Electroplating method convenient for reducing wiring space of circuit electroplating

Abstract

The invention discloses an electroplating method convenient for reducing a line electroplating wiring space, which comprises the following steps of: 1, preparing FPC (Flexible Printed Circuit) electroplating in advance, confirming a design drawing of the FPC, and checking required electroplating materials and breaking and conducting tools; 2, electroplating pretreatment is carried out on the FPC, cleaning equipment is used for cleaning the FPC, oil stains and oxide impurities on the surface of the FPC are removed, a covering film is used for covering the area which does not need to be electroplated, and appearance holes are formed in the FPC; the circuit on the FPC is subjected to special treatment, the appearance punch is arranged on the circuit, the temporary conduction circuit is connected with the adjacent circuit, the circuit is punched and poked through the appearance punch, the temporary conduction circuit is broken, the performance of the circuit is guaranteed, the circuit is not conducted with an external circuit, short circuit is not caused, and the circuit is not damaged. And on the premise of completing the function of electroplating the circuit, the wire arrangement space is reduced, so that the appearance of the circuit board is reduced.

Description

Technical Field

[0001] The invention relates to the field of FPC electroplating, and in particular to an electroplating method for reducing the space for line electroplating and wiring. Background Art

[0002] FPC is a flexible printed circuit board, also known as a soft board or flexible circuit board. FPC is a printed circuit board made of a flexible insulating substrate with high reliability and excellent flexibility. Conductors are usually set on FPC, and the exposed part of the FPC conductor needs to be electroplated. Surface treatment operation.

[0003] The purpose of electroplating surface treatment of FPC conductors is to prevent rust or corrosion, and to improve the wear resistance of FPC conductors during welding, bonding and installation when electronic components are mounted on FPC conductors, while also improving some mechanical properties.

[0004] As the name implies, the electroplating of FPC conductors requires electricity to be turned on for electrolysis. Therefore, the guide wires of the FPC need to be connected to the entire electrolytic solution, that is, they need to be connected to the outside of the FPC outline, and the positions that need to be gold-plated also need to be dissolved and connected to the outside.

[0005] However, when arranging the wires, the FPC conductor needs to be electrolytically gold-plated, and its position cannot be directly connected to the outside, and the line state itself needs to ensure that it is independent of the adjacent lines. Therefore, when arranging the wires, it needs to occupy a larger space, which increases the shape of the circuit board. Therefore, it is necessary to reduce the circuit wiring space when electroplating the FPC conductor. Summary of the invention

[0006] The object of the present invention is to provide an electroplating method that is convenient for reducing the space for electroplating wiring, so as to solve the problems raised in the above-mentioned background technology.

[0007] To achieve the above object, the present invention provides the following technical solution: a plating method for reducing the space for wiring plating, comprising the following specific steps:

[0008] Step 1: Prepare the electroplating of FPC, confirm the design drawings of FPC, and check the required electroplating materials and disconnection tools;

[0009] Step 2: Perform pre-plating treatment on the FPC, use cleaning equipment to clean the FPC, remove oil and oxide impurities on the surface of the FPC, use a covering film to cover the area that does not require electroplating, and set the outer shape hole on the FPC;

[0010] Step 3: Perform special treatment on the circuit. For areas that need electroplating but cannot be directly connected to the outside, connect them to adjacent circuits through temporary conduction circuits. After temporary conduction, check the firmness of the circuit connection.

[0011] Step 4: electroplating operation, electroplating the conductor of the processed FPC to form a metal coating on the FPC conductor;

[0012] Step 5: Post-processing and interruption of conduction. Perform post-processing operations on the electroplated FPC, and use the interruption tool and the position of the FPC outer hole to interrupt the temporary conduction circuit part to disconnect it, restore the original independence of the circuit, and use professional inspection equipment for inspection;

[0013] Step 6: Conduct a comprehensive inspection on the FPC processed in step 5 to obtain a qualified FPC electroplating product.

[0014] Preferably, the electroplating material in step one includes an FPC substrate, an electroplating solution, a conductive fixture and a covering film, and the cleaning equipment in step two is an ultrasonic cleaning machine.

[0015] Preferably, the conduction interrupting tool in step one, step three and step five is an external punch, and the external punch is located in the external hole and in the circuit.

[0016] Preferably, the temporary conductive circuit in step three is connected to the adjacent circuit by using a conductive clamp and a temporary wire.

