Substrate processing apparatus and particle removal method

Abstract

A substrate processing apparatus (100) is provided with a substrate processing unit (10), a pipe (32), a filter unit (140), and a pump (114). A substrate processing unit (10) processes a substrate (W). The piping (32) allows the processing liquid to flow to the substrate processing unit (10). The filter unit (140) is disposed in the pipe (32). The filter unit (140) has a filter (141) that captures particles in the processing liquid. The pump (114) pressurizes a liquid containing a processing liquid so that the liquid passes through the filter (141). The pump (114) pressurizes the processing liquid such that the pressure of the processing liquid relative to the filter (141) becomes a first pressure during substrate processing. The pump (114) pressurizes the liquid such that the pressure of the liquid with respect to the filter (141) becomes a second pressure higher than the first pressure during non-substrate processing.

Description

Technical Field

[0001] The invention relates to a substrate processing device and a particle removal method. Background Art

[0002] In the past, there is a known substrate processing device for processing substrates. The substrate processing device is suitable for use in manufacturing semiconductor substrates. The substrate processing device uses a processing liquid such as a chemical liquid to process the substrate. The processing liquid flows through a pipe equipped with a filter and a valve, etc. and processes the substrate. The filter captures particles contained in the processing liquid passing through the inside of the pipe. The filter that has been used for a predetermined time is replaced with a new filter. As such a substrate processing device, there is a known liquid processing device comprising: a tank for storing the processing liquid; and a circulation line that is pulled out from the tank and returned to the tank; and the processing liquid is supplied to the liquid processing unit via the circulation line (for example, refer to patent document 1). The liquid processing device comprises: a filter that removes particles contained in the processing liquid. The filter is arranged in the circulation line. When the filter is supplied with processing liquid for a long period of time, the filter will be clogged by particles. Therefore, in the liquid processing device of patent document 1, a cleaning fluid is circulated to the filter from the downstream side to the upstream side, thereby removing particles from the filter.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2015-204302. Summary of the invention

[0006] Problems to be solved by the invention

[0007] However, with the miniaturization of semiconductors in recent years, filters have an electrostatic capture function in addition to the physical capture function. Specifically, in addition to capturing particles larger than the pores of the filter, the filter also captures particles smaller than the pores with electrostatic effects. Therefore, as described in Patent Document 1, when a cleaning fluid is circulated through the filter from the downstream side to the upstream side, particles larger than the pores can be removed from the filter. On the other hand, particles captured by electrostatic effects are difficult to remove from the filter even if a cleaning fluid is circulated through the filter from the downstream side to the upstream side. Therefore, when the filter is clogged, the clogged filter needs to be replaced with a new filter.

[0008] However, since replacing the filter increases the environmental burden, it is desirable to suppress the replacement frequency of the filter from the viewpoint of reducing the environmental burden.

[0009] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a substrate processing apparatus and a particle removal method capable of suppressing the replacement frequency of a filter.

[0010] [Methods used to solve the problem]

[0011] A substrate processing device according to one embodiment of the present invention comprises a substrate processing unit, a processing liquid piping, a filter unit, and a pressurizing unit. The substrate processing unit processes a substrate. The processing liquid piping supplies processing liquid to flow to the substrate processing unit. The filter unit is arranged on the processing liquid piping. The filter unit comprises: a filter for capturing particles in the processing liquid. The pressurizing unit pressurizes a liquid containing the processing liquid so that the liquid passes through the filter. The pressurizing unit is capable of changing the pressure of the liquid relative to the filter. In a substrate processing in which the substrate is processed by the processing liquid, the pressurizing unit pressurizes the processing liquid in such a manner that the pressure of the processing liquid relative to the filter becomes a first pressure. In a non-substrate processing in which the substrate is not processed by the processing liquid, the pressurizing unit pressurizes the liquid in such a manner that the pressure of the liquid relative to the filter becomes a second pressure higher than the first pressure.

[0012] In one embodiment, the substrate processing apparatus further comprises: a heating unit that heats the liquid passing through the filter. In the substrate processing, the temperature of the processing liquid passing through the filter is a first temperature. In the non-substrate processing, the heating unit heats the liquid in such a manner that the temperature of the liquid passing through the filter becomes a second temperature higher than the first temperature.

[0013] In one embodiment, the substrate processing device further includes an upstream piping, a downstream piping, and a removal liquid supply unit. The upstream piping is connected to the treatment liquid piping at the upstream side of the filter. The downstream piping is connected to the treatment liquid piping at the downstream side of the filter. The removal liquid supply unit is connected to one of the upstream piping and the downstream piping. The removal liquid supply unit supplies a removal liquid for removing particles clogged in the filter to one of the upstream piping and the downstream piping. The liquid contains the removal liquid. The substrate processing device causes the removal liquid to pass from one of the upstream piping and the downstream piping through the filter through the other of the upstream piping and the downstream piping during the non-substrate processing.

[0014] In a certain embodiment, the substrate processing device further includes a first valve, a second valve, a third valve and a fourth valve. The first valve is arranged on the processing liquid piping at the upstream side of the filter. The second valve is arranged on the processing liquid piping at the downstream side of the filter. The third valve is arranged on the upstream side piping. The fourth valve is arranged on the downstream side piping. The substrate processing device closes the third valve and the fourth valve and opens the first valve and the second valve during the substrate processing, thereby allowing the processing liquid to pass from the upstream side of the processing liquid piping to the downstream side of the processing liquid piping via the filter. The substrate processing device closes the first valve and the second valve during the non-substrate processing and opens the third valve and the fourth valve, thereby allowing the removal liquid to pass from one of the upstream side piping and the downstream side piping via the filter through the other of the upstream side piping and the downstream side piping.

[0015] In one embodiment, the removal liquid is a liquid of a different type from the treatment liquid.

[0016] In one embodiment, the substrate processing apparatus allows the removal liquid to pass from the downstream side pipe through the filter and into the upstream side pipe during the non-substrate processing.

[0017] In one embodiment, the substrate processing apparatus further includes a downstream piping connected to the processing liquid piping at the downstream side of the filter. The substrate processing apparatus allows the liquid to pass through the downstream piping from the upstream side of the filter via the filter during the non-substrate processing.

[0018] In one embodiment, the filter unit further includes: an upstream chamber disposed on the upstream side of the filter; and a downstream chamber disposed on the downstream side of the filter. The downstream side pipe is connected to the treatment liquid pipe via the downstream chamber.

[0019] In one embodiment, the substrate processing device further includes a detector. The detector is disposed on the processing liquid piping. The detector detects the pressure or flow rate of the processing liquid passing through the filter. When the detection value of the detector is less than a threshold value, the pressurizing unit pressurizes the liquid in such a manner that the pressure of the liquid relative to the filter becomes the second pressure.

[0020] In one embodiment, the pressurizing unit periodically pressurizes the liquid so that the pressure of the liquid relative to the filter reaches the second pressure.

[0021] According to another embodiment of the present invention, a particle removal method includes: a substrate processing step, in which a processing liquid is caused to flow through a filter of a filter unit disposed in a processing liquid piping connected to a substrate processing unit and pass through the substrate processing unit, and the substrate is processed by the processing liquid; and a non-substrate processing step, in which the substrate is processed without the processing liquid; in the substrate processing step, the processing liquid is caused to flow and pass through the filter in such a manner that the pressure of the processing liquid relative to the filter becomes a first pressure; in the non-substrate processing step, the liquid is caused to flow and pass through the filter in such a manner that the pressure of the liquid relative to the filter becomes a second pressure higher than the first pressure.

[0022] In one embodiment, in the substrate processing step, the temperature of the processing liquid passing through the filter is a first temperature; in the non-substrate processing step, the liquid at a second temperature higher than the first temperature is allowed to flow through the filter.

[0023] In one embodiment, the liquid includes a removal liquid for removing particles clogged in the filter; in the non-substrate processing step, the removal liquid is passed from one of the upstream piping and the downstream piping through the filter through the other of the upstream piping and the downstream piping, the upstream piping is connected to the processing liquid piping at the upstream side of the filter, and the downstream piping is connected to the processing liquid piping at the downstream side of the filter.

[0024] In one embodiment, the removal liquid is a liquid of a different type from the treatment liquid.

[0025] In one embodiment, in the non-substrate processing step, the removal liquid is passed from the downstream side pipe through the filter to the upstream side pipe.

[0026] In one embodiment, in the non-substrate processing step, the liquid is passed from an upstream side of the filter through the filter and through a downstream pipe connected to the processing liquid pipe at a downstream side of the filter.

[0027] In one embodiment, the filter unit includes an upstream chamber disposed on the upstream side of the filter and a downstream chamber disposed on the downstream side of the filter; and the downstream side pipe is connected to the treatment liquid pipe via the downstream chamber.

[0028] In one embodiment, in the substrate processing step, when the pressure or flow rate of the processing liquid passing through the filter is less than a threshold value, the non-substrate processing step is performed.

[0029] In one embodiment, the non-substrate processing step is performed periodically.

[0030] Effects of the Invention

[0031] According to the present invention, it is possible to provide a substrate processing apparatus and a particle removal method capable of suppressing the replacement frequency of a filter. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic top view of the substrate processing apparatus according to the first embodiment.

[0033] Figure 2 It is a schematic diagram of a substrate processing unit in the substrate processing apparatus according to the first embodiment.

[0034] Figure 3 It is a schematic diagram for explaining the piping structure in the substrate processing apparatus according to the first embodiment.

[0035] Figure 4 It is a block diagram of a substrate processing apparatus according to a first embodiment.

[0036] Figure 5 It is a flowchart showing the particulate removal method of the filter according to the first embodiment.

[0037] Fig. 6A It is a schematic diagram for explaining the particle removal method according to the first embodiment, and is a diagram showing the flow of liquid in the vicinity of the filter unit by arrows.

[0038] Figure 6B It is a schematic diagram for explaining the particle removal method according to the first embodiment, and is a diagram showing the flow of liquid in the vicinity of the filter unit by arrows.

[0039] Figure 7 It is a schematic diagram for explaining the piping structure in the substrate processing apparatus according to the second embodiment.

[0040] Figure 8 It is a flowchart showing the particulate removal method of the filter according to the second embodiment.

[0041] Fig. 9 It is a schematic diagram for explaining the piping structure in the substrate processing apparatus according to the third embodiment.

[0042] Fig.10 It is a flowchart showing the particulate removal method of the filter according to the third embodiment.

[0043] Fig.11A It is a schematic diagram for explaining the particle removal method according to the third embodiment, and is a diagram showing the flow of liquid in the vicinity of the filter unit by arrows.

