Electronic assembly and communication equipment

Abstract

The invention provides an electronic component and communication equipment. The electronic assembly comprises a first circuit board and a power module. The power module is provided with a first input pad, a first output pad, and a first ground pad. The first circuit board is provided with a second input pad, a second output pad, and a second ground pad. The power module is provided with a first projection area on the first circuit board. The first surface of the first circuit board is provided with a first demetalized area, and the first demetalized area is located between the second input bonding pad and the second output bonding pad. The second surface of the first circuit board is provided with a second demetalized area, and the projection of the second demetalized area on the first surface is located between the second input bonding pad and the second output bonding pad. The power module and the first circuit board are oppositely attached, parasitic parameters generated when the power module and the first circuit board are assembled can be reduced, and therefore the performance of the electronic assembly is improved. And the demetalized region can reduce the influence on the radio frequency signal path region of the radio frequency power device.

Description

Technical Field

[0001] The present application relates to the technical field of communication equipment, and in particular to an electronic component and a communication equipment. Background Art

[0002] RF high-power devices are key components of transmitter systems and have signal amplification functions. RF high-power devices are mainly used to convert DC energy supplied by the power supply into AC energy. During the conversion process, part of the energy will be converted into heat energy and dissipated. Therefore, the greater the output power of the RF high-power device, the higher its heat dissipation requirements.

[0003] Existing RF high-power devices are usually packaged in a drop-in manner on the surface of the flange, and the input pins and output pins of the RF high-power devices extend out of the packaging layer respectively. When assembling the power module, the circuit board is slotted, and then the package is sunk into the slot, and the input pins and output pins are connected to the circuit board respectively. However, there are assembly tolerances in the process of assembling the package and the circuit board, and the assembled power module introduces parasitic parameters, resulting in poor performance of the power module. Summary of the invention

[0004] The present application provides an electronic component and a communication device to reduce the tolerance and parasitic parameters generated when assembling a power module and a circuit board, thereby improving the performance of the electronic component.

[0005] In the first aspect, the present application provides an electronic component. Specifically, the electronic component includes a power module and a first circuit board. Among them, the power module includes a flange, a packaging layer and a radio frequency power device. The packaging layer is located on the side of the flange facing the first circuit board, and the packaging layer is connected to the flange. The radio frequency power device is arranged in the packaging layer. A first input pad, a first output pad and a first ground pad are arranged on the surface of the packaging layer facing the first circuit board, wherein the first input pad and the first output pad are respectively conductively connected to the radio frequency power device, and the first ground pad is conductively connected to the flange. A second input pad, a second output pad and a second ground pad are arranged on the first surface of the first circuit board facing the power module, the second input pad is arranged opposite to the first input pad and conductively connected, the second output pad is arranged opposite to the first output pad and conductively connected, and the second ground pad is arranged opposite to the first ground pad and conductively connected. In a direction perpendicular to the first circuit board, the power module has a first projection area on the first surface. The first surface has a first demetallized area, and the first demetallized area is located in the first projection area and between the second input pad and the second output pad. The second surface of the first circuit board facing away from the power module has a second demetallized area. Along the direction perpendicular to the first circuit board, the projection of the second demetallized area on the first surface is located within the first projection area and between the second input pad and the second output pad.

[0006] In the electronic component of the present application, the power module and the first circuit board are arranged relative to each other, and the power module and the first circuit board are bonded by surface mounting, so that the assembly tolerance along the perpendicular direction and the parallel direction to the first circuit board can be reduced, so as to improve the assembly consistency, and reduce the tolerance and parasitic parameters generated when the power component is assembled with the first circuit board, thereby improving the performance of the electronic component. In addition, the first demetallized area and the second demetallized area are respectively located between the second input pad and the second output pad, thereby reducing the impact on the RF signal path area of ​​the RF power device.

[0007] The relative positions of the first demetallized area and the second demetallized area are not limited. In a possible implementation, along a direction perpendicular to the first circuit board, a projection of the second demetallized area on the first surface at least partially overlaps with the first demetallized area.

[0008] In another possible implementation manner, a projection of the second demetallized region on the first surface may completely overlap with the first demetallized region.

[0009] In another possible implementation manner, a projection of the second demetallized region on the first surface may not overlap with the first demetallized region.

[0010] When the first demetallized area and the second demetallized area are specifically provided, in a possible implementation, an insulating dielectric layer is provided between the first demetallized area and the second demetallized area, and the insulating dielectric layer connects the first demetallized area and the second demetallized area. In other words, by at least partially removing the metal layer located in the first demetallized area and the second demetallized area on the first circuit board, the impact on the RF signal path area can be reduced.

[0011] In one possible implementation, the insulating dielectric layer may be provided with a slot, and the opening of the slot is located in the first demetallized region or the second demetallized region. That is, the opening of the slot may be toward the power module, or may be away from the power module. Here, the number of slots is not specifically limited. In another possible implementation, the insulating dielectric layer may be provided with a first through hole, which passes through the insulating dielectric layer and connects the first demetallized region and the second demetallized region.

[0012] When the first demetallized area and the second demetallized area are specifically set, in another possible implementation, a second through hole may be set between the first demetallized area and the second demetallized area, and the second through hole connects the first demetallized area and the second demetallized area. In other words, by removing all the media (including metal media and non-metal media) located in the first demetallized area and the second demetallized area on the first circuit board, the impact on the RF signal path area can be reduced.

