Circuit board ink coating method and device, computer equipment and storage medium

Abstract

The invention relates to the technical field of circuit board processing, and discloses a circuit board ink coating method and device, computer equipment and a storage medium. According to the ink coating method for the circuit board, a first double-sided coating mechanism is used for carrying out primary ink coating treatment on the circuit board to be coated, and base material filling coatings are formed on the two sides of the circuit board to be coated, so that the flat circuit board is obtained; performing secondary ink coating treatment on the flat circuit board through a second double-sided coating mechanism, and forming solder resist ink coatings on two sides of the flat circuit board to obtain a target circuit board; and the mesh number of the first solder resist coating wheels in the second double-sided coating mechanism is greater than that of the second solder resist coating wheels, so that the thickness of the first solder resist ink coating corresponding to the first solder resist coating wheels is greater than that of the second solder resist ink coating corresponding to the second solder resist coating wheels. According to the method, the thickness of the ink coating can be finely controlled, thickness difference can be formed between the solder resist ink coatings on the two sides of the circuit board, the uniformity and the stability of ink coating are improved, and the processing quality is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and in particular to a circuit board ink coating method, device, computer equipment and storage medium. Background Art

[0002] Circuit board, also known as printed circuit board (PCB), is the core component of electronic products. The solder mask ink process in the production of circuit boards can ensure the stability of the circuit boards. As electronic products develop towards light, thin and small, the thickness of solder mask ink is required to be thinner and thinner, and even a controllable difference in the thickness of the ink on both sides of the PCB is required.

[0003] In the prior art, when using liquid ink, the ink volume is controlled by adjusting the pressure of the ink retaining plate provided by the coating machine, thereby forming ink layers with different thicknesses on both sides of the PCB board. However, this method still has two defects. On the one hand, the height difference between the copper layer and the substrate of the PCB board will cause uneven ink thickness after coating, and the physical properties of liquid ink will flow downwards. The ink will form a certain slope when flowing from the higher copper layer area to the lower substrate area, making the ink thickness in the center area of ​​the copper layer higher and the ink thickness in the edge area lower. On the other hand, the method of adjusting the pressure of the ink retaining plate is only suitable for roughly changing the ink volume under the premise of thicker ink thickness requirements. For PCB boards with thinner ink thickness requirements, the ink thickness on both sides cannot be accurately controlled, and the different pressures on both sides cannot guarantee the stability of ink coating, which easily leads to the risk of excessive ink thickness. Summary of the invention

[0004] Based on this, it is necessary to provide a circuit board ink coating method, device, computer equipment and storage medium to address the above technical problems, so as to solve the problems of uneven ink thickness and inability to accurately control ink thickness during circuit board ink coating.

[0005] A method for coating ink on a circuit board, comprising: Performing an ink coating process on the circuit board to be coated by a first double-sided coating mechanism, forming a base material filling coating on both sides of the circuit board to be coated, and obtaining a flat circuit board; The flat circuit board is subjected to secondary ink coating by a second double-sided coating mechanism to form solder resist ink coatings on both sides of the flat circuit board to obtain a target circuit board; the second double-sided coating mechanism includes a first solder resist coating wheel and a second solder resist coating wheel which are arranged opposite to each other, the solder resist ink coating includes a first solder resist ink coating corresponding to the first solder resist coating wheel and a second solder resist ink coating corresponding to the second solder resist coating wheel, and the mesh number of the first solder resist coating wheel is greater than the mesh number of the second solder resist coating wheel, so that the thickness of the first solder resist ink coating is greater than the thickness of the second solder resist ink coating.

[0006] A circuit board ink coating device, comprising: A one-time ink coating module, used for performing one-time ink coating on the circuit board to be coated through a first double-sided coating mechanism, forming a base material filling coating on both sides of the circuit board to be coated, and obtaining a flat circuit board; A secondary ink coating module is used to perform secondary ink coating on the flat circuit board through a second double-sided coating mechanism, forming a solder resist ink coating on both sides of the flat circuit board to obtain a target circuit board; the second double-sided coating mechanism includes a first solder resist coating wheel and a second solder resist coating wheel that are relatively arranged, and the solder resist ink coating includes a first solder resist ink coating corresponding to the first solder resist coating wheel and a second solder resist ink coating corresponding to the second solder resist coating wheel, and the mesh number of the first solder resist coating wheel is greater than the mesh number of the second solder resist coating wheel, so that the thickness of the first solder resist ink coating is greater than the thickness of the second solder resist ink coating.

[0007] A computer device comprises a memory, a processor and computer-readable instructions stored in the memory and executable on the processor, wherein the circuit board ink coating method is implemented when the processor executes the computer-readable instructions.

[0008] A computer-readable storage medium stores computer-readable instructions. When the computer-readable instructions are executed by one or more processors, the one or more processors execute the above-mentioned circuit board ink coating method.

