Semiconductor process chamber and semiconductor process equipment

Abstract

The invention discloses a semiconductor process chamber and semiconductor process equipment, and the semiconductor process chamber comprises a chamber body, and a movable lining, a fixed lining and a bearing device which are arranged in the chamber body, and the chamber body is provided with a wafer transmission hole. The movable lining is arranged in the chamber body in a liftable manner so as to be switched between a rising position and a falling position; the movable lining and the fixed lining are arranged around the bearing device, and the fixed lining and the chamber body define an exhaust hole or the fixed lining is provided with an exhaust hole; when the movable lining is located at the falling position, the wafer transmission hole is communicated with a space surrounded by the movable lining, so that the wafer is transmitted to the bearing device through the wafer transmission hole or is transmitted out of the bearing device through the wafer transmission hole; when the movable lining is in the lifting position, the movable lining, the chamber body and the fixed lining define a process space, the bearing device is located in the process space, the process space is isolated from the wafer transmission hole in a sealed mode, and the process space is communicated with the exhaust hole.

Description

Technical Field

[0001] The present application belongs to the technical field of semiconductor process equipment, and specifically relates to a semiconductor process chamber and semiconductor process equipment. Background Art

[0002] In the chemical vapor deposition or chemical vapor etching process, the wafer is processed in the semiconductor process chamber. In order to protect the chamber wall of the semiconductor process chamber, a liner is installed in the semiconductor process chamber involved in the related art. Considering the need for the wafer to enter and exit, the liner is provided with a film transmission hole and a lifting door is configured for the film transmission hole, and the lifting door can be lifted and lowered to realize the opening and closing of the film transmission hole. Before or after the process, the lifting door is opened, and the wafer can enter and exit the liner through the film transmission hole, thereby realizing the film transmission. However, in order to avoid the friction between the lifting door and the liner during the lifting process and cause particle contamination, in the semiconductor process chamber involved in the related art, there is a gap between the liner and the lifting door, so that the lifting door will not contact and rub with the liner during the lifting process. Although this structure can avoid particle contamination caused by wear, it will cause the lifting door and the liner to be loosely sealed, and ultimately cause the process gas to be discharged not only from the preset exhaust hole on the liner during the process, but also from the gap between the lifting door and the liner, which is easy to cause the exhaust to be turbulent.

[0003] Obviously, this is not conducive to uniform distribution of process gases in the semiconductor process chamber, resulting in poor process effects. Summary of the invention

[0004] The present application discloses a semiconductor process chamber and a semiconductor process equipment to solve the problem of uneven distribution of process gas in the semiconductor process chamber involved in the related art, which leads to poor process effect.

[0005] In order to solve the above technical problems, this application provides the following technical solutions: In a first aspect, an embodiment of the present invention discloses a semiconductor process chamber, the disclosed semiconductor process chamber comprising a chamber body and a movable liner, a fixed liner and a carrying device arranged in the chamber body, the chamber body is provided with a wafer transfer hole, the movable liner is liftably arranged in the chamber body to switch between a raised position and a lowered position; the movable liner and the fixed liner are both arranged around the carrying device, the fixed liner and the chamber body enclose an exhaust hole or the fixed liner is provided with an exhaust hole; When the movable liner is in the lowering position, the wafer transfer hole is in communication with the space surrounded by the movable liner, so that the wafer can be transferred to the carrier through the wafer transfer hole or transferred from the carrier through the wafer transfer hole; When the movable liner is in the raised position, the movable liner, the chamber body and the fixed liner enclose a process space, the carrying device is located in the process space, the process space is sealed and isolated from the wafer transfer hole, and the process space is connected to the exhaust hole.

[0006] In a second aspect, an embodiment of the present invention discloses a semiconductor process equipment, which includes a robot and the semiconductor process chamber described in the first aspect, and when the movable liner is in the landing position, the robot is used to transfer the wafer to the carrier through the wafer transfer hole or transfer the wafer out from the carrier through the wafer transfer hole.

[0007] The semiconductor process chamber disclosed in the embodiment of the present invention improves the relevant technology, so that the semiconductor process chamber includes a movable liner and a fixed liner both arranged around the carrier device, and the movable liner is lowered to realize the wafer being transferred to the carrier device through the wafer transfer hole or being transferred from the carrier device to the semiconductor process chamber through the wafer transfer hole. At the same time, when the movable liner is raised, the formed process space can be sealed and isolated from the wafer transfer hole. Therefore, there is no need to open a wafer transfer hole on the liner or to set a lifting door matched with the wafer transfer hole. Therefore, during the process, the process gas can be discharged through the exhaust hole instead of being discharged from other places, which can ultimately improve the exhaust stability, facilitate the uniform distribution of the process gas in the process space and improve the process effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 is a schematic structural diagram of a semiconductor process chamber disclosed in an embodiment of the present invention; Figure 2 yes Figure 1 A local enlarged schematic diagram in FIG. Figure 3 is Figure 1 A schematic diagram showing the exhaust process in a partial structure of Figure 3 The black arrow in the figure shows the direction of exhaust gas; Figure 4 It is a structural schematic diagram of a movable liner disclosed in an embodiment of the present invention; Figure 5 The present invention is a schematic structural diagram of another movable liner similar to the disclosed one; Figure 6 is a schematic structural diagram of a driving mechanism of a semiconductor process chamber disclosed in an embodiment of the present invention; Figure 7 is a schematic structural diagram of a fixed liner disclosed in an embodiment of the present invention; Figure 8 yes Figure 7 A-direction schematic diagram; Fig. 9 is a schematic structural diagram of a movable liner disclosed in an embodiment of the present invention; Fig.10 yes Fig. 9 BB section view; Fig.11 is a schematic diagram of the structure of the first sealing ring or the second sealing ring disclosed in an embodiment of the present invention; Fig.12 yes Fig.11 Partial cross-sectional view along CC direction.

