Accurate grinding device for circuit board

Abstract

The invention discloses an accurate grinding device for a circuit board, and relates to the field of circuit board side edge grinding, the accurate grinding device comprises a grinding workbench, a positioning grinding mechanism is arranged above the grinding workbench, the positioning grinding mechanism comprises a positioning frame, a rotating cross beam, a positioning assembly and a grinding assembly, and the rotating cross beam is rotatably mounted on the positioning frame; a positioning assembly and a grinding assembly are installed at the two ends of the rotating cross beam correspondingly and are symmetrically arranged about the axis of the main shaft, the positioning assembly comprises a positioning rotary disc and a positioning sliding block, the positioning rotary disc is rotationally installed at the bottom of the rotating cross beam, and the positioning sliding block is slidably arranged on the bottom face of the positioning rotary disc; and the grinding assembly comprises a grinding rotating disc and a grinding sliding block, the grinding rotating disc is rotationally installed at the bottom of the rotating cross beam, the grinding sliding block is slidably arranged at the bottom of the grinding rotating disc, and the grinding shaft is rotationally installed at the bottom of the grinding sliding block, so that a grinding path can be accurately planned; and the grinding precision and the grinding efficiency are improved.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board side grinding, in particular to a precise grinding device for a circuit board. Background Art

[0002] Electronic component assemblies include single-sided circuit boards, double-sided circuit boards, PCB boards, multi-layer printed circuit boards, printed circuit boards, etc. These electronic component assemblies are the core components of the controller, which can play an important role, that is, they can control the automatic operation of CNC machine tools, cutting equipment, etc. Among them, PCB boards are also commonly called circuit boards. When the circuit board is initially cut and formed, burrs will be formed on the side of the circuit board due to the cutting process. Therefore, the circuit board needs to be edged after cutting and forming. The size path of the circuit board is input into the edge grinder, and the edge grinder can move according to the preset trajectory path to complete the edge grinding operation of the circuit board. However, with the rapid development of integrated circuits, circuit boards have become diverse and complex. In order to meet the needs of different environments, the circuit board will be cut into a special shape, that is, the shape of the circuit board is not a conventional rectangular shape, but is cut into a special shape according to the actual environment, which makes it difficult to detect the outer dimensions of the special-shaped circuit board to preset the grinding path of the edge grinder. At the same time, the trajectory path of the special-shaped circuit board requires more coordinates to be input, and the operation is complicated, which makes it difficult for the edge grinder to follow the side of the special-shaped circuit board with high precision to complete the grinding operation, and its grinding accuracy is poor and the grinding efficiency is low. Summary of the invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a precise grinding device for a circuit board to solve the deficiencies of the prior art.

[0004] The objective of the present invention is achieved through the following technical scheme: a precise grinding device for a circuit board comprises a grinding workbench, a tooling mechanism is arranged on the grinding workbench, the tooling mechanism comprises a chassis and a lower pressure plate, a support shaft is coaxially fixed to the bottom of the chassis, the support shaft is vertically fixed to the grinding workbench, the lower pressure plate is arranged above the chassis, the circuit board tooling is between the chassis and the lower pressure plate, a positioning and grinding mechanism is arranged above the grinding workbench, the positioning and grinding mechanism comprises a positioning frame, a rotating crossbeam, a positioning assembly and a grinding assembly, a main shaft is fixed to the middle part of the bottom surface of the rotating crossbeam, the main shaft is rotatably mounted on the positioning frame, the positioning frame and the lower pressure plate both have the freedom to move axially along the support shaft, the positioning assembly and the grinding assembly are respectively mounted at both ends of the rotating crossbeam, and the positioning assembly The parts are symmetrically arranged with respect to the axis of the main shaft with respect to the grinding component, the positioning component comprises a positioning turntable, a positioning slider, a positioning shaft and a first distance measuring sensor, the positioning turntable is rotatably mounted on the bottom of the rotating beam, the end surface of the positioning turntable away from the rotating beam is provided with the positioning slider, the positioning slider has the freedom to move radially along the positioning turntable, the positioning shaft is vertically mounted on the bottom of the positioning slider, the first distance measuring sensor is used to measure the moving distance of the positioning slider, the grinding component comprises a grinding turntable, a grinding slider and a grinding shaft, the grinding turntable is rotatably mounted on the bottom of the rotating beam, the end surface of the grinding turntable away from the rotating beam is provided with the grinding slider, the grinding slider has the freedom to move radially along the grinding turntable, and the grinding shaft is rotatably mounted on the bottom of the grinding slider.

