Integrated intelligent isolation driver, solid state relay and high side switch

Abstract

The invention provides an integrated intelligent isolation driver, a solid-state relay and a high-side switch. The integrated intelligent isolation driver comprises a packaging frame, a PCB frame, a transformer, a primary side chip and a secondary side chip. The transformer is integrated on the PCB frame, the primary side chip and the secondary side chip are both arranged on the PCB frame, the PCB frame is packaged in the packaging frame, and the packaging frame comprises an input pin and an output pin; the input pin is connected with the primary side chip, the primary side chip is isolated from the secondary side chip through the transformer, and the secondary side chip is connected with the output pin; the primary side chip transmits an energy signal and an enable signal from the input pin to the secondary side chip through the transformer; the secondary side chip is used for receiving an energy signal and an enable signal, when the enable signal is at a high level, the output pin outputs a high level, and when the enable signal is at a low level, the output pin outputs a low level, and compared with an existing isolation driver structure, the isolation driver has the advantages that the design is simplified, the size is effectively reduced, and the manufacturing cost is reduced.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to an integrated intelligent isolation driver, a solid-state relay and a high-side switch. Background Art

[0002] An intelligent isolation driver is a special electronic component that can provide electrical isolation between input and output while enhancing the signal transmission capability and stability. This driver is usually used in situations that require high reliability and high precision, such as solid-state relays, high-side switches, and automation control. With the development of integrated circuits, isolation drivers are also moving towards miniaturization and integration. When using control chips as drivers for high-voltage and ultra-high-voltage intelligent control, there will be problems with the withstand voltage of process devices. Therefore, the use of isolated control methods can well solve the withstand voltage problem of devices.

[0003] In existing isolated drivers using inductors or capacitors, the primary side, the secondary side, and the inductor or capacitor module are usually separated into three independent hardware modules, and then the primary side and the secondary side capacitor or inductor are connected through conductive wires.

[0004] However, due to the presence of conductive wires and inductors or capacitors, the structure of the isolation driver is larger and the production cost is higher. Summary of the invention

[0005] The present invention provides an integrated intelligent isolation driver, a solid-state relay and a high-side switch, which are used to solve the defects of the isolation driver in the prior art that the isolation driver has a large structure and a high production cost.

[0006] On the one hand, the present invention provides an integrated intelligent isolation driver, comprising: a packaging frame, a PCB frame, a transformer, a primary side chip and a secondary side chip;

[0007] The transformer is integrated on the PCB frame, the primary chip and the secondary chip are both arranged on the PCB frame, the PCB frame is packaged inside the packaging frame, and the packaging frame includes an input pin and an output pin;

[0008] The input pin is connected to the primary chip, the primary chip is connected to the secondary chip via the transformer, and the secondary chip is connected to the output pin;

[0009] The primary chip transmits the energy signal and the enable signal from the input pin to the secondary chip through the transformer;

[0010] The secondary chip is used to receive the energy signal and the enable signal. When the enable signal is at a high level, the output pin outputs a high level, and when the enable signal is at a low level, the output pin outputs a low level.

[0011] According to an integrated intelligent isolation driver provided by the present invention, the transformer is integrated on the PCB frame to form a PCB transformer;

[0012] The substrate of the PCB transformer is a layered structure.

[0013] According to an integrated intelligent isolation driver provided by the present invention, the layered structure comprises: a first layer, a second layer, a third layer, a fourth layer and a fifth layer;

[0014] The first layer, the second layer, the third layer, the fourth layer and the fifth layer are arranged and distributed in sequence, and the transformer includes a primary coil and a secondary coil;

[0015] The first layer is used to protect the primary coil;

[0016] The second layer is used to set the primary coil;

[0017] The third layer is used to isolate the primary coil from the secondary coil;

[0018] The fourth layer is used to set the secondary coil;

[0019] The fifth layer is used to protect the secondary coil.

[0020] According to an integrated intelligent isolation driver provided by the present invention, the first layer, the second layer, the third layer and the fourth layer are all provided with through holes;

[0021] The through hole is used to connect the primary coil, the secondary coil, the primary chip and the secondary chip.

[0022] According to an integrated intelligent isolation driver provided by the present invention, materials of the first layer, the second layer, the third layer, the fourth layer and the fifth layer are all non-conductive materials, and the non-conductive materials are glass fiber boards or plastic substrates.

