POE-based micro-system module general test system and POE-based micro-system module general test method

Abstract

The invention discloses a POE-based micro-system module general test system and method, and aims to solve the technical problem of insufficient test integrity during micro-system test in the prior art. The test system comprises an upper computer, a POE switch and test hardware. The upper computer is used for sending a test command and receiving test data; the POE switch is connected with the upper computer and the test hardware to realize data transmission and supply power to the system; the test hardware is composed of a core board TBC and an expansion board TBE, and is used for receiving a test instruction and applying excitation to equipment to be tested. The system can work in a three-temperature environment. The test method comprises the steps of executing an upper computer command, applying excitation, obtaining response data and feeding back the response data to the upper computer, and can also be carried out in a three-temperature environment. Through the unique system architecture and the test method, the universality of the test scheme is improved, the test cost is greatly reduced, and the test coverage and reliability of the microsystem product in different environments are enhanced.

Description

Technical Field

[0001] The present application relates to the field of modern electronic manufacturing, and in particular to a universal testing system and method for microsystem modules based on POE. Background Art

[0002] In the field of modern electronic manufacturing, with the rapid progress of integrated circuit technology, highly integrated microsystem modules, such as SiP (System in Package) and POP (Package on Package) memory, have become the core of realizing high-performance, miniaturized and low-power electronic products. The development of these technologies has not only promoted the development of electronic devices in a more complex and compact direction, but also posed new challenges to the ability to test and verify these complex systems. In particular, under different environmental conditions, including high temperature, normal temperature and low temperature environments, the so-called three-temperature environment, the performance and reliability of electronic equipment must be fully tested and verified to ensure its stability and durability in practical applications. Three-temperature environment testing is crucial to evaluate the adaptability and reliability of products under extreme temperature changes, but traditional testing methods often find it difficult to fully cover these temperature conditions, resulting in limitations in test results.

[0003] At present, the testing of microsystem modules mainly relies on traditional ATE (Automatic Test Equipment) machines. Although this testing method can meet basic testing needs to a certain extent, it has many problems, such as insufficient test coverage, insufficient functional testing, and insufficient application verification, especially when facing microsystem modules with multi-chip integration and complex electrical connections. These problems are more prominent. In addition, with the widespread application of domestic chips, the requirements for test coverage and verification adequacy are becoming higher and higher, and the existing testing methods are difficult to meet these requirements, resulting in a large gap in product maturity compared with imported chips. Especially in a three-temperature environment, traditional testing methods often cannot provide sufficient test coverage and accuracy.

[0004] Therefore, in order to overcome the limitations of existing testing methods, improve the test efficiency and coverage of microsystem modules, reduce testing costs, and adapt to different testing needs, especially the testing needs under three-temperature environments (high temperature environment, normal temperature environment, and low temperature environment), it is urgent to develop a new testing method or device, including improving test coverage, enhancing the adequacy of functional testing, and deepening application verification, so as to ensure the performance and reliability of microsystem modules under various environmental conditions, improve overall testing efficiency and reduce costs. Summary of the invention

[0005] The object of the present invention is to provide a universal testing system and method for a microsystem module based on POE, so as to overcome the technical problems of low test integrity and poor versatility of existing microsystem module testing schemes.

[0006] In order to achieve the above object, the present invention adopts the following technical solution: A universal test system for microsystem modules based on POE, comprising: Host computer, used to send test commands and receive test data; POE switch, used to transmit data between the host computer and the test hardware; The test hardware is used to receive the test instructions sent by the POE switch and apply corresponding stimulus to the device under test.

[0007] The POE switch is connected to the host computer on one hand, and is connected to some test hardware on the other hand.

[0008] The test hardware includes: The core board TBC is used to receive the test instructions sent by the POE switch and drive the extended version TBE; The expansion board TBE is used to apply corresponding stimulus to the device under test according to the instruction of the core board TBC.

[0009] Each core board TBC is connected to an expansion board TBE.

[0010] Each expansion board TBE is provided with a plurality of test sockets for connecting to the device under test.

[0011] When the test object is replaced in the test system, only the expansion board TBE needs to be replaced.

[0012] The test system can perform microsystem testing in three temperature environments.

[0013] The POE switch can also provide power for the test system.

