A VCSEL laser and a method for manufacturing the same

Abstract

The present invention discloses a VCSEL laser and a preparation method thereof. The preparation method includes providing a flexible substrate and a mounting base. The mounting base includes a mounting groove. The mounting groove includes a mounting bottom surface perpendicular to the first direction and a mounting side surface inclined relative to the mounting bottom surface. A plurality of VCSEL chips arranged at intervals are welded on the flexible substrate. The flexible substrate is attached to the mounting base, and the flexible substrate is attached to the mounting bottom surface and the mounting side surface, so that VCSEL chips are attached to both the mounting bottom surface and the mounting side surface through the flexible substrate. A refractive mirror is installed at the notch of the mounting groove. The refractive mirror is arranged corresponding to the VCSEL chips on the mounting side surface for refracting the laser of the VCSEL chips on the mounting side surface to the first direction. By providing a flexible substrate pre-mounted with a plurality of VCSEL chips, the installation accuracy of the VCSEL chips and the mounting groove is guaranteed. At the same time, by attaching the flexible substrate to the mounting bottom surface and the mounting side surface, VCSEL chips are attached to both the mounting bottom surface and the mounting side surface through the flexible substrate, and the installation density is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of lasers, and in particular to a VCSEL laser and a preparation method thereof. Background Art

[0002] VCSEL (Vertical Cavity Surface Emitting Laser) is one of many lasers. Specifically, it adopts a vertical cavity structure, enabling the laser to be vertically emitted from the chip surface, thus having advantages such as high beam quality, low power consumption, easy large-scale integration and packaging, and is widely used in fields such as optical communication, 3D sensing, face recognition, lidar, augmented reality, virtual reality, etc.; especially in scenarios such as smartphones and autonomous driving, the VCSEL laser plays a crucial role as the core light source.

[0003] Existing VCSEL lasers are usually packaged using a rigid substrate. The specific packaging method includes: individually mounting single VCSEL chips on the rigid substrate one by one, and then completing the electrical connection between the rigid substrates of the VCSEL chips. This packaging method has been widely used in the production of VCSEL lasers. However, in the actual application process, there are still some problems that are difficult to solve in the existing packaging method. For example, the error accumulation of the mounting accuracy and the limited installation density of the VCSEL chips.

[0004] It can be understood that under the conventional packaging method, it is difficult to solve these two problems simultaneously: in order to reduce the influence of mounting errors, usually high-precision chip mounters need to be used, and precise alignment and independent mounting are required for each VCSEL chip, but this will limit the arrangement of the chips, making it difficult to increase the installation density of the chips. On the contrary, if an attempt is made to increase the installation density of the chips, such as by arranging them more closely or mounting the VCSEL chips obliquely, a plurality of rigid substrates need to be introduced, and the accuracy between the rigid substrates will affect the above-mentioned error accumulation, resulting in a further increase in the mounting error and affecting the optical performance.

[0005] In summary, the existing packaging method of VCSEL lasers has defects in mounting accuracy and chip installation density, and it is difficult to optimize simultaneously under the existing process. Therefore, there is an urgent need for a new VCSEL laser, aiming to increase the installation density of VCSEL chips while reducing the influence of mounting errors, thereby improving the overall performance and production quality stability of VCSEL lasers. Summary of the Invention

[0006] The purpose of the present invention is to provide a VCSEL laser and a preparation method thereof, to solve the problem that it is difficult to improve the production quality stability and the performance of the VCSEL laser simultaneously in the existing technology.

[0007] To achieve this purpose, the present invention adopts the following technical solutions:

[0008] A method for manufacturing a VCSEL laser, comprising:

[0009] Step S100: Provide a flexible substrate and a mounting base. The mounting base includes a mounting groove, and the mounting groove includes a mounting bottom surface perpendicular to the first direction and a mounting side surface inclined relative to the mounting bottom surface. A plurality of VCSEL chips are welded on the flexible substrate at intervals;

[0010] Step S200: Attach the flexible substrate to the mounting base, and make the flexible substrate fit with the mounting bottom surface and the mounting side surface, so that VCSEL chips are attached to both the mounting bottom surface and the mounting side surface through the flexible substrate;

[0011] Step S300: Install a refractive mirror at the notch of the mounting groove. The refractive mirror is arranged corresponding to the VCSEL chip on the mounting side surface for refracting the laser of the VCSEL chip on the mounting side surface to the first direction.