[0017] Preferably, the electroplating operation in step 4 comprises the following steps:

[0018] Step 41: According to the electroplating requirements of FPC, select the appropriate electroplating solution, adjust the relevant parameters, and calculate the electroplating cost;

[0019] Step 42: Immerse the treated FPC in the electroplating solution, and use the electric current to deposit the metal in the electroplating solution in the area where electroplating is required, so that the FPC forms a metal coating. At the same time, during the electroplating process, monitor the changes in relevant parameters of the electroplating solution and adjust them as needed.

[0020] Preferably, the relevant parameters in step 41 are concentration and temperature, and the calculation formula for the thickness of the electroplated coating used in step 42 is as follows:

[0021] Coating thickness = current density * electroplating time * electroplating efficiency * electroplating coefficient

[0022] Among them, current density refers to the intensity of current passing through unit area, electroplating time refers to the time required for the electroplating process, electroplating efficiency refers to the actual utilization rate of current, and electroplating coefficient refers to a constant related to the electroplating process and coating material.

[0023] Preferably, the electroplating cost calculation formula in step 4-1 is as follows:

[0024] Plating coefficient = cm 2 ×cm×g / cm 3 ×[1+output loss rate oo ]×Metal Unit Price

[0025] Among them, cm 2 is the workpiece area to be electroplated, cm is the required coating thickness, g / cm 2 is the density of the coating material, the carry-out loss rate is the metal loss rate caused by the electroplating process, and the metal unit price is the market price of the coating material.

[0026] Preferably, the post-processing operation mode after FPC electroplating in step five is to thoroughly clean the FPC, remove the residual plating liquid and impurities on the surface of the FPC, and perform drying treatment. The inspection operation mode in step five is to use professional equipment to inspect and test the interrupted circuit to ensure that the circuit performance meets the design requirements and there is no conduction between the electroplated area and the adjacent circuit.

[0027] Preferably, the professional inspection equipment in step five is a coating thickness measuring instrument and a coating quality detector.

[0028] Preferably, the comprehensive inspection of the FPC in step six includes the thickness, uniformity, adhesion and appearance of the electroplating layer.

[0029] Technical effects and advantages of the present invention:

[0030] The present invention performs special processing on the circuit on the FPC, places an outer punch on the circuit, connects the temporary conductive circuit with the adjacent circuit, and performs metal plating. After the metal plating is completed, the outer punch is used to punch and punch the circuit to interrupt the temporary conductive circuit, which is beneficial to ensure the performance of the circuit. There is no conduction with the external circuit, and no short circuit will be caused. It is convenient to ensure that the function of completing the electroplating of the circuit is also completed, and the space for arranging the wires is reduced, thereby reducing the appearance of the circuit board, and at the same time, it is ensured that the internal area that cannot be connected to the external circuit alone can also complete the electroplating function, thereby reducing the production cost of the flexible circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a schematic diagram of the process flow of the FPC electroplating method of the present invention.

[0032] Figure 2 This is a schematic diagram of the state before the line is interrupted in the present invention.

[0033] Figure 3 This is a schematic diagram of the state after the line of the present invention is interrupted. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] Embodiment 1

[0036] The present invention provides Figure 1 A plating method for reducing the space for plating wiring is shown, comprising the following specific steps:

[0037] Step 1: Prepare the electroplating of FPC, confirm the design drawings of FPC, and check the required electroplating materials and disconnection tools;

[0038] Step 2: Perform pre-plating treatment on the FPC, use cleaning equipment to clean the FPC, remove oil and oxide impurities on the surface of the FPC, which is conducive to ensuring that the plating solution can adhere smoothly, and use a covering film to cover the areas that do not need to be plated, which is conducive to protecting these areas from the influence of the plating solution, and setting the outer holes on the FPC;

[0039] Step 3: Special treatment is performed on the circuit. For areas that need to be electroplated but cannot be directly connected to the outside, temporary conduction lines are used to connect them to adjacent lines, which helps to ensure that the plating solution can reach these areas smoothly. After temporary conduction, check the firmness of the circuit connection to ensure that there will be no open circuit or short circuit during the electroplating process. Figure 2 As shown, the black shadow part is the profile punch;

[0040] Step 4: electroplating operation, electroplating the conductor of the processed FPC to form a metal coating on the FPC conductor;

[0041] Step 5: Post-processing and interruption of conduction. Perform post-processing operations on the electroplated FPC, and use the interruption tool and the position of the FPC outer hole to interrupt the temporary conduction line part to disconnect it, such as Figure 3 As shown, Figure 3 and Figure 2 The frame in the circuit is covered with film openings to restore the original independence of the circuit, and professional inspection equipment is used for inspection operations, which is conducive to ensuring that the circuit performance meets the design requirements, and there is no conduction between the electroplating area and the adjacent circuits to avoid short circuits;

[0042] Step 6: Conduct a comprehensive inspection on the FPC processed in step 5 to obtain a qualified FPC electroplating product.