[0014] A universal test method for a microsystem module based on POE, comprising: Receive the test command sent by the host computer; Applying corresponding test stimulus to the device under test; Get the response data of the device under test; Feedback test data to the host computer via Ethernet.

[0015] This test method can be carried out under three temperature environments.

[0016] Compared with the prior art, the present invention has the following beneficial technical effects: A universal test system for microsystem modules based on POE adopts a POE switch to connect a host computer and test hardware, thereby realizing efficient data transmission. Meanwhile, the POE switch can also power the test system, thereby reducing the need for additional power supply equipment and simplifying the system structure. When changing the test object, only the expansion board TBE needs to be replaced, while the core board TBC can remain unchanged, which greatly improves the flexibility and adaptability of the system and reduces the hardware cost and replacement cost. When testing microsystem modules of different models, only the TBE expansion board adapted to different module interfaces needs to be replaced. The universal design of the TBC core board enables the system to quickly switch the test object without rebuilding the entire test hardware. The test system has high versatility and can effectively reduce the test cost. Each core board TBC is connected to an expansion board TBE, and a number of test sockets are arranged on the expansion board TBE, so that multiple devices to be tested can be tested at the same time, thereby improving the parallelism and batch processing capability of the test. This can significantly shorten the test cycle and improve production efficiency in large-scale microsystem product testing. The test system can perform microsystem tests in three temperature environments (high temperature, normal temperature, and low temperature), which can fully simulate various temperature environments that microsystems may encounter in actual applications, and effectively detect the performance and reliability of the equipment under test under different temperature conditions. Compared with systems that can only test at normal temperature, this system can more deeply discover potential problems, improve the integrity and accuracy of the test, and ensure the stable operation of microsystem products in different temperature environments.

[0017] A universal test method for a microsystem module based on POE can accurately control the test process and ensure the consistency and standardization of the test by executing the test command sent by the host computer. After applying the corresponding test stimulus to the device under test, the response data of the device under test is obtained in time and fed back to the host computer, realizing the rapid acquisition and real-time transmission of test data. This enables testers to understand the performance status of the device under test in time, quickly judge the test results, and improve the test efficiency. The automated test process can reduce human operation errors and improve the accuracy and reliability of the test. The test method can be carried out in a three-temperature environment and can comprehensively evaluate the performance of the microsystem under different temperature conditions. In a high temperature environment, the heat resistance of the device under test and the stability under high temperature working state can be detected; in a low temperature environment, the cold start problem and the influence of low temperature on the function of the device can be found; the test in a normal temperature environment is used as a benchmark reference. Through the test in the three-temperature environment, the problems that may occur in the microsystem under different temperature environments can be more comprehensively discovered, the environmental adaptability and reliability of the microsystem product are improved, and the stable operation of the product in various practical application scenarios is facilitated. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Schematic diagram of a universal test system for a microsystem module based on POE in an embodiment of the present invention.

[0019] Figure 2 Schematic diagram of a universal testing method for a POE-based microsystem module in an embodiment of the present invention. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0022] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "set / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0023] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "several" is two or more, unless otherwise clearly and specifically defined.

[0024] Embodiment 1: The specific implementation of the present invention provides a microsystem test system based on POE (Power over Ethernet), which uses POE technology to provide power and data communication for the microsystem module to achieve remote power supply and control. The system consists of a host computer, a POE switch, a core board TBC (Test Board Core), an extension board TBE (Test Board Extension), a device under test (DUT) and a database system, and is connected via Ethernet. Figure 1 As shown, the system includes: The host computer is used to control the entire test process, including sending test commands, collecting test data, analyzing results and storing records, and realizes data connection with the POE switch through Gigabit Ethernet. The host computer can be a computer or a server, with built-in test software developed based on HAL (Hardware Abstraction Layer).

[0025] The POE switch is connected to the host computer on one hand and the test hardware on the other. Through the cascade expansion of the POE switch, a test server can theoretically support an unlimited number of test clients working in parallel. The POE switch transmits data between the host computer and the test hardware through Gigabit Ethernet while also providing power and data transmission for the entire test system. The redundant POE network ports are used as additional power supply sections to enhance the power supply capacity of the test board and reduce the cost of external power supply.