[0012] Optionally, the mounting side surface includes a first side surface and a second side surface that are sequentially arranged and connected in a direction away from the mounting bottom surface, and relative to the refractive mirror, the first side surface protrudes from the second side surface; the first side surface and the second side surface are connected by a transition plane;

[0013] A first bending portion is formed by bending the flexible substrate at a position corresponding to the first side surface, a second bending portion is formed by bending the flexible substrate at a position corresponding to the second side surface, and a transition bending portion is formed by bending at a position corresponding to the transition plane.

[0014] Optionally, the step S200 includes:

[0015] Step S210: Attach the middle part of the flexible substrate to the mounting bottom surface;

[0016] Step S220: Perform a first bending on the flexible substrate to form a first bending portion that fits on the first side surface, and perform a second bending on the first bending portion to form a transition bending portion that fits on the transition plane and a second bending portion that fits on the second side surface.

[0017] Optionally, the step S100 includes:

[0018] Step S101: Set a rigid substrate on the bonding surface of the flexible substrate, and the rigid substrate is arranged corresponding to the mounting bottom surface;

[0019] Step S102: Provide a first positioning member, pass the first positioning member through the flexible substrate and the rigid substrate, and partially embed it into the first positioning hole on the mounting bottom surface;

[0020] Step S103: Symmetrically install VCSEL chips on the bonding surface of the flexible substrate with the first positioning member as a reference.

[0021] The step S200 includes:

[0022] Step S211: Bond the rigid substrate to the mounting bottom surface, and the lower edge of the rigid substrate abuts against the mounting side surface.

[0023] Optionally, the step S300 includes:

[0024] Step S310: Deposit a sealing layer on the edge of the notch of the mounting groove.

[0025] Step S320: Stack the refractive mirror on the sealing layer.

[0026] Step S330: Sheath the encapsulation housing outside the refractive mirror and the mounting base. The first shell surface of the encapsulation housing presses the refractive mirror against the sealing layer. The second shell surface of the encapsulation housing abuts against the other surface of the mounting base where the mounting groove is provided. The first shell surface and the second shell surface are oppositely arranged.

[0027] Optionally, second positioning holes are respectively provided on the second shell surface and the bottom surface of the mounting base. The second positioning holes are connected to the first positioning holes.

[0028] After the step S330, it further includes:

[0029] Step S340: Provide a second positioning member, insert the second positioning member into the second positioning hole from the second positioning hole and connect it to the first positioning member.

[0030] Optionally, the first positioning hole is a first threaded hole. The first positioning member is formed with an external thread at a position corresponding to the first threaded hole. The first positioning member is provided with a second threaded hole. The second positioning member is formed with an external thread at a position corresponding to the second threaded hole.

[0031] In the step S102, the first positioning member is threadedly connected to the first threaded hole.

[0032] In the step S340, the second positioning member is threadedly connected to the second threaded hole.

[0033] Optionally, the first positioning member protrudes with a first edge portion having a size larger than the first positioning hole, and the second positioning member protrudes with a second edge portion having a size larger than the second positioning hole.

[0034] Optionally, the step S100 further includes:

[0035] Deposit an insulating carrier layer on the notch surface of the mounting groove.

[0036] A VCSEL laser, prepared by the preparation method of the VCSEL laser as described above, includes a flexible substrate and a mounting base; the mounting base includes a mounting groove, the mounting groove includes a mounting bottom surface perpendicular to the first direction and a mounting side surface inclined relative to the mounting bottom surface, and a plurality of VCSEL chips are welded on the flexible substrate at intervals;

[0037] The flexible substrate is attached to the mounting base; a refractive mirror is installed at the notch of the mounting groove, and the refractive mirror is arranged corresponding to the VCSEL chips on the mounting side surface for refracting the laser of the VCSEL chips on the mounting side surface to the first direction.

