Shielding structure of sensor circuit board and processing method

Abstract

The invention discloses a shielding structure of a sensor circuit board, and the structure comprises welding grooves which are formed in the side part of a bonding pad region of the sensor circuit board and are arranged at intervals, and a plurality of first pins which are formed at the bonding end, bonded with the bonding pad region, of an upper shielding cover. And the plurality of first pins are inserted into the welding grooves and welded when the upper shielding cover is attached to the bonding pad area. Through the above arrangement, when the upper shielding case is installed, a welding area between a fitting end and a pad area in the prior art can be canceled, the width of the pad area is reduced, the width size of a sensor circuit board is reduced, the space occupied by the upper shielding case in the pad area is reduced, and the upper shielding case is more suitable for small-space arrangement; meanwhile, the first pin and the welding groove are welded to form cross fusion, so that the welded upper shielding case is more stable and firmer.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board shielding and packaging, and in particular to a shielding structure and a processing method of a sensor circuit board. Background Art

[0002] The shielding cover is an alloy metal cover, which is a structural cover that reduces the radiation of the components with radiation on the circuit board to the important parts. In the prior art, the shielding package fixing structure of the circuit board is mostly divided into two types. One is to buckle the shielding cover on the end face of the PAD (pad) reserved on the PCBA (circuit board with components welded), and then weld and fix it; the other is to weld the shielding cover fixing clip or shielding cover hanger on the end face of the PAD (pad) reserved on the PCBA (circuit board with components welded), and then install the shielding cover or the shielding cover formed by removing a part of the structure on the shielding cover fixing clip or shielding cover hanger. Among them, the welding of the first method requires a wider PAD setting, or it is necessary to punch holes on the PAD for through-hole welding. However, when the shielding cover needs to be shielded and installed on both sides of the PCBA, the shielding cover installed later cannot be buckled on the PAD well, resulting in conflict and making welding more difficult; the second method requires more board surface or three-dimensional space by using the shielding cover fixing clip or the shielding cover frame, which is greatly restricted in the use environment of small space. Therefore, it is urgent to solve the problem of how to install a shielding cover that occupies more board space resources when the sensor circuit board is arranged in a small space. Summary of the invention

[0003] In order to solve the above technical problems, the present invention provides a shielding structure of a sensor circuit board, including welding grooves arranged at intervals formed on the side of the pad area of ​​the sensor circuit board and a plurality of first pins formed on the fitting end where the upper shielding cover fits the pad area, and the plurality of first pins are inserted into the welding grooves and welded when the upper shielding cover fits the pad area. Through the above arrangement, when installing the upper shielding cover, the welding area between the fitting end and the pad area in the prior art can be eliminated, the width of the pad area is reduced, the width of the sensor circuit board is reduced, the space occupied by the upper shielding cover in the pad area is reduced, and it is more suitable for small space layout; at the same time, welding is performed between the first pins and the welding grooves to form a cross fusion, so that the upper shielding cover after welding is more stable and strong. As for the multiple welding grooves arranged at intervals, a pulse-shaped structure design is preferred.

[0004] In one embodiment, it also includes a lower shielding cover, and a plurality of second pins are formed on the fitting end of the lower shielding cover and the pad area, and the plurality of second pins are inserted into the welding groove and welded when the lower shielding cover and the pad area are fitted. By providing the lower shielding cover and the second pins, double-sided shielding can be achieved on the basis of achieving the above functions, thereby improving the shielding effect. Furthermore, the double-sided shielding structure of the above structure overcomes the technical shortcomings of the prior art that the through-hole welding installation cannot be repaired and occupies more board resources, and the patch welding installation occupies more board resources, so that the double-sided shielding structure is more adaptable to small space layout compared with the prior art.

[0005] The structures of the first pin and the second pin are not specifically limited. In the present embodiment, they are strip-shaped structures protruding from the fitting end.

[0006] In one embodiment, the first pin and the second pin are arranged at intervals. Through this arrangement, the first pin and the second pin are independently welded to the welding groove and independently fixed, and when the upper shielding cover or the lower shielding cover needs to be repaired, the upper and lower shielding covers do not interfere with each other and have strong independence.

[0007] In one embodiment, the first pin and the second pin are a double pin structure. The double pin structure is more stable and strong after welding. The double pin structure is a double strip structure protruding from the fitting end.