[0005] Furthermore, a positioning motor is installed on the top of the rotating beam, and a positioning spindle is coaxially fixed on the top of the positioning turntable. The positioning spindle is rotatably connected to the rotating beam, and the output shaft of the positioning motor is transmission-connected to the positioning spindle. A positioning groove is opened on the bottom surface of the positioning turntable along its own radial direction, and the grinding slider is slidably adapted in the positioning groove. A positioning spring is arranged in the positioning groove, and the two ends of the positioning spring are respectively connected to the grinding slider and the positioning turntable, and the positioning spring is located between the center of the positioning turntable and the grinding slider, the first ranging sensor is installed in the positioning groove, and a horizontal cylinder is installed on the side wall of the positioning turntable, and the telescopic shaft of the horizontal cylinder movably penetrates into the positioning groove.

[0006] Furthermore, a driving shaft is coaxially fixed on the top of the grinding turntable, and the driving shaft is rotatably connected to the rotating beam. A grinding groove is opened on the grinding turntable along its own radial direction, and the grinding groove is arranged to penetrate along the axial direction of the grinding turntable. The grinding slider is slidably adapted in the grinding groove, and a pushing cylinder is horizontally installed on the side wall of the grinding turntable. The telescopic shaft of the pushing cylinder movably penetrates into the grinding groove to connect with the grinding slider, and the initial position of the grinding shaft corresponds to the detection base point of the first ranging sensor.

[0007] Furthermore, a first motor is arranged above the rotating crossbeam, and an output shaft of the first motor is drivingly connected to the driving shaft. A second motor is installed on the grinding slider, and an output shaft of the second motor is drivingly connected to the grinding shaft.

[0008] Furthermore, the positioning and polishing mechanism also includes a lifting cylinder, which is vertically installed. The telescopic shaft of the lifting cylinder is connected to the positioning frame, and a third motor is installed on the positioning frame. The output shaft of the third motor is connected to a driving gear. A driven gear is mounted on the main shaft, and the driven gear meshes with the driving gear.

[0009] Furthermore, a plurality of radial limiting mechanisms are arranged on the grinding workbench, and the plurality of radial limiting mechanisms are evenly distributed along the circumferential direction of the support shaft. The radial limiting mechanism includes a radial limiting shaft, and the radial limiting shaft has the freedom to move radially along the support shaft. The radial limiting shaft is used to contact the side wall of the circuit board for limiting, and the radial limiting shaft follows the grinding path of the grinding shaft and moves away from the side wall of the circuit board in sequence.

[0010] Furthermore, the radial limiting mechanism also includes a radial cylinder and a radial sliding block. A limiting inner cavity is arranged in the grinding workbench, and the radial sliding block is arranged in the limiting inner cavity. The cylinder body of the radial cylinder is horizontally installed on the side wall of the grinding workbench, and the telescopic shaft of the radial cylinder penetrates into the limiting inner cavity to connect to the radial sliding block. The top surface of the grinding workbench is provided with a radial groove connected to the limiting inner cavity. Each of the radial limiting mechanisms is provided with a radial groove, and the radial limiting shaft passes through the radial groove to connect to the radial sliding block.

[0011] Furthermore, the tooling mechanism also includes a downward pressing beam and a rotating column, the rotating column is rotatably arranged on the grinding workbench, the rotation axis of the rotating column is coaxially arranged with the axis of the supporting shaft, one end of the downward pressing beam is connected to the top of the rotating column through a lifting cylinder, and a tooling downward pressing shaft is fixed to the bottom of the other end of the downward pressing beam, a bearing is mounted on the tooling downward pressing shaft, a bearing groove is opened on the top of the lower pressure plate, and the bearing is assembled in the bearing groove.

[0012] Furthermore, an annular groove is provided on the top surface of the grinding workbench, the axis of the annular groove is coaxially arranged with the axis of the supporting shaft, an outer gear ring is rotatably installed in the annular groove, the outer gear ring is meshed with a tooling drive gear, a fourth motor is arranged in the limiting inner cavity, and the output shaft of the fourth motor is transmission-connected to the tooling drive gear.

[0013] Furthermore, the radial sliding block is penetrated by a through hole, the radial limiting shaft slides through the through hole, a driving cylinder is vertically installed in the limiting inner cavity, the telescopic shaft of the driving cylinder is connected to a lifting support plate, the radial limiting shaft is supported by the lifting support plate, and the lifting support plate is penetrated by a avoidance groove for the fourth motor to pass through.