[0044] Fig. 11BIt is a schematic diagram for explaining the particle removal method according to the third embodiment, and is a diagram showing the flow of liquid in the vicinity of the filter unit by arrows.

[0045] Fig.12 It is a schematic diagram for explaining the piping structure in the substrate processing apparatus according to the first variation.

[0046] Fig.13 The flowchart shows the particle removal method of the filter according to the first variation.

[0047] Fig.14 It is a schematic diagram for explaining the piping structure in the substrate processing apparatus according to the fourth embodiment.

[0048] Fig.15 It is a flowchart showing a particulate removal method of a filter according to a fourth embodiment.

[0049] Fig.16A It is a schematic diagram for explaining the particle removal method according to the fourth embodiment, and is a diagram showing the flow of liquid in the vicinity of the filter unit by arrows.

[0050] Fig. 16B It is a schematic diagram for explaining the particle removal method according to the fourth embodiment, and is a diagram showing the flow of liquid in the vicinity of the filter unit by arrows.

[0051] Fig.17 It is a schematic diagram for explaining the piping structure in the substrate processing apparatus according to the second variation.

[0052] Fig.18 The flowchart shows the particulate removal method of the filter according to the second variation.

[0053] Fig.19 It is a schematic diagram for explaining the piping structure in the substrate processing apparatus according to the third variation.

[0054] Fig. 20 It is a schematic diagram for explaining the piping structure in the substrate processing apparatus according to the fourth variation.

[0055] Fig.21 It is a flowchart showing a particulate removal method of a filter according to a fifth embodiment.

[0056] Fig. 22 It is a schematic diagram showing a piping structure in a substrate processing apparatus according to a sixth embodiment. DETAILED DESCRIPTION

[0057] Hereinafter, embodiments of the substrate processing device and particle removal method of the present invention are described with reference to the accompanying drawings. In addition, the same reference numerals are attached to the same or equivalent parts in the figures and the description is not repeated. In addition, in order to facilitate the understanding of the present invention, the description may record the X-axis, Y-axis and Z-axis that are orthogonal to each other. In this embodiment, the X-axis and the Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction.

[0058] [First embodiment]

[0059] Reference Figures 1 to 5 , Fig. 6A as well as Figure 6B A substrate processing apparatus 100 according to a first embodiment of the present invention will be described. Figure 1 It is a schematic top view of the substrate processing apparatus 100 according to the first embodiment.

[0060] The substrate processing apparatus 100 processes the substrate W. The substrate processing apparatus 100 processes the substrate W by performing at least one of etching, surface processing, imparting characteristics, forming a processing film, removing at least a portion of a film, and cleaning.

[0061] The substrate W is used as a semiconductor substrate. The substrate W includes a semiconductor wafer. For example, the substrate W is substantially disk-shaped. Here, the substrate processing apparatus 100 processes the substrate W piece by piece.

[0062] like Figure 1 As shown, the substrate processing apparatus 100 includes a plurality of substrate processing units 10, a processing liquid tank 110, a processing liquid tank 120, a plurality of load ports LP, an indexer robot IR, a center robot CR, and a control device 101. The control device 101 controls the load port LP, the indexer robot IR, and the center robot CR. The control device 101 includes a control unit 102 and a storage unit 104.

[0063] The loading port LP stacks and accommodates a plurality of substrates W. The indexer robot IR transports the substrates W between the loading port LP and the central robot CR. The central robot CR transports the substrates W between the indexer robot IR and the substrate processing unit 10. The substrate processing unit 10 sprays a processing liquid onto the substrates W to process the substrates W. The processing liquid includes, for example, a chemical solution, a cleaning solution, and / or a water repellent. The processing liquid cabinet 110 accommodates the processing liquid. In addition, the processing liquid cabinet 110 may also accommodate gas.

[0064] Specifically, the plurality of substrate processing units 10 form a plurality of towers TW (in Figure 1The towers TW are arranged around the central robot CR in a top view. Each tower TW includes a plurality of substrate processing units 10 stacked up and down (in Figure 1 There are three substrate processing units 10 in the figure. The processing liquid tanks 120 correspond to the plurality of towers TW, respectively. The liquid in the processing liquid tank 110 is supplied to all the substrate processing units 10 contained in the tower TW corresponding to the processing liquid tank 120 via a certain processing liquid tank 120. In addition, the gas in the processing liquid tank 110 is supplied to all the substrate processing units 10 contained in the tower TW corresponding to the processing liquid tank 120 via any processing liquid tank 120.

[0065] In the substrate processing apparatus 100 , a boundary wall BW is disposed between an area where the central robot CR and the substrate processing unit 10 are installed and an area where the processing liquid tank 110 is installed. The processing liquid tank 110 partitions a part of the area outside the boundary wall BW in the substrate processing apparatus 100 .

[0066] Typically, the treatment liquid cabinet 110 has a modulation tank (drum tank) for modulating the treatment liquid. The treatment liquid cabinet 110 may have a modulation tank for one treatment liquid, or may have modulation tanks for a plurality of treatment liquids. In addition, the treatment liquid cabinet 110 may also have a pump, a nozzle, and / or a filter for circulating the treatment liquid.

[0067] Here, the processing liquid tank 110 includes a first processing liquid tank 110A and a second processing liquid tank 110B. The first processing liquid tank 110A and the second processing liquid tank 110B are arranged to face each other.

[0068] The control device 101 controls various operations of the substrate processing apparatus 100 .

[0069] The control device 101 includes a control unit 102 and a storage unit 104. The control unit 102 includes a processor. The control unit 102 includes, for example, a central processing unit (CPU). Alternatively, the control unit 102 may include a general-purpose computing unit.

[0070] The storage unit 104 stores data and computer programs. The data includes recipe data. The recipe data includes information indicating a plurality of recipes. The plurality of recipes respectively define the processing contents and processing order of the substrate W.

[0071] The storage unit 104 includes a main storage device and an auxiliary storage device. The main storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. The storage unit 104 may also include a removable media. The control unit 102 executes the computer program stored in the storage unit 104 and performs the substrate processing operation.

[0072] Next, refer to Figure 2 The substrate processing unit 10 in the substrate processing apparatus 100 according to the first embodiment will be described. Figure 2 Schematic diagram of the substrate processing unit 10 in the substrate processing apparatus 100 according to the first embodiment.

[0073] The substrate processing unit 10 includes a chamber 11 , a substrate holding unit 20 , and a processing liquid supply unit 30 .

[0074] The chamber 11 is substantially box-shaped with an internal space. The chamber 11 accommodates the substrate W. Here, the substrate processing apparatus 100 is a single-chip type for processing the substrate W piece by piece, and the substrate W is accommodated piece by piece in the chamber 11. The substrate W is accommodated in the chamber 11 and processed in the chamber 11. The chamber 11 accommodates at least a portion of each of the substrate holding portion 20 and the processing liquid supply portion 30.

[0075] The substrate holding part 20 holds the substrate W. The substrate holding part 20 holds the substrate W horizontally in a manner that the upper surface (front surface) Wa of the substrate W faces upward and the back surface (lower surface) Wb of the substrate W faces vertically downward. In addition, the substrate holding part 20 rotates the substrate W while holding the substrate W. For example, a stacked structure having a recess is provided on the upper surface Wa of the substrate W. The substrate holding part 20 rotates the substrate W while holding the substrate W.

[0076] For example, the substrate holding portion 20 may be a clamping type for clamping the end of the substrate W. Alternatively, the substrate holding portion 20 may have any mechanism for holding the substrate W from the back side Wb. For example, the substrate holding portion 20 may be a vacuum type. In this case, the substrate holding portion 20 adsorbs the central portion of the back side Wb of the substrate W, which is a non-device forming surface, onto the upper surface, thereby holding the substrate W horizontally. Alternatively, the substrate holding portion 20 may be a combination of a clamping type and a vacuum type for contacting a plurality of chuck pins to the peripheral end surface of the substrate W.

[0077] For example, the substrate holding unit 20 includes a spin base 21, a chuck member 22, a shaft 23, an electric motor 24, and a housing 25. The chuck member 22 is provided on the spin base 21. The chuck member 22 holds the substrate W. Typically, a plurality of chuck members 22 are provided on the spin base 21.

[0078] The shaft 23 is a hollow shaft and extends in the vertical direction along the rotation axis Ax. The spin base 21 is coupled to the upper end of the shaft 23 . The substrate W is placed on the spin base 21 .

[0079] The spin base 21 is in the shape of a disk and is used to horizontally support the substrate W. The shaft 23 extends downward from the center of the spin base 21. The electric motor 24 applies a rotational force to the shaft 23. The electric motor 24 rotates the shaft 23 in the rotation direction, thereby rotating the substrate W and the spin base 21 around the rotation axis Ax. The housing 25 surrounds the shaft 23 and the electric motor 24.

[0080] The processing liquid supply unit 30 supplies the processing liquid to the substrate W. Typically, the processing liquid supply unit 30 supplies the processing liquid to the upper surface Wa of the substrate W. At least a portion of the processing liquid supply unit 30 is accommodated in the chamber 11 .

[0081] The processing liquid supply unit 30 supplies the processing liquid to the upper surface Wa of the substrate W. The processing liquid may include a so-called chemical liquid. The chemical solution may also include, for example, dilute hydrofluoric acid (DHF), hydrofluoric acid (HF), hydrofluoric nitric acid (a mixture of hydrofluoric acid and nitric acid (HNO3)), buffered hydrofluoric acid (BHF), ammonium fluoride, HFEG (hydrofluorine ethylene glycol) (a mixture of hydrofluoric acid and ethylene glycol), phosphoric acid (H3PO4), sulfuric acid, acetic acid, nitric acid, hydrochloric acid, ammonia water, hydrogen peroxide water, organic acids (such as citric acid, oxalic acid), organic bases (such as TMAH (tetramethyl ammonium hydroxide)), sulfuric acid / hydrogen peroxide mixture (SPM; sulfuric acid / hydrogen peroxide mixture), ammonia-hydrogen peroxide mixture (SC1 (standard clean-1)), hydrochloric acid-hydrogen peroxide mixture (hydrochloric acid-hydrogen peroxide mixture) (SC2 (standardclean-2; second standard cleaning solution)), isopropyl alcohol (IPA; isopropyl alcohol), a surfactant, an anticorrosive agent, and a hydrophobic agent.

[0082] Alternatively, the treatment liquid may include a so-called cleaning liquid (rinse liquid). For example, the cleaning liquid may include any one of deionized water (DIW), carbonated water, electrolytic ionized water, ozone water, ammonia water, hydrochloric acid water with a diluted concentration (e.g., about 10 ppm to 100 ppm), and reduced water (hydrogen water).

