 is a rack for receiving a carrier C containing an unprocessed substrate W from an external transport mechanism OHT (Overhead Hoist Transport). The external transport mechanism OHT transports the carrier C within the factory. The so-called unprocessed means that in this embodiment, no processing using the first processing block 3 has been performed. As shown in FIG. Figure 1 , Figure 5 As shown, the input port 71 is provided on the first ID block 2, that is, on the top platform of the first ID block 2. A rail 77 of an external transport mechanism OHT is provided above the first ID block 2. The external transport mechanism OHT transports the carrier C to one of the two input ports 71.

[0102] The unprocessed substrate carrier rack 73 is for placing the unprocessed substrates C, that is, it is placed on the input port 71 and contains unprocessed substrates W that cannot be transferred to either of the two loading tables 13. The empty carrier rack 74 is for placing the carriers C whose substrates W have all been taken out and placed on the loading table 13. The processed substrate carrier rack 75 is for placing the unprocessed substrates C, that is, it contains processed substrates W and cannot be transferred to either of the two output ports 72. The so-called processed means that the substrates have been processed by the first processing block 3 in the first embodiment.

[0103] The output port 72 is a rack for delivering the carrier C containing the processed substrate W to the external transport mechanism OHT. Figure 1 , Figure 5 As shown, the output port 72 is provided on the first ID block 2, that is, on the top platform of the first ID block 2. The carrier transport mechanism 51 can freely move the carrier C between the mounting table 13 and each of the racks 71 to 75.

[0104] In addition, the carrier transport mechanism 51 has two sets of multi-joint arms and holding parts, but may also have one or more than three sets of multi-joint arms and holding parts. In addition, the lifting drive unit 65 may also be configured to be rotationally driven around a vertical axis relative to the support portion 67A. In addition, the track 77 may also pass through a position other than above the first ID block 2. In this case, an input port 71 and an output port 72 are provided at a position on the device 1 above the device 1 through which the external transport mechanism OHT passes. In addition, the track 77 of the external transport mechanism OHT may also be configured to pass above the substrate processing device 1 more than twice. For example, the carrier transport mechanism 51 may also be arranged on the first processing block 3 with several layers interposed therebetween. The number and type of the carrier storage racks 53 may be appropriately changed.

[0105] In addition, if Figure 2A As shown, the substrate processing device 1 includes one or more control units 79 and an operating unit 80. The control unit 79 includes, for example, a central processing unit (CPU). The control unit 79 controls each component of the substrate processing device 1. The operating unit 80 includes a display unit (for example, a liquid crystal display), a storage unit, and an input unit. The storage unit includes, for example, at least one of a ROM (Read-Only Memory), a RAM (Random-Access Memory), and a hard disk. The input unit includes at least one of a keyboard, a mouse, a touchpad, and various buttons. The storage unit stores various conditions for substrate processing and action programs required for controlling the substrate processing device 1. In addition, in Figure 2A The space SP of the first ID block 2 shown may also be provided with a circuit substrate including, for example, a control unit 79. In addition, in the space SP, a reversing unit for reversing the substrate W (the front and back surfaces of the substrate W) may be provided in addition to the circuit substrate, or the reversing unit may be provided separately.

[0106] <Operation of substrate processing apparatus 1>

[0107] Next, the operation of the substrate processing apparatus 1 will be described. Figure 5 Next, the operation of the carrier transport mechanism 51 will be described. In addition, for example, the opening mechanism 10 is used to take out the substrate W from the carrier C, and the opening mechanism 9 is used to move the substrate W back to the carrier C.

[0108] (Step S01) The carrier C is conveyed from the input port 71 to the opening mechanism 10.

[0109] The external transport mechanism OHT moves along the rail 77 to transport the carrier C storing the unprocessed substrate W to one of the two input ports 71. The carrier transport mechanism 51 moves the carrier C transported to the input port 71 to the mounting table 13 of the opening mechanism 10. When the carrier C cannot be transported to the mounting table 13 of the opening mechanism 10, the carrier transport mechanism 51 transports the carrier C from the input port 71 to any one of the four unprocessed substrate carrier racks 73. In addition, when the carrier C cannot be transported to any one of the four unprocessed substrate carrier racks 73, the carrier C is placed on standby at the input port 71. In addition, basically, the substrates W stored in the carrier C in the order in which they are transported to the input port 71 are processed by the first processing block 3.

[0110] (Step S02) Carrier C is transferred from the opening mechanism 10 to the opening mechanism 9.

[0111] The second substrate transfer mechanism TM2 of the first ID block 2 takes out a substrate W from the carrier C transferred to the mounting table 13 of the opening mechanism 10, and transfers the taken-out substrate W to the first processing block 3. The empty carrier C from which all the substrates W are taken out is transferred to the mounting table 13 of the opening mechanism 9 by the carrier transfer mechanism 51. When the empty carrier C cannot be transferred to the mounting table 13 of the opening mechanism 9, the carrier transfer mechanism 51 transfers the carrier C to any one of the four empty carrier racks 74. In addition, when the empty carrier C cannot be transferred to any one of the empty carrier racks 74, the empty carrier C is placed on standby on the mounting table 13 of the opening mechanism 10.

[0112] (Step S03) The carrier C is transported from the opening mechanism 9 to the output port 72.

[0113] The first substrate transfer mechanism TM1 of the first ID block 2 stores the substrates W processed in the processing block 3 in the carrier C transferred to the mounting table 13 of the opening mechanism 9. The carrier C storing all the substrates W is transferred to one of the two output ports 72 by the carrier transfer mechanism 51. When the carrier C cannot be transferred to any of the two output ports 72, the carrier transfer mechanism 51 transfers the carrier C from the mounting table 13 of the opening mechanism 9 to any of the four processed substrate carrier racks 75. In addition, when the carrier C cannot be transferred to any of the four processed substrate carrier racks 75, the carrier C is placed on standby on the mounting table 13 of the opening mechanism 9.

[0114] Thereafter, the external transport mechanism OHT moves along the rails 77 to transport the carrier C storing the processed substrates W from one of the two output ports 72 to the next destination.

[0115] Next, the overall operation of the substrate processing apparatus 1 will be described. Figure 1The external transport mechanism OHT transports the carrier C to the input port 71 provided on the first ID block 2. The carrier transport mechanism 51 transports the carrier C from the input port 71 to the mounting table 13 of the opening mechanism 10. The shutter portion of the opening mechanism 10 opens the opening 14 while removing and holding the cover of the carrier C.

[0116] (Step S11) First ID Block 2

[0117] The first ID block 2 takes out a substrate W from a carrier C mounted on a mounting table 13 of the opening mechanism 10, and transports the taken-out substrate W to any one of the four processing layers 3A to 3D. For example, the second substrate transport mechanism TM2 takes out a substrate W from a carrier C mounted on a mounting table 13 of the opening mechanism 10. The second substrate transport mechanism TM2 transports the taken-out substrate W to the substrate mounting portion PS1A. In addition, the second substrate transport mechanism TM2 transports the taken-out substrate W to, for example, the processing layers 3A to 3D substantially evenly.

[0118] When all the substrates W are taken out from the carrier C, the opening mechanism 10 closes the opening 14 with the shutter portion while attaching the cover to the carrier C. Thereafter, the carrier transport mechanism 51 replaces the empty carrier C after the substrates W are taken out with another carrier C storing unprocessed substrates W. Then, the empty carrier C is transported to, for example, the mounting table 13 of the opening mechanism 9. When the empty carrier C cannot be transported to the opening mechanism 9, the carrier transport mechanism 51 transports the empty carrier C to any one of the four empty carrier racks 74.

[0119] (Step S12) First Processing Block 3

[0120] Each of the processing layers 3A to 3D of the first processing block 3 performs coating processing on the conveyed substrate W, and returns the substrate W subjected to the coating processing to the first ID block 2. This will be described in detail.

