Electronic device

Abstract

The present disclosure provides an electronic device including an active region and a peripheral region adjacent to the active region, and further including: a substrate including a first edge and a second edge connected to the first edge, where the first edge is not parallel to the second edge, and the peripheral region is located between the active region and the first edge of the substrate; a first electrode layer disposed on the substrate; the first conductive adhesive is arranged on the substrate and is positioned in the peripheral area; a second conductive adhesive disposed on the substrate and located in the peripheral region; the insulating adhesive is overlapped with the first conductive adhesive and the second conductive adhesive; the first metal element is fixedly arranged on the first electrode layer through the first conductive adhesive and the insulating adhesive; in a top view, the insulating glue is located in the peripheral area and extends in the extending direction parallel to the first edge of the substrate, and in the extending direction, the first distance between the first conductive glue and the second edge of the substrate is larger than the second distance between the second conductive glue and the second edge of the substrate.

Description

Technical Field

[0001] The present disclosure provides an electronic display device, in particular an electronic device with upper and lower substrates misaligned. Background Art

[0002] As the global birth rate continues to decline over the years, the labor force is gradually decreasing, resulting in rising labor costs. Various industries are beginning to move towards replacing labor with robots. With the continuous advancement of electronic device-related technologies, industrial automation is seen as an important future trend.

[0003] In traditional electronic devices, conductive tape is often used as a medium to fix and electrically connect electronic components. However, the conductive tape requires high precision in the process, which is not conducive to the development of automation. In addition, metal components in electronic devices are prone to bending after being subjected to thermal shock, causing the electronic devices to deteriorate.

[0004] Therefore, there is an urgent need to provide an electronic device and a manufacturing method thereof to improve the shortcomings of traditional electronic devices. Summary of the invention

[0005] In view of this, the present disclosure provides an electronic device to improve the tolerance of the electronic device or enhance the automation efficiency.

[0006] To achieve the above-mentioned purpose, the present disclosure provides an electronic device, characterized in that it includes an active area and a peripheral area adjacent to the active area, and further includes: a substrate, including a first edge and a second edge connected to the first edge, wherein the first edge and the second edge are not parallel, and the peripheral area is located between the active area and the first edge of the substrate; a first electrode layer, arranged on the substrate; a first conductive glue, arranged on the substrate and located in the peripheral area; a second conductive glue, arranged on the substrate and located in the peripheral area; an insulating glue, overlapping with the first conductive glue and the second conductive glue; and a first metal element, fixed on the first electrode layer through the first conductive glue and the insulating glue; wherein, in a top view, the insulating glue is located in the peripheral area and extends along an extension direction parallel to the first edge of the substrate, and along the extension direction, a first distance between the first conductive glue and the second edge of the substrate is greater than a second distance between the second conductive glue and the second edge of the substrate.

[0007] The present disclosure also provides an electronic device, characterized in that it includes an active area and a peripheral area adjacent to the active area, and further includes: a substrate having a first edge, wherein the first edge extends along a first direction, and the peripheral area is located between the active area and the first edge of the substrate; a first electrode layer is disposed on the substrate; a first conductive glue is disposed on the substrate and located in the peripheral area; a second conductive glue is disposed on the substrate and located in the peripheral area; an insulating glue is located in the peripheral area and overlaps with the first conductive glue and the second conductive glue; a first element includes a first metal A first element comprises a metal material and has a first long side, wherein the first long side extends along the first direction, and the first element is fixed on the first electrode layer through the first conductive glue and the insulating glue; and a second element comprises a second metal material and has a second long side, wherein the second long side extends along the first direction, and the second element is fixed on the first electrode layer through the second conductive glue and the insulating glue; wherein, in a top view, the insulating glue extends along the first direction, and along the first direction, the sum of the length of the first conductive glue and the length of the second conductive glue is less than the length of the insulating glue. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is a three-dimensional diagram of the electronic device disclosed in the present invention.

[0009] Figure 2 It is a side view of the electronic device of the present disclosure.

[0010] Figure 3A FIG. 4 is a top view of an electronic device according to an embodiment of the present disclosure.

[0011] Figure 3B for Figure 3A Cross-sectional view of line segment BB'.

[0012] Figure 3C for Figure 3A Cross-sectional view of line segment C-C'.

[0013] Figure 4A It is a top view of the electronic device of Example 2.

[0014] Figure 4B for Figure 4A Cross-sectional view of line segment BB'.