[0083] The processing liquid supply unit 30 includes a pipe 32, a nozzle 34, and a valve 36. The pipe 32 is an example of the "processing liquid pipe" of the present invention. The nozzle 34 sprays the processing liquid onto the upper surface Wa of the substrate W. The nozzle 34 is connected to the pipe 32. The processing liquid is supplied to the pipe 32 from a supply source. The valve 36 opens and closes the flow path in the pipe 32. The nozzle 34 is preferably configured to be movable relative to the substrate W.

[0084] The valve 36 opens and closes the flow path in the pipe 32. The valve 36 adjusts the opening degree of the pipe 32, thereby adjusting the flow rate of the processing liquid supplied to the pipe 32. Specifically, the valve 36 includes: a valve body (not shown) having a valve seat disposed therein; a valve core that opens and closes the valve seat; and an actuator (not shown) that moves the valve core between an open position and a closed position.

[0085] The nozzle 34 is also movable. The nozzle 34 can be moved in the horizontal direction and / or the vertical direction by a moving mechanism controlled by the control unit 102. In addition, it should be noted that in order to avoid making the drawings too complicated, the moving mechanism is omitted in this specification.

[0086] The substrate processing unit 10 further includes a cup 80. The cup 80 recovers the processing liquid scattered from the substrate W. The cup 80 rises and falls. For example, the cup 80 rises vertically above to the side of the substrate W during the entire period in which the processing liquid supply unit 30 supplies the processing liquid to the substrate W. In this case, the cup 80 recovers the processing liquid scattered from the substrate W due to the rotation of the substrate W. In addition, when the period in which the processing liquid supply unit 30 supplies the processing liquid to the substrate W ends, the cup 80 descends from the side of the substrate W to the vertical below.

[0087] As described above, the control device 101 includes the control unit 102 and the storage unit 104. The control unit 102 controls the substrate holding unit 20, the processing liquid supply unit 30 and / or the cup 80. In one example, the control unit 102 controls the electric motor 24, the valve 36 and / or the cup 80.

[0088] The substrate processing apparatus 100 of this embodiment is suitable for use in manufacturing a semiconductor component provided with a semiconductor. Typically, in a semiconductor component, a conductive layer and an insulating layer are stacked on a substrate. The substrate processing apparatus 100 is suitable for use in cleaning and / or processing (e.g., etching, property change, etc.) the conductive layer and / or the insulating layer when manufacturing a semiconductor component.

[0089] In addition, Figure 2 In the substrate processing unit 10 shown, the processing liquid supply unit 30 can supply one type of processing liquid. However, the present embodiment is not limited to this. The processing liquid supply unit 30 can also supply multiple types of processing liquids. For example, the processing liquid supply unit 30 can also supply multiple types of processing liquids with different uses to the substrate W in sequence. Alternatively, the processing liquid supply unit 30 can also supply multiple types of processing liquids with different uses to the substrate W simultaneously.

[0090] Next, refer to Figures 1 to 3 The piping structure of the substrate processing apparatus 100 according to the first embodiment will be described. Figure 3Schematic diagram for explaining the piping structure in the substrate processing apparatus 100 according to the first embodiment. Figure 1 as well as Figure 2 As can be understood, it is preferred that the substrate processing apparatus 100 has a plurality of substrate processing units 10 and the substrate W can be processed by a plurality of processing liquids. However, in order to avoid overly complicated description, a method of supplying one type of processing liquid to one substrate processing unit 10 is described here.

[0091] like Figure 3 As shown, the substrate processing apparatus 100 includes a modulation tank 112, a pump 114, a valve 115, a filter unit 140, a detector 116, and a valve 117. In addition, the pump 114 is an example of the "pressurizing unit" of the present invention. The valve 115 is an example of the "first valve" of the present invention. The valve 117 is an example of the "second valve" of the present invention.

[0092] The modulation tank 112 stores a processing liquid. The processing liquid is supplied to the substrate processing unit 10 to process the substrate W. Typically, the processing liquid is a chemical solution. However, the processing liquid may also be a cleaning solution. The processing liquid is prepared in the modulation tank 112. Typically, the modulation tank 112 is disposed in the processing liquid cabinet 110.

[0093] The pipe 32 connects the modulation tank 112 and the substrate processing unit 10. The pump 114, valve 115, filter unit 140, detector 116, valve 117 and valve 36 are installed in the pipe 32. The pump 114, valve 115, filter unit 140, detector 116, valve 117 and valve 36 constitute the processing liquid supply unit 30. Figure 3 Although only one valve 36 is shown in FIG. 1 , the valve 36 is provided for each nozzle 34 . Therefore, a plurality of valves 36 are provided for one filter unit 140 .

[0094] The processing liquid tank 110 has a housing 111. Typically, a preparation tank 112, a pump 114, a valve 115, a filter unit 140, a detector 116, and a valve 117 are accommodated in the housing 111.

[0095] The processing liquid tank 120 has a frame 121. Typically, the valve 36 is accommodated in the frame 121.

[0096] The pipe 32 extends from the processing liquid tank 110 through the processing liquid tank 120 to the substrate processing unit 10. After being conditioned in the conditioning tank 112, the processing liquid flows from the conditioning tank 112 through the pipe 32 to the substrate processing unit 10. The pipe 32 is formed of, for example, resin.

[0097] The pump 114 delivers the processing liquid of the modulation tank 112 toward the nozzle 34. In the first embodiment, the pump 114 is capable of changing the pressure applied to the processing liquid. That is, the pump 114 is capable of changing the output. In addition, in the first embodiment, as described later, the pump 114 pressurizes the processing liquid in a substrate processing in which the substrate W is processed by the processing liquid in such a manner that the pressure of the processing liquid relative to the filter 141 becomes a first pressure. In addition, in a non-substrate processing in which the substrate W is not processed by the processing liquid, the pump 114 pressurizes the processing liquid in such a manner that the pressure of the processing liquid relative to the filter 141 becomes a second pressure higher than the first pressure. In addition, as long as the second pressure is higher than the first pressure, it is not particularly limited, but the second pressure may also be, for example, the minimum value of the withstand pressure of a component or machine on which the pressure of the processing liquid acts. In other words, the second pressure may also be, for example, the same size as the withstand pressure of a component or machine with the lowest pressure resistance among the valve 115, the filter unit 140, the detector 116, and the valve 117. Specifically, for example, when the pressure resistance of the component or device with the lowest pressure resistance among the valve 115 , the filter unit 140 , the detector 116 , and the valve 117 is 0.5 MPa, the second pressure may be 0.5 MPa.

[0098] The valve 115 is connected to the pipe 32 at the upstream side of the filter 141 described later. The valve 115 opens and closes the flow path in the pipe 32. In detail, the valve 115 opens and closes the flow path of the upstream portion 32a of the pipe 32 that is upstream of the filter unit 140. The valve 115 adjusts the opening degree of the pipe 32, thereby adjusting the flow rate of the treatment liquid supplied to the pipe 32. Specifically, the valve 115 includes: a valve body (not shown) having a valve seat provided therein; a valve core that opens and closes the valve seat; and an actuator (not shown) that moves the valve core between an open position and a closed position.

[0099] The filter unit 140 is mounted on the pipe 32. The filter unit 140 can be installed and removed from the pipe 32. When the filter unit 140 is installed on the pipe 32, the treatment liquid flows through the filter unit 140. On the other hand, the filter unit 140 can be removed from the pipe 32. Therefore, when the filter unit 140 is deteriorated, the filter unit 140 is replaced.

[0100] The filter unit 140 is formed of, for example, resin. Typically, the filter unit 140 is formed by resin molding. In one example, the filter unit 140 is manufactured by cutting a resin formation with a metal processing tool. In addition, the filter unit 140 may also be formed of metal.

[0101] The filter unit 140 filters the treatment liquid flowing in the piping 32. The filter unit 140 includes a filter 141 and a filter housing 142. The filter 141 is disposed in the piping 32. The filter 141 has, for example, a porous shape. The filter 141 allows the liquid component of the treatment liquid to pass through. On the other hand, the filter 141 captures particles contained in the treatment liquid. Specifically, the filter 141 has a large number of holes. In a first embodiment, the filter 141 not only captures particles physically, but also captures particles electrostatically. That is, in addition to capturing particles larger than the holes, the filter 141 also captures particles smaller than the holes with electrostatic effects. In addition, the particles are, for example, solid. The particles are not particularly limited, and are, for example, made of resin or metal.

[0102] The filter housing 142 accommodates the filter 141. The filter housing 142 includes an upstream chamber 142a disposed on the upstream side of the filter 141 and a downstream chamber 142b disposed on the downstream side of the filter 141. In addition, a vent pipe for discharging gas to the outside and a drain pipe for discharging liquid to the outside may be connected to the upstream chamber 142a and the downstream chamber 142b.

[0103] The detector 116 detects the pressure or flow rate of the treatment liquid passing through the filter 141. That is, the detector 116 is, for example, a pressure gauge for detecting the pressure of the treatment liquid passing through the filter 141, or a flow meter for detecting the flow rate of the treatment liquid passing through the filter 141. In the first embodiment, the detector 116 is a flow meter. In addition, the detector 116 is preferably arranged on the downstream side of the filter 141, but may also be arranged on the upstream side of the filter 141.

[0104] The valve 117 is connected to the pipe 32 at the downstream side of the filter 141. The valve 117 opens and closes the flow path in the pipe 32. In detail, the valve 117 opens and closes the flow path of the downstream portion 32b of the pipe 32 which is further downstream than the filter unit 140. The valve 117 adjusts the opening degree of the pipe 32, thereby adjusting the flow rate of the treatment liquid supplied to the pipe 32. Specifically, the valve 117 includes: a valve body (not shown) having a valve seat provided therein; a valve core which opens and closes the valve seat; and an actuator (not shown) which moves the valve core between an open position and a closed position.

[0105] The substrate processing apparatus 100 includes a downstream pipe 161 and a valve 162 .

[0106] The downstream pipe 161 is connected to the pipe 32 at the downstream side of the filter 141. The downstream pipe 161 is connected to the downstream portion 32b of the pipe 32 at the downstream side of the filter 141. In the first embodiment, the downstream pipe 161 is directly connected to the pipe 32. In other words, the downstream pipe 161 is connected to the pipe 32 without passing through the filter unit 140.