[0121] For example, in the processing layer 3A of the processing block 3, the third substrate transport mechanism TM3 receives the substrate W from the substrate mounting portion PS1A. The third substrate transport mechanism TM3 transfers the received substrate W according to Figure 3 or Figure 4 The substrate W formed with an anti-reflection film by the coating unit BARC is transported in the order of the close contact strengthening treatment unit PAHP, the cooling unit CP, and the coating unit BARC shown in the figure. Afterwards, the third substrate transport mechanism TM3 transports the substrate W formed with an anti-reflection film by the coating unit BARC in the order of the heating and cooling unit PHP, the cooling unit CP, the coating unit RESIST, and the heating and cooling unit PHP. Afterwards, the third substrate transport mechanism TM3 transports the substrate W formed with a resist film by the coating unit RESIST to the substrate loading unit PS1B. In addition, the processing layers 3B to 3D perform coating processing on the transported substrate W in the same manner as the processing layer 3A.

[0122] (Step S13) First ID Block 2

[0123] The first ID block 2 stores the substrate W processed by any of the processing layers 3A to 3D in the carrier C placed on the stage 13 of the opening mechanism 9. The following is a specific description. The carrier C on the stage 13 is in a state where the opening 14 is opened by the opening mechanism 9. The first substrate transport mechanism TM1 receives the substrate W from the substrate placement unit PS1B, for example, and moves the received substrate W back to the carrier C placed on the stage 13 of the opening mechanism 9. In addition, the substrate W is moved back to the carrier C where it was stored before the coating process was performed. That is, the substrate W is moved back to the original carrier C.

[0124] After all processed substrates W are stored in the carrier C, the opening mechanism 9 closes the opening 14 while attaching the cover to the carrier C. The carrier transport mechanism 51 transports the carrier C storing the processed substrates W from the mounting table 13 of the opening mechanism 9 to the export port 72. Thereafter, the external transport mechanism OHT transports the carrier C from the export port 72 to the next destination.

[0125] According to the present embodiment, the carrier transport mechanism 51 transports the carrier C between the loading tables 13 of the two opening mechanisms 9 and 10 and the plurality of carrier storage racks 53. The plurality of carrier storage racks 53 and the carrier transport mechanism 51 are respectively mounted on the first processing block 3. Therefore, it is not necessary to horizontally extend the plurality of carrier storage racks 53 and the carrier transport mechanism 51 from the loading block as in the past, and the horizontally extended installation area can be reduced. That is, the occupied area of ​​the substrate processing apparatus 1 can be reduced.

[0126] The mounting tables 13 of the two opening mechanisms 9 and 10 are provided at a position higher than the upper surface of the first processing block 3. The carrier transport mechanism 51 mounted on the first processing block 3 can easily transport the carrier C mounted on the mounting table 13.

[0127] In addition, the mounting table 13 of the two opening mechanisms 9 and 10 is provided above the first processing block 3. Therefore, the mounting table 13 can be directed toward the carrier transport mechanism 51. Thus, the carrier transport mechanism 51 can easily transport the carrier C mounted on the mounting table 13. In addition, it is possible to prevent the mounting table 13 from protruding from the ID block 2 when viewed from above, so that the occupied area of ​​the substrate processing apparatus 1 can be further reduced.

[0128] The substrate processing apparatus 1 includes an opening 14 for allowing a substrate W to pass through a carrier C placed on a mounting table 13, a shutter member 16 for opening and closing the opening 14, and a shutter member driving mechanism 18 for moving the shutter member 16 in a horizontal direction along the opening 14. A space for arranging a substrate mounting unit, for example, can be secured in a region below the opening 14.

[0129] [Example 2]

[0130] Next, Embodiment 2 of the present invention will be described with reference to the drawings. Note that descriptions overlapping with Embodiment 1 will be omitted.

[0131] The substrate processing apparatus 1 of the first embodiment includes a first ID block 2 and a first processing block 3. In contrast, the substrate processing apparatus 1 of the second embodiment includes a second processing block 5 and an interface block (hereinafter referred to as "IF block") 6 in addition to the first ID block 2 and the first processing block 3.

[0132] Figure 7 It is a longitudinal sectional view of the substrate processing apparatus 1 of the second embodiment. Figure 8 is a cross-sectional view of the substrate processing apparatus 1 . Fig. 9 It is a right side view of the substrate processing apparatus 1 . Fig.10 It is a left side view of the substrate processing apparatus 1 .

[0133] Reference Figure 7 , Figure 8 The second processing block 5 is connected to the first processing block 3 in the horizontal direction. The first processing block 3 performs a coating process as a first process, and the second processing block 5 performs a developing process as a second process.

[0134] The first processing block 3 includes an upper coating processing layer 3A and a lower coating processing layer 3B. In addition, the second processing block 5 includes an upper developing processing layer 5A and a lower developing processing layer 5B. The four processing layers 3A, 3B, 4A, and 4B are respectively provided with a third substrate transport mechanism TM3, a transport space 27 (see Figure 2A , Figure 8 ), liquid treatment section 28 and heat treatment section 29.

[0135] exist Figure 7 In the figure, two substrate mounting parts PS11 and PS12 are provided between the first ID block 2 and the two coating treatment layers 3A and 3B. A substrate mounting part PS13 is provided between the upper coating treatment layer 3A and the developing treatment layer 5A, and a substrate mounting part PS14 is provided between the lower coating treatment layer 3B and the developing treatment layer 5B. In addition, two substrate mounting parts PS15 and PS17 and a mounting and cooling part P-CP2 are provided between the upper developing treatment layer 5A and the IF block 6, and two substrate mounting parts PS16 and PS18 and a mounting and cooling part P-CP3 are provided between the lower developing treatment layer 5B and the IF block 6.

[0136] like Fig. 9 As shown, the four liquid processing units 28 of the first processing block 3 are arranged in two rows in the horizontal direction and in two layers in the vertical direction in two rows×two layers.

[0137] (Configuration of the Second Processing Block 5)

[0138] like Fig. 9 As shown, the two development processing layers 5A and 5B each include three liquid processing units 28. The three liquid processing units 28 are arranged in 3 rows x 1 layer. The three liquid processing units 28 are development units DEV. The development unit DEV develops the substrate W after exposure.

[0139] In addition, if Fig.10 As shown in FIG. 1 , in the two development processing layers 5A and 5B, the heat treatment unit 29 is configured to be arranged in 4 rows × 5 layers. The two development processing layers 5A and 5B are respectively provided with 1 cooling unit CP, 12 heating and cooling units PHP and an edge exposure unit EEW. The edge exposure unit EEW performs exposure processing on the peripheral portion of the substrate W. In addition, the number and type of units other than the liquid processing unit 28 and the heat treatment unit 29 can be appropriately changed.

[0140] (Interface block (IF block) 6)

[0141] The IF block 6 is connected to the second processing block 5 in the horizontal direction. The IF block 6 is also called the second ID block. The IF block 6 carries in and carries out the substrate W for the exposure device EXP that performs the exposure processing as the third processing. The IF block 6 includes three substrate transport mechanisms TM4 to TM6, a plurality of pre-exposure cleaning units 161, a plurality of post-exposure cleaning units 162, 12 heating and cooling units PHP (PEB), three placement and cooling units P-CP, and a substrate placement unit PS9. In addition, two opening mechanisms 45 and 46 are provided on the IF block 6 (see Figure 8 ).