[0013] In a possible implementation, the first circuit board is provided with a first conductor and a second conductor, the first conductor is located in the first demetallized area and the second demetallized area and connected to the second input pad, and the second conductor is located in the first demetallized area and the second demetallized area and connected to the second output pad. Therefore, the first demetallized area and the second demetallized area are respectively located between the first conductor and the second conductor, the second input pad is conductively connected to other circuits through the first conductor, and the second output pad is conductively connected to other circuits through the second conductor.

[0014] In a possible implementation, a wiring portion is disposed on the second surface, and the second demetallized region is disposed in the wiring portion. The first conductor is conductively connected to the second input pad and the third wiring portion, and the second conductor is conductively connected to the second output pad and the third wiring portion.

[0015] In a possible implementation, the first input pad and the first output pad are conductively connected to the RF power device through a conductor. Specifically, the packaging layer is provided with a first through-hole and a second through-hole, the first through-hole and the second through-hole respectively penetrate the packaging layer, the first through-hole is provided with a third conductor, the first input pad and the RF power device are conductively connected through the third conductor, the second through-hole is provided with a fourth conductor, the second input pad and the RF power device are conductively connected through the fourth conductor.

[0016] In a possible implementation, the flange is conductively connected to the first ground pad via a conductor. Specifically, a fifth conductor is disposed on a surface of the flange facing the first circuit board, and the fifth conductor penetrates the packaging layer and conductively connects the flange to the first ground pad.

[0017] In a possible implementation, the electronic component is a dual-channel module. A third input pad, a third output pad and a third ground pad are also provided on the surface of the packaging layer facing the first circuit board. The third input pad and the third output pad are respectively conductively connected to the RF power device, and the third ground pad is conductively connected to the flange. The first surface is also provided with a fourth input pad, a fourth output pad and a fourth ground pad. The fourth input pad is arranged opposite to and conductively connected to the third input pad, the fourth output pad is arranged opposite to and conductively connected to the third output pad, and the fourth ground pad is arranged opposite to and conductively connected to the third ground pad. The first surface also has a third demetallized area, and the third demetallized area is located in the first projection area and between the fourth input pad and the fourth output pad. The second surface also has a fourth demetallized area, and along the direction perpendicular to the first circuit board, the projection of the fourth demetallized area on the first surface is located in the first projection area and between the fourth input pad and the fourth output pad.

[0018] The first circuit board may also be provided with discrete devices. In a possible implementation, a first discrete device, a second discrete device, a third discrete device, and a fourth discrete device are provided on a side of the first circuit board away from the power module, the first discrete device and the second discrete device are respectively located on both sides of the second demetallized area, and the third discrete device and the fourth discrete device are respectively located on both sides of the fourth demetallized area.

[0019] In a possible implementation, the electronic component further includes a first heat sink, which is disposed on a side of the flange away from the first circuit board and is used to dissipate heat for the power module.

[0020] In a possible implementation, a first heat-conducting layer is disposed between the flange and the first heat sink to increase heat transfer efficiency between the flange and the first heat sink.

[0021] In a possible implementation, the electronic component further includes a second circuit board, which is located on a side of the first circuit board facing the power module and is connected to the first circuit board, and the power module is disposed in the second circuit board.

[0022] In a second aspect, the present application also provides a communication device. The communication device includes the electronic component of the first aspect above. In the communication device of the present application, the power module and the first circuit board of the electronic component are arranged relative to each other, and the power module and the first circuit board are bonded by surface mounting, so that the assembly tolerance along the perpendicular to the first circuit board and along the parallel to the first circuit board can be reduced to improve the assembly consistency, and reduce the tolerance and parasitic parameters generated when the power component is assembled with the first circuit board, thereby improving the performance of the communication device. In addition, the first demetallized area and the second demetallized area are respectively located between the second input pad and the second output pad, thereby reducing the impact on the RF signal path area of ​​the RF power device. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of a communication system provided in an embodiment of the present application;

[0024] Figure 2 A schematic diagram of a communication device provided in an embodiment of the present application;

[0025] Figure 3 A schematic diagram of a transmitter provided in an embodiment of the present application;

[0026] Figure 4 A schematic diagram of an electronic component provided in an embodiment of the present application;

[0027] Figure 5 A schematic diagram of a power module provided in an embodiment of the present application;

[0028] Figure 6 Another schematic diagram of a power module provided in an embodiment of the present application;

[0029] Figure 7 Another schematic diagram of a power module provided in an embodiment of the present application;

[0030] Figure 8 A schematic diagram of a first circuit board provided in an embodiment of the present application;

[0031] Fig. 9 Another schematic diagram of the first circuit board provided in an embodiment of the present application;

[0032] Fig.10 Another schematic diagram of the first circuit board provided in an embodiment of the present application;

[0033] Fig.11 Another schematic diagram of the first circuit board provided in an embodiment of the present application;

[0034] Fig.12 Another schematic diagram of the first circuit board provided in an embodiment of the present application;

[0035] Fig.13 Another schematic diagram of the first circuit board provided in an embodiment of the present application;

[0036] Fig.14 Another schematic diagram of an electronic component provided by an embodiment of the present application;

[0037] Fig.15 Another schematic diagram of an electronic component provided by an embodiment of the present application;

[0038] Fig.16 Another schematic diagram of an electronic component provided by an embodiment of the present application;

[0039] Fig.17 Another schematic diagram of an electronic component provided by an embodiment of the present application;

[0040] Fig.18 Another schematic diagram of an electronic component provided in an embodiment of the present application.