[0107] The valve 162 is disposed in the downstream piping 161. The valve 162 adjusts the degree of opening of the flow path in the downstream piping 161, thereby adjusting the flow rate of the liquid passing through the downstream piping 161. Specifically, the valve 162 includes: a valve body (not shown) having a valve seat disposed therein; a valve core that opens and closes the valve seat; and an actuator (not shown) that moves the valve core between an open position and a closed position. In addition, the valve 162 is an example of the "fourth valve" of the present invention.

[0108] Next, refer to Figures 1 to 4 A substrate processing apparatus 100 according to a first embodiment will be described. Figure 4 1 is a block diagram of a substrate processing apparatus 100 according to the first embodiment.

[0109] like Figure 4 As shown, the control device 101 controls various actions of the substrate processing apparatus 100. The control device 101 controls the indexer robot IR, the center robot CR, the substrate holding portion 20, the processing liquid supply portion 30, and the valve 162. Specifically, the control device 101 sends a control signal to the indexer robot IR, the center robot CR, the substrate holding portion 20, the processing liquid supply portion 30, and the valve 162, thereby controlling the indexer robot IR, the center robot CR, the substrate holding portion 20, the processing liquid supply portion 30, and the valve 162.

[0110] More specifically, the control unit 102 controls the indexer robot IR to receive and transfer the substrate W via the indexer robot IR.

[0111] The control unit 102 controls the central robot CR to receive and transfer the substrate W through the central robot CR. For example, the central robot CR receives an unprocessed substrate W and moves the substrate W into any one of the plurality of substrate processing units 10. In addition, the central robot CR receives a processed substrate W from the substrate processing unit 10 and moves the substrate W out.

[0112] The control unit 102 controls the substrate holding unit 20 to control the start of rotation of the substrate W, change of the rotation speed, and stop of rotation of the substrate W. For example, the control unit 102 controls the substrate holding unit 20 to change the rotation speed of the substrate holding unit 20. Specifically, the control unit 102 changes the rotation speed of the electric motor 24 of the substrate holding unit 20, thereby changing the rotation speed of the substrate W.

[0113] The control unit 102 controls the valve 115, the valve 117, and the valve 36, so that the states of the valves 115, the valve 117, and the valve 36 can be switched between an open state and a closed state. Specifically, the control unit 102 sets the valve 115 to an open state or a closed state, thereby allowing the liquid in the upstream portion 32a of the pipe 32 to pass through or not to pass through the liquid in the upstream portion 32a of the pipe 32. In addition, the control unit 102 sets the valve 117 to an open state or a closed state, thereby allowing the liquid in the downstream portion 32b of the pipe 32 to pass through or not to pass through the liquid in the downstream portion 32b of the pipe 32. In addition, the control unit 102 sets the valve 36 to an open state or a closed state, thereby allowing the liquid that has passed through the valve 117 to be supplied to the nozzle 34 or not to supply the liquid that has passed through the valve 117 to the nozzle 34.

[0114] The control unit 102 controls the pump 114 to send the liquid in the preparation tank 112 to the downstream side. Specifically, the control unit 102 drives the pump 114 to send the liquid in the preparation tank 112 toward the nozzle 34. The measurement result of the detector 116 is sent to the control unit 102.

[0115] The control unit 102 controls the valve 162 so as to switch the state of the valve 162 to an open state and a closed state. Specifically, the control unit 102 sets the valve 162 to an open state or a closed state, thereby allowing or preventing the liquid in the downstream pipe 161 from passing through.

[0116] As described above, the storage unit 104 may store a plurality of program data. The plurality of programs may define the processing contents and processing sequence for removing particles clogged in the filter unit 140. The program for removing particles may be included in the program for defining the operation contents and operation sequence of the treatment liquid tank 110, for example.

[0117] The substrate processing apparatus 100 of the first embodiment is suitable for use in forming a semiconductor component. For example, the substrate processing apparatus 100 is suitable for use in processing a substrate W used as a semiconductor component of a stacked structure. The semiconductor component is a so-called 3D (three-dimensional) structured memory (storage device). As an example, the substrate W is suitable for use as a NAND (NOT-AND) type flash memory.

[0118] Next, refer to Figure 5 , Fig. 6A as well as Figure 6B A method of removing particles from the filter 141 of the substrate processing apparatus 100 according to the first embodiment will be described. Figure 5 1 is a flowchart showing a method for removing particles from the filter 141 according to the first embodiment. Fig. 6A as well as Figure 6B 1 is a schematic diagram for explaining the particle removal method of the first embodiment, and is a diagram showing the flow of liquid in the vicinity of the filter unit 140 by arrows. The particle removal method of the filter 141 of the first embodiment includes steps S101 to S104. Steps S101 to S104 are executed by the control unit 102. In addition, step S101 is an example of the "substrate processing step" of the present invention. In addition, step S103 is an example of the "non-substrate processing step" of the present invention.

[0119] like Figure 5 As shown, in step S101, the control unit 102 determines whether the flow rate of the treatment liquid passing through the pipe 32 is less than a threshold value. The threshold value is a predetermined value. Specifically, in step S101, valves 115 and 117 are opened, and valve 162 is closed (see Fig. 6A ). The valve 36 is switched between an open state and a closed state in accordance with the timing of ejecting the processing liquid to the substrate W. That is, in step S101, the processing liquid is caused to flow and pass through the filter 141 disposed in the piping 32. In addition, in step S101, the processing liquid is caused to flow through the piping 32 and supplied to the substrate processing unit 10, so that the substrate W can be processed by the processing liquid. In addition, in step S101 (substrate processing step), the pressure of the processing liquid relative to the filter 141 is the first pressure.

[0120] In step S101, the control unit 102 determines whether the measured value of the detector 116 is less than a threshold value when the treatment liquid can pass through the pipe 32 (for example, the valve 36 is in an open state). In addition, for example, when the filter 141 is in a new state, the measured value of the detector 116 is above the threshold value. On the other hand, when particles clog the filter 141, the flow rate of the treatment liquid passing through the filter 141 decreases, so the measured value of the detector 116 decreases. Moreover, when the amount of particles clogged in the filter 141 becomes more than a predetermined amount, the measured value of the detector 116 becomes less than the threshold value. In addition, the measured value is an example of the "detection value" of the present invention.

[0121] In step S101, when the control unit 102 determines that the flow rate of the processing liquid passing through the pipe 32 is greater than the threshold value, the process repeats step S101. In other words, when the measured value of the detector 116 is greater than the threshold value, the process repeats step S101.

[0122] On the other hand, in step S101, when the control unit 102 determines that the flow rate of the processing liquid passing through the pipe 32 is less than the threshold value, the process moves to step S102. In other words, when the measured value of the detector 116 is less than the threshold value, the process moves to step S102.

[0123] Next, in step S102, the control unit 102 stops supplying the processing liquid. Specifically, the control unit 102 switches the valve 117 from an open state to a closed state.

[0124] Next, in step S103, the control unit 102 pressurizes the liquid so that the liquid flows and passes through the filter 141. In the first embodiment, the control unit 102 pressurizes the processing liquid so that the processing liquid flows and passes through the filter 141. Specifically, the control unit 102 switches the valve 162 from a closed state to an open state. In addition, the control unit 102 sets the output of the pump 114 to be higher than that of step S101 (substrate processing step). Thus, as Figure 6B As shown, the processing liquid in the modulation tank 112 passes through the piping 32 and the filter unit 140 and is then discharged through the downstream piping 161. At this time, the pressure (second pressure) of the processing liquid relative to the filter 141 is higher than the pressure (first pressure) of the processing liquid relative to the filter 141 in step S101. Therefore, the processing liquid passes through the filter 141, thereby removing the particles blocked in the filter 141. That is, the performance of the liquid flow and passage of the filter 141 is restored. In addition, in step S103 (non-substrate processing process), the pressure of the processing liquid relative to the filter 141 is the second pressure. Then, the control unit 102 returns the valve 162 from the open state to the closed state after a predetermined time. In addition, the control unit 102 sets the output of the pump 114 to the same size as the output of the pump 114 in step S101.

[0125] Next, in step S104, the control unit 102 starts supplying the treatment liquid again. Specifically, the control unit 102 switches the valve 117 from the closed state to the open state. Fig. 6A As shown, the treatment liquid in the preparation tank 112 passes through the filter unit 140 and the valve 117.

[0126] As described above, the particulate removal by the filter 141 of the first embodiment is completed.

[0127] Above, refer to Figures 1 to 5 , Fig. 6A as well as Figure 6B The first embodiment of the present invention is described. As described above, in the first embodiment, the pump 114 pressurizes the processing liquid in a non-substrate process (e.g., step S103) in which the substrate W is not processed, so that the pressure of the processing liquid relative to the filter 141 becomes a second pressure higher than the first pressure in the substrate process (e.g., step S101). Therefore, particles clogging the filter 141 can be removed. That is, the performance of the filter 141 in which the liquid flows and passes can be restored. Therefore, the replacement frequency of the filter 141 can be suppressed. As a result, the environmental burden can be reduced.

[0128] In addition, the reason why the pressure of the treatment liquid relative to the filter 141 is set to the second pressure and the performance of the liquid flowing and passing through the filter 141 is restored is considered to be due to the following reason. That is, it is considered to be due to the following reason: the pressure of the treatment liquid is set to the second pressure higher than the first pressure, so that a force greater than the force of the filter 141 electrostatically capturing the particles acts on the particles, so that the particles pass through the holes of the filter 141.

[0129] Furthermore, by suppressing the replacement frequency of the filter 141, the time required for replacement and recovery of the filter 141 (also referred to as down time) can be reduced.

[0130] In addition, as described above, in non-substrate processing, the processing liquid is passed from the upstream side of the filter 141 through the filter 141 through the downstream side piping 161. Therefore, the particles clogged in the filter 141 can be removed using the processing liquid. Therefore, unlike the case of using a removal liquid as described later, it is not necessary to provide a piping for supplying the removal liquid. In addition, unlike the case of using a removal liquid, the processing liquid and the removal liquid are not mixed or contacted.

[0131] In addition, as described above, the flow rate of the treatment liquid passing through the filter 141 is measured. Therefore, the blockage of particles that are difficult to directly observe can be easily confirmed using the detector 116. Moreover, in the case where the flow rate of the treatment liquid is less than the threshold value, the removal liquid can be passed from the modulation tank 112 to the downstream side pipe 161 via the filter 141. Therefore, before a large number of particles are blocked, particles can be removed. Therefore, when removing particles, it is possible to suppress the time for the treatment liquid to flow and pass through the filter 141 from becoming longer.

