Circuit board and display module

Abstract

The invention provides a circuit board and a display module. The circuit board comprises a first substrate layer; the first adhesive layer is in a grid shape, and the first adhesive layer is arranged on one side of the first base material layer; the first conductive layer is arranged on one side, far away from the first base material layer, of the first adhesive layer; wherein a partial area of the first conductive layer penetrates through the grids of the first adhesive layer to be in contact with the first substrate layer. The adhesive layer between the base material layer and the conductive layer is arranged to be grid-shaped, so that partial area of the conductive layer is directly contacted with the base material layer, the heat dissipation efficiency of the conductive layer towards the base material layer is improved, the service life of the element is prolonged, and the performance of the product is improved.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a circuit board and a display module. Background Art

[0002] In the field of display technology, circuit boards are a common type of electrical component. On circuit boards, the heat generated by parts and circuits will be transferred to the board and dissipated toward the parts or under the board. Part of the heat is dissipated by the copper foil layer itself to the surroundings. The heat dissipation of the copper foil layer needs to pass through the adhesive layer and the substrate layer before it reaches the board and under the board to release the heat. This will reduce the speed of heat dissipation and affect the overall heat dissipation effect. Summary of the invention

[0003] In view of this, the embodiments of the present invention are directed to providing a circuit board and a display module, which can improve the heat dissipation capacity of the circuit board, thereby improving the life of components and product performance.

[0004] According to an inventive concept of one aspect of the present invention, a circuit board is provided, comprising: a first substrate layer, a first adhesive layer and a first conductive layer. The first adhesive layer is in a grid shape and is arranged on one side of the first substrate layer; the first conductive layer is arranged on a side of the first adhesive layer away from the first substrate layer; wherein a part of the first conductive layer contacts the first substrate layer through the mesh of the first adhesive layer.

[0005] According to some embodiments of the present application, the circuit board further includes: a second substrate layer, a second adhesive layer, and a second conductive layer. The second substrate layer is located on a side of the first substrate layer away from the first adhesive layer; the second adhesive layer is in a grid shape, and the second adhesive layer is arranged on a side of the second substrate layer close to the first substrate layer; the second conductive layer is located on a side of the second adhesive layer away from the second substrate layer; wherein a portion of the second conductive layer contacts the second substrate layer through the mesh of the second adhesive layer.

[0006] The first substrate layer and the second substrate layer are made of flexible materials.

[0007] Preferably, the materials of the first substrate layer and the second substrate layer include polyimide, polyester, and polyethylene naphthalate.

[0008] Preferably, the first adhesive layer and the second adhesive layer are made of acrylic adhesive, epoxy resin adhesive or acrylate adhesive.

[0009] Preferably, the first conductive layer and the second conductive layer are copper foil layers.

[0010] According to some embodiments of the present application, the circuit board further includes a third adhesive layer in a grid shape, and the third adhesive layer is located between the second conductive layer and the first substrate layer.

[0011] According to some embodiments of the present application, the circuit board further includes a first covering film, and the first covering film includes: a first covering film base and a first covering film base. The first covering film base is located on a side of the first conductive layer away from the first substrate layer; and the first covering film adhesive layer is in a grid shape, and the first covering film adhesive layer is located between the first covering film base and the first conductive layer.

[0012] Preferably, the material of the first cover film substrate includes polyimide, polyester, polyethylene naphthalate and liquid crystal display polymer.

[0013] Preferably, the material of the adhesive layer of the first cover film is acrylic adhesive, epoxy resin adhesive or acrylate adhesive.

[0014] According to some embodiments of the present application, the circuit board further includes a first electromagnetic shielding film, and the first electromagnetic shielding film is located on a side of the first cover film base away from the first base material layer.

[0015] Preferably, the material of the first electromagnetic shielding film includes metal alloy or conductive glue.

[0016] According to some embodiments of the present application, the first conductive layers are respectively located on both sides of the first substrate layer, wherein the first conductive layer close to the second substrate layer is connected to the third adhesive layer.

[0017] According to some embodiments of the present application, the second conductive layer is respectively located on both sides of the second substrate layer, and the circuit board also includes a second covering film, the second covering film including: a second covering film base, located on a side of the second conductive layer away from the first substrate layer and away from the first substrate layer; a second covering film adhesive layer, in a grid shape, the second covering film adhesive layer is located between the second covering film base and the second conductive layer away from the first substrate layer.