[0023] According to an integrated intelligent isolation driver provided by the present invention, the input pins include: a low-voltage power pin, an enable pin and a ground pin;

[0024] The output pins include a driving pin and a power pin;

[0025] The low voltage power supply pin is used to connect a low voltage power supply, the enable pin is used to input a voltage signal of 0V or 5V, and the ground pin is used to ground;

[0026] The driving pin and the power pin are used to control the on and off of an external device.

[0027] According to an integrated intelligent isolation driver provided by the present invention, the external device is a MOS tube;

[0028] The gate of the MOS tube is connected to the driving pin, the source of the MOS tube is connected to the power pin, the drain of the MOS tube is connected to the high-voltage power supply, and the MOS tube is also connected to a load.

[0029] According to an integrated intelligent isolation driver provided by the present invention, the primary chip and the secondary chip are arranged on the PCB frame through a detachable structure, and the detachable structure includes a connector.

[0030] On the other hand, the present invention further provides a solid-state relay, comprising the integrated intelligent isolation driver as described in any one of the above items.

[0031] In yet another aspect, the present invention further provides a high-side switch, comprising the integrated intelligent isolation driver as described in any one of the above items.

[0032] The present invention provides an integrated intelligent isolation driver, solid-state relay and high-side switch, comprising: a packaging frame, a PCB frame, a transformer, a primary chip and a secondary chip; the transformer is integrated on the PCB frame, the primary chip and the secondary chip are both arranged on the PCB frame, the PCB frame is packaged inside the packaging frame, and the packaging frame includes an input pin and an output pin; the input pin is connected to the primary chip, the primary chip is isolated from the secondary chip through a transformer, and the secondary chip is connected to the output pin; the primary chip transmits an energy signal and an enable signal from the input pin to the secondary chip through the transformer; the secondary chip is used to receive the energy signal and the enable signal, when the enable signal is at a high level, the output pin outputs a high level, and when the enable signal is at a low level, the output pin outputs a low level. Since the primary chip and the secondary chip are arranged on the PCB frame, the transformer is integrated on the PCB frame, and it is packaged inside the packaging frame, compared with the existing isolation driver structure, the design is simplified, the volume is effectively reduced, and the manufacturing cost is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0034] Figure 1 is a schematic diagram of the principle of an isolation driver provided by an embodiment of the present invention;

[0035] Figure 2It is a schematic structural diagram of a substrate of a PCB transformer provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] Figure 1 It is a schematic diagram of the principle of the isolation driver provided by an embodiment of the present invention.

[0038] like Figure 1 As shown, the integrated intelligent isolation driver provided in this embodiment includes: a packaging frame 1, a PCB frame 2, a transformer 3, a primary chip 4 and a secondary chip 5; the transformer 3 is integrated on the PCB frame 2, the primary chip 4 and the secondary chip 5 are both arranged on the PCB frame 2, the PCB frame 2 is packaged inside the packaging frame 1, and the packaging frame 1 includes an input pin and an output pin; the input pin is connected to the primary chip 4, the primary chip 4 is isolated from the secondary chip 5 through the transformer 3, and the secondary chip 5 is connected to the output pin; the primary chip 4 transmits the energy signal and the enable signal from the input pin to the secondary chip 5 through the transformer 3; the secondary chip 5 is used to receive the energy signal and the enable signal, when the enable signal is high level, the output pin outputs a high level, and when the enable signal is low level, the output pin outputs a low level.

[0039] In a specific implementation process, the transformer 3 is integrated on the PCB frame 2 to form a PCB transformer. The PCB transformer refers to the transformer 3 directly integrated on the substrate of the PCB. The primary chip 4 and the secondary chip 5 can be pasted on the surface of the PCB transformer, or they can be set on the surface of the PCB transformer in other ways. After the various components are connected by metal wires, they are packaged to form an integrated intelligent isolation driver. From the outside, the intelligent isolation driver has five pins, including three input pins and two output pins. The input pins are used to input control signals, and the output pins are used to output drive signals to the load. The drive signal is affected by the input control signal.