[0026] Due to the cascading expansion of POE switches, one test server can theoretically support an unlimited number of test clients working in parallel, which allows multiple devices under test to be tested simultaneously in different temperature control environments, that is, testing the devices under test in low temperature, normal temperature, and high temperature environments, which is also called three-temperature testing. Traditional circuit test systems only cover functional performance tests at room temperature, and can only complete simple functional tests in high and low temperature environments, or need to be quickly taken out of the high and low temperature box for testing. Since this test system can test multiple DUTs at the same time, the POE-based test system can reduce the test cost of a single product and improve the utilization efficiency of test resources. By performing parallel testing in three-temperature environments, the performance and reliability of the DUT can be more comprehensively evaluated, potential problems can be discovered early, and the risk of products after they are launched on the market can be reduced.

[0027] The test hardware includes the core board TBC and the expansion board TBE. The core board TBC is responsible for receiving the test command sent by the host computer through the Ethernet port, driving the expansion board TBE to apply the test stimulus to the device under test, and obtaining the feedback result of the device under test, and then transmitting it back to the host computer through Ethernet again. The expansion board TBE provides multiple physical interfaces for testing the device under test, which can be a test socket. The expansion board TBE receives the test stimulus from the TBC and applies it to different test devices DUT, and feeds back the DUT test result information, and can also feed back the basic information of the DUT such as power supply current, voltage, temperature, etc.

[0028] The test system described in this specific implementation also includes a database system for storing and managing test result data. The database system can be a server or a cloud storage service.

[0029] This specific embodiment also provides a POE-based micro-system module universal test method, which can be used in a POE-based micro-system module universal test system. Figure 2 As shown, the test method includes the following steps: Execute the test command sent by the host computer; Applying corresponding test stimulus to the device under test; Get the response data of the device under test; Feedback test data to the host computer via Ethernet.

[0030] Similarly, this test method can be used to test the device under test in a three-temperature environment. During the test, the host computer supplies power to all components through a POE switch and initializes the core board TBC and the expansion board TBE. After that, the user operates the host computer to issue the test command. The host computer generates the test command and transmits it to the core board TBC through the POE switch. The core board TBC controls the expansion board TBC to apply the corresponding test stimulus to the device under test according to the test command. The device under test responds to the test stimulus and feeds back the result to the core board TBC through the expansion board TBE. The core board TBC sends the collected data back to the host computer through the POE switch, and the host computer performs data processing and analysis. The test results can be stored in the database system for easy recording, tracking and subsequent analysis. The host computer can generate a test report and provide feedback to the operator through the user interface.

[0031] This test method utilizes a universal test system for microsystem modules based on POE, and implements batch testing of the devices to be tested through POE technology, thereby improving test efficiency while reducing test costs and complexity, providing an innovative solution for mass production testing of microsystem modules.

[0032] Embodiment 2: Another specific embodiment of the present invention provides a scenario of testing a SiP (System in Package) module using a POE-based microsystem module universal test system and method.

[0033] First, build a test power supply system, select an 8-port 240W Gigabit POE switch, and perform cascade expansion according to actual test requirements. Connect a test server to the POE switch via Ethernet to ensure normal network communication. Connect multiple test end test devices consisting of a core board TBC and an expansion board TBE to each port of the POE switch. The core board TBC and the expansion board TBE are connected through an interface to ensure the stability and reliability of signal transmission.

[0034] For SiP module testing, the expansion board TBE is initially configured according to the physical interface type and electrical characteristics of the SiP module to ensure that it can accurately dock with the SiP module. A socket that matches the pin spacing and number of the SiP module is selected, and precise welding and wiring are performed to achieve effective signal transmission between the expansion board TBC and the SiP module.

[0035] The test server performs software configuration based on HAL (Hardware Abstraction Layer). Using the unified API interface provided by HAL, the initialization code of the system clock, peripherals, etc. is generated through the STM32CubeMX tool. According to the test requirements of the SiP module, the developer writes an application in an integrated development environment (such as STM32CubeIDE). The program covers functional modules such as the control logic of the core board TBC and the expansion board TBE, the generation and sending of test commands, and the reception and processing of test results. Write a function to initialize the Ethernet communication module of the core board TBC so that it can accurately receive test instructions from the server, and set the corresponding interrupt handler to ensure timely transmission of data.