[0014] The beneficial effects of the present invention are: The rotating crossbeam rotates to put the positioning assembly in the working position, and the positioning slider drives the positioning shaft to move so that the positioning shaft always contacts the side of the circuit board, and the first distance measuring sensor measures the position of the positioning shaft, and then the positioning turntable drives the positioning shaft to rotate so that the positioning shaft rotates around the side of the circuit board. During this process, the positioning shaft always contacts the side of the circuit board, and the first distance measuring sensor detects the distance of the positioning shaft in real time, thereby planning the outer dimension path of the circuit board, and the rotating crossbeam rotates to put the grinding assembly in the working position, and the grinding shaft moves along the outer dimension path of the circuit board to complete the grinding operation, thereby being able to accurately plan the grinding path and improve the grinding accuracy and efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of the structure of a precise grinding device for a circuit board according to the present invention Figure 1 ; Figure 2 A schematic diagram of the structure of a precise grinding device for a circuit board according to the present invention Figure 2 ; Figure 3 for Figure 2 Enlarged view of point A in the middle; Figure 4 A schematic diagram of the structure of a precise grinding device for a circuit board according to the present invention Figure 3 ; Figure 5 It is a schematic diagram of the internal structure of a grinding workbench in a precise grinding device for a circuit board of the present invention; In the figure, 1-grinding workbench, 2-chassis, 3-lower pressure plate, 4-support shaft, 5-positioning frame, 6-rotating beam, 7-spindle, 8-positioning turntable, 9-positioning slider, 10-positioning shaft, 11-first distance measuring sensor, 12-grinding turntable, 13-grinding slider, 14-grinding shaft, 15-positioning motor, 16-positioning spindle, 17-positioning slide, 18-positioning spring, 19-horizontal cylinder, 20-driving shaft, 21-grinding slide, 22-pushing cylinder, 24-first motor, 2 5-lifting cylinder, 28-second motor, 31-lifting cylinder, 32-third motor, 33-driving gear, 34-driven gear, 35-radial limiting shaft, 36-radial cylinder, 37-radial sliding block, 38-limiting inner cavity, 39-radial groove, 40-downward pressure beam, 41-rotating column, 42-tooling down pressure shaft, 43-bearing, 44-bearing groove, 45-annular groove, 46-outer gear ring, 47-tooling driving gear, 48-through hole, 49-driving cylinder, 50-lifting support plate. DETAILED DESCRIPTION

[0016] The technical solution of the present invention is further described in detail below in conjunction with the accompanying drawings, but the protection scope of the present invention is not limited to the following.