[0142] The fourth substrate transport mechanism TM4 and the fifth substrate transport mechanism TM5 are arranged in a manner that they are aligned in the Y direction orthogonal to the front-rear direction (X direction). The sixth substrate transport mechanism TM6 is arranged behind the two substrate transport mechanisms TM4 and TM5 ( Figure 7 on the right side of the substrate W). The pre-exposure cleaning unit 161 and the post-exposure cleaning unit 162 are arranged in a manner opposing each other with two substrate transport mechanisms TM4 and TM5 interposed therebetween. The pre-exposure cleaning unit 161 cleans and dries the substrate W before the exposure process. The post-exposure cleaning unit 162 cleans and dries the substrate W after the exposure process. Each of the cleaning units 161 and 162 includes: a holding rotating unit that holds the substrate W; and a nozzle that sprays, for example, a cleaning liquid and a rinse liquid onto the substrate W. In addition, each of the cleaning units 161 and 162 can also polish the back side and end portion (inclined portion) of the substrate W using a brush or the like. In addition, the back side of the substrate W refers to, for example, the surface on the opposite side of the surface on which the circuit pattern is formed.

[0143] Three placement and cooling parts P-CP and a substrate placement part PS9 are provided between the three substrate transfer mechanisms TM4 to TM6. The three placement and cooling parts P-CP and the substrate placement part PS9 are arranged in the up-down direction.

[0144] The fourth substrate transport mechanism TM4 can transport the substrate W between the five substrate mounting parts PS15 to PS18, PS9, the five mounting and cooling parts P-CP, P-CP2, P-CP3, the pre-exposure cleaning unit 161, the heating and cooling part PHP, and the carrier C mounted on the opening mechanism 45. In addition, the fourth substrate transport mechanism TM4 cannot transport the substrate W to the carrier C mounted on the opening mechanism 46 and the post-exposure cleaning unit 162.

[0145] The fifth substrate transport mechanism TM5 can transport the substrate W between the five substrate mounting parts PS15 to PS18, PS9, the five mounting and cooling parts P-CP, P-CP2, P-CP3, the post-exposure cleaning unit 162, the heating and cooling part PHP, and the carrier C mounted on the opening mechanism 46. In addition, the fifth substrate transport mechanism TM5 cannot transport the substrate W to the carrier C mounted on the opening mechanism 45 and the pre-exposure cleaning unit 161.

[0146] The sixth substrate transport mechanism TM6 can transport the substrate W between the substrate mounting portion PS9, three mounting and cooling portions P-CP, and the external exposure apparatus EXP. The three substrate transport mechanisms TM4 to TM6 are respectively configured substantially the same as the first substrate transport mechanism TM1, for example, and thus their description is omitted.

[0147] The two opening mechanisms 45 and 46 provided on the IF block 6 are respectively provided for placing the carrier C. The two opening mechanisms 45 and 46 are respectively provided with: a placing table 47 for placing the carrier C; an opening 48 for allowing the substrate W to pass through; a shutter member (not shown) for opening and closing the opening 48 and attaching and detaching the cover of the carrier body; and a shutter member driving mechanism (not shown) for driving the shutter member. The shutter member driving mechanism is provided with an electric motor.

[0148] The mounting platform 47 of the two opening mechanisms 45 and 46 is provided on the top platform of the second processing block 5. Figure 1 In the embodiment, the mounting table 47 is provided at a position higher than the second processing block 5, that is, above the second processing block 5. The mounting table 47 may also be provided on the second processing block 5, that is, provided in contact with the second processing block 5. In addition, the mounting table 47 is equivalent to the second carrier mounting table of the present invention.

[0149] (Carrier buffer device 8)

[0150] like Fig.11As shown, the carrier buffer device 8 is mounted on, for example, the first ID block 2 and the two processing blocks 3 and 5. Alternatively, the carrier buffer device 8 may be mounted on at least one of the first ID block 2, the two processing blocks 3 and 5, and the IF block 6.

[0151] exist Fig.11 In the embodiment, the carrier transport mechanism 51 includes: two multi-joint arms 61, 62, each of which is provided with a holding portion 63, 64; driving portions 65, 67, which support the two multi-joint arms 61, 62; and a longitudinal portion 67B, which is mounted on the two processing blocks 3, 5. The driving portions 65, 67 are configured to move the two holding portions 63, 64 and the two multi-joint arms 61, 62 along the longitudinal portion 67B. In addition, the longitudinal portion 67B corresponds to the guide rail of the present invention.

[0152] <Operation of substrate processing apparatus 1>

[0153] Next, the operation of the substrate processing apparatus 1 of this embodiment will be described. For example, the two opening mechanisms 9 and 10 are used to take out the substrate W from the carrier C, and the two opening mechanisms 45 and 46 are used to return the substrate W to the carrier C.

[0154] (Step S21) 1st ID block 2

[0155] The carrier transport mechanism 51 transports the carrier C from the input port 71 to, for example, the mounting table 13 of the opening mechanism 9. The first substrate transport mechanism TM1 of the first ID block 2 takes out the substrate W from the carrier C mounted on the mounting table 13 of the opening mechanism 9, and transports the taken-out substrate W to one of the two coating processing layers 3A and 3B of the first processing block 3. For example, the first substrate transport mechanism TM1 transports the substrate W taken out from the carrier C to the substrate mounting portion PS11.

[0156] When all the substrates W are taken out from the carrier C, the carrier transport mechanism 51 transports the empty carrier C from the mounting table 13 to, for example, the mounting table 47 of the opening mechanism 45 .

[0157] (Step S22) First Processing Block 3

[0158] The first processing block 3 performs coating processing on the substrate W transported from the first ID block 2, and transports the substrate W subjected to coating processing to the second processing block 5. The operation of this step is substantially the same as step S12 of the first embodiment, so the description of this step is omitted. The third substrate transport mechanism TM3 transports the substrate W subjected to coating processing by the coating processing layer 3A to the substrate mounting portion PS13.

[0159] (Step S23) Second Processing Block 5

[0160] The second processing block 5 does not perform a development process on the substrate W that has been subjected to the coating process, but transports the substrate W transported from the coating process layer 3A of the first processing block 3 to the IF block 6. That is, in the upper development process layer 5A, the third substrate transport mechanism TM3 receives the substrate W from the substrate mounting portion PS13 and transports the received substrate W to the substrate mounting portion PS15.

[0161] (Step S24) IF block 6

[0162] The IF block 6 carries out the substrate W conveyed from the second processing block 5 to the exposure device EXP. Then, the IF block 6 carries in the exposed substrate W from the exposure device EXP and conveys the exposed substrate W to, for example, the upper development processing layer 5A of the second processing block 5. This will be described in detail.

[0163] In the IF block 6, for example, the fourth substrate transport mechanism TM4 receives the substrate W from the substrate placement part PS15, and transports the received substrate W in the order of the pre-exposure cleaning unit 161 and the placement and cooling part P-CP. The sixth substrate transport mechanism TM6 transports the substrate W from the placement and cooling part P-CP to the exposure device EXP. The exposure device EXP exposes the transported substrate W.

[0164] The sixth substrate transport mechanism TM6 transports the substrate W exposed by the exposure device EXP from the exposure device EXP to the substrate mounting portion PS9. For example, the fifth substrate transport mechanism TM5 receives the substrate W from the substrate mounting portion PS9 and transports the received substrate W to the post-exposure cleaning unit 162.

[0165] Afterwards, in Figure 8In the case of the configuration of , the fifth substrate transport mechanism TM5 directly transports the substrate W to the heating and cooling part PHP of the second processing block 5. The entry and exit of the second processing block 5 to the heating and cooling part PHP only utilizes the fifth substrate transport mechanism TM5 (basic operation). In this case, the post-exposure cleaning unit 162 is fixed (configured) on the side of the fifth substrate transport mechanism TM5, and the pre-exposure cleaning unit 161 is fixed on the side of the fourth substrate transport mechanism TM. After the substrate W is processed by the heating and cooling part PHP of the second processing block 5, the third substrate transport mechanism TM3 enters and exits the heating and cooling part PHP and transports the substrate W to the developing unit DEV. Therefore, in the basic operation, the fifth substrate transport mechanism TM5 directly transports the substrate W to the heating and cooling part PHP of the developing block 5 without passing through the placement and cooling part P-CP2. However, when a failure occurs, the fifth substrate transport mechanism TM5 moves the substrate W out of the heating and cooling part PHP and transports it to the substrate placement part PS15 or the placement and cooling part P-CP2. Then, the third substrate transport mechanism TM3 transports the substrate W to the developing unit DEV. On the other hand, as an optional operation, when the substrate W is transported to the heating and cooling part PHP via the substrate loading part PS15 or the loading and cooling part P-CP2, the pre-exposure cleaning unit 161 and the post-exposure cleaning unit 162 may be configured on both sides (the fourth substrate transport mechanism TM4 side and the fifth substrate transport mechanism TM5 side) (for example, refer to Fig.13 post-exposure cleaning unit 162).