[0043] Specifically, the electroplating material in step one includes an FPC substrate, an electroplating solution, a conductive clamp and a covering film; the cleaning equipment in step two is an ultrasonic cleaning machine; the conductive interrupting tool in steps one, three and five is an outer punch, and the outer punch is located in the outer hole and in the circuit; the temporary conductive circuit in step three is connected to the adjacent circuit by using a conductive clamp and a temporary wire.

[0044] Specifically, the electroplating operation in step 4 includes the following steps:

[0045] Step 41: According to the electroplating requirements of FPC, select a suitable electroplating solution and adjust relevant parameters to ensure the quality of electroplating. The relevant parameters are concentration and temperature, and calculate the electroplating cost. The electroplating cost calculation formula in step 41 is as follows:

[0046] Plating coefficient = cm 2 ×cm×g / cm 3 ×[1+output loss rate oo ]×Metal Unit Price

[0047] Among them, cm 2 is the workpiece area to be electroplated, cm is the required coating thickness, g / cm 2 is the density of the coating material, the carry-out loss rate is the metal loss rate caused by the electroplating process, and the metal unit price is the market price of the coating material;

[0048] Step 42: Immerse the treated FPC in the electroplating solution, and deposit the metal in the electroplating solution in the area where electroplating is required through the action of electric current, so that the FPC forms a metal coating. At the same time, during the electroplating process, monitor the changes in the relevant parameters of the electroplating solution and adjust them as needed. The calculation formula for the electroplating coating thickness is as follows:

[0049] Coating thickness = current density * electroplating time * electroplating efficiency * electroplating coefficient

[0050] Among them, current density refers to the intensity of current passing through unit area, electroplating time refers to the time required for the electroplating process, electroplating efficiency refers to the actual utilization rate of current, and electroplating coefficient refers to a constant related to the electroplating process and coating material.

[0051] It should be noted that the post-processing operation method after FPC electroplating in step five is to thoroughly clean the FPC, remove the residual plating liquid and impurities on the surface of the FPC, and dry it. The inspection operation method in step five is to use professional equipment to inspect and test the interrupted circuit to ensure that the circuit performance meets the design requirements and there is no conduction between the electroplating area and the adjacent circuit. The professional inspection equipment in step five is a plating thickness measuring instrument and a plating quality detector. The comprehensive inspection of FPC in step six includes the thickness, uniformity, adhesion and appearance of the electroplating layer.

[0052] In this embodiment, the circuit on the FPC is specially processed and the outer punch is placed on the circuit. The temporary conductive circuit is connected to the adjacent circuit to perform metal plating. After the metal plating is completed, the circuit is punched and punched by the outer punch to interrupt the temporary conductive circuit, which is beneficial to ensure the performance of the circuit. There is no conduction with the external circuit, and no short circuit will be caused. It is convenient to ensure that the function of electroplating the circuit is also completed, and the space for wiring is reduced, thereby reducing the appearance of the circuit board. At the same time, it also ensures that the internal area that cannot be connected to the external circuit alone can also complete the electroplating function, thereby reducing the production cost of the flexible circuit board.

[0053] Embodiment 2

[0054] A plating method for reducing the space for plating wiring, comprising the following specific steps:

[0055] Step 1: Prepare the electroplating of FPC, confirm the design drawings of FPC, and check the required electroplating materials and disconnection tools;

[0056] Step 2: Perform pre-plating treatment on the FPC, use cleaning equipment to clean the FPC, remove oil and oxide impurities on the surface of the FPC, use a covering film to cover the area that does not require electroplating, and set the outer shape hole on the FPC;

[0057] Step 3: Connect the lines;

[0058] Step 4: electroplating operation, electroplating the conductor of the processed FPC to form a metal coating on the FPC conductor;

[0059] Step 5: Post-processing, perform post-processing operations on the FPC after electroplating, and use professional inspection equipment for inspection operations;

[0060] Step 6: Conduct a comprehensive inspection on the FPC processed in step 5 to obtain a qualified FPC electroplating product.

[0061] Specifically, the electroplating material in step one includes an FPC substrate, an electroplating solution, a conductive clamp and a covering film; the cleaning equipment in step two is an ultrasonic cleaning machine; the conductive interrupting tool in steps one, three and five is an outer punch, and the outer punch is located in the outer hole and in the circuit; the temporary conductive circuit in step three is connected to the adjacent circuit by using a conductive clamp and a temporary wire.

