Wafer bearing device with wafer positioning function

Abstract

The invention relates to a wafer bearing device with a wafer positioning function, which is used for fixing a wafer on the wafer bearing device and positioning the wafer, the edge of the wafer comprises a positioning structure, and the wafer bearing device comprises a base, a bearing disc, a plurality of ejector pins, a linear actuator and an aligner. The bearing disc is arranged on the base. The bearing disc comprises an upper surface and a lower surface; the upper surface is used for placing a wafer thereon, and the upper surface is provided with an adsorption structure for adsorbing and fixing the wafer. The ejector pins are arranged on the upper surface in a protruding mode, and the ejector pins are arranged on the bearing disc at intervals in a surrounding mode with the preset reference center on the bearing disc as the reference. The linear actuator is arranged on the base, and the actuating direction of the linear actuator is parallel to the upper surface. The aligner may be driven by a linear actuator to move along an actuation direction to contact and push against a positioning structure of the wafer.

Description

Technical Field

[0001] The invention relates to the carrying and positioning of a wafer, and in particular to a wafer carrying device with a wafer positioning function. Background Art

[0002] The existing wafer manufacturing process continuously processes the wafer surface with multiple process flows, continuously performs etching operations or stacks wafer patterns. Each process flow of etching or stacking must fall on the predetermined position of the same component to complete the production of the component.

[0003] The above process flow will be performed on different wafer chucks. When the wafer is transferred to a wafer chuck, the wafer must be positioned so that the processing operations performed on the wafer chuck will fall on the correct position on the wafer.

[0004] Most of the existing wafer positioning is performed by optical detection or image recognition. Generally speaking, a positioning structure or pattern is set on the wafer first. As for the positioning structure, a common practice is to set a flat edge or notch on the edge of the wafer, and use optical detection or image recognition to identify the position of the flat edge / notch, and use a rotating mechanism to rotate the wafer on the vertical axis of the wafer so that the flat edge / notch is in the correct position.

[0005] In the above positioning method, a rotation mechanism must be set up, and the accuracy of positioning depends on the accuracy of optical detection or image recognition to identify the flat edge / notch. Not only does it make the structure of the wafer suction cup device complicated, but high-precision identification and rotation will also increase equipment costs and the time required for positioning. Summary of the invention

[0006] Based on the above technical issues, the present invention proposes a wafer carrying device with a wafer positioning function, which can quickly position the wafer.

[0007] The present invention proposes a wafer carrier device with a wafer positioning function, which is used to fix a wafer thereon and can position the wafer, and the edge of the wafer includes a positioning structure, and the wafer carrier device includes a base, a carrier plate, a plurality of ejectors, a linear actuator and an aligner. The carrier plate is arranged on the base. The carrier plate includes an upper surface and a lower surface; the upper surface is used for the wafer to be placed thereon, and the upper surface is provided with an adsorption structure for adsorbing and fixing the wafer. The ejectors are protrudingly arranged on the upper surface, and each ejector is arranged on the carrier plate at intervals around a preset reference center on the carrier plate as a reference. The linear actuator is arranged on the base, and the actuation direction of the linear actuator is parallel to the upper surface. The aligner can be driven by the linear actuator to move along the actuation direction to contact and push against the positioning structure of the wafer.

[0008] In at least one embodiment, the adsorption structure is a vacuum adsorption hole and an air guide groove connected to the vacuum adsorption hole, and the vacuum adsorption hole is connected to the upper surface and the lower surface.

[0009] In at least one embodiment, the wafer carrying device with wafer positioning function further includes an air pump, and the vacuum adsorption hole is connected to the air pump on the lower surface.

[0010] In at least one embodiment, the wafer carrier device with wafer positioning function further includes a plurality of lifting rods that are movably disposed on the carrier plate; wherein the lifting rods can be lowered and buried in the carrier plate, or raised and protruded from the upper surface.

[0011] In at least one embodiment, the linear actuator is connected to the base through a bracket, and the linear actuator includes at least one linear slide rail unit, a moving member, and a lead screw. The moving member is movably coupled to the at least one linear slide rail unit, and the moving direction of the moving member is parallel to the actuation direction of the linear actuator. One end of the lead screw is rotatably fixed to the bracket, and the other end passes through the hollow space of the moving member and is rotatably fixed to the moving member.

[0012] In at least one embodiment, the linear actuator further includes a compression spring sleeved on the lead screw, one end of the compression spring abuts against the moving member, and the other end is connected to at least one linear slide rail unit.