[0041] Reference numerals:

[0042] 10- Communication system 11- Communication equipment 12- Terminal equipment

[0043] 30-electronic component 31-power module 32-first circuit board

[0044] 33-discrete device 34-first heat sink 35-first heat conducting layer

[0045] 36- second circuit board 37- second heat sink 38- second heat conducting layer

[0046] 33a - first discrete device 33b - second discrete device 33c - third discrete device

[0047] 33d- fourth discrete device 110- transmitter 311- flange

[0048] 312-RF power device 313-packaging layer 314-first input pad

[0049] 315 - first output pad 316 - first ground pad 317 - conductive circuit

[0050] 318 - third input pad 319 - third output pad 321 - second input pad

[0051] 322 - second output pad 323 - second ground pad 324 - insulating dielectric layer

[0052] 325- slot 326- first through hole 327- metal part

[0053] 328 - second through hole 329 - wiring portion 3111 - conductive column

[0054] 3131-first conductor 3132-second conductor 3211-third conductor

[0055] 3221- fourth conductor R0- first projection area R1- first demetallized area

[0056] R2- second demetallized area R4- fourth demetallized area S1- first surface

[0057] S2-Second Surface DETAILED DESCRIPTION

[0058] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings.

[0059] In order to facilitate the understanding of the electronic components provided in the embodiments of the present application, the application scenarios are described below. The electronic components provided in the embodiments of the present application can be applied to various communication systems, including but not limited to: global system of mobile communication (GSM) system, code division multiple access (CDMA) system, wideband code division multiple access (WCDMA) system, general packet radio service (GPRS), long term evolution (LTE) system, LTE frequency division duplex (FDD) system, LTE time division duplex (TDD), universal mobile telecommunication system (UMTS), worldwide interoperability for microwave access (WiMAX) communication system, 5G system or new radio (NR), and future sixth generation mobile communication technology system, etc.

[0060] Figure 1 A schematic diagram of a communication system provided in an embodiment of the present application. Figure 1As shown, the communication system 10 includes at least one communication device 11. The communication device 11 provided in the embodiment of the present application may refer to a radio access network (RAN) node / device that accesses a terminal device to a wireless network. The communication device 11 may also be referred to as an access network device or a wireless access device, for example, the communication device 11 may be a base station. Base stations include, but are not limited to: evolutionary node B (eNB or eNodeB) in LTE systems, base stations (node ​​B, NB) in WCDMA systems, base stations (base transceiver station, BTS) in GSM or CDMA systems, base stations in future 5G networks, base stations in future evolved PLMN networks, home base stations, new wireless base stations, vehicle-mounted devices, wearable devices, wireless controllers in cloud radio access networks (cloudradio access network, CRAN) scenarios, relay stations, access points, transmission points (transmitting and receiving point, TRP), transmission points (transmitting point, TP), baseband units (building base band unit, BBU), radio frequency remote units (remote radio unit, RRU), AAU, radio frequency heads (remote radio head, RRH), central units (central unit, CU), distributed units (distributed unit, DU), positioning nodes, etc. The above base stations can be fixed or mobile, and the base stations can support networks with the same or different access technologies. The embodiments of the present application do not limit the specific technology and specific device form adopted by the communication device 11. Of course, the communication device 11 may also be a transmitter, or a radar, or other devices with similar functions.

[0061] The communication system 10 can be used to communicate with at least one terminal device 12, and the at least one terminal device 12 can communicate with the at least one communication device 11. When the communication device 11 communicates with the terminal device 12, one communication device 11 can manage one or more terminal devices 12. The terminal device 12 is a device used to communicate with the communication device 11, including but not limited to: user equipment (UE), access terminal, user unit, user station, mobile station, mobile station (MS), mobile terminal (MT), remote station, remote terminal, mobile device, user terminal, terminal, wireless communication device, user agent or user device. For example, the terminal device 12 can be a device that provides voice and / or data connectivity to a user, and can be used to connect people, objects and machines, such as a handheld device with wireless connection function, a vehicle-mounted device, etc. Alternatively, the terminal device 12 may be a mobile phone, a tablet computer, a laptop computer, a PDA, a mobile internet device (MID), a wearable device, a virtual reality (VR) device, an augmented reality (AR) device, a wireless terminal in industrial control, a wireless terminal in unmanned driving, a wireless terminal in remote surgery, a wireless terminal in a smart grid, a wireless terminal in transportation safety, a wireless terminal in a smart city, a wireless terminal in a smart home, etc.

[0062] Figure 2 A schematic diagram of a communication device provided in an embodiment of the present application. Figure 2 As shown, the communication device 11 includes an electronic component 30. The electronic component 30 is used to increase the power level of the signal, thereby expanding the coverage of the communication device 11. Optionally, the communication device 11 also includes an antenna, which is connected to the electronic component 30 signal, so that the signal after the power level of the electronic component 30 is increased is finally sent to the outside through the antenna.