[0009] Description of reference numerals: 10-chamber body, 11-chamber shell, 111-process gas input hole, 12-gas distribution plate, 121-gas distribution hole, 20-movable lining, 21-annular body, 211-first flange, 30-fixed lining, 31-exhaust hole, 311-groove, 312-second flange, 40-carrying device, 51-first sealing ring, 52-second sealing ring, 521-first sealing ring piece, 522-second sealing ring piece, 61-electric heating element, 62-power supply line, 70-guide mechanism, 71-guide rod, 711-first rod segment, 712-second rod segment, 72-first guide sleeve assembly, 721-first sealing flange, 722-first linear bearing, 723-first bearing flange, 724-first end cover, 73-third sealing ring, 80-driving mechanism, 81-power source, 82-rod, 83-fourth sealing ring, 84-second guide sleeve assembly, 841-second sealing flange, 842-second linear bearing, 843-second bearing flange, 844-second end cover, 01-process space, 011-annular gap, 02-gas distribution cavity, 03-wafer. DETAILED DESCRIPTION

[0010] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in combination with the specific embodiments of the present application and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application.

[0011] The technical solutions disclosed in various embodiments of the present application are described in detail below in conjunction with the accompanying drawings.

[0012] Please refer to Figures 1 to 12The embodiment of the present invention discloses a semiconductor process chamber, which is applied to semiconductor process equipment. The disclosed semiconductor process chamber includes a chamber body 10 , a movable liner 20 , a fixed liner 30 and a carrier 40 .

[0013] The chamber body 10 is the main peripheral component of the semiconductor process chamber. The chamber body 10 can at least provide a mounting base for other components of the semiconductor process chamber. In the embodiment of the present invention, the movable liner 20, the fixed liner 30 and the carrier 40 are all arranged in the chamber body 10. In addition, the chamber body 10 is also used to form some functional structures. In the embodiment of the present invention, the chamber body 10 is provided with a wafer transfer hole. The wafer transfer hole can allow the wafer 03 to pass through, thereby realizing the wafer 03 entering and exiting the chamber body 10, and finally achieving the purpose of the wafer 03 entering and exiting the semiconductor process chamber.

[0014] The movable liner 20 is a movable liner arranged in the chamber body 10. The movable liner 20 can be raised and lowered in the chamber body 10 to switch between a raised position and a lowered position. The fixed liner 30 is a liner fixedly arranged in the chamber body 10. In the embodiment of the present invention, the movable liner 20 and the fixed liner 30 are both arranged around the carrier 40, thereby forming a structure for protecting the inner wall of the chamber body 10.

[0015] The carrier 40 is used to carry the wafer 03, so that the wafer 03 can be placed on the carrier 40 for a process, such as an etching process or a deposition process. In the embodiment of the present invention, the carrier 40 can be an electrostatic chuck, a vacuum adsorption chuck, etc., and the embodiment of the present invention does not limit the specific type of the carrier 40.

[0016] In the embodiment of the present invention, the fixed liner 30 and the chamber body 10 form an exhaust hole 31 or the fixed liner 30 is provided with an exhaust hole 31. The exhaust hole 31 is used to discharge waste gas during the process.

[0017] When the movable liner 20 is in the descending position, the wafer transfer hole is connected with the space surrounded by the movable liner 20, so that the wafer 03 can be transferred to the carrier 40 through the wafer transfer hole or transferred from the carrier 40 through the wafer transfer hole. When the movable liner 20 is in the descending position, it is actually the semiconductor process chamber is in the pre-process preparation stage or the post-process stage. The movable liner 20 opens the wafer transfer hole by descending, so that the wafer transfer hole is connected with the space surrounded by the movable liner 20, and then the wafer 03 is transferred to the carrier 40 through the wafer transfer hole for pre-process preparation or to remove the processed wafer 03 on the carrier 40.

[0018] When the movable liner 20 is in the raised position, the movable liner 20, the chamber body 10 and the fixed liner 30 enclose a process space 01, and the carrier 40 is located in the process space 01, so that the wafer 03 placed on the carrier 40 can be processed in the process space 01. The process space 01 is sealed and isolated from the wafer transfer hole, and the process space 01 is connected to the exhaust hole 31. During the process, the process gas in the process space 01 will be discharged through the exhaust hole 31 after participating in the process. After participating in the process, the process gas forms the exhaust gas mentioned above.

[0019] It can be seen that the movable liner 20 not only plays the function of enclosing the process space 01 to protect the inner wall of the chamber body 10, but also can replace the lifting door in the background technology to realize the opening and closing control of the chip transfer hole.

[0020] The semiconductor process chamber disclosed in the embodiment of the present invention improves the relevant technology, so that the semiconductor process chamber includes a movable liner 20 and a fixed liner 30 both arranged around a carrier device 40. The movable liner 20 is lowered to realize that the chip 03 is transferred to the carrier device 40 through the chip transfer hole or is transferred from the carrier device 40 to the semiconductor process chamber through the chip transfer hole. At the same time, when the movable liner 20 is raised, the formed process space 01 can be sealed and isolated from the chip transfer hole. Therefore, there is no need to open a chip transfer hole on the liner or to set a lifting door that matches the chip transfer hole. Finally, during the process, the process gas will be discharged through the exhaust hole instead of being discharged from other places. Finally, the exhaust stability can be improved, which is beneficial to the uniform distribution of the process gas in the process space 01 and improves the process effect.

