Heat dissipation structure of LVDT displacement sensor based on micro-channel

By adopting a micro-channel-based heat dissipation structure in the LVDT displacement sensor, combined with the piezoelectric diaphragm to drive the circulating flow of the thermally conductive liquid and the aerosol cooling component, the problem of low heat dissipation efficiency of the sensor is solved, and efficient heat management and stable measurement performance are achieved.

CN119907218AActive Publication Date: 2025-04-29XI'AN UNIVERSITY OF ARCHITECTURE AND TECHNOLOGY
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Patent Information

Application Number
CN202510030424.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-01-08
Publication Date
2025-04-29
Estimated Expiration
2045-01-08

AI Technical Summary

Technical Problem

The existing LVDT displacement sensors have low heat dissipation efficiency during high temperatures, high loads or long-term operation, resulting in an increase in temperature rise, affecting linearity and measurement accuracy.

Method used

The heat dissipation structure based on microchannels is adopted, including the setting of micro heat dissipation channels in the skeleton, combined with a piezoelectric diaphragm to drive the circulation of thermally conductive liquids, and the use of aerosol cooling components and phase change heat absorption materials to achieve efficient heat conduction and release.

Benefits of technology

It effectively reduces the working temperature of the LVDT displacement sensor, stabilizes the magnetic performance of the coil, improves linearity and measurement accuracy, and enhances the working stability in high-temperature environments.

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Abstract

The invention relates to a heat dissipation structure of an LVDT displacement sensor based on a micro channel, which belongs to the technical field of sensors and comprises an outer shell, a framework, a coil, an iron core, the micro channel, a water tank and a piezoelectric diaphragm. The framework is arranged in the outer shell, the coil is arranged around the periphery of the framework, and the iron core is arranged on the inner side of the framework and can move in the axial direction of the framework; the micro channel is arranged on the inner side of the framework and surrounds the iron core; the water tank is arranged near one end of the framework; a liquid channel is formed in the micro channel and communicated with the water tank through the liquid channel; the piezoelectric diaphragm is arranged close to the water tank and used for driving the heat conduction liquid in the water tank to flow along the liquid channel. According to the LVDT displacement sensor, the miniature heat dissipation channel is arranged in the framework, the piezoelectric diaphragm is combined to drive the heat conduction liquid to circularly flow, heat can be effectively conducted and released to the external environment, and the performance and working stability of the LVDT displacement sensor in application occasions with high linearity requirements are improved.
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Description

Technical Field

[0001] The invention belongs to the technical field of sensors, and in particular relates to a heat dissipation structure of an LVDT displacement sensor based on a micro-channel. Background Art

[0002] In automation equipment and servo control systems, LVDT displacement sensors (Linear Variable Differential Transformer) are often used as the core sensor for displacement detection to ensure the closed-loop control accuracy of the system. In the actual application of LVDT displacement sensors, especially in high-precision measurements and complex working conditions, maintaining excellent linearity is the core requirement of sensor performance. However, temperature rise will have a significant impact on the linearity of LVDT displacement sensors, causing output characteristic offsets, which in turn affects measurement accuracy. In some high-temperature, high-load or long-term operating situations, such as servo systems, industrial automation equipment, and aerospace sensors, LVDT displacement sensors not only need to maintain precise linear output, but also need to effectively solve the problem of large-scale heat dissipation to ensure stability and reliability. The main factors that cause the temperature rise of LVDT displacement sensors include two aspects: one is the Joule heat generated by the coil being energized; the other is the superposition of the external ambient temperature. The temperature rise will not only affect the magnetic flux distribution of the coil, thereby reducing the linearity of the sensor, but may also damage the internal insulation material, accelerate aging, and even cause failures. Therefore, improving heat dissipation performance and alleviating the problem of heat accumulation caused by heat dissipation limitations have become key links in improving the accuracy and linearity of LVDT displacement sensors.

[0003] Due to the compact internal structure of the LVDT displacement sensor, including key components such as coils, cores and skeletons, the internal space is usually very limited. Therefore, the existing heat dissipation methods all set the heat dissipation structure on the sensor housing or directly on the outside of the sensor. The heat dissipation structure is set on the sensor housing mainly through the high-pressure oil flow channel, and the oil inlet and outlet pipes guide the liquid to flow inside the sensor. After absorbing heat, the oil takes away the heat through the external circulation system to achieve the heat dissipation effect. However, its design is complex, requiring additional inlet and outlet oil pipes, oil holes and high-pressure pumps and other equipment, with high manufacturing and assembly costs, and over-reliance on the stability of the external oil circulation system. Once the system fails, the heat dissipation efficiency will drop significantly. At the same time, long-term operation under high pressure is prone to problems such as oil leakage and seal aging, which increases the difficulty of maintenance and safety hazards. Most importantly, since this solution relies entirely on oil to conduct heat, the heat needs to pass through the wire package assembly, housing and other insulation layers before it can be taken away by the oil, resulting in low heat dissipation efficiency. In another solution of setting up an independent heat sink externally, a support frame magnet fixed to the surface of the LVDT displacement sensor and a fan magnetically fixed to the support frame magnet are used to achieve heat dissipation. The heat sink uses the wind of the fan to take away the heat generated by the internal winding of the LVDT displacement sensor, but first of all, the fan heat dissipation efficiency is limited, and the heat accumulation effect for high power or long-term operation is poor, especially in high temperature or closed environment. It is difficult to meet the heat dissipation requirements; secondly, the magnetic fixation method may cause the fan to shift or fall off under vibration or impact environment, and the reliability is insufficient. In addition, as a mechanical component, the fan is susceptible to dust and moisture and malfunctions, which increases the maintenance frequency and cost. More importantly, the support frame magnet may generate a magnetic field around the sensor, interfering with the normal operation of the LVDT displacement sensor and affecting the signal accuracy.