[0015] Figure 4C for Figure 4A Cross-sectional view of line segment C-C'.

[0016] Figure 5A This is a top view of the electronic device of Example 3.

[0017] Figure 5B for Figure 5ACross-sectional view of line segment BB'.

[0018] Figure 5C for Figure 5A Cross-sectional view of line segment C-C'.

[0019] Fig. 6A This is a top view of the electronic device of Example 4.

[0020] Figure 6B for Fig. 6A Cross-sectional view of line segment BB'.

[0021] Fig. 7A This is a top view of the electronic device of Example 5.

[0022] Figure 7B for Fig. 7A Cross-sectional view of line segment BB'.

[0023] Figure 7C for Fig. 7A Cross-sectional view of line segment C-C'.

[0024] Figure 8 This is a top view of the electronic device of Example 6.

[0025] Fig. 9 This is a top view of the electronic device of Example 7.

[0026] [Explanation of the main component symbols in the accompanying drawings]

[0027] DETAILED DESCRIPTION

[0028] The following is an explanation of the implementation of the present disclosure through specific embodiments. People skilled in the art can easily understand other advantages and effects of the present disclosure from the contents disclosed in this specification. The present disclosure can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways according to different viewpoints and applications without departing from the spirit of the present invention.

[0029] Furthermore, the ordinal numbers used in the specification and claims, such as "first", "second" and "third", etc., to modify the elements of the claims, do not themselves imply or represent any previous ordinal number of the element, nor do they represent the order of one element and another element, or the order in the manufacturing method. The use of these ordinal numbers is only used to clearly distinguish one element with a certain name from another element with the same name.

[0030] In the present disclosure, the terms "almost", "about", "approximately", and "roughly" generally mean within 20%, within 10%, within 5%, within 3%, within 2%, within 1%, or within 0.5% of a given value or range. The numbers given here are approximate numbers, that is, in the absence of specific description of "almost", "about", "approximately", and "roughly", the meanings of "almost", "approximately", "approximately", and "roughly" can still be implied.

[0031] Furthermore, positions mentioned in the specification and claims, such as “on,” “over,” or “above,” may refer to two elements being in direct contact or may refer to two elements being in non-direct contact.

[0032] The detailed structure of the gas electron multiplier of the present disclosure will be described in detail below, but the present disclosure is not limited to the following illustrative embodiments. The embodiments of the present disclosure can be combined with each other or combined with other known structures to form another embodiment.

[0033] Figure 1 It is a three-dimensional diagram of an electronic device according to an embodiment of the present disclosure. Figure 1 Display X, Y, and Z coordinates. The first direction is the X direction, the second direction is the Y direction, and the third direction is the Z direction, which are different directions. For example, the first direction X, the second direction Y, and the third direction Z are perpendicular to each other. Figure 1As shown, the electronic device disclosed in the present invention includes: a first substrate 1; a second substrate 2, arranged opposite to the first substrate 1; a first electrode layer 11, arranged on the first substrate 1; a second electrode layer 21, arranged on the second substrate 2; a display medium layer (not shown), arranged between the first electrode layer 11 and the second electrode layer 21; a frame glue 31, arranged between the first electrode layer 11 and the second electrode layer 21 and arranged around the display medium layer (not shown); and a first metal element 41, extending along a first direction X, wherein the first metal element 41 is fixed on the first electrode layer 11 by a conductive glue 5 and a first insulating glue 6, the conductive glue 5 and the first insulating glue 6 can be used to fix the first metal element, and the first metal element 41 can strengthen the electrical connection with the first electrode layer 11 through the conductive glue 5. More specifically, the first substrate 1 includes a first area A1 and a second area A2, the first metal element 41 is disposed in the first area A1 and protrudes from the first substrate 1 along the first direction X, and the conductive glue 5 and the first insulating glue 6 are disposed in the first area A1. Here, the first area A1 refers to an area of ​​the first substrate 1 that does not overlap with the second substrate 2 in the normal direction (i.e., the third direction Z) and overlaps with the first metal element 41, and the second area A2 refers to an area of ​​the first substrate 1 that does not overlap with the second substrate 2 in the normal direction (i.e., the third direction Z) and does not overlap with the first metal element 41, that is, an area outside the first area A1. Therefore, in a top view direction, the conductive glue 5 and the first insulating glue 6 overlap with the first metal element 41 respectively to fix the first metal element 41 on the first electrode layer 11. Since the first metal element 41 is disposed in the first area A1 of the first substrate 1 and is not disposed in the second area A2, the first metal element 41 is not prone to bending after the thermal shock test, which can improve the tolerance of the electronic device.

