Display panel and manufacturing method thereof

Abstract

The invention provides a display panel and a manufacturing method thereof, the display panel comprises a circuit board, a first substrate, a conductive layer, a second substrate and a driving circuit layer which are sequentially stacked, the second substrate is provided with a via hole, and the driving circuit layer is electrically connected with one side of the conductive layer through the via hole; the first substrate is provided with an opening, and the circuit board is electrically connected with the other side of the conductive layer through the opening; and a conductive ink material structure is arranged in the opening and is connected with the circuit board and the conductive layer. According to the display panel and the manufacturing method thereof, the structure is simple, manufacturing is convenient, the narrow frame effect can be optimized, meanwhile, the stability of the display panel is ensured, and the service life is long.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof. Background Art

[0002] At present, with the rapid development of display technology, various types of display products are gradually appearing in people's lives, among which flexible display products are favored by more and more users. People's requirements for the experience and comfort of display products are getting higher and higher. In order to obtain a larger screen-to-body ratio and provide users with a good visual experience, narrowing the border, especially the narrowing of the lower border, has become a trend in the development of display products. However, the current display panel border narrowing effect is poor. Some technologies have proposed a design of binding the back of the circuit board. Although it can optimize the narrow border effect, the process conditions are high and it is easy to damage the screen. Therefore, there is an urgent need for a display panel that can narrow the border and has stronger stability. Summary of the invention

[0003] In view of this, the purpose of the present application is to provide a display panel and a manufacturing method thereof.

[0004] In a first aspect of the present application, a display panel is provided, comprising a circuit board, a first substrate, a conductive layer, a second substrate and a driving circuit layer stacked in sequence, wherein the second substrate is provided with a via hole, and the driving circuit layer is electrically connected to one side of the conductive layer through the via hole; an opening is provided on the first substrate, and the circuit board is electrically connected to the other side of the conductive layer through the opening; a conductive ink material structure is provided in the opening, and the conductive ink material structure connects the circuit board and the conductive layer.

[0005] In some embodiments, the circuit board includes a chip-on-film, a flexible circuit board and / or a printed circuit board; the conductive ink material structure includes a plurality of insulating rubber blocks arranged at intervals, and a conductive ink block is provided between two adjacent insulating rubber blocks.

[0006] In some embodiments, the conductive ink block is made of metal-based conductive ink, carbon-based conductive ink or polymer conductive ink, and the insulating rubber block is made of epoxy resin or acrylic resin.

[0007] In some embodiments, the adhesion of the conductive ink material structure is 11N / cm 2 Up to 17N / cm 2 , the thickness of the conductive ink material structure is 3 μm to 10 μm.

[0008] In some embodiments, the conductivity of the conductive ink block is (0.29-2)×10 3S / cm, the interface resistance between the conductive ink block and the conductive layer is less than or equal to 0.3Ω, the interface resistance between the conductive ink block and the circuit board is less than or equal to 0.3Ω, and the material viscosity of the conductive ink block is (2.2-2.5)×10 6 Pa.s.

[0009] In some implementations, a gap is provided between the conductive ink block and the insulating rubber block.

[0010] In some embodiments, the distance between the conductive ink block and the insulating rubber block is 3 μm to 5 μm.

[0011] In some embodiments, the conductive layer includes a plurality of conductive blocks arranged at intervals, the conductive blocks correspond one-to-one to the conductive ink blocks and are arranged against each other, and the cross-sectional width of the conductive blocks is greater than the cross-sectional width of the conductive ink blocks; and / or, a plurality of spaced pins are provided on one side of the circuit board close to the conductive layer, the pins correspond one-to-one to the conductive ink blocks and are arranged against each other, and the cross-sectional width of the pins is greater than the cross-sectional width of the conductive ink blocks.

[0012] In some embodiments, on the abutting surface between the conductive block and the conductive ink block, the distance between the edge of the conductive block and the edge of the conductive ink block is 8μm to 10μm; and / or, on the abutting surface between the pin and the conductive ink block, the distance between the edge of the pin and the edge of the conductive ink block is 8μm to 10μm.

[0013] In some embodiments, a cross-sectional width of a side of the conductive ink block close to the conductive block is greater than a cross-sectional width of a side close to the pin.

[0014] The second aspect of the present application provides a method for manufacturing a display panel, including forming a conductive layer on one side of a first substrate, forming a second substrate on a side of the conductive layer away from the first substrate, forming a via hole on the second substrate, and forming a driving circuit layer on a side of the second substrate away from the conductive layer; forming an opening on the first substrate, bonding a conductive ink material structure in the opening, and forming a circuit board on a side of the first substrate away from the conductive layer; and crimping and binding the circuit board, the conductive ink material structure and the conductive layer at a binding temperature of 30°C to 50°C and a binding pressure of 0.5MPa to 1MPa.