[0004] The Joule heat generated by the coil during the operation of the LVDT displacement sensor is the main heat source that causes the temperature rise. As the current continues to pass, the coil will inevitably release a large amount of heat due to the resistance effect. This heat not only directly affects the temperature distribution inside the sensor, but may also have an adverse effect on surrounding components through heat conduction. Since the heat dissipation efficiency of existing heat dissipation solutions is generally low, it is difficult to meet the temperature stability requirements of high-precision measurements. Therefore, an LVDT displacement sensor with high heat dissipation efficiency and reliable operation is needed. Summary of the invention

[0005] In order to solve the above problems existing in the prior art, the present invention provides a heat dissipation structure of an LVDT displacement sensor based on a micro-channel. The technical problem to be solved by the present invention is achieved through the following technical solutions:

[0006] The present invention provides a heat dissipation structure of an LVDT displacement sensor based on a microchannel, comprising: an outer shell, a frame, a coil, an iron core, a microchannel, a water tank, and a piezoelectric diaphragm; wherein the frame is arranged in the outer shell, a coil is arranged around the outer periphery of the frame, the iron core is arranged on the inner side of the frame and can move along its axial direction; the microchannel is arranged on the inner side of the frame and around the iron core; the water tank is arranged near one end of the frame; a liquid channel is formed in the microchannel, and is connected to the water tank through the liquid channel; the piezoelectric diaphragm is arranged near the water tank, and is used to drive the heat-conducting liquid in the water tank to flow along the liquid channel.

[0007] In one embodiment of the present invention, the inner surface of the microchannel is provided with a hydrophilic coating; the material of the hydrophilic coating includes: polyvinyl alcohol, polyethylene glycol, polyacrylamide, silicon dioxide nanoparticles or titanium oxide.

[0008] In one embodiment of the present invention, a one-way valve is provided between the water outlet of the water tank and the micro channel.

[0009] In one embodiment of the present invention, the heat dissipation structure of the LVDT displacement sensor based on the micro-channel also includes: two insulating partitions and two flanges, the two insulating partitions are respectively arranged at the two ends of the skeleton and are respectively connected to the outer shell; the two flanges are respectively connected to the two insulating partitions; the water tank is arranged on one of the flanges.

[0010] In one embodiment of the present invention, elastic damping materials are provided between the piezoelectric diaphragm and the water tank, and between the water tank and the flange.

[0011] In one embodiment of the present invention, the heat dissipation structure of the LVDT displacement sensor based on the micro-channel further includes: a plurality of connectors; both ends of each of the connectors are arranged perpendicular to each other and are respectively connected to the frame and the insulating partition.

[0012] In one embodiment of the present invention, the heat dissipation structure of the LVDT displacement sensor based on the micro-channel also includes: a guide rod; the guide rod is arranged at one end of the outer shell; the iron core is coaxially arranged with the guide rod, and the iron core is slidably connected with the guide rod.

[0013] In one embodiment of the present invention, an interlayer is provided in the skeleton, and the interlayer is filled with a phase change heat absorbing material.

[0014] In one embodiment of the present invention, the micro-channel-based LVDT displacement sensor heat dissipation structure further includes: an aerosol cooling component; the aerosol cooling component includes: an aerosol nozzle and a guide plate; wherein the aerosol nozzle is arranged on one side of the outer shell for spraying cooling aerosol; the outer shell is provided with a plurality of exhaust holes, and a plurality of the guide plates are correspondingly arranged near the plurality of the exhaust holes for guiding the flow direction of the cooling aerosol.

[0015] In one embodiment of the present invention, the guide plate is made of shape memory alloy and expands when the temperature rises.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] The heat dissipation structure of the LVDT displacement sensor based on micro-channels of the present invention is provided with a micro-heat dissipation channel in the frame. The micro-heat dissipation channel is arranged close to the coil and is combined with a piezoelectric diaphragm to drive the circulation of the heat-conducting liquid, which can effectively conduct and release the heat to the external environment. By closely combining the heat dissipation structure with the main structure of the LVDT displacement sensor, the volume and weight of the LVDT displacement sensor are reduced, and the applicability is also improved. At the same time, not only the operating temperature of the LVDT displacement sensor is greatly reduced, but also the magnetic properties of the coil can be stabilized, thereby improving the performance and working stability of the LVDT displacement sensor in applications with high linearity requirements.