[0063] Figure 3 A schematic diagram of a transmitter provided in an embodiment of the present application. Figure 3 As shown, in one embodiment, the communication device 11 may be a transmitter 110. The transmitter 110 may include a modulation module, a frequency conversion module, a power module (eg Figure 3 The power module includes at least one electronic component, and each electronic component includes a power module.

[0064] Current power modules usually use immersed packaging technology to package RF power devices and embed them into the slots of the circuit board. During the assembly process, the input pins and output pins of the power module are conductively connected to the circuit board respectively. However, due to processing errors, the plane where the input pins and output pins are located may not be on the same plane as the wiring layer of the circuit board. Therefore, the input pins and output pins need to be bent to be soldered to the wiring layer of the circuit board, which increases the parasitic parameters of the power module. In addition, the slots of the circuit board may have dimensional deviations due to processing errors, resulting in inconsistencies in the output and / or input ends after the power module is embedded in the slots, which ultimately leads to performance fluctuations of the electronic components and affects the performance of the electronic components.

[0065] Therefore, the present application provides an electronic component and a communication device to reduce the tolerance and parasitic parameters generated when assembling a power module and a circuit board, thereby improving the performance of the electronic component.

[0066] It should be noted that the terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to be limiting of the present application. As used in the specification and appended claims of the present application, the singular expressions "a", "an", "said", "above", "the" and "this" are intended to also include expressions such as "one or more", unless there is a clear indication to the contrary in the context.

[0067] References to "one embodiment" or "some embodiments" etc. described in this specification mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear at different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0068] Figure 4 A schematic diagram of an electronic component provided in an embodiment of the present application. Figure 4 As shown, the electronic component 30 includes a power module 31 and a first circuit board 32. The power module 31 is arranged opposite to the first circuit board 32, and the power module 31 is conductively connected to the first circuit board 32. The power module 31 and the first circuit board 32 are described in detail below.

[0069] Figure 5 A schematic diagram of a power module provided in an embodiment of the present application. Figure 5As shown, the power module 31 includes a flange 311, a radio frequency power device 312 and a packaging layer 313. Specifically, the flange 311 is a metal carrier with heat and electricity conduction functions. The packaging layer 313 is located on the side of the flange 311 facing the first circuit board 32, and the packaging layer 313 is connected to the flange 311. The radio frequency power device 312 is arranged in the packaging layer 313. In other words, the packaging layer 313 covers the radio frequency power device 312 and packages the radio frequency power device 312. The radio frequency power device 312 may include a tube core (bare die) having a radio frequency power amplification function, as well as other circuit wiring. A first input pad 314, a first output pad 315 and a first ground pad 316 are provided on the surface of the packaging layer 313 facing the first circuit board 32. The first input pad 314 is conductively connected to the input end of the radio frequency power device 312, the first output pad 315 is conductively connected to the output end of the radio frequency power device 312, and the first ground pad 316 is conductively connected to the flange 311.

[0070] It should be noted that, in the embodiments of the present application, the conductive connection between A and B may refer to A and B being directly in contact and connected to achieve electrical connection, or it may refer to A and B being connected through a conductor (such as a metal conductive column, a metal wire or a jumper, etc.) to achieve electrical connection.

[0071] Please continue reading Figure 5 , in the plane of the packaging layer 313 facing the first circuit board 32, the first grounding pad 316 can be arranged on the peripheral side of the first input pad 314 and the first output pad 315, and the first input pad 314, the first output pad 315 and the first grounding pad 316 are arranged at intervals from each other. The shapes of the first input pad 314, the first output pad 315 and the first grounding pad 316 are not limited. For example, in one embodiment, the first grounding pad 316 can be a first annular grounding pad, and the first input pad 314 and the first output pad 315 are located in the first annular grounding pad 316 and are respectively arranged at intervals from the first annular grounding pad. Figure 6 Another schematic diagram of a power module provided in an embodiment of the present application. Figure 6 As shown, in another embodiment, the first ground pad 316 may include a plurality of first ground pad points, and the plurality of first ground pad points are arranged in a ring shape around the first input pad 314 and the first output pad 315 . Figure 7 Another schematic diagram of a power module provided in an embodiment of the present application. Figure 7As shown, in another embodiment, the first grounding pad 316 may include at least one first strip grounding pad. Specifically, in one embodiment, the at least one first strip grounding pad may include a first strip grounding pad in a surface of the packaging layer 313 facing the first circuit board 32, and the first strip grounding pad may be located on the side of the first input pad 314 away from the first output pad 315, or may be located on the side of the first output pad 315 away from the first input pad 314, or may be located on the same side of the first input pad 314 and the first output pad 315. In another embodiment, the at least one first strip grounding pad may include two first strip grounding pads, and the two first strip grounding pads are arranged oppositely and in parallel. The first input pad 314 and the first output pad 315 are located between the two first strip grounding pads.

[0072] like Figure 5 As shown, the flange 311 is conductively connected to the first ground pad 316. Specifically, in one embodiment, a conductive column 3111 is provided on the side surface of the flange 311 facing the first circuit board 32, and the conductive column 3111 can penetrate the packaging layer 313 and be conductively connected to the first ground pad 316. In an embodiment of the present application, the material of the conductive column 3111 can be different from the material of the flange 311, and the conductive column 3111 and the flange 311 are connected by welding. Of course, the material of the conductive column 3111 can also be the same as the material of the flange 311, and it is made by an integrated molding process. In some implementations, a plurality of conductive columns 3111 can be provided on the surface of the flange 311, and the aforementioned plurality of conductive columns 3111 can be arranged in an array.