[0015] In some embodiments, the crimping binding of the conductive ink material structure is first pre-cured by low-temperature crimping at 40° C., and then completely cured by irradiation with a 470 nm light source for 4 to 8 seconds.

[0016] As can be seen from the above, the present application provides a display panel and a method for manufacturing the same, wherein the display panel includes a circuit board, a first substrate, a conductive layer, a second substrate and a driving circuit layer stacked in sequence, the second substrate is provided with a via, and the driving circuit layer is electrically connected to one side of the conductive layer through the via; the first substrate is provided with an opening, and the circuit board is electrically connected to the other side of the conductive layer through the opening; a conductive ink material structure is provided in the opening, and the conductive ink material structure connects the circuit board and the conductive layer. By forming a conductive layer between the first substrate and the second substrate, and then opening the first substrate, the circuit board can be directly bound to the back of the display panel, thereby improving the narrow frame effect of the display panel; by using a conductive ink material structure to connect the circuit board and the conductive layer, the binding process conditions are low, and low-temperature and low-pressure crimping binding can be achieved, which will not damage the film layers of the display panel and ensures structural stability. The display panel and its method for manufacturing the same have a simple structure and are easy to manufacture, and can optimize the narrow frame effect while ensuring the stability of the display panel and a long service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the present application or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 is a schematic diagram of a cross-sectional structure of a display panel in the related art;

[0019] Figure 2 is a schematic diagram of a cross-sectional structure of another display panel in the related art;

[0020] Figure 3 is a schematic diagram of a cross-sectional structure of a display panel in an embodiment of the present application;

[0021] Figure 4 This is a schematic diagram of manufacturing a conductive structure in an embodiment of the present application;

[0022] Figure 5 A top view of the conductive structure in an embodiment of the present application;

[0023] Figure 6 for Figure 5 Schematic diagram of the cross-sectional structure of the conductive structure;

[0024] Figure 7 for Figure 6 A schematic diagram of the cross-sectional structure of the conductive structure and the conductive layer;

[0025] Figure 8 for Figure 7A schematic diagram of the cross-sectional structure of the conductive structure and the circuit board;

[0026] Fig. 9 for Figure 8 Schematic diagram of the cross-sectional structure after the conductive structure is bound.

[0027] Figure numerals: 1, circuit board; 1-1, pin; 2, first substrate; 2-1, opening; 3, conductive layer; 3-1, conductive block; 4, second substrate; 4-1, via; 5, driving circuit layer; 6, conductive ink material structure; 6-1, insulating rubber block; 6-2, conductive ink block; 7, top film; 8, bottom film; 9, nozzle; 10, barrier layer. DETAILED DESCRIPTION

[0028] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0029] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should be the usual meanings understood by people with ordinary skills in the field to which the present application belongs. The "first", "second" and similar words used in the embodiments of the present application do not represent any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements or objects appearing in front of the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0030] At present, with the rapid development of display technology, various types of display products are gradually appearing in people's lives, among which flexible display products are favored by more and more users. People's requirements for the experience and comfort of display products are getting higher and higher. In order to obtain a larger screen-to-body ratio and provide users with a good visual experience, narrowing the border, especially the narrowing of the lower border, has become a trend in the development of display products. However, the current display panel border narrowing effect is poor. Some technologies have proposed a design of binding the back of the circuit board. Although it can optimize the narrow border effect, the process conditions are high and it is easy to damage the screen. Therefore, there is an urgent need for a display panel that can narrow the border and has stronger stability.

[0031] like Figure 1The figure shows a cross-sectional schematic diagram of a display panel, where Cover glass is the cover plate, OCA is the optical adhesive layer, POL is the polarizing layer, BF is the back film layer, SCF is the heat dissipation layer, FOAM is the support layer, and PNL is the display module. The display module is bonded to the circuit board by reverse bending, but the size of the lower frame is increased due to the influence of the bending structure.

[0032] In order to further narrow the border, a design was developed that directly bonds the circuit board to the back of the display panel, such as Figure 2 As shown, it is a cross-sectional schematic diagram of another display panel, in which CVD1 is the first inorganic film layer, CVD2 is the second inorganic film layer, IJP is the organic film layer, PDL is the pixel defining layer, PS is the spacer, PLN is the flat layer, Dam1 is the first blocking block, Dam2 is the second blocking block, SD1 is the first electrode layer, ILD is the interlayer dielectric layer, GI1 is the first gate insulating layer, GI2 is the second gate insulating layer, Gate1 is the first gate, Gate2 is the second gate, Barrier2&buffer is the blocking buffer layer, Barrier1 is the blocking layer 10, PI1 is the first substrate 2, PI2 is the second substrate 4, and SD0 is the conductive layer 3.