[0132] [Second embodiment]

[0133] Next, refer to Figure 7 as well as Figure 8 A substrate processing apparatus 100 according to a second embodiment of the present invention will be described. Figure 7 Schematic diagram for explaining the piping structure in the substrate processing apparatus 100 according to the second embodiment. In the second embodiment, an example in which the heater 113 is provided in the upstream portion 32a of the piping 32 is explained.

[0134] like Figure 7 As shown in FIG. 1 , the substrate processing apparatus 100 includes a heater 113. The heater 113 is an example of a "heating unit" in the present invention.

[0135] The heater 113 heats the liquid passing through the filter 141. In the second embodiment, the heater 113 heats the treatment liquid passing through the filter 141. In addition, in the second embodiment, the heater 113 is arranged at the upstream portion 32a of the pipe 32. In addition, in the second embodiment, although the heater 113 is arranged on the upstream side of the pump 114, the arrangement position of the heater 113 is not particularly limited as long as it is arranged on the upstream side of the filter 141. That is, for example, the heater 113 may be arranged between the pump 114 and the valve 115, or between the valve 115 and the filter 141.

[0136] Furthermore, in the second embodiment, the heater 113 heats the processing liquid in a substrate processing in such a manner that the temperature of the processing liquid passing through the filter 141 becomes a first temperature. Furthermore, in the second embodiment, in a case where the processing liquid from the modulation tank 112 is at the first temperature, the heater 113 may not heat the processing liquid. Furthermore, in a non-substrate processing, the heater 113 heats the processing liquid in such a manner that the temperature of the processing liquid passing through the filter 141 becomes a second temperature higher than the first temperature. The second temperature is a temperature higher than the first temperature by, for example, 5° C. or more and 15° C. or less. The heater 113 is controlled by the control unit 102. Furthermore, the first temperature and the second temperature may each have a predetermined temperature range.

[0137] The other configurations of the second embodiment are the same as those of the first embodiment.

[0138] Next, refer to Fig. 6A , Figure 6B as well as Figure 8 A method of removing particles from the filter 141 of the substrate processing apparatus 100 according to the second embodiment will be described. Figure 8 1 is a flowchart showing a particle removal method of the filter 141 according to the second embodiment. The particle removal method of the filter 141 according to the second embodiment includes steps S101, S102, S1021, S103, S1031, and S104.

[0139] like Figure 8 As shown, in step S101, the control unit 102 determines whether the flow rate of the processing liquid passing through the pipe 32 is less than a threshold value. In addition, in step S101 (substrate processing step) belonging to substrate processing, the heater 113 heats the processing liquid so that the temperature of the processing liquid passing through the filter 141 becomes a first temperature. In addition, in step S101, the pressure of the processing liquid relative to the filter 141 is the first pressure.

[0140] In step S101 , when the control unit 102 determines that the flow rate of the processing liquid passing through the pipe 32 is equal to or greater than the threshold value, the process repeats step S101 .

[0141] On the other hand, when the control unit 102 determines in step S101 that the flow rate of the processing liquid passing through the pipe 32 is smaller than the threshold value, the process proceeds to step S102 .

[0142] Next, in step S102 , the control unit 102 stops supplying the processing liquid.

[0143] Next, in step S1021, the control unit 102 controls the heater 113 to heat the liquid. In the second embodiment, the control unit 102 controls the heater 113 to heat the processing liquid. Specifically, the control unit 102 sets the output of the heater 113 to be higher than that in step S101 (substrate processing). As a result, the temperature of the processing liquid becomes the second temperature or a temperature higher than the second temperature.

[0144] Next, in step S103, the control unit 102 pressurizes the liquid so that the liquid flows and passes through the filter 141. In the second embodiment, the control unit 102 pressurizes the treatment liquid so that the treatment liquid flows and passes through the filter 141. Thus, the treatment liquid in the modulation tank 112 passes through the filter unit 140 while being heated by the heater 113 and pressurized by the pump 114, and then is discharged through the downstream side piping 161. At this time, the temperature of the treatment liquid passing through the filter 141 is higher than the temperature of the treatment liquid passing through the filter 141 in step S101. Therefore, the temperature of the filter 141 becomes higher, causing the size of the pores to become larger, and it becomes easier for particles to pass through the pores. In addition, the temperature of the particles becomes higher, causing the particles to be easily deformed, and it becomes easier for the particles to pass through the pores. Therefore, the treatment liquid passes through the filter 141, thereby removing the particles that are blocked in the filter 141.

[0145] Next, in step S1031, the control unit 102 returns the output of the heater 113 to the output in step S101. That is, the control unit 102 sets the output of the heater 113 to the same level as the output of the heater 113 in step S101.

[0146] Next, in step S104 , the control unit 102 starts supplying the processing liquid again.

[0147] As described above, the particulate removal by the filter 141 of the second embodiment is completed.

[0148] As described above, in the second embodiment, the heater 113 heats the processing liquid in a manner that the temperature of the processing liquid passing through the filter 141 becomes a second temperature higher than the first temperature during non-substrate processing (step S103). Therefore, it becomes easier to remove particles clogged in the filter 141. Thus, the particles clogged in the filter 141 can be easily removed. That is, the performance of the filter 141 in which the liquid flows and passes can be easily restored. Thus, the replacement frequency of the filter 141 can be suppressed. As a result, the environmental burden can be reduced.

[0149] The other particle removal methods and other effects of the second embodiment are the same as those of the first embodiment.

[0150] [Third Embodiment]

[0151] Next, refer to Fig. 9 , Fig.10 , Fig.11A as well as Fig. 11B A substrate processing apparatus 100 according to a third embodiment of the present invention will be described. Fig. 9 Schematic diagram for explaining the piping structure of the substrate processing apparatus 100 according to the third embodiment. The third embodiment describes an example different from the first and second embodiments, that is, an example in which the substrate processing apparatus 100 further includes an upstream piping 151 and a removal liquid supply unit 165 .

[0152] like Fig. 9 As shown in FIG. 1 , the substrate processing apparatus 100 further includes an upstream pipe 151 and a removal liquid supply unit 165. The pump 114 and the removal liquid supply unit 165 are examples of a "pressurizing unit" in the present invention.

[0153] The upstream pipe 151 is connected to the pipe 32 at the upstream side of the filter 141. The upstream pipe 151 is connected to the upstream portion 32a of the pipe 32 at the upstream side of the filter 141. In the third embodiment, the upstream pipe 151 is directly connected to the pipe 32. In other words, the upstream pipe 151 is connected to the pipe 32 without passing through the filter unit 140.

[0154] The substrate processing apparatus 100 is provided with a valve 152. The valve 152 is arranged in the upstream piping 151. The valve 152 adjusts the degree of opening of the flow path in the upstream piping 151, thereby adjusting the flow rate of the liquid passing through the upstream piping 151. Specifically, the valve 152 includes: a valve body (not shown) having a valve seat disposed therein; a valve core that opens and closes the valve seat; and an actuator (not shown) that moves the valve core between an open position and a closed position. In addition, the valve 152 is an example of the "third valve" of the present invention.

[0155] The removal liquid supply unit 165 is connected to one of the upstream piping 151 and the downstream piping 161. The removal liquid supply unit 165 supplies the removal liquid for removing particles clogged in the filter 141 to one of the upstream piping 151 and the downstream piping 161. In the third embodiment, the removal liquid supply unit 165 is connected to the upstream piping 151 and supplies the removal liquid to the upstream piping 151. The removal liquid supply unit 165 includes, for example, a pump for pressurizing and delivering the removal liquid. The removal liquid supply unit 165 may also include a drum for storing the removal liquid. The removal liquid is not particularly limited as long as it is a liquid for removing particles, and may include, for example, deionized water (DIW), a liquid containing hydrochloric acid, IPA (isopropyl alcohol) or PGMEA (propyleneglycol monomethyl ether acetate). In the third embodiment, the removal liquid includes DIW.

[0156] In addition, the removal liquid is preferably a liquid of a different type from the treatment liquid. For example, in the case of using DIW as the removal liquid, the amount of treatment liquid used when removing particles blocked in the filter 141 can be reduced. Therefore, the environmental burden can be further reduced. In addition, the removal liquid can also be, for example, a liquid of a type used to dissolve particles that are not dissolved by the treatment liquid. In this case, the removal liquid is made to flow and pass through the filter 141, thereby dissolving the particles, and thus the particles blocked in the filter 141 can be removed efficiently.

[0157] The other configurations of the third embodiment are the same as those of the first embodiment.

[0158] Next, refer to Fig.10 , Fig.11A as well as Fig. 11B A method of removing particles from the filter 141 of the substrate processing apparatus 100 according to the third embodiment will be described. Fig.10 1 is a flowchart showing a method for removing particles by the filter 141 according to the third embodiment. Fig.11A as well as Fig. 11B 1 is a schematic diagram for explaining the particle removal method of the third embodiment, and is a diagram showing the flow of liquid in the vicinity of the filter unit 140 by arrows. The particle removal method of the filter 141 of the third embodiment includes steps S101, S102, S103a, and S104. Step S103a of the third embodiment corresponds to step S103 of the first embodiment. In addition, step S103a is an example of the "non-substrate processing step" of the present invention.

[0159] like Fig.10As shown, in step S101, the control unit 102 determines whether the flow rate of the processing liquid passing through the pipe 32 is less than a threshold value. In addition, in step S101, the valve 115 and the valve 117 are opened, and the valve 152 and the valve 162 are closed (refer to Fig.11A ).

[0160] In step S101 , when the control unit 102 determines that the flow rate of the processing liquid passing through the pipe 32 is equal to or greater than the threshold value, the process repeats step S101 .

[0161] On the other hand, when the control unit 102 determines in step S101 that the flow rate of the processing liquid passing through the pipe 32 is smaller than the threshold value, the process proceeds to step S102 .

[0162] Next, in step S102 , the control unit 102 stops supplying the processing liquid.

[0163] Next, in step S103a, the control unit 102 pressurizes the removal liquid so that the removal liquid flows and passes through the filter 141. Specifically, the control unit 102 switches the valve 152 and the valve 162 from the closed state to the open state. Fig. 11B As shown, the removal liquid of the removal liquid supply unit 165 passes through the upstream pipe 151 and the filter unit 140 and is then discharged through the downstream pipe 161. At this time, the removal liquid supply unit 165 pressurizes the removal liquid in such a manner that the pressure of the removal liquid relative to the filter 141 becomes higher than the pressure of the treatment liquid relative to the filter 141 in step S101. Therefore, the removal liquid passes through the filter 141, thereby removing the particles clogged in the filter 141. Next, the control unit 102 returns the valve 152 and the valve 162 from the open state to the closed state after a predetermined time has passed.

