Processing method for realizing various surface treatments on PCB (Printed Circuit Board)

Abstract

The invention discloses a processing method for realizing multiple surface treatments on a PCB (Printed Circuit Board), which belongs to the technical field of printed circuit boards, and comprises the following steps of: firstly, pasting an adhesive tape to protect a tin-plated cerium alloy and a gold-plated area, processing a local nickel-gold immersion position, and then pasting the adhesive tape to protect the tin-plated cerium alloy and the nickel-gold immersion area. And finally, an adhesive tape is pasted or blue gel is printed to protect the nickel gold immersion and gold plating areas, and only the position needing tin-cerium alloy plating is exposed to complete tin-cerium alloy plating processing. Through accurate positioning and protection measures, the method can ensure that three different surface treatments of tin-cerium alloy plating, nickel-gold immersion and gold plating can be realized on the same PCB, and the highly complicated design requirements are met.

Description

Technical Field

[0001] The invention relates to the technical field of printed circuit boards, and in particular to a processing method for realizing multiple surface treatments on a PCB board. Background Art

[0002] With the development of the electronics industry, PCB design tends to be diversified and complex, and conventional single or two types of surface treatment can no longer meet the growing technical needs. At present, the PCB industry is gradually transforming to designs that include more than three surface treatments. However, the existing technical process cannot reliably implement this multi-surface treatment design, especially the simultaneous implementation of tin-cerium alloy plating, nickel-gold plating and gold plating on the same PCB board. The general practice in the industry is to recommend that the design end be adjusted to two types of surface treatment, which cannot meet the diverse requirements of the design end. Summary of the invention

[0003] The purpose of the present invention is to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a processing method for implementing multiple surface treatments on a PCB board, which can simultaneously implement three surface treatments on a PCB board to meet the design requirements of the PCB board.

[0004] A processing method for implementing various surface treatments on a PCB board according to an embodiment of the present invention includes:

[0005] Step 1: Apply a layer of solder resist evenly on the PCB board to protect the area that does not require surface treatment;

[0006] Step 2: Carry out the first tape application, and apply high temperature resistant tape on the non-nickel-gold immersion area to ensure that only the area that needs nickel-gold immersion is exposed;

[0007] Step 3: Perform chemical nickel deposition on the exposed area of ​​the PCB to form a uniform nickel layer, and then continue to plate gold on the nickel layer to form a nickel-gold surface treatment;

[0008] Step 4: Remove the high temperature resistant tape applied during the first application;

[0009] Step 5: Apply the tape for the second time, and apply high temperature resistant tape on the non-gold-plated area to ensure that only the area that needs gold plating is exposed;

[0010] Step 6: Electroplating gold on the exposed areas of the PCB;

[0011] Step 7: Remove the high temperature resistant tape applied during the second application of tape;

[0012] Step 8: Perform the third tape application, using high temperature resistant tape to cover the exposed gold-plated and nickel-gold-plated areas, exposing the areas that need to be electroplated with tin-cerium alloy;

[0013] Step 9: Electroplating of tin-cerium alloy is performed on the exposed areas of the PCB.

[0014] The processing method for realizing multiple surface treatments on a PCB board according to an embodiment of the present invention has at least the following beneficial effects: firstly, tape is applied to protect the tin-cerium alloy and gold-plated areas, and a local nickel-gold position is processed, and then tape is applied to protect the tin-cerium alloy and nickel-gold areas, and only the area where gold plating is required is exposed for gold plating processing, and finally, tape or blue glue is applied to protect the nickel-gold and gold-plated areas, and only the area where tin-cerium alloy is required is exposed to complete the tin-cerium alloy processing. Through precise positioning and protection measures, this method can ensure that three different surface treatments of tin-cerium alloy, nickel-gold and gold plating are realized on the same PCB board, meeting highly complex design requirements.

[0015] According to some embodiments of the present invention, before step 1, the PCB board is cleaned and pre-treated to remove impurities on the surface of the PCB board.

[0016] According to some embodiments of the present invention, in step 2, before the first tape application, a positioning device is used to determine the area of ​​the PCB board where nickel-gold deposition is required.

[0017] According to some embodiments of the present invention, after step 4, the PCB board after the high temperature resistant tape is removed is cleaned to remove residual colloid and impurities.

[0018] According to some embodiments of the present invention, in step 5, before applying the tape for the second time, a positioning device is used to determine the area of ​​the PCB board that needs to be gold plated.

[0019] According to some embodiments of the present invention, in step 5, when applying the tape for the second time, ensure that the distance between the exposed gold-plated area and the completed nickel-gold-plated area is greater than or equal to 0.5 mm.

[0020] According to some embodiments of the present invention, in step 6, the thickness of the gold plating is within a range of 0.02 um to 5.0 um.

