A heat sink for semiconductors

Abstract

The present invention relates to the field of semiconductor radiators, and discloses a radiator for semiconductors, including a support. A number of heat dissipation fins are provided at the bottom of the support, and a heat dissipation fan is provided at the top of the support. One side of the front and back of the support is rotatably provided with a connecting rod, and a knob penetrates through the front of the connecting rod. An auxiliary structure is provided on one side of the two connecting rods. The auxiliary structure includes a housing. A ventilation groove is opened inside the housing, and a wind collecting groove is opened on one side of the inner wall of the housing. The radiator for semiconductors provided by the present invention has a housing. The housing can clean the dust at the gaps in the heat dissipation fins in a closed state. When the housing is in an open state, a part of the wind generated by the heat dissipation fan is borrowed through the wind blocking plate, so that the air outlet of the heat dissipation bottom plate assists the heat dissipation fins to dissipate heat quickly, and secondary heat dissipation assistance is carried out to accelerate the heat dissipation speed, achieving dual use of one housing, and the working mode can be freely switched according to the situation.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor radiators, and specifically relates to a radiator for semiconductors. Background Art

[0002] In the patent application with the application publication number CN203351580U, it includes: a heat sink, characterized in that: heat dissipation plates are arranged above and below the heat sink, the inside of the heat sink and the heat dissipation plates is a hollow structure that is interconnected, a circular tube communicating with the hollow structure is arranged on the heat dissipation plate, the circular tube is provided with a medium tube and an exhaust pipe, the medium tube is used to inject a refrigerating medium into the hollow structure, and the exhaust pipe is used to discharge the gas in the hollow structure. The advantages are: a semiconductor radiator with such a structure has the advantages of better heat dissipation effect and convenient use.

[0003] In the prior art including the above patent, in a common semiconductor radiator, in addition to the heat sink body, a fan needs to be installed to assist in heat dissipation. The fan rotates to discharge the heat absorbed by the heat sink to the outside. However, the suction of the fan is ultimately limited and cannot carry out more heat, and the suction will also suck in objects such as dust and flying debris into the heat sink. Since the space inside the heat sink is narrow, it is extremely easy to cause dust adhesion. After a large amount of dust accumulates, it will affect the heat dissipation effect of the heat sink. Even if it is manually disassembled and cleaned later, it will take a long time. Summary of the Invention

[0004] The problem to be solved by the present invention is that the temperature of the heat sink in the semiconductor radiator is relatively high, the single-fan heat dissipation efficiency is low, and it is easy to generate dust adhesion in the heat sink, which affects the heat dissipation performance.

[0005] To solve the above technical problems, the technical solution of the present invention is: a radiator for semiconductors, including a support, a plurality of heat dissipation fins are arranged at the bottom of the support, a heat dissipation fan is arranged at the top of the support, connecting rods are rotatably arranged on one side of the front and back of the support, a knob penetrates through the front of the connecting rod, and an auxiliary structure is arranged on one side of the two connecting rods;

[0006] The auxiliary structure includes a housing. A ventilation groove is provided inside the housing. An air collecting groove is provided on one side of the inner wall of the housing. A plurality of air guiding grooves are radially provided around the air collecting groove. One side of the ventilation groove is fixedly communicated with an air inlet. A moving block is slidably provided on the top of the housing. A limiting screw penetrates through the top of the moving block. An activity cover is fixedly provided on one side of the moving block. A through groove is provided on one side of the bottom of the activity cover, and the through groove is adapted to one of the ventilation grooves. A communicating pipe is fixedly communicated with the bottom of the inner wall of the housing. Inclined blocks are fixedly provided at the dead corners inside the housing. L-shaped sliding grooves are provided on the front and back of the inner wall of the housing. A wind blocking plate is fixedly provided on the top of the inner wall of the housing. The wind blocking plate is telescopic. Fixing screws penetrate through the front and back of the top of the wind blocking plate.

[0007] Preferably, a cleaning pipe penetrates through the inside of the heat dissipation fins. A stabilizing frame is fixedly provided on one side of the support, and the stabilizing frame is adapted to the cleaning pipe. The outer diameter of the cleaning pipe is the same as the inner diameter of the activity cover.

[0008] Preferably, a plurality of rotating rings are arranged at equal intervals in a straight line at the bottom of the cleaning pipe. Air holes are provided inside the rotating rings, and the air holes are fixedly communicated with the cleaning pipe. Cleaning heads are fixedly communicated with the outside of the rotating rings in a circumferential array.