[0164] Next, in step S104, the control unit 102 starts supplying the treatment liquid again. Specifically, the control unit 102 switches the valve 115 and the valve 117 from the closed state to the open state. Fig.11A As shown, the treatment liquid in the preparation tank 112 passes through the filter unit 140 and the valve 117.

[0165] As described above, the particulate removal by the filter 141 of the third embodiment is completed.

[0166] The other particle removal methods of the third embodiment are the same as those of the first embodiment.

[0167] As described above, in the third embodiment, the removal liquid is a liquid of a different type from the treatment liquid. That is, when removing particles clogged in the filter 141, the removal liquid different from the treatment liquid is made to flow through the filter 141. Therefore, the amount of treatment liquid used can be reduced. Therefore, the environmental burden can be further reduced.

[0168] In addition, as described above, in the third embodiment, there are provided: an upstream side piping 151 connected to the piping 32 at the upstream side of the filter 141; and a downstream side piping 161 connected to the piping 32 at the downstream side of the filter 141; thereby, a removal liquid of a different type from the treatment liquid can be easily allowed to flow and pass through the filter 141.

[0169] The other effects of the third embodiment are the same as those of the first embodiment.

[0170] [First Modification Example]

[0171] Next, refer to Fig.12 as well as Fig.13 A substrate processing apparatus 100 according to a first modified example of the present invention will be described. Fig.12 1 is a schematic diagram for explaining the piping structure of the substrate processing apparatus 100 according to the first variation. The first variation describes an example different from the third embodiment, that is, an example in which the heater 113 is provided in the upstream portion 32a of the piping 32 and the heater 153 is provided in the upstream side piping 151.

[0172] like Fig.12 As shown in FIG. 1 , the substrate processing apparatus 100 includes a heater 113 and a heater 153. The heater 113 and the heater 153 are examples of the "heating unit" of the present invention.

[0173] The configuration of the heater 113 is the same as that of the heater 113 of the second embodiment. However, in the first variation, the output of the heater 113 in the non-substrate processing may be the same as the output of the heater 113 in the substrate processing.

[0174] The heater 153 heats the removal liquid passing through the filter 141. In addition, the heater 153 is arranged on the upstream side of the pipe 151. In addition, in the first variation, although the heater 153 is arranged on the upstream side of the valve 152, the arrangement position of the heater 153 is not particularly limited as long as it is arranged on the upstream side of the filter 141. That is, the heater 153 may also be arranged on the downstream side of the valve 152, for example.

[0175] In the first modification, the heater 153 heats the removing liquid during non-substrate processing so that the temperature of the removing liquid passing through the filter 141 becomes a second temperature higher than the first temperature. The heater 153 is controlled by the control unit 102 .

[0176] The other configurations of the first modified example are the same as those of the third embodiment.

[0177] Next, refer to Fig.13A method of removing particles from the filter 141 of the substrate processing apparatus 100 according to the first modified example will be described. Fig.13 1 is a flowchart showing a particle removal method of the filter 141 according to a first variation. The particle removal method of the filter 141 according to the first variation includes steps S101, S102, S1022, S103a, S1032, and S104.

[0178] like Fig.13 As shown, step S101 and step S102 are the same as those in the second embodiment. After step S102, the process proceeds to step S1022.

[0179] Next, in step S1022, the control unit 102 drives (turns on) the heater 153 to heat the removal liquid. Specifically, the control unit 102 heats the removal liquid in a manner such that the temperature of the removal liquid passing through the filter 141 becomes a second temperature higher than the first temperature during non-substrate processing. For example, the output of the heater 153 may be higher than the output of the heater 113.

[0180] Next, in step S103a, the control unit 102 pressurizes the removal liquid so that the removal liquid flows and passes through the filter 141. Specifically, the control unit 102 switches the valve 152 and the valve 162 from the closed state to the open state. As a result, the removal liquid of the removal liquid supply unit 165 passes through the upstream pipe 151 and the filter unit 140 and is then discharged through the downstream pipe 161. At this time, the heater 153 heats the removal liquid in such a manner that the temperature of the removal liquid passing through the filter 141 becomes higher than the temperature of the treatment liquid passing through the filter 141 in step S101. Therefore, the removal liquid passes through the filter unit 140 while being heated by the heater 153 and pressurized by the removal liquid supply unit 165 and is then discharged through the downstream pipe 161. In addition, at this time, the temperature of the removal liquid passing through the filter 141 is higher than the temperature of the treatment liquid passing through the filter 141 in step S101. Therefore, the temperature of the filter 141 becomes higher, resulting in an increase in the size of the pores, and particles become easier to pass through the pores. In addition, the particles are easily deformed as the temperature of the particles increases, and the particles are easily passed through the holes. Therefore, the removal liquid passes through the filter 141, thereby removing the particles that are blocked in the filter 141. Next, the control unit 102 returns the valve 152 and the valve 162 from the open state to the closed state after a predetermined time has passed.

[0181] Next, in step S1032 , the control unit 102 stops driving (OFF) the heater 153 , thereby stopping heating the removing liquid.

[0182] Next, in step S104 , the control unit 102 starts supplying the processing liquid again.

[0183] As described above, the particulate removal by the filter 141 of the first modification is completed.

[0184] The other particle removal methods and other effects of the first variation are the same as those of the second embodiment and the third embodiment.

[0185] [Fourth Embodiment]

[0186] Next, refer to Fig.14 , Fig.15 , Fig.16A as well as Fig. 16B A substrate processing apparatus 100 according to a fourth embodiment of the present invention will be described. Fig.14 Schematic diagram for explaining the piping structure of the substrate processing apparatus 100 according to the fourth embodiment. The fourth embodiment describes an example different from the third embodiment, that is, an example in which the removal liquid flows from the downstream pipe 161 toward the upstream pipe 151.

[0187] like Fig.14 As shown, similarly to the third embodiment, the substrate processing apparatus 100 includes an upstream pipe 151 , a downstream pipe 161 , and a removal liquid supply unit 165 .

[0188] In the fourth embodiment, the removal liquid supply unit 165 is connected to the downstream pipe 161, and supplies the removal liquid to the downstream pipe 161. That is, in the fourth embodiment, the removal liquid flows from the downstream pipe 161 toward the upstream pipe 151.

[0189] The other configurations of the fourth embodiment are the same as those of the third embodiment.

[0190] Next, refer to Fig.15 , Fig.16A as well as Fig. 16B A particle removal method of the filter 141 of the substrate processing apparatus 100 according to the fourth embodiment will be described. Fig.15 1 is a flowchart showing a method for removing particles from the filter 141 according to the fourth embodiment. Fig.16A as well as Fig. 16B 1 is a schematic diagram for explaining the particle removal method of the fourth embodiment, and is a diagram in which arrows are used to indicate the flow of liquid in the vicinity of the filter unit 140. The particle removal method of the filter 141 of the fourth embodiment includes steps S101, S102, S103b, and S104. Step S103b of the fourth embodiment corresponds to step S103a of the third embodiment. In addition, step S103b is an example of the "non-substrate processing step" of the present invention.

[0191] like Fig.15As shown, step S101 and step S102 are the same as those of the third embodiment. In step S101, valves 115 and 117 are opened, and valves 152 and 162 are closed (see Fig.16A ). After step S102, the process moves to step S103b.

[0192] Next, in step S103b, the control unit 102 pressurizes the removal liquid so that the removal liquid flows and passes through the filter 141. Specifically, the control unit 102 switches the valve 152 and the valve 162 from the closed state to the open state. Fig. 16B As shown in FIG. 1 , the removal liquid of the removal liquid supply unit 165 passes through the downstream piping 161 and the filter unit 140 and is then discharged through the upstream piping 151. At this time, the removal liquid supply unit 165 pressurizes the removal liquid in such a manner that the pressure of the removal liquid relative to the filter 141 becomes higher than the pressure of the treatment liquid relative to the filter 141 in step S101. Therefore, the removal liquid passes through the filter 141, thereby removing particles clogged in the filter 141. Next, the control unit 102 returns the valve 152 and the valve 162 from the open state to the closed state after a predetermined time has passed.

[0193] Next, in step S104, the control unit 102 starts supplying the treatment liquid again. Specifically, the control unit 102 switches the valve 115 and the valve 117 from the closed state to the open state. Fig.16A As shown, the treatment liquid in the preparation tank 112 passes through the filter unit 140 and the valve 117.

[0194] As described above, the particulate removal by the filter 141 of the fourth embodiment is completed.

[0195] The rest of the particle removal method of the fourth embodiment is the same as that of the third embodiment.

[0196] As described above, in the fourth embodiment, during non-substrate processing, the removal liquid is passed from the downstream pipe 161 to the upstream pipe 151 via the filter 141. Therefore, particles larger than the pores of the filter 141 and physically captured can also be removed from the filter 141.

[0197] The other effects of the fourth embodiment are the same as those of the third embodiment.

[0198] [Second variation]

[0199] Next, refer to Fig.17 as well as Fig.18 A substrate processing apparatus 100 according to a second modified example of the present invention will be described. Fig.17Schematic diagram for explaining the piping structure of the substrate processing apparatus 100 of the second variation. The second variation describes an example different from the fourth embodiment, that is, an example in which a heater 113 is provided in the upstream portion 32a of the piping 32 and a heater 163 is provided in the downstream piping 161.

[0200] like Fig.17 As shown in FIG. 1 , the substrate processing apparatus 100 includes a heater 113 and a heater 163. The heater 113 and the heater 163 are examples of the "heating unit" of the present invention.

[0201] The configuration of the heater 113 is the same as that of the heater 113 of the second embodiment. However, in the second variation, the output of the heater 113 in the non-substrate processing may be the same as the output of the heater 113 in the substrate processing.

[0202] The heater 163 heats the removal liquid passing through the filter 141. In addition, the heater 163 is arranged on the downstream side of the pipe 161. In addition, in the second variation, although the heater 163 is arranged on the upstream side of the valve 162, the arrangement position of the heater 163 is not particularly limited as long as it is arranged on the upstream side of the filter 141. That is, the heater 163 may also be arranged on the downstream side of the valve 162, for example.

[0203] In the second modification, the heater 163 heats the removing liquid during non-substrate processing so that the temperature of the removing liquid passing through the filter 141 becomes a second temperature higher than the first temperature. The heater 163 is controlled by the control unit 102 .

[0204] The other configurations of the second variation are the same as those of the fourth embodiment.