[0166] (Step S25) Second Processing Block 5

[0167] The second processing block 5 performs a development process on the exposed substrate W, and moves the developed substrate W back to the IF block 6. For example, in the development processing layer 5A, the third substrate transport mechanism TM3 receives the substrate W from the heating and cooling part PHP, and transports the received substrate W in the order of the developing unit DEV, the heating and cooling part PHP, and the substrate placement part PS17.

[0168] (Step S26) IF block 6

[0169] The IF block 6 moves the substrate W that has been subjected to the development process back to the carrier C placed on the stage 47 of the opening mechanism 45. The fourth substrate transport mechanism TM4 receives the substrate W from the substrate mounting portion PS17 and moves the received substrate W back to the carrier C placed on the stage 47 of the opening mechanism 45. In addition, the substrate W is moved back to the carrier C where it was stored before the coating and development process. In addition, when the substrate W is moved back to the carrier C placed on the stage 47 of the opening mechanism 46, the fifth substrate transport mechanism TM5 is used.

[0170] After all processed substrates W are stored in the carriers C, the carrier transport mechanism 51 transports the carriers C storing the processed substrates W from the mounting table 47 of the opening mechanism 45 to the carry-out port 72 .

[0171] like Figure 7 As shown, the first ID block 2, the first processing block 3, the second processing block 5 and the IF block 6 are arranged in sequence. The first ID block 2 is provided with a carrier 13, and the IF block 6 is provided with a carrier 47. In the past, only the first ID block 2 was provided with a carrier carrier. Therefore, in both the outward and return paths, the substrate W is transported between the first ID block 2 and the IF block 6. According to the present invention, in the return path, the substrate W is not transported from the IF block 6 to the first ID block 2, but the substrate W processed by the second processing block 5 is moved back to the IF block 6. Therefore, in the return path, the transport process performed by the first processing block 3 is reduced by one process. By reducing one process, other transport processes can be performed. As a result, the overall processing capacity of the substrate W processing device 1 can be increased.

[0172] According to the present embodiment, two processing blocks 3 and 5 are arranged between the first ID block 2 and the IF block (second ID block) 6. In such a substrate processing apparatus 1, the footprint of the substrate processing apparatus 1 can be reduced.

[0173] In addition, in the present embodiment, the substrate W is taken out from the carrier C of the stage 13, and after a specific process is performed in the two processing blocks 3 and 5, the substrate W is moved back to the carrier C of the stage 47. This point may be reversed. That is, the substrate W may be taken out from the carrier C of the stage 47, and after a specific process is performed in the two processing blocks 3 and 5, the substrate W is moved back to the carrier C of the stage 13. In this case, the first processing block 3 may perform a developing process, and the second processing block 5 may perform a coating process. In addition, the fifth substrate transport mechanism TM5 directly transports the substrate W to the heating and cooling part PHP of the second processing block 5. In this regard, the fifth substrate transport mechanism TM5 may transport the substrate W to a substrate mounting part such as the substrate mounting part PS15, and the third substrate transport mechanism TM3 may transport the substrate W from the substrate mounting part to the heating and cooling part PHP.

[0174] The mounting tables 47 of the two opening mechanisms 45 and 46 are provided at a position higher than the upper surfaces of the first and second processing blocks 3 and 5. The carrier transport mechanism 51 mounted on the first and second processing blocks 3 and 5 can easily transport the carrier C mounted on the mounting tables 47.

[0175] [Example 3]

[0176] Next, Embodiment 3 of the present invention will be described with reference to the drawings. Note that descriptions overlapping with Embodiments 1 and 2 will be omitted.

[0177] The substrate processing apparatus 1 of the second embodiment includes the first ID block 2, the first processing block 3, the second processing block 5, and the IF block 6. In contrast, the substrate processing apparatus 1 of the third embodiment includes the first ID block 2, the first processing block 3, the second ID block 4, the second processing block 5, and the IF block 6.

[0178] Fig.12 It is a longitudinal sectional view of the substrate processing apparatus 1 of the third embodiment. Fig.13 is a cross-sectional view of the substrate processing apparatus 1 . Fig.14 It is a right side view of the substrate processing apparatus 1. In the substrate processing apparatus 1 of the third embodiment, the two opening mechanisms 45 and 46 are not provided in the IF block 6 but are provided in the second ID block 4.

[0179] (Configuration of the Second Loading Block 4)

[0180] like Fig.12 , Fig.13 As shown, the second ID block 4 is connected to the first processing block 3, and the second processing block 5 is connected to the second ID block 4. That is, the second ID block 4 is arranged between the two processing blocks 3 and 5.

[0181] The second ID block 4 has two opening mechanisms 45 and 46 (see Fig.13 , Fig.15 ) and two substrate transfer mechanisms TM7, TM8. Two opening mechanisms 45, 46 provided in the second ID block 4 are provided with carriers C capable of storing a plurality of substrates W, respectively.

[0182] Each opening mechanism 45, 46 has the same as the opening mechanism 9: a loading table 47 for loading the carrier C; an opening portion 48 for allowing the substrate W to pass through; a baffle member (not shown) for opening and closing the opening portion 48 and loading and unloading the cover of the carrier body; and a baffle member driving mechanism for driving the baffle member.

[0183] The mounting table 47 is provided on the top platform of the first processing block 3. Fig.12 In the embodiment, the mounting table 47 is arranged at a position higher than the first processing block 3, that is, above the first processing block 3. The mounting table 47 may also be arranged on the first processing block 3, that is, in contact with the first processing block 3. The mounting table 47 (opening mechanisms 45, 46) may also be arranged above the second processing block 5 instead of above the first processing block 3.

[0184] The two substrate transport mechanisms TM7 and TM8 are configured, for example, in the same manner as the first substrate transport mechanism TM1. The seventh substrate transport mechanism TM7 can transport a substrate W between the substrate mounting portions PS13, PS14, PS21 to PS24 and the carrier C of the opening mechanism 45. On the other hand, the eighth substrate transport mechanism TM8 can transport a substrate W between the substrate mounting portions PS13, PS14, PS21 to PS24 and the carrier C of the opening mechanism 46.

[0185] In addition, Fig.12 In the embodiment, a substrate loading section PS21 for conveyance and a substrate loading section PS23 for return are provided between the second ID block 4 and the upper development processing layer 5A. In addition, a substrate loading section PS22 for conveyance and a substrate loading section PS24 for return are provided between the second ID block 4 and the lower development processing layer 5B. Furthermore, a substrate loading section PS25 for conveyance and a loading and cooling section P-CP2 for return are provided between the upper development processing layer 5A and the IF block 6. In addition, a substrate loading section PS26 for conveyance and a loading and cooling section P-CP3 for return are provided between the lower development processing layer 5B and the IF block 6.

[0186] (Carrier buffer device 8)

[0187] Fig.15 The carrier buffer device 8 shown is mounted on the first ID block 2, the first processing block 3 and the second ID block 4. The support portion 67A supporting the base of the two multi-jointed arms 61 and 62 can move in the X direction along the longitudinal portion 67B, but may not move in the X and Y directions.

