Device and method for trapezoidal deoxidation of CCGA device welding column

Abstract

The invention discloses a trapezoidal deoxidation device and method for a CCGA device welding column. The device comprises a stainless steel net, a base, a gasket, a cushion block, a cover plate, a fastening screw and an anti-static stainless steel brush. According to the method, the stainless steel mesh and the base are fixed through the sunk screws, then the gasket, the CCGA device and the cushion block are sequentially placed in, the cushion block is tightly jacked through the fastener, and the cover plate is fixed. The length of the welding column extending out of the stainless steel mesh is controlled by adjusting the thickness of the gasket. The deoxidation is divided into two steps: step 1, the thickness of a gasket is adjusted to enable a welding column to extend out of a stainless steel mesh by 0.2 mm, and then the welding column is polished and flattened by 400-mesh abrasive paper; in the second step, the welding column extends out of the stainless steel mesh by 0.5 mm by adjusting the thickness of the gasket, and then the side face of the welding column is deoxidized through an anti-static stainless steel brush. According to the device and the method, the oxide on the welding surface of the welding column of the CCGA device can be removed, and the welding qualification rate and the welding spot quality of the CCGA device are improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of electronic packaging, and in particular relates to a device and method for trapezoidal deoxidation of solder columns of CCGA devices. Background Art

[0002] Since CCGA devices are mainly used in the field of aerospace electronics, their reliability requirements are relatively high. The solder pillars of CCGA devices are made of high-lead solder. Existing devices do not deoxidize the solder pillars of CCGA devices during assembly. The welding process can easily lead to solder aggregation, solder pillar offset, non-wetting of solder joints, cold solder joints and other welding defects, reducing the reliability of CCGA devices and even causing CCGA devices to fail. Summary of the invention

[0003] In view of this, the device for trapezoidal deoxidation of CCGA device solder pillars of the present invention improves the soldering qualification rate and soldering quality of CCGA devices.

[0004] A CCGA device solder column trapezoidal deoxidation device comprises a stainless steel mesh, a base, a gasket, a gasket block and a cover plate, wherein:

[0005] The stainless steel mesh comprises a bottom plate and a first boss arranged in the central area of ​​the top surface of the bottom plate, wherein the central area of ​​the first boss is provided with a hole array structure;

[0006] A first through hole matching the shape of the first boss is provided in the central area of ​​the base, and the base is mounted on the top surface of the bottom plate by screws;

[0007] The shape of the gasket is adapted to the shape of the first through hole, and a second through hole adapted to the shape of the CCGA device is opened in the central area, the gasket is placed in the first through hole and the CCGA device is placed above the gasket, and the solder column part of the CCGA device extends out of the hole array structure and leaves an extended section;

[0008] The shape of the pad is matched with the shape of the gasket, a first groove whose shape is matched with the shape of the top cover plate of the CCGA device is provided in the central area of ​​the bottom surface of the pad, exhaust holes are provided at intervals on the first groove, and the exhaust holes extend to the top surface of the pad, the pad is placed above the CCGA device, and the bottom surface of the pad does not contact the top cover plate of the CCGA device;

[0009] The cover plate is arranged in a cross-step structure, and its cross-sectional size is larger than that of the base, and the cover plate is covered with the base by a button screw. A clamping screw is arranged in the central area of ​​the cover plate, and one end of the clamping screw passes through the cover plate. Rotating the clamping screw can press down the pad to prevent the CCGA device from shaking in the first through hole.

[0010] The technical beneficial effects of the present invention are:

[0011] The structure of the present invention can prevent the CCGA device from shaking in the first through hole, and can quickly perform the CCGA device. It has a simple structure and low cost. It is ground and deoxidized using 400-mesh sandpaper until the end face of the solder column is flat and evenly presents a silvery-white metallic luster. The oxide on the soldering surface of the CCGA device solder column is removed, thereby improving the CCGA device welding qualification rate and solder joint quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0013] Figure 1 This is an exploded view of the overall structure;

[0014] Figure 2 It is a schematic diagram of the overall structure;

[0015] Figure 3 is the main sectional view of the overall structure, in which:

[0016] 1. Stainless steel mesh; 2. Base; 3. Gasket; 4. Cushion block; 5. Cover plate; 6. Antistatic stainless steel brush; 11. Bottom plate; 12. First boss; 21. First through hole; 31. Second through hole; 41. First groove; 42. Exhaust hole; 51. Pressing screw. DETAILED DESCRIPTION

[0017] The embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

[0018] The following describes the embodiments of the present disclosure through specific examples, and those skilled in the art can easily understand other advantages and effects of the present disclosure from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. The present disclosure can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present disclosure. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present disclosure.