[0017] Embodiment 1: like Figures 1 to 5As shown, a precise grinding device for a circuit board comprises a grinding table 1, on which a tooling mechanism is arranged, the tooling mechanism comprises a chassis 2 and a lower pressure plate 3, a support shaft 4 is coaxially fixed to the bottom of the chassis 2, the support shaft 4 is vertically fixed to the grinding table 1, the lower pressure plate 3 is arranged above the chassis 2, the circuit board tooling is between the chassis 2 and the lower pressure plate 3, a positioning and grinding mechanism is arranged above the grinding table 1, the positioning and grinding mechanism comprises a positioning frame 5, a rotating crossbeam 6, a positioning assembly and a grinding assembly, a main shaft 7 is fixed to the middle part of the bottom surface of the rotating crossbeam 6, the main shaft 7 is rotatably mounted on the positioning frame 5, the positioning frame 5 and the lower pressure plate 3 both have the freedom to move axially along the support shaft 4, the two ends of the rotating crossbeam 6 are respectively mounted with a positioning assembly and a grinding assembly, and the positioning and grinding mechanisms are arranged on the upper side of the grinding table 1. The positioning assembly and the grinding assembly are symmetrically arranged about the axis of the main shaft 7. The positioning assembly includes a positioning turntable 8, a positioning slider 9, a positioning shaft 10 and a first distance measuring sensor 11. The positioning turntable 8 is rotatably installed at the bottom of the rotating beam 6. The end surface of the positioning turntable 8 away from the rotating beam 6 is provided with a positioning slider 9. The positioning slider 9 has the freedom to move radially along the positioning turntable 8. The positioning shaft 10 is vertically installed at the bottom of the positioning slider 9. The first distance measuring sensor 11 is used to measure the moving distance of the positioning slider 9. The grinding assembly includes a grinding turntable 12, a grinding slider 13 and a grinding shaft 14. The grinding turntable 12 is rotatably installed at the bottom of the rotating beam 6. The end surface of the grinding turntable 12 away from the rotating beam 6 is provided with a grinding slider 13. The grinding slider 13 has the freedom to move radially along the grinding turntable 12 degrees of freedom of radial movement, the grinding shaft 14 is rotatably installed at the bottom of the grinding slider 13, the circuit board is clamped and placed between the chassis 2 and the lower pressure plate 3 by the mechanical arm, the lower pressure plate 3 has the degree of freedom of axial movement along the support shaft 4, after the circuit board is loaded between the chassis 2 and the lower pressure plate 3, the lower pressure plate 3 moves downward to contact the circuit board, and the tooling of the circuit board is completed through the interaction between the chassis 2 and the lower pressure plate 3. The tooling position of the circuit board is located in the middle of the circuit board, so that the side of the circuit board is completely exposed, and then the outer size of the special-shaped circuit board is detected first, the rotating beam 6 is deflected, so that the positioning component is in the working position to measure the side position of the circuit board, and the positioning frame 5 drives the positioning component to move downward so that the bottom surface height of the positioning shaft 10 is located at the circuit board The positioning turntable 8 drives the positioning shaft 10 to rotate around the circuit board for one circle. During the rotation, the positioning slider 9 drives the positioning shaft 10 to move close to the circuit board so that the positioning shaft 10 always contacts the side of the circuit board. The position information of the positioning slider 9 is measured in real time by the first distance measuring sensor 11. When the positioning turntable 8 rotates one circle, the side path coordinates of the circuit board can be measured. The path information is transmitted to the grinding assembly, and then the rotating beam 6 is deflected to make the grinding assembly in the working position. The initial position of the grinding shaft 14 is the same as the initial position of the positioning shaft 10. Then, the grinding shaft 14 is driven to move by the grinding slider 13. The movement of the grinding slider 13 is based on the feedback of the side path coordinates. The rotation speed of the grinding turntable 12 is the same as the rotation speed of the positioning turntable 8.The grinding shaft 14 moves around the side of the circuit board at the same speed. During this process, the grinding shaft 14 moves in real time, and the moving coordinates of the grinding shaft 14 are the same as the side path coordinates, so that the side path coordinates of the circuit board measured by the positioning component are the grinding moving path of the grinding component, and then the grinding shaft 14 can always contact the side of the circuit board to complete the grinding operation. In the batch grinding of the same circuit board, it is only necessary to plan the side path coordinates of the circuit board of this model for the first time. The subsequent same circuit boards can be directly polished by installing the side path coordinates of the grinding component to complete the side grinding operation of the special-shaped circuit board, which has the advantages of high grinding accuracy and high grinding efficiency.

[0018] Furthermore, if Figure 1 , Figure 2 and Figure 4 As shown, the positioning and grinding mechanism also includes a lifting cylinder 31, which is installed vertically. The telescopic shaft of the lifting cylinder 31 is connected to the positioning frame 5. A third motor 32 is installed on the positioning frame 5. The output shaft of the third motor 32 is connected to a driving gear 33. A driven gear 34 is mounted on the main shaft 7. The driven gear 34 engages with the driving gear 33. The positioning frame 5 is driven to move up and down by the telescopic movement of the lifting cylinder 31. The positioning frame 5 drives the rotating beam 6 to move up and down, so that it moves downward to the working position to measure the side path and grind the side of the circuit board, and moves upward to facilitate the loading and unloading of the circuit board; the third motor 32 drives the main shaft 7 to rotate through the engagement of the driving gear 33 and the driven gear 34, and the main shaft 7 drives the rotating beam 6 to rotate, thereby completing the working position switching of the grinding assembly and the positioning assembly.