[0009] Preferably, a blocking piece is fixedly provided on one side of the top of the support. A heat dissipation bottom plate is provided at the bottom of the support. A plurality of air outlet pipes are arranged in an array on the top of the heat dissipation bottom plate. A connecting pipe is fixedly communicated with one side of the heat dissipation bottom plate.

[0010] Compared with the prior art, the technical solution of the present invention has the following advantages:

[0011] (1) The support is provided with a housing that can switch between two forms. The housing can clean the dust in the gaps of the heat dissipation fins in a closed state. In the open state, the housing borrows a part of the wind generated by the heat dissipation fan through the wind blocking plate, so that the air outlet of the heat dissipation bottom plate assists the heat dissipation fins to dissipate heat quickly, and secondary heat dissipation assistance speeds up the heat dissipation speed. It can be used for two purposes with one housing, and the working mode can be freely switched according to the actual situation. An air collecting groove is provided inside the housing. The air collecting groove is used to better introduce the wind discharged by the heat dissipation fan into the ventilation groove in the closed state of the housing. In the closed state of the housing, it can be connected to the cleaning pipe. After being connected together, the concentrated larger wind will pass through the cleaning pipe and spray out from the cleaning head. The sprayed wind will drive the rotating ring to rotate, so that the dust in the intervals of the heat dissipation fins can be cleaned in a dead-angle-free manner, and the dust can be cleaned up to avoid the overall heat dissipation effect of the radiator being affected by excessive dust accumulation after long-term use;

[0012] (2) A heat dissipation bottom plate is provided at the bottom of the support. When the outer shell is normally open, the wind blocking plate can be telescopically opened to intercept a part of the wind. After the wind is introduced, it is conveyed to the bottom of the heat dissipation fins and discharged upward. Compared with the suction of the fan by itself and the active dissipation of the heat dissipation fins, the bottom diversion can make the heat dissipation fan more efficient, and the temperature of the heat dissipation fins can drop faster, improving the heat dissipation effect of the radiator for the second time. A blocking block is provided on one side of the connecting pipe on one side of the heat dissipation bottom plate. The connecting pipe will only be opened when the communicating pipe on the outer shell is docked with it. When the connecting pipe is detached from the communicating pipe, the communicating pipe will become closed again. Description of the Drawings

[0013] Figure 1 Schematic diagram of the overall structure of the present invention;

[0014] Figure 2 Front view schematic diagram of the heat dissipation fin structure of the present invention;

[0015] Figure 3 Schematic diagram of the closed state of the outer shell structure of the present invention;

[0016] Figure 4 Schematic diagram of the connecting rod structure of the present invention;

[0017] Figure 5 Schematic diagram of the auxiliary structure of the present invention;

[0018] Figure 6 Schematic diagram of the air inlet structure of the present invention;

[0019] Figure 7 Left view schematic diagram of the outer shell structure of the present invention;

[0020] Figure 8 Bottom view schematic diagram of the outer shell structure of the present invention;

[0021] Figure 9 Schematic diagram of the cleaning pipe structure of the present invention;

[0022] Figure 10 Schematic diagram of the rotating ring structure of the present invention;

[0023] Figure 11 Enlarged schematic diagram of the structure at A of the present invention;

[0024] Figure 12 Schematic diagram of the heat dissipation bottom plate structure of the present invention;

[0025] Figure 13 Schematic diagram of the internal structure of the outer shell of the present invention.

[0026] In the figure: 1, heat dissipation fins; 2, knob; 3, auxiliary structure; 301, fixing screw; 302, wind blocking plate; 303, housing; 304, movable cover; 305, moving block; 306, limit screw; 307, air guide groove; 308, air inlet; 309, inclined block; 310, connecting pipe; 311, air collecting groove; 312, sliding groove; 313, ventilation groove; 4, cooling fan; 5, cleaning pipe; 6, connecting rod; 7, blocking piece; 8, support; 9, stabilizing frame; 10, heat dissipation bottom plate; 11, air outlet pipe; 12, connecting pipe; 13, rotating ring; 14, cleaning head. Detailed implementation manners

[0027] To make the objectives, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. Apparently, the described embodiments are some, but not all, of the embodiments of the present disclosure. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present disclosure without creative efforts shall fall within the scope of protection of the present disclosure.