[0034] Figure 2 FIG. 1 is a side view of an electronic device according to an embodiment of the present disclosure. Figure 2 As shown, the first substrate 1 protrudes from the second substrate 2 in a second direction Y, and the second substrate 2 protrudes from the first substrate 1 in a direction opposite to the second direction Y, wherein the second direction Y is substantially perpendicular to the first direction X. More specifically, the first substrate 1 protrudes from the second substrate 2 along the second direction Y, and the second substrate 2 protrudes from the first substrate 1 in a direction away from the second direction Y. In other words, the first substrate 1 and the second substrate 2 are staggered in the second direction Y. In addition, the sealant 31 is disposed between the first substrate 1 and the second substrate 2, and can be disposed around the display medium layer 3.

[0035] Please continue to refer to Figure 2The electronic device of the present disclosure may further include a second insulating glue 7, which is disposed on the first substrate 1, and in the normal direction of the first substrate 1 (i.e., the third direction Z), the height H1 of the second insulating glue 7 is less than or equal to the height H2 from the top surface 2a of the second substrate 2 to the top surface 11a of the first electrode layer 11. More specifically, the height of the second insulating glue 7 refers to the height H1 from the top surface 7a of the second insulating glue 7 to the top surface 11a of the first electrode layer 11, which can facilitate subsequent processing, for example, it will be beneficial to the subsequent bonding process and improve the reliability of the product.

[0036] In the present disclosure, the first metal element 41 on the first substrate 1 can be electrically connected to the first electrode layer 11 through the conductive adhesive 5, so that the external circuit applies a voltage to the first electrode layer 11 through the first metal element 41 to control the display medium layer 3. Specifically, the external circuit can apply a voltage to the first electrode layer 11 through the first metal element 41 to further control the tilt angle of the liquid crystal to achieve the desired grayscale, but is not limited thereto. In addition, if Figure 2 As shown, the conductive glue 5 on the first substrate 1 does not contact the second electrode layer 21 to avoid the first electrode layer 11 and the second electrode layer 21 being electrically connected through the conductive glue 5 to cause a short circuit. Figure 2 As shown, the first insulating glue 6 and the second insulating glue 7 on the first substrate 1 are also not in contact with the second electrode layer 21 , but the present disclosure is not limited to this. In one embodiment of the present disclosure, part of the first insulating glue 6 and / or part of the second insulating glue 7 may be in contact with the second electrode layer 21 .

[0037] Here, only the first metal element 41, the conductive glue 5, the first insulating glue 6 and the second insulating glue 7 on the first substrate 1 are used as examples. It should be understood that the second substrate 2 may also have the same or similar settings so that the external circuit applies voltage to the second electrode layer 21 through the first metal element 41.

[0038] Please continue to refer to Figure 1 and Figure 2, the preparation method of the electronic device disclosed in the present invention may include the following steps: providing a first substrate 1 and a second substrate 2; arranging a first electrode layer 11 and a second electrode layer 21 on the first substrate 1 and the second substrate 2 respectively; providing a display medium layer 3, arranged between the first electrode layer 11 and the second electrode layer 21; providing a frame glue 31, arranged between the first electrode layer 11 and the second electrode layer 21 and arranged around the display medium layer 3; and providing a first metal element 41, wherein the first metal element 41 is fixed on the first electrode layer 11 by a conductive glue 5 and a first insulating glue 6. In addition, the above preparation method may further include: providing a second insulating glue 7, arranged on the first substrate 1, and in the top view direction, the second insulating glue 7 at least partially overlaps with the first electrode layer 11 and the first metal element 41, and the conductive glue 5 can overlap at least a part of the second insulating glue 7, and the first insulating glue 6 can also overlap at least a part of the second insulating glue 7.

[0039] In the present disclosure, the method for preparing the electronic device may, for example, first pair a first substrate 1 having a first electrode layer 11 and a second substrate 2 having a second electrode layer 21, and then fix the first metal element 41 on the first electrode layer 11 by means of a conductive adhesive 5 and a first insulating adhesive 6; or, first fix the first metal element 41 on the first electrode layer 11 by means of a conductive adhesive 5 and a first insulating adhesive 6, and then pair the first substrate 1 and the second substrate 2 to form the electronic device described in the present disclosure, but the present disclosure is not limited thereto.