[0205] Next, refer to Fig.18 A method of removing particles from the filter 141 of the substrate processing apparatus 100 according to a second modified example of the present invention will be described. Fig.18 1 is a flow chart for explaining a particle removal method of the filter 141 according to a second variation. The particle removal method of the filter 141 according to the second variation includes steps S101, S102, S1023, S103b, S1033, and S104.

[0206] like Fig.18 As shown, step S101 and step S102 are the same as those in the fourth embodiment. After step S102, the process proceeds to step S1022.

[0207] Next, in step S1023, the control unit 102 drives (turns on) the heater 163 to heat the removal liquid. Specifically, the control unit 102 heats the removal liquid in a manner such that the temperature of the removal liquid passing through the filter 141 becomes a second temperature higher than the first temperature during non-substrate processing. For example, the output of the heater 163 may be higher than the output of the heater 113.

[0208] Next, in step S103b, the control unit 102 pressurizes the removal liquid so that the removal liquid flows and passes through the filter 141. Specifically, the control unit 102 switches the valve 152 and the valve 162 from the closed state to the open state. As a result, the removal liquid of the removal liquid supply unit 165 passes through the downstream pipe 161 and the filter unit 140 and is then discharged through the upstream pipe 151. At this time, the heater 163 heats the removal liquid in such a manner that the temperature of the removal liquid passing through the filter 141 becomes higher than the temperature of the treatment liquid passing through the filter 141 in step S101. Therefore, the removal liquid passes through the filter unit 140 while being heated by the heater 163 and pressurized by the removal liquid supply unit 165 and is then discharged through the upstream pipe 151. In addition, at this time, the temperature of the removal liquid passing through the filter 141 is higher than the temperature of the treatment liquid passing through the filter 141 in step S101. Therefore, the temperature of the filter 141 becomes higher, resulting in an increase in the size of the pores, and particles become easier to pass through the pores. In addition, the particles are easily deformed as the temperature of the particles increases, and the particles are easily passed through the holes. Therefore, the removal liquid passes through the filter 141, thereby removing the particles that are blocked in the filter 141. Next, the control unit 102 returns the valve 152 and the valve 162 from the open state to the closed state after a predetermined time has passed.

[0209] Next, in step S1033 , the control unit 102 stops driving (OFF) the heater 163 , thereby stopping heating the removing liquid.

[0210] Next, in step S104 , the control unit 102 starts supplying the processing liquid again.

[0211] As described above, the particulate removal by the filter 141 of the second modification is completed.

[0212] The other particle removal methods and other effects of the second variation are the same as those of the second embodiment and the fourth embodiment.

[0213] [Third Modification]

[0214] Next, refer to Fig.19 A substrate processing apparatus 100 according to a third modified example of the present invention will be described. Fig.19Schematic diagram for explaining the piping structure in the substrate processing apparatus 100 of the third variation. In the third variation, for example, an example different from the first to fourth embodiments is described, that is, an example in which the downstream piping 161 is connected to the filter unit 140. Figure 3 Although part of the piping structure of the first embodiment shown is described, part of the piping structure other than the first embodiment may be changed.

[0215] like Fig.19 As shown, in the substrate processing apparatus 100 of the third variation, the downstream side piping 161 is connected to the downstream portion 32b of the piping 32 at the downstream side of the filter 141. Specifically, the downstream side piping 161 is connected to the piping 32 via the filter unit 140. The downstream side piping 161 is connected to the piping 32 via the downstream chamber 142b of the filter unit 140.

[0216] In the third modification, similarly to the first to third embodiments, the liquid that has passed through the filter 141 can be discharged through the downstream pipe 161 .

[0217] The downstream side piping 161 is connected to the lower part of the downstream chamber 142b, for example. For example, in a configuration where a drain pipe for discharging the liquid passing through the filter 141 to the outside is connected to the downstream chamber 142b of the filter unit 140, the drain pipe can also be used as the downstream side piping 161. In other words, the previously provided drain pipe can also serve as the downstream side piping 161. According to this configuration, since there is no need to separately provide the downstream side piping 161, the increase in the number of components of the substrate processing apparatus 100 can be suppressed.

[0218] The other structures, particle removal methods, and other effects of the third variation are the same as those of the first to third embodiments.

[0219] [Fourth Modification]

[0220] Next, refer to Fig. 20 A substrate processing apparatus 100 according to a fourth modified example of the present invention will be described. Fig. 20 Schematic diagram for explaining the piping structure of the substrate processing apparatus 100 according to the fourth variation. The fourth variation describes an example different from the third variation, that is, an example in which the downstream side piping 161 is connected to the upper part of the downstream chamber 142b of the filter unit 140. Figure 3 Although part of the piping structure of the first embodiment shown is described, part of the piping structure other than the first embodiment may be changed.

[0221] like Fig. 20As shown, in the substrate processing apparatus 100 of the fourth modification, similarly to the third modification, the downstream pipe 161 is connected to the pipe 32 via the downstream chamber 142b of the filter unit 140. In the fourth modification, similarly to the third modification, the liquid passing through the filter 141 can be discharged via the downstream pipe 161.

[0222] In the fourth variation, the downstream side piping 161 is connected to the upper part of the downstream chamber 142b, for example. For example, in a configuration in which the downstream chamber 142b of the filter unit 140 is connected to an exhaust pipe for discharging the gas passing through the filter 141 to the outside, the exhaust pipe can also be used as the downstream side piping 161. In other words, the exhaust pipe provided in advance can also serve as the downstream side piping 161. According to this configuration, since there is no need to provide the downstream side piping 161 separately, the number of components of the substrate processing apparatus 100 can be suppressed from increasing.

[0223] The other structures, particle removal methods and other effects of the fourth variation are the same as those of the third variation.

[0224] In addition, in the third and fourth modified examples, although the example in which the downstream side piping 161 is connected to the piping 32 via the filter unit 140 is described, the present invention is not limited thereto. For example, the upstream side piping 151 is connected to the piping 32 via the filter unit 140. Specifically, the upstream side piping 151 may be connected to the piping 32 via the upstream chamber 142a of the filter unit 140. In addition, in a configuration in which a drain pipe or an exhaust pipe is connected to the upstream chamber 142a of the filter unit 140, the drain pipe or the exhaust pipe may be used as the upstream side piping 151. In addition, for example, similarly to the fourth embodiment, the removal liquid may be discharged via the upstream side piping 151 after passing through the downstream side piping 161 and the filter 141.

[0225] [Fifth Embodiment]

[0226] Next, refer to Fig.21 A substrate processing apparatus 100 according to a fifth embodiment of the present invention will be described. In the fifth embodiment, an example different from the first to fourth embodiments, that is, an example in which particles are removed periodically will be described. Figure 5 Although a part of the particle removal method of the first embodiment shown is described, a part of the particle removal method other than the first embodiment may be changed.

[0227] The configuration of the substrate processing apparatus 100 of the fifth embodiment is the same as that of the first embodiment. However, in the fifth embodiment, the substrate processing apparatus 100 may not include the detector 116 .

[0228] Fig.21Flow chart showing the particle removal method of the filter 141 of the fifth embodiment. The particle removal method of the filter 141 of the fifth embodiment includes step S201 and steps S102 to S104. In addition, step S201 is an example of the "substrate processing step" of the present invention. In step S201, the processing liquid is made to flow and pass through the filter 141 in the same manner as in the above-mentioned step S101. In addition, in step S201, the processing liquid is made to flow to the pipe 32 and supplied to the substrate processing unit 10, thereby enabling the substrate W to be processed by the processing liquid. In addition, in step S201 (substrate processing step), the pressure of the processing liquid relative to the filter 141 is the first pressure.

[0229] like Fig.21 As shown, in step S201, the control unit 102 determines whether a predetermined period has passed. The predetermined period is a predetermined period. The predetermined period is, for example, the time elapsed since the last time the filter 141 was replaced or particles were removed, or the accumulated driving time of the substrate processing apparatus 100. In addition, the predetermined period may also be, for example, the accumulated time for the processing liquid to flow and pass since the last time the filter 141 was replaced or particles were removed. The accumulated time for the processing liquid to flow and pass corresponds to the flow rate of the processing liquid. In order to measure the above-mentioned predetermined period, the substrate processing apparatus 100 is preferably equipped with a timer or a flow meter.

[0230] In addition, the predetermined period when the filter 141 was replaced last time may be different from the predetermined period when the filter 141 was removed from particles last time. In this case, the predetermined period when the filter 141 was replaced may be set longer than the predetermined period when the filter 141 was removed from particles.

[0231] In step S201, when the control unit 102 determines that the predetermined period has not elapsed, the process repeats step S201.

[0232] On the other hand, in step S201 , when the control unit 102 determines that the predetermined period has elapsed, the process proceeds to step S102 .

[0233] Next, step S102 to step S104 are executed.

[0234] The other particle removal methods of the fifth embodiment are the same as those of the first embodiment.

[0235] As described above, in the fifth embodiment, the removal liquid is periodically passed from the upstream pipe 151 through the filter 141 through the downstream pipe 161. Therefore, particles can be removed before a large number of particles clog the pipe. Therefore, the time taken to make the treatment liquid or the removal liquid flow and pass through the filter 141 can be suppressed from being prolonged.

[0236] The other functions of the fifth embodiment are the same as those of the first embodiment. In addition, step S201 of the fifth embodiment can also be applied to the second to fourth embodiments.

[0237] [Sixth Embodiment]

[0238] Next, refer to Fig. 22 A substrate processing apparatus 100 according to a sixth embodiment of the present invention will be described. Fig. 22 1 is a schematic diagram showing the piping structure in the substrate processing apparatus 100 according to the sixth embodiment. In the sixth embodiment, an example is described in which a part of the processing liquid that has passed through the valve 117 is returned to the modulation tank 112. That is, in the sixth embodiment, an example is described in which the piping 32 is configured so that the processing liquid circulates. Figure 3 Although part of the piping structure of the first embodiment shown is described, part of the piping structure other than the first embodiment may be changed.

[0239] like Fig. 22 As shown, in the sixth embodiment, the pipe 32 includes a common pipe 32c, a branch pipe 32d, a return pipe 32e, a common pipe 32f, and a branch pipe 32g. The common pipe 32c is connected to the downstream portion 32b of the pipe 32. A plurality of (four in this case) branch pipes 32d are connected to the common pipe 32c. The branch pipe 32d branches from the common pipe 32c. The branch pipe 32d supplies the treatment liquid that has passed through the valve 117 to the treatment liquid tank 120.

[0240] The return pipe 32e is connected to the common pipe 32c. The return pipe 32e extends to the preparation tank 112. The return pipe 32e returns the processing liquid having passed through the common pipe 32c to the preparation tank 112.