[0018] The present invention fills the interior of the skeleton with a phase change endothermic material. After reaching the phase change temperature of the phase change endothermic material, the phase change endothermic material absorbs a large amount of heat during phase change, thereby effectively reducing the temperature fluctuation inside the LVDT displacement sensor, so that the LVDT displacement sensor always works within a stable temperature range; the long-term stability and measurement accuracy of the LVDT displacement sensor are improved, and the influence of temperature changes on the working performance is reduced.

[0019] The present invention is provided with an aerosol cooling component. By designing the aerosol cooling component in the LVDT displacement sensor, cooling aerosol and ventilation channels are formed, and combined with the circulation of heat-conducting liquid in the microchannel, temperature management inside the LVDT displacement sensor is achieved, so that the LVDT displacement sensor can still maintain working stability in a high temperature environment, avoiding the influence of overheating on measurement accuracy.

[0020] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following specifically cites a preferred embodiment and describes it in detail with the accompanying drawings as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 Schematic diagram of a heat dissipation structure of a LVDT displacement sensor based on a micro-channel provided in an embodiment of the present invention;

[0022] Figure 2 is a cross-sectional view of a heat dissipation structure of an LVDT displacement sensor based on a micro-channel provided in an embodiment of the present invention;

[0023] Figure 3 is a cross-sectional view of another micro-channel-based LVDT displacement sensor heat dissipation structure provided by an embodiment of the present invention;

[0024] Figure 4 is a cross-sectional view of another micro-channel-based LVDT displacement sensor heat dissipation structure provided by an embodiment of the present invention;

[0025] Figure 5 The embodiment of the present invention provides Figure 4 Schematic diagram of the working process of the LVDT displacement sensor;

[0026] Figures 6a to 6c They are schematic diagrams of the structures of micro heat dissipation channels provided in embodiments of the present invention.

[0027] Icons: 1-outer shell; 2-skeleton; 3-coil; 4-iron core; 5-microchannel; 6-water tank; 7-piezoelectric diaphragm; 8-insulating partition; 9-flange; 10-connector; 11-guide rod; 12-phase change heat absorbing material; 13-aerosol nozzle; 14-guide plate. DETAILED DESCRIPTION

[0028] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the following is a detailed description of a heat dissipation structure of an LVDT displacement sensor based on a micro-channel proposed by the present invention in combination with the accompanying drawings and specific implementation methods.

[0029] The above and other technical contents, features and effects of the present invention are clearly presented in the following detailed description of the specific implementation modes in conjunction with the accompanying drawings. Through the description of the specific implementation modes, the technical means and effects adopted by the present invention to achieve the predetermined purpose can be more deeply and specifically understood. However, the attached drawings are only for reference and explanation purposes and are not used to limit the technical solutions of the present invention.

[0030] Embodiment 1

[0031] Since the internal space of the LVDT is usually very limited, the cooling structure may occupy the space of key components, making it difficult to balance performance and heat dissipation requirements in the design. In view of this, the present embodiment provides a micro-channel-based LVDT displacement sensor heat dissipation structure.

[0032] like Figure 1 and Figure 2 As shown, Figure 1 Schematic diagram of a heat dissipation structure of a LVDT displacement sensor based on a micro-channel provided in an embodiment of the present invention; Figure 2 It is a cross-sectional view of a heat dissipation structure of a LVDT displacement sensor based on a micro-channel provided in an embodiment of the present invention.

[0033] In this embodiment, the heat dissipation structure of the LVDT displacement sensor based on the microchannel includes: an outer shell 1, a skeleton 2, a coil 3, an iron core 4, a microchannel 5, a water tank 6, and a piezoelectric diaphragm 7; wherein the skeleton 2 is arranged in the outer shell 1, the coil 3 is arranged around the outer periphery of the skeleton 2, the iron core 4 is arranged on the inner side of the skeleton 2 and can move along its axial direction; the microchannel 5 is arranged on the inner side of the skeleton 2 and around the iron core 4; the water tank 6 is arranged near one end of the skeleton 2; a liquid channel is formed in the microchannel 5, and is connected to the water tank 6 through the liquid channel; the piezoelectric diaphragm 7 is arranged near the water tank 6, and is used to drive the heat-conducting liquid in the water tank 6 to flow along the liquid channel.