[0013] In at least one embodiment, the linear actuator further includes a compression spring, which is sleeved on the lead screw, one end of the compression spring abuts against the moving part, and the other end of the compression spring abuts against the bracket.

[0014] In at least one embodiment, the front end of the aligner includes a positioning flat surface.

[0015] In at least one embodiment, the aligner is in the shape of a plate, perpendicular to the upper surface, and extends toward a predetermined reference center.

[0016] In at least one embodiment, the carrier plate is further configured with a groove, which is located on the upper surface and connected to the edge of the carrier plate; the aligner and a part of the linear actuator are movably disposed in the groove.

[0017] The present invention proposes a wafer carrier device with a wafer positioning function, which achieves wafer positioning through the cooperation of a positioning structure, an aligner, and a pin. The positioning process does not involve the detection and identification of the wafer position / positioning structure, which greatly simplifies the complexity of the positioning mechanism. In addition, the present invention can achieve rapid positioning and easily improve the accuracy of positioning without affecting the execution rate of the positioning operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 11 is a top view of a wafer carrying device with a wafer positioning function in the first embodiment of the present invention.

[0019] Figure 2 It is a partial stereoscopic diagram of a wafer carrying device with a wafer positioning function in the first embodiment of the present invention.

[0020] Figure 3 FIG. 1 is a top view of a linear actuator according to a first embodiment of the present invention, showing a partial cross section.

[0021] Figure 4 FIG. 1 is a top view of some components in the first embodiment of the present invention.

[0022] Figure 5 It is a partial cross-sectional view of a wafer carrying device with a wafer positioning function in the first embodiment of the present invention.

[0023] Figure 6 It is a cross-sectional view of some components in the first embodiment of the present invention.

[0024] Figure 7 FIG. 1 is a top view of some components in the first embodiment of the present invention.

[0025] Figure 8 It is a cross-sectional view of some components in the first embodiment of the present invention.

[0026] Fig. 9 FIG. 1 is a top view of some components in the first embodiment of the present invention.

[0027] Fig.10 and Fig.11 It is a bottom view of a carrier plate in an embodiment of the present invention, revealing a driving mechanism of an ejector pin.

[0028] Fig.12 It is a schematic diagram of the maximum outer profile and the minimum outer profile of the planar cam in an embodiment of the present invention.

[0029] Fig.13 FIG. 1 is a top view of a linear actuator according to a second embodiment of the present invention, showing a partial cross section.

[0030] Fig.14 It is a cross-sectional view of some components in the second embodiment of the present invention.

[0031] Fig.15 FIG. 1 is a top view of some components in the second embodiment of the present invention.

[0032] Fig.16 It is a cross-sectional view of some components in the second embodiment of the present invention.

[0033] Fig.17 FIG. 1 is a top view of some components in the second embodiment of the present invention.

[0034] Description of reference numerals: 100-wafer carrier; 110-base; 112-bottom; 114-side wall; 120-carrier plate; 121-slot hole; 122-upper surface; 123-groove; 123a-extension portion; 124-lower surface; 126-adsorption structure; 126a-vacuum adsorption hole; 126b-air guide groove; 128-lifting hole; 130-thrust pin; 132-plane cam; 132a-outer vertex; 132b-inner concave point; 134-elastic member; 136-servo motor; 140- linear actuator; 142- linear slide unit; 142a- slider; 142b- track; 144- moving part; 146- lead screw; 148- compression spring; 150- aligner; 152- positioning plane; 160- lifting rod; 170- fixing block; 180- bracket; 190- lifting unit; 200- wafer; 212- flat edge; 214- notch; 300- vacuum pump; C1- preset reference center; C2- wafer center; R1- maximum outer contour; R2- minimum outer contour. DETAILED DESCRIPTION

[0035] See also Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, a wafer carrier 100 with a wafer positioning function in a first embodiment of the present invention is shown. The wafer carrier 100 is used to fix a wafer 200 thereon and can position the wafer 200. The edge of the wafer 200 includes a positioning structure, which can be, but is not limited to, a flat edge 212 (flatedge) or a notch (notch). In the first embodiment, the positioning structure is first illustrated as a flat edge 212.

[0036] like Figure 1 and Figure 2 As shown, the wafer carrier 100 includes a base 110 , a carrier plate 120 , a plurality of ejector pins 130 , a linear actuator 140 and an aligner 150 .