[0040] Figure 3A FIG. 4 is a top view of an electronic device according to an embodiment of the present disclosure. Figure 3B and Figure 3C They are Figure 3A Cross-sectional view of line segment BB' and line segment CC'.

[0041] like FIG. 3A to FIG. 3C As shown, in the second direction Y, the width W2 of the conductive glue 5 and the width W3 of the first insulating glue 6 are greater than the width W1 of the first metal element 41, so as to facilitate fixing the first metal element 41 on the first electrode layer 11. In this embodiment, the width W3 of the first insulating glue 6 is approximately equal to the width W2 of the conductive glue 5, but the present disclosure is not limited to this. In other forms of this embodiment, the width W3 of the first insulating glue 6 may be greater than the width W2 of the conductive glue 5, or the width W2 of the conductive glue 5 may be greater than the width W3 of the first insulating glue 6. In addition, in the second direction Y, the width W4 of the second insulating glue 7 is greater than the width W1 of the first metal element 41, the width W2 of the conductive glue 5, and the width W3 of the first insulating glue 6, which can be used to block oxygen and moisture, thereby preventing the element from being deteriorated due to moisture and oxygen. Among them, all the width measurements and comparisons in this case are the widths of the bottom of the element under the cross-sectional schematic diagram, but are not limited to this.

[0042] In this disclosure, Figure 3A As shown, the first substrate 1 has a first edge 1a, wherein the extending direction of the first edge 1a is parallel to the second direction Y, and in the first direction X, the distance D1 from the first insulating glue 6 to the first edge 1a is smaller than the distance D2 from the conductive glue 5 to the first edge 1a. Such a configuration will help fix the first metal element 41 on the first electrode layer 11, and will not cause poor electrical properties due to cracking due to external force. In other words, the first insulating glue 6 is disposed closer to the first edge 1a than the conductive glue 5. In this embodiment, the first edge 1a is perpendicular to the first direction X, but the present disclosure is not limited to this. In other embodiments of the present disclosure, the first edge 1a may not be a straight edge, but may be a curved edge, as long as the first insulating glue 6 is disposed closer to the first edge 1a than the conductive glue 5.

[0043] Please continue to refer to Figure 3A The electronic device may further include a second metal element 42 disposed on the first electrode layer 11 and extending along the first direction X, and the second metal element 42 protrudes from the first substrate 1 along the first direction X. More specifically, the first substrate 1 has two first areas A1 and one second area A2, and the first metal element 41 and the second metal element 42 are respectively disposed in the two first areas A1, wherein the second metal element 42 extends in a direction away from the first metal element 41, and the second metal element 42 protrudes from the first substrate 1 in a direction away from the first metal element 41.

[0044] like FIG. 3A to FIG. 3C As shown, in this embodiment, the preparation method of the electronic device includes: providing a first metal element 41 on the first electrode layer 11; then, coating a conductive glue 5 and a first insulating glue 6 on the first metal element 41 respectively, wherein, in the top view direction, the conductive glue 5 and the first insulating glue 6 do not overlap, therefore, the conductive glue 5 and the first insulating glue 6 can be coated approximately at the same time to shorten the process time; thereafter, coating a second insulating glue 7 on the first electrode layer 11, and in the top view direction, the second insulating glue 7 at least partially overlaps with the first electrode layer 11 and the first metal element 41, and the conductive glue 5 can overlap at least a portion of the second insulating glue 7, and the first insulating glue 6 can also overlap at least a portion of the second insulating glue 7.

[0045] Therefore, if Figure 3B and Figure 3C As shown, in the normal direction of the first substrate 1 (i.e., the third direction Z), the conductive glue 5 and the first insulating glue 6 are located on the same side of the first metal element 41. More specifically, the first metal element 41 has an upper surface 41a and a lower surface 41b opposite to the upper surface 41a, wherein the lower surface 41b is adjacent to the first electrode layer 11, and the conductive glue 5 and the first insulating glue 6 are disposed adjacent to the upper surface 41a of the first metal element 41.

