Adsorption device for wafer test and wafer test system

Abstract

The invention discloses an adsorption device for wafer testing and a wafer testing system.The adsorption device comprises a lifting assembly, a supporting assembly, a gas circuit assembly and a platform assembly, and is characterized in that the platform assembly comprises a vacuum tank bottom plate (10), a flexible sealing element fixing ring (11), a flexible sealing element (12) and a sealing groove (23); the sealing groove (23) is formed in the position, corresponding to the periphery of a wafer, of the vacuum groove bottom plate (10), the flexible sealing piece fixing ring (11) and the flexible sealing piece (12) are arranged in the sealing groove (23), after the wafer is placed, the air path assembly vacuumizes the space formed between the wafer and the vacuum groove bottom plate (10), and the flexible sealing piece (12) is arranged in the sealing groove (23). And the flexible sealing element (12) completely supports the wafer to be adsorbed on the surface of the vacuum tank bottom plate (10), so that the wafer overcomes large warping, and the flatness is improved. The wafer flatness is ensured, and the execution of the subsequent wafer test operation and the accuracy of the corresponding test result are ensured at the same time.

Description

Technical field:

[0001] The present invention relates to the technical field of wafer processing, and in particular to an adsorption device for wafer testing and a wafer testing system. Background technology:

[0002] In semiconductor manufacturing, wafers, as objects to be tested, generally need to be fixed on a carrier for measurement, testing, transportation and other process treatments. In the process of testing wafers by the wafer testing system, due to the dispersion of stress, some of the wafers to be tested will be severely warped. For these wafers with large warpage, if the upper surface of the wafer is pressed to make it fit with the wafer stage, it will cause contamination of the upper surface of the wafer. Therefore, the existing practice is usually to use vacuum adsorption to adsorb and fix the wafer on the wafer stage. However, in the process of adsorbing the wafer, most of the wafer test adsorption devices in the prior art will contact the rigid contact surface around the wafer stage with the hard wafer, and many contact point areas will form tiny air leakage gaps, which often cannot firmly adsorb the wafer on the wafer stage, and the flatness of the wafer cannot be guaranteed. In the wafer testing system, the flatness of the wafer surface is extremely high. If the wafer cannot be flatly fixed, it will directly affect the execution of the wafer test operation and the corresponding test results. In severe cases, the wafer will be mechanically damaged. Summary of the invention:

[0003] In order to solve the above-mentioned problem that the wafer cannot be perfectly adsorbed on the wafer stage and the high flatness of the wafer cannot be guaranteed, the present invention proposes an adsorption device for wafer testing and a wafer testing system.

[0004] The adsorption device for wafer testing proposed in the present invention comprises a lifting assembly, a supporting assembly, an air circuit assembly and a platform assembly, and is characterized in that: the platform assembly comprises a vacuum groove bottom plate, a flexible sealing fixing ring, a flexible seal and a sealing groove; the sealing groove is arranged at a position of the vacuum groove bottom plate corresponding to the periphery of the wafer, the flexible sealing fixing ring and the flexible seal are arranged in the sealing groove, and when the wafer is placed, the air circuit assembly vacuumizes the space formed between the wafer and the vacuum groove bottom plate, and under the action of the pressure difference between the upper and lower surfaces of the wafer, the flexible seal completely supports the wafer to be adsorbed on the surface of the vacuum groove bottom plate, so that the wafer overcomes large warping and improves flatness.

[0005] As a further improvement of the present invention, vacuum annular air path grooves and vacuum air holes are also provided on the vacuum groove bottom plate. Multiple groups of vacuum annular air path grooves and vacuum air holes are connected to the air path assembly and are arranged in concentric circles from the center of the vacuum groove bottom plate to the outside.

[0006] As a further improvement of the present invention, the lifting assembly includes a guide column, a linear bearing, a cylinder, a linear bearing fixing plate, a wafer support column and a proximity sensor; one end of the linear bearing fixing plate is connected to the linear bearing, and the other end is connected to the wafer support column.

[0007] As a further improvement of the present invention, the air circuit assembly includes a vacuum pressure gauge, an air circuit plug, a vacuum air circuit channel, an air pipe joint vacuum interface, a compressed air interface and an external vacuum interface; the vacuum air circuit channel is connected to the vacuum air hole.

[0008] As a further improvement of the present invention, the cross-sectional shape of the sealing groove is an inverted trapezoid.

[0009] As a further improvement of the present invention, the cross-sectional shape of the sealing groove is rectangular.

[0010] As a further improvement of the present invention, the flexible sealing member is a rubber sealing ring.

[0011] As a further improvement of the present invention, the cross section of the flexible sealing member is in a zigzag shape.

[0012] As a further improvement of the present invention, the cross-section of the flexible sealing member is V-shaped.

[0013] The present invention also provides a wafer testing system, including an adsorption force testing mechanism and an adhesion testing mechanism, characterized in that it also includes any one of the above-mentioned adsorption devices for wafer testing.