[0009] In the above-mentioned circuit board ink coating method, device, computer equipment and storage medium, the circuit board ink coating method performs a first ink coating treatment on the circuit board to be coated by a first double-sided coating mechanism, forms a substrate filling coating on both sides of the circuit board to be coated, and obtains a flat circuit board, which can eliminate the influence of the height difference between the substrate and the copper layer of the circuit board, and helps to improve the coating uniformity. In addition, the present invention performs a second ink coating treatment on the flat circuit board by a second double-sided coating mechanism, forms a solder resist ink coating on both sides of the flat circuit board, and obtains a target circuit board. Using a first solder resist coating wheel and a second solder resist coating wheel with different mesh sizes during the second ink coating treatment helps to finely control the thickness of the ink coating, and can form a thickness difference between the solder resist ink coatings on both sides of the circuit board, thereby improving the stability of the ink coating and ensuring the processing quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative labor.

[0011] Figure 1 It is a schematic diagram of a process of a circuit board ink coating method according to an embodiment of the present invention; Figure 2 It is a schematic diagram of a one-time ink coating process of a circuit board ink coating method in one embodiment of the present invention; Figure 3 It is a schematic diagram of a secondary ink coating process of a circuit board ink coating method in one embodiment of the present invention; Figure 4 It is a schematic structural diagram of a circuit board ink coating device in one embodiment of the present invention; Figure 5 is a schematic diagram of a computer device in one embodiment of the present invention. DETAILED DESCRIPTION

[0012] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0013] In one embodiment, if Figure 1 As shown, a circuit board ink coating method is provided, comprising the following steps S10-S20: S10, performing an ink coating process on the circuit board to be coated by a first double-sided coating mechanism, forming a base material filling coating on both sides of the circuit board to be coated, and obtaining a flat circuit board.

[0014] It can be understood that the circuit board to be coated refers to the circuit board that needs to be coated with solder resist ink. The circuit board includes a substrate and a copper layer. The copper layer refers to a conductive circuit composed of copper, and the substrate is the basic supporting structure of the copper layer, which is usually made of insulating material. The coating mechanism refers to a device dedicated to the solder resist process, which is used to apply solder resist ink on the surface of the circuit board, such as a roller coater. The double-sided coating mechanism refers to a device that uses two coating wheels to coat both sides of the circuit board to be coated at the same time. The coating wheel is a wheel-shaped mechanism with grooves on the surface for coating solder resist ink. The coating wheel in this embodiment can select different mesh sizes as needed.

[0015] Since the copper layer formed by the circuit in the circuit board to be coated is higher than the substrate, there are uneven circuit grooves on both sides of the circuit board to be coated. At this time, it is necessary to perform an ink coating treatment on the circuit board to be coated through the first double-sided coating mechanism to form a substrate filling coating on both sides of the circuit board to be coated to obtain a flat circuit board. The first double-sided coating mechanism is a mechanism for coating ink on both sides of the circuit board to be coated. One ink coating treatment refers to the process of performing an ink coating operation on the circuit board to be coated for the first time. The substrate filling coating refers to the coating formed by the solder resist ink filling the circuit grooves of the circuit board to be coated. A flat circuit board refers to a circuit board after the circuit board to be coated has been subjected to one ink coating treatment. After one ink coating treatment, the height of the substrate filling coating in the flat circuit board is flush with the height of the copper layer, so that the flat circuit board has two flat sides.

[0016] S20. Perform secondary ink coating on the flat circuit board through a second double-sided coating mechanism to form a solder resist ink coating on both sides of the flat circuit board to obtain a target circuit board; the second double-sided coating mechanism includes a first solder resist coating wheel and a second solder resist coating wheel that are relatively arranged, and the solder resist ink coating includes a first solder resist ink coating corresponding to the first solder resist coating wheel and a second solder resist ink coating corresponding to the second solder resist coating wheel, and the mesh number of the first solder resist coating wheel is greater than the mesh number of the second solder resist coating wheel, so that the thickness of the first solder resist ink coating is greater than the thickness of the second solder resist ink coating.

[0017] Understandably, the second double-sided coating mechanism is a mechanism for coating ink on both sides of a flat circuit board. The secondary ink coating process refers to the process of performing a second ink coating operation on the basis of the first coating to form a flat circuit board. The solder resist ink coating refers to the coating formed by filling the solder resist ink into the surface of the flat circuit board. The thickness of the solder resist ink coating refers to the thickness of the ink applied during the secondary ink coating process, that is, the thickness from the plane where the top of the copper layer is located to the plane where the top of the solder resist ink coating is located in the target circuit board. The target circuit board refers to the circuit board after the secondary ink coating process is performed on the flat circuit board. The mesh count of the coating wheel refers to the number of grooves on the surface of the coating wheel. The mesh count of the coating wheel includes 200 mesh, 250 mesh, 300 mesh, 400 mesh, 500 mesh and 700 mesh. The diameters of coating wheels of different specifications are the same, but the number of grooves is different. The size of the mesh can affect the amount of ink that the coating wheel carries on the solder mask ink. During the coating process, the larger the mesh of the coating wheel, the more ink it carries, and the thicker the ink coating formed on the surface of the circuit board. At the same time, the larger the mesh of the coating wheel, the smaller the spacing of the surface grooves, and the easier it is to finely control.