[0038] Compared with the prior art, the present invention has the following beneficial effects: The VCSEL laser and its preparation method provided by the present invention ensure the installation accuracy of the VCSEL chips on the flexible substrate by providing a flexible substrate pre-mounted with a plurality of VCSEL chips. That is, after the flexible substrate and the mounting groove are attached in the subsequent steps, the installation accuracy of the VCSEL chips and the mounting groove can be ensured; at the same time, the mounting groove includes a mounting bottom surface and a mounting side surface, so that the VCSEL chips can be arranged in multiple dimensions in the subsequent steps, and more space can be utilized, enabling the plurality of VCSEL chips to be arranged more compactly and reasonably, improving the installation density; then, with the setting of the refractive mirror, the final lasers can be emitted tightly along the first direction, without considering the alignment accuracy between multiple substrates, and the accuracy requirements are relatively low, thereby ensuring the stability of production quality. Therefore, the VCSEL laser and its preparation method can ensure the overall performance and production quality stability of the VCSEL laser. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0040] The structures, ratios, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those who are familiar with this technology to understand and read, and are not used to limit the limiting conditions under which the present invention can be implemented. Therefore, they do not have technical substance. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope that the technical content disclosed by the present invention can cover.

[0041] Figure 1 It is a schematic flow chart of the preparation method of the VCSEL laser provided by the present invention;

[0042] Figure 2 Schematic diagram of the partial structure of the VCSEL laser provided by the present invention;

[0043] Figure 3 Schematic diagram of the first state structure of the VCSEL laser provided by the present invention;

[0044] Figure 4 Schematic diagram of the second state structure of the VCSEL laser provided by the present invention;

[0045] Figure 5 Schematic diagram of the third state structure of the VCSEL laser provided by the present invention;

[0046] Figure 6 Schematic diagram of the fourth state structure of the VCSEL laser provided by the present invention;

[0047] Illustration: 100, rigid substrate; 200, flexible substrate; 201, first bending part; 202, second bending part; 203, transition bending part;

[0048] 300, mounting base; 301, mounting bottom surface; 3011, first positioning hole; 302, mounting side surface; 3021, first side surface; 3022, second side surface; 3023, transition plane; 310, insulating carrier layer; 320, sealing layer;

[0049] 400, VCSEL chip; 500, refractive mirror; 510, transmission part; 520, refraction part; 610, first positioning member; 611, first edge part; 612, second threaded hole; 620, second positioning member; 621, second edge part;

[0050] 700, packaging housing; 701, first housing surface; 702, second housing surface; 7021, second positioning hole. Detailed implementation manners

[0051] In order to make the object, features, and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the embodiments described below are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0052] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by terms such as "upper", "lower", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be intermediate components present simultaneously.

[0053] The technical solution of the present invention will be further described below with reference to the drawings and through specific embodiments.

[0054] Embodiment 1:

[0055] The embodiment of the present invention provides a method for fabricating a VCSEL laser. This fabrication method is applicable to the scenario of fabricating a VCSEL laser. In this embodiment, by optimizing this fabrication method, both the overall performance and the production quality stability of the VCSEL laser are ensured.

[0056] As Figure 1 shown, the method for fabricating a VCSEL laser in this embodiment specifically includes:

[0057] Step S100: Provide a flexible substrate 200 and a mounting base 300. The mounting base 300 includes a mounting groove. The mounting groove includes a mounting bottom surface 301 perpendicular to the first direction and a mounting side surface 302 inclined relative to the mounting bottom surface 301. As Figure 2 shown, a plurality of VCSEL chips 400 are welded to the flexible substrate 200 at intervals;

[0058] It can be understood that the first direction is the direction perpendicular to the mounting bottom surface 301. The welding method of the VCSEL chip 400 to the flexible substrate 200 includes, but is not limited to, welding methods such as spot welding and ultrasonic welding. The focus of this embodiment is on connecting the VCSEL chip 400 to the flexible substrate 200, and the specific welding method will not be specifically elaborated. At the same time, the VCSEL chip 400 and the flexible substrate 200 can also adopt other connection methods similar to the chip - on - board process. This solution provides a flexible substrate 200 and a mounting base 300 with an inclined mounting side surface 302, enabling the VCSEL chips 400 to be arranged in multiple dimensions, effectively utilizing more space, enabling the plurality of VCSEL chips 400 to be arranged more compactly and reasonably, and improving the mounting density.