[0019] Embodiment 2: Based on the first embodiment, Figures 1 to 4As shown, a positioning motor 15 is installed on the top of the rotating beam 6, and a positioning spindle 16 is coaxially fixed on the top of the positioning turntable 8. The positioning spindle 16 is rotatably connected to the rotating beam 6, and the output shaft of the positioning motor 15 is transmission-connected to the positioning spindle 16. A positioning groove 17 is opened on the bottom surface of the positioning turntable 8 along its own radial direction, and the grinding slider 13 is slidably adapted in the positioning groove 17. A positioning spring 18 is arranged in the positioning groove 17, and the two ends of the positioning spring 18 are respectively connected to the grinding slider 13 and the positioning turntable 8. The spring 18 is located between the center of the positioning turntable 8 and the grinding slider 13. The first distance measuring sensor 11 is installed in the positioning slide groove 17. The side wall of the positioning turntable 8 is installed with a horizontal cylinder 19. The telescopic shaft of the horizontal cylinder 19 is movably inserted into the positioning slide groove 17. The telescopic shaft of the horizontal cylinder 19 is not connected to the positioning slider 9. Initially, the horizontal cylinder 19 extends and pushes the positioning slider 9 to move away from the first distance measuring sensor 11, that is, the positioning slider 9 stretches the positioning spring 18 to move away from the center of the circuit board, so that the positioning shaft 10 is at The positioning frame 5 moves downward to the outside of the side of the circuit board, and then the positioning frame 5 moves downward so that the height of the circuit board is between the top and bottom surfaces of the positioning shaft 10. The horizontal cylinder 19 contracts, and the positioning slider 9 follows the contraction and reset movement of the horizontal cylinder 19 under the reaction force of the positioning spring 18, so that the positioning shaft 10 contacts the side of the circuit board. At this time, the positioning spring 18 is still in a stretched state, and then the positioning motor 15 drives the positioning turntable 8 to move slowly through the positioning spindle 16, so that the positioning shaft 10 rotates around the side of the circuit board. Under the reaction force of the positioning spring 18, the positioning shaft 10 can adapt to the shape of the side of the circuit board and keep the positioning shaft 10 always in contact with the side of the circuit board. The position of the positioning slider 9 is measured in real time by the first distance measuring sensor 11, thereby reflecting the position coordinates of the positioning shaft 10. According to this position coordinate, the side path coordinates of the circuit board can be planned, and the side path coordinates are used as the grinding movement path of the grinding shaft 14, so that the grinding shaft 14 can perform side grinding operations on special-shaped circuit boards.

[0020] Embodiment three: Based on the second embodiment, Figures 1 to 4As shown, a driving shaft 20 is coaxially fixed on the top of the grinding turntable 12, and the driving shaft 20 is rotatably connected to the rotating crossbeam 6. A grinding groove 21 is opened on the grinding turntable 12 along its own radial direction, and the grinding groove 21 is arranged to penetrate along the axial direction of the grinding turntable 12. The grinding slider 13 is slidably adapted in the grinding groove 21, and a pushing cylinder 22 is horizontally installed on the side wall of the grinding turntable 12. The telescopic shaft of the pushing cylinder 22 is movably inserted into the grinding groove 21 to connect the grinding slider 13. The initial position of the grinding shaft 14 corresponds to the detection base point of the first distance measuring sensor 11. The telescopic shaft of the pushing cylinder 22 is directly connected to the grinding slider 13. According to the side path coordinates of the circuit board, the pushing cylinder 22 The grinding slider 13 is driven to move according to the side path coordinates, so that the grinding shaft 14 can always contact the side of the circuit board to complete the grinding operation, so that the grinding accuracy of the special-shaped edge is higher, and full coverage grinding of the side of the circuit board can be achieved; a first motor 24 is arranged above the rotating beam 6, and the output shaft of the first motor 24 is connected to the driving shaft 20 through transmission. A second motor 28 is installed on the grinding slider 13, and the output shaft of the second motor 28 is connected to the grinding shaft 14 through transmission. The first motor 24 drives the grinding turntable 12 to rotate through the driving shaft 20, so that the grinding shaft 14 can complete full coverage grinding around the circuit board in one circle, and the grinding shaft 14 is driven to rotate by the second motor 28 to achieve the grinding operation.

[0021] Embodiment 4: The chassis 2 and the lower pressure plate 3 cooperate to have a strong limiting effect in the vertical direction of the circuit board, but the limiting strength in the horizontal direction is not high. Since the circuit board is being polished, the polishing will produce a large vibration, which will cause the circuit board to deviate in the horizontal direction, thereby making the side of the circuit board unevenly polished, affecting the polishing accuracy. Therefore, based on the third embodiment, as shown in FIG. Figures 1 to 5As shown, a plurality of radial limiting mechanisms are arranged on the grinding workbench 1, and the plurality of radial limiting mechanisms are evenly distributed along the circumferential direction of the support shaft 4. The radial limiting mechanism includes a radial limiting shaft 35, and the radial limiting shaft 35 has the freedom to move radially along the support shaft 4. The radial limiting shaft 35 is used to contact the side wall of the circuit board for limiting. The radial limiting shaft 35 follows the grinding path of the grinding shaft 14 and moves away from the side wall of the circuit board in sequence. The radial limiting mechanism also includes a radial cylinder 36 and a radial sliding block 37. A limiting inner cavity 38 is arranged in the grinding workbench 1, and the radial sliding block 37 is arranged in the limiting inner cavity 38. The cylinder body of the radial cylinder 36 is horizontally installed on the side wall of the grinding workbench 1, and the telescopic shaft of the radial cylinder 36 penetrates into the limiting inner cavity 38 to connect with the radial sliding block 37. A radial groove 39 connected to the limiting inner cavity 38 is provided on the top surface of the grinding workbench 1, and each radial limiting mechanism is provided with a radial groove 39. The positioning shaft 35 passes through the radial groove 39 to connect the radial sliding block 37. At least four radial limiting mechanisms are arranged. The radial sliding block 37 is moved close to the circuit board by the radial cylinder 36, so that the radial limiting shaft 35 contacts the side of the circuit board. The horizontal movement freedom of the circuit board is limited by multiple radial limiting shafts 35. When the grinding shaft 14 is performing the grinding operation, when the grinding shaft 14 approaches the radial limiting shaft 35, the radial limiting shaft 35 moves away from the circuit board, so that the radial limiting shaft 35 avoids the grinding shaft 14, and the circuit board is limited by other radial limiting shafts 35. Since the grinding shaft 14 also contacts the circuit board for grinding, the grinding shaft 14 replaces the avoided radial limiting shaft 35 to limit the circuit board. After the circuit board passes through the radial limiting shaft 35, the radial limiting shaft 35 moves to contact the side wall of the circuit board again. In this way, it does not affect the limiting effect of the circuit board and does not interfere with the grinding component.