[0021] In an embodiment of the present invention, the chamber body 10 may have a variety of structures. In one embodiment, the chamber body 10 may include a chamber shell 11 and a gas distribution disk 12. The wafer transmission hole may be opened on the chamber shell 11. The gas distribution disk 12 is arranged inside the chamber shell 11. The gas distribution disk 12 is sealed with the chamber shell 11 and encloses the gas distribution cavity 02. The chamber shell 11 is provided with a process gas input hole 111. The process gas input hole 111 is connected with the gas distribution cavity 02, and then the process gas is input into the gas distribution cavity 02. The gas distribution disk 12 is provided with a plurality of gas distribution holes 121. The gas distribution holes 121 are actually small air inlet holes. The process gas is transported from the process gas input hole 111 to the gas distribution cavity 02 for temporary storage. The gas distribution cavity 02 is also conducive to the stability of the gas flow during the temporary storage of the process gas. The process gas entering the gas distribution cavity 02 will flow out through the multiple gas distribution holes 121. The multiple gas distribution holes 121 can make the process gas flow out of the gas distribution cavity 02 in a more dispersed manner, thereby improving the uniformity of the outflow of the process gas.

[0022] When the movable liner 20 is in the raised position, the movable liner 20 is sealed with the gas distribution disk 12, and the movable liner 20, the gas distribution disk 12, the fixed liner 30 and the chamber shell 11 enclose the process space 01. The multiple gas distribution holes 121 are connected to the gas distribution cavity 02 and the process space 01. In this case, the multiple gas distribution holes 121 allow the process gas to flow out of the gas distribution cavity 02 and enter the process space 01 in a more dispersed manner, which is conducive to making the process gas in the process space 01 evenly distributed. It should be noted that, in this case, the process space 01 surrounded by the movable liner 20, the chamber body 10 and the fixed liner 30 is actually surrounded by the movable liner 20, the gas distribution disk 12, the fixed liner 30 and the chamber shell 11.

[0023] In one embodiment, the gas distribution plate 12 can be disposed above the carrier 40 to evenly distribute gas toward the carrier 40. Specifically, the gas distribution plate 12 can be disposed on the top of the chamber shell 11 and sealed with the top inner wall of the chamber shell 11 to enclose the gas distribution cavity 02.

[0024] When the active liner 20 is in the dropped position, the active liner 20 is separated from the gas distribution plate 12 , so that the wafer transfer hole is in communication with the space surrounded by the active liner 20 .

[0025] In order to make the process gas enter the process space 01 more uniformly, in a further embodiment, a plurality of gas distribution holes 121 can be evenly distributed on the gas distribution plate 12. The gas distribution holes 121 on the gas distribution plate 12 can be distributed in a relatively dense manner without affecting the strength of the gas distribution plate 12. Of course, the embodiment of the present invention does not limit the specific number and distribution method of the gas distribution holes 121.

[0026] In the embodiment of the present invention, the movable liner 20 may have various structures. In one embodiment, the movable liner 20 may include an annular body 21, one fixed liner 30 may be provided, and one carrier 40 may be provided. The annular body 21, the fixed liner 30, the gas distribution plate 12, and the chamber shell 11 may enclose a process space 01, and the carrier 40 may be provided in the process space 01.

[0027] In another embodiment, the movable liner 20 may include a plurality of annular bodies 21, and the fixed liner 30 may be a plurality, and the plurality of fixed liners 30 may be matched with the plurality of annular bodies 21 in a one-to-one correspondence. There may be a plurality of carrier devices 40. When the movable liner 20 is in the raised position, the plurality of annular bodies 21 are respectively sealed and matched with the gas distribution disk 12, and the plurality of annular bodies 21, the plurality of fixed liners 30, the gas distribution disk 12 and the chamber shell 11 respectively enclose a plurality of process spaces 01. A plurality of carrier devices 40 may be arranged in a one-to-one correspondence in a plurality of process spaces 01. This structure can form a plurality of process spaces 01, so that a plurality of carrier devices 40 perform processes in a plurality of process spaces 01, which can undoubtedly improve the production capacity of the semiconductor process chamber. The plurality of process spaces 01 may be sealed and isolated from each other to avoid mutual interference during the process.

[0028] In order to facilitate the transfer of the wafer 03, there may be multiple wafer transfer holes, and the multiple wafer transfer holes may correspond to the multiple process spaces 01, respectively, so as to facilitate the independent transfer of the wafer 03 to each process space 01. In order to avoid the influence of the strength of the chamber shell 11 due to too many wafer transfer holes, in one embodiment, there may be only one wafer transfer hole, and multiple process spaces 01 may share one wafer transfer hole.

[0029] In the embodiment where the movable liner 20 includes a plurality of annular bodies 21, the plurality of annular bodies 21 can be fixedly connected to achieve synchronous lifting. In this case, the movable liner 20 can achieve the lifting of the plurality of annular bodies 21 by only driving a small number of drive mechanisms 80. The plurality of annular bodies 21 can be split structures, and can be fixed by welding, bonding, connecting with connectors, etc. In other embodiments, in order to facilitate manufacturing, in further embodiments, the plurality of annular bodies 21 can be an integrated structure. For example, the plurality of annular bodies 21 can be integrally formed by casting, cutting, etc., that is, the movable liner 20 can be an integrated structure.

[0030] As described above, the gas distribution disk 12 and the chamber shell 11 enclose a gas distribution cavity 02. Specifically, the number of gas distribution cavities 02 enclosed by the gas distribution disk 12 and the chamber shell 11 can be one or more, and the embodiment of the present invention is not limited. When there is one gas distribution cavity 02, the gas distribution cavity 02 can uniformly distribute gas to multiple process spaces 01 at the same time. Taking into account the differences in the processes of each process space 01 or the fact that each process space 01 is more independent when performing the process, the gas distribution cavity 02 can be multiple and independent of each other. Based on this, in one embodiment, the gas distribution disk 12 can enclose a plurality of mutually isolated gas distribution cavities 02 with the chamber shell 11. The plurality of gas distribution cavities 02 are connected to the plurality of process spaces 01 in a one-to-one correspondence. The chamber shell 11 is provided with a plurality of process gas input holes 111, and the plurality of process gas input holes 111 are connected to the plurality of gas distribution cavities 02 in a one-to-one correspondence. This structure can realize independent air intake of multiple process spaces 01 to avoid mutual interference, and can also realize corresponding air distribution for the corresponding process spaces 01 by multiple air distribution cavities 02 .