[0062] Specifically, the electroplating operation in step 4 includes the following steps:

[0063] Step 41: According to the electroplating requirements of FPC, select the appropriate electroplating solution and adjust the relevant parameters, which are concentration and temperature;

[0064] Step 42: Immerse the treated FPC in the electroplating solution, and use the electric current to deposit the metal in the electroplating solution in the area where electroplating is required, so that the FPC forms a metal coating. At the same time, during the electroplating process, monitor the changes in relevant parameters of the electroplating solution and adjust them as needed.

[0065] It should be noted that the post-processing operation method after FPC electroplating in step five is to thoroughly clean the FPC, remove the residual plating liquid and impurities on the surface of the FPC, and dry it. The inspection operation method in step five is to use professional equipment to inspect and test the interrupted circuit to ensure that the circuit performance meets the design requirements and there is no conduction between the electroplating area and the adjacent circuit. The professional inspection equipment in step five is a plating thickness measuring instrument and a plating quality detector. The comprehensive inspection of FPC in step six includes the thickness, uniformity, adhesion and appearance of the electroplating layer.

[0066] The difference between this embodiment and the first embodiment is that there is no special processing on the circuit, so the circuit is directly connected and the gold-plating operation is performed, but there may be a circuit short circuit.

[0067] Embodiment 3

[0068] A plating method for reducing the space for plating wiring, comprising the following specific steps:

[0069] Step 1: Prepare the electroplating of FPC, confirm the design drawings of FPC and check the required electroplating materials;

[0070] Step 2: Perform pre-plating treatment on the FPC, use cleaning equipment to clean the FPC, remove oil and oxide impurities on the surface of the FPC, and use a covering film to cover the area that does not require electroplating;

[0071] Step 3: Perform special treatment on the circuit. For areas that need electroplating but cannot be directly connected to the outside, connect them to adjacent circuits through temporary conduction circuits. After temporary conduction, check the firmness of the circuit connection.

[0072] Step 4: electroplating operation, electroplating the conductor of the processed FPC to form a metal coating on the FPC conductor;

[0073] Step 5: Post-processing and circuit interruption. Perform post-processing operations on the electroplated FPC. Use a hand dial to disconnect the temporary conductive circuit from the adjacent circuit to restore the original independence of the circuit, and use professional inspection equipment for inspection operations;

[0074] Step 6: Conduct a comprehensive inspection on the FPC processed in step 5 to obtain a qualified FPC electroplating product.

[0075] Specifically, the electroplating material in step one includes an FPC substrate, an electroplating solution, a conductive clamp and a covering film; the cleaning equipment in step two is an ultrasonic cleaning machine; the conductive interrupting tool in steps one, three and five is an outer punch, and the outer punch is located in the outer hole and in the circuit; the temporary conductive circuit in step three is connected to the adjacent circuit by using a conductive clamp and a temporary wire.

[0076] Specifically, the electroplating operation in step 4 includes the following steps:

[0077] Step 41: According to the electroplating requirements of FPC, select the appropriate electroplating solution and adjust the relevant parameters, which are concentration and temperature;

[0078] Step 42: Immerse the treated FPC in the electroplating solution, and use the electric current to deposit the metal in the electroplating solution in the area where electroplating is required, so that the FPC forms a metal coating. At the same time, during the electroplating process, monitor the changes in relevant parameters of the electroplating solution and adjust them as needed.

[0079] It should be noted that the post-processing operation method after FPC electroplating in step five is to thoroughly clean the FPC, remove the residual plating liquid and impurities on the surface of the FPC, and dry it. The inspection operation method in step five is to use professional equipment to inspect and test the interrupted circuit to ensure that the circuit performance meets the design requirements and there is no conduction between the electroplating area and the adjacent circuit. The professional inspection equipment in step five is a plating thickness measuring instrument and a plating quality detector. The comprehensive inspection of FPC in step six includes the thickness, uniformity, adhesion and appearance of the electroplating layer.

[0080] The difference between this embodiment and the first embodiment is that there is no conduction interruption tool. When the temporary conduction line is connected and disconnected from the adjacent line, the temporary conduction line and the adjacent line cannot be directly punched and interrupted, which will affect the safety of the line connection.

[0081] Working principle of the present invention:

[0082] When electroplating FPC, first prepare for the electroplating of FPC. It is necessary to confirm the design drawings of FPC and prepare the interruption and conduction tools. Then use cleaning equipment to clean FPC, remove oil and oxide impurities on the surface of FPC, and use covering film to cover the areas that do not need electroplating. Then perform special treatment on the circuit. For the areas that need electroplating but cannot be directly connected to the outside, connect them to the adjacent circuits through temporary conduction circuits. Then perform electroplating operation on FPC, and electroplate the conductor of treated FPC to form a metal plating layer on the FPC conductor. After the electroplating is completed, interrupt the temporary conduction circuit part to disconnect it and restore the original independence of the circuit. Then perform a comprehensive inspection on FPC to obtain qualified FPC electroplating products.