[0019] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is merely illustrative. Based on the present disclosure, it should be understood by those skilled in the art that an aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number of aspects described herein can be used to implement the device and / or practice the method. In addition, other structures and / or functionalities other than one or more of the aspects described herein can be used to implement this device and / or practice this method.

[0020] like Figures 1 to 3 The CCGA device solder column trapezoidal deoxidation device shown comprises a stainless steel mesh 1, a base 2, a gasket 3, a gasket block 4 and a cover plate 5, wherein:

[0021] The stainless steel mesh includes a bottom plate 11 and a first boss 12 disposed in the central area of ​​the top surface of the bottom plate 11, wherein the central area of ​​the first boss 12 is provided with a hole array structure;

[0022] A first through hole 21 matching the shape of the first boss 12 is formed in the central area of ​​the base 2, and the base 2 is mounted on the top surface of the bottom plate 11 by screws;

[0023] The shape of the gasket 3 is adapted to the shape of the first through hole 21, and a second through hole 31 adapted to the shape of the CCGA device is opened in the central area, the gasket 3 is placed in the first through hole 21, and the CCGA device is placed above the gasket 3, and the solder column part of the CCGA device extends out of the hole array structure and leaves an extended section;

[0024] The shape of the pad 4 matches the shape of the gasket 3. A first groove 41 whose shape matches the shape of the top cover plate of the CCGA device is provided in the central area of ​​the bottom surface of the pad 4. Exhaust holes 42 are provided at intervals on the first groove 41. The exhaust holes 42 extend to the top surface of the pad 4. The pad 4 is placed above the CCGA device, and the bottom surface of the pad 4 does not contact the top cover plate of the CCGA device.

[0025] The cover plate 5 is arranged in a cross-step structure, and its cross-sectional size is larger than that of the base, and the cover plate 5 is covered with the base 2 by a button screw. A clamping screw 51 is arranged in the central area of ​​the cover plate 5, and one end of the clamping screw 51 passes through the cover plate 5. Rotating the clamping screw 51 can press down the pad 4 to prevent the CCGA device from shaking in the first through hole 21, so that the CCGA device can be quickly processed. The structure is simple and the cost is low. Use 400-mesh sandpaper to grind and remove oxidation until the end face of the solder column is flat and evenly presents a silver-white metallic luster. The oxide on the welding surface (end face and side face) of the CCGA device solder column is removed to improve the welding qualification rate and solder joint quality of the CCGA device.

[0026] Furthermore, the hole array of the hole array structure is 34*34, for example, the stainless steel mesh 1 has a through hole with a diameter of 0.58mm, and the surface array is 34*34. There are two types of stainless steel mesh 1, with a spacing of 1.27mm and 1.0mm respectively. The overall thickness of the stainless steel mesh 1 is 1.6mm, and the central local window is sunken by 0.5mm, which can protect the side solder joints of the CCGA device from being damaged during the disassembly and assembly process. The holes on the back of the stainless steel mesh 1 adopt the hole chamfer C0.1 design, which is convenient for the CCGA device solder column to be inserted into the corresponding hole of the stainless steel mesh 1, which can cover 99% of the CCGA device sizes on the market.

[0027] Furthermore, the height of the first through hole 21 is greater than the sum of the heights of the first boss 12 , the gasket 3 , the spacer block 4 and the CCGA device.