[0036] For different types of single-layer substrates before SiP assembly, the expansion board TBE is modified in a targeted manner. If the signal interface standard of the substrate changes, the socket on the expansion board TBE is promptly replaced with a model that meets the new interface standard, and the signal interconnection path between the expansion board TBE and the core board TBC is adjusted to ensure that the test stimulus can be accurately applied to the substrate, and the response signal of the substrate can be smoothly transmitted back to the core board TBC.

[0037] Carefully place the single-layer substrate to be tested on a special fixture in the high and low temperature test chamber to ensure that the substrate will not be displaced or damaged during the test. Connect the test interface between the expansion board TBE and the substrate to ensure the reliability of the electrical connection.

[0038] The test server sends an electrical connectivity test command at room temperature to the core board TBC via Ethernet. After receiving the command, the core board TBC drives the test excitation circuit on the expansion board TBE to apply the specified voltage or signal to each pin of the substrate. The expansion board TBE monitors the feedback signal of the substrate pins in real time to determine whether the electrical connectivity between the pins meets the design requirements. For a substrate with multiple pins, the expansion board TBE detects the resistance value between each pair of pins in turn. If the resistance value is within the normal range, it is determined that the electrical connectivity of the pin pair is normal; if the resistance value is abnormal, it is marked that the pin pair has a connectivity problem.

[0039] The expansion board TBE feeds back the test results, including the connectivity status of each pin pair, the power supply current and voltage of the substrate, to the test server in real time through the core board TBC. After receiving the data, the test server compares and analyzes it with the preset standard values, generates a preliminary test report, and stores the test results and related data in the database for subsequent query and analysis.

[0040] Set the temperature of the high and low temperature test chamber to 85°C, and wait for the temperature in the test chamber to stabilize at the set value. The test server sends a signal integrity test command at high temperature. The core board TBC drives the expansion board TBE to apply high-frequency signal excitation to the substrate according to the command. The expansion board TBE uses high-precision test instruments (such as oscilloscopes, etc.) to detect the signal integrity parameters on the key signal lines on the substrate, such as the rise time, fall time, overshoot, undershoot, and eye diagram of the signal.

[0041] During the test, the expansion board TBE continuously monitors the temperature, power current, voltage and other parameters of the baseboard to ensure that the baseboard works normally in a high temperature environment and the test conditions are stable. Once any abnormal situation is found, such as severe signal distortion, excessive power current or abnormal voltage fluctuation, the test is stopped immediately and an alarm message is sent to the server. After the test, the expansion board TBE feeds back the detailed test results to the server, and the server updates the test report and records the test data in the high temperature environment.

[0042] Adjust the temperature of the high and low temperature test box to -40°C. After the temperature stabilizes, the server sends a cold start test command. The core board TBC controls the expansion board TBE to apply the power and signals required for startup to the base board, and monitors the startup process of the base board. The expansion board TBE detects the time from power-on to completion of initialization and the start of normal operation of the base board, and whether there are error prompts or abnormal signals during the startup process.

[0043] In a low-temperature environment, the expansion board TBE closely monitors the power supply of the baseboard, including the changing trend of the power current, the stability of the voltage, etc., and monitors the temperature sensor data of the baseboard to ensure that the test environment temperature meets the requirements. If the baseboard has problems during the cold start process, such as startup failure, too long startup time or unstable operation, the expansion board TBE will promptly feedback the relevant information to the server, and the server will record the fault information and conduct preliminary analysis. After the test is completed, the expansion board TBE will upload the complete test results to the server, and the server will complete the report generation and data storage of the low-temperature test part.

[0044] According to the actual situation of the finished product after SiP assembly, the expansion board TBE is further modified. If the finished product adds new functional modules, resulting in increased power consumption, the expansion board TBE needs to enhance the power supply capacity, replace a higher power power module or adjust the power circuit parameters to ensure that the finished product can provide a stable power supply. At the same time, optimize the signal interconnection between the expansion board TBE and the finished product, reduce signal transmission loss and interference, and improve the accuracy of the test.

[0045] Install the SiP product accurately on the test fixture, connect the test interface between the expansion board TBE and the product, including the power interface, signal interface, etc., to ensure that the connection is firm and the contact is good. Perform a visual inspection of the product to ensure that there is no damage or loose parts during the installation process.