[0034] The principle is that the LVDT displacement sensor measures displacement based on the principle of magnetic induction. First, an excitation is introduced into the coil 3. When displacement is generated externally, the core 4 moves to achieve displacement measurement. During operation, the heat generated by the coil 3 needs to be conducted and dissipated. The piezoelectric diaphragm 7 generates periodic vibrations, which change the pressure of the heat-conducting liquid in the water tank 6, thereby pushing the heat-conducting liquid to flow to the microchannel 5. A liquid channel is provided in the microchannel 5, and the heat-conducting liquid circulates in the microchannel 5, thereby taking away the heat generated by the coil 3 and accumulated inside the skeleton 2, reducing the temperature rise of the LVDT displacement sensor.

[0035] Exemplarily, the inner diameter of the liquid channel of the microchannel 5 can be set to range from 0.5 mm to 2 mm to ensure that the heat-conducting liquid has a sufficient flow rate when flowing, avoid excessive friction loss, and ensure continuous circulation.

[0036] Exemplarily, the heat transfer liquid may be a water-based coolant or a non-aqueous coolant, such as a fluorinated liquid and a nanofluid coolant.

[0037] It is worth noting that by arranging the microchannel 5 inside the frame 2, no additional volume or weight is added, and the device has wide applicability. In addition, the heat-conducting liquid circulates along the liquid channel, thereby improving the cooling effect of the heat generated by the coil 3.

[0038] In an optional embodiment, a conduit is further connected between the water tank 6 and the microchannel 5. The conduit is arranged outside the skeleton 2, led out from the water tank 6, and connected to the microchannel 5 at the other end. An adjustable clamp is arranged at the pipeline interface between the conduit and the water tank 6, the water tank 6 and the microchannel 5, and the microchannel 5 and the conduit, and a firm fixation can be achieved through the clamp to prevent the connection from loosening. The separate arrangement of the conduit is also conducive to observing and adjusting the connection status from the outside of the skeleton 2, especially for the connection of microchannels 5 of different shapes.

[0039] like Figures 6a to 6c As shown, Figures 6a to 6c They are schematic diagrams of the structures of micro heat dissipation channels provided in embodiments of the present invention.

[0040] It should be noted that the shape of the microchannel 5 can be in various forms, and the present invention is not limited thereto.

[0041] For example, Figure 6a As shown, the microchannel 5 is a diamond grid, which is composed of a plurality of interlaced channel tubes forming a cylindrical structure, wherein the interlaced channel tubes are surrounded to form a diamond grid. The interior thereof can be divided into four parts, each of which forms a flow path, each flow path is led out by a channel tube, and the four channel tubes are finally gathered on a conduit, and connected to the water tank 6 through the conduit, and the diamond grids inside the microchannel 5 are also interconnected.

[0042] It is worth noting that by setting the microchannel 5 in a diamond grid shape, the four parts can achieve dispersed heat dissipation through the corresponding channel tubes, and the diamond grids inside the microchannel 5 can also be interconnected for cooling, so that multiple parts can exchange heat in parallel, reducing the heat load of a single channel and improving the overall cooling and heat exchange efficiency. At the same time, setting the microchannel 5 in a diamond grid shape also has the effect of evenly distributing the heat dissipation area. By dispersing the flow of the heat-conducting liquid through four channel tubes, it can ensure that the heat-conducting liquid flows evenly throughout the system, avoiding local overheating or uneven cooling. It helps to manage heat more efficiently in micro heat dissipation systems, especially in application scenarios where frequent temperature adjustment is required.

[0043] For example, Figure 6b As shown, the microchannel 5 is honeycomb-shaped, with internal intervals forming a plurality of long channels, a hexagonal honeycomb structure is provided between adjacent channels, and the honeycomb structures are interconnected with the long channels; each long channel is divided into 5 parts, and five channel tubes are respectively connected to each other, and are cooled at the same time, and the five channel tubes are finally gathered into one conduit, and the plurality of conduits can be combined into two main conduits and connected to the water tank 6 at the same time.

[0044] It is worth noting that setting the microchannel 5 in a honeycomb shape can effectively increase the flow path of the fluid, enhance the thermal conductivity of the fluid, and make the flow of the heat-conducting liquid in the liquid channel more uniform, so that the heat is evenly distributed. The heat-conducting liquid is evenly distributed in each hexagonal honeycomb structure, which improves the uniformity of heat exchange. In the heat dissipation system, uniform flow can effectively avoid heat concentration in a certain position, thereby reducing the thermal stress caused by the temperature difference. At the same time, it can also enhance the miscibility of the fluid. The interaction between the long strip channels and the hexagonal units in the honeycomb structure will increase the turbulent effect of the fluid, thereby improving the heat transfer efficiency of the heat-conducting liquid, which is suitable for application scenarios with complex thermal management requirements.

[0045] For example, Figure 6c As shown, the micro channel 5 is mesh-shaped, and the micro channel 5 and the skeleton 2 can be designed into an hourglass shape. This structure helps to improve the linearity of the LVDT and can also optimize the heat dissipation effect of the coil 3.

[0046] In an optional embodiment, a one-way valve is provided between the water outlet of the water tank 6 and the micro-channel 5 to ensure that the heat-conducting liquid in the micro-channel 5 flows in one direction without backflow.