[0022] Embodiment five: Based on the fourth embodiment, Figure 1 and Figure 5As shown, the tooling mechanism also includes a downward pressing beam 40 and a rotating column 41. The rotating column 41 is rotatably arranged on the grinding workbench 1. The rotating axis of the rotating column 41 is coaxially arranged with the axis of the supporting shaft 4. One end of the downward pressing beam 40 is connected to the top of the rotating column 41 through the lifting cylinder 25. A tooling downward pressing shaft 42 is fixed to the bottom of the other end of the downward pressing beam 40. A bearing 43 is sleeved on the tooling downward pressing shaft 42. A bearing groove 44 is provided on the top of the lower pressure plate 3. The bearing 43 is assembled in the bearing groove 44. An annular groove 45 is provided on the top surface of the grinding workbench 1. The annular groove 45 The axis of the support shaft 4 is coaxially arranged, and an outer gear ring 46 is rotatably mounted in the annular groove 45, and the outer gear ring 46 is meshed with a tooling drive gear 47. A fourth motor is arranged in the limiting inner cavity 38, and the output shaft of the fourth motor is connected to the tooling drive gear 47 through transmission. The lower pressing beam 40 is driven by the lifting cylinder 25 to move along the axial direction of the support shaft 4. When the circuit board is loaded, the lower pressing beam 40 drives the lower pressing plate 3 to move upward, so that the space required for the robot arm to load the material is reserved between the lower pressing plate 3 and the chassis 2. After the circuit board is placed on the chassis 2, the lifting cylinder 25 drives the lower pressing plate 3 to move close to the bottom The plate 2 moves, and the tooling of the circuit board is completed through the cooperation of the chassis 2 and the lower pressure plate 3. Since the side wall of the circuit board needs to be completely exposed, a tooling mechanism of the lower pressure plate 3 is set, but the lower pressure plate 3 needs to be driven by the lower pressure beam 40, which causes interference with the lower pressure beam 40 when the positioning component measures the side path coordinates of the circuit board and when the grinding shaft 14 performs a grinding operation along the grinding path. For this reason, a rotational degree of freedom is set for the lower pressure beam 40, and the tooling drive gear 47 is driven to rotate by the fourth motor, and the tooling drive gear 47 drives the rotating vertical through the outer gear ring 46 The column 41 rotates, and the rotating column 41 drives the pressing beam 40 to rotate. The rotation direction of the positioning turntable 8 and the rotation direction of the grinding turntable 12 are the same as the rotation direction of the pressing beam 40, so that the pressing beam 40 can avoid the grinding shaft 14 and the positioning shaft 10. Since the lower pressure plate 3 cannot rotate with the pressing beam 40, otherwise the circuit board will be worn. Therefore, the pressing beam 40 and the lower pressure plate 3 are connected by the bearing 43, so that the lower pressure plate 3 and the pressing beam 40 have rotational freedom, so that the lower pressure plate 3 does not rotate with the pressing beam 40, thereby not causing damage to the circuit board.