[0073] When the first input pad 314 and the first output pad 315 are specifically provided, the packaging layer 313 may be provided with a first through-hole and a second through-hole. The first through-hole and the second through-hole respectively penetrate the packaging layer 313. A first conductor 3131 is provided in the first through-hole, and the first input pad 314 and the RF power device 312 may be conductively connected through the first conductor 3131. A second conductor 3132 is provided in the second through-hole, and the first output pad 315 and the RF power device 312 may be conductively connected through the second conductor 3132.

[0074] In addition, in one embodiment, the power module 31 may include two RF power devices 312. A conductive circuit 317 is also provided on the surface of the packaging layer 313 facing the first circuit board 32, and the conductive circuit 317 is used to conductively connect the two RF power devices 312. Specifically, the conductive circuit 317 can also be connected to the two RF power devices 312 through two conductors, which will not be described in detail here.

[0075] Figure 8A schematic diagram of a first circuit board provided in an embodiment of the present application. Figure 8 As shown, the first circuit board 32 has a first surface S1 and a second surface S2 that are arranged opposite to each other, wherein the first surface S1 is arranged toward the power module 31, and the second surface S2 is arranged away from the power module 31. The first surface S1 is provided with a second input pad 321, a second output pad 322, and a second ground pad 323. The shapes of the second input pad 321, the second output pad 322, and the second ground pad 323 are not limited. Among them, the second input pad 321 is arranged opposite to the first input pad 314 and is conductively connected, the second output pad 322 is arranged opposite to the first output pad 315 and is conductively connected, and the second ground pad 323 is arranged opposite to the first ground pad 316 and is conductively connected, so that the power module 31 can be directly opposite to and connected to the first circuit board 32, thereby reducing the assembly tolerance. It can be understood that the relative arrangement of A and B means that the projection of A on the first surface S1 and the projection of B on the first surface S1 at least partially overlap in the direction perpendicular to the first circuit board 32. Herein, at least partial overlap means that a part of the projection of A on the first surface S1 overlaps with a part of the projection of B on the first surface S1; or, the projection of A on the first surface S1 covers the projection of B on the first surface S1; or, the projection of B on the first surface S1 covers the projection of A on the first surface S1; or, the projection of A on the first surface S1 completely overlaps with the projection of B on the first surface S1.

[0076] Please continue reading Figure 8 , along a direction perpendicular to the first circuit board 32 (eg Figure 8 The power module 31 has a first projection area R0 on the first surface S1. The first surface S1 has a first demetallized area R1, the first demetallized area R1 is located in the first projection area R0, and the first demetallized area R1 is located between the second input pad 321 and the second output pad 322. The second surface S2 has a second demetallized area R2, along the direction perpendicular to the first circuit board 32, the projection of the second demetallized area R2 on the first surface S1 is located in the first projection area R0, and the second demetallized area R2 is located between the second input pad 321 and the second output pad 322. In the embodiment of the present application, when the electronic component 30 is working, the RF signal of the power module 31 is from the first input pad 314 to the first output pad 315, so the RF signal path area is located between the first input pad 314 and the first output pad 315. That is, the RF signal path area is located between the second input pad 321 and the second output pad 322. Therefore, the first demetallized region R1 and the second demetallized region R2 can reduce the influence of the first circuit board 32 on the radio frequency signal of the power module 31, and avoid problems such as signal short circuit or cavity effect.

[0077] In one embodiment, along a direction perpendicular to the first circuit board 32, the projection of the second demetallized region R2 on the first surface S1 may at least partially overlap with the first demetallized region R1. Figure 8 As shown, in a specific embodiment, the projection of the second demetallized region R2 on the first surface S1 may completely overlap with the first demetallized region R1. Fig. 9 Another schematic diagram of the first circuit board provided in the embodiment of the present application. Fig. 9 As shown, in another embodiment, the projection of the second demetallized region R2 on the first surface S1 may not overlap with the first demetallized region R1.

[0078] Specifically, the first demetallized region R1 and the second demetallized region R2 can be realized in different ways. Figure 8 and Fig. 9 As shown, in one embodiment, the first demetallized region R1 and the second demetallized region R2 are provided with an insulating dielectric layer 324. The insulating dielectric layer 324 may be an insulating dielectric layer of the first circuit board 32. In this embodiment, when the first demetallized region R1 and the second demetallized region R2 are actually manufactured, demetallization can be achieved by directly removing the surface metal traces located in the first demetallized region R1 in the first surface S1 of the first circuit board 32, and demetallization can be achieved by removing the surface metal traces located in the second demetallized region R2 in the second surface S2 of the first circuit board 32. This method is simple and easy to operate, and can reduce the manufacturing cost of the first circuit board 32.