[0040] The input pin (VDD / EN / GND) is connected to the primary chip 4, the primary chip 4 is connected to the secondary chip 5 through the PCB transformer, and the secondary chip 5 is connected to the power MOS tube and the load L through the output pin (VSS / DRV), thereby forming a complete connection relationship. The PCB transformer is used to isolate the primary chip 4 and the secondary chip 5, the PAD output pin in the primary chip 4 is connected to the primary side (a1, a2) of the PCB transformer through a conductive wire, the PAD input pin of the secondary chip 5 is connected to the secondary side (b1, b2) of the PCB transformer through a conductive wire, the output pin of the final isolation driver is connected to the power MOS tube, the drive pin (DRV pin) is connected to the gate of the power MOS tube, the power pin (VSS pin) is connected to the source of the power MOS tube, and the power MOS tube is also connected to an external load device. The specific working process is that the low voltage VDD in the input pin is connected to the low voltage power supply, and the ground pin is grounded. When the enable signal EN is at a high level, the primary chip 4 transmits the energy signal and the enable signal to the secondary chip 5 through the PCB transformer. After the secondary chip 5 receives the energy signal and the enable signal, since the enable signal is high, the drive signal output by the secondary chip 5 is at a high level, and the high level at this time will drive the power tube. When the enable signal is at a low level, the drive signal outputs a low level signal, and the power tube will be turned off at this time. VCC refers to the power pin of the MOS tube, and L refers to the load.

[0041] The isolation of the primary chip 4 and the secondary chip 5 is achieved through the PCB transformer, and all three are arranged on the PCB frame 2, and the PCB frame 2 is arranged inside the packaging frame 1 to form an integrated structure. The entire integrated intelligent isolation driver has a simple structure, a small and flexible volume, and compared with the existing complex structure and large volume, it effectively reduces the volume and reduces the cost of production.

[0042] Working process of intelligent isolation driver: When the power supply VDD reaches the threshold voltage of the primary chip, the primary chip generates a high-frequency AC signal, and then rectifies or doubles the AC signal through the transformer coil to provide power for the secondary chip. When the secondary power supply obtains enough energy, the drive start threshold of the secondary chip is reached. When the EN enable signal becomes high, the drive signal also becomes high, and the power MOS tube is turned on. When the EN enable signal becomes low, the drive signal also becomes low, and the external power MOS tube is cut off.

[0043] The integrated intelligent isolation driver in this embodiment can directly drive the power MOS tube at the driving pin of the secondary chip 5 by inputting the logic high and low levels at the enable pin of the primary chip 4, without the need for an external control circuit. Compared with traditional photorelays and optocouplers, the isolation driver will not deteriorate in mechanical performance over time, and has higher reliability. In the integrated intelligent isolation driver, the primary chip 4, the secondary chip 5 and the transformer 3 are all arranged on the PCB frame 2, and the primary chip 4 and the secondary chip 5 are respectively connected to the transformer 3 by internal wiring, and finally the three modules are packaged together by a packaging process. Compared with the existing hardware construction method, the volume of the integrated intelligent isolation driver is greatly reduced, and it is more suitable for miniaturized occasions.

[0044] Further, based on the above embodiment, Figure 2 As shown, the transformer 3 in this embodiment is integrated on the PCB frame 2 to form a PCB transformer, and the substrate of the PCB transformer can be set as a layered structure. The layered structure includes: a first layer 31, a second layer 32, a third layer 33, a fourth layer 34 and a fifth layer 35; the first layer 31, the second layer 32, the third layer 33, the fourth layer 34 and the fifth layer 35 are arranged and distributed in sequence, and the transformer 3 includes a primary coil and a secondary coil; the first layer 31 is used to protect the primary coil; the second layer 32 is used to set the primary coil; the third layer 33 is used to isolate the primary coil and the secondary coil; the fourth layer 34 is used to set the secondary coil; the fifth layer 35 is used to protect the secondary coil, and the primary chip 4 and the secondary chip 5 are both set on the first layer 31.

[0045] Specifically, the first layer 31 and the fifth layer 35 are used to protect the coil of the transformer 3, while the primary coil is integrated in the second layer 32, the secondary coil is integrated in the fourth layer 34, and the third layer 33 is an isolation coil. The first layer 31 and the fifth layer 35 are mainly used to protect the primary coil and the secondary coil of the transformer 3 to prevent the exposure of the coils and cause chip failure. In order to ensure the effect between the layers, each layer is a non-conductive material, such as a glass fiber board or a plastic substrate.

[0046] Through holes are provided on the first to fourth layers 34, and the secondary coil of the fourth layer 34 is connected to the input PAD pin of the secondary chip 5 of the first layer 31 through the through hole, and the primary coil of the second layer 32 is connected to the output PAD pin of the primary chip 4 of the first layer 31 through the through hole. The layers are kept at a fixed distance or in close contact with each other by insulating materials. The PCB transformer formed by the integrated multi-layer structure is small in size, smart and convenient. Compared with the existing transformer 3, the transformer 3 set by the multi-layer structure effectively reduces the production cost in an integrated manner.

[0047] Further, on the basis of the above-mentioned embodiment, the primary chip 4 and the secondary chip 5 in this embodiment are arranged on the PCB frame 2 through a detachable structure, and the detachable structure includes a plug-in connector.