[0188] in addition, Fig.16 The carrier buffer device 8 shown is mounted on the two ID blocks 2 and 4 and the two processing blocks 3 and 5. In addition, the carrier buffer device 8 may also be provided on the IF block 6. In addition, the longitudinal portion 67B of the carrier transport mechanism 51 is mounted on the two processing blocks 3 and 5 and the second ID block 4. Fig.17A , Fig. 17B As shown, the vertical portion 67B is mounted on a groove portion 82 formed in the second ID block 4 .

[0189] Since the vertical portion 67B is mounted on the groove portion 82 formed in the second ID block 4 , the height of the carrier transport mechanism 51 can be suppressed, and the area on the opposite side of the first ID block 2 across the second ID block 4 can be used as the carrier storage rack 53 .

[0190] <Operation of substrate processing apparatus 1>

[0191] Next, the operation of the substrate processing apparatus 1 will be described. Fig.12 , Fig.14 The carrier transport mechanism 51 transports the carrier C from the input port 71 to, for example, the placement table 13 of the opening mechanism 9 .

[0192] (Step S31) First ID Block 2

[0193] The first substrate transfer mechanism TM1 of the first ID block 2 takes out a substrate W from, for example, a carrier C mounted on the mounting table 13 of the opening mechanism 9, and transfers the taken-out substrate W to the first processing block 3. That is, the taken-out substrate W is transferred to any one of the two substrate mounting portions PS11 and PS12.

[0194] When all the substrates W are taken out from the carrier C, the carrier transport mechanism 51 transports the empty carrier C to, for example, the mounting table 47 of the opening mechanism 45 .

[0195] (Step S32) First Processing Block 3

[0196] The first processing block 3 performs coating processing on the substrate W conveyed from the first ID block 2, and conveys the substrate W subjected to coating processing to the second ID block 4. For example, in the upper coating processing layer 3A, the third substrate conveying mechanism TM3 receives the substrate W from the substrate mounting portion PS11, and conveys the received substrate W to, for example, the coating unit BARC and the coating unit RESIST. The third substrate conveying mechanism TM3 conveys the substrate W subjected to coating processing to the substrate mounting portion PS13.

[0197] (Step S33) Second ID Block 4

[0198] The second ID block 4 transfers the substrate W transferred from the first processing block 3 to the second processing block 5. That is, one of the two substrate transfer mechanisms TM7 and TM8 of the second ID block 2 receives the substrate W from the substrate mounting portion PS13 and transfers the received substrate W to, for example, the substrate mounting portion PS21. Alternatively, the received substrate W may be transferred to the substrate mounting portion PS22 (the lower development processing layer 5B).

[0199] (Step S34) Second Processing Block 5

[0200] The second processing block 5 does not perform a development process on the coated substrate W, but transports the substrate W transported from the second ID block 4 to the IF block 6. That is, in the upper development processing layer 5A, the third substrate transport mechanism TM3 receives the substrate W from the substrate mounting portion PS21 and transports the received substrate W to the substrate mounting portion PS25.

[0201] (Step S35) IF block 6

[0202] The IF block 6 carries out the substrate W conveyed from the second processing block 5 to the exposure device EXP. Then, the IF block 6 carries in the substrate W subjected to the exposure process from the exposure device EXP, and conveys the substrate W subjected to the exposure process to the second processing block 5. That is, the substrate W subjected to the exposure process is conveyed to, for example, the placement and cooling unit P-CP2.

[0203] (Step S36) Second Processing Block 5

[0204] The second processing block 5 performs a development process on the exposed substrate W, and transports the developed substrate W to the second ID block 4. For example, in the development processing layer 5A, the third substrate transport mechanism TM3 receives the substrate W from the placement and cooling unit P-CP2, and after transporting the received substrate W to, for example, the developing unit DEV, transports the substrate W to the substrate placement unit PS23.

[0205] (Step S37) Second ID Block 4

[0206] The second ID block 4 moves the substrate W subjected to the development process back to, for example, the carrier C mounted on the mounting table 47 of the opening mechanism 45. For example, the seventh substrate transport mechanism TM7 transports the substrate W from the substrate mounting portion PS23 to the carrier C of the opening mechanism 45.

[0207] According to the present embodiment, the second ID block 4 is disposed between the two processing blocks 3 and 5. In such a substrate processing apparatus 1, the footprint of the substrate processing apparatus 1 can be reduced.

[0208] [Example 4]

[0209] Next, a fourth embodiment of the present invention will be described with reference to the drawings. Note that descriptions overlapping with those of the first to third embodiments will be omitted.

[0210] The substrate processing apparatus 1 of the first embodiment includes the first ID block 2 and the first processing block 3. In contrast, the substrate processing apparatus 1 of the fourth embodiment includes the first ID block 2, the first processing block 3, and the second ID block 4.

[0211] Fig.18 It is a longitudinal sectional view of the substrate processing apparatus 1 of the fourth embodiment. Fig.19 is a cross-sectional view of the substrate processing apparatus 1 . Fig. 20 It is a right side view of the substrate processing apparatus 1 .

[0212] Reference Fig.18 , Fig.19 The substrate processing apparatus 1 of the fourth embodiment includes a single processing block (first processing block) 3. The single processing block 3 includes one or more processing layers. Fig.18 In the single processing block 3, there are seven processing layers 3A to 3G arranged in the vertical direction. In addition, seven substrate mounting parts PS1A to PS7A are provided between the first ID block 2 and the seven processing layers 3A to 3G. In addition, seven substrate mounting parts PS1B to PS7B are provided between the seven processing layers 3A to 3G and the second ID block 4.

[0213] like Fig. 20As shown, the two lower processing layers 3A and 3B are provided with a coating unit BARC for forming an antireflection film on the substrate W. The two middle processing layers 3C and 3D are provided with a coating unit RESIST for forming a resist film on the substrate W. In addition, the three upper processing layers 3E to 3G are provided with a developing unit DEV for developing the substrate W after exposure.

[0214] (Carrier buffer device 8)

[0215] like Fig.21 As shown in FIG. 1 , the carrier buffer device 8 of this embodiment is mounted on the first ID block 2, the processing block 3 and the second ID block (IF block) 4. Fig.21 In the embodiment, the input port 71 and the output port 72 are arranged in the Y direction along the track 77 of the external transport mechanism OHT. The empty carrier racks 74 are arranged on the second ID block 4 in a manner of being arranged in the Y direction. The longitudinal portion 67B of the carrier transport mechanism 51 is provided between the first ID block 2 and the second ID block 4 in a manner of extending in the X direction. The unprocessed substrate carrier rack 73 and the processed substrate carrier rack 75 are provided along the longitudinal portion 67B.

[0216] <Operation of substrate processing apparatus 1>

[0217] Next, the operation of the substrate processing apparatus 1 of this embodiment will be described. Fig. 20 .

[0218] (Step S41) Second ID block 4 (IF block)

[0219] The second ID block 4 takes out a substrate W from a carrier C mounted on a mounting table 47 of either of the two opening mechanisms 45 and 46, and transfers the taken-out substrate W to either of the two processing layers 3A and 3B. This will be described in detail. In the second ID block 4, for example, the fourth substrate transfer mechanism TM4 takes out a substrate W from a carrier C mounted on a mounting table 47 of the opening mechanism 45, and transfers the taken-out substrate W to the substrate mounting portion PS1B.

[0220] When all the substrates W are taken out from the carrier C, the carrier transport mechanism 51 transports the empty carrier C to, for example, the mounting table 13 of the opening mechanism 9 .

[0221] (Step S42) Processing Layers 3A and 3B of Processing Block 3 (First Coating Process)

[0222] The processing layers 3A and 3B respectively perform the first coating process (for example, forming an antireflection film) on the conveyed substrate W, and convey the substrate W subjected to the first coating process to the first ID block 2. For example, in the processing layer 3A of the processing block 3, Fig.18 , Fig.19The third substrate transport mechanism TM3 shown receives the substrate W from the substrate mounting portion PS1B and transports the received substrate W to at least the coating unit BARC. Thereafter, the third substrate transport mechanism TM3 transports the substrate W on which the antireflection film is formed by the coating unit BARC to the substrate mounting portion PS1A.