[0018] Preferably, the material of the second cover film substrate includes polyimide, polyester, polyethylene naphthalate and liquid crystal display polymer.

[0019] Preferably, the material of the adhesive layer of the second cover film is acrylic adhesive, epoxy resin adhesive or acrylate adhesive.

[0020] According to some embodiments of the present application, the circuit board further includes a second electromagnetic shielding film, and the second electromagnetic shielding film is located on a side of the second cover film base away from the second base material layer.

[0021] Preferably, the material of the second electromagnetic shielding film includes metal alloy or conductive glue.

[0022] According to some embodiments of the present application, a first copper via is disposed on the first conductive layer, and a second copper via is disposed on the second conductive layer away from the first substrate layer.

[0023] According to another aspect of the invention concept of the present application, a display module is further provided, comprising a display panel and a circuit board as described in the above embodiment, wherein the circuit board is connected to the display panel.

[0024] According to the circuit board and display module of the embodiments of the present invention, the adhesive layer between the substrate layer and the conductive layer is arranged in a grid shape so that a partial area of ​​the conductive layer is in direct contact with the substrate layer, thereby improving the heat dissipation efficiency from the conductive layer to the substrate layer, thereby improving the life of the component and the performance of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the stacking structure of a three-layer board and a schematic diagram of heat dissipation in the prior art.

[0026] Figure 2 FIG. 4 is a schematic diagram of a stacked structure of a circuit board according to an embodiment of the present invention.

[0027] Figure 3 FIG. 4 is a schematic diagram of a stacked structure of a circuit board according to another embodiment of the present invention.

[0028] Figure 4 FIG. 4 is a schematic diagram of a stacked structure of a circuit board according to another embodiment of the present invention.

[0029] Figure 5 FIG. 4 is a schematic diagram of a stacked structure of a circuit board according to another embodiment of the present invention.

[0030] Figure 6 FIG. 4 is a schematic diagram of a stacked structure of a circuit board according to another embodiment of the present invention.

[0031] Figure 7 FIG. 4 is a schematic diagram of a stacked structure of a circuit board according to another embodiment of the present invention.

[0032] Figure 8 FIG. 4 is a schematic diagram of a stacked structure of a circuit board according to another embodiment of the present invention.

[0033] Fig. 9 FIG. 4 is a schematic diagram of a stacked structure of a circuit board according to another embodiment of the present invention.

[0034] Description of reference numerals:

[0035] PA1-single sided board substrate;

[0036] PA2-double-sided board substrate;

[0037] PA3-inner layer of thermosetting adhesive;

[0038] PA4-covering film;

[0039] PA5-electromagnetic film;

[0040] 1- first substrate layer;

[0041] 2- first adhesive layer;

[0042] 3- first conductive layer;

[0043] 4- second substrate layer;

[0044] 5- second adhesive layer;

[0045] 6- second conductive layer;

[0046] 7- third adhesive layer;

[0047] 8- first covering film;

[0048] 81-a first covering film substrate;

[0049] 82-first covering film adhesive layer;

[0050] 9- second covering film;

[0051] 91- a second covering film substrate;

[0052] 92-second cover film adhesive layer;

[0053] 10-a first electromagnetic shielding film;

[0054] 11-Second electromagnetic shielding film. DETAILED DESCRIPTION

[0055] The features and exemplary embodiments of various aspects of the present invention will be described in detail below. In the detailed description below, many specific details are proposed in order to provide a comprehensive understanding of the present invention. However, it is obvious to those skilled in the art that the present invention can be implemented without some of these specific details. The following description of the embodiments is only to provide a better understanding of the present invention by illustrating examples of the present invention. In the drawings and the following description, at least part of the known structures and technologies are not shown in order to avoid unnecessary ambiguity of the present invention; and, for clarity, the size of some structures may be exaggerated. In addition, the features, structures or characteristics described below may be combined in one or more embodiments in any suitable manner.