[0046] The test server starts the normal temperature functional test program for the SiP finished product and sends a series of functional test commands to the core board TBC, covering various functional modules of the SiP finished product, such as data processing function, communication function, storage function, etc. The core board TBC converts the test command into a corresponding test stimulus signal and applies it to the SiP finished product through the expansion board TBE.

[0047] After receiving the test stimulus, the SiP finished product performs the corresponding functional operation and feeds back the result to the server through the expansion board TBE and the core board TBC. When testing the data processing function, the server sends a specific set of data to the finished product. The finished product processes the data and returns the processing result to the server. The server compares the processing result with the expected value to determine whether the data processing function is normal. When testing the communication function, the server simulates the communication peer to interact with the finished product to check whether the communication protocol of the finished product is implemented correctly and whether the data transmission is accurate.

[0048] The expansion board TBE monitors the power supply current, voltage, temperature and other parameters of the finished product in real time during the test to ensure that the finished product works under normal electrical and temperature conditions. If any parameter is found to be abnormal, the test is immediately suspended and the server is notified so that the problem can be promptly checked. The server generates a functional test report based on the test results, recording the test status of each functional module, including detailed information on whether the test passed or failed.

[0049] The test fixture containing the SiP finished product is placed in a high temperature test chamber, the temperature is set to 85°C, and the high temperature stability test is started after the temperature stabilizes. The server sends a long-term running test command to enable the SiP finished product to continuously run specific functions or tasks in a high temperature environment, such as cyclically executing data processing algorithms and continuously transmitting communication data.

[0050] During the test, the core board TBC and the expansion board TBE work together to regularly test the performance of the finished product, including functional correctness checks and data transmission accuracy verification. The expansion board TBE monitors the temperature, power status and other parameters of the finished product in real time, and draws parameter change curves to observe the performance change trend of the finished product in a high temperature environment. If the finished product has functional abnormalities or performance degradation during the test, such as slower processing speed and increased data error rate, the expansion board TBE will promptly record the time of the abnormality and related parameters, and notify the server to stop the test.

[0051] After the predetermined high-temperature operation time, the server sends a stop test command, and the expansion board TBE feeds back the final test results to the server, including the performance indicators of the finished product in a high-temperature environment, whether a fault occurs, and the relevant parameters when the fault occurs. The server evaluates the stability of the SiP finished product in a high-temperature environment based on the test results, generates a high-temperature stability test report, and updates the database.

[0052] The temperature of the high temperature test chamber is adjusted to -40°C, and the low temperature performance test is performed after the temperature stabilizes. The server first sends a low temperature startup test command to observe the startup of the SiP finished product in a low temperature environment, including the startup time and whether there are any error prompts during the startup process. The expansion board TBE monitors the power supply current and voltage changes during the startup process of the finished product to ensure that the startup process is normal.

[0053] After successful startup, the server sends a function accuracy test command to test the functions of the finished product in a low-temperature environment to check whether the function output is accurate and consistent with the function performance at normal temperature. For example, when testing the sensor data acquisition function, compare whether the data collected in a low-temperature environment is consistent with the actual environmental parameters; when testing the control function, verify whether the output of the control signal is correct.

[0054] The expansion board TBE closely monitors the temperature, power supply and performance of the finished product during the entire low-temperature test process. If any abnormalities such as functional failure or serious performance degradation are found in the finished product, they will be reported to the server in a timely manner. After the test, the expansion board TBE will feed back the low-temperature performance test results to the server, and the server will complete the low-temperature performance test report and store the relevant data to comprehensively evaluate the performance of the SiP finished product in a low-temperature environment.

[0055] Place the SiP module in a humidity test chamber and set the humidity test conditions, such as humidity range from 30%RH to 95%RH. The temperature can be set according to actual needs. The humidity test can be performed at room temperature or other specific temperatures. Connect the test interface of the expansion board TBE and the SiP module to ensure reliable electrical connection.

[0056] The test server sends test commands under humidity environment, including functional test and electrical performance test commands. The core board TBC drives the expansion board TBE to apply test stimulus to the SiP module, while the expansion board TBE monitors the module's response under different humidity environments. For example, in a high humidity environment, detect whether the module has leakage by monitoring slight changes in the power supply current; during humidity changes, test whether the module's functions are stable, such as whether the communication function is affected by humidity, resulting in increased data transmission errors, etc.