[0014] The beneficial effects of the present invention are as follows: by adding a sealing groove at a position corresponding to the periphery of the wafer on the bottom plate of the vacuum groove, a flexible sealing fixing ring and a flexible sealing member arranged in the sealing groove, and a plurality of groups of vacuum annular air path grooves and vacuum air holes arranged in concentric circles from the center of the bottom plate of the vacuum groove to the outside, the wafer can be fully adhered and adsorbed on the surface of the bottom plate of the vacuum groove, and the wafer will not have a warping problem. While ensuring the flatness of the wafer, the execution of subsequent wafer testing operations and the accuracy of the corresponding test results are also guaranteed. Description of the drawings:

[0015] Figure 1 It is an overall exploded view of the wafer testing adsorption device of the present invention;

[0016] Figure 2 It is a front view, a stereoscopic view and a partial enlarged view of the adsorption device for wafer testing of the present invention;

[0017] Figure 3 It is a local detail diagram of the flexible seal in the unfolded state;

[0018] Figure 4 It is a local detail diagram of the flexible seal in the compressed state.

[0019] The corresponding relationship between the reference numerals and the component names is as follows:

[0020] Base plate—1; guide column—2; linear bearing—3; vacuum tank base plate support block—4; cylinder—5;

[0021] Right housing—6; vacuum pressure gauge—7; left housing—8; linear bearing fixing plate—9; vacuum tank bottom plate—10;

[0022] Flexible sealing member fixing ring—11; flexible sealing member—12; wafer supporting column—13; wafer—14;

[0023] Proximity sensor—15; air path plug—16; vacuum air path channel—17; air pipe joint vacuum interface—18;

[0024] Vacuum annular gas path groove—19; vacuum air hole—20; compressed air interface—21; external vacuum interface—22;

[0025] Sealing groove—23; Specific implementation method:

[0026] The technical solutions in the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings in the embodiments of the present invention. The embodiments described below by the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0027] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0028] like Figures 1 to 4 As shown, an embodiment of the adsorption device for wafer testing of the present invention is provided, including a base plate 1, a guide column 2, a linear bearing 3, a vacuum groove bottom plate support block 4, a cylinder 5, a right shell 6, a vacuum pressure gauge 7, a left shell 8, a linear bearing fixing plate 9, a vacuum groove bottom plate 10, a flexible sealing fixing ring 11, a flexible sealing member 12, a wafer support column 13, a wafer 14, a proximity sensor 15, an air path plug 16, a vacuum air path channel 17, an air pipe joint vacuum interface 18, a vacuum annular air path groove 19, a vacuum air hole 20, a compressed air interface 21, an external vacuum interface 22 and a sealing groove 23.

[0029] like Figures 1 to 3As shown, in terms of specific structure, the supporting assembly includes the base plate 1, the vacuum tank base plate supporting block 4, the right outer shell 6 and the left outer shell 8; the guide column 2, the vacuum tank base plate supporting block 4, the cylinder 5 and the proximity sensor 15 are arranged on the base plate 1, and the vacuum tank base plate supporting block 4 is used to support the fixed vacuum tank base plate 10.

[0030] The lifting assembly includes the guide column 2, the linear bearing 3, the cylinder 5, the linear bearing fixing plate 9, the wafer support column 13 and the proximity sensor 15; the guide column 2 guides the linear bearing 3 to move in the up and down directions, the cylinder 5 body is fixedly connected to the base plate 1, the piston rod is fixedly connected to the linear bearing plate 9, and the wafer support column 13 and the linear bearing 3 are fixedly connected to the linear bearing plate 9.

[0031] The platform assembly includes the vacuum groove bottom plate 10, the flexible seal fixing ring 11, the flexible seal 12, the vacuum annular air path groove 19, the vacuum air hole 20 and the sealing groove 23; the sealing groove 23 is arranged on the vacuum groove bottom plate 10 at a position corresponding to the periphery of the wafer, the flexible seal 12 is fixed in the sealing groove 23 by the flexible seal fixing ring 11, and multiple groups of the vacuum annular air path grooves 19 and the vacuum air holes 20 are arranged in concentric circles from the center of the vacuum groove bottom plate 10 to the outside.

[0032] The air circuit assembly includes the vacuum pressure gauge 7, the air circuit plug 16, the vacuum air circuit channel 17, the air pipe joint vacuum interface 18, the compressed air interface 21 and the external vacuum interface 22; the air circuit plug 16 is arranged on both sides of the vacuum tank bottom plate 10, the vacuum air circuit channel 17 and the vacuum air hole 20 are interconnected, and the air pipe between the air pipe joint vacuum interface 18 and the external vacuum interface 22 is connected.