[0021] According to some embodiments of the present invention, after step 7, the PCB board is checked for wire pick-up to ensure that there is no short circuit or open circuit.

[0022] According to some embodiments of the present invention, in step 8, when applying the tape for the third time, ensure that the distance between the exposed area for electroplating the tin-cerium alloy and the gold-plated and nickel-gold-immersion areas is greater than or equal to 0.5 mm.

[0023] According to some embodiments of the present invention, after step 9, the PCB board is cleaned to remove residues on the surface.

[0024] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The present invention is further described below in conjunction with the accompanying drawings and embodiments:

[0026] Figure 1 It is a flow chart of a processing method for implementing various surface treatments on a PCB board according to an embodiment of the present invention. DETAILED DESCRIPTION

[0027] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0028] In the description of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0029] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0030] refer to Figure 1 A processing method for implementing various surface treatments on a PCB board according to an embodiment of the present invention is described.

[0031] like Figure 1 As shown, the processing method for implementing various surface treatments on a PCB board according to an embodiment of the present invention includes:

[0032] Step 1: Apply a layer of solder resist evenly on the PCB board to protect the area that does not require surface treatment;

[0033] Step 2: Carry out the first tape application, and apply high temperature resistant tape on the non-nickel-gold immersion area to ensure that only the area that needs nickel-gold immersion is exposed;

[0034] Step 3: Perform chemical nickel deposition on the exposed area of ​​the PCB to form a uniform nickel layer, and then continue to plate gold on the nickel layer to form a nickel-gold surface treatment;

[0035] Step 4: Remove the high temperature resistant tape applied during the first application;

[0036] Step 5: Apply the tape for the second time, and apply high temperature resistant tape on the non-gold-plated area to ensure that only the area that needs gold plating is exposed;

[0037] Step 6: Electroplating gold on the exposed areas of the PCB;

[0038] Step 7: Remove the high temperature resistant tape applied during the second application of tape;

[0039] Step 8: Perform the third tape application, using high temperature resistant tape to cover the exposed gold-plated and nickel-gold-plated areas, exposing the areas that need to be electroplated with tin-cerium alloy;

[0040] Step 9: Electroplating of tin-cerium alloy is performed on the exposed areas of the PCB.

[0041] like Figure 1 As shown, firstly, the PCB board is thoroughly cleaned to remove impurities such as oil, dust, etc. on the surface to ensure the adhesion of subsequent surface treatment. A layer of solder resist is evenly applied on the PCB board to protect the area that does not require surface treatment and prevent unnecessary chemical erosion in subsequent processes.

[0042] After the solder mask is completed, use precise positioning equipment to determine the area that needs nickel-gold immersion, and apply high-temperature resistant tape to the non-nickel-gold immersion area to ensure that only the area that needs nickel-gold immersion is exposed. Choose a high-temperature resistant tape suitable for the PCB material, and control the ambient temperature and humidity to prevent the tape from losing its stickiness due to environmental changes.

[0043] After the first tape application, perform chemical nickel deposition on the exposed area to form a uniform nickel layer. Continue gold plating on the nickel layer to form a nickel-plated gold surface treatment. After the nickel-plated gold is completed, carefully remove the applied high-temperature resistant tape to avoid damage to the nickel-plated gold area.

[0044] Use precision positioning equipment again to determine the area that needs to be gold plated, and apply high temperature resistant tape to the non-gold plated area. Make sure that the distance between different surface treatment areas is not less than 0.5mm to prevent the interaction between different chemical treatments. For complex shapes or small areas, dry film may be used to ensure complete coverage of non-gold plated areas.

[0045] After the second tape application, the exposed area is electroplated with gold to form a uniform gold layer. After the gold plating is completed, carefully remove the applied high temperature resistant tape to avoid damage to the gold plated area. And pick the wires and carefully check the wires on the PCB to ensure that there are no short circuits or open circuits.

[0046] Determine the area that needs to be plated with tin-cerium alloy, and apply high-temperature resistant tape to the non-tin-cerium alloy area. If it is difficult to apply tape, you can print blue glue to cover it. Choose tape or blue glue that can withstand the high temperature in the subsequent electroplating process, and check carefully against the drawings to ensure the accuracy of the coverage area. Finally, electroplate the exposed area with tin-cerium alloy to form a uniform tin-cerium alloy layer.

[0047] The processing method for realizing multiple surface treatments on a PCB board can ensure that three different surface treatments, namely, tin-cerium alloy plating, nickel-gold plating and gold plating, are realized on the same PCB board through precise positioning and protection measures, meeting highly complex design requirements. Secondly, the method saves costs and improves production efficiency by reducing the production and repeated tests of test boards. In addition, by controlling the distance between different surface treatment areas and the thickness of the gold plating layer, the method enhances the reliability and stability of the product and avoids mutual interference between different treatment areas.