[0056] In the description of the present invention, it should be noted that, unless otherwise specified, "plurality" means more than two; the directions or positional relationships indicated by the terms "upper", "lower", "left", "right", "inner", "outer", etc. are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0057] The directional words appearing in the following description are all directions shown in the figures, and do not limit the specific structure of the embodiments of the present invention. In the description of the present invention, it should also be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0058] In the related art, when the circuit board is in use, if the heat generated by the components on the circuit board and the circuit board itself cannot be dissipated as quickly as possible, it will directly reduce the life of the components and the performance of the product. Figure 1 The three-layer board structure shown in the figure is used as an example to illustrate Figure 1 The top of the pattern is defined as the top, and the bottom of the pattern is defined as the bottom. The circuit board includes a single-sided board substrate PA1 and a double-sided board substrate PA2. The single-sided board substrate PA1 and the double-sided board substrate PA2 are connected by an inner layer of thermosetting adhesive PA3 (i.e. Figure 1 The surface of the single-sided substrate PA1 and the lower surface of the double-sided substrate PA2 are respectively provided with a covering film PA4, and the covering film PA4 includes a surface covering film located on the side of the single-sided substrate PA1 and a bottom covering film located on the side of the single-sided substrate PA1, wherein the surface covering film is provided with an electromagnetic film PA5 (i.e. Figure 1 The EMI layer referred to by PA5S, Electromagnetic Interference Material, electromagnetic shielding film) and parts (i.e. Figure 1 component), a bottom electromagnetic film PA5 is arranged under the bottom covering film.

[0059] The single-sided board substrate PA1 includes PI (i.e. Figure 1 The Polyimide layer (PA1) and the copper foil layer (also known as the Polyimide layer) set on the side of the PI Figure 1 The copper layer PA1 refers to, where Cu piating means copper with holes), and the double-sided board substrate PA2 includes PI (i.e. Figure 1 The Polyimide layer (PA2) and the copper foil layer (i.e. Figure 1 The covering film PA4 includes a PI layer (i.e., a copper layer referred to as PA2, wherein Cu piating means copper with holes). Figure 1 The C / P (Polyimide) layer referred to by PA4 in the figure) and the adhesive layer (i.e. Figure 1The C / P (Adhesive) layer referred to by PA4 in FIG.

[0060] exist Figure 1 In the circuit, the copper foil layer (copper) is used as a conductive layer. It will generate heat during operation. The generated heat is transferred to the parts and to the bottom of the board (such as Figure 1 The heat transfer from the copper foil layer of the single-sided board substrate PA1 to the part needs to pass through the PI layer, adhesive layer and electromagnetic film PA5 to dissipate heat to the outside world. The heat transfer from the lower copper foil layer of the double-sided board substrate PA2 to the bottom of the board needs to pass through the PI layer, adhesive layer and electromagnetic film PA5 to dissipate heat to the bottom of the board. The heat dissipation under the board of the upper copper foil layer needs to pass through an additional PI layer and copper foil layer. Therefore, the heat transfer efficiency in the PI layer, adhesive layer and electromagnetic film PA5 directly affects the overall heat dissipation effect, and will also affect the life and performance of the product. The traditional stacked structure cannot meet the heat dissipation needs.

[0061] Figure 2 FIG. 4 is a schematic diagram of a stacked structure of a circuit board according to an embodiment of the present invention.

[0062] In order to solve the above technical problems, according to an inventive concept of one aspect of the present invention, Figure 2 As shown, a circuit board is provided, comprising: a first substrate layer 1, a first adhesive layer 2 and a first conductive layer 3. The first adhesive layer 2 is in a grid shape and is arranged on one side of the first substrate layer 1. The first conductive layer 3 is arranged on a side of the first adhesive layer 2 away from the first substrate layer 1. Part of the first conductive layer 3 contacts the first substrate layer 1 through the mesh of the first adhesive layer 2.

[0063] In this embodiment, the adhesive layer between the substrate layer and the conductive layer is arranged in a grid shape so that a part of the conductive layer is in direct contact with the substrate layer, thereby improving the heat dissipation efficiency from the conductive layer to the substrate layer, thereby improving the life of the component and the performance of the product.

[0064] According to some embodiments of the present application, the first substrate layer 1 is a support structure for the first conductive layer 3. Other functional layers or components may also be provided on the side of the first conductive layer 3 away from the first substrate layer 1. Figure 1 Not shown in the figure.

[0065] Figure 3 FIG. 4 is a schematic diagram of a stacked structure of a circuit board according to another embodiment of the present invention.