[0048] Specifically, the primary chip 4 and the secondary chip 5 are arranged on the PCB frame 2 in the form of a plug-in connector. When the primary chip 4 or the secondary chip 5 is damaged, it is easier to replace, and the plug-in connector is also easy to install. When different voltages need to be output, it can also be achieved by replacing the transformer 3. There is no need for a control circuit. Different PCB transformers are only set to different models to output different drive signals. Compared with the existing control circuit, the method is simpler and more reliable. When different output voltages are required, it can also be achieved by different models of intelligent isolation drivers.

[0049] Based on the same general inventive concept, the present invention also protects a solid-state relay, including the integrated intelligent isolation driver of any of the above embodiments.

[0050] Based on the same general inventive concept, the present invention also protects a high-side switch, including the integrated intelligent isolation driver of any of the above embodiments.

[0051] Whether in a high-side switch or a solid-state relay, the function of the intelligent isolation driver of the present invention is to provide a controllable drive signal to replace its original drive scheme. The external device can be a power MOS tube, a triode or a next-level drive circuit.

[0052] Through the description of the above implementation methods, those skilled in the art can clearly understand that each implementation method can be implemented by means of software plus a necessary general hardware platform, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solution is essentially or the part that contributes to the prior art can be embodied in the form of a software product, and the computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, a disk, an optical disk, etc., including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or some parts of the embodiments.

[0053] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An integrated intelligent isolation driver, characterized in that: include: Package frame, PCB frame, transformer, primary chip and secondary chip; The transformer is integrated on the PCB frame, the primary chip and the secondary chip are both arranged on the PCB frame, the PCB frame is packaged inside the packaging frame, and the packaging frame includes an input pin and an output pin; The input pin is connected to the primary chip, the primary chip is isolated from the secondary chip by the transformer, and the secondary chip is connected to the output pin; The primary chip transmits the energy signal and the enable signal from the input pin to the secondary chip through the transformer; The secondary chip is used to receive the energy signal and the enable signal. When the enable signal is at a high level, the output pin outputs a high level, and when the enable signal is at a low level, the output pin outputs a low level.

2. The integrated intelligent isolation driver according to claim 1, characterized in that: The transformer is integrated on the PCB frame to form a PCB transformer; The substrate of the PCB transformer is a layered structure.

3. The integrated intelligent isolation driver according to claim 2, characterized in that: The hierarchical structure includes: a first layer, a second layer, a third layer, a fourth layer and a fifth layer; The first layer, the second layer, the third layer, the fourth layer and the fifth layer are arranged and distributed in sequence, and the transformer includes a primary coil and a secondary coil; The first layer is used to protect the primary coil; The second layer is used to set the primary coil; The third layer is used to isolate the primary coil from the secondary coil; The fourth layer is used to set the secondary coil; The fifth layer is used to protect the secondary coil.

4. The integrated intelligent isolation driver according to claim 3, characterized in that: The first layer, the second layer, the third layer and the fourth layer are all provided with through holes; The through hole is used to connect the primary coil, the secondary coil, the primary chip and the secondary chip.

5. The integrated intelligent isolation driver according to claim 2, characterized in that: The materials of the first layer, the second layer, the third layer, the fourth layer and the fifth layer are all non-conductive materials, and the non-conductive materials are glass fiber boards or plastic substrates.

6. The integrated intelligent isolation driver according to any one of claims 1 to 5, characterized in that: The input pins include: a low voltage power supply pin, an enable pin and a ground pin; The output pins include a driving pin and a power pin; The low voltage power supply pin is used to connect a low voltage power supply, the enable pin is used to input a voltage signal of 0V or 5V, and the ground pin is used to ground; The driving pin and the power pin are used to control the on and off of an external device.

7. The integrated intelligent isolation driver according to claim 6, characterized in that: The external device is a MOS tube; The gate of the MOS tube is connected to the driving pin, the source of the MOS tube is connected to the power pin, the drain of the MOS tube is connected to the high-voltage power supply, and the MOS tube is also connected to a load.

8. The integrated intelligent isolation driver according to any one of claims 1 to 5, characterized in that: The primary chip and the secondary chip are arranged on the PCB frame through a detachable structure; the detachable structure includes a plug-in connector.

9. A solid-state relay, characterized in that: Comprising an integrated intelligent isolation driver as described in any one of claims 1-8.

10. A high-side switch, characterized in that: Comprising an integrated intelligent isolation driver as described in any one of claims 1-8.

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