[0018] In this embodiment, if Figure 3 In the secondary coating process shown, the second double-sided coating mechanism includes a first solder resist coating wheel 201 and a second solder resist coating wheel 202 which are arranged opposite to each other, and the solder resist ink coating includes a first solder resist ink coating 205 corresponding to the first solder resist coating wheel 201 and a second solder resist ink coating 206 corresponding to the second solder resist coating wheel 202. The first solder resist ink coating 205 is formed by the first solder resist coating wheel 201 coating the solder resist ink 203 on one side of the flat circuit board, and the second solder resist ink coating 206 is formed by the second solder resist coating wheel 202 coating the solder resist ink 203 on the other side of the flat circuit board. When the mesh number of the first solder resist coating wheel 201 is greater than the mesh number of the second solder resist coating wheel 202, the thickness of the first solder resist ink coating 205 can be greater than the thickness of the second solder resist ink coating 206. In addition (not shown in the figure), when the mesh number of the first solder resist coating wheel 201 is smaller than the mesh number of the second solder resist coating wheel 202 , the thickness of the first solder resist ink coating 205 can be smaller than the thickness of the second solder resist ink coating 206 .

[0019] In this embodiment, the circuit board to be coated is subjected to a first ink coating process by the first double-sided coating mechanism, and a substrate filling coating is formed on both sides of the circuit board to be coated to obtain a flat circuit board, which can eliminate the influence of the height difference between the substrate and the copper layer of the circuit board, and help to improve the coating uniformity. In addition, in this embodiment, the flat circuit board is subjected to a second ink coating process by the second double-sided coating mechanism, and a solder resist ink coating is formed on both sides of the flat circuit board to obtain a target circuit board. The use of a first solder resist coating wheel and a second solder resist coating wheel with different mesh sizes during the second ink coating process helps to finely control the thickness of the ink coating, and can form a thickness difference between the solder resist ink coatings on both sides of the circuit board, thereby improving the stability of the ink coating and ensuring the processing quality.

[0020] In one embodiment, the first double-sided coating mechanism includes a first filling coating wheel and a second filling coating wheel arranged opposite to each other; the one-time ink coating process includes one-time top coating process; in step S10, the one-time ink coating process on the circuit board to be coated by the first double-sided coating mechanism includes: S101, controlling the circuit board to be coated to pass through the gap between the first filling coating wheel and the second filling coating wheel, performing a surface coating treatment on the circuit board to be coated by the first filling coating wheel and the second filling coating wheel, and forming an initial filling coating on both sides of the circuit board to be coated.

[0021] It can be understood that the top coating process refers to the process of applying the solder resist ink to the surface of the circuit board by rolling the coating wheel. Figure 2 As shown, the first double-sided coating mechanism includes a first filling coating wheel 101 and a second filling coating wheel 102 that are arranged opposite to each other. The ink baffle plate 106 is a baffle structure in the coating mechanism that contacts the coating wheel and is used to cooperate with the coating wheel to apply the solder resist ink 105 to the circuit board 100 to be coated. During a top coating process, the circuit board 100 to be coated is controlled to pass through the gap between the first filling coating wheel 101 and the second filling coating wheel 102, and the surfaces of the circuit board 100 to be coated with copper layers on both sides are simultaneously top-coated by the first filling coating wheel 101 and the second filling coating wheel 102, so as to form an initial filling coating on the surfaces of both sides of the circuit board 100 to be coated. The initial filling coating refers to the coating formed by the solder resist ink after the circuit board to be coated is subjected to a top coating process. A part of the solder resist ink of the initial filling coating is filled into the circuit grooves of the circuit board to be coated, and the other part is coated on the copper layer surface of the circuit board to be coated.

[0022] In this embodiment, the first filling coating wheel and the second filling coating wheel perform a top coating treatment on the circuit board to be coated to form an initial filling coating, which helps to fill the solder resist ink into the circuit grooves of the circuit board to be coated and avoid the influence of the height difference between the substrate and the copper layer.

[0023] In one embodiment, the first double-sided coating mechanism further includes a first scraper and a second scraper arranged opposite to each other; the one-time ink coating process further includes a scraping process; in step S10, that is, after the one-time surface coating process is performed on the circuit board to be coated by the first filling coating wheel and the second filling coating wheel, the step further includes: S102, controlling the circuit board to be coated to pass through the gap between the first scraper and the second scraper, and applying the initial filling coating by the first scraper and the second scraper to form a substrate filling coating on both sides of the circuit board to be coated to obtain the flat circuit board.