[0066] According to some embodiments of the present application, Figure 3As shown, the circuit board further includes: a second substrate layer 4, a second adhesive layer 5 and a second conductive layer 6. The second substrate layer 4 is located on the side of the first substrate layer 1 away from the first adhesive layer 2. The second adhesive layer 5 is in a grid shape, and the second adhesive layer 5 is arranged on the side of the second substrate layer 4 close to the first substrate layer 1. The second conductive layer 6 is located on the side of the second adhesive layer 5 away from the second substrate layer 4. Part of the second conductive layer 6 contacts the second substrate layer 4 through the mesh of the second adhesive layer 5.

[0067] In this embodiment, the circuit board is a double-layer board or a multi-layer board. The two adhesive layers in the circuit board are both in a grid shape, that is, the original bonding function is retained, and at the same time, with the help of its grid design, the conductive layer is directly in contact with part of the PI layer, thereby improving the heat transfer efficiency of the conductive layer upward or downward.

[0068] According to some embodiments of the present application, the first substrate layer 1 and the second substrate layer 4 are made of flexible materials, that is, the circuit board is a flexible printed circuit board (FPC). The substrate of the FPC is a bendable material with flexibility, which can adapt to curved surfaces and special-shaped structures and is commonly used in mobile devices, wearable devices, etc. Flexible circuit boards can be bent and folded, and are suitable for electronic devices that require flexible installation.

[0069] According to some embodiments of the present application, the materials of the first substrate layer 1 and the second substrate layer 4 include polyimide, polyester, and polyethylene naphthalate.

[0070] According to some embodiments of the present application, the first substrate layer 1 and the second substrate layer 4 are made of hard materials, such as fiberglass boards, which have good mechanical strength and stability and are suitable for most electronic devices. Rigid circuit boards cannot be bent and are usually used in fixed electronic devices.

[0071] According to some embodiments of the present application, the circuit board can also be a rigid-flexible circuit board, which combines the characteristics of a rigid circuit board and a flexible circuit board, and has a certain rigidity and can be bent. This type of circuit board is often used in the fields of automotive electronics, medical equipment, etc. to meet the installation requirements of different parts.

[0072] According to some embodiments of the present application, the first adhesive layer 2 and the second adhesive layer 5 are made of acrylic adhesive, epoxy resin adhesive or acrylate adhesive.

[0073] In this embodiment, taking FPC as an example, a grid pattern is designed according to the overall layout and circuit design of the FPC, including: designing a grid pattern according to requirements, determining the size, shape and spacing of the grid. This pattern should be coordinated with the overall layout and circuit design of the FPC to ensure the performance and reliability of the circuit board.

[0074] The adhesive can be printed in a grid-like form on the substrate (e.g., the first substrate layer, the second substrate layer) of the FPC using precise printing techniques (such as screen printing, gravure printing, etc.). During the printing process, the uniformity and consistency of the adhesive need to be ensured to avoid problems such as poor bonding or circuit short circuits in subsequent processes.

[0075] The FPC printed with grid-shaped adhesive is placed in a curing device for a curing process, and the adhesive is heated or otherwise used to achieve its optimal bonding state, and the retainer is patterned.

[0076] The conductive layer is bonded to the grid-shaped adhesive layer, and the conductive layer and the adhesive layer are bonded by pressing and / or heating to complete the secondary curing. In this embodiment, the temperature and time need to be strictly controlled to ensure that the grid-shaped adhesive layer is not damaged or deformed to maintain the integrity and performance of the circuit board.

[0077] According to some embodiments of the present application, the materials of the first conductive layer 3 and the second conductive layer 6 include copper, silver and gold. Preferably, the first conductive layer 3 and the second conductive layer 6 are copper foil layers. Copper foil is divided into two types: electrolytic copper foil and rolled copper foil. Electrolytic copper foil has high conductivity, while rolled copper foil has better flexibility and ductility.

[0078] Figure 4 FIG. 4 is a schematic diagram of a stacked structure of a circuit board according to another embodiment of the present invention.

[0079] According to some embodiments of the present application, Figure 4 As shown, the circuit board further includes a third adhesive layer 7 , which is in a grid shape and is located between the second conductive layer 6 and the first substrate layer 1 .