[0048] Before step 1, clean and pre-treat the PCB to remove impurities on the surface of the PCB. Cleaning and pre-treating the PCB before applying solder resist can ensure that there is no impurities such as oil, dust, etc. on the surface of the PCB, thereby improving the adhesion of the solder resist and the quality of the surface treatment, and reducing possible defects in subsequent processes.

[0049] After step 4, the PCB board is cleaned after the high temperature tape is removed to remove the residual colloid and impurities. Cleaning after removing the high temperature tape can remove the residual colloid and impurities, prevent these residues from affecting the subsequent gold plating process, ensure the quality and adhesion of the electroplating layer, and improve the performance of the final product.

[0050] In step 5, when applying the tape for the second time, ensure that the distance between the exposed gold-plated area and the completed nickel-gold-plated area is greater than or equal to 0.5 mm. In step 8, when applying the tape for the third time, ensure that the distance between the exposed area for electroplating tin-cerium alloy and the gold-plated and nickel-gold-plated areas is greater than or equal to 0.5 mm. This can prevent the mutual influence between different surface treatment areas, avoid possible chemical reactions or mutual interference of electroplating layers, and improve the reliability and stability of the product.

[0051] In step 6, the thickness of the gold plating is within 0.02um to 5.0um. The uniformity and consistency of the gold plating layer are ensured, and the thickness of the gold plating layer is adjusted as needed to meet different application requirements and improve the durability and conductivity of the product.

[0052] After step 9, the PCB is cleaned to remove the residue on the surface. Cleaning after electroplating the tin-cerium alloy can remove the residue on the surface, including unreacted materials and by-products generated during the electroplating process, ensure the cleanliness of the PCB and the quality of the surface treatment, and improve the performance and appearance of the final product.

[0053] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A processing method for realizing multiple surface treatments on a PCB board, characterized in that: include: Step 1: Apply a layer of solder resist evenly on the PCB board to protect the area that does not require surface treatment; Step 2: Carry out the first tape application, and apply high temperature resistant tape on the non-nickel-gold immersion area to ensure that only the area that needs nickel-gold immersion is exposed; Step 3: Perform chemical nickel deposition on the exposed area of ​​the PCB to form a uniform nickel layer, and then continue to plate gold on the nickel layer to form a nickel-gold surface treatment; Step 4: Remove the high temperature resistant tape applied during the first application; Step 5: Apply the tape for the second time, and apply high temperature resistant tape on the non-gold-plated area to ensure that only the area that needs gold plating is exposed; Step 6: Electroplating gold on the exposed areas of the PCB; Step 7: Remove the high temperature resistant tape applied during the second application of tape; Step 8: Perform the third tape application, using high temperature resistant tape to cover the exposed gold-plated and nickel-gold-plated areas, exposing the areas that need to be electroplated with tin-cerium alloy; Step 9: Electroplating of tin-cerium alloy is performed on the exposed areas of the PCB.

2. The processing method for realizing multiple surface treatments on a PCB board according to claim 1, characterized in that: Before step 1, clean and pre-treat the PCB board to remove impurities on the surface of the PCB board.

3. The processing method for realizing multiple surface treatments on a PCB board according to claim 1, characterized in that: In step 2, before applying the tape for the first time, use a positioning device to determine the area of ​​the PCB board that needs to be nickel-gold plated.

4. The method for realizing multiple surface treatments on a PCB according to claim 1, characterized in that: After step 4, the PCB board after the high temperature resistant tape is removed is cleaned to remove the residual colloid and impurities.

5. The processing method for realizing multiple surface treatments on a PCB board according to claim 1, characterized in that: In step 5, before applying the tape for the second time, use a positioning device to determine the area of ​​the PCB board that needs to be gold-plated.

6. The method for realizing multiple surface treatments on a PCB according to claim 5, characterized in that: In step 5, when applying the tape for the second time, ensure that the distance between the exposed gold-plated area and the completed nickel-gold-plated area is greater than or equal to 0.5 mm.

7. The processing method for realizing multiple surface treatments on a PCB board according to claim 1, characterized in that: In step 6, the thickness of the gold plating is within 0.02um to 5.0um.

8. The method for realizing multiple surface treatments on a PCB according to claim 1, characterized in that: After step 7, check the wires on the PCB to ensure there are no short circuits or open circuits.

9. The method for realizing multiple surface treatments on a PCB according to claim 1, characterized in that: In step 8, when applying the tape for the third time, ensure that the distance between the exposed area for electroplating the tin-cerium alloy and the gold-plated and nickel-gold-immersion areas is greater than or equal to 0.5 mm.

10. The processing method for realizing multiple surface treatments on a PCB board according to claim 1, characterized in that: After step 9, the PCB board is cleaned to remove the residue on the surface.

Images