[0223] (Step S43) First ID Block 2

[0224] The first ID block 2 performs the first coating process and transfers the transferred substrate W to the processing layer 3C. That is, one of the two substrate transfer mechanisms TM1 and TM2 is switched from Fig. 20 The substrate mounting portion PS1A shown in the figure transfers the substrate W to the substrate mounting portion PS3A. In addition, the substrate W subjected to the first coating process in the processing layer 3B is transported to the processing layer 3D.

[0225] (Step S44) Processing Layers 3C and 3D of Processing Block 3 (Second Coating Process)

[0226] Each processing layer 3C, 3D performs a second coating process (eg, forming a resist film) on the conveyed substrate W, and conveys the substrate W subjected to the second coating process to the second ID block 4. For example, in the processing layer 3C of the processing block 3, Fig.18 , Fig.19 The third substrate transport mechanism TM3 shown receives the substrate W from the substrate placement part PS3A. The third substrate transport mechanism TM3 transports the received substrate W to at least the coating unit RESIST. The third substrate transport mechanism TM3 transports the substrate W on which the resist film is formed by the coating unit RESIST to the substrate placement part PS3B.

[0227] (Step S45) Second ID Block 4 (Exposure Processing by Exposure Device)

[0228] The second ID block 4 carries out the substrate W processed by the processing layer 3C to the exposure device EXP. In addition, the second ID block 4 carries in the substrate W subjected to the exposure processing by the exposure device EXP from the exposure device EXP. The second ID block 4 carries the carried-in substrate W to any one of the three processing layers 3E to 3G. For example, after the exposure processing is performed, the substrate W processed by the post-exposure cleaning unit 162 and the heating and cooling part PHP of the second ID block 4 is carried to the substrate mounting part PS5B.

[0229] (Step S46) Processing Layers 3E to 3G of Processing Block 3 (Development Processing)

[0230] The three processing layers 3E to 3G of the processing block 3 respectively perform development processing on the transferred substrate W, and transfer the developed substrate W to the first ID block 2. For example, in the processing layer 3E, the third substrate transfer mechanism TM3 receives the substrate W from the substrate mounting portion PS5B and transfers it to at least the developing unit DEV, and then transfers the developed substrate W to the substrate mounting portion PS5A.

[0231] (Step S47) First ID Block 2

[0232] The first ID block 2 moves the substrate W developed by any one of the processing layers 3E to 3G back to the carrier C mounted on the mounting table 13 of any one of the two opening mechanisms 9 and 10. To be specific, one of the two substrate transfer mechanisms TM1 and TM2 receives the substrate W from the substrate mounting portion PS5A and moves the received substrate W back to the carrier C mounted on the mounting table 13 of the opening mechanism 9.

[0233] According to the present embodiment, for the substrate processing apparatus 1 in which the single processing block 3 is interposed between the first ID block 2 and the ID block (IF block) 4, the occupied area of ​​the substrate processing apparatus 1 can be reduced.

[0234] The present invention is not limited to the above-described embodiment, and can be implemented in various modified forms as follows.

[0235] (1) In the first embodiment, the substrate processing apparatus 1 includes one processing block 3, but may include a plurality of processing blocks 3 arranged in a row in the horizontal direction. In this case, the longitudinal portion 67B of the carrier transport mechanism 51 may be arranged to extend from a processing block at one end of the plurality of processing blocks 3 to a processing block at the other end.

[0236] (2) In the first embodiment and the variation (1), the processing block 3 performs a coating process. In this regard, the processing block 3 may also perform a developing process. In addition, the processing block 3 may also perform a cleaning process. The cleaning unit (liquid processing unit SC) that performs the cleaning process includes, for example, a holding rotating part, a liquid supply part, and a brush cleaning mechanism. The holding rotating part contacts and holds the end of the substrate W at more than three points, and rotates the held substrate W. The liquid supply part includes a nozzle and a pipe connected to the nozzle, and supplies a processing liquid to the substrate W held by the holding rotating part. The brush cleaning mechanism includes a brush cleaning tool and a support arm that rotatably supports the brush cleaning tool.

[0237] As the treatment liquid used for cleaning, for example, APM (ammonia-hydrogen peroxide water mixed solution), pure water (DIW), carbonated water, hydrogen water, ammonia water (NH4OH), SC1 (Standard Clean 1, standard cleaning solution 1), SC2 (Standard Clean 2, standard cleaning solution 2), citric acid aqueous solution, FOM (hydrofluoric acid / ozone mixed solution), FPM (hydrofluoric acid / hydrogen peroxide water / pure water mixed solution), hydrofluoric acid (HF), HCl, IPA (isopropyl alcohol), TMAH (tetramethylammonium hydroxide) and trimethyl-2-hydroxytetraethylammonium hydroxide aqueous solution (CHOLINE) can also be used.

[0238] (3) In the second embodiment and each variation, the substrate processing apparatus 1 includes two processing blocks 3 and 5. In this regard, the substrate processing apparatus 1 may include three or more processing blocks. Fig. 22 In the embodiment, the substrate processing apparatus 1 includes three processing blocks 101 to 103. The processing block 101 at one end performs a first coating process, for example, to form an antireflection film on a substrate W. The processing block 102 in the middle performs a second coating process to form a resist film on the substrate W. The processing block 103 at the other end performs a development process on the substrate W. Fig. 22 Although the three processing blocks 101 to 103 shown in the figure each include a single processing layer, they may include two or more processing layers.

[0239] The IF block (second ID block) 6 is horizontally connected to the other end processing block 103 among the three processing blocks 101 to 103. The carrier buffer device 8 may be arranged from the first ID block 2 to the IF block 6.

[0240] An example of the operation of the substrate processing device 1 is described. The first ID block 2 takes out the substrate W from the carrier C of the stage 13. In this case, the taken-out substrate W is transported in the order of the first processing block 101 (first coating process), the second processing block 102 (second coating process), the third processing block 103 (through), the IF block 6, the exposure device EXP, the IF block 6, the third processing block 103 (development process), and the IF block 6. Then, the IF block 6 stores the substrate W after the development process in the carrier C of the stage 47.

[0241] (4) In the third embodiment and each variation, the substrate processing apparatus 1 includes two processing blocks 3 and 5. In this regard, the substrate processing apparatus 1 may include three or more processing blocks. Fig.23 In the embodiment, the substrate processing apparatus 1 includes three processing blocks 101 to 103. The second ID block 4 is disposed, for example, between the two processing blocks 102 and 103. In addition, at least one processing block may be provided between the first ID block 2 and the second ID block 4. In addition, at least one processing block may be provided between the second ID block 4 and the IF block 6.

[0242] An example of the operation of the substrate processing device 1 is described. The first ID block 2 takes out the substrate W from the carrier C of the stage 13. In this case, the taken-out substrate W is transported in the order of the first processing block 101 (first coating process), the second processing block 102 (second coating process), the second ID block 4, the third processing block 103 (through), the IF block 6, the exposure device EXP, the IF block 6, the third processing block (development process), and the second ID block 4. Then, the second ID block 4 stores the substrate W after the development process in the carrier C of the stage 47.

[0243] (5) In the above-described embodiments 2 to 4 and each variation, the substrate processing apparatus 1 is connected to the exposure apparatus EXP. In this regard, the substrate processing apparatus 1 may not be connected to the exposure apparatus EXP. In this case, for example, Figure 8 In the embodiment, the first coating process for forming an antireflection film may be performed by the first processing block 3, and the second coating process for forming a resist film may be performed by the second processing block 5. The first coating process is a process for forming an antireflection film and a resist film, and the second coating process may be a process for forming a resist protective film.