[0037] like Figure 1 and Figure 2 As shown, the base 110 is used as a base for the carrier plate 120 and the linear actuator 140, that is, the carrier plate 120 and the linear actuator 140 are directly or indirectly disposed on the base 110. The base 110 can be a flat plate structure, a slot structure or other types; the first embodiment uses a slot structure as an example of the base 110. As shown in the figure, the base 110 includes a bottom 112 and a side wall 114 surrounding the bottom 112.

[0038] like Figure 1 , Figure 2 and Figure 5 As shown, the carrier plate 120 is disposed on the bottom 112 of the base 110. The carrier plate 120 can be disposed on the bottom 112 through a support member so that a spacing distance is maintained between the carrier plate 120 and the bottom 112 for arranging other components between the carrier plate 120 and the bottom 112.

[0039] like Figure 1 , Figure 2 and Figure 5 As shown, the carrier plate 120 includes an upper surface 122 and a lower surface 124. The upper surface 122 is used for the wafer 200 to be placed thereon. An adsorption structure 126 is provided on the upper surface 122. The adsorption structure 126 is a vacuum adsorption hole 126a connected to the vacuum pump 300 and an air guide groove 126b connected to the vacuum adsorption hole 126a, so as to generate negative pressure to adsorb the wafer 200. The vacuum adsorption hole 126a can be connected to the upper surface 122 and the lower surface 124, and the vacuum adsorption hole 126a is connected to the vacuum pump 300 on the lower surface 124.

[0040] like Figure 1 and Figure 5 As shown, the carrier plate 120 further includes a plurality of lifting holes 128, and the wafer carrier device 100 further includes a plurality of lifting rods 160. The lifting rods 160 pass through the lifting holes 128 from the lower surface 124 of the carrier plate 120, and are driven by a lifting unit 190 such as a hydraulic cylinder, a pneumatic cylinder or a linear motor, so that the plurality of lifting rods 160 are arranged on the carrier plate 120 in a liftable manner. Therefore, the lifting rods 160 can be lowered and completely buried in the carrier plate 120, or raised and protruded from the upper surface 122. In addition, the edge of the upper surface 122 can also be configured as a stepped structure.

[0041] like Figure 1 , Figure 2 and Figure 5 As shown, a plurality of ejector pins 130 are protrudingly disposed on the upper surface 122 of the carrier plate 120 and are matched to the edge of the wafer 200. Each ejector pin 130 is disposed on the carrier plate 120 at intervals around a preset reference center C1 on the carrier plate 120.

[0042] like Figure 1 , Figure 2 and Figure 5As shown, the ejector pin 130 can be movably disposed on the carrier plate 120 and protrude from the upper surface 122 of the carrier plate 120. Taking the first embodiment as an example, the carrier plate 120 also includes a plurality of slots 121, each slot 121 connecting the upper surface 122 and the lower surface 124 of the carrier plate 120, and the extension direction of each slot 121 is toward the preset reference center C1. The ejector pin 130 is fixed on a fixed block 170, and the fixed block 170 is movably disposed on the lower surface 124, and the ejector pin 130 passes through the slot 121 from the lower surface 124 and protrudes from the upper surface 122. By adjusting the position of the fixed block 170, the distance between the ejector pin 130 and the preset reference center C1 can be changed, so that the plurality of ejector pins 130 can be matched with wafers 200 of different diameters.

[0043] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the linear actuator 140 is directly or indirectly fixed to the base 110, and the actuation direction of the linear actuator 140 is parallel to the upper surface 122. Specifically, in the first embodiment, the linear actuator 140 is connected to the side wall 114 through the bracket 180.

[0044] like Figure 3As shown, the linear actuator 140 of the first embodiment includes two linear slide rail units 142, a moving member 144, a lead screw 146 and a compression spring 148. The two linear slide rail units 142 are arranged in parallel and connected to the bracket 180. The linear slide rail unit 142 includes a slider 142a and a track 142b, and the slider 142a is slidably coupled to the track 142b. The moving member 144 is movably coupled to the two linear slide rail units 142, and the moving direction of the moving member 144 is parallel to the actuation direction of the linear actuator 140. Specifically, the interior of the moving member 144 can be a hollow space, so that the linear slide rail unit 142 is partially located in the hollow space of the moving member 144. One end of the lead screw 146 is rotatably fixed to the bracket 180, and the other end passes through the hollow space of the moving member 144 and is rotatably fixed to the moving member 144, and the lead screw 146 is located between the two linear slide rail units 142. The compression spring 148 is sleeved on the lead screw 146, one end of the compression spring 148 is pressed against the moving member 144, and the other end is connected to the two linear slide rail units 142, so that the elastic force of the compression spring 148 normally pushes the moving member 144 toward the carrier plate 120 to achieve front and rear buffering and eliminate the clearance caused by tolerance in the linear slide rail unit 142. The compression spring 148 can make the movement of the moving member 144 smoother, and the moving member 144 will not be frustrated due to the clearance between parts when moving forward and backward. The aligner 150 is connected to the linear actuator 140, and can be driven by the linear actuator 140 to move along the actuation direction to contact and push against the positioning structure of the wafer 200. Specifically, the aligner 150 is fixed to the moving member 144, or the aligner 150 is integrally formed with the moving member 144. The front end of the aligner 150 includes a positioning plane 152 , which matches the flat edge 212 of the wafer 200 and is perpendicular to the actuation direction of the linear actuator 140 and the upper surface 122 .