[0047] In an optional embodiment, a one-way valve may also be disposed between the water return port of the water tank 6 and the micro-channel 5, which also serves to prevent the heat transfer liquid from flowing back.

[0048] It is worth noting that by setting a one-way valve, the heat-conducting liquid flows into the microchannel 5 in one direction to perform heat exchange cooling on the coil 3. Specifically, the one-way valve prevents the heat-conducting liquid from flowing back due to the reverse vibration of the piezoelectric diaphragm 7, and the other end of the microchannel 5 is connected to the water return port of the water tank 6, thereby forming a cooling cycle.

[0049] Exemplarily, the piezoelectric diaphragm 7 is installed on the water tank 6, which is provided with a diaphragm that can deform under the stimulation of alternating voltage. The diaphragm is installed in a closed cavity or water chamber, and can effectively compress and release the heat-conducting liquid to directly or indirectly affect the heat-conducting liquid in the water tank 6 through the deformation of the diaphragm.

[0050] Further, the piezoelectric diaphragm 7 is mounted on the top or bottom of the water tank 6 and fixed by bolts, and the central portion of the diaphragm is in direct contact with the water tank 6 to transmit pressure changes through the vibration of the diaphragm.

[0051] The working principle of the piezoelectric diaphragm 7 is that by applying an alternating voltage to it, the diaphragm of the piezoelectric diaphragm 7 is bent and deformed. When the diaphragm bends inward, it compresses the heat-conducting liquid in the water tank 6 to generate pressure; when the diaphragm bends outward, the pressure is released, the pressure in the water tank 6 is reduced, and the one-way valve is closed to prevent the heat-conducting liquid from flowing back. By continuously applying an alternating voltage and generating deformation, the diaphragm periodically drives the heat-conducting liquid in the water tank 6 to vibrate, forming a pulsed pressure wave, thereby pushing the heat-conducting liquid to circulate in the microchannel 5.

[0052] Exemplarily, after the liquid in the water tank 6 enters the microchannel 5 through the one-way valve, a hydrophilic coating may be provided on the inner surface of the microchannel 5 to improve the fluidity of the heat-conducting liquid.

[0053] For example, a hydrophilic material, such as a polymer material: polyvinyl alcohol (PVA), polyethylene glycol (PEG), polyacrylamide (PAM); or an inorganic material: silicon dioxide (SiO 2 ) nanoparticles, titanium oxide (TiO 2 ) is dissolved in a solvent, and then the microchannel 5 is immersed in the solution, allowing the coating to naturally deposit on the surface of the liquid channel. The use of a hydrophilic coating can significantly reduce the surface tension of the liquid, making it easier for the heat-conducting liquid to spread and flow on the inner wall of the channel. Since the flow of liquid is greatly affected by surface tension, the use of a hydrophilic coating can increase the wettability of the liquid on the surface, promote the smooth flow of the heat-conducting liquid along the liquid channel, and reduce stagnation or uneven flow.

[0054] In an optional embodiment, the heat dissipation structure of the LVDT displacement sensor based on the micro-channel also includes: two insulating partitions 8 and two flanges 9, the two insulating partitions 8 are respectively arranged at the two ends of the skeleton 2 and are respectively connected to the outer shell 1; the two flanges 9 are respectively connected to the two insulating partitions 8; the water tank 6 is arranged on one of the flanges 9.

[0055] It is worth noting that since the piezoelectric diaphragm 7 may cause weak magnetic field changes when vibrating, especially when current passes through the driving electrode of the piezoelectric diaphragm 7, the insulating partition 8 uses insulating material to reduce the interference of the magnetic field on the normal operation of the LVDT displacement sensor.

[0056] In an optional embodiment, there are several connecting members 10; the several connecting members 10 are all L-shaped, and both ends of each connecting member 10 are perpendicular to each other and are respectively connected to the frame 2 and the insulating partition 8.

[0057] The principle is that two insulating baffles 8 are arranged at intervals on the inner side of the outer shell 1, and a cavity is arranged in the middle of each insulating baffle 8 to form a clamping structure, and two flanges 9 are respectively embedded in the cavities in the middle of the two insulating baffles 8. At the same time, the frame 2 and the insulating baffle 8 are fixed as a whole through the L-shaped connector 10, and the stability of the frame 2 is ensured through mechanical fixation, avoiding the position of the frame 2 from being offset due to vibration or external interference, and realizing the stable installation and precise positioning of the frame 2, so as to ensure that the LVDT can maintain a precise measurement position during operation.

[0058] In an optional embodiment, a sealing gasket, such as a silicone gasket or a rubber gasket, can be provided at the connection between the piezoelectric diaphragm 7 and the water tank 6 to achieve sealing. At the same time, the sealing gasket is provided at the joint where the diaphragm and the water tank 6 contact, which also plays a role in avoiding the influence of the vibration of the piezoelectric diaphragm 7 on the water tank 6 and the external environment, which is conducive to improving the measurement accuracy.