[0008] In one embodiment, a reinforced positioning hole is formed on the sensor circuit board, a reinforced positioning structure is formed on the upper shielding cover and / or the lower shielding cover, and a reinforced positioning groove that matches the reinforced positioning structure is formed on the lower shielding cover and / or the upper shielding cover, and the reinforced positioning structure passes through the reinforced positioning hole and then extends into the reinforced positioning groove. By providing a combination of the reinforced positioning structure, the reinforced positioning hole and the reinforced positioning groove, rapid positioning installation can be achieved, and at the same time, the installation strength of the upper and lower shielding covers can be increased.

[0009] Furthermore, the reinforcement positioning structure is an extension plate formed on the side of the lower shielding cover or the upper shielding cover, and the reinforcement positioning groove is a concave on the side of the upper shielding cover or the lower shielding cover. This structural combination is easy to process, simple to operate, and flexible to install.

[0010] The present invention also discloses a processing method for the shielding structure of the above-mentioned sensor circuit board, comprising the following steps: (1) forming spaced soldering grooves on the sides of the pad area of ​​the sensor circuit board; (2) forming pins at the ends where the upper shielding cover and / or the lower shielding cover fit the pad area; (3) after the sensor circuit board is tested, the upper shielding cover and / or the lower shielding cover fit the circuit board, the reinforced positioning structure passes through the reinforced positioning hole and then extends into the reinforced positioning groove, and the pins are located in the soldering groove for soldering. The above-mentioned processing method can reduce the pad area, facilitate installation and positioning, increase the welding strength, and make the processed sensor circuit board more suitable for small space settings. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions in the specific implementation modes of the present invention, the following briefly introduces the drawings required for use in the specific implementation modes. Obviously, the drawings described below are some implementation modes of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0012] Figure 1 It is a schematic diagram of the structure of the unassembled shielding structure of the sensor circuit board of the present invention;

[0013] Figure 2 It is a schematic structural diagram of the shielding structure of the sensor circuit board of the present invention after being assembled;

[0014] Figure 3 It is a structural schematic diagram of the pad area of ​​the present invention;

[0015] The reference numerals in the figure are as follows: 1-sensor circuit board; 2-pad area; 3-soldering groove; 4-upper shielding cover; 5-first pin; 6-lower shielding cover; 7-second pin; 8-reinforced positioning hole; 9-reinforced positioning structure; 10-reinforced positioning groove; 11-wiring area. DETAILED DESCRIPTION

[0016] The following is a clear and complete description of the content of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. The embodiments in the present invention and other embodiments obtained by ordinary technicians in this field without creative work are all within the scope of protection of the present invention.

[0017] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.

[0018] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0019] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0020] Example 1

[0021] like Figure 1-3 As shown, this embodiment discloses a shielding structure of a sensor circuit board, which includes welding grooves 3 formed at intervals on the side of the pad area 2 of the sensor circuit board 1, and a plurality of first pins 5 formed on the bonding end of the upper shielding cover 4 and the pad area 3. The pad area 2 refers to the area bonded to the bonding end of the upper shielding cover 4. In this embodiment, it is the area surrounding the wiring area 11. The specific shape is not specifically limited. For example, Figure 3 As shown, the overall outline is close to a rectangle. When the upper shielding cover 4 is fitted with the pad area 2, the plurality of first pins 5 are inserted into the welding groove 3 and welded. The welding groove 3 is an open groove, not a hole groove, which is convenient for installation and plugging. At the same time, the welding material or welding layer is located in the welding groove 3, and no additional welding area is required, which effectively utilizes the space. The first pin 5 is a plurality of strips extending from the upper shielding cover 4 at the fitting end. Preferably, each of the first pins 5 is a double-pin structure, so that the welding is more firm.

[0022] In one embodiment, a lower shielding cover 6 is further included. In this case, the pad area includes a front area and a back area, which are preferably symmetrically arranged. Of course, they can be specifically designed according to the specific situation and are not specifically limited. A plurality of second pins 7 are formed on the fitting end where the lower shielding cover 6 and the back part of the pad area 2 are fitted. When the lower shielding cover 6 and the back area of ​​the pad area 2 are fitted, the plurality of second pins 7 are inserted into the welding groove 3 and welded. The second pins 7 are multiple strips extending from the fitting end of the lower shielding cover 6. Preferably, each of the second pins 7 is a double-pin structure, so that the welding is more firm.