[0046] Here, the materials of the first substrate 1 and the second substrate 2 are not particularly limited, and in the present embodiment, the first substrate 1 and the second substrate 2 may be, for example, a flexible substrate, a rigid substrate, or a combination thereof. For example, the material of the substrate 110 may include glass, quartz, sapphire, ceramic, polycarbonate (PC), polyimide (PI), polyethylene terephthalate (PET), other suitable substrate materials, or a combination thereof, but not limited thereto. The materials of the first electrode layer 11 and the second electrode layer 21 are not particularly limited, and the first electrode layer 11 and the second electrode layer 21 may be made of the same or different materials. For example, it may be indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), indium gallium zinc oxide (IGZO), or a combination thereof, but the present disclosure is not limited thereto. The materials of the first metal element 41 and the second metal element 42 are not particularly limited, and the first metal element 41 and the second metal element 41 may be made of the same or different materials. For example, gold, silver, copper, aluminum, titanium, chromium, nickel, molybdenum, tin, alloys thereof, or combinations thereof may be included, but the present disclosure is not limited thereto.

[0047] Here, the conductive glue 5 is a material with good conductive function, which has the characteristic of small volume resistance after curing, for example, it may include silver glue, but the present disclosure is not limited to this. The material of the first insulating glue 6 may include acrylic, rubber, resin or a combination thereof. For example, an insulating glue with a shear strength (shear force standard test method: ASTM D 3080) of 21Mpa can be selected, which will help to improve the adhesion strength of the component and will not be easily damaged by external forces. The material of the second insulating glue 7 may include resin, high molecular polymer or a combination thereof. For example, an insulating glue with a moisture absorption rate of 0.3% after being placed under 90% relative humidity for 24 hours can be selected, which will help to block water and oxygen, but the present disclosure is not limited to this.

[0048] Figure 4A FIG. 4 is a top view of an electronic device according to an embodiment of the present disclosure. Figure 4B and Figure 4C They are Figure 4A The electronic device of this embodiment is similar to that of the first embodiment except for the following differences. Figure 4A The second metal element 42 is omitted, but the present embodiment is not limited thereto. In other forms of the present embodiment, the second metal element 42 may also be included, and its configuration is similar to that of the first metal element 41, which will not be repeated here.

[0049] like FIG. 4A to FIG. 4CAs shown, in the top view direction, the conductive adhesive 5 can overlap at least a portion of the first insulating adhesive 6, wherein in the second direction Y, the width W3 of the first insulating adhesive 6 is greater than the width W2 of the conductive adhesive 5, and the width W2 of the conductive adhesive 5 is greater than the width W1 of the first metal element 41. More specifically, in the top view direction, when the conductive adhesive 5 overlaps at least a portion of the first insulating adhesive 6, the bonding between the conductive adhesive 5 and the first metal element 4 can be strengthened to improve the reliability of the electronic device, but the present invention is not limited thereto.

[0050] The preparation method of this example is similar to that of Example 1, except for the following differences.

[0051] like FIG. 4A to FIG. 4C As shown, the preparation method of the electronic device of the present embodiment includes: providing a first metal element 41 on the first electrode layer 11; then, first applying a conductive glue 5 on the first metal element 41; then applying a first insulating glue 6 on the conductive glue 5 and the first metal element 41, wherein the first insulating glue 6 can completely cover the conductive glue 5, and can strengthen the connection between the conductive glue 5 and the first metal element 41; thereafter, applying a second insulating glue 7 on the first electrode layer 11, the first metal element 4, the conductive glue 5 and the first insulating layer 6, but the preparation method of the electronic device disclosed in the present invention is not limited thereto.

[0052] Therefore, if Figure 4A As shown, in the top view direction, the conductive glue 5 can overlap at least a portion of the first insulating glue 6. More specifically, as shown in FIG. Figure 4B As shown, in the normal direction of the first substrate 1 (i.e., the third direction Z), the conductive glue 5 is disposed between the first metal element 41 and the first insulating glue 6, and the first insulating glue 6 is disposed between the conductive glue 5 and the second insulating glue 7. In addition, the conductive glue 5 and the first insulating glue 6 are located on the same side of the first metal element 41.

[0053] Figure 5A FIG. 4 is a top view of an electronic device according to an embodiment of the present disclosure. Figure 5B and Figure 5C They are Figure 5A The electronic device and the method for manufacturing the same are similar to those of Example 1, except for the following differences. Figure 5A The second metal element 42 is omitted, but the present embodiment is not limited thereto. In other forms of the present embodiment, the second metal element 42 may also be included, and its configuration is similar to that of the first metal element 41, which will not be repeated here.

[0054] like FIG. 5A to FIG. 5CAs shown, in this embodiment, a conductive glue 5 is first applied on the first electrode layer 11; then a first metal element 41 is provided on the conductive glue 5 and the first electrode layer 11; next, a first insulating glue 6 is applied on the first metal element 41; thereafter, a second insulating glue 7 is applied on the first electrode layer 11, the first metal element 41, the conductive glue 5 and the first insulating layer 6.