[0031] As described above, during the process, the waste gas formed after the process gas participates in the process will be discharged from the exhaust hole 31. Specifically, the exhaust hole 31 can be connected to the bottom space of the process space 01, the gas distribution hole 121 can be connected to the top space of the process space 01, and the exhaust hole 31 can be lower than the bearing surface of the carrier 40 to reduce the airflow disturbance near the wafer 03 during the process. In order to achieve uniform exhaust so that the distribution of the process gas in the process space 01 is more uniform, in one embodiment, there can be multiple exhaust holes 31. The multiple exhaust holes 31 can be evenly distributed around the circumferential direction of the carrier 40. An annular gap 011 is formed between the whole formed by the fixed liner 30 and the movable liner 20 and the carrier 40, and the process space 01 includes the annular gap 011, and the annular gap 011 is connected to the multiple exhaust holes 31. This structure enables the multiple exhaust holes 31 to be exhausted in multiple directions, which is conducive to the more dispersed discharge of the airflow in the process space 01, and is conducive to maintaining the uniformity of the process gas in the process space 01.

[0032] In one embodiment, the bottom end of the fixed liner 30 may be provided with a plurality of grooves 311 distributed in the circumferential direction around the carrier 40. The plurality of grooves 311 and the chamber body 10 respectively form a plurality of exhaust holes 31. This structure can form exhaust holes 31 by using the fixed liner 30 and the chamber body 10, without having to specially form complete exhaust holes 31 on the fixed liner 30. In other embodiments, the exhaust holes 31 may be completely formed on the fixed liner 30. Specifically, the plurality of grooves 311 and the bottom wall of the chamber shell 11 form a plurality of exhaust holes 31.

[0033] The embodiment of the present invention does not limit the size of the groove 311, and those skilled in the art can reasonably design it according to the specific process scenario. In one embodiment, the ratio of the length of the notch of the groove 311 in the circumferential direction of the carrier 40 to the spacing length of two adjacent grooves 311 in the circumferential direction can be greater than or equal to 0.5 and less than or equal to 1.5. The number of grooves 311 can be greater than or equal to 3 and less than or equal to 14. It should be noted that the embodiment of the present invention does not limit the number of grooves 311.

[0034] In one embodiment, the depth of the groove 311 may be greater than or equal to 3 mm and less than or equal to 10 mm. The groove 311 may also be of other depths, which is not limited in the embodiment of the present invention.

[0035] In the embodiment of the present invention, the movable liner 20 is a movable liner, the fixed liner 30 is a fixed liner, and the movable liner 20 is at least used to enclose the process space 01 with the fixed liner 30 and the chamber body 10, and the movable liner 20 can also move relative to the fixed liner 30. There are many structures to achieve the above-mentioned matching relationship between the movable liner 20 and the fixed liner 30, and the embodiment of the present invention is not limited. For example, the movable liner 20 and the fixed liner 30 are connected at the adjacent ends through an elastic sealing sleeve, and the lifting and lowering of the movable liner 20 can drive the elastic sealing sleeve to expand and contract, and the expansion and contraction of the elastic sealing sleeve can adapt to the lifting and lowering movement of the movable liner 20, and at the same time, it can also ensure that the movable liner 20 and the fixed liner 30 are sealed and connected to form the process space 01.

[0036] In other embodiments, the bottom end of the movable liner 20 that cooperates with the fixed liner 30 may include a first flange 211 folded toward the inside of the movable liner 20. The top end of the fixed liner 30 may include a second flange 312 folded toward the outside of the fixed liner 30. The bottom end of the fixed liner 30 and the chamber body 10 form an exhaust hole 31 or the bottom end of the fixed liner 30 is provided with an exhaust hole 31. The first flange 211 and the second flange 312 are annular flanges and a first sealing ring 51 is provided between the two (i.e., between the first flange 211 and the second flange 312). The movable liner 20 is sleeved outside the fixed liner 30. When the movable liner 20 is in the raised position, the first flange 211 and the second flange 312 clamp the first sealing ring 51, thereby ensuring the sealed docking between the movable liner 20 and the fixed liner 30, so that the movable liner 20, the fixed liner 30 and the chamber body 10 can enclose the process space 01. In this structure, the first flange 211 gradually compresses the first sealing ring 51 as the movable liner 20 rises, so that the first sealing ring 51 is pressed between the first flange 211 and the second flange 312, thereby achieving a seal between the first flange 211 and the second flange 312. At the same time, the second flange 312 can indirectly limit the excessive rise of the first flange 211 through the first sealing ring 51, thereby achieving the purpose of limiting the excessive rise of the movable liner 20.

[0037] It should be noted that, in other embodiments, the first sealing ring 51 may not be provided between the first flange 211 and the second flange 312. In this case, as the movable liner 20 rises, the first flange 211 and the second flange 312 will contact. Compared with the first sealing ring 51 provided between the first flange 211 and the second flange 312, the first flange 211 and the second flange 312 may be in direct contact with each other with a weaker seal. However, compared with the gap specially left between the lifting door and the liner in the background technology, the direct cooperation between the first flange 211 and the second flange 312 will not cause a large degree of poor sealing caused by a similar gap. Therefore, the semiconductor process chamber disclosed in the embodiment not including the first sealing ring 51 can still alleviate the technical problems described in the background technology. Of course, the semiconductor process chamber including the first sealing ring 51 can achieve a better seal between the first flange 211 and the second flange 312, which can better alleviate the technical problems described in the background technology.