[0033] like Figure 2 As shown, a conductive layer 3 is formed between the first substrate 2 and the second substrate 4, and a via 4-1 is provided in the second substrate 4 so that the conductive layer 3 can be connected to the circuit of the display panel. At the same time, an opening 2-1 is provided in the first substrate 2 to expose the bonding pin of the conductive layer 3, so that it can be directly crimped and connected with the circuit board 1 to realize a design of direct back-side binding.

[0034] However, at present, the conductive layer 3 and the circuit board 1 are crimped and connected using anisotropic conductive particles (ACF). The activation of ACF requires a high temperature of 180°C, a high pressure of 8MPa, and a pressure maintenance of more than 6s. If this process condition is applied to the back of the display area, the high temperature will burn the packaging layer and the flexible circuit board of the flexible screen, and generate thermal stress on each film layer. The high pressure will cause the above-mentioned film layers to be crushed and cause the film layers to rupture. Therefore, it is difficult to ensure the stability of the display panel. In order to realize the back-binding process of the flexible screen, low-temperature and low-pressure crimping and binding conductive materials are required.

[0035] Below, through specific embodiments and combined Figures 3 to 9 To describe the technical solution of this application in detail.

[0036] In some embodiments of the present application, a display panel is provided, such as Figure 3 and Fig. 9As shown, it includes a circuit board 1, a first substrate 2, a conductive layer 3, a second substrate 4 and a driving circuit layer 5 which are stacked in sequence, the second substrate 4 is provided with a via hole 4-1, and the driving circuit layer 5 is electrically connected to one side of the conductive layer 3 through the via hole 4-1; the first substrate 2 is provided with an opening 2-1, and the circuit board 1 is electrically connected to the other side of the conductive layer 3 through the opening 2-1; a conductive ink material structure 6 is provided in the opening 2-1, and the conductive ink material structure 6 connects the circuit board 1 and the conductive layer 3.

[0037] like Figure 3 As shown, the display panel includes a circuit board 1, a first substrate 2, a conductive layer 3, a second substrate 4 and a driving circuit layer 5 which are stacked in sequence, and the circuit board 1 and the driving circuit layer 5 are respectively located on both sides of the substrate; a light-emitting layer is provided on the side of the driving circuit layer 5 away from the substrate, which is used to control the light emission of the display panel; the first substrate 2 and the second substrate 4 are, for example, flexible substrates, which provide support; the circuit board 1 includes, for example, a chip on film (COF), a flexible circuit board (FPC) and a printed circuit board (PCB), etc. In one embodiment, the display panel can be first bound to the chip on film, and then the chip on film is bound to the flexible circuit board or the printed circuit board; in another embodiment, the display panel can also be directly bound to the flexible circuit board. The circuit board 1 is used to control the driving circuit layer 5. Components and connectors can be set on the circuit board 1. The components can be copper leakage areas, capacitor and resistor areas (blocks), piano covers, timing controllers (t-con), non-volatile memory (flash), shielding covers, etc. A conductive layer 3 is provided between the first substrate 2 and the second substrate 4. The conductive layer 3 is, for example, a metal layer. A via 4-1 is provided on the second substrate 4. The driving circuit layer 5 is electrically connected to one side of the conductive layer 3 through the via 4-1. An opening 2-1 is provided on the first substrate 2. The circuit board 1 is electrically connected to the other side of the conductive layer 3 through the opening 2-1, thereby conducting the circuit board 1 and the driving circuit layer 5.

[0038] like Fig. 9 As shown, by forming a conductive layer 3 between the first substrate 2 and the second substrate 4, and then opening the opening 2-1 in the first substrate 2, the circuit board 1 can be directly bound to the back of the display panel without bending the display panel, thereby improving the narrow frame effect of the display panel; by adopting a conductive ink material structure 6 to connect the circuit board 1 and the conductive layer 3, the binding process conditions are low, the binding temperature is, for example, 30°C to 50°C, and the binding pressure is, for example, 0.5MPa to 1MPa, so that low-temperature and low-pressure crimping binding can be achieved, which will not damage the film layers of the display panel and ensure the structural stability of the display panel.

[0039] The display panel has a simple structure and is easy to manufacture, and can optimize the narrow frame effect while ensuring the stability of the display panel and a long service life.

[0040] In some embodiments, Figure 5 As shown, the conductive ink material structure 6 includes a plurality of insulating rubber blocks 6 - 1 arranged at intervals, and a conductive ink block 6 - 2 is provided between two adjacent insulating rubber blocks 6 - 1 .

[0041] like Figure 5 As shown, the conductive ink material structure 6 includes insulating rubber blocks 6-1 and conductive ink blocks 6-2 arranged alternately. The manufacturing process is as follows: Figure 4 As shown, the nozzles 9 of two materials can be used to simultaneously perform profiling printing on the insulating rubber block 6-1 and the conductive ink block 6-2, and the profiling refers to the pin 1-1 of the circuit board 1, so that the circuit board 1 and the conductive layer 3 can be accurately connected; Figure 5 As shown, a is the length of the conductive ink block 6 - 2 or the insulating rubber block 6 - 1 , and the length can be adjusted according to the size of the pin 1 - 1 , and is not specifically limited.