[0059] Step S200: Attach the flexible substrate 200 to the mounting base 300, and make the flexible substrate 200 conform to the mounting bottom surface 301 and the mounting side surface 302, so that VCSEL chips 400 are attached to both the mounting bottom surface 301 and the mounting side surface 302 through the flexible substrate 200;

[0060] It can be understood that since the flexible substrate 200 has a certain degree of flexibility and adaptability, it can be formed into a corresponding shape corresponding to the mounting base 300 without involving the alignment between multiple substrates. Therefore, the accumulation of alignment errors can be effectively reduced, and the error of individual mounting can be prevented from spreading to the entire VCSEL array, making the installation of the VCSEL chips 400 more accurate, improving the optical performance of the VCSEL chip 400 array, and ensuring the beam collimation of the VCSEL laser, which is crucial especially in high-precision applications;

[0061] Step S300: Install a refractive mirror 500 at the notch of the installation groove. The refractive mirror 500 is arranged corresponding to the VCSEL chips 400 on the mounting side surface 302, and is used to refract the laser of the VCSEL chips 400 on the mounting side surface 302 to the first direction. It can be understood that the refractive mirror 500 is used in cooperation with the VCSEL chips 400 on the mounting side surface 302, and can guide the lasers emitted by all the VCSEL chips 400 to the same direction, thereby optimizing the beam quality and avoiding beam divergence caused by chip arrangement errors. Exemplarily, when the inclination angle of the mounting side surface 302 relative to the mounting bottom surface 301 is 45°, a refractive mirror 500 with a refractive angle of 45° is selected, so that the laser emitted by the VCSEL chips 400 is deflected by 45° and emitted along the first direction.

[0062] Specifically, for the VCSEL laser and its manufacturing method provided by the present invention, by providing a flexible substrate 200 pre-mounted with multiple VCSEL chips 400 and ensuring the installation accuracy of the VCSEL chips 400 on the flexible substrate 200, the installation accuracy of the VCSEL chips 400 and the installation groove can be ensured after the flexible substrate 200 is attached to the installation groove in the subsequent steps; at the same time, the installation groove includes a mounting bottom surface 301 and a mounting side surface 302, enabling the VCSEL chips 400 to be arranged in multiple dimensions in the subsequent steps, making better use of more space, enabling the multiple VCSEL chips 400 to be arranged more compactly and reasonably, and improving the installation density; then, in cooperation with the setting of the refractive mirror 500, the lasers can finally be emitted tightly in the first direction, without considering the alignment accuracy between multiple substrates and with relatively low accuracy requirements, thereby ensuring the production quality stability. Therefore, the VCSEL laser and its manufacturing method can ensure the overall performance and production quality stability of the VCSEL laser.

[0063] Furthermore, as Figures 3 to 6As shown, the mounting side surface 302 includes a first side surface 3021 and a second side surface 3022 which are sequentially arranged and connected in a direction away from the mounting bottom surface 301, and relative to the refractor 500, the first side surface 3021 is arranged to protrude from the second side surface 3022; the first side surface 3021 and the second side surface 3022 are connected via a transition plane 3023; the flexible substrate 200 is bent at a position corresponding to the first side surface 3021 to form a first bending portion 201, the flexible substrate 200 is bent at a position corresponding to the second side surface 3022 to form a second bending portion 202, and is bent at a position corresponding to the transition plane 3023 to form a transition bending portion 203.

[0064] It should be supplemented that, for the bending of the flexible substrate 200, it is first partially attached to the mounting bottom surface 301 to achieve preliminary positioning; then, with the first side surface 3021 as a support, it can cooperate with bending machines, hot pressing equipment, molding equipment, non-standard bonding equipment and other devices to complete the bending of the flexible substrate 200. It can be understood that the above-mentioned device is not limited, and can cooperate with the first side surface 3021 to achieve the bending of the flexible substrate 200 to form the first bending portion 201; similarly, other bending portions can also be formed by the same means. At the same time, it should be noted that since the first side surface 3021 protrudes from the second side surface 3022, it means that the second distance between the second side surface 3022, which is farther from the mounting bottom surface 301, and the refractor 500 is greater than the first distance between the first side surface 3021 and the refractor 500; for example, assuming Figure 2 and Figure 3 In the embodiment, the distance between two adjacent VCSEL chips 400 is a, and the distance a is the minimum value that can be achieved in the mounting process or the welding process. Figure 4 As shown, since the second spacing is greater than the first spacing, it means that the flexible substrate 200 is folded inward, so that the spacing between two adjacent VCSEL chips 400 is reduced and is obviously smaller than a, thereby further improving the mounting density.