[0024] It is understandable that part of the solder resist ink of the initial filling coating is filled into the circuit grooves of the circuit board to be coated, and the other part is coated on the copper layer surface of the circuit board to be coated, and the surface is still uneven. Therefore, it is necessary to scrape the initial filling coating. Scraping is the process of using a scraper to scrape off the excess ink on the surface of the circuit board on the basis of top coating. Figure 2 As shown, the first double-sided coating mechanism also includes a first scraper 103 and a second scraper 104 which are arranged opposite to each other. After the circuit board 100 to be coated passes through the gap between the first filling coating wheel 101 and the second filling coating wheel 102, the circuit board 100 to be coated is controlled to pass through the gap between the first scraper 103 and the second scraper 104, and the initial filling coating is scraped by the first scraper 103 and the second scraper 104 to form a substrate filling coating 107 on both sides of the circuit board 100 to be coated, so as to obtain a flat circuit board. During the scraping process, the tips of the first scraper 103 and the second scraper 104 are respectively in contact with the top of the copper layer on both sides of the circuit board to be coated, so as to scrape off the solder resist ink in the initial filling coating that is higher than the plane where the top of the copper layer is located, so that the solder resist ink after the scraping process fills the circuit grooves to form a substrate filling coating, and the thickness of the substrate filling coating is equal to the height of the copper layer.

[0025] In this embodiment, the initial filling coating is scraped by the first scraper and the second scraper. The solder resist ink fills the circuit grooves and scrapes off the excess solder resist ink, so that the thickness of the substrate filling coating is equal to the height of the copper layer, eliminating the height difference between the substrate and the copper layer in the flat circuit board, which helps to improve the uniformity of subsequent coating.

[0026] In one embodiment, step S10, that is, before the first double-sided coating mechanism performs an ink coating process on the circuit board to be coated, includes: S103, obtaining the copper layer thickness data of the circuit board to be coated, querying the preset thickness mesh association table according to the copper layer thickness data, obtaining the first coating wheel mesh number matching the copper layer thickness data, and determining the first coating wheel mesh number as the mesh number of the first filling coating wheel and the second filling coating wheel.

[0027] Understandably, the copper layer thickness data of the circuit board to be coated refers to the height value of the top of the copper layer relative to the contact surface between the substrate and the copper layer. When the solder resist ink is applied to the surface of the circuit board using a coating wheel, the mesh count of the coating wheel is different, and the thickness of the ink coating produced after coating is also different. The mesh counts between the first filling coating wheel and the second filling coating wheel are the same by default, or they can be different. In this embodiment, the first filling coating wheel and the second filling coating wheel use the same mesh count. The preset thickness mesh count association table is a pre-set data table for recording the correlation between the coating wheel mesh count and the ink thickness after coating. The preset thickness mesh count association table records the correlation between the mesh count of a pair of identical coating wheels and an ink thickness range value. For example, when the mesh count of a pair of identical coating wheels is 250 mesh (P250), the associated ink thickness range value is 7 to 10 microns. The first coating wheel mesh count refers to the coating wheel mesh count whose ink thickness after coating is greater than or equal to the copper layer thickness data.

[0028] In this embodiment, before the first double-sided coating mechanism performs an ink coating process on the circuit board to be coated, the mesh counts of the first filling coating wheel and the second filling coating wheel need to be determined. The copper layer thickness data of the circuit board to be coated is obtained, and when the lower limit of the ink thickness range value is found in the preset thickness mesh association table to be greater than or equal to the copper layer thickness data, the coating wheel mesh count associated with the found ink thickness range value is used as the first coating wheel mesh count, and the first coating wheel mesh count is determined as the mesh count of the first filling coating wheel and the second filling coating wheel.

[0029] This embodiment queries the preset thickness mesh association table according to the copper layer thickness data to obtain the first coating wheel mesh that matches the copper layer thickness data, so that enough solder resist ink can be filled into the circuit grooves of the circuit board to be coated during one ink coating process, which can effectively eliminate the height difference between the substrate and the copper layer.

[0030] In one embodiment, the secondary ink coating process includes a secondary surface coating process; in step S20, that is, the secondary ink coating process is performed on the flat circuit board by a second double-sided coating mechanism to form a solder resist ink coating on both sides of the flat circuit board, including: S201, controlling the flat circuit board to pass through the gap between the first solder resist coating wheel and the second solder resist coating wheel, performing secondary surface coating treatment on the flat circuit board by using the first solder resist coating wheel and the second solder resist coating wheel to form a first solder resist ink coating on the side of the flat circuit board close to the first solder resist coating wheel, and to form a second solder resist ink coating on the side of the flat circuit board close to the second solder resist coating wheel, so as to obtain a target circuit board.