[0059] Furthermore, elastic damping materials are provided between the piezoelectric diaphragm 7 and the water tank 6 , and between the water tank 6 and the flange 9 .

[0060] For example, the elastic damping material may be silicone rubber or polyurethane.

[0061] Exemplarily, an elastic vibration isolation support, such as a spring or a rubber pad, may be used to suspend the water tank 6 on the flange 9 to achieve a vibration reduction effect.

[0062] Specifically, a damping layer is formed by a sealing gasket or an elastic damping material, which can absorb the excess energy generated by the vibration of the diaphragm. The damping layer is designed on the vibration transmission path, such as between the piezoelectric diaphragm 7 and the water tank 6, between the water tank 6 and the flange 9, or an elastic vibration isolation support is used to suspend the water tank 6, such as a spring or a rubber pad, to reduce the path of vibration transmission to the outside. At the same time, by adjusting the size, thickness or driving voltage frequency of the diaphragm of the piezoelectric diaphragm 7 to avoid the diaphragm operating frequency from coinciding with the resonant frequency of the water tank 6 or the surrounding structure, the vibration reduction effect can also be achieved.

[0063] Furthermore, multiple small-sized diaphragms can be used instead of a large-sized diaphragm to disperse the vibration source and achieve synchronous drive through phase control to further reduce the overall amplitude of the system, thereby keeping the vibration direction of the piezoelectric diaphragm 7 and the water tank 6 stable.

[0064] In an optional embodiment, the heat dissipation structure of the LVDT displacement sensor based on the micro-channel also includes: a guide rod 11; the guide rod 11 is arranged at one end of the outer shell 1; the iron core 4 and the guide rod 11 are coaxially arranged, and the iron core 4 and the guide rod 11 are slidably connected, that is, the iron core 4 and the guide rod 11 can slide relative to each other.

[0065] The principle is that a sleeve-type connection structure is formed between the iron core 4 and the guide rod 11, one end of the guide rod 11 is fixed to the outer shell 1, and the other end is slidably connected to the iron core 4. Guided by the guide rod 11, the iron core 4 can move freely and smoothly along the guide rod 11 to achieve displacement measurement, thereby ensuring the measurement accuracy of the LVDT displacement sensor. Furthermore, the contact surface between the iron core 4 and the guide rod 11 is coated with a low-friction material to reduce friction and ensure smooth movement of the iron core 4.

[0066] The heat dissipation structure of the LVDT displacement sensor based on micro-channels of the present invention is provided with a micro-heat dissipation channel in the frame. The micro-heat dissipation channel is arranged close to the coil and is combined with a piezoelectric diaphragm to drive the circulation of the heat-conducting liquid, which can effectively conduct and release the heat to the external environment. By closely combining the heat dissipation structure with the main structure of the LVDT displacement sensor, the volume and weight of the LVDT displacement sensor are reduced, and the applicability is also improved. At the same time, not only the operating temperature of the LVDT displacement sensor is greatly reduced, but also the magnetic properties of the coil can be stabilized, thereby improving the performance and working stability of the LVDT displacement sensor in applications with high linearity requirements.

[0067] Embodiment 2

[0068] like Figure 3 As shown, Figure 3 It is a cross-sectional view of another micro-channel-based LVDT displacement sensor heat dissipation structure provided in an embodiment of the present invention.

[0069] The difference between this embodiment and the first embodiment is that an interlayer is provided in the skeleton 2 , and the interlayer is filled with a phase change heat absorbing material 12 .

[0070] Exemplarily, the phase change heat absorbing material 12 may be paraffin, stearic acid or other organic phase change materials suitable for medium and low temperature ranges.

[0071] Exemplarily, the phase change heat absorbing material 12 may be paraffin wax, which has a relatively low melting point, is suitable for a working environment of about 40° C., and has a good heat storage capacity.

[0072] Exemplarily, the phase change endothermic material 12 may also be docosane (C22H46), which is an alkane organic phase change material and also has a low melting point and good heat storage capacity.

[0073] The principle is that under normal use conditions, the temperature inside the LVDT displacement sensor is usually maintained in the range of room temperature to 50 degrees Celsius. In order to effectively control the internal temperature of the LVDT displacement sensor and avoid overheating, the phase change temperature of the phase change endothermic material 12 can be set to 40 degrees Celsius. The phase change endothermic material 12 absorbs a large amount of heat when the temperature reaches its phase change temperature, thereby effectively reducing the temperature fluctuation inside the LVDT displacement sensor. After the temperature drops, the phase change endothermic material 12 can also return to its original state. By setting the phase change endothermic material 12, the LVDT displacement sensor always works within a stable temperature range, which improves the long-term stability and measurement accuracy of the LVDT displacement sensor, while reducing the impact of temperature changes on performance.