[0065] Further, step S200 includes:

[0066] Step S210, attaching the middle portion of the flexible substrate 200 to the mounting bottom surface 301;

[0067] Step S220, performing a first bend on the flexible substrate 200 to form a first bend portion 201 attached to the first side surface 3021, performing a second bend on the first bend portion 201 to form a transition bend portion 203 attached to the transition plane 3023 and a second bend portion 202 attached to the second side surface 3022.

[0068] And so on, when the installation side 302 includes a plurality of side faces arranged in sequence and connected in a direction away from the installation bottom face 301, a plurality of VCSEL chips 400 are correspondingly arranged on the flexible substrate 200. For example, when the installation side 302 includes three connected side faces, three VCSEL chips 400 can be correspondingly arranged at one end of the flexible substrate 200; Additionally, referring to along Figure 4 , a plurality of VCSEL chips 400 can be arranged at intervals on the same side face in a direction perpendicular to the plane where they are located.

[0069] It can be understood that through step-by-step bending, the flexible substrate 200 can be precisely adjusted on multiple faces to ensure that each VCSEL chip 400 is installed at an appropriate angle and position, effectively eliminating errors caused by an inappropriate substrate shape, thereby improving the overall installation accuracy and optical performance of the laser. At the same time, since the flexible substrate 200 can be adaptively bent according to the angle of each side face, the installation density of the VCSEL chips 400 can be increased without sacrificing accuracy, enabling high-density installation in a relatively small space and optimizing the design of the optical system.

[0070] Based on the above embodiments, step S100 includes:

[0071] Step S101, a rigid substrate 100 is arranged on the bonding surface of the flexible substrate 200, and the rigid substrate 100 is correspondingly arranged with the installation bottom face 301; The rigid substrate 100 can be selected from plate members that are not easily deformed, such as metal plates and plastic plates, and the setting methods include but are not limited to bonding, welding, etc.;

[0072] Step S102, a first positioning member 610 is provided, the first positioning member 610 is passed through the flexible substrate 200 and the rigid substrate 100, and partially embedded in the first positioning hole 3011 on the installation bottom face 301;

[0073] Step S103, on the bonding surface of the flexible substrate 200, symmetrically install the VCSEL chips 400 with the first positioning member 610 as a reference;

[0074] Step S200 includes:

[0075] Step S211, the rigid substrate 100 is attached to the installation bottom face 301, and the lower edge of the rigid substrate 100 abuts against the installation side 302.

[0076] First, in step S101, a flexible substrate 200 and a rigid substrate 100 are provided. The rigid substrate 100 is correspondingly arranged with the mounting bottom surface 301 and used in combination with the flexible substrate 200 to form a composite structure, ensuring the precise positioning and stability of the flexible substrate 200 in subsequent steps. Moreover, the rigid substrate 100 can provide support for the flexible substrate 200 to ensure that unnecessary deformations do not occur during subsequent bending and fitting processes, thereby effectively improving the stability and accuracy of the installation process. Then, the first positioning member 610 in step S102 passes through the flexible substrate 200 and the rigid substrate 100 and is partially embedded in the first positioning hole 3011 on the mounting bottom surface 301, making the first positioning member 610 a positioning reference, ensuring that the relative positions of the flexible substrate 200 and the rigid substrate 100 do not shift, and as Figure 1 shown, during the soldering process of the VCSEL chip 400, the first positioning member 610 can be used as a reference to ensure the accurate alignment of the VCSEL chip 400, ensuring that each VCSEL chip 400 can be precisely located at the designed position; specifically, the VCSEL chips 400 are symmetrically installed, with the first positioning member 610 as a reference, and evenly and accurately installed on the bonding surface of the flexible substrate 200, ensuring that the spacing between each VCSEL chip 400 is consistent, thereby optimizing the optical performance and avoiding the problem of uneven light beams caused by inconsistent spacing of the VCSEL chips 400.