[0045] The above-mentioned linear actuator 140 is only an example, and other forms of linear actuator 140 are not excluded, such as a motor, a combination of a gear and a rack, or a linear motor driven by magnetic force.

[0046] It is difficult to make the aligner 150 slide on the upper surface 122 and contact the flat edge 212 of the wafer 200. The aligner 150 contacts the upper surface 122 and slides, which will cause too much friction resistance. The aligner 150 and the upper surface 122 are kept at a distance, which will cause the aligner 150 to fail to contact the flat edge 212. The aligner 150 may even fail to contact the flat edge 212 because the distance is greater than the thickness of the wafer 200.

[0047] like Figure 1 , Figure 2 and Figure 5As shown, in one or more embodiments of the present invention, the carrier plate 120 is further configured with a groove 123, which is located on the upper surface 122 and connected to the edge of the carrier plate 120. The aligner 150 and a part of the linear actuator 140 (moving member 144) are movably disposed in the groove 123.

[0048] The following describes the process of placing and positioning the wafer 200 according to the first embodiment.

[0049] like Figure 5 As shown, the plurality of lifting pins 160 first rise and protrude above the upper surface 122 of the carrier plate 120. The wafer 200 is moved by a robot or other handling equipment and placed on the plurality of lifting pins 160, with the flat edge 212 of the wafer 200 roughly corresponding to the aligner 150.

[0050] like Figure 6 and Figure 7 As shown, the lifting rod 160 then descends and is completely buried in the carrier plate 120, so that the wafer 200 is placed on the upper surface 122. The linear actuator 140 starts to operate, so that the aligner 150 contacts the flat edge 212 of the wafer 200 with the positioning plane 152, and starts to push the wafer 200 to move on the upper surface 122 and rotate horizontally.

[0051] like Figure 7 and Figure 8 As shown, by the push of the aligner 150, the wafer 200 moves on the upper surface 122 and contacts the ejector pin 130 with its edge, and the ejector pin 130 also moves toward the preset reference center C1 to a position matching the outer diameter of the wafer 200, so that the wafer center C2 moves to coincide with the preset reference center C1. Then, the wafer 200 pushed by the aligner 150 begins to rotate so that the positioning plane 152 of the aligner 150 is attached to the flat edge 212 of the wafer 200, completing the positioning of the wafer 200.

[0052] Afterwards, the vacuum pump 300 may start to operate, so that the suction structure 126 starts to provide negative pressure to attract / fix the wafer 200 .

[0053] See also Fig.10 and Fig.11 FIG. 2 shows a driving mechanism of a ejector pin 130 according to an embodiment of the present invention, which is applicable to one or more embodiments of the present invention.

[0054] Fig.10 and Fig.11 The bottom view of the carrier plate 120 is shown. As shown in the figure, the driving mechanism of the ejector pin 130 includes a planar cam 132, a plurality of elastic members 134 and a servo motor 136.

[0055] like Fig.12As shown, the plane cam 132 is rotatably disposed on the lower surface 124 of the carrier plate 120, and the cam center coincides with the preset reference center C1. The plane cam 132 includes a maximum outer profile R1 and a minimum outer profile R2. The diameter of the maximum outer profile R1 is greater than the diameter of the wafer 200, and the diameter of the minimum outer profile R2 is substantially equal to the diameter of the wafer 200. The plane cam 132 includes a plurality of outer vertices 132a, which correspond to the ejector pins 130 respectively and are located at the maximum outer profile R1. The plane cam 132 also includes a plurality of inner concave points 132b, which correspond to the ejector pins 130 respectively and are located at the minimum outer profile R2.