[0079] Fig.10 Another schematic diagram of the first circuit board provided in the embodiment of the present application. Fig.10 As shown, in another embodiment, the insulating dielectric layer 324 may be provided with a slot 325. Specifically, the first demetallized region R1 may be provided with a slot 325, and the opening of the slot 325 is arranged toward the power module 31. The second demetallized region R2 may also be provided with a slot 325, and the opening of the slot 325 is arranged toward the direction of the power module 31. Fig.11 Another schematic diagram of the first circuit board provided in the embodiment of the present application. Fig.11 As shown, in another embodiment, the insulating dielectric layer 324 may be provided with a first through hole 326. The first through hole 326 penetrates the insulating dielectric layer 324 and connects the first demetallized region R1 and the second demetallized region R2. That is, the entire first through hole 326 may form a demetallized region that penetrates the first circuit board 32.

[0080] Of course, it is understandable that in practical applications, the first circuit board 32 may be a multi-layer circuit board. The multi-layer circuit board may include at least three stacked metal circuit layers, with two adjacent metal circuit layers being insulated and spaced apart by an insulating dielectric layer 324 . Fig.12 Another schematic diagram of the first circuit board provided in the embodiment of the present application. Fig.12 As shown, during demetallization, the metal portion of the metal circuit layer located in the first surface S1 and the second surface S2 is removed, but the metal circuit layer between two adjacent insulating dielectric layers 324 can be retained, but the metal circuit layer is at least partially demetallized. For example, in one embodiment, a metal portion 327 is also provided in the insulating dielectric layer 324.

[0081] Fig.13 Another schematic diagram of the first circuit board provided in the embodiment of the present application. Fig.13 As shown, of course, in another embodiment, the first demetallized region R1 and the second demetallized region R2 can be directly connected through the second through hole 328. That is to say, no insulating dielectric layer 324 is provided between the first demetallized region R1 and the second demetallized region R2, and between the second input pad 321 and the second output pad 322.

[0082] Please continue reading Figure 8 The first circuit board 32 is provided with a third conductor 3211 and a fourth conductor 3221. The third conductor 3211 can be located in the first demetallized area R1 and the second demetallized area R2, and the third conductor 3211 is connected to the second input pad 321. The fourth conductor 3221 can be located in the first demetallized area R1 and the second demetallized area R2 and is connected to the second output pad 322.

[0083] In the above embodiment, the cross section of the third conductor 3211 perpendicular to the thickness direction of the first circuit board 32 has a projection on the first surface S1. The projection of the third conductor 3211 can fall into the second input pad 321, that is, the cross-sectional size of the third conductor 3211 is smaller than the size of the second input pad 321 on the first surface S1. Alternatively, the projection of the third conductor 3211 can also completely overlap with the second input pad 321, that is, the cross-sectional size of the third conductor 3211 is equal to the size of the second input pad 321 on the first surface S1. Alternatively, the projection of the third conductor 3211 can also cover the second input pad 321, that is, the cross-sectional size of the third conductor 3211 is larger than the size of the second input pad 321 on the first surface S1. Similarly, the cross section of the fourth conductor 3221 perpendicular to the thickness direction of the first circuit board 32 has a projection on the first surface S1. The projection of the fourth conductor 3221 may fall within the second output pad 322, that is, the cross-sectional size of the fourth conductor 3221 is smaller than the size of the second output pad 322 on the first surface S1. Alternatively, the projection of the fourth conductor 3221 may also completely overlap with the second output pad 322, that is, the cross-sectional size of the third conductor 3211 is equal to the size of the second output pad 322 on the first surface S1. Alternatively, the projection of the fourth conductor 3221 may also cover the second output pad 322, that is, the cross-sectional size of the fourth conductor 3221 is larger than the size of the second output pad 322 on the first surface S1.

[0084] like Figure 8 As shown, in a specific embodiment, within the first projection area R0, the first demetallized area R1 extends to the second input pad 321 and the second output pad 322 on the first surface S1, and the projection of the second demetallized area R2 on the first surface S1 also extends to the second input pad 321 and the second output pad 322. In this embodiment, the area between the first surface S1 and the second surface S2, and between the third conductor 3211 and the fourth conductor 3221 can also be demetallized to form an intermediate demetallized area. The intermediate demetallized area can be an irregular shape. Specifically, along the direction perpendicular to the first circuit board, the first demetallized area R1 and the second demetallized area R2 can completely overlap, and the projection of the intermediate demetallized area on the first surface S1 can be smaller than the first demetallized area R1, or can be equal to the first demetallized area R1 (that is, the projection of the intermediate demetallized area completely overlaps with the first demetallized area R1), or can be larger than the first demetallized area R1.

[0085] In one embodiment, the second surface S2 may be provided with a wiring portion 329, and the second demetallized region R2 is provided in the wiring portion 329. The third conductor 3211 may be used to conductively connect the second input pad 321 and the third wiring portion 329, and the fourth conductor 3221 may be used to conductively connect the second output pad 322 and the third wiring portion 329.

[0086] In practical applications, the second surface S2 of the first circuit board 32 may be provided with at least one discrete device 33, and the at least one discrete device 33 may be conductively connected to the wiring portion 329. In the present application, the discrete device 33 includes but is not limited to electronic devices such as resistors, capacitors or inductors.