[0241] The common pipe 32f is, for example, disposed in the treatment liquid tank 120. The common pipe 32f is connected to the branch pipe 32d. In addition, a plurality of (three in this case) branch pipes 32g are connected to the common pipe 32f. The branch pipe 32g branches from the common pipe 32f. The branch pipe 32g supplies the treatment liquid that has passed through the common pipe 32f to the nozzle 34.

[0242] In the sixth embodiment, when the valve 117 is switched from the open state to the closed state, the valve 117 is switched from the open state to the closed state after the substrate processing steps in all the substrate processing units 10 are completed.

[0243] The other configurations, other particle removal methods, and effects of the sixth embodiment are the same as those of the first embodiment. In addition, the piping configuration of the sixth embodiment can also be applied to the second to fifth embodiments.

[0244] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the above-mentioned embodiments, and can be implemented in various ways without departing from the spirit of the present invention. In addition, various inventions can be formed by appropriately combining the plurality of constituent elements disclosed in the above-mentioned embodiments. For example, some of the constituent elements of all the constituent elements shown in the embodiments can be deleted. Furthermore, the constituent elements in different embodiments can also be appropriately combined. In order to easily understand the present invention, the accompanying drawings show each constituent element principally and schematically, and the thickness, length, number, interval, etc. of each constituent element shown in the drawings will also be different from the actual situation due to the relationship of drawing the accompanying drawings. In addition, the material, shape, size, etc. of each constituent element shown in the above-mentioned embodiments are examples, and are not particularly limited. Various changes can be made within the scope of not substantially departing from the effect of the present invention.

[0245] For example, in the first embodiment and the second embodiment, although an example is described in which the processing liquid in the modulation tank 112 is used to remove particles, thereby consuming the processing liquid in the modulation tank 112, the present invention is not limited to this. For example, particles can be removed without substantially consuming the processing liquid in the modulation tank 112. Specifically, the processing liquid in the modulation tank 112 is replaced with a new processing liquid, for example, on a regular basis. When the processing liquid in the modulation tank 112 is replaced with a new processing liquid, the processing liquid to be discharged can also be used to remove particles. According to this structure, it is not necessary to consume the processing liquid in the modulation tank 112 to remove particles. As a result, since the amount of processing liquid used can be suppressed, the environmental burden can be further reduced.

[0246] In addition, for example, in the third and fourth embodiments, although examples of using a removal liquid of a different type from the processing liquid are shown, the present invention is not limited thereto. For example, a removal liquid of the same type as the processing liquid or a removal liquid having the same composition as the processing liquid may be used.

[0247] In addition, in the above-mentioned embodiment, although the valve 36, 115, 117, 152, 162 is described as an example of a valve capable of adjusting the flow rate of the liquid, the present invention is not limited to this. For example, the valve 36, 115, 117, 152, 162 may also be a valve that cannot adjust the flow rate of the liquid. That is, the valve 36, 115, 117, 152, 162 may also switch the flow path only to an open state or a closed state.

[0248] In addition, in the above embodiment, although the pump 114 is used as an example of a pressurizing unit for pressurizing the processing liquid, the present invention is not limited to this. For example, in a configuration in which compressed gas is sent into the modulation tank 112 and the processing liquid in the modulation tank 112 is sent to the pipe 32 by the compressed gas, a compressor or the like for sending compressed air into the modulation tank 112 may be used as a pressurizing unit.

[0249] Industrial Applicability

[0250] The present invention is suitable for use in a substrate processing device and a particle removal method.

[0251] [Description of Reference Numerals]

[0252] 10: Substrate processing unit

[0253] 32: Piping (processing liquid piping)

[0254] 100: Substrate processing device

[0255] 113, 153, 163: Heater (heating unit)

[0256] 114: Pump (pressurizing part)

[0257] 115: Valve (first valve)

[0258] 116: Detector

[0259] 117: Valve (second valve)

[0260] 140: Filter unit

[0261] 141: Filter

[0262] 142a: Upstream Room

[0263] 142b: Downstream Chamber

[0264] 151: Upstream piping

[0265] 152: Valve (third valve)

[0266] 161: Downstream piping

[0267] 162: Valve (fourth valve)

[0268] 165: Removal liquid supply unit (pressurizing unit)

[0269] S101, S201: Steps (substrate processing steps)

[0270] S103, S103a, S103b: Steps (non-substrate processing steps)

[0271] W: Substrate

Claims

1. A substrate processing device, wherein: have: A substrate processing unit, used for processing a substrate; A processing liquid pipe for supplying the processing liquid to flow to the substrate processing unit; a filter unit, disposed in the processing liquid piping and having a filter for capturing particles in the processing liquid; as well as a pressurizing unit that pressurizes a liquid containing the treatment liquid so that the liquid passes through the filter; The pressurizing unit is capable of changing the pressure of the liquid relative to the filter; The pressurizing unit pressurizes the processing liquid in a manner that a pressure of the processing liquid relative to the filter becomes a first pressure during substrate processing in which the substrate is processed by the processing liquid; The pressurizing unit pressurizes the liquid so that the pressure of the liquid relative to the filter becomes a second pressure higher than the first pressure during non-substrate processing in which the substrate is not processed by the processing liquid.

2. The substrate processing apparatus according to claim 1, wherein: The invention further comprises: a heating unit for heating the liquid passing through the filter; In the substrate processing, the temperature of the processing liquid passing through the filter is a first temperature; The heating unit heats the liquid during the non-substrate process so that the temperature of the liquid passing through the filter becomes a second temperature higher than the first temperature.

3. The substrate processing apparatus according to claim 1 or 2, wherein: Also available: an upstream pipe connected to the treatment liquid pipe at the upstream side of the filter; A downstream pipe connected to the treatment liquid pipe at the downstream side of the filter; as well as a removal liquid supply unit connected to one of the upstream pipe and the downstream pipe, and supplying the removal liquid for removing particles clogged in the filter to one of the upstream pipe and the downstream pipe; The liquid comprises the removal liquid; The substrate processing apparatus allows the removal liquid to pass from one of the upstream pipe and the downstream pipe through the filter during the non-substrate processing.

4. The substrate processing apparatus according to claim 3, wherein: Also available: a first valve disposed on the treatment liquid pipe at an upstream side of the filter; a second valve disposed in the treatment liquid pipe at a downstream side of the filter; A third valve is disposed on the upstream pipe; as well as a fourth valve, disposed on the downstream pipe; The substrate processing device closes the third valve and the fourth valve and opens the first valve and the second valve during the substrate processing, thereby allowing the processing liquid to pass from the upstream side of the processing liquid piping through the filter to the downstream side of the processing liquid piping; The substrate processing device closes the first valve and the second valve and opens the third valve and the fourth valve during the non-substrate processing, thereby allowing the removal liquid to pass from one of the upstream piping and the downstream piping through the filter to the other of the upstream piping and the downstream piping.

5. The substrate processing apparatus according to claim 3 or 4, wherein: The removal liquid is a liquid of a different type from the treatment liquid.

6. The substrate processing apparatus according to any one of claims 3 to 5, wherein: The substrate processing apparatus allows the removal liquid to pass from the downstream side pipe through the filter and through the upstream side pipe during the non-substrate processing.

7. The substrate processing apparatus according to any one of claims 1 to 6, wherein: It also includes: a downstream side pipe connected to the treatment liquid pipe at the downstream side of the filter; The substrate processing apparatus allows the liquid to pass through the downstream pipe from the upstream side of the filter via the filter during the non-substrate processing.

8. The substrate processing apparatus according to claim 7, wherein: The filter unit also has: an upstream chamber disposed on the upstream side of the filter; and a downstream chamber, disposed on the downstream side of the filter; The downstream side pipe is connected to the processing liquid pipe via the downstream chamber.

9. The substrate processing apparatus according to any one of claims 1 to 8, wherein: It also includes: a detector, which is arranged on the processing liquid piping and detects the pressure or flow rate of the processing liquid passing through the filter; The pressurizing unit pressurizes the liquid so that the pressure of the liquid relative to the filter becomes the second pressure when the detection value of the detector is smaller than a threshold value.

10. The substrate processing apparatus according to any one of claims 1 to 9, wherein: The pressurizing unit periodically pressurizes the liquid so that the pressure of the liquid relative to the filter reaches the second pressure.

11. A particle removal method, wherein: Include: a substrate processing step of causing a processing liquid to flow through a filter of a filter unit disposed in a processing liquid piping connected to a substrate processing unit and pass through the substrate processing unit, and processing the substrate with the processing liquid; as well as a non-substrate processing step in which the substrate is not processed by the processing liquid; In the substrate processing step, the processing liquid is caused to flow through the filter in such a manner that a pressure of the processing liquid relative to the filter becomes a first pressure; In the non-substrate processing step, the liquid is caused to flow and pass through the filter so that a pressure of the liquid relative to the filter becomes a second pressure higher than the first pressure.

12. The particle removal method according to claim 11, wherein: In the substrate processing step, the temperature of the processing liquid passing through the filter is a first temperature; In the non-substrate processing step, the liquid at a second temperature higher than the first temperature is caused to flow through the filter.

13. The particle removal method according to claim 11 or 12, wherein: The liquid includes a removal liquid for removing particles clogged in the filter; In the non-substrate processing step, the removal liquid is passed from one of the upstream side piping and the downstream side piping through the filter through the other of the upstream side piping and the downstream side piping, the upstream side piping is connected to the processing liquid piping at the upstream side of the filter, and the downstream side piping is connected to the processing liquid piping at the downstream side of the filter.

14. The particle removal method according to claim 13, wherein: The removal liquid is a liquid of a different type from the treatment liquid.

15. The particle removal method according to claim 13 or 14, wherein: In the non-substrate processing step, the removal liquid is passed from the downstream side pipe through the filter and into the upstream side pipe.

16. The particle removal method according to any one of claims 11 to 15, wherein: In the non-substrate processing step, the liquid is passed from the upstream side of the filter through the filter and through a downstream side pipe connected to the processing liquid pipe at the downstream side of the filter.

17. The particle removal method according to claim 16, wherein: The filter unit has: an upstream chamber, disposed on the upstream side of the filter; as well as a downstream chamber, disposed on the downstream side of the filter; The downstream side pipe is connected to the processing liquid pipe via the downstream chamber.

18. The particle removal method according to any one of claims 11 to 17, wherein: In the substrate processing step, when the pressure or flow rate of the processing liquid passing through the filter is less than a threshold value, the non-substrate processing step is performed.

19. The particle removal method according to any one of claims 11 to 18, wherein: The non-substrate processing steps are performed periodically.

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