[0074] The present invention fills the interior of the skeleton with a phase change endothermic material. After reaching the phase change temperature of the phase change endothermic material, the phase change endothermic material absorbs a large amount of heat during phase change, thereby effectively reducing the temperature fluctuation inside the LVDT displacement sensor, so that the LVDT displacement sensor always works within a stable temperature range; the long-term stability and measurement accuracy of the LVDT displacement sensor are improved, and the influence of temperature changes on the working performance is reduced.

[0075] Embodiment 3

[0076] like Figure 4 As shown, Figure 4 It is a cross-sectional view of another micro-channel-based LVDT displacement sensor heat dissipation structure provided in an embodiment of the present invention.

[0077] The difference between this embodiment and the first or second embodiment is that an aerosol cooling assembly is provided; the aerosol cooling assembly includes: an aerosol nozzle 13 and a guide plate 14;

[0078] The aerosol nozzle 13 is arranged on one side of the outer shell 1 for spraying cooling aerosol; the outer shell 1 is provided with a plurality of exhaust holes, and a plurality of guide plates 14 are respectively arranged close to the plurality of exhaust holes for guiding the flow direction of the cooling aerosol.

[0079] In an optional embodiment, the guide plate 14 is made of shape memory alloy (SMA) and expands when the temperature rises.

[0080] Exemplarily, the guide plate 14 is made of nickel-titanium shape memory alloy, one end of the guide plate 14 is fixed to the inner wall of the outer shell 1 using a high-strength, high-temperature resistant adhesive, and the other end of the guide plate 14 is a free end. The adhesive used can maintain stability and strength during temperature changes. Alternatively, a mechanical connection hook, slot or other mechanical structure can be used to connect one end of the guide plate 14 to the inner wall of the outer shell 1 and ensure that the guide plate 14 will not fall off during operation. The bidirectional memory effect is achieved by training the initial shape of the guide plate 14, thereby ensuring that the guide plate 14 can be transformed from a close-fitting state to an open state of 30 degrees.

[0081] Its working process is as follows Figure 5 As shown, Figure 5 The embodiment of the present invention provides Figure 4 Schematic diagram of the working process of the LVDT displacement sensor.

[0082] Two aerosol nozzles 13 are arranged at intervals on one side of the outer shell 1, and each aerosol nozzle 13 can spray cooling aerosol, such as cooling gas or micro-water mist; a plurality of guide plates 14 are respectively installed on the inner side of the outer shell 1, and the guide plates 14 are made of shape memory alloy (SMA) material. When the temperature rises, the guide plates 14 are driven to expand through the phase change of the shape memory alloy to guide the cooling aerosol to flow along the direction of the guide plates 14, so that the hot air is efficiently discharged through the exhaust holes on the outer shell 1, and a stable airflow cycle is formed, which can directly reduce the temperature of the core components inside the LVDT displacement sensor.

[0083] Specifically, at low temperatures, such as 30°C, the guide plate 14 remains contracted and close to the inner wall of the outer shell 1; at high temperatures, the guide plate 14 changes phase and expands, and the plate rises upward to form an angle, which can be flexibly adjusted according to the overall structure to optimize the airflow channel. The outer shell 1 is provided with a plurality of exhaust holes to form an exhaust channel, through which hot air is discharged, and at the same time, it also prevents hot air from outside from entering the interior of the device.

[0084] Furthermore, the exhaust hole is arranged between the guide plates 14 on both sides. When the temperature of the LVDT displacement sensor is about 30°C and before the phase change of the guide plate 14 is triggered, the guide plate 14 shrinks close to the inner wall of the outer shell 1 to close the exhaust hole, preventing the outside air from entering the LVDT displacement sensor and preventing the cold air from being discharged after the LVDT displacement sensor is liquid-cooled. When the temperature reaches 40°C, the guide plate 14 triggers the phase change, and the hot air inside is discharged through the exhaust hole on the outer shell 1 and the exhaust holes arranged on both sides of the aerosol nozzle 13.

[0085] Furthermore, a small temperature sensor can be installed on the outer shell 1 of the LVDT displacement sensor. The internal temperature can be monitored in real time through the temperature sensor. When the internal temperature of the LVDT displacement sensor reaches 30°C, the piezoelectric diaphragm 7 is controlled to push the water in the water tank 6 into the microchannel 5 for cooling through the heat-conducting liquid; when the temperature of the temperature sensor reaches 40°C, the internal temperature also exceeds 40°C, triggering the action of the guide plate 14, starting the aerosol nozzle 13 for cooling, and pressing the hot air out of the LVDT displacement sensor from the exhaust hole on the outer shell 1, thereby achieving sufficient cooling of the LVDT displacement sensor.