[0087] Fig.14 Another schematic diagram of an electronic component provided in an embodiment of the present application. Fig.14 As shown, in one embodiment, the electronic component 30 can be a dual-channel module. Specifically, in the power module 31, the surface of the packaging layer 313 facing the first circuit board 32 is also provided with a third input pad 318, a third output pad 319 and a third ground pad, wherein the third input pad 318 and the third output pad 319 are respectively conductively connected to the RF power device 312, and the third ground pad is conductively connected to the flange 311. The first input pad 314 and the first output pad 315 can form a first channel, and the third input pad 318 and the third output pad 319 can form a second channel. The third ground pad can be an integrally formed structure with the first ground pad 316. Correspondingly, in the first projection area R0 of the first circuit board 32, the first surface S1 is also provided with a fourth input pad, a fourth output pad and a fourth ground pad. The fourth input pad is arranged opposite to and conductively connected to the third input pad 318, the fourth output pad is arranged opposite to and conductively connected to the third output pad 319, and the fourth ground pad is arranged opposite to and conductively connected to the third ground pad. In addition, the first surface S1 also has a third demetallized area, which is located in the first projection area R0 and between the fourth input pad and the fourth output pad. The second surface S2 also has a fourth demetallized area R4, and along the direction perpendicular to the first circuit board 32, the projection of the fourth demetallized area R4 on the first surface S1 is located in the first projection area R0 and between the fourth input pad and the fourth output pad.

[0088] In the above embodiment, on one side surface of the packaging layer 313 facing the first circuit board 32, the first input pad 314 and the third input pad 318 can be aligned, and the first output pad 315 and the third output pad 319 can be aligned. That is, the first channel and the second channel have the same center line (such as Fig.14 mid-dotted line). Fig.15Another schematic diagram of an electronic component provided in an embodiment of the present application. Fig.15 As shown, the first channel and the second channel may also be staggered, that is, the center line of the first channel and the center line of the second channel may not overlap. In this embodiment, each channel may be provided with two discrete devices 33. Specifically, the first channel is provided with a first discrete device 33a and a second discrete device 33b, and the first discrete device 33a and the second discrete device 33b are respectively located on both sides of the second demetallized region R2. The second channel is provided with a third discrete device 33c and a fourth discrete device 33d, and the third discrete device 33c and the fourth discrete device 33d are respectively located on both sides of the fourth demetallized region R4. In this way, the first channel and the second channel are independent of each other, which can reduce the risk of interference in the layout between channels. It can be understood that the electronic component 30 of the present application can also be a three-channel module or a multi-channel module, which is not specifically limited here.

[0089] In the above embodiment, the first distance d1 between the first discrete device 33a and the second demetallized region R2, the second distance d2 between the second discrete device 33b and the second demetallized region R2, the third distance d3 between the third discrete device 33c and the fourth demetallized region R4, and the fourth distance d4 between the fourth discrete device 33d and the fourth demetallized region R4 can be set to equal distances, thereby improving the design freedom.

[0090] Fig.16 Another schematic diagram of an electronic component provided in an embodiment of the present application. Fig.16 As shown, the electronic component 30 further includes a first heat sink 34. The first heat sink 34 is disposed on the side of the flange 311 away from the first circuit board 32 and is used to dissipate heat for the power module 31. The first heat sink 34 can be used only for heat dissipation without conducting electricity.

[0091] When the electronic component 30 is working, the return path can pass through the second ground pad 323, the first ground pad 316, the flange 311, the first output pad 315, the second output pad 322, the fourth conductor 3221 and the discrete device 33 from the first circuit board 32. The return path does not need to pass through the first heat sink 34, and the path is shorter, so that the consistency of the electronic component 30 can be better.

[0092] In practical applications, in order to improve the heat transfer efficiency of the surface where the flange 311 contacts the first heat sink 34, a first heat conducting layer 35 is provided between the flange 311 and the first heat sink 34. The first heat conducting layer 35 is in close contact with the surfaces of the flange 311 and the first heat sink 34, respectively, to improve the heat transfer efficiency.

[0093] Fig.17 Another schematic diagram of an electronic component provided in an embodiment of the present application. Fig.17 As shown, in one embodiment, the electronic component 30 can be applied to a multi-circuit board scenario. Specifically, the electronic component 30 also includes a second circuit board 36. The second circuit board 36 is located on the side of the first circuit board 32 facing the power module 31, and the second circuit board 36 is fixedly connected to the first circuit board 32, and the power module 31 is arranged in the second circuit board 36.

[0094] Fig.18 Another schematic diagram of an electronic component provided in an embodiment of the present application. Fig.18 As shown, in one embodiment, the electronic component 30 further includes a second heat sink 37. The second heat sink 37 is located on the side of the second circuit board 36 away from the first circuit board 32, and the second heat sink 37 is located on the side of the first heat sink 34 away from the first circuit board 32. The second heat sink 37 can be used to dissipate heat from the power module 31 and the second circuit board 36. In order to improve the heat transfer efficiency of the surface where the second circuit board 36 contacts the second heat sink 37, a second heat conducting layer 38 is provided between the second circuit board 36 and the second heat sink 37, and the second heat conducting layer 38 is in close contact with the surfaces of the second circuit board 36 and the second heat sink 37, respectively. In addition, the second heat conducting layer 38 can also extend between the first heat sink 34 and the second heat sink 37, and the second heat conducting layer 38 is in close contact with the surfaces of the first heat sink 34 and the second heat sink 37, respectively.