[0028] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure shall have the ordinary meanings understood by those of ordinary skill in the art to which the present disclosure pertains. The terms "including" or "comprising" and the like used in the present disclosure mean that the elements or items appearing before the term cover the elements or items listed after the term and their equivalents, without excluding other elements or items. The terms "connected" or "coupled" and the like are not limited to physical or mechanical connections, and may also include electrical connections, whether direct or indirect. The terms "upper", "lower", "left", "right", etc. are only used to indicate relative positional relationships, and when the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0029] As Figures 1 to 13 As shown, a radiator for a semiconductor provided by the present invention includes a support 8. A plurality of heat dissipation fins 1 are provided at the bottom of the support 8, a cooling fan 4 is provided at the top of the support 8, a connecting rod 6 is rotatably provided on one side of the front and back surfaces of the support 8, a knob 2 penetrates through the front of the connecting rod 6, and an auxiliary structure 3 is provided on one side of the two connecting rods 6;

[0030] The auxiliary structure 3 includes a housing 303. A ventilation groove 313 is formed inside the housing 303. A wind collecting groove 311 is formed on one side of the inner wall of the housing 303. A plurality of air guiding grooves 307 are radially formed around the wind collecting groove 311. An air inlet 308 is fixedly communicated with one side of the ventilation groove 313. A moving block 305 is slidably arranged on the top of the housing 303. A limit screw 306 penetrates through the top of the moving block 305. A movable cover 304 is fixedly arranged on one side of the moving block 305. A through groove is formed on one side of the bottom of the movable cover 304, and the through groove is adapted to one of the ventilation grooves 313. A connecting pipe 310 is fixedly communicated with the bottom of the inner wall of the housing 303. Inclined blocks 309 are fixedly arranged at the dead corners inside the housing 303. L-shaped sliding grooves 312 are formed on the front and back sides of the inner wall of the housing 303. The inclined blocks 309 can cooperate with the air guiding grooves 307 to gather the wind force into the wind collecting groove 311. A wind blocking plate 302 is fixedly arranged on the top of the inner wall of the housing 303. The wind blocking plate 302 is telescopic. Fixing screws 301 penetrate through the front and rear sides of the top of the wind blocking plate 302.

[0031] A cleaning pipe 5 penetrates through the inside of the heat dissipation fin 1. A stabilizing frame 9 is fixedly arranged on one side of the support 8, and the stabilizing frame 9 is adapted to the cleaning pipe 5. The outer diameter of the cleaning pipe 5 is the same as the inner diameter of the movable cover 304.

[0032] A plurality of rotating rings 13 are arranged at equal intervals in a linear shape at the bottom of the cleaning pipe 5. Air holes are formed in the rotating rings 13, and the air holes are fixedly communicated with the cleaning pipe 5. Cleaning heads 14 are fixedly communicated with the outside of the rotating rings 13 in a circumferential array.

[0033] A blocking piece 7 is fixedly arranged on one side of the top of the support 8. A heat dissipation bottom plate 10 is arranged at the bottom of the support 8. A plurality of air outlet pipes 11 are arrayed on the top of the heat dissipation bottom plate 10. A connecting pipe 12 is fixedly communicated with one side of the heat dissipation bottom plate 10.