[0083] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A plating method for reducing the space for plating wiring, characterized in that: The specific steps include: Step 1: Prepare the electroplating of FPC, confirm the design drawings of FPC, and check the required electroplating materials and disconnection tools; Step 2: Perform pre-plating treatment on the FPC, use cleaning equipment to clean the FPC, remove oil and oxide impurities on the surface of the FPC, use a covering film to cover the area that does not require electroplating, and set the outer shape hole on the FPC; Step 3: Perform special treatment on the circuit. For areas that need electroplating but cannot be directly connected to the outside, connect them to adjacent circuits through temporary conduction circuits. After temporary conduction, check the firmness of the circuit connection. Step 4: electroplating operation, electroplating the conductor of the processed FPC to form a metal coating on the FPC conductor; Step 5: Post-processing and interruption of conduction. Perform post-processing operations on the electroplated FPC, and use the interruption tool and the position of the FPC outer hole to interrupt the temporary conduction circuit part to disconnect it, restore the original independence of the circuit, and use professional inspection equipment for inspection; Step 6: Conduct a comprehensive inspection on the FPC processed in step 5 to obtain a qualified FPC electroplating product.

2. The electroplating method for reducing the space for electroplating wiring according to claim 1, characterized in that: The electroplating material in step one includes an FPC substrate, an electroplating solution, a conductive fixture and a covering film, and the cleaning equipment in step two is an ultrasonic cleaning machine.

3. The electroplating method for reducing the space for wiring electroplating according to claim 1, characterized in that: The conduction interruption tool in step 1, step 3 and step 5 is an external punch, and the external punch is located in the external hole and in the circuit.

4. The electroplating method for reducing the space for electroplating wiring according to claim 1, characterized in that: The temporary conductive circuit in step three is connected to the adjacent circuit by using a conductive clamp and a temporary wire.

5. The electroplating method for reducing the space for wiring electroplating according to claim 1, characterized in that: The electroplating operation in step 4 comprises the following steps: Step 41: According to the electroplating requirements of FPC, select the appropriate electroplating solution, adjust the relevant parameters, and calculate the electroplating cost; Step 42: Immerse the treated FPC in the electroplating solution, and use the electric current to deposit the metal in the electroplating solution in the area where electroplating is required, so that the FPC forms a metal coating. At the same time, during the electroplating process, monitor the changes in relevant parameters of the electroplating solution and adjust them as needed.

6. The electroplating method for reducing the space for wiring electroplating according to claim 1, characterized in that: The relevant parameters in step 41 are concentration and temperature, and the calculation formula for the electroplating coating thickness used in step 42 is as follows: Coating thickness = current density * electroplating time * electroplating efficiency * electroplating coefficient Among them, current density refers to the intensity of current passing through unit area, electroplating time refers to the time required for the electroplating process, electroplating efficiency refers to the actual utilization rate of current, and electroplating coefficient refers to a constant related to the electroplating process and coating material.

7. The electroplating method for reducing the space for electroplating wiring according to claim 1, characterized in that: The electroplating cost calculation formula in step 4-1 is as follows: Plating coefficient = cm 2 ×cm×g / cm 3 ×[1+output loss rate oo ]×Metal Unit Price Among them, cm 2 is the workpiece area to be electroplated, cm is the required coating thickness, g / cm 2 is the density of the coating material, the carry-out loss rate is the metal loss rate caused by the electroplating process, and the metal unit price is the market price of the coating material.

8. The electroplating method for reducing the space for electroplating wiring according to claim 1, characterized in that: The post-processing operation method after FPC electroplating in step five is to thoroughly clean the FPC, remove the residual plating liquid and impurities on the surface of the FPC, and perform drying treatment. The inspection operation method in step five is to use professional equipment to inspect and test the interrupted circuit to ensure that the circuit performance meets the design requirements and there is no conduction between the electroplated area and the adjacent circuit.

9. The electroplating method for reducing the space for electroplating wiring according to claim 1, characterized in that: The professional inspection equipment in step five is a coating thickness measuring instrument and a coating quality detector.

10. The electroplating method for reducing the space for electroplating wiring according to claim 1, characterized in that: The comprehensive inspection of the FPC in step six includes the thickness, uniformity, adhesion and appearance of the electroplating layer.

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