[0042] Before being bonded to the opening 2-1, the conductive ink material structure 6 can be first printed on the base film 8, and after printing is completed, it can be covered with the top film 7 for standby use. When in use, the top film 7 and the base film 8 can be peeled off. The material of the top film 7 and the base film 8 is, for example, PET, and the peeling force of the base film 8 is, for example, 1gf / inch to 3gf / inch, and the peeling force of the top film 7 is, for example, 4gf / inch to 8gf / inch. The peeling force of the base film 8 is less than the peeling force of the top film 7. In this way, when the conductive ink material structure 6 is in use, the base film 8 can be peeled off first and attached to the conductive layer 3, and then the top film 7 can be peeled off and attached to the circuit board 1.

[0043] like Figure 6 As shown, the conductive ink block 6-2 is located between the insulating rubber blocks 6-1, which can play an insulating protection role and avoid cross-current; the conductive ink block 6-2 can accurately connect the circuit board 1 and the conductive layer 3 to achieve precise control.

[0044] In some embodiments, the conductive ink block 6 - 2 is made of metal-based conductive ink, carbon-based conductive ink or polymer conductive ink, and the insulating rubber block 6 - 1 is made of epoxy resin or acrylic resin.

[0045] The material of the conductive ink block 6-2 is, for example, silver nanowire conductive ink, graphene conductive ink, polyaniline conductive ink, polythiophene conductive ink, etc., which has high conductivity and low curing conditions; the material of the insulating rubber block 6-1 is epoxy resin or acrylic resin, etc., which has strong insulation effect and has certain bonding ability at low temperature.

[0046] In some embodiments, the adhesion of the conductive ink material structure 6 is 11N / cm 2 Up to 17N / cm 2 , the thickness of the conductive ink material structure 6 is 3 μm to 10 μm.

[0047] The adhesion of the conductive ink material structure 6 is, for example, 11 N / cm 2 , 12N / cm 2 , 13N / cm 2 , 14N / cm 2 , 15N / cm 2 , 16N / cm 2 or 17N / cm 2 Etc., which has a good adhesion effect, and can achieve preliminary bonding between the conductive layer 3 and the circuit board 1 before crimping and binding; Figure 6 As shown, c is the thickness of the conductive ink material structure, and the thickness may be, for example, 3μm, 4μm, 5μm, 6μm, 7μm, 8μm, 9μm or 10μm, etc. This can stably connect the conductive layer 3 and the circuit board 1, and avoid the conductive ink material structure 6 being too thin and loose in connection, and also avoid being too thick and causing increased resistance and increased space.

[0048] In some embodiments, the conductivity of the conductive ink block 6-2 is (0.29-2)×10 3 S / cm, the interface resistance between the conductive ink block 6-2 and the conductive layer 3 is less than or equal to 0.3Ω, the interface resistance between the conductive ink block 6-2 and the circuit board 1 is less than or equal to 0.3Ω, and the material viscosity of the conductive ink block 6-2 is (2.2-2.5)×10 6 Pa.s.

[0049] The conductivity of the conductive ink block 6-2 is, for example, 0.29×10 3 S / cm, 0.5×10 3 S / cm, 1×10 3 S / cm, 1.5×10 3 S / cm or 2×10 3 S / cm, etc. The interface resistance formed by the conductive ink block 6-2 is, for example, 0.1Ω, 0.2Ω or 0.3Ω, etc., to ensure good conductive performance; the material viscosity of the conductive ink block 6-2 is, for example, 2.2×10 6 Pa.s, 2.3×10 6 Pa.s, 2.4×10 6 Pa.s or 2.5×10 6 Pa.s, etc., to ensure a good fit.

[0050] In some embodiments, Figure 6 As shown, the conductive ink block 6 - 2 and the insulating rubber block 6 - 1 are arranged with a gap.

[0051] like Figure 6As shown, the conductive ink block 6-2 and the insulating rubber block 6-1 are provided with a gap, so that when they are subsequently crimped and bound, an extrusion space can be provided to ensure the connection effect of the conductive ink block 6-2 and the stability of the conductive ink material structure. When the conductive ink material structure 6 is manufactured, the conductive ink block 6-2 and the insulating rubber block 6-1 are not affected to be printed simultaneously, thereby improving the manufacturing efficiency. Figure 6 As shown, b is the distance between the conductive ink block 6-2 and the insulating rubber block 6-1, and the distance is, for example, 3μm, 4μm or 5μm, etc., to avoid a spacing that is too large and low space utilization, and to avoid a spacing that is too small and cannot provide sufficient extrusion space, resulting in damage to the conductive ink material structure 6.