[0056] like Fig.12 As shown, a plurality of elastic members 134 are disposed on the lower surface 124 of the carrier plate 120 , and each elastic member 134 is used to normally push the ejector pin 130 toward the default reference center C1 and make the ejector pin 130 abut against the planar cam 132 .

[0057] like Fig.12 As shown, the servo motor 136 is connected to the planar cam 132 so that the planar cam 132 can be relative to the carrier plate 120 .

[0058] See also Fig.10 and Fig.12 As shown, taking three ejector pins 130 as an example, the planar cam 132 includes three outer vertices 132a and three inner concave points 132b, which are arranged alternately. When the wafer 200 is to be placed on the upper surface 122 of the carrier plate 120, the servo motor 136 rotates the planar cam 132 so that the three outer vertices 132a contact one ejector pin 130 respectively, so that the ejector pin 130 is pushed outward to a position corresponding to the maximum outer contour R1, so that the wafer 200 can be placed on the upper surface 122 of the carrier plate 120 without hindrance.

[0059] See also Fig.11 and Fig.12 As shown, the servo motor 136 then drives the planar cam 132 to rotate a predetermined angle. For example, in this embodiment, the servo motor 136 drives the planar cam 132 to rotate 60 degrees, so that the three inner concave points 132b contact the ejector pin 130. At this time, the ejector pin 130 is also pushed by the elastic member 134 to move toward the preset reference center C1 and continuously abut against the outer profile of the planar cam 132 to contact the inner concave points 132b. At this time, the distance from the ejector pin 130 to the preset reference center C1 is approximately equal to the diameter of the wafer 200, and the wafer 200 can be positioned so that the wafer center C2 of the wafer 200 moves to coincide with the preset reference center C1.

[0060] Through the interference of the planar cam 132, the multiple ejector pins 130 can be displaced synchronously to ensure that the distances from the multiple ejector pins 130 to the preset reference center C1 remain consistent. In addition, the aligner 150 can start to operate and align after the ejector pins 130 contact the inner concave point 132b to complete the positioning of the wafer 200. The aligner 150 can also be operated simultaneously with the ejector pins 130 to complete the positioning and alignment of the wafer 200 at the same time.

[0061] See also Fig.13 FIG. 1 is a linear actuator 140 and an aligner 150 according to a second embodiment of the present invention, which are applied in one or more embodiments of the present invention. The wafer 200 according to the second embodiment has a positioning structure of a notch 214 .

[0062] like Fig.13 As shown, the linear actuator 140 is directly or indirectly fixed to the base 110, and the actuation direction of the linear actuator 140 is parallel to the upper surface 122. Specifically, in the second embodiment, the linear actuator 140 is connected to the side wall 114 through the bracket 180.

[0063] like Fig.13 As shown, the linear actuator 140 of the second embodiment includes a linear slide unit 142, a moving member 144, a lead screw 146 and a compression spring 148. The linear slide unit 142 is connected to the bracket 180. The linear actuator 140 can also be configured with two linear slide units 142 in a left-right symmetrical manner as in the first embodiment. The moving member 144 is movably coupled to the linear slide unit 142, and the moving direction of the moving member 144 is parallel to the actuation direction of the linear actuator 140. The linear slide unit 142 is partially located in the hollow space of the moving member 144. One end of the lead screw 146 is rotatably fixed to the bracket 180, and the other end passes through the hollow space of the moving member 144 and is rotatably fixed to the moving member 144. The compression spring 148 is sleeved on the lead screw 146, one end of the compression spring 148 abuts against the moving member 144, and the other end abuts against the bracket 180, so that the elastic force of the compression spring 148 normally pushes the moving member 144 toward the carrier plate 120. Different from the first embodiment, the compression spring 148 in the second embodiment is located outside the moving member 144 and is compressed between the moving member 144 and the bracket 180.

[0064] like Fig.13 , Fig.14 and Fig.15 As shown, the aligner 150 is fixed to the movable member 144, the aligner 150 is flat, perpendicular to the upper surface 122, and extends toward a preset reference center C1, and the front end of the aligner 150 can be configured to include a rounded corner, and the front end of the aligner 150 is used to insert and match the notch 214 of the wafer 200 to abut against the corner of the notch 214.

[0065] Similarly, the carrier plate 120 of the second embodiment is also configured with a groove 123, which is located on the upper surface 122 and connected to the edge of the carrier plate 120, and the groove 123 is further configured with an extension portion 123a extending toward the default reference center C1 for allowing the front end of the aligner 150 to be inserted and further approach the preset reference center C1.