[0028] Secondly, a method for deoxidizing the CCGA device solder column by trapezoidal shape is provided, using the device as described above, the method comprising:

[0029] S1: manufacturing two types of gaskets, including a first gasket and a second gasket, wherein the thickness of the first gasket is greater than the thickness of the second gasket (except for the thickness parameter, the other parameters of the two gaskets are the same);

[0030] S2: Use the first gasket to support the CCGA device so that the length of the solder column of the CCGA device extending out of the hole array structure is a first extension section, and grind the first extension section until it is flush with the bottom surface of the base plate 11;

[0031] S3: Use the second gasket to replace the first gasket, and make the length of the solder column extending out of the hole array structure of the CCGA device after one grinding to be the second extension section, and use an anti-static stainless steel brush 6 to process the second extension section until part of the length of the second extension section is a trapezoidal cylindrical structure.

[0032] Furthermore, the top surface of each hole in the hole array structure is provided with a hole opening C0.1 chamfer to prevent the solder column of the CCGA device from being rigidly damaged by the hole array structure when being placed.

[0033] Working principle: The stainless steel mesh 1 and the base 2 are positioned and fastened by the countersunk screws 7; then the gasket 3, the CCGA device to be deoxidized, the gasket 4 and the cover 5 are placed in sequence, and the cover 5 and the base 2 are fixed by the fasteners 8. Deoxidation is divided into two steps. The first step is to adjust the thickness of the gasket so that the welding column protrudes 0.2mm from the stainless steel mesh, and then polish it flat with 400-grit sandpaper; the second step is also to adjust the thickness of the gasket so that the welding column protrudes 0.5mm from the stainless steel mesh, and then use an anti-static stainless steel brush to deoxidize the side of the welding column.

[0034] Preferably, the openings of the stainless steel mesh 1 are through holes with a diameter of 0.58 mm, and the surface array is 34*34. There are two types of stainless steel mesh 1, with a spacing of 1.27 mm and 1.0 mm. The overall thickness of the stainless steel mesh 1 is 1.6 mm, and the central local window is sunken 0.5 mm, which can protect the side solder joints of the CCGA device from being damaged during the disassembly process. The openings on the back of the stainless steel mesh 1 adopt the hole chamfer C0.1 design, which is convenient for the CCGA device solder column to be inserted into the corresponding hole of the stainless steel mesh 1, which can cover 99% of the CCGA device sizes on the market.

[0035] The specific application of the operation method is as follows:

[0036] Position and fasten the stainless steel mesh 1 and the base 2 with countersunk screws 7;

[0037] Place the 0.9 mm gasket 3, the CCGA device to be deoxidized, and the gasket 4 into the base in sequence, so that the welding column extends 0.2 mm from the upper surface of the stainless steel mesh 1;

[0038] Fix the cover plate 5 and the base 2 with fasteners 8;

[0039] The fastener 6 is used to fix the cushion block 4 to prevent relative displacement of the components inside the device.

[0040] Grind the extended end of the device welding column downward with 400-grit sandpaper to remove oxidation until the end surface of the welding column is flat and evenly presents a silver-white metallic luster;

[0041] Disassemble the device and replace the gasket 3. Note that it is not necessary to disassemble the stainless steel mesh 1 and the base 2;

[0042] Place the 0.4mm gasket 3, the CCGA device to be deoxidized, and the gasket 4 into the base in sequence, so that the welding column extends 0.5mm from the upper surface of the stainless steel mesh 1;

[0043] Fix the cover plate 5 and the base 2 with fasteners 8;

[0044] The fastener 6 is used to fix the cushion block 4 to prevent relative displacement of the components inside the device;

[0045] Use an antistatic stainless steel brush to move along the X and Y directions respectively, then rotate the device 45° and repeat the above operation, the same number of times in each direction, at least 5 times;

[0046] The device is disassembled, the CCGA device is taken out, and the soldering ends of the CCGA device solder pillars are deoxidized in a trapezoidal manner.

[0047] The openings of stainless steel mesh 1 are through holes with a diameter of 0.58mm, and the area array is 34*34. There are two types of stainless steel mesh 1, with a spacing of 1.27mm and 1.0mm. The overall thickness of stainless steel mesh 1 is 1.6mm, and the central local window is sunken 0.5mm to protect the side solder joints of the CCGA device from damage during the disassembly process. The openings on the back of stainless steel mesh 1 adopt the hole chamfer C0.1 design, which is convenient for the CCGA device solder column to be inserted into the corresponding hole of stainless steel mesh 1.