[0080] In this embodiment, by setting the adhesive layer between the second conductive layer 6 and the first substrate layer 1 into a grid shape, the heat transfer efficiency between the second conductive layer 6 and the first substrate layer 1 can be improved, thereby improving the overall heat transfer efficiency of the circuit board, thereby improving the life of the components and the performance of the product.

[0081] Figure 5 FIG. 4 is a schematic diagram of a stacked structure of a circuit board according to another embodiment of the present invention.

[0082] According to some embodiments of the present application, Figure 5 As shown, the circuit board also includes a first covering film 8, and the first covering film 8 includes: a first covering film base 81 and a first covering film base 81. The first covering film base 81 is located on the side of the first conductive layer 3 away from the first substrate layer 1. The first covering film adhesive layer 82 is in a grid shape, and the first covering film adhesive layer 82 is located between the first covering film base 81 and the first conductive layer 3.

[0083] In this embodiment, the structure shown is Figure 2 The structure of the embodiment shown is similar, but the difference is that the functional layer on the side of the first conductive layer 3 away from the first substrate layer 1 is the first covering film 8, which is also called a protective film and is a vital part of the circuit board structure. Taking FPC as an example, the covering film is usually a thin film with a relatively simple structure but precise design. It fits tightly on the conductive layer (copper foil layer) and can be closely combined with the conductive layer through a lamination process to ensure the stability and reliability of the circuit in dynamic environments such as bending and folding. The main materials of the covering film include polymer films such as polyimide (PI) and polyester (PET). These materials have excellent flexibility and reliability, can withstand the bending and folding of the circuit board, and are resistant to high temperature and wear, and can protect the conductive circuit layer on the FPC flexible circuit board from the influence of the external environment. Specifically, the covering film can prevent the conductive layer from being physically damaged, such as scratches, impacts, etc., and prevent pollutants such as dust and oil from corroding the circuit, keeping the circuit board clean and intact. The covering film has good insulation properties, can prevent short circuits between the conductive layers on the circuit board, and ensure the normal operation of the circuit. In addition, during the manufacturing process, the cover film can be used as a positioning reference to help workers accurately install and solder components, ensuring that the components on the circuit board are neatly arranged and reliably connected.

[0084] In this embodiment, the first covering film 8 includes a first covering film base 81 and a first covering film adhesive layer 82. By arranging the first covering film adhesive layer 82 in a grid shape, the heat dissipation efficiency between the first conductive layer 3 and the first covering film base 81 can be improved, thereby improving the life of the component and the performance of the product.

[0085] According to some embodiments of the present application, the material of the first cover film substrate 81 includes polyimide, polyester, polyethylene naphthalate and liquid crystal display polymer.

[0086] According to some embodiments of the present application, the material of the first cover film adhesive layer 82 is acrylic adhesive, epoxy resin adhesive or acrylate adhesive.

[0087] Figure 6 FIG. 4 is a schematic diagram of a stacked structure of a circuit board according to another embodiment of the present invention.

[0088] According to some embodiments of the present application, Figure 6 As shown, the circuit board further includes a first electromagnetic shielding film 10 , and the first electromagnetic shielding film 10 is located on a side of the first cover film base 81 away from the first base material layer 1 .

[0089] In this embodiment, the electromagnetic shielding film is mainly used for electromagnetic shielding to protect the circuit from electromagnetic interference. Taking FPC as an example, the electromagnetic shielding film is a composite film material composed of a conductive material and a substrate. The conductive material can be a metal foil (such as copper foil, aluminum foil, alloy film), a conductive powder or a conductive glue. The metal foil has good conductivity and mechanical strength, and the conductive powder can be formed into a conductive layer by coating or printing. These materials can form an effective shielding current in the electromagnetic field, thereby suppressing the propagation of electromagnetic waves. The substrate uses flexible materials such as polyester (PET) and polyimide (PI) to provide the necessary support and flexibility for the electromagnetic shielding film. These materials have excellent heat resistance, mechanical strength and electrical insulation, and can meet the use requirements of FPC in various environments. The electromagnetic shielding film can also be used as an interlayer insulating material to prevent short circuits between different circuit layers, and can provide a certain mechanical support force to enhance the mechanical stability and durability of the FPC.