[0038] As described above, when the movable liner 20 is in the raised position, the movable liner 20, the chamber body 10 and the fixed liner 30 enclose the process space 01. In order to achieve the sealed docking between the movable liner 20 and the chamber body 10, in a further embodiment, the semiconductor process chamber disclosed in the embodiment of the present invention may further include a second sealing ring 52. The second sealing ring 52 is arranged at the top of the chamber body 10 or the movable liner 20. For example, the second sealing ring 52 can be fixed to the top of the chamber body 10 or the movable liner 20 by bonding, clamping, etc. When the movable liner 20 is in the raised position, the second sealing ring 52 is clamped between the top of the movable liner 20 and the chamber body 10. In the embodiment where the chamber body 10 includes the chamber shell 11 and the gas distribution disk 12 described above, the second sealing ring 52 can be clamped between the top of the movable liner 20 and the gas distribution disk 12, thereby achieving the sealed docking between the top of the movable liner 20 and the gas distribution disk 12.

[0039] It should be noted that in other embodiments, when the movable liner 20 is in the raised position, the top of the movable liner 20 can be in direct contact with the chamber body 10 without providing the second sealing ring 52. Similarly, the top of the movable liner 20 in direct contact with the chamber body 10 may result in a weak seal, but compared with the special gap between the lifting door and the liner in the background technology, the top of the movable liner 20 in direct contact with the chamber body 10 will not result in a large degree of poor sealing caused by a similar gap, so the semiconductor process chamber disclosed in the embodiment not including the second sealing ring 52 can still alleviate the technical problems described in the background technology. Of course, the semiconductor process chamber including the second sealing ring 52 can achieve a better seal between the movable liner 20 and the chamber body 10, and can better alleviate the technical problems described in the background technology.

[0040] In the embodiment of the present invention, the first sealing ring 51 and the second sealing ring 52 may have various shapes, for example, the first sealing ring 51 and the second sealing ring 52 are O-rings, Y-rings, etc., and the embodiment of the present invention does not limit the specific shapes of the first sealing ring 51 and the second sealing ring 52. The shapes of the first sealing ring 51 and the second sealing ring 52 may be the same or different, and the embodiment of the present invention does not limit this.

[0041] In one embodiment, the first sealing ring 51 and the second sealing ring 52 may include a first sealing ring sheet 521 and a second sealing ring sheet 522 coaxially distributed, and the first sealing ring sheet 521 and the second sealing ring sheet 522 are an integrated structure, that is, the first sealing ring 51 and the second sealing ring 52 are both an integrated structure. The second sealing ring sheet 522 is tilted relative to the first sealing ring sheet 521. This structure can make the first sealing ring 51 and the second sealing ring 52 have better elasticity, and then when the first sealing ring 51 and the second sealing ring 52 are compressed, the first sealing ring sheet 521 and the second sealing ring sheet 522 can be better attached to the respective contacting parts under the action of the elastic restoring force, and finally the sealing effect can be improved. At the same time, this structure is an elastic structure, and the first sealing ring 51 and the second sealing ring 52 are made of elastic material, so the first sealing ring 51 of this structure can better prevent the first flange 211 and the second flange 312 from having a rigid collision, and achieve a good shock absorption effect. Similarly, the second sealing ring 52 can effectively prevent the movable liner 20 from colliding with the chamber body 10, thereby achieving a good shock-absorbing effect.

[0042] After the first sealing ring 51 and the second sealing ring 52 are pressed tightly, the first sealing ring piece 521 and the second sealing ring piece 522 are deformed so that the relative inclination angle e therebetween becomes 0°.

[0043] As described above, the first sealing ring piece 521 and the second sealing ring piece 522 are relatively inclined. In one embodiment, the relative inclination angle e between the first sealing ring piece 521 and the second sealing ring piece 522 can be greater than or equal to 30° and less than or equal to 60°. In another embodiment, the thickness d of the first sealing ring piece 521 can be greater than or equal to 0.5 mm and less than or equal to 3 mm. It should be noted that the embodiment of the present invention does not limit the specific inclination angle between the first sealing ring piece 521 and the second sealing ring piece 522. Similarly, the embodiment of the present invention does not limit the thickness of the first sealing ring piece 521 and the second sealing ring piece 522.

[0044] In a specific process, the wafer 03 needs a corresponding temperature for the process in the process space 01. Based on this, the carrier 40 may have a heating function. In order to ensure that the temperature in the process space 01 is easier to meet the requirements, in one embodiment, the movable liner 20 may be embedded with an electric heating element 61, and the electric heating element 61 may be distributed around the carrier 40. In a specific working process, the electric heating element 61 generates heat after being energized, thereby providing a thermal field around the carrier 40, which is conducive to ensuring the temperature required for the wafer 03 during the process. The electric heating element 61 may be a heating wire, or an electric heating device with other structures.

[0045] As described above, the movable liner 20 is raised and lowered in the chamber body 10 . In order to improve the accuracy of the raising and lowering of the movable liner 20 , in one embodiment, the semiconductor process chamber disclosed in the embodiment of the present invention may further include a guiding mechanism 70 .