[0055] Since in this embodiment, the first metal element 41 is provided on the first electrode layer 11 and the conductive glue 5 when the conductive glue 5 is not completely cured, Figure 5B As shown, the first metal element 41 is slightly sunken into the conductive glue 5. More specifically, in the normal direction of the first substrate 1 (i.e., the third direction Z), the first metal element 41 is disposed between the conductive glue 5 and the second insulating glue 7, and the conductive glue 5 has a protruding surface 5a, which does not overlap with the first metal element 41.

[0056] In addition, in this embodiment, the conductive glue 5 and the first insulating glue 6 are located on different sides of the first metal element 41. More specifically, the conductive glue 5 is disposed adjacent to the lower surface 41b of the first metal element 41, and the first insulating glue 6 is disposed adjacent to the upper surface 41a of the first metal element 41. However, this embodiment is not limited thereto. In other forms of this embodiment, the first insulating glue 6 may be first applied on the first electrode layer 11; then the first metal element 41 is provided on the first insulating glue 6 and the first electrode layer 11; then, the conductive glue 5 is applied on the first metal element 41; and then, the second insulating glue 7 is applied on the first electrode layer 11, the first metal element 4, the conductive glue 5, and the first insulating glue 6. Therefore, the conductive glue 5 is disposed adjacent to the upper surface 41a of the first metal element 41, and the first insulating glue 6 is disposed adjacent to the lower surface 41b of the first metal element 41.

[0057] Fig. 6A FIG. 4 is a top view of an electronic device according to an embodiment of the present disclosure. Figure 6B for Fig. 6A The electronic device of this embodiment is similar to that of Embodiment 2 except for the following differences.

[0058] like Fig. 6A and Figure 6B As shown, in this embodiment, a conductive glue 5 is first applied on the first electrode layer 11; then a first metal element 41 is provided on the first electrode layer 11 and the conductive glue 5; next, a first insulating glue 6 is applied on the first metal element 41 and the conductive glue 5; thereafter, a second insulating glue 7 is applied on the first electrode layer 11, the first metal element 41, the conductive glue 5 and the first insulating glue 6.

[0059] Since in this embodiment, the first metal element 41 is provided on the first electrode layer 11 and the conductive glue 5 when the conductive glue 5 is not completely cured, Figure 6B As shown, the first metal element 41 is slightly sunken into the conductive glue 5. More specifically, the conductive glue 5 has a protruding surface 5a, and the protruding surface 5a does not overlap with the first metal element 41. In addition, in the top view direction, the conductive glue 5 can overlap at least a portion of the first insulating glue 6. More specifically, in the normal direction of the first substrate 1 (i.e., the third direction Z), the first metal element 41 is disposed between the conductive glue 5 and the first insulating glue 6, thereby strengthening the bonding between the conductive glue 5 and the first metal element 41. In this embodiment, in the top view direction, the conductive glue 5 and the first insulating glue 6 do not completely overlap. More specifically, as shown in FIG. Fig. 6A As shown, in the top view, part of the conductive glue 5 does not overlap with the first insulating glue 6, but the present disclosure is not limited to this. In other forms of this embodiment, the conductive glue 5 and the first insulating glue 6 can completely overlap, so that the conductive glue 5 and the first metal element 41 have a better bonding effect.

[0060] Please continue to refer to Figure 6B In this embodiment, the conductive glue 5 and the first insulating glue 6 are located on different sides of the first metal element 41. More specifically, the conductive glue 5 is disposed adjacent to the lower surface 41b of the first metal element 41, and the first insulating glue 6 is disposed adjacent to the upper surface 41a of the first metal element 41.

[0061] Fig. 7A A top view of an electronic device according to a disclosed embodiment. Figure 7B and Figure 7C They are Fig. 7A The electronic device of this embodiment is similar to that of the first embodiment except for the following differences. Fig. 7A The second metal element 42 is omitted, but the present embodiment is not limited thereto. In other forms of the present embodiment, the second metal element 42 may also be included, and its configuration is similar to that of the first metal element 41, which will not be repeated here.