[0033] Combine the following Figures 1 to 4To further illustrate the specific adsorption working process of the present invention: when it is detected that the wafer 14 is approaching, the cylinder 5 drives the piston rod to extend, driving the linear bearing plate 9 and the wafer support column 13, so that the wafer support column 13 passes through the vacuum tank bottom plate 10 and rises to the top of the fixture table. After the wafer 14 that has been transmitted falls on the top of the wafer support column 13, the piston rod of the cylinder 5 retracts, and the wafer support column 13 descends carrying the wafer 14. During the descent of the wafer 14, it is received by the flexible seal 12. 4 and the flexible seal 12 adaptively contact and descend to form a closed space. When the wafer 14 descends to a certain height, it is sensed by the proximity sensor 15. The external vacuum interface 22 allows the external vacuum gas to enter the vacuum air passage 17 through the air pipe joint vacuum interface 18. The vacuum annular air passage 19 is connected to the vacuum air passage 17 through the vacuum air hole 20, thereby forming an integral air passage. After the vacuum is input, the wafer 14 is adsorbed on the upper surface of the vacuum chamber bottom plate 10, and then further combined with Figure 3 and Figure 4 It can be seen that since the flexible seal 12 is arranged in the sealing groove 23 and has a zigzag cross-section, when the wafer 14 is adsorbed on the upper surface of the vacuum tank bottom plate 10, under the action of the pressure difference between the upper and lower surfaces of the wafer 14, the flexible seal 12 retracts into the sealing groove 23 and supports the wafer 14 to be adsorbed on the vacuum tank bottom plate 10 to form a plane, so that the wafer 14 remains flat during the adsorption process.

[0034] It should be noted that in this embodiment, the cross-sectional shape of the sealing groove 23 is a rectangle, and the flexible sealing member 12 is specifically a rubber sealing ring with a zigzag cross-sectional shape. In other embodiments, the cross-sectional shape of the sealing groove 23 can also be an inverted trapezoid, and the cross-sectional shape of the flexible sealing member 12 can also be a V-shaped shape, depending on the thickness of the sealing material used and the required vacuum suction force.

[0035] To summarize, the test wafer adsorption device of the present invention, through the sealing groove added at the position of the vacuum groove bottom plate corresponding to the periphery of the wafer, the flexible sealing fixing ring and the flexible sealing member arranged in the sealing groove, and a plurality of groups of vacuum circular air path grooves and vacuum air holes arranged in concentric circles from the center of the vacuum groove bottom plate to the outside, enables the wafer to be fully adhered and adsorbed on the surface of the vacuum groove bottom plate, and the wafer will not have warping problems. While ensuring the flatness of the wafer, it also ensures the execution of subsequent wafer testing operations and the accuracy of the corresponding test results.

[0036] The above contents are further detailed descriptions of the present invention in combination with specific preferred embodiments, and the specific implementation of the present invention cannot be considered to be limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as belonging to the present invention.

Claims

1. A wafer testing adsorption device, comprising a lifting assembly, a supporting assembly, a gas path assembly and a platform assembly, characterized in that: The platform assembly comprises a vacuum groove bottom plate (10), a flexible sealing member fixing ring (11), a flexible sealing member (12) and a sealing groove (23); the sealing groove (23) is arranged at a position of the vacuum groove bottom plate (10) corresponding to the periphery of the wafer, the flexible sealing member fixing ring (11) and the flexible sealing member (12) are arranged in the sealing groove (23); when the wafer is placed, the air path assembly evacuates the space formed between the wafer and the vacuum groove bottom plate (10); under the action of the pressure difference between the upper and lower surfaces of the wafer, the flexible sealing member (12) completely supports the wafer to be adsorbed on the surface of the vacuum groove bottom plate (10), so that the wafer overcomes large warping and improves flatness.

2. The wafer testing adsorption device according to claim 1, characterized in that: The vacuum tank bottom plate (10) is also provided with a vacuum annular gas path groove (19) and a vacuum air hole (20). A plurality of groups of the vacuum annular gas path grooves (19) and the vacuum air holes (20) are connected to the gas path assembly and are arranged in concentric circles from the center of the vacuum tank bottom plate (10) to the outside.

3. The wafer testing adsorption device according to claim 2, characterized in that: The lifting assembly comprises a guide column (2), a linear bearing (3), a cylinder (5), a linear bearing fixing plate (9), a wafer supporting column (13) and a proximity sensor (15); one end of the linear bearing fixing plate (9) is connected to the linear bearing (3), and the other end is connected to the wafer supporting column (13).

4. The wafer testing adsorption device according to claim 3, characterized in that: The air circuit assembly comprises a vacuum pressure gauge (7), an air circuit plug (16), a vacuum air circuit channel (17), an air pipe joint vacuum interface (18), a compressed air interface (21) and an external vacuum interface (22); the vacuum air circuit channel (17) is in communication with the vacuum air hole (20).

5. The wafer testing adsorption device according to claim 4, characterized in that: The cross-sectional shape of the sealing groove (23) is an inverted trapezoid.

6. The wafer testing adsorption device according to claim 4, characterized in that: The cross-sectional shape of the sealing groove (23) is rectangular.

7. The wafer testing adsorption device according to claim 5 or 6, characterized in that: The flexible sealing element (12) is a rubber sealing ring.

8. The wafer testing adsorption device according to claim 7, characterized in that: The cross section of the flexible sealing member (12) is in a zigzag shape.

9. The wafer testing adsorption device according to claim 7, characterized in that: The cross section of the flexible sealing member (12) is in a V-shape.

10. A wafer testing system, comprising an adsorption force testing mechanism and an adhesion force testing mechanism, characterized in that: It also includes a wafer testing adsorption device as described in any one of claims 1-9.

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