[0046] The guide mechanism 70 may include a guide rod 71, a first guide sleeve assembly 72 and a third sealing ring 73. The first end of the guide rod 71 extends into the chamber body 10 and is connected to the movable liner 20. The first guide sleeve assembly 72 is fixed outside the chamber body 10. The second end of the guide rod 71 passes through the first guide sleeve assembly 72 and cooperates with the first guide sleeve assembly 72 in the lifting direction of the movable liner 20. The third sealing ring 73 is used to seal between the guide rod 71 and the first guide sleeve assembly 72, thereby preventing the chamber body 10 from leaking at the guide rod 71. The first end of the guide rod 71 and the second end of the guide rod 71 are respectively the two opposite ends of the guide rod 71. In this structure, the movable liner 20 is connected to the guide rod 71, so the guide rod 71 will be driven to lift during the lifting process of the movable liner 20. Since the guide rod 71 and the first guide sleeve assembly 72 cooperate in the lifting direction, the guide rod 71 will be restricted by the first guide sleeve assembly 72 to achieve more accurate lifting, and finally constrain the movable liner 20 to perform more accurate lifting. The third sealing ring 73 seals between the guide rod 71 and the first guide sleeve assembly 72 , thereby preventing the chamber body 10 from communicating with the external environment of the semiconductor process chamber through the gap between the guide rod 71 and the first guide sleeve assembly 72 , thereby facilitating ensuring the environment inside the chamber body 10 .

[0047] In the embodiment of the present invention, the guiding mechanism 70 may be one or more. In order to improve the guiding effect, the guiding mechanism 70 may be more than one, and the multiple guiding mechanisms 70 may be distributed at intervals, so as to guide the movable liner 20 at multiple positions.

[0048] In one embodiment as described above, the movable liner 20 may be embedded with an electric heater 61, and the electric heater 61 needs to be connected to an external power source. In one embodiment, the guide rod 71 may be a hollow structure. The first end of the guide rod 71 is sealed and connected to the movable liner 20, and the semiconductor process chamber may also include a power supply line 62. The first end of the power supply line 62 passes through the rod cavity of the guide rod 71 and is electrically connected to the electric heater 61. In this structure, the power supply line 62 is arranged inside the guide rod 71, so it can be protected by the guide rod 71 to avoid the high temperature and high pressure environment in the chamber body 10 from causing corrosion and other adverse effects on the power supply line 62.

[0049] The first guide sleeve assembly 72 can have a variety of structures. For example, the first guide sleeve assembly 72 can be a cylindrical structure with an integrated structure. The third sealing ring 73 can be sleeved on the guide rod 71 and positioned in the positioning groove of the guide rod 71. The third sealing ring 73 is pressed between the guide rod 71 and the first guide sleeve assembly 72 and can slide along the first guide sleeve assembly 72 driven by the guide rod 71. In the embodiment where the first guide sleeve assembly 72 is a cylindrical structure with an integrated structure, the third sealing ring 73 can slide with the inner wall of the cylindrical cavity of the cylindrical structure. Figure 2 As shown, in other embodiments, the first guide sleeve assembly 72 may include a first sealing flange 721, a first linear bearing 722, a first bearing flange 723 and a first end cover 724, the first sealing flange 721 is fixed outside the chamber body 10, the first linear bearing 722 is sleeved inside the first bearing flange 723, the first bearing flange 723 is sealed and docked with the first sealing flange 721, and the first end cover 724 covers the end of the first bearing flange 723 facing away from the first sealing flange 721. The guide rod 71 passes through the first end cover 724, the first linear bearing 722, the first sealing flange 721 and the chamber body 10 and extends into the chamber body 10. The first linear bearing 722 is slidably matched with the guide rod 71, so as to facilitate the sliding of the guide rod 71.

[0050] Please refer again Figure 2 In one embodiment, the guide rod 71 may include a first rod segment 711 and a second rod segment 712. One end of the first rod segment 711 is located inside the chamber body 10 and connected to the movable liner 20. The other end of the first rod segment 711 may extend outside the chamber body 10 and be fixedly connected to one end of the second rod segment 712. The other end of the second rod segment 712 passes through the first guide sleeve assembly 72. In one embodiment, the second rod segment 712 may be slidably matched with the first linear bearing 722. The first rod segment 711 may be slidably matched with the first sealing flange 721 after the third sealing ring 73 is put on. This structure allows the guide rod 71 to be designed in sections, thereby avoiding the situation where the guide rod 71 is too long and difficult to manufacture or has low manufacturing precision.

[0051] In order to facilitate the lifting and lowering of the movable liner 20, the semiconductor process chamber disclosed in the embodiment of the present invention may further include a driving mechanism 80. The driving mechanism 80 is directly or indirectly connected to the movable liner 20, so as to drive the movable liner 20 to be lifted and lowered.

[0052] The structure of the driving mechanism 80 can be various, and the embodiment of the present invention is not limited. In one embodiment, the driving mechanism 80 may include a power source 81, a push rod 82 and a fourth sealing ring 83, the power source 81 is fixed outside the chamber body 10, the first end of the push rod 82 extends into the chamber body 10 and is connected to the movable liner 20, the second end of the push rod 82 passes through the chamber body 10 and is connected to the power source 81, and the fourth sealing ring 83 is sleeved on the push rod 82 and sealed between the push rod 82 and the chamber body 10. The power source 81 can be a motor. In order to prevent the power source 81 from being adversely affected by the environment in the chamber body 10, the power source 81 can be located outside the chamber body 10.

[0053] Please refer to Figure 6 In order to improve the accuracy of the movement of the push rod 82, the driving mechanism 80 disclosed in the embodiment of the present invention may also include a second guide sleeve assembly 84. The second guide sleeve assembly 84 is fixed outside the chamber body 10, and the second end of the push rod 82 passes through the second guide sleeve assembly 84 and is connected to the power source 81 located outside the chamber body 10. The second guide sleeve assembly 84 can cooperate with the push rod 82 in the lifting direction of the push rod. In the embodiment of the present invention, the lifting direction of the push rod 82 is parallel to the sliding direction of the guide rod 71. The fourth sealing ring 83 can be sealed between the push rod 82 and the second guide sleeve assembly 84, which is actually to indirectly achieve the purpose of sealing between the push rod 82 and the chamber body 10, so as to implement sealing at the push rod 82 to avoid leakage of the chamber body 10. Similarly, the fourth sealing ring 83 can be sleeved on the push rod 82 and positioned in the positioning groove of the push rod 82, so that it can slide with the push rod 82 relative to the second guide sleeve assembly 84 and achieve sliding sealing.