[0052] In some embodiments, Fig. 9 As shown, the conductive layer 3 includes a plurality of conductive blocks 3-1 arranged at intervals, the conductive blocks 3-1 correspond one-to-one with the conductive ink blocks 6-2 and are arranged against each other, and the cross-sectional width of the conductive blocks 3-1 is greater than the cross-sectional width of the conductive ink blocks 6-2; and / or, a plurality of spaced pins 1-1 are provided on one side of the circuit board 1 close to the conductive layer 3, the pins 1-1 correspond one-to-one with the conductive ink blocks 6-2 and are arranged against each other, and the cross-sectional width of the pins 1-1 is greater than the cross-sectional width of the conductive ink blocks 6-2.

[0053] like Fig. 9 As shown, the conductive layer 3 includes a plurality of conductive blocks 3-1 arranged at intervals, the conductive blocks 3-1 correspond to the conductive ink blocks 6-2 one by one and are arranged against each other, and the cross-sectional width of the conductive blocks 3-1 is greater than the cross-sectional width of the conductive ink blocks 6-2, so that the fitting accuracy deviation can be provided to avoid short circuits in connection; similarly, a plurality of spaced pins 1-1 are provided on one side of the circuit board 1 close to the conductive layer 3, the pins 1-1 correspond to the conductive ink blocks 6-2 one by one and are arranged against each other, and the cross-sectional width of the pins 1-1 is greater than the cross-sectional width of the conductive ink blocks 6-2, so that the fitting accuracy deviation can be provided to avoid short circuits in connection; the insulating rubber block 6-1 is bonded to the conductive block 3-1 and the pin 1-1 part to ensure the connection effect.

[0054] In some embodiments, Figure 7 and Figure 8 As shown, on the abutting surface between the conductive block 3-1 and the conductive ink block 6-2, the distance between the edge of the conductive block 3-1 and the edge of the conductive ink block 6-2 is 8μm to 10μm; and / or, on the abutting surface between the pin 1-1 and the conductive ink block 6-2, the distance between the edge of the pin 1-1 and the edge of the conductive ink block 6-2 is 8μm to 10μm.

[0055] like Figure 7As shown, when bonding the conductive ink material structure 6, first remove the base film 8, and then stick it on the conductive layer 3. On the contact surface between the conductive block 3-1 and the conductive ink block 6-2, d1 in the figure is the distance between the edge of the conductive block 3-1 and the edge of the conductive ink block 6-2. The distance is, for example, 8 μm, 9 μm or 10 μm, etc., to avoid the distance being too small and causing misalignment in pasting, and to avoid the distance being too large and causing poor connection effect; as shown in FIG. Figure 8 As shown, after bonding the conductive ink material structure 6, remove the top film 7, and then fit the circuit board 1. On the contact surface between the pin 1-1 and the conductive ink block 6-2, d2 in the figure is the distance between the edge of the pin 1-1 and the edge of the conductive ink block 6-2. The distance is, for example, 8μm, 9μm or 10μm, etc. Similarly, avoid too small a distance, which will cause misalignment in pasting, and avoid too large a distance, which will cause poor connection effect.

[0056] In some embodiments, Fig. 9 As shown, the cross-sectional width of the conductive ink block 6 - 2 close to the conductive block 3 - 1 is greater than the cross-sectional width of the conductive ink block 6 - 2 close to the pin 1 - 1 .

[0057] like Fig. 9 As shown, the bottom cross-sectional width of the conductive ink block 6-2 is greater than the top cross-sectional width, so that the bottom of the conductive ink block 6-2 can be more stable when it is first bonded to the conductive block 3-1, and it is also convenient to subsequently remove the top film 7 and bond it to the pin 1-1. The conductive ink material structure 6 is initially bonded and pre-cured at 40°C, and then a 470nm light source is used to illuminate the binding position for 4s to 8s for complete curing. The fully cured conductive ink material structure 6 has stimulated its bonding force, ensuring the reliability of the binding.

[0058] In some embodiments, Figure 3 As shown, a barrier layer 10 is disposed between the first substrate 2 and the second substrate 4 , and the barrier layer partially covers the conductive layer 3 to further avoid crosstalk.

[0059] In some embodiments, Figure 3 As shown, the display panel also includes: an encapsulation layer, which is arranged at the outermost layer of the display panel, and is used to block external dust and water vapor, etc., to prevent external dust and water vapor from affecting the internal film layer; an OLED device layer, which is arranged on the side of the driving circuit layer 5 away from the second substrate 4, and includes multiple OLED display devices, and the OLED display device includes an anode layer, a cathode layer, a light-emitting layer, an electron transport layer, a hole transport layer and a hole injection layer, wherein the anode layer is electrically connected to the drain of the driving circuit layer 5; the material of the cathode layer adopts a low work function material, which can improve the efficiency of electron injection; secondly, it can reduce the Joule heat generated when the OLED is working, thereby improving the life of the device.