[0031] Understandably, in this embodiment, if Figure 3In the secondary coating process shown in the figure, the second double-sided coating mechanism includes a first solder resist coating wheel 201 and a second solder resist coating wheel 202 which are arranged opposite to each other, and the solder resist ink coating includes a first solder resist ink coating 205 corresponding to the first solder resist coating wheel 201 and a second solder resist ink coating 206 corresponding to the second solder resist coating wheel 202. Figure 2 After the gap between the first filling coating wheel 101 and the second filling coating wheel 102, and the gap between the first scraper 103 and the second scraper 104, continue to pass through the gap between the first filling coating wheel 101 and the second filling coating wheel 102, and ... Figure 3 The gap between the first solder resist coating wheel 201 and the second solder resist coating wheel 202 is shown. Figure 2 Solder mask ink 105 and Figure 3 The solder resist ink 203 in the embodiment can be the same solder resist ink. Figure 2 The ink retaining plate 106 and Figure 3 When the mesh number of the first solder resist coating wheel 201 is greater than the mesh number of the second solder resist coating wheel 202, the thickness of the first solder resist ink coating 205 can be greater than the thickness of the second solder resist ink coating 206.

[0032] In the secondary coating process of this embodiment, the first solder resist coating wheel with a larger mesh number forms a first solder resist ink coating with a larger thickness, and the second solder resist coating wheel with a smaller mesh number forms a second solder resist ink coating with a smaller thickness. By combining the two coating wheels with different mesh numbers, the ink thickness differentiation can be accurately achieved on both sides of the target circuit board, while ensuring the stability of the ink coating.

[0033] In one embodiment, step S20, that is, before the second double-sided coating mechanism performs a second ink coating process on the flattened circuit board, includes: S202, obtaining the ink thickness requirement of the target circuit board, querying the preset thickness mesh association table according to the ink thickness requirement, obtaining the second coating wheel mesh number and the third coating wheel mesh number that match the ink thickness requirement, and determining the second coating wheel mesh number as the mesh number of the first solder resist coating wheel, and determining the third coating wheel mesh number as the mesh number of the second solder resist coating wheel.

[0034] Understandably, before the second double-sided coating mechanism performs a secondary ink coating process on the flattened circuit board, it is necessary to first determine the mesh counts of the first solder resist coating wheel and the second solder resist coating wheel. The ink thickness requirement of the target circuit board refers to the thickness values ​​that the solder resist ink coatings on both sides of the target circuit board need to reach, for example, the ink thickness of the first solder resist ink coating is 12 microns, the ink thickness of the second solder resist ink coating is 10 microns, and the thickness difference between the first solder resist ink coating and the second solder resist ink coating is 2 microns. In addition to recording the association relationship between a pair of the same coating wheel mesh counts and an ink thickness range value, the preset thickness mesh count association table also records the association relationship between a pair of different coating wheel mesh count combinations and ink thickness difference and ink thickness range values. For example, when the mesh count combination of a pair of coating wheels is 250 mesh / 300 mesh (P250 / P300), the associated ink thickness difference is 0~4 microns, and the associated ink thickness range value is 7~13 microns.

[0035] Obtain the ink thickness requirement of the target circuit board, query the preset thickness mesh association table according to the ink thickness requirement, and when the two ink thickness values ​​of the ink thickness requirement fall within the ink thickness range value associated with a pair of coating wheel mesh combinations in the preset thickness mesh association table, and the thickness difference between the two ink thickness values ​​falls within the ink thickness difference range associated with the same pair of coating wheel mesh combinations, the mesh of this pair of coating wheel combinations is used as the second coating wheel mesh and the third coating wheel mesh that match the ink thickness requirement. At the same time, when the mesh of the second coating wheel is greater than the mesh of the third coating wheel, the mesh of the second coating wheel is determined as the mesh of the first solder resist coating wheel, and the mesh of the third coating wheel is determined as the mesh of the second solder resist coating wheel.

[0036] In this embodiment, the preset thickness mesh association table is queried according to the ink thickness requirements, and the second coating wheel mesh number and the third coating wheel mesh number that meet the ink thickness requirements are used as the mesh numbers of the first solder resist coating wheel and the second solder resist coating wheel, respectively, thereby achieving a precise control effect of differentiated ink thickness on both sides and improving production efficiency while ensuring quality.

[0037] In one embodiment, step S20, that is, before querying the preset thickness mesh association table, includes: S203, obtaining historical ink thickness data corresponding to the coating wheel mesh number; S204, associating the coating wheel mesh count with the historical ink thickness data to generate a thickness mesh count associated data group; S205, generating a preset thickness-mesh-number association table according to all the thickness-mesh-number association data groups.