[0077] In addition, in step S200, the rigid substrate 100 is bonded to the mounting bottom surface 301, and the lower edge of the rigid substrate abuts against the mounting side surface 302, that is, the size of the rigid substrate 100 matches the length of the mounting bottom surface 301. At this time, the rigid substrate 100 not only provides support for the flexible substrate 200 but also ensures the precise contact between the flexible substrate 200 and the mounting base 300, improving the overall stability and accuracy during the installation process of the VCSEL chip 400.

[0078] Furthermore, step S300 includes:

[0079] Step S310: Deposit a sealing layer 320 on the edge of the notch of the installation groove; the material of the sealing layer 320 includes but is not limited to optical glue, epoxy resin, etc. The sealing layer 320 provides a stable foundation for the subsequent installation of the refractive mirror 500 and plays a sealing role to prevent dust or contaminants from entering the optical system and ensure that the optical performance of the refractive mirror 500 is not affected;

[0080] Step S320: Stack the refractive mirror 500 on the sealing layer 320; wherein, the refractive mirror 500 includes a transmission part 510 and a refraction part 520. The transmission part 510 is correspondingly arranged with the mounting bottom surface 301, and the refraction part 520 is correspondingly arranged with the mounting side surface 302;

[0081] Step S330: Sheath the encapsulation housing 700 outside the refractive mirror 500 and the mounting base 300. The first housing surface 701 of the encapsulation housing 700 presses the refractive mirror 500 onto the sealing layer 320. The second housing surface 702 of the encapsulation housing 700 abuts against the other surface of the mounting base 300 where the mounting groove is formed. The first housing surface 701 and the second housing surface 702 are oppositely arranged. The encapsulation housing 700 can be a housing obtained by injection molding in advance or a housing obtained by CNC machining. There is no limitation in this embodiment. The key point is to install the refractive mirror 500 in a pressing manner and fix the above structure to avoid damaging the refractive mirror 500.

[0082] It can be understood that when the encapsulation housing 700 is sheathed outside the refractive mirror 500 and the mounting base 300, the first housing surface 701 of the encapsulation housing 700 presses the refractive mirror 500 onto the sealing layer 320, and the second housing surface 702 of the encapsulation housing 700 abuts against the other surface of the mounting base 300 where the mounting groove is formed, ensuring the fastening and sealing of the overall structure. This not only protects the refractive mirror 500 and the VCSEL chip 400 from external physical damage, but also has a sealing and supporting effect, enhancing the mechanical stability of the VCSEL laser.

[0083] It should be added that second positioning holes 7021 are respectively formed in the second housing surface 702 and the bottom surface of the mounting base 300, and the second positioning holes 7021 are connected to the first positioning holes 3011.

[0084] After step S330, it further includes:

[0085] Step S340: Provide a second positioning member 620, insert the second positioning member 620 into the second positioning hole 7021 from the second positioning hole 7021 and connect it to the first positioning member 610.

[0086] Exemplarily, during the installation process of the flexible substrate 200, the preliminary positioning and fixing of the flexible substrate 200 are completed through the first positioning member 610. After steps such as bending and installing the refractive mirror 500 are completed, the encapsulation housing 700 is sheathed outside the above structure. With the cooperation of the connection between the second positioning member 620 and the first positioning member 610, substantially, the flexible substrate 200, the rigid substrate 100, the mounting base 300, and the encapsulation housing 700 are pressed together from both sides, enabling the four to complete further positioning and fixed connection. At the same time, the first housing surface 701 can press and fix the refractive mirror 500, avoiding steps such as drilling holes in the refractive mirror 500, improving the service life of the fragile refractive mirror 500, and also avoiding problems such as aging and non-detachability caused by bonding and other methods, making the refractive mirror 500 of the VCSEL laser replaceable.

[0087] Specifically, the first positioning hole 3011 is a first threaded hole, the first positioning member 610 is formed with an external thread corresponding to the position of the first threaded hole, the first positioning member 610 is provided with a second threaded hole 612, and the second positioning member 620 is formed with an external thread corresponding to the position of the second threaded hole 612;

[0088] In step S102, the first positioning member 610 is threadedly connected to the first threaded hole;

[0089] In step S340, the second positioning member 620 is threadedly connected to the second threaded hole 612.