[0023] Embodiment six: Due to the setting of the outer gear ring 46, the radial limiting shaft 35 will be affected by the outer gear ring 46 when moving. Therefore, based on the fifth embodiment, as shown in FIG. Figure 1 and Figure 5As shown, the radial sliding block 37 is penetrated with a through hole 48, the radial limiting shaft 35 slides through the through hole 48, a driving cylinder 49 is vertically installed in the limiting inner cavity 38, the telescopic shaft of the driving cylinder 49 is connected with a jacking support plate 50, the radial limiting shaft 35 is supported by the jacking support plate 50, and the jacking support plate 50 is penetrated with an avoidance groove for the fourth motor to pass through, when the radial limiting shaft 35 approaches the outer gear ring 46, the driving cylinder 49 drives the jacking support plate 50 to move downward, so that the radial limiting shaft 35 moves downward under its own gravity, so that The radial limiting shaft 35 moves into the limiting inner cavity 38, that is, the radial limiting shaft 35 is located below the outer gear ring 46, so that the radial limiting shaft 35 can pass through the outer gear ring 46 smoothly. After the radial limiting shaft 35 passes through the outer gear ring 46, the driving cylinder 49 drives the lifting support plate 50 to move upward, so that the lifting support plate 50 lifts the radial limiting shaft 35, so that the radial limiting shaft 35 passes through the radial groove 39, and the radial limiting shaft 35 contacts the side of the circuit board to complete the limiting, so that the radial limiting shaft 35 can avoid the outer gear ring 46 to move, and avoid interference.

Claims

1. A precise grinding device for a circuit board, characterized in that: The invention comprises a grinding workbench (1), wherein a tooling mechanism is arranged on the grinding workbench (1), wherein the tooling mechanism comprises a chassis (2) and a lower pressure plate (3), wherein a support shaft (4) is coaxially fixed to the bottom of the chassis (2), wherein the support shaft (4) is vertically fixed to the grinding workbench (1), wherein the lower pressure plate (3) is arranged above the chassis (2), wherein a circuit board tooling is arranged between the chassis (2) and the lower pressure plate (3), and wherein a positioning grinding mechanism is arranged above the grinding workbench (1), wherein the positioning grinding mechanism is arranged at a position of the grinding workbench (1). The structure comprises a positioning frame (5), a rotating crossbeam (6), a positioning assembly and a grinding assembly. A main shaft (7) is fixed in the middle of the bottom surface of the rotating crossbeam (6). The main shaft (7) is rotatably mounted on the positioning frame (5). The positioning frame (5) and the lower pressure plate (3) both have the degree of freedom to move axially along the support shaft (4). The positioning assembly and the grinding assembly are respectively mounted at both ends of the rotating crossbeam (6). The positioning assembly and the grinding assembly are symmetrically arranged about the axis of the main shaft (7). The positioning assembly comprises A positioning turntable (8), a positioning slider (9), a positioning shaft (10) and a first distance measuring sensor (11), wherein the positioning turntable (8) is rotatably mounted on the bottom of the rotating crossbeam (6), the positioning slider (9) is arranged on the end surface of the positioning turntable (8) away from the rotating crossbeam (6), the positioning slider (9) has the freedom to move radially along the positioning turntable (8), the positioning shaft (10) is vertically mounted on the bottom of the positioning slider (9), and the first distance measuring sensor (11) is used to measure the The moving distance of the positioning slider (9), the grinding assembly comprises a grinding turntable (12), a grinding slider (13) and a grinding shaft (14), the grinding turntable (12) is rotatably mounted on the bottom of the rotating beam (6), the end surface of the grinding turntable (12) away from the rotating beam (6) is provided with the grinding slider (13), the grinding slider (13) has the freedom to move radially along the grinding turntable (12), and the grinding shaft (14) is rotatably mounted on the bottom of the grinding slider (13).

2. A precise grinding device for a circuit board according to claim 1, characterized in that: A positioning motor (15) is installed on the top of the rotating crossbeam (6), a positioning spindle (16) is coaxially fixed on the top of the positioning turntable (8), the positioning spindle (16) is rotatably connected to the rotating crossbeam (6), the output shaft of the positioning motor (15) is transmission-connected to the positioning spindle (16), a positioning groove (17) is provided on the bottom surface of the positioning turntable (8) along its radial direction, the grinding slider (13) is slidably adapted in the positioning groove (17), and the positioning groove (17) is ) is provided with a positioning spring (18), the two ends of the positioning spring (18) are respectively connected to the grinding slider (13) and the positioning turntable (8), the positioning spring (18) is located between the center of the positioning turntable (8) and the grinding slider (13), the first distance measuring sensor (11) is installed in the positioning slide groove (17), the side wall of the positioning turntable (8) is installed with a horizontal cylinder (19), and the telescopic shaft of the horizontal cylinder (19) is movably inserted into the positioning slide groove (17).