[0090] When electromagnetic waves encounter electromagnetic shielding films, the free electrons in the conductive material will be affected by the electromagnetic waves and generate induced currents. This induced current will generate a magnetic field in the opposite direction of the original electromagnetic waves, thereby suppressing the propagation of electromagnetic waves. At the same time, the conductive material in the electromagnetic shielding film can also absorb part of the energy of the electromagnetic waves and convert it into heat or other forms of energy, thereby further reducing the interference intensity of the electromagnetic waves.

[0091] In the FPC manufacturing process, the electromagnetic shielding film is usually laid on the cover film through a lamination process. The specific steps are as follows. Prepare the electromagnetic shielding film and the cover film to ensure that their sizes and shapes match. Perform necessary pretreatments on the electromagnetic shielding film and the cover film, such as cleaning and dust removal, to ensure a good fit between them. Put the electromagnetic shielding film and the cover film into the laminator and combine them tightly together by heating and pressurizing. In this process, it is necessary to control the lamination parameters such as temperature, pressure and time to ensure the quality of lamination. After lamination, the FPC is subjected to necessary follow-up treatments, such as cutting, drilling, electroplating, etc., to meet the design requirements of the product.

[0092] Figure 7 FIG. 4 is a schematic diagram of a stacked structure of a circuit board according to another embodiment of the present invention.

[0093] According to some embodiments of the present application, Figure 7 As shown, the first conductive layers 3 are respectively located on both sides of the first substrate layer 1 , wherein the first conductive layer 3 close to the second substrate layer 4 is connected to the third adhesive layer 7 .

[0094] In this embodiment, the upper layer of the multi-layer circuit board is a double-sided circuit board, and the conductive layers are attached to both sides of the substrate layer to form upper and lower conductive circuits, respectively. Optionally, electrical connection can be achieved between the two copper foil layers (conductive layers) through metallized vias, such as copper vias.

[0095] Figure 8 FIG. 4 is a schematic diagram of a stacked structure of a circuit board according to another embodiment of the present invention.

[0096] According to some embodiments of the present application, Figure 8 As shown, the second conductive layer 6 is respectively located on both sides of the second substrate layer 4, and the circuit board also includes a second cover film 9, which includes: a second cover film base 91 and a second cover film adhesive layer 92. The second cover film base 91 is located on the side of the second conductive layer 6 away from the first substrate layer 1 and away from the first substrate layer 1. The second cover film adhesive layer 92 is in a grid shape, and the second cover film adhesive layer 92 is located between the second cover film base 91 and the second conductive layer 6 away from the first substrate layer 1.

[0097] In this embodiment, the lower layer of the multi-layer circuit board is a double-sided circuit board, and the conductive layers are attached to both sides of the substrate layer to form upper and lower conductive circuits, respectively. Optionally, electrical connection can be achieved between the two copper foil layers (conductive layers) through metallized vias, such as copper vias.

[0098] The structure, material, function and effect of the second covering film 9 are similar to those of the first covering film 8 , and can improve the heat dissipation efficiency between the second conductive layer 6 and the second covering film substrate 91 , thereby improving the life of the component and the performance of the product, which will not be elaborated herein.

[0099] Fig. 9 FIG. 4 is a schematic diagram of a stacked structure of a circuit board according to another embodiment of the present invention.

[0100] According to some embodiments of the present application, Fig. 9 As shown, the circuit board further includes a second electromagnetic shielding film 11 , and the second electromagnetic shielding film 11 is located on a side of the second cover film base 91 away from the second base material layer 4 .

[0101] In this embodiment, the structure, function, material and effect of the second electromagnetic shielding film 11 are similar to those of the first electromagnetic shielding film 10. It can be used for electromagnetic shielding to protect the circuit from electromagnetic interference, and as an interlayer insulating material to prevent short circuits between different circuit layers. It can also provide a certain mechanical support force to enhance the mechanical stability and durability of the FPC. No further details will be given here.

[0102] According to another aspect of the invention concept of the present application, a display module is further provided, comprising a display panel and a circuit board as described in the previous embodiment, wherein the circuit board is connected to the display panel.

[0103] In one embodiment, the display panel may be a flexible display panel or a rigid display panel. The light extraction mode of the display panel may be a bottom light extraction mode or a top light extraction mode.

[0104] In one embodiment, the display panel can be applied to any product or component with display function, such as a television, a digital camera, a mobile phone, a watch, a tablet computer, a notebook computer, a navigator, an e-book reader, a player, a laptop computer, a car computer, a desktop computer or a set-top box.