[0023] In one embodiment, the first pin 5 and the second pin 7 are spaced apart from each other, that is, when inserted into the welding slot 3 , there is one second pin 7 between two adjacent first pins 5 , or there is one first pin 5 between two adjacent second pins 7 .

[0024] In one embodiment, a reinforcement positioning hole 8 is formed on the sensor circuit board 1, a reinforcement positioning structure 9 is formed on the upper shielding cover 4 and / or the lower shielding cover 6, and a reinforcement positioning groove 10 matched with the reinforcement positioning structure is formed on the lower shielding cover 6 and / or the upper shielding cover 4, and the reinforcement positioning structure 9 extends into the reinforcement positioning groove 10 after passing through the reinforcement positioning hole 8. Specifically, the reinforcement positioning structure 9 is an extension plate formed on the side of the upper part of the lower shielding cover 6 or the upper shielding cover 4, and the width is smaller than the width of the side, and the reinforcement positioning groove 10 is a concave structure formed on the side of the upper part of the upper shielding cover 4 or the lower shielding cover 6. In this embodiment, the reinforcement positioning hole 8 is a strip hole, specifically two, the reinforcement positioning structure 9 is two extension plates formed on the side of the upper part of the lower shielding cover 6, and the reinforcement positioning groove 10 is two concave structures formed on the side of the upper part of the upper shielding cover 4.

[0025] Example 2

[0026] like Figure 1-3 The present embodiment discloses a method for processing a shielding structure of a sensor circuit board, comprising the following steps: (1) forming spaced soldering grooves on the sides of a soldering pad area of ​​the sensor circuit board; (2) forming pins at the ends where the upper shielding cover and / or the lower shielding cover are bonded to the soldering pad area; (3) after the sensor circuit board is tested, the upper shielding cover and / or the lower shielding cover are bonded to the circuit board, the reinforced positioning structure passes through the reinforced positioning hole and then extends into the reinforced positioning groove, and the pins are located in the soldering groove for soldering.

[0027] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention.

Claims

1. A shielding structure of a sensor circuit board, characterized in that: It includes welding grooves arranged at intervals on the side of the pad area of ​​the sensor circuit board and a plurality of first pins formed on the bonding end where the upper shielding cover is bonded to the pad area. The plurality of first pins are inserted into the welding grooves and welded when the upper shielding cover is bonded to the pad area.

2. The shielding structure of the sensor circuit board according to claim 1, characterized in that: It also includes a lower shielding cover, and a plurality of second pins are formed on the bonding end of the lower shielding cover and the pad area. The plurality of second pins are inserted into the welding groove and welded when the lower shielding cover and the pad area are bonded.

3. The shielding structure of the sensor circuit board according to claim 2, characterized in that: The first pin and the second pin are arranged at intervals.

4. The shielding structure of the sensor circuit board according to claim 2, characterized in that: The first pin and the second pin are a double-pin structure.

5. The shielding structure of the sensor circuit board according to claim 2, characterized in that: A reinforced positioning hole is formed on the sensor circuit board, a reinforced positioning structure is formed on the upper shielding cover and / or the lower shielding cover, a reinforced positioning groove matching the reinforced positioning structure is formed on the lower shielding cover and / or the upper shielding cover, and the reinforced positioning structure passes through the reinforced positioning hole and then extends into the reinforced positioning groove.

6. The shielding structure of the sensor circuit board according to claim 5, characterized in that: The reinforced positioning structure is an extension plate formed on the side of the upper part of the lower shielding cover or the upper shielding cover, and the reinforced positioning groove is a concave on the side of the upper part of the upper shielding cover or the lower shielding cover.

7. A method for processing the shielding structure of a sensor circuit board according to any one of claims 1 to 6, characterized in that: The method comprises the following steps: (1) forming welding grooves arranged at intervals on the sides of the pad area of ​​the sensor circuit board; (2) forming pins at the ends where the upper shielding cover and / or the lower shielding cover are bonded to the pad area; and (3) after the sensor circuit board is tested, bonding the upper shielding cover and / or the lower shielding cover to the circuit board, with the pins located in the welding grooves for welding.

Images