[0060] The light-emitting layer is used for emitting light. The light-emitting layer may include a host material and a guest material doped in the host material. The doping ratio of the guest material in the light-emitting layer is 1% to 20%. Within the doping ratio range, on the one hand, the host material of the light-emitting layer can effectively transfer the exciton energy to the guest material of the light-emitting layer to excite the guest material of the light-emitting layer to emit light. On the other hand, the host material of the light-emitting layer "dilutes" the guest material of the light-emitting layer, effectively improving the mutual collision between the molecules of the guest material of the light-emitting layer, and the fluorescence quenching caused by the mutual collision between the energy, thereby improving the luminous efficiency and the life of the device. In an exemplary embodiment, the doping ratio refers to the ratio of the mass of the guest material to the mass of the light-emitting layer, that is, the mass percentage. In an exemplary embodiment, the host material and the guest material can be co-evaporated by a multi-source evaporation process, so that the host material and the guest material are uniformly dispersed in the light-emitting layer. The doping ratio can be regulated by controlling the evaporation rate of the guest material during the evaporation process, or by controlling the evaporation rate ratio of the host material and the guest material.

[0061] The hole injection layer reduces the barrier for injecting holes from the anode so that the holes can be effectively injected from the anode into the OLED device. Inorganic oxides such as molybdenum oxide, titanium oxide, vanadium oxide, rhenium oxide, ruthenium oxide, chromium oxide, zirconium oxide, hafnium oxide, tantalum oxide, silver oxide, tungsten oxide or manganese oxide can be used, or p-type dopants of strong electron-withdrawing systems and dopants of hole transport materials can be used.

[0062] The electron transport layer and the hole transport layer allow the recombination of electrons and holes injected from the electrode to occur in the light-emitting layer. The hole transport layer can be made of materials with high hole mobility, such as aromatic amine compounds, and its substituent groups can be carbazole, methylfluorene, spirofluorene, dibenzothiophene or furan.

[0063] The electron transport layer can use aromatic heterocyclic compounds, such as imidazole derivatives such as benzimidazole derivatives, imidazopyridine derivatives, and benzimidazolephenanthridine derivatives; oxazine derivatives such as pyrimidine derivatives and triazine derivatives; quinoline derivatives, isoquinoline derivatives, phenanthroline derivatives and other compounds containing a nitrogen-containing six-membered ring structure (including compounds having phosphine oxide-based substituents on the heterocyclic ring), etc.

[0064] The driving circuit layer 5 includes a first gate insulating layer and a second gate insulating layer, and the material of the gate insulating layer may include silicon compounds and metal oxides. For example, the material of the gate insulating layer GI1 includes silicon oxynitride (SiON), silicon oxide (SiOx), silicon nitride (SiNx), silicon oxycarbide (SiOxCy), silicon carbide nitride (SiCxNy), aluminum oxide (AlOx), aluminum nitride (AlNx), tantalum oxide (TaOx), hafnium oxide (HfOx), zirconium oxide (ZrOx), titanium oxide (TiOx), etc. The driving circuit layer 5 includes an interlayer dielectric layer, and the material of the interlayer dielectric layer may include, for example, silicon compounds, metal oxides, etc.

[0065] The driving circuit layer 5 includes a first electrode layer, which may include the source and drain of each transistor in the display area, the source is electrically connected to the source connection portion, and the drain is electrically connected to the drain connection portion. The first electrode layer may include metal, alloy, metal nitride, conductive metal oxide, transparent conductive material, etc. For example, the first electrode layer may be a single layer or multiple layers composed of metal, such as Mo / Al / Mo or Ti / Al / Ti.

[0066] In addition, the display panel further includes a flat layer, which is made of an organic insulating material, for example, the organic insulating material includes resin materials such as polyimide, epoxy resin, acrylic, polyester, photoresist, polyacrylate, polyamide, siloxane, etc. For another example, the organic insulating material includes an elastic material, for example, urethane, thermoplastic polyurethane (TPU), etc.

[0067] The display panel further includes a pixel defining layer, and the material of the pixel defining layer may include organic insulating materials such as polyimide, polyphthalimide, polyphthalamide, acrylic resin, benzocyclobutene or phenolic resin. In addition, a spacer may be provided on the pixel defining layer, and the material of the spacer may be the same as that of the pixel defining layer.