[0066] The following describes the process of placing and positioning the wafer 200 according to the second embodiment.

[0067] like Fig.14 and Fig.15 As shown, after the wafer 200 is placed on the upper surface 122 , the linear actuator 140 starts to operate, so that the front end of the aligner 150 is inserted into the notch 214 of the wafer and starts to push the wafer 200 to move and rotate horizontally on the upper surface 122 .

[0068] like Fig.16 and Fig.17 As shown, by the push of the aligner 150, the wafer 200 moves on the upper surface 122 and contacts the ejector pin 130 with its edge, so that the center C2 of the wafer moves to coincide with the preset reference center C1. Then the wafer 200 starts to rotate so that the front end of the aligner 150 abuts against the corner of the notch 214, completing the positioning of the wafer 200. After that, the vacuum pump 300 can start to operate, so that the suction structure 126 starts to provide negative pressure to attract / fix the wafer 200.

[0069] The present invention proposes a wafer carrier device 100 with a wafer positioning function, which achieves the positioning of the wafer 200 through the cooperation of the positioning structure, the aligner 150 and the ejector pin 130. The positioning process does not involve the detection and identification of the position / positioning structure of the wafer 200, which greatly simplifies the complexity of the positioning mechanism. In addition, the present invention can achieve rapid positioning and easily improve the accuracy of positioning without affecting the execution rate of the positioning operation.

Claims

1. A wafer carrier with a wafer positioning function, used to fix a wafer thereon and to position the wafer, and the edge of the wafer includes a positioning structure, characterized in that Included are: Pedestal; A carrier plate is disposed on the base; wherein the carrier plate comprises an upper surface and a lower surface; the upper surface is used for the wafer to be placed thereon, and the upper surface is provided with an adsorption structure for adsorbing and fixing the wafer; A plurality of ejector pins are protrudingly disposed on the upper surface, and each of the ejector pins is disposed on the carrier disc at intervals around a preset reference center on the carrier disc; A linear actuator is disposed on the base, and an actuating direction of the linear actuator is parallel to the upper surface; and The aligner can be driven by the linear actuator and move along the actuation direction to contact and push against the positioning structure of the wafer.

2. The wafer carrier device with wafer positioning function according to claim 1, characterized in that: The adsorption structure is a vacuum adsorption hole and an air guide groove connected to the vacuum adsorption hole, and the vacuum adsorption hole is connected to the upper surface and the lower surface.

3. The wafer carrying device with wafer positioning function according to claim 2, characterized in that: An air pump is also included, and the vacuum adsorption hole is connected to the air pump on the lower surface.

4. The wafer carrying device with wafer positioning function according to claim 1, characterized in that: It also includes a plurality of lifting rods which are escalably disposed on the carrying plate; wherein the plurality of lifting rods can be lowered to be buried in the carrying plate, or raised to protrude from the upper surface.

5. The wafer carrying device with wafer positioning function as claimed in claim 1, characterized in that: The linear actuator is connected to the base through a bracket, and the linear actuator comprises: At least one linear slide unit; a moving member, movably coupled to the at least one linear slide rail unit, wherein a moving direction of the moving member is parallel to the actuating direction of the linear actuator; and A lead screw has one end rotatably fixed to the bracket and the other end passes through the hollow space of the moving member and is rotatably fixed to the moving member.

6. The wafer carrying device with wafer positioning function according to claim 5, characterized in that: The linear actuator further comprises a compression spring which is sleeved on the lead screw, one end of the compression spring abuts against the moving part, and the other end of the compression spring is connected to the at least one linear slide rail unit.

7. The wafer carrying device with wafer positioning function according to claim 5, characterized in that: The linear actuator further comprises a compression spring, which is sleeved on the lead screw, one end of the compression spring abuts against the moving part, and the other end of the compression spring abuts against the bracket.

8. The wafer carrier device with wafer positioning function according to claim 1, characterized in that: The front end of the aligner includes a positioning flat surface.

9. The wafer carrying device with wafer positioning function according to claim 1, characterized in that: The aligner is in the shape of a flat plate, is perpendicular to the upper surface, and extends toward the preset reference center.

10. The wafer carrying device with wafer positioning function according to claim 1, characterized in that: The carrier plate is also provided with a groove, which is located on the upper surface and communicates with the edge of the carrier plate; the aligner and a part of the linear actuator are movably arranged in the groove.

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