[0244] (6) In the substrate processing apparatus 1 of the second and third embodiments, the two opening mechanisms 9 and 10 are used to take out the substrate W, and the two opening mechanisms 45 and 46 are used to store the substrate W. These roles may be reversed. That is, the two opening mechanisms 45 and 46 are used to take out the substrate W, and the two opening mechanisms 9 and 10 are used to store the substrate W.

[0245] In the fourth embodiment, the two opening mechanisms 45 and 46 are used to take out the substrate W, and the two opening mechanisms 9 and 10 are used to store the substrate W. These roles may be reversed. That is, the two opening mechanisms 9 and 10 are used to take out the substrate W, and the two opening mechanisms 45 and 46 are used to store the substrate W.

[0246] (7) In the above-mentioned embodiments and variations, for example, Figure 7 In the embodiment, the opening mechanism 9 (carrying table 13) is arranged in the direction of the processing block 3, and the opening mechanism 45 (carrying table 47) is arranged in the direction of the processing block 3. Thus, the carrier transport mechanism 51 can easily transport the carrier C to the mounting tables 13 and 47. Fig.24 As shown, the opening mechanism 9 may be provided on the outer wall of the first ID block 2 on the opposite side of the first processing block 3 across the first ID block 2. In addition, the opening mechanism 45 may be provided on the outer wall of the IF block 6 on the exposure device EXP side.

[0247] in addition, Fig.24At least one of the stages 13 shown may also be capable of being raised and lowered. The substrate processing apparatus 1 includes a lifting mechanism 140, which is disposed between the first ID block 2 and the stage 13, and raises and lowers the stage 13 between the upper surface side and the ground side of the first ID block 2. The lifting mechanism 140 includes an electric motor. By raising and lowering the stage 13 using the lifting mechanism 140, the stage 13 can be lowered to a height at which an operator can directly place the carrier C on the stage 13. For example, when the substrate processing apparatus 1 is used in non-production conditions such as during evaluation or maintenance, the operator usually transports the carrier C by hand rather than using an external transport mechanism OHT. At this time, since the operator can directly place the carrier C on the stage 13, the substrate processing apparatus can be used flexibly during evaluation or maintenance, thereby improving operating efficiency.

[0248] In addition, for example, when the exposure device EXP is not connected to the IF block 6 (or the second ID block 4), the stage 47 may be raised and lowered by the lifting mechanism. For example, on the side of the IF block 6, the stage 141 other than the stages 13 and 47 may be raised and lowered by the lifting mechanism. In this case, when the stage 141 rises to the same height as the stage 47, the carrier transport mechanism 51 transports the carrier C from the stage 141 to, for example, the stage 47.

[0249] (8) In each of the above-described embodiments and variations, the mounting table 13 (opening mechanisms 9, 10) is arranged so as to be accommodated in at least one area of ​​the first ID block 2 and the first processing block 3 when viewed from above. Fig.25A , Fig.25B As shown, the mounting table 13 (opening mechanisms 9 and 10) may be provided so as to be accommodated in the area of ​​the first ID block 2 when viewed from above.

[0250] In addition, if Fig.26A , Fig.26B As shown, the mounting table 13 (opening mechanisms 9, 10) may also be arranged to be accommodated in the area of ​​the first ID block 2 and the first processing block 3 when viewed from above. Fig.26A In a plan view, two opening mechanisms 9 and 85 (two mounting tables 13) are provided around the first substrate transport mechanism TM1. In addition, two opening mechanisms 10 and 86 (two mounting tables 13) are provided around the second substrate transport mechanism TM2. The first substrate transport mechanism TM1 is configured to take out a substrate W from each of the two opening mechanisms 9 and 85 carriers C. In addition, the second substrate transport mechanism TM2 is configured to take out a substrate W from each of the two opening mechanisms 10 and 86 carriers C.

[0251] That is, the mounting tables 13 of the four opening mechanisms 9, 10, 85, and 86 are arranged to be stored in at least one area of ​​the first ID block 2 and the first processing block 3 when viewed from above. As a result, the mounting table 13 can be relatively oriented toward the carrier transport mechanism 51, so that the carrier transport mechanism 51 can easily transport the carrier C mounted on the mounting table 13.

[0252] (9) In the above-mentioned embodiments 2 to 4 and various variations, for example, Figure 7 to Figure 10 As shown, the fourth substrate transport mechanism TM4 of the IF block 6 transports the substrate W between the five substrate mounts PS15 to PS18, PS9, the five mount and cooling units P-CP, P-CP2, P-CP3, the pre-exposure cleaning unit 161, and the carrier C mounted on the opening mechanism 45. In addition, the fifth substrate transport mechanism TM5 transports the substrate W between the five substrate mounts PS15 to PS18, PS9, the five mount and cooling units P-CP, P-CP2, P-CP3, the post-exposure cleaning unit 162, and the carrier C mounted on the opening mechanism 46.

[0253] For example, the fifth substrate transport mechanism TM5 may transport the substrate W between the three substrate mounting parts PS15, PS16, PS9, the five mounting and cooling parts P-CP, P-CP2, P-CP3, the post-exposure cleaning unit 162, and the carrier C mounted on the opening mechanism 46. In this case, the fourth substrate transport mechanism TM4 may transport the substrate W between the two substrate mounting parts PS17, PS18, the post-exposure cleaning unit 161, and the carrier C of the opening mechanism 45. The functions between the fourth substrate transport mechanism TM4 and the fifth substrate transport mechanism TM5 may be opposite.

[0254] When the fourth substrate transport mechanism TM4 transports the substrate W to the carrier C of the opening mechanism 45, for example, the opening mechanism 46 may not be provided. In addition, when the fourth substrate transport mechanism TM4 transports the substrate W to the carrier C of a plurality of (for example, two) opening mechanisms 45 and 87, as shown in FIG. Fig. 27 As shown, the two opening mechanisms 45 and 87 (two mounting tables 47) are provided around the fourth substrate transfer mechanism TM4 in a plan view.

[0255] That is, the second ID block 4 has, for example, a fourth substrate transport mechanism TM4 for transporting the substrate W. The two opening mechanisms 45 and 87 are provided on the periphery of the fourth substrate transport mechanism TM4 in a plan view. The carrier C can be transported to a plurality of stages 47 using one, for example, the fourth substrate transport mechanism TM4. In addition, Fig. 27 The opening mechanisms 46, 88 shown are also identical.

[0256] (10) In the above-described embodiments and variations, the carrier buffer device 8 may include, in addition to the carrier transport mechanism 51, a second carrier transport mechanism 91 for transporting the carrier C. For example, Fig.28 As shown, the second carrier transport mechanism 91 may be mounted on the second processing block 5 (at least one processing block on the other end side) on the opposite side of the carrier transport mechanism 51 via the second ID block 4. In addition, the second carrier transport mechanism 91 may be mounted on the second processing block 5 and the IF block 6. Since the two carrier transport mechanisms 51 and 91 are used to transport the carrier C, the carrier transport efficiency can be improved. Therefore, the processing capacity of the substrate processing apparatus 1 can be increased.

[0257] In addition, if Fig.28 As shown, the carrier buffer device 8 may also include a relay carrier mounting table 93 disposed on the second ID block 4. The carrier transport mechanism 51 uses the relay carrier mounting table 93 to transport the carrier C to the second carrier transport mechanism 91. That is, the carrier transport mechanism 51 transports the carrier C to the relay carrier mounting table 93, and the second carrier transport mechanism 91 receives the carrier C transported to the relay carrier mounting table 93. In addition, the second carrier transport mechanism 91 uses the relay carrier mounting table 93 to transport the carrier C to the carrier transport mechanism 51. The area above the second ID block 4 can be used as the relay carrier mounting table 93 of the two carrier transport mechanisms 51 and 91. Therefore, the delivery of the carrier C can be performed more smoothly. In addition, three or more carrier transport mechanisms may be provided.