[0034] Working principle and usage process of the present invention: When the user needs to perform auxiliary heat dissipation during the normal use of the heat dissipation fins 1 for heat dissipation, the knob 2 can be rotated and loosened first. After loosening, the outer shell 303 is rotated with the rotation connection point of the connecting rod 6 and the support 8 as the center. The outer shell 303 is rotated and opened by 90 degrees. After opening, the knob 2 is rotated and tightened, so that the chute 312 in the outer shell 303 moves along the connecting rod 6. After moving to the final position, the outer shell 303 is in a vertical state and the connecting pipe 310 at the bottom will be docked with the connecting pipe 12, and the blocking block on one side of the connecting pipe 12 will be pushed open, so that the connecting pipe 310 and the connecting pipe 12 are interconnected. Then, the fixing screw 301 is rotated and loosened, and after loosening, the wind blocking plate 302 is pulled outwards. After pulling out, it is tightened again. Then, the cooling fan 4 can be normally started. After the cooling fan 4 is started, the temperature in the heat dissipation fins 1 will be discharged outwards. The wind generated by the cooling fan 4 will be intercepted and blocked by the wind blocking plate 302. The blocked wind will be introduced into the outer shell 303 and enter the air inlet 308. At this time, since the movable cover 304 is in a closed state, one of the ventilation grooves 313 is in a closed state. The air flow entering the air inlet 308 will be discharged from the other ventilation groove 313. The discharged wind will enter the heat dissipation bottom plate 10 and finally be discharged outwards from the air outlet pipe 11. The discharged wind can accelerate the discharge of the heat of the heat dissipation fins 1 itself, and cooperate with the cooling fan 4 to perform heat dissipation treatment with higher efficiency. After long-term use, when there is a lot of dust residue in the gaps of the heat dissipation fins 1 and the heat dissipation efficiency is affected, the outer shell 303 can be rotated back to directly above the support 8 and covered downwards. When covering, the blocking piece 7 will block the connecting pipe 310. At this time, the movable cover 304 on the other side of the outer shell 303 will be exactly directly above the cleaning pipe 5. Then, the limit screw 306 is loosened, and the moving block 305 is pushed downwards. While the movable cover 304 is docked with the cleaning pipe 5, the through groove on the back of the movable cover 304 is interconnected with the ventilation groove 313 on the other side of the outer shell 303. At this time, the wind generated by the cooling fan 4 will be centrally collected by the air collecting groove 311 and conveyed into the cleaning pipe 5. As the wind is input, the rotating ring 13 provided on the cleaning pipe 5 will be filled with strong wind. When the wind is compressed and discharged outwards from the cleaning head 14, it will drive the rotating ring 13 to rotate to form a rotating air flow. In this way, the dust in the gaps of the heat dissipation fins 1 can be quickly cleaned on a large area by this rotating air flow, avoiding the influence of dust on the heat dissipation effect.

[0035] The above embodiments are only exemplary embodiments of the present invention and are not used to limit the present invention. The protection scope of the present invention is defined by the claims. Those skilled in the art can make various modifications or equivalent replacements to the present invention within the essence and protection scope of the present invention, and such modifications or equivalent replacements should also be regarded as falling within the protection scope of the present invention.

Claims

1. A heat sink for a semiconductor, comprising a support (8), characterized in that: A plurality of heat dissipation fins (1) are provided at the bottom of the support (8), a heat dissipation fan (4) is provided at the top of the support (8), connecting rods (6) are rotatably provided on one side of the front and back sides of the support (8), a knob (2) passes through the front side of the connecting rod (6), and auxiliary structures (3) are provided on one side of the two connecting rods (6); The auxiliary structure (3) comprises a shell (303), a ventilation slot (313) is provided inside the shell (303), a wind collecting slot (311) is provided on one side of the inner wall of the shell (303), a plurality of wind guide slots (307) are radially provided around the wind collecting slot (311), one side of the ventilation slot (313) is fixedly connected to an air inlet (308), a moving block (305) is slidably provided on the top of the shell (303), a limiting screw (306) passes through the top of the moving block (305), and a movable cover (304) is fixedly provided on one side of the moving block (305). ), a through slot is provided on one side of the bottom of the movable cover (304), the through slot is matched with one of the ventilation slots (313), a connecting pipe (310) is fixedly connected to the bottom of the inner wall of the shell (303), a tilting block (309) is fixedly provided at each dead corner inside the shell (303), an L-shaped sliding slot (312) is provided on the front and back sides of the inner wall of the shell (303), a wind blocking plate (302) is fixedly provided on the top of the inner wall of the shell (303), the wind blocking plate (302) is telescopic, and fixing screws (301) are passed through the front and rear sides of the top of the wind blocking plate (302).

2. A heat sink for semiconductor according to claim 1, characterized in that: A cleaning tube (5) passes through the interior of the heat dissipation fin (1), a stabilizing frame (9) is fixedly provided on one side of the support (8), the stabilizing frame (9) is adapted to the cleaning tube (5), and the outer diameter of the cleaning tube (5) is the same as the inner diameter of the movable cover (304).

3. A heat sink for semiconductor according to claim 2, characterized in that: The bottom of the cleaning tube (5) is provided with a plurality of rotating rings (13) arranged equidistantly in a straight line, the rotating ring (13) is provided with air holes, the air holes are fixedly connected to the cleaning tube (5), and the outside of the rotating ring (13) is fixedly connected to a cleaning head (14) in a circular array.

4. A heat sink for semiconductor according to claim 1, characterized in that: A sealing plate (7) is fixedly provided on one side of the top of the support (8), a heat dissipation base plate (10) is provided on the bottom of the support (8), a plurality of air outlet pipes (11) are arranged in an array on the top of the heat dissipation base plate (10), and a connecting pipe (12) is fixedly connected to one side of the heat dissipation base plate (10).

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