[0054] In the embodiment of the present invention, the structure of the second guide sleeve assembly 84 can be various. For example, in one embodiment, the second guide sleeve assembly 84 can be a cylindrical structure of an integrated structure. In other embodiments, the second guide sleeve assembly 84 can include a second sealing flange 841, a second linear bearing 842, a second bearing flange 843, and a second end cover 844. The second sealing flange 841 is fixed outside the chamber body 10, the second linear bearing 842 is sleeved inside the second bearing flange 843, the second bearing flange 843 is sealed and docked with the second sealing flange 841, and the second end cover 844 is capped on the end of the second bearing flange 843 facing away from the second sealing flange 841. The ejector rod 82 passes through the second end cover 844, the second linear bearing 842, the second sealing flange 841, and the chamber body 10 in sequence and extends into the chamber body 10. The second linear bearing 842 is slidably matched with the ejector rod 82, so as to facilitate the sliding of the ejector rod 82.

[0055] The embodiment of the present invention does not limit the specific number and distribution of the guide mechanism 70 and the drive mechanism 80. Figure 5In one embodiment, the movable liner 20 may include an annular body 21, and the semiconductor process chamber may include a driving mechanism 80 and a guiding mechanism 70. More specifically, the connection between the top rod 82 of the driving mechanism 80 and the annular body 21 is the first connection, and the connection between the guide rod 71 of the guiding mechanism 70 and the annular body 21 is the second connection. The straight line m where the first connection and the second connection are connected passes through the center of the annular body 21. In this case, the parts of the annular body 21 located on both sides of the straight line m are symmetrically distributed with the straight line m as the symmetry axis. This method can drive and guide the movable liner 20 more evenly.

[0056] like Figure 4 As shown, in another embodiment, the movable liner 20 may include two annular bodies 21, and the semiconductor process chamber may include a driving mechanism 80 and two guide mechanisms 70. The guide rods 71 ​​of the two guide mechanisms 70 may be connected to the two annular bodies 21 respectively, and the two annular bodies 21 are symmetrically distributed with the central axis n of the movable liner 20 as the symmetry axis, that is, the two annular bodies 21 are symmetrically distributed on both sides of the central axis n, the connection between the top rod 82 of the driving mechanism 80 and the movable liner 20 is located on the central axis n, and the guide rods 71 ​​of the two guide mechanisms 70 are connected to the two annular bodies 21 respectively, and the connection between the guide rods 71 ​​of the two guide mechanisms 70 and the two annular bodies 21 is also symmetrically distributed on both sides of the central axis n. It should be noted that the central axis n is perpendicular to the lifting direction of the movable liner 20.

[0057] Based on the semiconductor process chamber disclosed in the embodiment of the present invention, the embodiment of the present invention discloses a semiconductor process equipment, and the disclosed semiconductor process equipment includes a manipulator and the semiconductor process chamber described in the above embodiment. When the movable liner 20 is in the landing position, the manipulator is used to transfer the wafer 03 to the carrier 40 through the wafer transfer hole or transfer it from the carrier 40 through the wafer transfer hole.

[0058] The above embodiments of the present application focus on describing the differences between the various embodiments. As long as the different features of the various embodiments are not contradictory, they can be combined to form more specific embodiments. Considering the simplicity of the text, they will not be repeated here.

[0059] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A semiconductor process chamber, characterized in that: The invention comprises a chamber body (10), and a movable liner (20), a fixed liner (30) and a carrying device (40) arranged in the chamber body (10); the chamber body (10) is provided with a wafer transfer hole; the movable liner (20) is arranged in the chamber body (10) in a liftable manner so as to switch between a raised position and a lowered position; the movable liner (20) and the fixed liner (30) are both arranged around the carrying device (40); the fixed liner (30) and the chamber body (10) enclose an exhaust hole (31) or the fixed liner (30) is provided with an exhaust hole (31); When the movable liner (20) is in the lowered position, the wafer transfer hole is in communication with the space surrounded by the movable liner (20), so that the wafer (03) can be transferred to the carrier device (40) through the wafer transfer hole or transferred from the carrier device (40) through the wafer transfer hole; When the movable liner (20) is in the raised position, the movable liner (20), the chamber body (10) and the fixed liner (30) enclose a process space (01), the carrying device (40) is located in the process space (01), the process space (01) is sealed and isolated from the wafer transfer hole, and the process space (01) is connected to the exhaust hole (31).

2. The semiconductor process chamber according to claim 1, characterized in that: The chamber body (10) comprises a chamber shell (11) and a gas distribution disk (12), wherein the gas distribution disk (12) is arranged inside the chamber shell (11), the gas distribution disk (12) and the chamber shell (11) are sealed and matched to form a gas distribution cavity (02), the chamber shell (11) is provided with a process gas input hole (111), the process gas input hole (111) is communicated with the gas distribution cavity (02), and the gas distribution disk (12) is provided with a plurality of gas distribution holes (121); When the movable liner (20) is in the raised position, the movable liner (20) is sealed with the gas distribution disk (12), and the movable liner (20), the gas distribution disk (12), the fixed liner (30) and the chamber shell (11) enclose the process space (01), and the gas distribution hole (121) connects the gas distribution cavity (02) and the process space (01).

3. The semiconductor process chamber according to claim 2, characterized in that: The movable liner (20) comprises a plurality of annular bodies (21), the plurality of fixed liners (30) are matched with the plurality of annular bodies (21) in a one-to-one correspondence, the plurality of carrying devices (40) are matched with the plurality of annular bodies (21) in a one-to-one correspondence, and when the movable liner (20) is in the raised position, the plurality of annular bodies (21) are respectively sealed with the gas distribution disk (12), and the plurality of annular bodies (21), the plurality of fixed liners (30), the gas distribution disk (12) and the chamber shell (11) enclose a plurality of process spaces (01), and the plurality of carrying devices (40) are arranged in the plurality of process spaces (01) in a one-to-one correspondence.