[0086] It is worth noting that by designing an aerosol cooling component in the LVDT displacement sensor to form a cooling aerosol and a ventilation channel, and combining the circulation of the heat-conducting liquid in the microchannel 5, a dual-mode temperature-controlled heat dissipation mode is achieved, that is, the heat-conducting liquid heat exchange system composed of the microchannel 5, the water tank 6 and the piezoelectric diaphragm 7, and the aerosol cooling system composed of the aerosol nozzle 13, the guide plate 14 and the exhaust hole, the liquid cooling phase change technology is used to effectively take away the heat generated by the coil 3 during operation, and the heat dissipation effect is improved. In addition, it can also be combined with the second embodiment to form a heat-conducting liquid heat exchange system, an aerosol cooling system and a phase change heat-absorbing material 12 as a whole, so as to achieve temperature management inside the LVDT displacement sensor and quickly take away the heat generated by the coil 3.

[0087] In addition, improving the heat dissipation capacity and heat dissipation efficiency can also stabilize the magnetic properties of the coil 3, maintain the working stability of the LVDT displacement sensor in a high temperature environment, avoid the influence of overheating on the measurement accuracy, and make the LVDT displacement sensor perform better in applications with high linearity requirements.

[0088] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the term "include", "comprise" or any other variant is intended to cover non-exclusive inclusion, so that the article or device including a series of elements includes not only those elements, but also other elements that are not explicitly listed. In the absence of more restrictions, the elements defined by the sentence "including one..." do not exclude the existence of other identical elements in the article or device including the elements. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The orientation or position relationship indicated by "up", "down", "left", "right", etc. is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention.

[0089] The above contents are further detailed descriptions of the present invention in combination with specific preferred embodiments, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.

Claims

1. A heat dissipation structure of an LVDT displacement sensor based on a micro-channel, characterized in that: include: An outer shell (1), a frame (2), a coil (3), an iron core (4), a microchannel (5), a water tank (6), and a piezoelectric diaphragm (7); The frame (2) is arranged inside the outer shell (1), a coil (3) is arranged around the outer circumference of the frame (2), and the iron core (4) is arranged inside the frame (2) and can move along its axial direction; The microchannel (5) is arranged on the inner side of the frame (2) and surrounds the iron core (4); the water tank (6) is arranged close to one end of the frame (2); A liquid channel is formed in the microchannel (5) and is connected to the water tank (6) through the liquid channel; the piezoelectric diaphragm (7) is arranged close to the water tank (6) and is used to drive the heat-conducting liquid in the water tank (6) to flow along the liquid channel.

2. The heat dissipation structure of the LVDT displacement sensor based on the micro-channel according to claim 1 is characterized in that: The inner surface of the microchannel (5) is provided with a hydrophilic coating; the material of the hydrophilic coating includes: polyvinyl alcohol, polyethylene glycol, polyacrylamide, silicon dioxide nanoparticles or titanium oxide.

3. The heat dissipation structure of the LVDT displacement sensor based on the micro-channel according to claim 1 is characterized in that: A one-way valve is provided between the water outlet of the water tank (6) and the micro channel (5).

4. The heat dissipation structure of the LVDT displacement sensor based on the micro-channel according to claim 1, characterized in that: Also includes: Two insulating baffles (8) and two flanges (9), the two insulating baffles (8) are respectively arranged at the two ends of the frame (2) and are respectively connected to the outer shell (1); the two flanges (9) are respectively connected to the two insulating baffles (8); the water tank (6) is arranged on one of the flanges (9).

5. The heat dissipation structure of the LVDT displacement sensor based on the micro-channel according to claim 4 is characterized in that: Elastic damping materials are provided between the piezoelectric diaphragm (7) and the water tank (6), and between the water tank (6) and the flange (9).

6. The heat dissipation structure of the LVDT displacement sensor based on the micro-channel according to claim 4, characterized in that: Also includes: A plurality of connecting members (10); both ends of each connecting member (10) are arranged perpendicular to each other and are respectively connected to the frame (2) and the insulating partition (8).

7. The heat dissipation structure of the LVDT displacement sensor based on the micro-channel according to claim 1, characterized in that: It also comprises: a guide rod (11); the guide rod (11) is arranged at one end of the outer shell (1); the iron core (4) and the guide rod (11) are coaxially arranged, and the iron core (4) and the guide rod (11) are slidably connected.

8. The heat dissipation structure of the LVDT displacement sensor based on the micro-channel according to claim 1, characterized in that: An interlayer is provided in the skeleton (2), and the interlayer is filled with a phase-change heat-absorbing material (12).

9. The heat dissipation structure of the LVDT displacement sensor based on the micro-channel according to claim 1, characterized in that: Also includes: Aerosol cooling components; The aerosol cooling assembly comprises: an aerosol nozzle (13) and a guide plate (14); The aerosol nozzle (13) is arranged on one side of the outer shell (1) for spraying cooling aerosol; a plurality of exhaust holes are arranged on the outer shell (1), and a plurality of guide plates (14) are arranged correspondingly to the plurality of exhaust holes for guiding the flow direction of the cooling aerosol.

10. The heat dissipation structure of the LVDT displacement sensor based on the micro-channel according to claim 9, characterized in that: The guide plate (14) is made of shape memory alloy and expands when the temperature rises.

Citation Information

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