[0038] Understandably, the coating wheel mesh count includes multiple pairs of the same coating wheel mesh count (such as P250, indicating that the mesh counts of the two coating wheels in the double-sided coating mechanism are both 250 mesh), and multiple pairs of different coating wheel mesh count combinations (such as P250 / P300, indicating that the mesh counts of the two coating wheels in the double-sided coating mechanism are 250 mesh and 300 mesh, respectively). The historical ink thickness data refers to the pre-collected solder mask ink coating thickness value formed in the coating operation that has been completed using the coating wheels with the same pair of coating wheel mesh counts. The same pair of coating wheel mesh counts may correspond to multiple historical ink thickness data. The coating wheel mesh counts and the historical ink thickness data are associated with the coating wheel mesh counts as a unit to generate a thickness mesh count associated data group. The thickness mesh count associated data group is a data group used to characterize the association relationship between the same pair of coating wheel mesh counts and the historical ink thickness data. For example, when a pair of coating wheels has a mesh count of P250, the historical ink thickness data may be 7 microns, 8 microns, 9 microns, and 10 microns, and the ink thickness range value in the thickness mesh association data group is 7 to 10 microns. The collection of all thickness mesh association data groups can generate a preset thickness mesh association table, and the preset thickness mesh association table is shown in Table 1 below.

[0039] Table 1 Preset thickness mesh correlation table This embodiment uses the collected historical ink thickness data corresponding to the coating wheel mesh count for associated storage, and finally generates a preset thickness mesh count association table, so as to accurately find the coating wheel mesh count according to the needs of the first and second ink coating processes, thereby improving the reusability of the data and ensuring the ink coating quality. At the same time, this embodiment is not only applicable to the differentiation of ink thickness under the premise of thicker ink thickness requirements (such as 16 to 30 microns), but also applicable to the differentiation of ink thickness under the premise of thinner ink thickness requirements (such as 7 to 13 microns).

[0040] It should be understood that the order of execution of the steps in the above embodiment does not necessarily mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present invention.

[0041] In one embodiment, a circuit board ink coating device is provided, and the circuit board ink coating device corresponds one-to-one to the circuit board ink coating method in the above embodiment. Figure 4 As shown, the circuit board ink coating device includes a primary ink coating module 10 and a secondary ink coating module 20. The functional modules are described in detail as follows: A one-time ink coating module 10 is used to perform one-time ink coating on the circuit board to be coated by a first double-sided coating mechanism, so as to form a base material filling coating on both sides of the circuit board to be coated to obtain a flat circuit board; The secondary ink coating module 20 is used to perform secondary ink coating on the flat circuit board through a second double-sided coating mechanism to form a solder resist ink coating on both sides of the flat circuit board to obtain a target circuit board; the second double-sided coating mechanism includes a first solder resist coating wheel and a second solder resist coating wheel that are relatively arranged, and the solder resist ink coating includes a first solder resist ink coating corresponding to the first solder resist coating wheel and a second solder resist ink coating corresponding to the second solder resist coating wheel, and the mesh number of the first solder resist coating wheel is greater than the mesh number of the second solder resist coating wheel, so that the thickness of the first solder resist ink coating is greater than the thickness of the second solder resist ink coating.

[0042] In one embodiment, the one-time inking module 10 comprises: The primary surface coating unit is used to control the circuit board to be coated to pass through the gap between the first filling coating wheel and the second filling coating wheel, and perform a primary surface coating treatment on the circuit board to be coated through the first filling coating wheel and the second filling coating wheel to form an initial filling coating on both sides of the circuit board to be coated.

[0043] In one embodiment, the primary ink application module 10 further includes: The coating unit is used to control the circuit board to be coated to pass through the gap between the first scraper and the second scraper, and the initial filling coating is coated by the first scraper and the second scraper to form a base material filling coating on both sides of the circuit board to be coated to obtain the flat circuit board.

[0044] In one embodiment, the primary ink application module 10 further includes: The first mesh matching unit is used to obtain the copper layer thickness data of the circuit board to be coated, query the preset thickness mesh association table according to the copper layer thickness data, obtain the first coating wheel mesh matching the copper layer thickness data, and determine the first coating wheel mesh as the mesh of the first filling coating wheel and the second filling coating wheel.

[0045] In one embodiment, the secondary ink coating module 20 includes: The secondary coating unit is used to control the flat circuit board to pass through the gap between the first solder resist coating wheel and the second solder resist coating wheel, and perform secondary coating treatment on the flat circuit board through the first solder resist coating wheel and the second solder resist coating wheel to form a first solder resist ink coating on the side of the flat circuit board close to the first solder resist coating wheel, and to form a second solder resist ink coating on the side of the flat circuit board close to the second solder resist coating wheel, so as to obtain a target circuit board.

[0046] In one embodiment, the secondary ink coating module 20 further includes: The second mesh matching unit is used to obtain the ink thickness requirement of the target circuit board, query the preset thickness mesh association table according to the ink thickness requirement, obtain the second coating wheel mesh and the third coating wheel mesh that match the ink thickness requirement, and determine the second coating wheel mesh as the mesh of the first solder resist coating wheel, and determine the third coating wheel mesh as the mesh of the second solder resist coating wheel.