[0068] The display panel also includes an encapsulation layer, which is arranged on the pixel definition layer and is used to encapsulate the light-emitting element to prevent water vapor and / or oxygen in the external environment from corroding the light-emitting element. The encapsulation layer, for example, includes a first inorganic encapsulation layer CVD1, a second inorganic encapsulation layer CVD2 and an organic encapsulation layer IJP, the second inorganic encapsulation layer CVD2 is located on the side of the first inorganic encapsulation layer CVD1 away from the substrate, and the organic encapsulation layer IJP is located between the first inorganic encapsulation layer CVD1 and the second inorganic encapsulation layer CVD2. Optionally, the first inorganic encapsulation layer CVD1 and the second inorganic encapsulation layer CVD2 extend to the peripheral area and cover the blocking block; the organic encapsulation layer IJP extends to the peripheral area and is located within the range surrounded by the blocking block. The first inorganic encapsulation layer CVD1 and the second inorganic encapsulation layer CVD2 can be made of inorganic materials with high density such as silicon oxynitride (SiON), silicon oxide (SiOx), and silicon nitride (SiNx). The organic encapsulation layer IJP can be made of a polymer material containing a desiccant, or a polymer material that can block water vapor. For example, a polymer resin is used to relieve stress of the first inorganic encapsulation layer CVD1 and the second inorganic encapsulation layer CVD2 , and a water-absorbing material such as a desiccant may be included to absorb water, oxygen and other substances that invade the interior.

[0069] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present application (including the claims) is limited to these examples. In line with the concept of the present application, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present application as described above, which are not provided in detail for the sake of simplicity.

[0070] In the embodiments of the present application, "film" and "layer" can be interchanged. For example, sometimes "conductive layer 3" can be replaced with "conductive film". Similarly, sometimes "insulating film" can be replaced with "insulating layer". The proportions of the drawings in the embodiments of the present application can be used as a reference in the actual process, but are not limited to this. For example: the width-to-length ratio of the channel, the thickness and spacing of each film layer can be adjusted according to actual needs. The number of pixels in the array substrate and the number of sub-pixels in each pixel are not limited to the numbers shown in the figures. The drawings described in the embodiments of the present application are only structural schematic diagrams. A method in the embodiments of the present application is not limited to the shapes or values ​​shown in the drawings.

[0071] The triangle, rectangle, trapezoid, pentagon or hexagon in the embodiment of the present application is not in the strict sense, and may be an approximate triangle, rectangle, trapezoid, pentagon or hexagon, etc. There may be some small deformations caused by tolerance, and there may be chamfers, arc edges and deformations.

[0072] In addition, when details are set forth to describe exemplary embodiments of the present application, it is obvious to those skilled in the art that the present application embodiments can be implemented without these details or with changes in these details. Therefore, these descriptions should be considered illustrative rather than restrictive.

[0073] In some embodiments of the present application, a method for manufacturing a display panel is provided, including forming a conductive layer 3 on one side of a first substrate 2, forming a second substrate 4 on a side of the conductive layer 3 away from the first substrate 2, forming a via 4-1 on the second substrate 4 by a patterning process, and forming a driving circuit layer 5 on a side of the second substrate 4 away from the conductive layer 3; forming an opening 2-1 on the first substrate 2 by a patterning process, and bonding a conductive ink material structure 6 in the opening 2-1, and forming a circuit board 1 on a side of the first substrate 2 away from the conductive layer 3; and crimping and binding the circuit board 1, the conductive ink material structure 6 and the conductive layer 3, with a binding temperature of 30°C to 50°C and a binding pressure of 0.5MPa to 1MPa.

[0074] Specifically, Figure 7 As shown, the conductive ink material structure 6 is stripped of the bottom film 8, and then attached to the conductive layer 3 in the opening 2-1, and then the top film 7 is removed, as shown in FIG. Figure 8 As shown, the circuit board 1 is attached and then crimped and bound. Fig. 9 As shown, under low temperature and low pressure, the insulating rubber block 6-1 fills the gap, the conductive ink block 6-2 connects the pin 1-1 and the conductive block 3-1, the binding temperature is, for example, 30°C, 40°C or 50°C, and the binding pressure is, for example, 0.5MPa, 0.7MPa or 1MPa. The conditions are mild, the connection is stable, and the film layers of the display panel will not be damaged.

[0075] In some embodiments, the crimping binding of the conductive ink material structure 6 is first pre-cured by low-temperature crimping at 40° C., and then completely cured by irradiation with a 470 nm light source for 4 to 8 seconds.

[0076] The conductive ink material structure 6 is first pre-cured. Under this condition, the insulating rubber block 6-1 stimulates initial viscosity, fills the gap and connects the circuit board 1 and the conductive layer 3. The conductive ink block 6-2 is pre-cured to connect the pin 1-1 and the conductive block 3-1; then photocuring is performed to achieve complete curing of the conductive ink material structure 6 to form a stable structure.

[0077] The "patterning process" mentioned in the embodiments of the present application includes processes such as coating photoresist, mask exposure, development, etching, and stripping photoresist for metal materials, inorganic materials, or transparent conductive materials, and includes processes such as coating organic materials, mask exposure, and development for organic materials. Deposition can be any one or more of sputtering, evaporation, and chemical vapor deposition, coating can be any one or more of spraying, spin coating, and inkjet printing, and etching can be any one or more of dry etching and wet etching, without limitation.