[0258] (11) In the above-mentioned embodiments and variations, for example, Figure 5 In the embodiment, the carrier transport mechanism 51 is mounted on the first processing block 3. In this regard, the carrier transport mechanism 51 may also be mounted on the first ID block 2. In addition, the carrier transport mechanism 51 may also be mounted on the first ID block 2 and the first processing block 3.

[0259] The carrier storage rack 53 is mounted on the first ID block 2 and the first processing block 3. In this regard, the carrier storage rack 53 may be mounted on the first ID block 2 or the first processing block 3.

[0260] (12) In each of the above-mentioned embodiments and variations, the first ID block 2 includes two substrate transfer mechanisms TM1 and TM2. Fig.29 As shown, the first ID block 2 may also include a single substrate transport mechanism TM1. In this case, a plurality of (e.g., four) stages 13 may be arranged in the Y direction on the wall portion 206 of the first ID block 2. In order to take out and store the substrate W from the carrier C mounted on these stages 13, the substrate transport mechanism TM1 may also be configured to move in the Y direction by driving an electric motor.

[0261] In addition, a single substrate transfer mechanism TM1 may be fixed to the bottom of the first ID block 2 so as not to move in the horizontal direction (particularly the Y direction) as in Embodiment 1. In addition, the first ID block 2 may include three or more substrate transfer mechanisms.

[0262] (13) In each of the above-mentioned embodiments and variations, the second ID block 4 (or IF block 6) includes, for example, two substrate transfer mechanisms TM4 and TM5. Fig.29 As shown, the second ID block 4 may also include, for example, a single substrate transport mechanism TM4. In this case, a plurality of (for example, four) stages 47 may be arranged in the Y direction on the wall portion 208 of the second ID block 4. In order to take out and store the substrate W for the carrier C placed on these stages 47, the substrate transport mechanism TM4 may also be configured to move in the Y direction by driving an electric motor.

[0263] In addition, a single substrate transfer mechanism TM4 may be fixed to the bottom of the second ID block 4 so as not to move in the horizontal direction (particularly the Y direction) as in Embodiment 1. In addition, the second ID block 4 may include three or more substrate transfer mechanisms.

[0264] (14) In the above embodiments and variations, Figure 5 As shown, the carrier C placed on the carrier storage rack 53 is placed with the cover side surface 210 of the carrier C facing inward, that is, toward the carrier transport mechanism 51, but the orientation of the carrier C placed on the carrier storage rack 53 is not particularly limited. Fig.21 In the embodiment, an IC (Integrated Circuit) tag (RFID: radiofrequency identification) 212 storing information of each carrier C is installed on the opposite side of the cover side surface 210 of the carrier C. In this case, the carrier C can also be placed in a manner such that the IC tag 212 faces inward, that is, toward the carrier conveying mechanism 51. In addition, in order to read the information of the IC tag 212, a reader / writer 214 as a transceiver can also be provided on the holding parts 63 and 64 of the carrier conveying mechanism 51, respectively.

[0265] The present invention can be embodied in other specific forms without departing from the spirit or essence thereof and, therefore, reference should be made to the appended claims rather than to the foregoing description as indicating the scope of the invention.

[0266] [Explanation of Symbols]

[0267] 1 Substrate processing device

[0268] 2 1st loading block (1st ID block)

[0269] 3. Processing Block 1

[0270] 3A~3G processing layer

[0271] 4 2nd loading block (2nd ID block)

[0272] 5. Processing Block 2

[0273] 5A, 5B processing layer

[0274] 6 Interface block (IF block)

[0275] 8 Carrier buffer device

[0276] 13, 47 loading platform

[0277] 28 Liquid Handling Department

[0278] BARC coating unit

[0279] RESIST coating unit

[0280] DEV Development Unit

[0281] 29 Heat Treatment Department

[0282] 51, 91 Carrier transport mechanism

[0283] 79 Control Department

Claims

1. A substrate processing device for processing a substrate, comprising the following elements: A plurality of processing blocks are arranged in a row in the horizontal direction; A first loading block connected to a processing block at one end of the plurality of processing blocks in a horizontal direction and provided with at least one first carrier mounting table for mounting a carrier capable of accommodating a plurality of substrates; A second loading block connected to the processing block at the other end of the plurality of processing blocks in the horizontal direction and provided with at least one second carrier mounting table for mounting the carrier; a plurality of carrier storage racks, mounted on at least any one of the first loading block, the plurality of processing blocks, and the second loading block, for storing the carriers respectively; and The carrier transport mechanism is mounted on at least any one of the first loading block, the plurality of processing blocks and the second loading block, and transports the carrier between the at least one first carrier placement table, the plurality of carrier storage racks and the at least one second carrier placement table.

2. A substrate processing device for processing a substrate, comprising the following elements: A plurality of processing blocks are arranged in a row in the horizontal direction; A first loading block connected to a processing block at one end of the plurality of processing blocks in a horizontal direction and provided with at least one first carrier mounting table for mounting a carrier capable of accommodating a plurality of substrates; A second loading block is disposed between a processing block at one end and a processing block at the other end of the plurality of processing blocks and is provided with at least one second carrier mounting table for mounting the carrier; a plurality of carrier storage racks, mounted on at least any one of the first loading block, the plurality of processing blocks, and the second loading block, for storing the carriers respectively; and The carrier transport mechanism is mounted on at least any one of the first loading block, the plurality of processing blocks and the second loading block, and transports the carrier between the at least one first carrier placement table, the plurality of carrier storage racks and the at least one second carrier placement table.

3. The substrate processing apparatus according to claim 2, further comprising a second carrier transport mechanism, The second carrier transport mechanism transports the carrier by placing the carrier on the processing block on the other end side, which is the opposite side of the first carrier transport mechanism, via the second loading block.

4. The substrate processing apparatus according to claim 3, wherein It also includes a relay carrier placement table disposed on the second loading block, The first carrier transport mechanism transports the carrier to the second carrier transport mechanism using the relay carrier placement table, and further, The second carrier transport mechanism transports the carrier to the first carrier transport mechanism using the relay carrier placement table.

5. The substrate processing apparatus according to claim 2, wherein The carrier transport mechanism comprises: a holding portion for holding the carrier; an arm portion for mounting the holding portion; a driving portion for supporting the arm portion; and a guide rail mounted on at least two of the plurality of processing blocks and the second loading block; The driving part is configured to enable the holding part and the arm part to move along the guide rail. The guide rail is mounted on a groove formed in the second loading block.

6. The substrate processing apparatus according to claim 2, wherein The at least one second carrier mounting table is provided at a position higher than the upper surfaces of the plurality of processing blocks.

7. The substrate processing apparatus according to claim 6, wherein The second loading block includes a substrate transfer mechanism for transferring the substrate. The at least one second carrier mounting platform is a plurality of second carrier mounting platforms, The plurality of second carrier stages are provided around the substrate transfer mechanism in a plan view.

8. The substrate processing apparatus according to claim 2, further comprising a lifting mechanism, The lifting mechanism is provided on the first loading block, and lifts the at least one first carrier mounting table between the upper surface side and the ground side of the first loading block.

9. The substrate processing apparatus according to claim 2, comprising: an opening for allowing a substrate to pass through a carrier mounted on the first carrier mounting table; a baffle member to open and close the opening; and The shutter member driving mechanism moves the shutter member in a horizontal direction along the opening.

10. A substrate processing device for processing a substrate, comprising the following elements: The first loading block is provided with at least one first carrier mounting table for mounting a carrier capable of accommodating a plurality of substrates; a first processing block connected to the first loading block in a horizontal direction; a second loading block connected to the first processing block on the opposite side of the first loading block and provided with at least one second carrier mounting table for mounting the carrier; a plurality of carrier storage racks, mounted on at least any one of the first loading block, the first processing block, and the second loading block, for storing the carriers respectively; and The carrier transport mechanism is mounted on at least one of the first loading block, the first processing block and the second loading block, and transports the carrier between the at least one first carrier placement table, the plurality of carrier storage racks and the at least one second carrier placement table.

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