[0095] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An electronic component, characterized in that: It includes a power module and a first circuit board, wherein: The power module comprises a flange, a packaging layer and a radio frequency power device; the packaging layer is located on a side of the flange facing the first circuit board and is connected to the flange, and the radio frequency power device is arranged in the packaging layer; a first input pad, a first output pad and a first ground pad are arranged on a surface of the packaging layer facing the first circuit board, the first input pad and the first output pad are respectively conductively connected to the radio frequency power device, and the first ground pad is conductively connected to the flange; A second input pad, a second output pad and a second ground pad are disposed on a first surface of the first circuit board facing the power module, the second input pad is disposed opposite to and conductively connected to the first input pad, the second output pad is disposed opposite to and conductively connected to the first output pad, and the second ground pad is disposed opposite to and conductively connected to the first ground pad; The power module has a first projection area on the first surface along a direction perpendicular to the first circuit board; the first surface has a first demetallized area, the first demetallized area is located within the first projection area and between the second input pad and the second output pad; the second surface of the first circuit board facing away from the power module has a second demetallized area, and along the direction perpendicular to the first circuit board, the projection of the second demetallized area on the first surface is located within the first projection area and between the second input pad and the second output pad.

2. The electronic component according to claim 1, wherein: Along a direction perpendicular to the first circuit board, a projection of the second demetallized area on the first surface at least partially overlaps with the first demetallized area.

3. The electronic component according to claim 2, wherein: Along a direction perpendicular to the first circuit board, a projection of the second demetallized area on the first surface completely overlaps with the first demetallized area.

4. The electronic component according to claim 1, wherein: Along a direction perpendicular to the first circuit board, a projection of the second demetallized area on the first surface does not overlap with the first demetallized area.

5. The electronic component according to any one of claims 1 to 4, characterized in that: An insulating dielectric layer is disposed between the first demetallized region and the second demetallized region, and the insulating dielectric layer connects the first demetallized region and the second demetallized region.

6. The electronic component according to claim 5, characterized in that The insulating dielectric layer is provided with a groove, and the opening of the groove is located in the first demetallized area or the second demetallized area; Alternatively, the insulating dielectric layer is provided with a first through hole, the first through hole penetrates the insulating dielectric layer and connects the first demetallized region and the second demetallized region.

7. The electronic component according to any one of claims 1 to 4, characterized in that: A second through hole is disposed between the first demetallized region and the second demetallized region, and the second through hole connects the first demetallized region and the second demetallized region.

8. The electronic component according to any one of claims 1 to 7, characterized in that: The first circuit board is provided with a first conductor and a second conductor, the first conductor is located in the first demetallized area and the second demetallized area and connected to the second input pad, and the second conductor is located in the first demetallized area and the second demetallized area and connected to the second output pad.

9. The electronic component according to claim 8, characterized in that The second surface is provided with a wiring portion, and the second demetallized area is provided in the wiring portion; the first conductor is conductively connected to the second input pad and the wiring portion, and the second conductor is conductively connected to the second output pad and the wiring portion.

10. The electronic component according to any one of claims 1 to 9, characterized in that: The packaging layer is provided with a first through-hole and a second through-hole, the first through-hole and the second through-hole respectively penetrate the packaging layer, the first through-hole is provided with a third conductor, the first input pad and the RF power device are conductively connected through the third conductor, the second through-hole is provided with a fourth conductor, the second input pad and the RF power device are conductively connected through the fourth conductor.

11. The electronic component according to any one of claims 1 to 10, characterized in that: A fifth conductor is disposed on a surface of the flange facing the first circuit board. The fifth conductor penetrates the packaging layer and conductively connects the flange and the first ground pad.

12. The electronic component according to any one of claims 1 to 11, characterized in that: The electronic component is a dual-channel module; A third input pad, a third output pad and a third ground pad are also provided on a surface of the packaging layer facing the first circuit board, wherein the third input pad and the third output pad are respectively conductively connected to the RF power device, and the third ground pad is conductively connected to the flange; The first surface is further provided with a fourth input pad, a fourth output pad and a fourth ground pad, the fourth input pad is arranged opposite to and conductively connected to the third input pad, the fourth output pad is arranged opposite to and conductively connected to the third output pad, and the fourth ground pad is arranged opposite to and conductively connected to the third ground pad; The first surface also has a third demetallized area, which is located within the first projection area and between the fourth input pad and the fourth output pad; the second surface also has a fourth demetallized area, and along a direction perpendicular to the first circuit board, the projection of the fourth demetallized area on the first surface is located within the first projection area and between the fourth input pad and the fourth output pad.

13. The electronic component according to claim 12, wherein: A first discrete device, a second discrete device, a third discrete device and a fourth discrete device are arranged on a side of the first circuit board facing away from the power module. The first discrete device and the second discrete device are respectively located on both sides of the second demetallized area, and the third discrete device and the fourth discrete device are respectively located on both sides of the fourth demetallized area.

14. The electronic component according to any one of claims 1 to 13, characterized in that: The electronic component further includes a first heat sink, which is disposed on a side of the flange away from the first circuit board and is used to dissipate heat for the power module.

15. The electronic component according to claim 14, wherein: A first heat-conducting layer is arranged between the flange and the first heat sink.

16. The electronic component according to any one of claims 1 to 15, characterized in that: The electronic component further includes a second circuit board, which is located on a side of the first circuit board facing the power module and is connected to the first circuit board. The power module is disposed in the second circuit board.

17. A communication device, characterized in that: Comprising the electronic component as claimed in any one of claims 1 to 16.

Images