[0057] The expansion board TBE feeds back the humidity environment data of the SiP module (such as the actual humidity value in the test chamber), the module's power supply current, voltage, temperature, and test results to the server in real time. The server records the performance changes of the module in the humidity environment test based on the feedback data, generates a humidity environment test report, analyzes the impact of humidity on module performance, and determines whether the module meets the humidity environment adaptability requirements.

[0058] Install the SiP module firmly on the vibration test bench, connect the expansion board TBE and the test interface of the module to ensure that the connection will not loosen during the vibration process. According to the actual application scenarios and standard requirements of the SiP module, set the vibration test parameters such as vibration frequency range, vibration amplitude, and vibration time.

[0059] The test server starts the test program in the vibration environment and sends a test command. During the vibration process, the core board TBC and the expansion board TBE work together. The core board TBC ensures that the test excitation signal can be stably applied to the module, and the expansion board TBE monitors the functional status and electrical parameters of the module in real time. For example, by monitoring the signal quality of the module output, it can be determined whether there is signal interruption or distortion caused by poor contact in a vibration environment; by monitoring the fluctuations of the power supply current and voltage, it can be determined whether the power supply of the module is affected by vibration.

[0060] If the SiP module fails or has abnormal performance during the vibration test, the expansion board TBE immediately records the vibration parameters, module status information and test results when the failure occurs, and notifies the server to stop the test. After the test, the expansion board TBE feeds back the complete vibration environment test results to the server, and the server generates a vibration environment test report to evaluate the reliability of the module in the vibration environment, providing a basis for product improvement and optimization.

[0061] The test server conducts in-depth analysis of the massive amount of data collected during the entire test process. This includes the performance indicator change trends of SiP modules, including single-layer substrates and finished products, under different temperature environments, performance in humidity and vibration environment tests, and the types and frequencies of failures in each test link. Through data mining and statistical analysis techniques, the correlation and potential patterns between data are found. For example, the relationship between chip temperature and performance degradation under high temperature environments is analyzed to determine the heat resistance limit of the chip; the relationship between vibration frequency and module failure probability is analyzed to provide a reference for optimizing module structure.

[0062] The data analysis results are used to generate a detailed test data analysis report, which contains intuitive data display methods such as charts and curves, so that testers and R&D personnel can clearly understand the test status of the SiP module.

[0063] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A universal test system for microsystem modules based on POE, characterized in that: include: Host computer, used to send test commands and receive test data; POE switch, used to transmit data between the host computer and the test hardware; The test hardware is used to receive the test instructions sent by the POE switch and apply corresponding stimulus to the device under test.

2. A POE-based microsystem module universal test system according to claim 1, characterized in that: The POE switch is connected to a host computer on one hand, and is connected to a plurality of test hardware on the other hand.

3. A POE-based microsystem testing system according to claim 1, characterized in that: The test hardware includes: The core board TBC is used to receive the test instructions sent by the POE switch and drive the extended version TBE; The expansion board TBE is used to apply corresponding stimulus to the device under test according to the instruction of the core board TBC.

4. A POE-based microsystem module universal test system according to claim 2, characterized in that: Each of the core boards TBC is connected to an expansion board TBE.

5. A POE-based microsystem module universal test system according to claim 2, characterized in that: Each expansion board TBE is provided with a plurality of test sockets for connecting to the device under test.

6. A POE-based microsystem module universal test system according to claim 2, characterized in that: When the test object is replaced, the test system only needs to replace the expansion board TBE.

7. The POE-based microsystem module universal test system according to claim 1, characterized in that: The test system can perform microsystem testing under three-temperature environments.

8. The POE-based microsystem module universal test system according to claim 1, characterized in that: The POE switch can also provide power for the test system.

9. A universal test method for microsystem modules based on POE, characterized in that: include: Receive the test command sent by the host computer; Applying corresponding test stimulus to the device under test; Get the response data of the device under test; Feedback test data to the host computer via Ethernet.

10. A universal testing method for microsystem modules based on POE according to claim 6, characterized in that: The test method can be carried out under three temperature environments.

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