3. The precise grinding device for a circuit board according to claim 1, characterized in that: A driving shaft (20) is coaxially fixed on the top of the grinding turntable (12), and the driving shaft (20) is rotatably connected to the rotating crossbeam (6). A grinding slide groove (21) is provided on the grinding turntable (12) along its radial direction, and the grinding slide groove (21) is arranged to penetrate along the axial direction of the grinding turntable (12). The grinding slider (13) is slidably adapted in the grinding slide groove (21). A pushing cylinder (22) is horizontally installed on the side wall of the grinding turntable (12), and the telescopic shaft of the pushing cylinder (22) is movably inserted into the grinding slide groove (21) to connect with the grinding slider (13). The initial position of the grinding shaft (14) corresponds to the detection base point of the first distance measuring sensor (11).

4. The precise grinding device for a circuit board according to claim 3, characterized in that: A first motor (24) is arranged above the rotating crossbeam (6), and an output shaft of the first motor (24) is drivingly connected to the drive shaft (20). A second motor (28) is mounted on the grinding slider (13), and an output shaft of the second motor (28) is drivingly connected to the grinding shaft (14).

5. The precise grinding device for a circuit board according to claim 1, characterized in that: The positioning and polishing mechanism further comprises a lifting cylinder (31), the lifting cylinder (31) being installed vertically, the telescopic shaft of the lifting cylinder (31) being connected to the positioning frame (5), a third motor (32) being installed on the positioning frame (5), an output shaft of the third motor (32) being connected to a driving gear (33), a driven gear (34) being sleeved on the main shaft (7), and the driven gear (34) being meshed with the driving gear (33).

6. The precise grinding device for a circuit board according to claim 1, characterized in that: The grinding workbench (1) is provided with a plurality of radial limiting mechanisms, which are evenly distributed along the circumferential direction of the support shaft (4), and the radial limiting mechanisms include a radial limiting shaft (35), the radial limiting shaft (35) having the freedom to move radially along the support shaft (4), the radial limiting shaft (35) being used to contact the side wall of the circuit board for limiting, and the radial limiting shaft (35) follows the grinding path of the grinding shaft (14) and moves away from the side wall of the circuit board in sequence.

7. The precise grinding device for a circuit board according to claim 6, characterized in that: The radial limiting mechanism further comprises a radial cylinder (36) and a radial sliding block (37); a limiting inner cavity (38) is arranged in the grinding workbench (1); the radial sliding block (37) is arranged in the limiting inner cavity (38); the cylinder body of the radial cylinder (36) is horizontally mounted on the side wall of the grinding workbench (1); the telescopic shaft of the radial cylinder (36) penetrates into the limiting inner cavity (38) and is connected to the radial sliding block (37); a radial groove (39) communicating with the limiting inner cavity (38) is provided on the top surface of the grinding workbench (1); each of the radial limiting mechanisms is provided with a radial groove (39); the radial limiting shaft (35) passes through the radial groove (39) and is connected to the radial sliding block (37).

8. The precise grinding device for a circuit board according to claim 7, characterized in that: The tooling mechanism further comprises a downward pressing beam (40) and a rotating column (41), wherein the rotating column (41) is rotatably arranged on the grinding workbench (1), and the rotation axis of the rotating column (41) is coaxially arranged with the axis of the supporting shaft (4), one end of the downward pressing beam (40) is connected to the top of the rotating column (41) via a lifting cylinder (25), and a tooling downward pressing shaft (42) is fixed to the bottom of the other end of the downward pressing beam (40), and a bearing (43) is sleeved on the tooling downward pressing shaft (42), and a bearing groove (44) is opened at the top of the lower pressure plate (3), and the bearing (43) is assembled in the bearing groove (44).

9. The precise grinding device for a circuit board according to claim 8, characterized in that: An annular groove (45) is provided on the top surface of the grinding workbench (1), the axis of the annular groove (45) being coaxially arranged with the axis of the support shaft (4), an outer gear ring (46) being rotatably mounted in the annular groove (45), the outer gear ring (46) being meshed with a tooling drive gear (47), a fourth motor being arranged in the limiting inner cavity (38), the output shaft of the fourth motor being drivingly connected to the tooling drive gear (47).

10. The precise grinding device for a circuit board according to claim 9, characterized in that: The radial sliding block (37) is provided with a through hole (48), the radial limiting shaft (35) slides through the through hole (48), a driving cylinder (49) is vertically installed in the limiting inner cavity (38), the telescopic shaft of the driving cylinder (49) is connected to a lifting support plate (50), the radial limiting shaft (35) is supported by the lifting support plate (50), and the lifting support plate (50) is provided with an avoidance groove for the fourth motor to pass through.

Images