4. The semiconductor process chamber according to claim 3, characterized in that: The multiple annular bodies (21) are an integrated structure.

5. The semiconductor process chamber according to claim 3, characterized in that: The gas distribution disk (12) and the chamber shell (11) enclose a plurality of mutually isolated gas distribution cavities (02), the plurality of gas distribution cavities (02) are connected to the plurality of process spaces (01) in a one-to-one correspondence, and the chamber shell (11) is provided with a plurality of process gas input holes (111), the plurality of process gas input holes (111) are connected to the plurality of gas distribution cavities (02) in a one-to-one correspondence.

6. The semiconductor process chamber according to claim 1, wherein: There are a plurality of exhaust holes (31), and the plurality of exhaust holes (31) are evenly distributed in a circumferential direction around the carrier device (40); an annular gap (011) is formed between the whole formed by the fixed liner (30) and the movable liner (20) and the carrier device (40); the process space (01) includes the annular gap (011), and the annular gap (011) is connected to the plurality of exhaust holes (31).

7. The semiconductor process chamber according to claim 6, characterized in that: The bottom end of the fixed liner (30) is provided with a plurality of grooves (311) distributed in a circumferential direction around the supporting device (40), and the plurality of grooves (311) respectively form a plurality of exhaust holes (31) together with the chamber body (10).

8. The semiconductor process chamber according to claim 7, characterized in that: The ratio of the length of the groove (311) notch in the circumferential direction to the spacing length of the groove (311) in the circumferential direction is greater than or equal to 0.5 and less than or equal to 1.5; and / or the number of the grooves (311) is greater than or equal to 3 and less than or equal to 14; and / or the depth of the groove (311) is greater than or equal to 3 mm and less than or equal to 10 mm.

9. The semiconductor process chamber according to claim 1, wherein: The bottom end of the movable liner (20) that cooperates with the fixed liner (30) includes a first flange (211) folded toward the inside of the movable liner (20), and the top end of the fixed liner (30) includes a second flange (312) folded toward the outside of the fixed liner (30). The bottom end of the fixed liner (30) and the chamber body (10) enclose the exhaust hole (31) or the bottom end of the fixed liner (30) is provided with the exhaust hole (31); the first flange (211) and the second flange (312) are annular flanges and a first sealing ring (51) is provided therebetween. The movable liner (20) is sleeved outside the fixed liner (30). When the movable liner (20) is in the raised position, the first flange (211) and the second flange (312) clamp the first sealing ring (51).

10. The semiconductor process chamber according to claim 9, characterized in that: The semiconductor process chamber also includes a second sealing ring (52), which is arranged at the top of the chamber body (10) or the movable liner (20). When the movable liner (20) is in the raised position, the second sealing ring (52) is clamped between the top of the movable liner (20) and the chamber body (10).

11. The semiconductor process chamber according to claim 10, characterized in that: The first sealing ring (51) and the second sealing ring (52) both comprise a first sealing ring piece (521) and a second sealing ring piece (522) which are coaxially distributed; the first sealing ring piece (521) and the second sealing ring piece (522) are an integrated structure; and the second sealing ring piece (522) is arranged obliquely relative to the first sealing ring piece (521).

12. The semiconductor process chamber according to claim 11, characterized in that: The included angle between the first sealing ring sheet (521) and the second sealing ring sheet (522) is greater than or equal to 30° and less than or equal to 60°; and / or the thickness of the first sealing ring sheet (521) is greater than or equal to 0.5 mm and less than or equal to 3 mm.

13. The semiconductor process chamber according to claim 1, wherein: The movable lining (20) is embedded with an electric heating element (61), and the electric heating element (61) is distributed around the supporting device (40).

14. The semiconductor process chamber according to claim 13, wherein: The semiconductor process chamber also includes a guide mechanism (70), the guide mechanism (70) includes a guide rod (71), a first guide sleeve assembly (72) and a third sealing ring (73), the first end of the guide rod (71) extends into the chamber body (10) and is connected to the movable liner (20), the first guide sleeve assembly (72) is fixed outside the chamber body (10), the second end of the guide rod (71) passes through the first guide sleeve assembly (72) and cooperates with the first guide sleeve assembly (72) in the lifting direction of the movable liner (20), and the third sealing ring (73) is used to seal between the guide rod (71) and the first guide sleeve assembly (72).

15. The semiconductor process chamber according to claim 14, wherein: The guide rod (71) is a hollow structure, and the first end of the guide rod (71) is sealed and connected to the movable liner (20). The semiconductor process chamber also includes a power supply line (62), and the first end of the power supply line (62) passes through the rod cavity of the guide rod (71) and is electrically connected to the electric heating element (61).

16. The semiconductor process chamber according to claim 1, wherein: The semiconductor process chamber also includes a driving mechanism (80), the driving mechanism (80) includes a power source (81), a push rod (82) and a fourth sealing ring (83), the power source (81) is fixed outside the chamber body (10), the first end of the push rod (82) extends into the chamber body (10) and is connected to the movable liner (20), the second end of the push rod (82) passes through the chamber body (10) and is connected to the power source (81), and the fourth sealing ring (83) is sleeved on the push rod (82) and sealed between the push rod (82) and the chamber body (10).

17. A semiconductor process equipment, characterized in that: A semiconductor process chamber comprising a robot and any one of claims 1 to 16, wherein when the movable liner (20) is in the landing position, the robot is used to transfer the wafer (03) to the carrier (40) through the wafer transfer hole or to transfer the wafer from the carrier (40) through the wafer transfer hole.

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