[0062] like 7A to 7C As shown, in this embodiment, the conductive glue 5 and the first insulating glue 6 are first coated on the first electrode layer 11; then, the first metal element 41 is provided on the first electrode layer 11, the conductive glue 5 and the first insulating glue 6; then, the second insulating glue 7 is coated on the first electrode layer 11, the first metal element 41, the conductive glue 5 and the first insulating layer 6. Therefore, the conductive glue 5 and the first insulating glue 6 are located on the same side of the first metal element 41. More specifically, as shown in FIG. Figure 7B and Figure 7C As shown, the conductive adhesive 5 and the first insulating adhesive 6 are respectively disposed adjacent to the lower surface 41 b of the first metal element 41 .

[0063] In addition, since in this embodiment, the first metal element 41 is provided on the first electrode layer 11, the conductive glue 5 and the first insulating glue 6 when the conductive glue 5 and the first insulating glue 6 are not completely cured, Figure 7B and Figure 7C As shown, the first metal element 41 is slightly sunken into the conductive glue 5 and the first insulating glue 6, respectively. More specifically, in the normal direction of the first substrate 1 (i.e., the third direction Z), the first metal element 41 is disposed between the conductive glue 5 and the second insulating glue 7, and the first metal element 41 is also disposed between the first insulating glue 6 and the second insulating glue 7. In addition, the conductive glue 5 and the first insulating glue 6 have a protruding surface 5a, 6a, respectively, and the protruding surfaces 5a, 6a do not overlap with the first metal element 41, respectively.

[0064] Figure 8 FIG. 1 is a top view of an electronic device according to an embodiment of the present disclosure. The electronic device according to this embodiment is similar to that of Embodiment 1, except for the following differences. Figure 8 The second metal element 42 is omitted, but the present embodiment is not limited thereto. In other forms of the present embodiment, the second metal element 42 may also be included, and its configuration is similar to that of the first metal element 41, which will not be repeated here.

[0065] like Figure 8 As shown, the electronic device of this embodiment further includes a third insulating glue 61, which is disposed on the first electrode layer 11, wherein the conductive glue 5 is disposed between the first insulating glue 6 and the third insulating glue 61 in the first direction X, and the first insulating glue 6 is disposed adjacent to the first edge 1a of the first substrate 1. In this embodiment, in the top view direction, the conductive glue 5 does not overlap with the first insulating glue 6 and the third insulating glue 61, but the present disclosure is not limited thereto. In other forms of this embodiment, the conductive glue 5 may partially overlap with the first insulating glue 6 and / or the third insulating glue 61, which may improve the reliability of the electronic device.

[0066] In this embodiment, there is no particular restriction on the order in which the first metal element 41, the conductive glue 5, the first insulating glue 6 and the third insulating glue 61 are arranged. For example, the first metal element 41 can be provided on the first electrode layer 11 first, and then the conductive glue 4, the first insulating glue 6 and the third insulating glue 61 are coated on the first metal element 41. Alternatively, a method similar to that of Example 3 or Example 5 can be used for arrangement, which will not be repeated here.

[0067] Here, the material of the third insulating glue 61 is similar to that of the first insulating glue 6, and will not be described in detail here, and the materials of the first insulating glue 6 and the third insulating glue 61 can be the same or different from each other. When the materials of the first insulating glue 6 and the third insulating glue 61 are the same, the first insulating glue 6 and the third insulating glue 61 can be coated at about the same time to shorten the process time.

[0068] Fig. 9 FIG. 1 is a top view of an electronic device according to an embodiment of the present disclosure. The electronic device according to this embodiment is similar to that of Embodiment 1, except for the following differences.

[0069] like Fig. 9 As shown, the conductive adhesive 5 of the electronic device of this embodiment extends along the first direction X, and the conductive adhesive 5 partially overlaps with the first metal element 41 and the second metal element 42. More specifically, in the top view direction, the conductive adhesive 5 extends in the first area A1 and the second area A2 in a direction away from the first metal element 41 (i.e., away from the first direction X), which can strengthen the electrical connection between the first metal element 41 and the first electrode layer 11.

[0070] In the present embodiment, in the top view direction, the conductive glue 5 does not overlap with the first insulating glue 6, but the present disclosure is not limited to this. In other forms of the present embodiment, the conductive glue 5 may overlap at least a portion of the first insulating glue 6, which can strengthen the bonding between the conductive glue 5 and the first metal element 41. In addition, the conductive glue 5 can be prepared using a method similar to that of Embodiments 1 to 5, which will not be described in detail here. In the present embodiment, the conductive glue 5 extends along the first direction X and overlaps with the first metal element 41 and the second metal element 42, respectively. More specifically, the conductive glue 5 is applied from the first metal element 41 to the second metal element 42 in a manner that can be selected as a linear coating, a wavy coating, a discontinuous line segment or other non-linear coating method, or a combination of the foregoing, depending on the needs, but the present disclosure is not limited to this.