[0090] Furthermore, the first positioning member 610 is convexly provided with a first edge portion 611 whose size is larger than that of the first positioning hole 3011, and the second positioning member 620 is convexly provided with a second edge portion 621 whose size is larger than that of the second positioning hole 7021.

[0091] It can be understood that in the above settings, the first positioning member 610 and the second positioning member 620 respectively have edge portions (such as the first edge portion 611 and the second edge portion 621) with sizes larger than the positioning holes. The design of these edge portions enables the positioning members to be firmly positioned in the positioning holes and provide effective supporting forces, thereby avoiding possible loosening problems during the installation process and further ensuring the stability of the entire VCSEL laser structure. Especially under multiple uses or changes in the external environment, the positioning members can still maintain high-efficiency alignment performance.

[0092] Based on the above embodiments, step S100 further includes:

[0093] Depositing an insulating carrier layer 310 on the groove surface of the installation groove. Through the setting of the insulating carrier layer 310, electrical separation is achieved between the installation base 300 and the flexible substrate 200.

[0094] Based on the above embodiments, the installation base 300 is provided with first through holes corresponding to each side surface (the first side surface 3021 and the second side surface 3022), and the first through holes extend along the first direction; correspondingly, the second housing surface 702 is provided with second through holes corresponding to the positions of the first through holes;

[0095] Exemplarily, before the first bending of the flexible substrate 200, it further includes:

[0096] Step S221: Insert the probe into the first through hole on the first side surface 3021;

[0097] After the first bending of the flexible substrate 200, it further includes:

[0098] Step S222: Detect whether the pins of the VCSEL chip 400 are in place through a probe; if so, perform a second bend on the flexible substrate 200, if not, mark the VCSEL laser as a NG product;

[0099] Similarly, before performing a second bend on the flexible substrate 200, it also includes:

[0100] Step S223: Insert the probe into the first through hole on the second side 3022;

[0101] Step S224: Detect whether the pins of the VCSEL chip 400 are in place through a probe; if so, perform subsequent steps, if not, mark the VCSEL laser as a NG product;

[0102] It can be understood that through the above steps, it is ensured that the VCSEL chip 400 can be accurately aligned after each bend, reducing performance problems caused by the incorrect position of the VCSEL chip 400. At the same time, the connected first through hole and second through hole provide a heat dissipation channel for the subsequent use of the VCSEL laser, thereby improving the heat dissipation effect.

[0103] Embodiment 2:

[0104] This embodiment also provides a VCSEL laser, which is prepared by the preparation method of the VCSEL laser in Embodiment 1, and includes a flexible substrate 200 and a mounting base 300; the mounting base 300 includes a mounting groove, and the mounting groove includes a mounting bottom surface 301 perpendicular to the first direction and a mounting side surface 302 inclined relative to the mounting bottom surface 301. A plurality of VCSEL chips 400 arranged at intervals are welded on the flexible substrate 200;

[0105] The flexible substrate 200 is attached to the mounting base 300; a refractive mirror 500 is installed at the notch of the mounting groove, and the refractive mirror 500 is arranged corresponding to the VCSEL chip 400 on the mounting side surface 302, and is used to refract the laser of the VCSEL chip 400 on the mounting side surface 302 to the first direction.

[0106] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for preparing a VCSEL laser, characterized in that: include: Step S100, providing a flexible substrate and a mounting base, wherein the mounting base includes a mounting groove, the mounting groove includes a mounting bottom surface perpendicular to the first direction and a mounting side surface inclined relative to the mounting bottom surface, and a plurality of VCSEL chips spaced apart are welded on the flexible substrate; Step S200, attaching the flexible substrate to the mounting base, and attaching the flexible substrate to the mounting bottom surface and the mounting side surface, so that the VCSEL chip is mounted on the mounting bottom surface and the mounting side surface through the flexible substrate; Step S300, installing a refractor at the notch of the mounting groove, the refractor being arranged corresponding to the VCSEL chip on the mounting side, and being used to refract the laser of the VCSEL chip on the mounting side to a first direction; The mounting side surface comprises a first side surface and a second side surface which are sequentially arranged and connected in a direction away from the mounting bottom surface, and relative to the refractor, the first side surface is arranged to protrude from the second side surface; the first side surface and the second side surface are connected via a transition plane; The flexible substrate is bent at a position corresponding to the first side to form a first bending portion, the flexible substrate is bent at a position corresponding to the second side to form a second bending portion, and is bent at a position corresponding to the transition plane to form a transition bending portion.