[0047] In one embodiment, the secondary ink coating module 20 further includes: A historical data acquisition unit, used to acquire historical ink thickness data corresponding to the coating wheel mesh count; A thickness mesh correlation unit, used for correlating the coating wheel mesh with the historical ink thickness data to generate a thickness mesh correlation data group; The preset thickness mesh number association table generating unit is used to generate a preset thickness mesh number association table according to all the thickness mesh number association data groups.

[0048] The specific definition of the circuit board ink coating device can be found in the above-mentioned definition of the circuit board ink coating method, which will not be repeated here. Each module in the above-mentioned circuit board ink coating device can be implemented in whole or in part by software, hardware and a combination thereof. The above-mentioned modules can be embedded in or independent of the processor in the computer device in the form of hardware, or can be stored in the memory of the computer device in the form of software, so that the processor can call and execute the operations corresponding to the above modules.

[0049] In one embodiment, a computer device is provided. The computer device may be a server, and its internal structure diagram may be as follows: Figure 5 As shown. The computer device includes a processor, a memory, a network interface and a database connected through a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a readable storage medium and an internal memory. The readable storage medium stores an operating system, computer-readable instructions and a database. The internal memory provides an environment for the operation of the operating system and computer-readable instructions in the readable storage medium. The database of the computer device is used to store data related to the circuit board ink coating method. The network interface of the computer device is used to communicate with an external terminal through a network connection. When the computer-readable instructions are executed by the processor, a circuit board ink coating method is implemented. The readable storage medium provided in this embodiment includes a non-volatile readable storage medium and a volatile readable storage medium.

[0050] In one embodiment, a computer device is provided, including a memory, a processor, and computer-readable instructions stored in the memory and executable on the processor, wherein the processor executes the computer-readable instructions to implement the following steps: Performing an ink coating process on the circuit board to be coated by a first double-sided coating mechanism, forming a base material filling coating on both sides of the circuit board to be coated, and obtaining a flat circuit board; The flat circuit board is subjected to secondary ink coating by a second double-sided coating mechanism to form solder resist ink coatings on both sides of the flat circuit board to obtain a target circuit board; the second double-sided coating mechanism includes a first solder resist coating wheel and a second solder resist coating wheel which are arranged opposite to each other, the solder resist ink coating includes a first solder resist ink coating corresponding to the first solder resist coating wheel and a second solder resist ink coating corresponding to the second solder resist coating wheel, and the mesh number of the first solder resist coating wheel is greater than the mesh number of the second solder resist coating wheel, so that the thickness of the first solder resist ink coating is greater than the thickness of the second solder resist ink coating.

[0051] In one embodiment, one or more computer-readable storage media storing computer-readable instructions are provided. The readable storage media provided in this embodiment include non-volatile readable storage media and volatile readable storage media. The readable storage media store computer-readable instructions, and when the computer-readable instructions are executed by one or more processors, the following steps are implemented: Performing an ink coating process on the circuit board to be coated by a first double-sided coating mechanism, forming a base material filling coating on both sides of the circuit board to be coated, and obtaining a flat circuit board; The flat circuit board is subjected to secondary ink coating by a second double-sided coating mechanism to form solder resist ink coatings on both sides of the flat circuit board to obtain a target circuit board; the second double-sided coating mechanism includes a first solder resist coating wheel and a second solder resist coating wheel which are arranged opposite to each other, the solder resist ink coating includes a first solder resist ink coating corresponding to the first solder resist coating wheel and a second solder resist ink coating corresponding to the second solder resist coating wheel, and the mesh number of the first solder resist coating wheel is greater than the mesh number of the second solder resist coating wheel, so that the thickness of the first solder resist ink coating is greater than the thickness of the second solder resist ink coating.

[0052] A person of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiments can be implemented by instructing the relevant hardware through computer-readable instructions. The computer-readable instructions can be stored in a non-volatile readable storage medium or a volatile readable storage medium. When the computer-readable instructions are executed, they can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided by the present invention may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0053] Those skilled in the art can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example. In actual applications, the above-mentioned functions can be distributed and completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above.

[0054] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. A method for coating circuit board ink, characterized in that: include: Performing an ink coating process on the circuit board to be coated by a first double-sided coating mechanism, forming a base material filling coating on both sides of the circuit board to be coated, and obtaining a flat circuit board; The flat circuit board is subjected to secondary ink coating by a second double-sided coating mechanism to form solder resist ink coatings on both sides of the flat circuit board to obtain a target circuit board; the second double-sided coating mechanism includes a first solder resist coating wheel and a second solder resist coating wheel which are arranged opposite to each other, the solder resist ink coating includes a first solder resist ink coating corresponding to the first solder resist coating wheel and a second solder resist ink coating corresponding to the second solder resist coating wheel, and the mesh number of the first solder resist coating wheel is greater than the mesh number of the second solder resist coating wheel, so that the thickness of the first solder resist ink coating is greater than the thickness of the second solder resist ink coating.