[0048] The inner frame size of the base 2 is 44.1*44.1mm, and the inner depth is 8.0mm, which can cover the sizes of 99% of CCGA devices on the market.

[0049] The outer frame size of gasket 3 is 44*44mm, and the inner frame size is related to the size of CCGA device. There are two thicknesses of gasket 3. When the end surface of the solder column is deoxidized, a 0.9mm gasket is used to ensure that the solder column protrudes 0.2mm; when the side surface of the solder column is deoxidized, a 0.4mm gasket is used to ensure that the solder column protrudes 0.5mm.

[0050] The outer dimension of the pad 4 is 44*44mm, and the inner dimension is related to the dimension of the CCGA device body. The pad 4 is designed with two 5mm diameter ventilation holes to prevent the device body from being in close contact with the pad 4 and generating negative pressure.

[0051] The method for deoxidizing the side of the solder column is to use an antistatic stainless steel brush to move in the X direction and Y direction respectively, and then rotate the device 45° and repeat the above operation. The number of times in each direction is the same, at least 5 times. The above deoxidation method can correct the shape of the solder column welding end to a trapezoid.

[0052] After the CCGA device solder column solder end is deoxidized by the above-mentioned deoxidation device and method, the CCGA device is soldered to the corresponding position of the printed circuit board to form a solder joint on the printed circuit board side.

[0053] The above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A CCGA device solder column trapezoidal deoxidation device, characterized in that , including a stainless steel mesh, a base, a gasket, a pad and a cover, wherein, The stainless steel mesh comprises a bottom plate and a first boss arranged in the central area of ​​the top surface of the bottom plate, wherein the central area of ​​the first boss is provided with a hole array structure; A first through hole matching the shape of the first boss is provided in the central area of ​​the base, and the base is mounted on the top surface of the bottom plate by screws; The shape of the gasket is adapted to the shape of the first through hole, and a second through hole adapted to the shape of the CCGA device is opened in the central area, the gasket is placed in the first through hole and the CCGA device is placed above the gasket, and the solder column part of the CCGA device extends out of the hole array structure and leaves an extended section; The shape of the cushion block matches the shape of the gasket, and a first groove whose shape matches the shape of the top cover plate of the CCGA device is provided in the central area of ​​the bottom surface of the cushion block, and exhaust holes are provided at intervals on the first groove, and the exhaust holes extend to the top surface of the cushion block, and the cushion block is placed above the CCGA device, and the bottom surface of the cushion block does not contact the top cover plate of the CCGA device; The cover plate is arranged in a cross-step structure and has a cross-sectional size larger than that of the base, and the cover plate is covered with the base by a button screw. A clamping screw is arranged in the central area of ​​the cover plate, and one end of the clamping screw passes through the cover plate. Rotating the clamping screw can press down the pad to prevent the CCGA device from shaking in the first through hole.

2. The device according to claim 1, characterized in that The hole array of the hole array structure is 34*34.

3. The device according to claim 2, characterized in that The height of the first through hole is greater than the sum of the heights of the first boss, the gasket, the spacer, and the CCGA device.

4. A method for deoxidizing a CCGA device solder column by trapezoidalization, using the device according to any one of claims 1 to 3, characterized in that: The method comprises: S1: manufacturing two types of gaskets, including a first gasket and a second gasket, wherein the thickness of the first gasket is greater than the thickness of the second gasket; S2: using a first gasket to support the CCGA device so that the length of the solder column of the CCGA device extending out of the hole array structure is a first extension section, and grinding the first extension section until it is flush with the bottom surface of the base plate; S3: Use the second gasket to replace the first gasket, and make the length of the solder column extending out of the hole array structure of the CCGA device after one grinding to be the second extension section, and use an anti-static stainless steel brush to process the second extension section until part of the length of the second extension section is a trapezoidal cylindrical structure.

5. The method according to claim 4, characterized in that The top surface of each hole in the hole array structure is provided with a hole opening C0.1 chamfer to prevent the solder column of the CCGA device from being rigidly damaged by the hole array structure when being placed.

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