2. The method for preparing a VCSEL laser according to claim 1, characterized in that: The step S200 includes: Step S210, attaching the middle part of the flexible substrate to the installation bottom surface; Step S220, performing a first bend on the flexible substrate to form a first bend portion attached to the first side surface, performing a second bend on the first bend portion to form a transition bend portion attached to the transition plane and a second bend portion attached to the second side surface.

3. The method for preparing a VCSEL laser according to claim 1, characterized in that: The step S100 includes: Step S101, a rigid substrate is arranged on the bonding surface of the flexible substrate, and the rigid substrate is arranged corresponding to the installation bottom surface; Step S102, providing a first positioning member, passing the first positioning member through the flexible substrate and the rigid substrate, and partially embedding the first positioning member into a first positioning hole on the mounting bottom surface; Step S103, symmetrically mounting the VCSEL chip on the bonding surface of the flexible substrate with the first positioning member as a reference; The step S200 includes: Step S211 , attaching the rigid substrate to the installation bottom surface, with the lower edge of the rigid substrate abutting against the installation side surface.

4. The method for preparing a VCSEL laser according to claim 3, characterized in that: The step S300 includes: Step S310, depositing a sealing layer on the edge of the groove of the installation groove; Step S320, stacking the refraction mirror on the sealing layer; Step S330, sleeve the packaging shell over the refractor and the mounting base, the first shell surface of the packaging shell presses the refractor onto the sealing layer, the second shell surface of the packaging shell abuts against the other side of the mounting base where the mounting groove is opened, and the first shell surface and the second shell surface are arranged opposite to each other.

5. The method for preparing a VCSEL laser according to claim 4, characterized in that: The second shell surface and the bottom surface of the mounting base are respectively provided with a second positioning hole, and the second positioning hole is connected to the first positioning hole; After step S330, the method further includes: Step S340: provide a second positioning member, insert the second positioning member into the second positioning hole from the second positioning hole and connect the second positioning member to the first positioning member.

6. The method for preparing a VCSEL laser according to claim 5, characterized in that: The first positioning hole is a first threaded hole, the first positioning member is provided with an external thread at a position corresponding to the first threaded hole, the first positioning member is provided with a second threaded hole, and the second positioning member is provided with an external thread at a position corresponding to the second threaded hole; In the step S102, the first positioning member is threadedly connected to the first threaded hole; In the step S340, the second positioning member is threadedly connected to the second threaded hole.

7. The method for preparing a VCSEL laser according to claim 6, characterized in that: The first positioning member is provided with a first edge portion whose size is larger than the first positioning hole, and the second positioning member is provided with a second edge portion whose size is larger than the second positioning hole.

8. A method for preparing a VCSEL laser according to any one of claims 1 to 7, characterized in that: The step S100 further includes: An insulating bearing layer is deposited on the groove surface of the mounting groove.

9. A VCSEL laser, characterized in that: The method for preparing a VCSEL laser according to any one of claims 1 to 8 comprises a flexible substrate and a mounting base; the mounting base comprises a mounting groove, the mounting groove comprises a mounting bottom surface perpendicular to a first direction and a mounting side surface inclined relative to the mounting bottom surface, and a plurality of VCSEL chips spaced apart are welded on the flexible substrate; The flexible substrate is attached to the mounting base; a refractor is installed at the notch of the mounting groove, and the refractor is arranged corresponding to the VCSEL chip on the mounting side, and is used to refract the laser of the VCSEL chip on the mounting side to a first direction; The mounting side surface comprises a first side surface and a second side surface which are sequentially arranged and connected in a direction away from the mounting bottom surface, and relative to the refractor, the first side surface is arranged to protrude from the second side surface; the first side surface and the second side surface are connected via a transition plane; The flexible substrate is bent at a position corresponding to the first side to form a first bending portion, the flexible substrate is bent at a position corresponding to the second side to form a second bending portion, and is bent at a position corresponding to the transition plane to form a transition bending portion.

Images