[0105] In one embodiment, the display panel can be applied to a display device, which can be various electronic display products, including but not limited to at least one of a mobile phone, a tablet computer, an e-book reader, a player, a digital camera, a laptop computer, a car computer, a desktop computer, a set-top box, a smart TV, and a wearable device.

[0106] In addition, according to actual needs, the display device may also include other structures such as a touch panel.

[0107] It should be noted that, for the sake of clarity, not all structures of the above-mentioned display panel and display device are described. To achieve the necessary functions of the display panel or display device, those skilled in the art may set other structures according to specific application scenarios.

[0108] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A circuit board, characterized in that: include: a first substrate layer; A first adhesive layer in a grid shape, wherein the first adhesive layer is disposed on one side of the first substrate layer; A first conductive layer is disposed on a side of the first adhesive layer away from the first substrate layer; Part of the first conductive layer contacts the first substrate layer through the mesh holes of the first adhesive layer.

2. The circuit board according to claim 1, characterized in that: The circuit board also includes: a second substrate layer, located on a side of the first substrate layer away from the first adhesive layer; a second adhesive layer in a grid shape, wherein the second adhesive layer is arranged on a side of the second substrate layer close to the first substrate layer; a second conductive layer, located on a side of the second adhesive layer away from the second substrate layer; Wherein, a partial area of ​​the second conductive layer contacts the second substrate layer through the mesh holes of the second adhesive layer; Preferably, the first substrate layer and the second substrate layer are made of flexible materials; Preferably, the materials of the first substrate layer and the second substrate layer include polyimide, polyester, and polyethylene naphthalate; Preferably, the first adhesive layer and the second adhesive layer are made of acrylic adhesive, epoxy resin adhesive or acrylate adhesive; Preferably, the first conductive layer and the second conductive layer are copper foil layers.

3. The circuit board according to claim 2, characterized in that: The circuit board also includes: The third adhesive layer is in a grid shape and is located between the second conductive layer and the first substrate layer.

4. The circuit board according to claim 1, characterized in that: The circuit board further includes a first covering film, wherein the first covering film includes: A first covering film substrate is located on a side of the first conductive layer away from the first base material layer; a first covering film adhesive layer in a grid shape, wherein the first covering film adhesive layer is located between the first covering film substrate and the first conductive layer; Preferably, the material of the first cover film substrate includes polyimide, polyester, polyethylene naphthalate and liquid crystal display polymer; Preferably, the material of the adhesive layer of the first cover film is acrylic adhesive, epoxy resin adhesive or acrylate adhesive.

5. The circuit board according to claim 4, characterized in that: The circuit board also includes: A first electromagnetic shielding film is located on a side of the first covering film substrate away from the first base material layer; Preferably, the material of the first electromagnetic shielding film includes metal alloy or conductive glue.

6. The circuit board according to claim 3, characterized in that: The first conductive layer is located on both sides of the first substrate layer, wherein the first conductive layer close to the second substrate layer is connected to the third adhesive layer.

7. The circuit board according to claim 3, characterized in that: The second conductive layer is respectively located on both sides of the second substrate layer, and the circuit board further includes a second covering film, which includes: A second cover film substrate is located on a side of the second conductive layer away from the first substrate layer and away from the first substrate layer; a second covering film adhesive layer in a grid shape, wherein the second covering film adhesive layer is located between the second covering film base and the second conductive layer away from the first substrate layer; Preferably, the material of the second cover film substrate includes polyimide, polyester, polyethylene naphthalate and liquid crystal display polymer; Preferably, the material of the adhesive layer of the second cover film is acrylic adhesive, epoxy resin adhesive or acrylate adhesive.

8. The circuit board according to claim 7, characterized in that: The circuit board also includes: A second electromagnetic shielding film is located on a side of the second cover film substrate away from the second base material layer; Preferably, the material of the second electromagnetic shielding film includes metal alloy or conductive glue.

9. The circuit board according to claim 7, characterized in that: A first copper via is disposed on the first conductive layer, and a second copper via is disposed on the second conductive layer away from the first substrate layer.

10. A display module, characterized in that: The invention comprises a display panel and a circuit board as claimed in any one of claims 1 to 9, wherein the circuit board is connected to the display panel.

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