[0071] The electronic device of this embodiment includes a first metal element 41 and a second metal element 42 , but the present disclosure is not limited thereto. In other forms of this embodiment, the second metal element 42 may be omitted, and only the first metal element 41 may be connected to the external circuit.

[0072] In summary, the present disclosure can electrically connect the first metal element 41 to the first electrode layer 11 by fixing the first metal element 41 on the first electrode layer 11 with the conductive adhesive 5 and the first insulating adhesive 6. In addition, since the first metal element 41 is disposed in the first area A1 of the first substrate 1 but not in the second area A2, the first metal element 41 can be prevented from bending after being subjected to thermal shock, thereby improving the tolerance of the electronic device.

[0073] In the present disclosure, the electronic device manufactured by the above-mentioned embodiments may be a display device, for example, a liquid crystal display device, including vertical alignment (VA), in-plane switching (IPS) and fringe field switching (FFS), but the present disclosure is not limited thereto. In addition, the electronic device of the present disclosure may be used on display devices known in the art, such as monitors, music players, mobile navigation devices, etc., but the present disclosure is not limited thereto.

[0074] The above specific embodiments are to be construed as merely illustrative, and not limitative of the remainder of the disclosure in any way whatsoever.

Claims

1. An electronic device, characterized in that: The invention comprises an active region and a peripheral region adjacent to the active region, and further comprises: A substrate comprising a first edge and a second edge connected to the first edge, wherein the first edge and the second edge are not parallel, and the peripheral region is located between the active region and the first edge of the substrate; a first electrode layer, disposed on the substrate; A first conductive adhesive is disposed on the substrate and located in the peripheral area; A second conductive adhesive is disposed on the substrate and located in the peripheral area; an insulating adhesive, overlapping the first conductive adhesive and the second conductive adhesive; and A first metal element is fixed on the first electrode layer through the first conductive glue and the insulating glue; In which, in a top view, the insulating glue is located in the peripheral area and extends along an extension direction parallel to the first edge of the substrate, and along the extension direction, a first distance between the first conductive glue and the second edge of the substrate is greater than a second distance between the second conductive glue and the second edge of the substrate.

2. The electronic device according to claim 1, characterized in that: It also includes a display medium layer, which is arranged on the first electrode layer.

3. The electronic device according to claim 3, characterized in that: The active area corresponds to the display medium layer, and the peripheral area does not correspond to the display medium layer.

4. The electronic device according to claim 1, characterized in that: The extending direction of the insulating glue is parallel to a long side of the peripheral area.

5. The electronic device according to claim 1, characterized in that: Along the extending direction of the insulating glue, the length of the insulating glue is greater than the length of the first conductive glue.

6. An electronic device, characterized in that: The invention comprises an active region and a peripheral region adjacent to the active region, and further comprises: A substrate having a first edge, wherein the first edge extends along a first direction, and the peripheral region is located between the active region and the first edge of the substrate; a first electrode layer, disposed on the substrate; A first conductive adhesive is disposed on the substrate and located in the peripheral area; A second conductive adhesive is disposed on the substrate and located in the peripheral area; An insulating adhesive, located in the peripheral area and overlapping the first conductive adhesive and the second conductive adhesive; a first element, comprising a first metal material and having a first long side, wherein the first long side extends along the first direction, and the first element is fixed on the first electrode layer through the first conductive glue and the insulating glue; and A second element, comprising a second metal material and having a second long side, wherein the second long side extends along the first direction, and the second element is fixed on the first electrode layer through the second conductive glue and the insulating glue; Wherein, in a top view, the insulating glue extends along the first direction, and along the first direction, the sum of the length of the first conductive glue and the length of the second conductive glue is smaller than the length of the insulating glue.

7. The electronic device according to claim 6, characterized in that: It also includes a display medium layer, which is arranged on the first electrode layer.

8. The electronic device according to claim 7, characterized in that: The active area corresponds to the display medium layer, and the peripheral area does not correspond to the display medium layer.

9. The electronic device according to claim 6, characterized in that: The extending direction of the insulating glue is parallel to a long side of the peripheral area.

10. The electronic device according to claim 6, characterized in that: Along the extending direction of the insulating glue, the length of the insulating glue is greater than the length of the first conductive glue.

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