2. The circuit board ink coating method according to claim 1, characterized in that: The first double-sided coating mechanism comprises a first filling coating wheel and a second filling coating wheel which are arranged opposite to each other; the one-time ink coating process comprises a one-time surface coating process; The ink coating process is performed once on the circuit board to be coated by the first double-sided coating mechanism, comprising: The circuit board to be coated is controlled to pass through the gap between the first filling coating wheel and the second filling coating wheel, and the circuit board to be coated is subjected to a surface coating treatment by the first filling coating wheel and the second filling coating wheel to form an initial filling coating on both sides of the circuit board to be coated.

3. The method for coating circuit board ink according to claim 2, characterized in that: The first double-sided coating mechanism further comprises a first scraper and a second scraper arranged opposite to each other; the one-time ink coating process further comprises a coating and scraping process; After the first filling coating wheel and the second filling coating wheel perform a surface coating treatment on the circuit board to be coated, the method further includes: The circuit board to be coated is controlled to pass through the gap between the first scraper and the second scraper, and the initial filling coating is scraped by the first scraper and the second scraper to form a substrate filling coating on both sides of the circuit board to be coated to obtain the flat circuit board.

4. The method for coating circuit board ink according to claim 2, characterized in that: Before the first double-sided coating mechanism performs an ink coating process on the circuit board to be coated, the method includes: The copper layer thickness data of the circuit board to be coated is obtained, and a preset thickness mesh association table is queried according to the copper layer thickness data to obtain a first coating wheel mesh number that matches the copper layer thickness data, and the first coating wheel mesh number is determined as the mesh number of the first filling coating wheel and the second filling coating wheel.

5. The circuit board ink coating method according to claim 1, characterized in that: The secondary ink coating process includes a secondary top coating process; The second double-sided coating mechanism is used to perform a secondary ink coating process on the flat circuit board to form a solder resist ink coating on both sides of the flat circuit board, including: The flat circuit board is controlled to pass through the gap between the first solder resist coating wheel and the second solder resist coating wheel, and the flat circuit board is subjected to secondary surface coating treatment by the first solder resist coating wheel and the second solder resist coating wheel, so as to form a first solder resist ink coating on the side of the flat circuit board close to the first solder resist coating wheel, and to form a second solder resist ink coating on the side of the flat circuit board close to the second solder resist coating wheel, so as to obtain a target circuit board.

6. The method for coating circuit board ink according to claim 1, characterized in that: Before the second double-sided coating mechanism is used to perform a second ink coating process on the flattened circuit board, the method includes: The ink thickness requirement of the target circuit board is obtained, and the preset thickness mesh association table is queried according to the ink thickness requirement to obtain the second coating wheel mesh number and the third coating wheel mesh number that match the ink thickness requirement, and the second coating wheel mesh number is determined as the mesh number of the first solder resist coating wheel, and the third coating wheel mesh number is determined as the mesh number of the second solder resist coating wheel.

7. The method for coating circuit board ink according to claim 4 or 6, characterized in that: Before the preset thickness mesh association table is queried, the following steps are included: Obtain historical ink thickness data corresponding to the coating wheel mesh count; Associating the coating wheel mesh count with the historical ink thickness data to generate a thickness-mesh count associated data group; A preset thickness and mesh number association table is generated according to all the thickness and mesh number association data groups.

8. A circuit board ink coating device, characterized in that: include: A one-time ink coating module, used for performing one-time ink coating on the circuit board to be coated through a first double-sided coating mechanism, forming a base material filling coating on both sides of the circuit board to be coated, and obtaining a flat circuit board; A secondary ink coating module is used to perform secondary ink coating on the flat circuit board through a second double-sided coating mechanism, forming a solder resist ink coating on both sides of the flat circuit board to obtain a target circuit board; the second double-sided coating mechanism includes a first solder resist coating wheel and a second solder resist coating wheel that are relatively arranged, and the solder resist ink coating includes a first solder resist ink coating corresponding to the first solder resist coating wheel and a second solder resist ink coating corresponding to the second solder resist coating wheel, and the mesh number of the first solder resist coating wheel is greater than the mesh number of the second solder resist coating wheel, so that the thickness of the first solder resist ink coating is greater than the thickness of the second solder resist ink coating.

9. A computer device comprising a memory, a processor, and computer-readable instructions stored in the memory and executable on the processor, characterized in that: When the processor executes the computer-readable instructions, the circuit board ink coating method as described in any one of claims 1 to 7 is implemented.

10. A computer-readable storage medium storing computer-readable instructions, characterized in that: When the computer-readable instructions are executed by one or more processors, the one or more processors execute the circuit board ink coating method as described in any one of claims 1 to 7.

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