[0078] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present application (including the claims) is limited to these examples. In line with the concept of the present application, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present application as described above, which are not provided in detail for the sake of simplicity.

[0079] In addition, to simplify the description and discussion, and in order not to make the embodiment of the present application difficult to understand, the known power supply / ground connection with other components may or may not be shown in the provided drawings. In addition, the device can be shown in the form of a block diagram to avoid making the embodiment of the present application difficult to understand, and this also takes into account the following fact, that is, the details of the implementation method of these block diagram devices are highly dependent on the platform to be implemented in the embodiment of the present application (that is, these details should be completely within the scope of understanding of those skilled in the art). In the case of elaborating specific details to describe the exemplary embodiments of the present application, it is obvious to those skilled in the art that the embodiment of the present application can be implemented without these specific details or when these specific details are changed. Therefore, these descriptions should be considered to be illustrative rather than restrictive.

[0080] Although the present application has been described in conjunction with the specific embodiments of the present application, many replacements, modifications and variations of these embodiments will be apparent to those of ordinary skill in the art based on the foregoing description. The present application embodiments are intended to encompass all such replacements, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application embodiments should be included in the protection scope of the present application.

Claims

1. A display device, characterized in that: It includes a circuit board, a first substrate, a conductive layer, a second substrate and a driving circuit layer which are stacked in sequence, wherein the second substrate is provided with a via hole, and the driving circuit layer is electrically connected to one side of the conductive layer through the via hole; the first substrate is provided with an opening, and the circuit board is electrically connected to the other side of the conductive layer through the opening; a conductive ink material structure is provided in the opening, and the conductive ink material structure connects the circuit board and the conductive layer.

2. The display device according to claim 1, characterized in that The circuit board includes a chip-on-film, a flexible circuit board and / or a printed circuit board; the conductive ink material structure includes a plurality of insulating rubber blocks arranged at intervals, and a conductive ink block is provided between two adjacent insulating rubber blocks.

3. The display device according to claim 2, characterized in that: The conductive ink block is made of metal-based conductive ink, carbon-based conductive ink or polymer conductive ink, and the insulating rubber block is made of epoxy resin or acrylic resin.

4. The display device according to claim 2, characterized in that: The adhesion of the conductive ink material structure is 11N / cm 2 Up to 17N / cm 2 , the thickness of the conductive ink material structure is 3 μm to 10 μm.

5. The display device according to claim 2, characterized in that: The conductivity of the conductive ink block is (0.29-2)×10 3 S / cm, the interface resistance between the conductive ink block and the conductive layer is less than or equal to 0.3Ω, the interface resistance between the conductive ink block and the circuit board is less than or equal to 0.3Ω, and the material viscosity of the conductive ink block is (2.2-2.5)×10 6 Pa.s.

6. The display device according to claim 2, characterized in that: The conductive ink block and the insulating rubber block are arranged in a gap.

7. The display device according to claim 6, characterized in that: The distance between the conductive ink block and the insulating rubber block is 3 μm to 5 μm.

8. The display device according to claim 2, characterized in that: The conductive layer comprises a plurality of conductive blocks arranged at intervals, the conductive blocks correspond to the conductive ink blocks one by one and are arranged against each other, and the cross-sectional width of the conductive blocks is greater than the cross-sectional width of the conductive ink blocks; And / or, a plurality of spaced pins are provided on one side of the circuit board close to the conductive layer, the pins correspond to the conductive ink blocks one by one and are arranged against each other, and the cross-sectional width of the pins is greater than the cross-sectional width of the conductive ink blocks.

9. The display device according to claim 8, characterized in that: On the contact surface between the conductive block and the conductive ink block, the distance between the edge of the conductive block and the edge of the conductive ink block is 8 μm to 10 μm; And / or, on the contact surface between the pin and the conductive ink block, a distance between an edge of the pin and an edge of the conductive ink block is 8 μm to 10 μm.

10. The display device according to claim 8, characterized in that: The cross-sectional width of the conductive ink block on a side close to the conductive block is greater than the cross-sectional width of the side close to the pin.

11. A method for manufacturing a display panel, characterized in that: The method comprises forming a conductive layer on one side of a first substrate, forming a second substrate on a side of the conductive layer away from the first substrate, forming a via hole on the second substrate, and forming a driving circuit layer on a side of the second substrate away from the conductive layer; forming an opening on the first substrate, bonding a conductive ink material structure in the opening, and forming a circuit board on a side of the first substrate away from the conductive layer; The circuit board, the conductive ink material structure and the conductive layer are crimped and bound at a bonding temperature of 30° C. to 50° C. and a bonding pressure of 0.5 MPa to 1 MPa.

12. The method for manufacturing a display panel according to claim 11, characterized in that: The crimping binding of the conductive ink material structure is first pre-cured by low-temperature crimping at 40° C., and then completely cured by irradiating with a 470nm light source for 4s to 8s.

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